GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc; 300W Input
Features
RoHS Compliant
▪
300W / -48V telecom input power distribution
▪
8W (3.3Vdc or 5.0Vdc) of isolated Management
Power for IPM or other housekeeping functions
▪
OR’ing functionality for the A/B & RTN power feeds
as well as Enable A/B signals
▪
Inrush protection / hot swap capability
▪
Integral EMI filter designed for the ATCA board to
meet CISPR Class B
▪
Independent 72Vdc output for charging the external
holdup capacitors resulting in significant board real
estate savings and bleed resistor power dissipation
▪
A/B Feed Loss or open fuse alarm (opto-isolated)
▪
Protection: Reverse polarity, under voltage, input
transient over voltage, over current & over
temperature
Applications
▪
ATCA Front Board / Blade
▪
High efficiency : 98% @ –48V / 300W (@25C)
▪
Central Office Telecom equipment
▪
-5 to 85ºC ambient temperature operation
▪
High availability server and storage applications
▪
Compact design : 70.6 mm x 36.8 mm x 12.7 mm
▪
Compliant to RoHS Directive 2011/65/EU and
amended Directive (EU) 2015/863.
▪
Compliant to REACH Directive (EC) No
1907/2006MTBF : 1,362,480 hours per
TELCORDIA
▪
ISO** 9001 & ISO 14001 certified manufacturing
facilities
▪
ANSI/UL* 62368-1 and CAN/CSA† C22.2 No.
62368-1 Recognized, DIN VDE‡ 0868-1/A11:2017
(EN62368-1:2014/A11:2017
▪
Designed and tested for Basic Insulation (1500Vdc)
Options
▪
▪
Choice of System Management Power:
▪
3.3Vdc (PIM300F)
▪
5.0Vdc (PIM300A)
Choice of short pin lengths
Description
The PIM300X-series is the higher power version of its highly successful predecessor, the PIM200X series. Besides providing
higher power over extended temperature range, the module is pin compatible and retains the same form factor as the
PIM200X series for ease of upgrading to higher power or thermally challenging ATCA board designs. The PIM200X/300X
series are a new class of power modules designed to greatly simplify the task of implementing dual redundant, hot swap –
48Vdc power distribution with EMI filtering on an ATCA or other telecom boards. The PIM300X, when used with a variety of
GE’s dc-dc converters/POLs provides for a quick, simple and elegant power architecture solution to a wide variety of
complex power requirements. While providing high reliability, innovative features and compact design at a low cost, the
module significantly reduces the valuable telecom board real estate compared to conventional discrete designs. Besides
processing the main –48V bus, the module greatly simplifies the task of powering the IPM (for ATCA applications), system
management or other housekeeping functions by providing a completely isolated auxiliary 3.3V or 5.0V power bus.
* UL is a registered trademark of Underwriters Laboratories, Inc. †CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards
August 13, 2020
©2012 General Electric Company. All rights reserved.
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
300W ATCA Board Typical Application
F5
Short Pin (32)
ENABLE_A
Short Pin (27)
ENABLE_B
ENABLE_AF
(5)
ENABLE_BF
(6)
VRTN_AF
(3)
VRTN_BF
(4)
(8)
72V_CAP
F6
F1
(28)
VRTN_A
(29)
VRTN_B
R_Bleed
C_HLDP
C_EMI
F2
ATCA
Backplane
ATCA
(25)
Zone 1
Connector
SHELF_GND
(Optional)
Long Pin (30)
(13)
U2
ON/OFF
(9)
F3
-48V_A
(34)
-48V_B
-48V_AF
(1)
-48V_BF
(2)
(10)
-48V_OUT
Vin(-)
(Optional)
(26)
3K3
R2
(12)
EARLY_B
Vo(-)
MGMT_PWR
F4
Long Pin (31)
+12V_BUS
(Bus Converter)
PIM300X
EARLY_A
(33)
Vo(+)
U1
C_FLTR
(7)
R1
Vin(+)
VRTN_OUT
22uF
-48V_ALARM
Vcc
LOGIC_GND
C_EMI
IPMC
(System
Controller)
Enab le
Payload Power
(11)
LOGIC_GND
C _ HLDP ( F ) [ Po u t(W ) {T h o ld u p( ms) + 1.7}] / 1.9
R _ Bleed ( ) 5 .485 / C _ HLDP ( F )
Suggested Bill of Materials
(Note: Customer is ultimately responsible for the selection and verification of the suggested parts).
Qty
Ref Des
Description
(Values)
2
F1, F2
Fuse, SMT, 12 Amp
2
F3, F4
Fuse, SMT, 10 Amp
2
F5, F6
Fuse, SMT, 1/16th Amp
2
C_FLTR
Capacitors, Al Electrolytic
100uF/100V
Capacitors, Al Electrolytic
470uF/80V
4
OR
1
MFR / PN
(or equivalent)
C_HLDP
Comments
VRTN_A, VRTN_B
Bel Fuse: SSQ Series
Littelfuse 451/ 453 Series
(Voltage rating >/=75V)
Nippon/Chemicon; KZE Series
Panasonic: FK Series (SMT)
Nichicon: UJ Series
Nippon/Chemicon; KZE Series
Panasonic: FK Series (SMT)
ENABLE_A, ENABLE_B
C_FLTR(Max,Total) = 330 uF
C_HLDP(calculated)=1737 uF
(for 300W &Tholdup=9.3msecs)
1
R_Bleed
OR
Capacitors, Al Electrolytic
1800uF/80V
SM, 2.9Kohms, 1W
2
C_EMI
SM, 4700pF, >/=1500V
Novacap, Murata or Syfer
1
U1
300W/12V Bus Converter
GE: QBW025A0B1
1
U2
Opto-coupler (1500V)
Fairchild: HMHA2801
Safety approved
2
R1*, R2*
High Surge Power,
15 Ohms
KOA: SG73 (Size >/=1206)
*Optional; See “Design Consideration”
Section
August 13, 2020
OR
Panasonic / ECEC1KP182DL
30mm(OD) X 20mm(L)
-48V_A, -48V_B
Snap-In Radial
For C_HLDP=1800uF
Size: >/=1210
©2012 General Electric Company. All rights reserved.
Page 2
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Absolute Maximum Ratings:
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliability.
Parameter
Device
Symbol
Min
Typ
-48
Max
Unit
Input Voltage (Absolute values)
Continuous
All
VI
0
-75
Vdc
Transient (Pulse duration above –75V = 1ms)
All
Vtr
-75
-100
Vdc
Normal Operating Ambient Temperature
(See Thermal Considerations section)
All
TA
-5
85
o
C
Storage Temperature
All
Tstg
-55
125
o
C
All
Pin, max
300
W
All
Vdelta
0.8V
V
All
η
98
%
Power Dissipation
(Internal Module Dissipation @ Pin, max
(with MGMT_PWR = 8W)
All
Pdiss
12
W
Output Power, Maximum Deliverable
(Management Power + Payload Power)
All
Pout
288
W
Management Power, Maximum Deliverable
(MGMT_PWR)
All
PMGMT_PWR
Module Standby Power
(@-48Vin & MGMT_PWR=0W, Pout=0W)
All
PStdby
Temperature
Power
Input Power, Maximum Allowable
Input to Output Voltage Differential
@ -48Vin & Pin,max, TA=25 oC
Efficiency
VIN=-48V, Pin,max, TA=25 oC (MGMT_PWR=0W)
8
W
2.0
W
Isolation
Input to MGMT_PWR Output Voltage
All
1500
Vdc
Input to SHELF_GND Voltage
All
1500
Vdc
Input to LOGIC_GND Voltage
All
1500
Vdc
LOGIC_GND to SHELF_GND
Insulation Resistance with 100Vdc Test Voltage
All
9
MOhms
CAUTION: This power module is not internally fused. Both A & B feeds and their corresponding returns
must be individually fused.
To preserve maximum flexibility, internal fusing is not included. However, to achieve maximum safety and system
protection, the safety agencies require a fast-acting fuse with a maximum rating of 15 Amps and Voltage Rating >/= 75Vdc
for the –48AF, -48BF VRTN_AF & VRTN_BF feeds. Consult Fusing and fault protection (Section 4.1.4) of PICMG 3.0 ATCA
specifications for additional information. Based on the information provided in this data sheet on inrush current and
maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data
sheet for further information.
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 3
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Electrical Specifications:
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Main Input (-48_AF,-48_BF,VRTN_AF,VRTN_BF); (Absolute values)
Operating Input Voltage
(Module will operate down to –36V depending on the
output power and thermal environment but may not
support holdup time requirements)
All
VI
-38
-48
-75
Vdc
Input Voltage Turn-on Threshold
(Module On)
All
VUVHI
-34.3
-35.3
-36.0
Vdc
Under Voltage Lockout Threshold
(Module Off)
All
VUVLO
-32.4
-33.7
-34.1
Vdc
Maximum current drain if input voltage falls below
VUVLO for > 2 seconds.
All
Istdby
10
mA
Maximum Input Current
(VI=0V to -75Vdc, Pin=Pin, max)
All
II, max
9.0
Adc
Inrush Transient
(@ -48 VI and with C_FLTR = 200 F)
All
Ipk
20
(/= 100Vdc.
•
The minimum C_FLTR capacitance (200μF)
recommendation is based on meeting the EMI
requirements. Based on end systems test, the
capacitance may be lowered if real estate is an
issue. As a minimum, 50 μF to 100 μF is
strongly recommended to stabilize the line
impedance for proper startup of the DC/DC
converter. Refer to the DC/DC converter’s data
sheet for the recommended capacitor.
(2) Holdup / Bulk Capacitor Output (72V_CAP)
This output provides the high voltage (nominal 72Vdc) to
charge the C_BULK capacitor(s) to allow the ATCA board
to meet the 5ms, 0Volts transient requirements.
•
•
•
The 72V_CAP connects to the +ve terminals of
the C_HLDP capacitors while the –ve terminals
of the C_HLDP connects to the -48V_OUT bus.
Since the 72V_CAP output is regulated to
72Vdc (+3%/-5%) and the capacitors are off
line during normal operation, the capacitors
may be selected with voltage rating of >/= 80V
to minimize the real estate on the board.
The C_HLDP capacitance is dependent on the
system power and the holdup time
requirements based on the following formula
C _ HLDP(F ) [ Pout(W ) {Tholdup(ms) + 1.7}] / 1.9
•
Bleed Resistor (R_Bleed) : The PICMG 3.0
specifications requires a discharge mechanism
(e.g. bleed resistor) to discharge the
holdup/bulk capacitance to less than -60Vdc
and less than 20 joules within one second of
disconnection from the backplane. This
requirement is fulfilled by installing R_Bleed
resistor that is selected based on the C_HLDP
selected in the previous step. The formula for
selecting the resistor is :
R _ Bleed () 5.485 / C _ HLDP( F )
For 300W and 9.3 ms holdup requirements, this
results in a 2.9 Kohm resistor with 1W rating.
Worst case power dissipation of R_Bleed
(=2.9Kohms) @ -36V is 0.45W.
August 13, 2020
•
The R_Bleed is connected across the 72V_CAP
and VRTN_OUT pins of the PIM300X.
(3) Management Power
(MGMT_PWR)
The MGMT_PWR output is an isolated secondary voltage
(3.3V for PIM300F or 5.0V for PIM300A) referenced to
LOGIC_GND that provides 8W(maximum) power to the
IPM Controller for the ATCA board or to the power up
system controller for other applications.
•
Per PICMG 3.0 Specs, the ATCA board shall not
consume more than 10W of input power; this
includes the standby power of PIM300X
(typically 1.7W) as well as all the on board
DC/DC power converters. It is the responsibility
of the board designer to insure that this
requirement is met prior to power-up rights
have been negotiated with the Shelf Manager.
•
The management power is available even
when the input voltage is down to –36Vdc.
•
No additional output capacitors are required,
but a 22μF tantalum/ceramic and a 0.01 to
0.1μF ceramic capacitors are highly
recommended to contain the switching ripple
and noise.
•
Higher output capacitance may be required in
case of large input line or output load transient
conditions.
(4) -48V Feed Loss or Open Fuse Alarm
(-48V_ALARM)
The -48V_ALARM output is an opto-isolated signal
internally referenced to the LOGIC_GND. The signal is an
open collector output that requires an external pull up
resistor. A 3.3K pull up resistor to 3.3V, MGMT_PWR (for
PIM300F) should suffice. During normal operation, the
signal is LO (opto conducting). During fault condition, the
opto shall stop conducting and the alarm signal shall
assume a HI state.
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards,
i.e., UL ANSI/UL* 62368-1 and CAN/CSA+ C22.2 No.
62368-1 Recognized, DIN VDE 0868-1/A11:2017
(EN62368-1:2014/A11:2017)
The power input to these units is to be provided with a
maximum of 15 Amps fuses with a voltage rating of at
least 75Vdc.
Refer to “Thermal Consideration” section for additional
safety considerations.
©2012 General Electric Company. All rights reserved.
Page 13
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Figure 17. Typical Class B EMC signature of PIM300F
with QBW025A0B1 module.
Feature Description
A/B Feed OR’ing
The module provides dedicated OR’ing functionality to
both Feeds A & B and their corresponding returns. The
following pairs of signals are OR’d within the module:
-48V_AF / -48_BF, VRTN_AF / VRTN_BF, and ENABLE_AF/
ENABLE_B.
The -48V A/B feeds and their corresponding returns are
OR’d via N-channel MOSFET power devices resulting in a
highly efficient system compared to conventional diode
OR’ing scheme.
Inrush Current Control / Hot Plug Functionality
EMI Filtering
The module incorporates an EMI filter that is designed
for the ATCA board to help meet the conducted
emissions requirements of CISPR 22 Class B when used
in conjunction with GE DC/DC converters approved for
ATCA applications. The following insertion loss table is
provided as filter performance guidelines.
Parameter
For Safety and noise considerations, copper traces must
not be routed directly beneath the power module (PWB
top layer). C_EMI capacitors must make direct
connections (preferably without vias) to the DC/DC
module pins with as much copper width as possible. In
case vias are necessary, allow for multiple connections
to the inner plane with vias placed outside the footprint
of the module. For additional layout guide-lines, refer to
GE’s FLT007A0 Input Filter Module data sheet.
The module provides inrush current control / hot plug
capability. The peak value of the inrush current and the
duration complies with the PICMG 3.0’s Inrush Transient
specifications. The specifications shall be met with the
external C_HLDP and C_FLTR capacitances as specified
in the previous sections.
The unique design of the module where the large energy
storage capacitors are segregated from the input filter
capacitors allows the module to meet the stringent
PICMG’s inrush transient specifications. In conventional
designs where the energy storage capacitors and the
filter capacitors are in parallel, it is extremely difficult to
meet the inrush transient specifications without over
sizing the inrush control power FET.
Typical
Unit
50 Ohms circuit, 200kHz
24
dB
50 Ohms circuit, 500kHz
32
dB
50 Ohms circuit, 1MHz
39
dB
50 Ohms circuit, 200kHz
75
dB
A/B Feed / Fuse Alarm (-48V_ALARM)
50 Ohms circuit, 500kHz
66
dB
50 Ohms circuit, 1MHz
61
dB
The module monitors the A & B feeds as well as the
status of the A&B feed fuses and provides an optoisolated signal in case of loss of a feed or the opening of
any of the fuses. The response time of the fault condition
is < 100 μsec. The alarm signal indicates normal
operation when the opto coupler transistor is conducting
and a fault condition by an off state.
Common-Mode Insertion Loss
Differential-mode Insertion Loss
The following Figure 17 depicts the Class B EMI
performance of PIM300F when tested with
QBW025A0B1 on a stand alone basis (ATCA form factor
load board with resistive loads and only power, return
and chassis connections to the backplane). The external
filtering components are identified in the Typical
Application circuit.
August 13, 2020
Holdup Capacitor Charging Current (72V_CAP)
The module employs a unique feature to charge and
recharge the external energy storage holdup/bulk
capacitors (C_HLDP) within seconds from the application
of power to a nominal voltage of 72Vdc (+3%/-5%)
resulting in significant reduction in the real estate on the
board in order to comply with the PICMG 3.0’s 0
volt/5msec transient requirements. Since the 72V_CAP is
also regulated, there is further reduction in real estate
board because now 80V capacitors with higher
capacitance can be used instead of the >/= 100Vdc caps
required in conventional designs. The maximum rate of
input voltage change (dv/dt) shall not exceed 5V/ms
when the -72V_CAP output is switched on the 48V_OUT/VRTN_OUT bus.
©2012 General Electric Company. All rights reserved.
Page 14
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
The holdup capacitors are switched on automatically
when there is a loss of power on both feeds A & B or
both feeds have dropped below –38V (typical).
Upon restoration of normal power on either or both
feeds, the holdup capacitors automatically go off line
and are recharged for the next power loss event.
Note 1: The holdup capacitors and the bleed resistor are
installed external to the module.
Note 2: The PICMG 3.0’s requirements for the 0 Vdc
transient for 5ms is normally interpreted as the holdup
time requirement by many. In actuality, when one
considers the additional specification of 50V/ms fall time
and 12.5 V/ms rise time to and from the 0Vdc condition,
this leads to a 9.3ms of total hold up time requirement
when power is interrupted at -43Vdc. The 72V_CAP
output provided by the module to charge the bulk
capacitors provides a tremendous advantage over
conventional designs in terms of real estate
requirements on the board with the added benefit of the
usage of 80V capacitor rating vs >/=100V.
The holdup time, Tholdup, is defined for power loss at 43Vdc input and the C_HLDP maintaining -48V_OUT bus
to at least –36Vdc (which is the minimum operating
voltage of the downstream DC/DC bus converter).
Note 3: Bleed Resistor (R_Bleed): Normally, the bleed
resistor is not required as there is sufficient standby
current drain within the module to bleed the holdup
capacitors from 75V to 60V in 1 second as specified in
the PICMG 3.0. Again, due to the PIM300X’s unique
design, the placement of the bleed resistor results in
significantly less power dissipation compared with
conventional designs where the bleed resistor is sized for
-75Vdc continuous maximum voltage and -100V
transients.
the downstream DC/DC converters from input voltage
transients exceeding -75Vdc. The TVS is rated for 1500W
of Peak Pulse Power with the Breakdown Voltage (VBR) of
77.8V to 86.0V.
Input Reverse Polarity Protection
The module shall not be damaged from reverse polarity
connection in the event of miswiring of either input feeds
at the shelf input terminals.
Over Temperature Protection
To provide over temperature protection in a fault
condition, the unit will shutdown if any thermal sensor
reference point TOTP (identified in Figure 16), exceeds the
trip point of 125oC (+/- 5oC). The thermal shutdown is not
intended as a guarantee that the unit will survive
temperatures beyond its rating. The module will
automatically restart after it cools down.
During thermal design verification, it is recommended
that these temperatures be monitored by IR Thermal
imaging camera. In case thermocouples are used, the
thermocouple contacts should be attached as close as
possible to the thermal sensors (thermistors) on the PWB
but not directly on the thermistors themselves. Attaching
the contacts directly to the thermocouple is not
recommended as this will result in false temperature
measurements due to the heat sink effect of the
thermocouple wires.
Management Power (MGMT_PWR)
•
The module provides up to 8W of 3.3V
(PIM300F) or 5.0V (PIM300A) of isolated output
power referred to LOGIC_GND.
•
The management power is available
automatically as soon as the input voltage
levels are within –36Vdc to –75Vdc.
•
The output is short circuit and over voltage
protected with low ripple and noise.
Over Current Protection (- 48V_OUT Bus)
To provide protection in a fault (output overload or short
circuit) condition, the unit is equipped with internal
current-limiting circuitry. The unit can endure current
overload conditions continuously or shutdown due to
thermal protection depending on operating ambient
temperature conditions. The unit will restart
automatically once the overload condition is removed.
Input Under Voltage Lockout
At input voltages below the input under voltage lockout
threshold limit (VUVLO), the module operation is disabled.
The module will begin to operate at an input voltage
above the under voltage lockout turn-on threshold(VUVHI).
Please see the Electrical Specifications Table for the
specified trip points.
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test set-up is
shown below in Figure 18.
Transient Over Voltage Protection
The module incorporates a Transient Voltage
Suppressor. This feature helps protect the module and
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 15
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
25.4_
(1.0)
Wind Tunne l
PWBs
Po w e r Mo d ule
76.2_
(3.0)
Reflow Lead-Free Soldering Information
x
5.97_
(0.235)
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. If additional
information is needed, please consult with your Sales
representative for more details.
Pro b e Lo c a tio n
fo r m e a suring
a irflo w a nd
a m b ie nt
te m p e ra ture
Air
flo w
Figure 18. Thermal Test Set-up
The thermal derating curves were generated with the
airflow parallel to the long axis of the module (input to
output).
The thermal reference points, Tref 1 to Tref 3 are identified
in Figure 15. For reliable operation and to comply with
the module’s safety requirements, these temperatures
should not exceed the limits specified in the figure.
Exceeding these temperatures may or may not trigger
the over temperature shutdown. The output power of
the module should not exceed the rated input power of
the module i.e. 300W.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by the module versus local ambient
temperature (TA) are shown in the Thermal derating
curves, Figs 13-1 to 13-4 for PIM300F and Figs 14-1 to
14-4 for PIM300A.
The RoHS-compliant through-hole products can be
processed with Pb-free reflow process. However, since
the modules are not packed in vacuum sealed Moisture
Barrier Bags (MBB), the modules need to be baked to
prevent any printed wiring board (PWB) delamination.
The modules should be baked at 125C for 4 hours prior
to use. The recommended reflow profile is described
below.
Max. sustain temperature :
245C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5mm / Volume > 2000mm3),
Peak temperature over 245C is not suggested due to
the potential reliability risk of components under
continuous high-temperature.
Min. sustain duration above 217C: 90 seconds
Min. sustain duration above 180C: 150 seconds
Max. heat up rate: 3C/sec
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.
Pb-free Reflow Profile
BMP module will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Figure 19.
Manufacturing Considerations
Through-Hole Lead Free Soldering Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 16
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Temp
Peak Temp. 240-245°C
Ramp down
max. 4°C/Sec
217°C
200°C
Time Limited 90 Sec.
above 217°C
150°C
Preheat time
100-150 Sec.
Ramp up
max. 3°C/Sec
25°C
Time
Figure 19. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to GE’s Electronics Board Mounted Power Modules:
Soldering and Cleaning Application Note (AP01-056EPS)
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 17
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
TOP VIEW
SIDE VIEW
BOTTOM VIEW
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 18
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
NOTES:
1. For the pins, use 1.27(mm) / 0.050(in) diameter Plated Trough Hole
August 13, 2020
©2012 General Electric Company. All rights reserved.
Page 19
GE
Data Sheet
PIM300X Series; ATCA Board Power Input Modules
-38 to -75Vdc ; 300W Input
Ordering Information
Please contact your GE’s Sales Representative for pricing, availability and optional features.
Table 1. Device Code
Input Voltage
Power
Rating
Auxiliary
Output
Voltage
Auxiliary
Output
Current
Connector Type
&
Options
Product codes
Comcodes
-38 to -75 Vdc
300W
3.3Vdc
2.4A
Thru Hole/RoHS
PIM300FZ
CC109113858
-38 to -75 Vdc
300W
5.0Vdc
1.6A
Thru Hole/RoHS
PIM300AZ
CC109122322
-38 to -75 Vdc
300W
3.3Vdc
2.4A
Thru Hole/RoHS
PIM300F6Z
CC109159190
-38 to -75 Vdc
300W
5.0Vdc
2.4A
Thru Hole/RoHS
PIM300A6Z
150038129
Table 2. Device Options
Option
Device Code Suffix
Short pins: 3.68mm ± 0.25mm
(0.145 in. ± 0.010 in.)
Short pins: 2.79mm ± 0.25mm
(0.110 in. ± 0.010 in.)
6
8
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86-21-53899666
Europe, Middle-East and Africa:
+49.89.878067-280
Go.ABB/Industrial
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
August 13, 2020
©2020 General Electric Company. All International rights reserved.
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