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24AA024T-I/SN

24AA024T-I/SN

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOICN8_150MIL

  • 描述:

    IC EEPROM 2KBIT I2C 400KHZ 8SOIC

  • 数据手册
  • 价格&库存
24AA024T-I/SN 数据手册
24AA024/24LC024/24AA025/24LC025 2-Kbit I2C Serial EEPROM Device Selection Table Part Number 24AA024 VCC Range 1.7V-5.5V Max. Clock 400 kHz(1) 400 kHz(1) Temp. Range Write Protect Available Packages I Yes MC, MNY, MS, P, SN, ST 24AA025 1.7V-5.5V I No MC, MNY, MS, OT, P, SN, ST 24LC024 2.5V-5.5V 400 kHz I, E Yes MC, MNY, MS, P, SN, ST 24LC025 2.5V-5.5V 400 kHz I, E No MC, MNY, MS, OT, P, SN, ST Note 1: 100 kHz for VCC < 2.5V Features Description • Single Supply with Operation from 1.7V to 5.5V for 24AA024/24AA025 Devices and 2.5V to 5.5V for 24LC024/24LC025 Devices • Low-Power CMOS Technology: - Read current: 1 mA, maximum - Standby current: 1 µA, maximum (I-temp.) • Organized as a Single Block of 256 Bytes (256 x 8) • Two-Wire Serial Interface, I2C Compatible • Cascadable up to Eight Devices • Schmitt Trigger Inputs for Noise Suppression • Output Slope Control to Eliminate Ground Bounce • 100 kHz and 400 kHz Clock Compatibility • Page Write Time: 5 ms Maximum • Self-timed Erase/Write Cycle • 16-Byte Page Write Buffer • Hardware Write-Protect on 24XX024 Devices • High Reliability: - More than one million erase/write cycles - Data retention: >200 years - ESD protection: >4000V • Factory Programming Available • RoHS Compliant • Temperature Ranges: - Industrial (I): -40°C to +85°C - Extended (E): -40°C to +125°C The Microchip Technology Inc. 24AA024/24LC024/ 24AA025/24LC025 is a 2-Kbit Serial Electrically Erasable PROM (EEPROM). The device is organized as one block of 256 x 8-bit memory with a two-wire serial interface. Its low-voltage design permits operation down to 1.7V, with standby and active currents of only 1 µA and 1 mA, respectively. The device has a page write capability for up to 16 bytes of data. Functional address lines allow the connection of up to eight 24AA024/ 24LC024/24AA025/24LC025 devices on the same bus for up to 16 Kbits of contiguous EEPROM memory. Package Types PDIP/SOIC/TSSOP/MSOP A0 1 8 DFN/TDFN A0 1 VCC A1 2 7 WP(1) A2 3 6 SCL VSS 4 5 SDA A1 2 A2 3 VSS 4 8 VCC (1) 7 WP 6 SCL 5 SDA SOT-23 Note 1: SCL 1 6 VCC VSS 2 5 A0 SDA 3 4 A1 WP pin is not internally connected on the 24XX025. Packages • 8-Lead DFN, 8-Lead TDFN, 8-Lead MSOP, 8Lead PDIP, 8-Lead SOIC, 8-Lead TSSOP and 6Lead SOT-23 (24XX025 only)  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 1 24AA024/24LC024/24AA025/24LC025 Block Diagram A0 A1 A2 WP (1) I/O Control Logic Memory Control Logic HV Generator XDEC EEPROM Array SDA SCL Write-Protect Circuitry YDEC VCC VSS Sense Amp. R/W Control Note 1: WP pin is not internally connected on the 24XX025. DS20001210Q-page 2  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VCC.............................................................................................................................................................................6.5V All inputs and outputs w.r.t. VSS ..........................................................................................................-0.3V to VCC +1.0V Storage temperature ............................................................................................................................... -65°C to +150°C Ambient temperature with power applied................................................................................................ -40°C to +125°C ESD protection on all pins  4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: DC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V DC CHARACTERISTICS Param. Symbol No. Characteristic Min. Max. Units Conditions D1 VIH High-level Input Voltage 0.7VCC — V D2 VIL Low-level Input Voltage — 0.3VCC V 0.2VCC for VCC < 2.5V 0.05VCC — V (Note) D3 VHYS Hysteresis of Schmitt Trigger Inputs D4 VOL Low-level Output Voltage — 0.40 V IOL = 3.0 mA, VCC = 2.5V D5 ILI Input Leakage Current — ±1 µA VIN = VSS or VCC D6 ILO Output Leakage Current — ±1 µA VOUT = VSS or VCC D7 CIN, COUT Pin Capacitance (all inputs/outputs) — 10 pF VCC = 5.5V (Note) TA = 25°C, FCLK = 1 MHz D8 ICCWRITE — 3 mA VCC = 5.5V, SCL = 400 kHz D9 ICCREAD — 1 mA — 1 µA SDA = SCL = VCC A0, A1, A2, WP = VSS, I-Temp — 5 µA SDA = SCL = VCC A0, A1, A2, WP = VSS, E-Temp D10 Note: ICCS Operating Current Standby Current This parameter is periodically sampled and not 100% tested.  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 3 24AA024/24LC024/24AA025/24LC025 TABLE 1-2: AC CHARACTERISTICS Industrial (I): TA = -40°C to +85°C, VCC = +1.7V to +5.5V Extended (E): TA = -40°C to +125°C, VCC = +2.5V to +5.5V AC CHARACTERISTICS Param. Symbol No. 1 2 3 4 5 6 FCLK THIGH TLOW TR TF Characteristic Clock Frequency Clock High Time Clock Low Time SDA and SCL Rise Time SDA and SCL Fall Time THD:STA Start Condition Hold Time 7 TSU:STA Start Condition Setup Time 8 THD:DAT Data Input Hold Time 9 TSU:DAT Data Input Setup Time 10 TSU:STO Stop Condition Setup Time 11 TSU:WP WP Setup Time 12 THD:WP WP Hold Time 13 TAA Output Valid from Clock 14 TBUF Bus Free Time: Bus time must be free before a new transmission can start 15 TSP 16 TWC 17 — Min. Max. Units — 100 kHz Conditions 1.7V ≤ VCC < 1.8V — 400 kHz 1.8V ≤ VCC ≤ 5.5V 4000 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V 4700 — ns 1.7V ≤ VCC < 1.8V 1300 — ns 1.8V ≤ VCC ≤ 5.5V — 1000 ns 1.7V ≤ VCC < 1.8V (Note 1) — 300 ns 1.8V ≤ VCC ≤ 5.5V (Note 1) — 1000 ns 1.7V ≤ VCC < 1.8V (Note 1) — 300 ns 1.8V ≤ VCC ≤ 5.5V (Note 1) 4000 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V 4700 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V 0 — ns (Note 2) 250 — ns 1.7V ≤ VCC < 1.8V 100 — ns 1.8V ≤ VCC ≤ 5.5V 4000 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V 4000 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V 4700 — ns 1.7V ≤ VCC < 1.8V 600 — ns 1.8V ≤ VCC ≤ 5.5V — 3500 ns 1.7V ≤ VCC < 1.8V (Note 2) — 900 ns 1.8V ≤ VCC ≤ 5.5V (Note 2) 4700 — ns 1.7V ≤ VCC < 1.8V 1300 — ns 1.8V ≤ VCC ≤ 5.5V Input Filter Spike Suppression (SDA and SCL pins) — 50 ns (Note 1 and Note 3) Write Cycle Time (byte or page) — 5 ms 1,000,000 — cycles Endurance 25°C, VCC = 5.5V, Page mode (Note 4) Note 1: Not 100% tested. 2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions. 3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs, which provide improved noise spike suppression. This eliminates the need for a TI specification for standard operation. 4: This parameter is not tested but ensured by characterization. DS20001210Q-page 4  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 FIGURE 1-1: BUS TIMING DATA 5 SCL 7 SDA In 3 4 D3 2 8 10 9 6 15 14 13 SDA Out WP  2007-2022 Microchip Technology Inc. and its subsidiaries (protected) (unprotected) 11 12 DS20001210Q-page 5 24AA024/24LC024/24AA025/24LC025 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Name PDIP SOIC TSSOP DFN/TDFN(1) MSOP SOT-23 A0 1 1 1 1 1 5 Address Pin AO A1 2 2 2 2 2 4 Address Pin A1 A2 3 3 3 3 3 — Address Pin A2 Ground Description VSS 4 4 4 4 4 2 SDA 5 5 5 5 5 3 Serial Address/Data I/O SCL 6 6 6 6 6 1 Serial Clock WP 7 7 7 7 7 — Write-Protect Input 8 8 8 8 8 6 Power Supply VCC Note 1: 2.1 Exposed pad on DFN/TDFN can be connected to VSS or left floating. Chip Address Inputs (A0, A1, A2) The A0, A1 and A2 inputs are used by the 24AA024/ 24LC024/24AA025/24LC025 for multiple device operation. The levels on these inputs are compared with the corresponding bits in the client address. The chip is selected if the comparison is true. Up to eight devices (four for SOT-23 package) may be connected to the same bus by using different Chip Select bit combinations. These inputs must be connected to either VCC or VSS. In most applications, the chip address inputs A0, A1 and A2 are hard-wired to logic ‘0’ or logic ‘1’. For applications in which these pins are controlled by a microcontroller or other programmable device, the chip address pins must be driven to logic ‘0’ or logic ‘1’ before normal device operation can proceed. 2.2 Serial Address/Data Input/Output (SDA) 2.4 Write-Protect (WP) (24XX024 Only) WP is the hardware write-protect pin. It must be tied to VCC or VSS. If tied to Vcc, hardware write protection is enabled. If WP is tied to Vss, the hardware write protection is disabled. Note that the WP pin is available only on the 24XX024. This pin is not internally connected on the 24XX025. 2.5 Noise Protection The 24AA024/24LC024/24AA025/24LC025 employs a VCC threshold detector circuit which disables the internal erase/write logic if the VCC is below 1.5V at nominal conditions. The SCL and SDA inputs have Schmitt Trigger and filter circuits which suppress noise spikes to assure proper device operation, even on a noisy bus. SDA is a bidirectional pin used to transfer addresses and data into and out of the device. It is an open-drain terminal; therefore, the SDA bus requires a pull-up resistor to VCC (typical 10 k for 100 kHz and 2 k for 400 kHz). For normal data transfer, SDA is allowed to change only during SCL low. Changes during SCL high are reserved for indicating the Start and Stop conditions. 2.3 Serial Clock (SCL) The SCL input is used to synchronize the data transfer from and to the device. DS20001210Q-page 6  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 3.0 FUNCTIONAL DESCRIPTION The 24AA024/24LC024/24AA025/24LC025 supports a bidirectional, two-wire bus and data transmission protocol. A device that sends data onto the bus is defined as transmitter, while a device receiving data is defined as receiver. The bus has to be controlled by a host device that generates the Serial Clock (SCL), controls the bus access and generates the Start and Stop conditions, while the 24AA024/ 24LC024/24AA025/24LC025 works as client. Both host and client can operate as transmitter or receiver, but the host device determines which mode is activated.  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 7 24AA024/24LC024/24AA025/24LC025 4.0 BUS CHARACTERISTICS The data on the line must be changed during the low period of the clock signal. There is one bit of data per clock pulse. The following bus protocol has been defined: • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as a Start or Stop condition. Accordingly, the following bus conditions have been defined (Figure 4-1). Each data transfer is initiated with a Start condition and terminated with a Stop condition. The number of the data bytes transferred between the Start and Stop conditions is determined by the host device and is, theoretically, unlimited (though only the last 16 bytes will be stored when performing a write operation). When an overwrite does occur, it will replace data in a First-InFirst-Out (FIFO) principle. 4.1 4.5 Bus Not Busy (A) Each receiving device, when addressed, is required to generate an acknowledge after the reception of each byte. The host device must generate an extra clock pulse, which is associated with this Acknowledge bit. Both data and clock lines remain high. 4.2 Start Data Transfer (B) A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All commands must be preceded by a Start condition. 4.3 Note: Stop Data Transfer (C) Data Valid (D) The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal. FIGURE 4-1: SCL (A) The 24AA024/24LC024/24AA025/24LC025 does not generate any Acknowledge bits if an internal programming cycle is in progress. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable-low during the high period of the acknowledge-related clock pulse. Moreover, setup and hold times must be taken into account. A host must signal an end of data to the client by not generating an Acknowledge bit on the last byte that has been clocked out of the client. In this case, the client must leave the data line high to enable the host to generate the Stop condition (Figure 4-2). A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All operations must be ended with a Stop condition. 4.4 Acknowledge DATA TRANSFER SEQUENCE ON THE SERIAL BUS CHARACTERISTICS (B) (C) (D) (C) (A) SDA Start Condition FIGURE 4-2: Address or Acknowledge Valid Stop Condition Data Allowed to Change ACKNOWLEDGE TIMING Acknowledge Bit 1 SCL SDA 2 3 4 5 6 7 Data from transmitter Transmitter must release the SDA line at this point allowing the Receiver to pull the SDA line low to acknowledge the previous eight bits of data. DS20001210Q-page 8 8 9 1 2 3 Data from transmitter Receiver must release the SDA line at this point so the Transmitter can continue sending data.  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 5.0 DEVICE ADDRESSING FIGURE 5-1: A control byte is the first byte received following the Start condition from the host device. The control byte consists of a 4-bit control code. For the 24AA024/ 24LC024/24AA025/24LC025, this is set as ‘1010’ binary for read and write operations. The next three bits of the control byte are the Chip Select bits (A2, A1, A0). The Chip Select bits allow the use of up to eight 24AA024/24LC024/24AA025/24LC025 devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic levels on the corresponding A2, A1 and A0 pins for the device to respond. These bits are, in effect, the three Most Significant bits (MSb) of the word address. The combination of the 4-bit control code and the next three bits are called the client address. For the SOT-23 package, the A2 address pin is not available. During device addressing, the A2 Chip Select bit should be set to ‘0’. The last bit of the control byte is the Read/Write (R/W) bit and it defines the operation to be performed. When set to a one, a read operation is selected. When set to a zero, a write operation is selected. The next byte received defines the address of the first data byte (Figure 5-2). Following the Start condition, the 24AA024/24LC024/24AA025/24LC025 monitors the SDA bus checking the control byte being transmitted. Upon receiving a valid client address and the R/W bit, the client device outputs an Acknowledge signal on the SDA line. Depending on the state of the R/W bit, the 24AA024/24LC024/24AA025/24LC025 will select a read or write operation. FIGURE 5-2: CONTROL BYTE FORMAT Read/Write Bit Chip Select Bits Control Code S 1 0 1 0 A2 A1 A0 R/W ACK Client Address Start Bit 5.1 Acknowledge Bit Contiguous Addressing Across Multiple Devices The Chip Select bits A2, A1 and A0 can be used to expand the contiguous address space for up to 16 Kbits by adding up to eight 24AA024/24LC024/ 24AA025/24LC025 devices on the same bus. In this case, software can use A0 of the control byte as address bit A8; A1 as address bit A9; and A2 as address bit A10. It is not possible to sequentially read across device boundaries. For the SOT-23 package, up to four 24AA025/24LC025 devices can be added for up to 8 Kbits of address space. In this case, software can use A0 of the control byte as address bit A8, and A1 as address bit A9. It is not possible to sequentially read across device boundaries. ADDRESS SEQUENCE BIT ASSIGNMENTS Control Byte 1 0 1 Control Code 0 A 2 A 1 Word Address Byte A R/W 0 A 7 • • • • • • A 0 Chip Select bits  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 9 24AA024/24LC024/24AA025/24LC025 6.0 WRITE OPERATIONS 6.1 Byte Write Following the Start signal from the host, the device code(four bits), the Chip Select bits (three bits) and the R/W bit (which is a logic low) are placed onto the bus by the host transmitter. The device will acknowledge this control byte during the ninth clock pulse. The next byte transmitted by the host is the word address and will be written into the Address Pointer of the 24AA024/24LC024/24AA025/24LC025. After receiving another Acknowledge signal from the 24AA024/24LC024/24AA025/24LC025, the host device will transmit the data word to be written into the addressed memory location. The 24AA024/24LC024/ 24AA025/24LC025 acknowledges again and the host generates a Stop condition. This initiates the internal write cycle and, during this time, the 24AA024/ 24LC024/24AA025/24LC025 will not generate Acknowledge signals (Figure 6-1). If an attempt is made to write to the protected portion of the array when the hardware write protection (24XX024 only) has been enabled, the device will acknowledge the command, but no data will be written. The write cycle time must be observed even if write protection is enabled. 6.2 The higher-order four bits of the word address remain constant. If the host should transmit more than 16 bytes prior to generating the Stop condition, the Address Pointer will roll over and the previously received data will be overwritten. As with the byte-write operation, once the Stop condition is received, an internal write cycle will begin (Figure 6-2). If an attempt is made to write to the protected portion of the array when the hardware write protection has been enabled, the device will acknowledge the command, but no data will be written. The write cycle time must be observed even if write protection is enabled. Note: Page Write The write control byte, word address and the first data byte are transmitted to the 24AA024/24LC024/ 24AA025/24LC025 in the same way as in a byte write. However, instead of generating a Stop condition, the host transmits up to 15 additional data bytes to the 24AA024/24LC024/24AA025/24LC025, which are temporarily stored in the on-chip page buffer and will be written into the memory once the host has transmitted a Stop condition. Upon receipt of each word, the four lower-order Address Pointer bits, which form the byte counter, are internally incremented by one. FIGURE 6-1: 6.3 Page write operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buffer size (or ‘page size’) and end at addresses that are integer multiples of page size – 1. If a page write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next page, as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary. Write Protection The WP pin (available on 24XX024 only) must be tied to VCC or VSS. If tied to VCC, the entire array will be write-protected. If the WP pin is tied to VSS, write operations to all address locations are allowed. The WP pin is not available on the SOT-23 package. BYTE WRITE Bus Activity Host S T A R T SDA Line S Bus Activity DS20001210Q-page 10 Control Byte Word Address S T O P Data P A C K A C K A C K  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 FIGURE 6-2: PAGE WRITE Bus Activity Host S T A R T SDA Line S Bus Activity Control Byte Word Address (n) Data (n) Data (n + 15) Data (n +1) S T O P P A C K  2007-2022 Microchip Technology Inc. and its subsidiaries A C K A C K A C K A C K DS20001210Q-page 11 24AA024/24LC024/24AA025/24LC025 7.0 ACKNOWLEDGE POLLING Since the device will not acknowledge during a write cycle, this can be used to determine when the cycle is complete (this feature can be used to maximize bus throughput). Once the Stop condition for a write command has been issued from the host, the device initiates the internally timed write cycle, with ACK polling being initiated immediately. This involves the host sending a Start condition, followed by the control byte for a write command (R/W = 0). If the device is still busy with the write cycle, no ACK will be returned. If no ACK is returned, the Start bit and control byte must be resent. If the cycle is complete, the device will return the ACK and the host can then proceed with the next read or write operation. See Figure 7-1 for a flow diagram of this operation. FIGURE 7-1: ACKNOWLEDGE POLLING FLOW Send Write Command Send Stop Condition to Initiate Write Cycle Send Start Send Control Byte with R/W = 0 Did Device Acknowledge (ACK = 0)? No Yes Next Operation DS20001210Q-page 12  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 8.0 READ OPERATIONS Read operations are initiated in the same way as write operations, with the exception that the R/W bit of the client address is set to ‘1’. There are three basic types of read operations: current address read, random read and sequential read. 8.1 Current Address Read The 24AA024/24LC024/24AA025/24LC025 contains an Address Pointer that maintains the address of the last word accessed, internally incremented by one. Therefore, if the previous read access was to address ‘n’, the next current address read operation would access data from address n + 1. Upon receipt of the client address with the R/W bit set to ‘1’, the 24AA024/ 24LC024/24AA025/24LC025 issues an acknowledge and transmits the 8-bit data word. The host will not acknowledge the transfer, but generate a Stop condition, which causes the 24AA024/24LC024/ 24AA025/24LC025 to discontinue transmission (Figure 8-1). 8.2 Random Read Random read operations allow the host to access any memory location in a random manner. To perform this type of read operation, the word address must first be set. This is accomplished by sending the word address to the 24AA024/24LC024/24AA025/24LC025 as part of a write operation. Once the word address is sent, the host generates a Start condition following the acknowledge. This terminates the write operation, but not before the internal Address Pointer is set. The host then issues the control byte again, but with the R/W bit set to a ‘1’. FIGURE 8-1: The 24AA024/24LC024/24AA025/24LC025 will then issue an acknowledge and transmit the 8-bit data word. The host will not acknowledge the transfer, though it does generate a Stop condition, which causes the 24AA024/24LC024/24AA025/24LC025 to discontinue transmission (Figure 8-2). After this command, the internal Address Pointer will point to the address location following the one that was just read. 8.3 Sequential Read Sequential reads are initiated in the same way as a random read except that after the 24AA024/24LC024/ 24AA025/24LC025 transmits the first data byte, the host issues an acknowledge (as opposed to a Stop condition in a random read). This directs the 24AA024/ 24LC024/24AA025/24LC025 to transmit the next sequentially addressed 8-bit word (Figure 8-3). To provide sequential reads, the 24AA024/24LC024/ 24AA025/24LC025 contains an internal Address Pointer that is incremented by one upon completion of each operation. This Address Pointer allows the entire memory contents to be serially read during one operation. The internal Address Pointer will automatically roll over from address 0FFh to address 000h. CURRENT ADDRESS READ Bus Activity Host S T A R T SDA Line S 1 0 1 0 A0 A1 A2 1 Bus Activity  2007-2022 Microchip Technology Inc. and its subsidiaries Control Byte Block Select Bits S T O P Data (n) P A C K N o A C K DS20001210Q-page 13 24AA024/24LC024/24AA025/24LC025 FIGURE 8-2: RANDOM READ Bus Activity Host S T A R T Control Byte S SDA Line Bus Activity Host Control Byte S T O P Data (n) P S A C K A C K Bus Activity FIGURE 8-3: S T A R T Word Address (n) A C K N O A C K SEQUENTIAL READ Control Byte Data (n) Data (n + 1) Data (n + 2) S T O P Data (n + x) P SDA Line Bus Activity DS20001210Q-page 14 A C K A C K A C K A C K N O A C K  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 9.0 PACKAGING INFORMATION 9.1 Package Marking Information* 8-Lead PDIP (300 mil) XXXXXXXX T/XXXNNN YYWW 8-Lead SOIC (3.90 mm) XXXXXXXT XXXXYYWW NNN 8-Lead TSSOP Example: 24LC024 I/P e3 13F 2224 Example: 24LC024I SN e3 2224 13F Example: XXXX 4L24 TYWW I224 NNN 13F 8-Lead MSOP XXXXT YWWNNN 8-Lead 2x3 DFN XXX YWW NN 8-Lead 2x3 TDFN XXX YWW NN  2007-2022 Microchip Technology Inc. and its subsidiaries Example: 4L24I 22413F Example: 2P4 224 13 Example: AP4 224 13 DS20001210Q-page 15 24AA024/24LC024/24AA025/24LC025 6-Lead SOT-23 Example: XXNN HQEF 1st Line Marking Codes Part Number TSSOP MSOP 4A24 4A24T 24AA024 DFN TDFN SOT-23 I-TEMP E-TEMP I-TEMP E-TEMP I-TEMP E-TEMP 2P1 — AP1 — — — 24LC024 4L24 4L24T 2P4 AP5 AP4 2P5 — — 24AA025 4A25 4A25T 2R1 — AR1 — HQNN HRNN 24LC025 4L25 4L25T 2R4 AR5 AR4 2R5 HMNN HPNN Legend: XX...X T Y YY WW NNN e3 Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code (2 characters for small packages) RoHS compliant JEDEC® designator for Matte Tin (Sn) Note: Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. Note: For very small packages with no room for the JEDEC® designator e3 , the marking will only appear on the outer carton or reel label. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS20001210Q-page 16  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018-P Rev F Sheet 1 of 2  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 17 24AA024/24LC024/24AA025/24LC025 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (NOTE 5) DATUM A DATUM A b b e 2 e 2 e e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 5. Lead design above seating plane may vary, based on assembly vendor. Microchip Technology Drawing No. C04-018-P Rev F Sheet 2 of 2 DS20001210Q-page 18  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E 2X 0.10 C A–B 2X 0.10 C A–B NOTE 1 2 1 e NX b 0.25 B C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C 4X ș1 ș2 h R1 h R H L SEE VIEW C VIEW A–A c ș (L1) 4X ș1 VIEW C Microchip Technology Drawing No. C04-057-SN Rev J Sheet 1 of 2  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 19 24AA024/24LC024/24AA025/24LC025 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 § Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L Footprint L1 c Lead Thickness b Lead Width Lead Bend Radius R Lead Bend Radius R1 Foot Angle ș Mold Draft Angle ș1 Lead Angle ș2 MIN – 1.25 0.10 0.25 0.40 0.17 0.31 0.07 0.07 0° 5° 0° MILLIMETERS NOM 8 1.27 BSC – – – 6.00 BSC 3.90 BSC 4.90 BSC – – 1.04 REF – – – – – – – MAX 1.75 0.25 0.50 1.27 0.25 0.51 – – 8° 15° 8° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev J Sheet 2 of 2 DS20001210Q-page 20  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev J  2007-2022 Microchip Technology Inc. and its subsidiaries DS20001210Q-page 21 24AA024/24LC024/24AA025/24LC025 /HDG3ODVWLF7KLQ6KULQN6PDOO2XWOLQH 67 PP%RG\>76623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ ' $ % 1 '$780$ '$780% ( (   & % $  ;E  H & % $ 7239,(: $  & & 6($7,1* 3/$1( $ $ $ ;  & $ 6,'(9,(: + F / / 9,(:$$ 0LFURFKLS7HFKQRORJ\'UDZLQJ&5HY&6KHHWRI DS20001210Q-page 22  2007-2022 Microchip Technology Inc. and its subsidiaries 24AA024/24LC024/24AA025/24LC025 /HDG3ODVWLF7KLQ6KULQN6PDOO2XWOLQH 67 PP%RG\>76623@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 1 H 3LWFK 2YHUDOO+HLJKW $ 0ROGHG3DFNDJH7KLFNQHVV $ 6WDQGRII $ 2YHUDOO:LGWK ( 0ROGHG3DFNDJH:LGWK ( 2YHUDOO/HQJWK ' )RRW/HQJWK / )RRWSULQW / F /HDG7KLFNQHVV )RRW$QJOH E /HDG:LGWK 0,1        ƒ  0,//,0(7(56 120  %6&    %6&    5()  ƒ  0$;        ƒ  Notes:  3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD  'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRU SURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH  'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(
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