MTD6501C/D/G
3-Phase Brushless DC Sinusoidal Sensorless Fan Motor Driver
Features
Description
• Position Sensorless BLDC Drivers (No Hall
Sensor Required)
• 180° Sinusoidal Drive, for High Efficiency and Low
Acoustic Noise
• Support 2V to 14V Power Supplies
• Speed Control Through PAM and/or PWM
• Built-in Frequency Generator (FG Output Signal)
• Built-in Lock-up Protection and Automatic
Recovery Circuit (External Capacitor not
Necessary)
• Built-in Over Current Limitation and Short Circuit
Protection
• Built-in Thermal Shutdown Protection
• Thermally Enhanced SOP-8 Package for
MTD6501C and MTD6501G (Maximum Output
Current – 800 mA);
• MSOP-10L Package for MTD6501D (Maximum
Output Current – 500 mA)
• 20 kHz PWM Output Frequency for MTD6501C/D
and 23 kHz for MTD6501G
• Boost Mode (Optional Back Electromotive Force
(BEMF) Pre-amplification in MTD6501D)
• No External Tuning Required
The MTD6501C/D/G devices are 3-phase, full-wave
drivers for brushless sensorless DC motors. They
feature 180° sinusoidal drive, high torque output, and
silent drive. Due to their adaptive features and wide
power-supply range capabilities (2V to 14V), they are
intended to cover a wide range of motor characteristics,
while requiring no external tuning from the user. Speed
control can be achieved through either power supply
modulation or pulse-width modulation (using the PWM
digital input pin).
The MTD6501C/D/G devices are formerly products of
Advanced Silicon.
Due to the compact packaging and minimum bill of
materials (power transistors incorporated, no Hall
sensor, no external tuning), they are best suited for lowcost fan applications requiring high efficiency and low
acoustic noise, such as CPU cooling fans. Frequency
generator output enables precision speed control in
closed-loop applications. The MTD6501C/D/G drivers
include a Lock-up Protection mode, which turns off the
output current when the motor is under lock condition,
and an automatic recovery that enables the fan to run
when the lock condition is removed. Motor overcurrent
limitation, short-circuit protection and thermalshutdown protection are also included.
The MTD6501C and the MTD6501G are available in a
compact thermally-enhanced SOP-8 package, while
the MTD6501D is available in the MSOP-10L package.
Package Types
MTD6501C, MTD6501G
SOP-8
FG 1
VDD 2
8 PWM
7 VCC
OUT1 3
6 OUT3
OUT2 4
5 GND
MTD6501D
MSOP
FG 1
GND 2
VDD 3
2010-2012 Microchip Technology Inc.
10 PWM
9 BOOST
8 VCC
OUT1 4
7 OUT3
OUT2 5
6 GND
DS22263B-page 1
MTD6501C/D/G
Functional Block Diagram
BOOST *MTD6501D Only
VCC
VREF
Motor Phase
Detection Circuit
VDD
Regulator
Overcurrent
protection
VCC
PWM
PWM
Input
Output Drive Circuit
VDD
Timing
Controller
Soft Switching Drive
FG
OUT3
OUT2
OUT1
GND
Thermal
protection
DS22263B-page 2
Short-circuit
protection
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
Typical Application – Fan Motor Driver Using the MTD6501C or MTD6501G
PWM input
(0.02-100 kHz)
Vlogic
(controller side)
1 FG
2 VDD
C1
3 OUT1
4 OUT2
MTD6501C/G
R1
PWM 8
VCC
VCC 7
C2
OUT3 6
GND 5
Recommended External Components for Typical Application
Element
Type/Value
Comment
C1
>1 µF
Connect as close as possible to IC input pins
C2
>1 µF
Connect as close as possible to IC input pins
R1
>10 kΩ
2010-2012 Microchip Technology Inc.
Connect to Vlogic on controller side
DS22263B-page 3
MTD6501C/D/G
Typical Application – Fan Motor Driver Using the MTD6501D
PWM input
(0.02-100 kHz)
Vlogic
(controller side)
R1
1 FG
3 VDD
C1
4 OUT1
5 OUT2
MTD6501D
2 GND
PWM
10
BOOST 9
Tie to GND
for BOOST
mode
VCC 8
C2
OUT3 7
GND 6
Recommended External Components for Typical Application
Element
C1
Type/Value
>1 µF
C2
>1 µF
R1
>10 kΩ
DS22263B-page 4
Comment
Connect as close as possible to IC input pins
Connect as close as possible to IC input pins
Connect to Vlogic on controller side
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Power Supply Voltage (VCC_MAX) .................... -0.7 to +15.3V
Maximum OUT1, 2, 3 Output Voltage (VOUT_MAX) .................
................................................................ -0.7 to +15.3V+0.7V
FG Maximum Output Voltage (VFG_MAX) ......... -0.7 to +15.3V
Maximum Output Current(3,4) (IOUT_MAX)....................800 mA
Maximum Output Current(3,5) (IOUT_MAX)....................500 mA
FG Maximum Output Voltage (VFG_MAX) ......... -0.7 to +15.3V
FG Maximum Output Current (IFG_MAX) .....................5.0 mA
VDD Maximum Voltage (VDD_MAX) ..................... -0.7 to +4.0V
PWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +4.0V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Note 1: Reference PCB, according to JEDEC
standard EIA/JESD 51-9.
2: Derating applies for ambient temperatures
outside the specified operating range (refer
to Figure 1-1).
3: OUT1, OUT2, OUT3 (Continuous,
100% duty cycle).
Allowable Power Dissipation(1,2,4)(PD_MAX).....................1.0W
Allowable Power Dissipation(1,2,5)(PD_MAX).....................0.5W
Max Junction Temperature (TJ)....................................+150°C
4: MTD6501C and MTD6501G
5: MTD6501D
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Power Supply Voltage
VCC
2
—
14
V
Power Supply Current
IVCC
—
10
—
mA
5
Conditions
Rotation Mode
Lock-Protection Mode
OUTx High Resistance
RON(H)
—
0.75
1
Ω
IOUT = 0.5A, VCC = 3.3V to 14V
OUTx Low Resistance
RON(L)
—
0.75
1
Ω
IOUT = -0.5A, VCC = 3.3V to 14V
OUTx Total Resistance
RON(H+L)
—
1.5
2
Ω
IOUT = 0.5A, VCC = 3.3V to 14V
VDD Output Voltage
VDD
—
3
—
V
VCC = 3.3V to 14V
V
VCC < 3.3V
PWM Input Frequency
fPWM
0.02
100
kHz
—
VCC – 0.2
—
PWM Input H Level
VPWM_H
0.8*VDD
—
3.6
V
—
PWM Input L Level
VPWM_L
0
—
0.2*VDD
V
—
PWM Internal Pull-Up
Current
IPWM_L
17
34
—
µA
PWM = GND, VCC = 3.3V to 14V
8
17
—
µA
PWM = GND, VCC < 3.3V
PWM Output
Frequency
fPWM_O
—
20
—
kHz
MTD6501C and MTD6501D
kHz
MTD6501G
FG Output Pin Low
Level Voltage
VOL_FG
—
—
0.25
V
IFG = -1 mA
FG Output Pin Leakage
Current
ILH_FG
—
—
10
µA
VFG = 14V
Lock Protection
Operating Time
TRUN
—
0.5
—
s
—
Lock Protection Waiting
Time
TWAIT
4.5
5
5.5
s
—
Thermal Shutdown
TSD
—
170
—
°C
—
Thermal Shutdown
Hysteresis
TSD_HYS
—
25
—
°C
—
23
2010-2012 Microchip Technology Inc.
DS22263B-page 5
MTD6501C/D/G
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits are established for VCC = 5.0V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature
TOPR
-30
—
+95
°C
Storage Temperature Range
TSTG
-55
—
+150
°C
Conditions
Temperature Ranges
1.2
PDMAX (W)
1
SOP-8
0.8
0.6
MSOP-10
0.4
0.2
-10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
0
TA (°C)
FIGURE 1-1:
DS22263B-page 6
Allowable Power Dissipation (PD_MAX) as a Function of Ambient Temperature (TA).
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
MTD6501C/D/G PIN FUNCTION TABLE
MTD6501C,
MTD6501G
MTD6501D
SOP-8
MSOP
1
1
Type
Symbol
O
FG
Description
Motor speed indication output
Internal regulator output (for decoupling only)
2
3
P
VDD
3
4
O
OUT1
Single-phase coil output pin
4
5
O
OUT2
Single-phase coil output pin
5
2, 6
P
GND
Negative voltage supply (ground)
6
7
O
OUT3
Single-phase coil output pin
7
8
P
VCC
8
10
I
PWM
PWM input signal for speed control
N/A
9
I
BOOST
Boost mode selection:
• Pin floating for Normal mode
• Pin tied to GND for Boost mode
Positive voltage supply for motor driver
Legend: I = Input; O = Output; P = Power
2010-2012 Microchip Technology Inc.
DS22263B-page 7
MTD6501C/D/G
NOTES:
DS22263B-page 8
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
3.0
FUNCTIONAL DESCRIPTION
The MTD6501C/D/G devices generate a full-wave signal to drive a 3-phase sensorless BLDC motor. High
efficiency and low-power consumption are achieved
due to DMOS transistors and synchronous rectification
drive type. The current carrying order of the output is as
follows: OUT1 OUT2 OUT3.
3.1
Frequency Generator Function
The Frequency Generator output is a “Hall-sensor
equivalent” digital output, giving information to an
external controller about the speed and phase of the
motor. The FG pin is an open drain output, connecting
to a logical voltage level through an external pull-up
resistor. When a lock (or out-of-sync) situation is
detected by the driver, this output is set to high-impedance until the motor is restarted. Leave the pin open
when not used. The FG signal can be used to compute
the motor speed in rotations per minute (RPM). Typically, for a four pole BLDC fan, the speed in RPMs is 30
FG frequency (Hz).
3.3
Overcurrent Protection and Short
Circuit Detection
The motor peak current is limited by the driver to a fixed
value (defined internally), thus limiting the maximum
power dissipation in the coils. The detection of a shortcircuit situation immediately sets the driver outputs to
high-impedance, in order to avoid permanent damage
to the IC.
Speed Control
The rotational speed of the motor can be controlled
either through the PWM digital input signal or by acting
directly on the power supply (VCC). When the PWM
signal is “High” (or left open) the motor rotates at full
speed. When the PWM signal is “Low”, the motor is
stopped (and the IC outputs are set to highimpedance). By changing the PWM duty cycle, the
speed can be adjusted. Notice that the PWM frequency
has no special meaning for the motor speed and is
asynchronous with the activation of the output
transistors. Thus, the user has maximum freedom to
choose the PWM system frequency within a wide range
(from 20 Hz to 100 kHz), while the output transistor
activation always occurs at a fixed rate, which is
outside of the range of audible frequencies. The
MTD6501C and MTD6501D typical output frequency is
20 kHz. The MTD6501G output frequency is 23 kHz.
3.2
3.4
Lockup Protection and Automatic
Restart
3.5
Thermal Shutdown
The MTD6501C/D/G have a thermal protection
function which detects when the die temperature
exceeds TSD = +170°C. When this temperature is
reached, the circuit enters Thermal Shutdown mode
and the outputs OUT1, OUT2 and OUT3 are disabled
(high-impedance), avoiding IC destruction and allowing
the circuit to cool down. Once the junction temperature
(TSD) has dropped below +145°C, the normal operation
resumes (thermal detection circuit has +25°C
hysteresis function).
Thermal Shutdown
Normal operation
TSD
+145°C
FIGURE 3-1:
Hysteresis.
3.6
+170°C
Thermal Protection
Internal Voltage Regulator
VDD voltage is generated internally and is used to
supply internal logical blocks. The VDD pin is used to
connect an external decoupling capacitor (1 µF or
higher). Notice that this pin is for IC internal use and is
not designed to supply DC current to external blocks.
If the motor is stopped (blocked) or if it loses
synchronization with the driver, a lock-up protection
circuit detects this situation and disables the driver (by
setting its outputs to high-impedance) in order to
prevent the motor coil from burnout. After a “waiting
time” (TWAIT), the lock-up protection is released and
normal operation resumes for a given time (TRUN). In
case the motor is still blocked, a new period of waiting
time is started. TWAIT and TRUN timings are fixed
internally, so that no external capacitor is needed.
2010-2012 Microchip Technology Inc.
DS22263B-page 9
MTD6501C/D/G
3.7
Boost Mode (MTD6501D)
The Boost mode is an optional BEMF pre-amplification
by a factor of three. The intention of Boost mode is to
compensate for motors with a low coupling coefficient
(= BEMF coefficient), thus allowing it to cover an even
wider range of motor characteristics. Notice that Boost
mode impacts the mechanical performance of the
motor altogether. In Boost mode, the speed of the
motor will adjust faster to variations of the control (VCC
or PWM) and/or of the load, including at start-up.
However, when the BEMF is amplified too much, the
mechanical performance (in terms of vibration and
acoustic noise) may start degrading. Thus, Boost mode
may be inappropriate for motors that already have a
good coupling coefficient. The optimum choice
between normal mode and Boost mode depends both
on the application requirements and on the motor
characteristics.
Refer to Table 3-1 for usage of Boost pin 9; leaving this
pin floating results in the normal mode of operation,
while tying this pin to GND activates Boost mode
(active low feature, internal pull-up).
TABLE 3-1:
POSSIBLE MODES OF
OPERATION BASED ON THE
BOOST PIN CONNECTION
BOOST Pin
Mode of Operation
Floating
Normal
Tied to GND
Boost
DS22263B-page 10
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead SOP (3.90 mm) (MTD6501C, MTD6501G)
Example
MTD6501C
HC e^^1135
3
256
NNN
10-Lead MSOP (MTD6501D)
Example
6501D
135256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2010-2012 Microchip Technology Inc.
DS22263B-page 11
MTD6501C/D/G
DS22263B-page 12
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
2010-2012 Microchip Technology Inc.
DS22263B-page 13
MTD6501C/D/G
DS22263B-page 14
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2012 Microchip Technology Inc.
DS22263B-page 15
MTD6501C/D/G
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22263B-page 16
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010-2012 Microchip Technology Inc.
DS22263B-page 17
MTD6501C/D/G
NOTES:
DS22263B-page 18
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
APPENDIX A:
REVISION HISTORY
Revision B (May 2012)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Added the MTD6501G device to the family and
related information throughout the document.
Updated the Temperature Specifications
table.
Sorted the information in Table 2-1.
Corrected Frequency Generator output to open
drain in Section 3.2 “Frequency Generator
Function”.
Renamed
Section 4.0
“Packaging
Information”. Added Section 4.1 “Package
Marking Information”.
Added Product Identification System section.
Other minor typographical corrections.
Revision A (September 2010)
• Original data sheet for the MTD6501C/D/G family
of devices.
2010-2012 Microchip Technology Inc.
DS22263B-page 19
MTD6501C/D/G
NOTES:
DS22263B-page 20
2010-2012 Microchip Technology Inc.
MTD6501C/D/G
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
XX
Device Tube/Tape and Reel Package
Device
MTD6501C-H:
MTD6501C-L:
MTD6501D-H:
MTD6501D-L:
MTD6501G-H:
MTD6501G-L:
Package
C1*
=
=
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 800 mA, PWM 20 kHz) (Tube)
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 800 mA, PWM 20 kHz)
(Tape and Reel)
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 500 mA, PWM 20 kHz, Boost
option) (Tube)
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 500 mA, PWM 20 kHz, Boost
option) (Tape and Reel)
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 800 mA, PWM 23 kHz) (Tube)
3-Phase BLDC Sinusoidal Sensorless Fan Motor
Driver (IOUT maximum 800 mA, PWM 23 kHz)
(Tape and Reel)
Examples:
a)
MTD6501C-HC1
b)
MTD6501C-LC1
c)
MTD6501D-HC1
d)
MTD6501D-LC1
e)
MTD6501G-HC1
f)
MTD6501G-LC1
Tube,
8LD SOP Package
Tape and Reel,
8LD SOP Package
Tube,
10LD MSOP Package
Tape and Reel,
10LD MSOP Package
Tube,
8LD SOP Package
Tape and Reel,
8LD SOP Package
8-Lead Plastic Small Outline – Thermally Enhanced Package
(SOP)
10-Lead Plastic Micro Small Outline Package (MSOP)
* These devices are formerly products of Advanced Silicon
2010-2012 Microchip Technology Inc.
DS22263B-page 21
MTD6501C/D/G
NOTES:
DS22263B-page 22
2010-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2010-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-278-3
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2010-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22263B-page 23
Worldwide Sales and Service
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EUROPE
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Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS22263B-page 24
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
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