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APA150-PQGM - ProASIC Flash Family FPGAs - Actel Corporation

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APA150-PQGM
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4773.56KB 共174页
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ACTEL[ActelCorporation]
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http://www.actel.com/
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APA150-PQGM - ProASIC Flash Family FPGAs - Actel Corporation
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v5.7 ProASICPLUS® ® Flash Family FPGAs High Performance Routing Hierarchy • • • • • • • • • • • • • • • • • ® Features and Benefits High Capacity Commercial and Industrial • • • • • • • • • • • • 75,000 to 1 Million System Gates 27 k to 198 kbits of Two-Port SRAM 66 to 712 User I/Os 300, 000 to 1 million System Gates 72 k to 198 kbits of Two Port SRAM 158 to 712 User I/Os 0.22 µm 4 LM Flash-Based CMOS Process Live At Power-Up (LAPU) Level 0 Support Single-Chip Solution No Configuration Device Required Retains Programmed Design during Power-Down/Up Cycles Mil/Aero Devices Operate over Full Military Temperature Range 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military temperature) Two Integrated PLLs External System Performance up to 150 MHz The Industry’s Most Effective Security Key (FlashLock ) Low Impedance Flash Switches Segmented Hierarchical Routing Structure Small, Efficient, Configurable (Combinatorial or Sequential) Logic Cells APA075 75,000 3,072 27 k 12 2 2 4 24 158 Yes Yes 100, 144 208 – 144 APA150 150,000 6,144 36k 16 2 2 4 32 242 Yes Yes 100 208 456 144, 256 Ultra-Fast Local and Long-Line Network High-Speed Very Long-Line Network High-Performance, Low Skew, Splittable Global Network 100% Routability and Utilization Schmitt-Trigger Option on Every Input 2.5 V/3.3 V Support with Individually-Selectable Voltage and Slew Rate Bidirectional Global I/Os Compliance with PCI Specification Revision 2.2 Boundary-Scan Test IEEE Std. 1149.1 (JTAG) Compliant Pin Compatible Packages across the ProASICPLUS Family PLL with Flexible Phase, Multiply/Divide and Delay Capabilities Internal and/or External Dynamic PLL Configuration Two LVPECL Differential Pairs for Clock or Data Inputs Flexibility with Choice of Industry-Standard Front-End Tools Efficient Design through Front-End Timing and Gate Optimization In-System Programming (ISP) via JTAG Port SmartGen Netlist Generation Ensures Optimal Usage of Embedded Memory Blocks 24 SRAM and FIFO Configurations with Synchronous and Asynchronous Operation up to 150 MHz (typical) I/O Military Reprogrammable Flash Technology Unique Clock Conditioning Circuitry Standard FPGA and ASIC Design Flow ISP Support SRAMs and FIFOs • Performance • • • • • • • Secure Programming Low Power Table 1 • ProASICPLUS Product Profile Device Maximum System Gates Tiles (Registers) Embedded RAM Bits (k=1,024 bits) Embedded RAM Blocks (256x9) LVPECL PLL Global Networks Maximum Clocks Maximum User I/Os JTAG ISP PCI Package (by pin count) TQFP PQFP PBGA FBGA CQFP2 CCGA/LGA2 Notes: APA3001 300,000 8,192 72 k 32 2 2 4 32 290 Yes Yes – 208 456 144, 256 208, 352 APA450 450,000 12,288 108 k 48 2 2 4 48 344 Yes Yes – 208 456 144, 256, 484 APA6001 600,000 21,504 126 k 56 2 2 4 56 454 Yes Yes – 208 456 256, 484, 676 208, 352 624 APA750 750,000 32,768 144 k 64 2 2 4 64 562 Yes Yes – 208 456 676, 896 APA10001 1,000,000 56,320 198 k 88 2 2 4 88 712 Yes Yes – 208 456 896, 1152 208, 352 624 1. Available as Commercial/Industrial and Military/MIL-STD-883B devices. 2. These packages are available only for Military/MIL-STD-883B devices. S e pt em be r 2 0 08 © 2008 Actel Corporation i See the Actel website for the latest version of the datasheet. ProASICPLUS Flash Family FPGAs Ordering Information APA1000 _ F FG G 1152 I Application (Ambient Temperature Range) Blank = Commercial (0˚C to +70˚C) I = Industrial (-40˚C to +85˚C) PP = Pre-production ES = Engineering Silicon (Room Temperature Only) M = Military (-55˚C to 125˚C) B = MIL-STD-883 Class B Package Lead Count Lead-free packaging Blank = Standard Packaging G = RoHS Compliant Packaging Package Type TQ = Thin Quad Flat Pack (0.5 mm pitch) PQ = Plastic Quad Flat Pack (0.5 mm pitch) FG = Fine Pitch Ball Grid Array (1.0 mm pitch) BG = Plastic Ball Grid Array (1.27 mm pitch) CQ = Ceramic Quad Flat Pack (1.05 mm pitch) CG = Ceramic Column Grid Array (1.27 mm pitch) LG = Land Grid Array (1.27 mm pitch) Speed Grade Blank = Standard Speed F = 20% Slower than Standard Part Number APA075 APA150 APA300 APA450 APA600 APA750 APA1000 = = = = = = = 75,000 Equivalent System Gates 150,000 Equivalent System Gates 300,000 Equivalent System Gates 450,000 Equivalent System Gates 600,000 Equivalent System Gates 750,000 Equivalent System Gates 1,000,000 Equivalent System Gates ii v5.7 ProASICPLUS Flash Family FPGAs Device Resources User I/Os2 Commercial/Industrial Military/MIL-STD-883B CCGA/ LGA TQFP TQFP PQFP PBGA FBGA FBGA FBGA FBGA FBGA FBGA CQFP CQFP 100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin Device APA075 APA150 APA300 APA450 APA600 APA750 APA1000 66 66 107 158 158 158 4 158 158 4 100 242 290 4 344 356 4 100 100 4 100 186 3 186 3, 4 186 186 3 158 344 3 248 248 248 440 440 3, 4 370 3 454 454 562 5 642 4, 5 712 5 158 158 158 158 4 356 356 4 Notes: 1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array 2. Each pair of PECL I/Os is counted as one user I/O. 3. FG256 and FG484 are footprint-compatible packages. 4. Military Temperature Plastic Package Offering 5. FG896 and FG1152 are footprint-compatible packages. General Guideline Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee performance beyond the limits specified within the datasheet. v5.7 iii ProASICPLUS Flash Family FPGAs Temperature Grade Offerings Package TQ100 TQ144 PQ208 BG456 FG144 FG256 FG484 FG676 FG896 FG1152 CQ208 CQ352 CG624 Note: C = Commercial I = Industrial M = Military B = MIL-STD-883 M, B M, B M, B M, B M, B C, I APA075 C, I C, I C, I C, I C, I C, I C, I C, I, M C, I, M C, I, M C, I, M C, I C, I C, I C, I C, I C, I, M C, I, M C, I, M C, I C, I C, I, M C, I M, B M, B M, B C, I, M C, I, M C, I C, I C, I, M C, I, M APA150 C, I APA300 APA450 APA600 APA750 APA1000 Speed Grade and Temperature Matrix –F C I M, B Note: C = Commercial I = Industrial M = Military B = MIL-STD-883 ✓ Std. ✓ ✓ ✓ iv v5.7 ProASICPLUS Flash Family FPGAs Table of Contents General Description ProASICPLUS Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Timing Control and Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13 Sample Implementations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16 Adjustable Clock Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16 Clock Skew Minimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16 PLL Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21 Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27 ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27 Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28 Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29 Calculating Typical Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-30 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-33 Tristate Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-42 Output Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Global Input Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Predicted Global Routing Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-44 1-46 1-48 1-50 Global Routing Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-50 Module Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51 Sample Macrocell Library Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51 Embedded Memory Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-54 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-73 Recommended Design Practice for VPN/VPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-74 Package Pin Assignments 100-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12 352-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16 456-Pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22 144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-37 256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40 484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-45 676-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-51 896-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-59 1152-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-69 624-Pin CCGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-78 Datasheet Information List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Data Sheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8 v5.7 v ProASICPLUS Flash Family FPGAs General Description The ProASICPLUS family of devices, Actel’s secondgeneration Flash FPGAs, offers enhanced performance over Actel’s ProASIC family. It combines the advantages of ASICs with the benefits of programmable devices through nonvolatile Flash technology. This enables engineers to create high-density systems using existing ASIC or FPGA design flows and tools. In addition, the ProASICPLUS family offers a unique clock conditioning circuit based on two on-board phase-locked loops (PLLs). The family offers up to one million system gates, supported with up to 198 kbits of two-port SRAM and up to 712 user I/Os, all providing 50 MHz PCI performance. Advantages to the designer extend beyond performance. Unlike SRAM-based FPGAs, four levels of routing hierarchy simplify routing, while the use of Flash technology allows all functionality to be live at powerup. No external boot PROM is required to support device programming. While on-board security mechanisms prevent access to the program information, reprogramming can be performed in-system to support future design iterations and field upgrades. The device’s architecture mitigates the complexity of ASIC migration at higher user volume. This makes ProASICPLUS a costeffective solution for applications in the networking, communications, computing, and avionics markets. The ProASICPLUS family achieves its nonvolatility and reprogrammability through an advanced Flash-based 0.22 μm LVCMOS process with four layers of metal. Standard CMOS design techniques are used to implement logic and control functions, including the PLLs and LVPECL inputs. This results in predictable performance compatible with gate arrays. The ProASICPLUS architecture provides granularity comparable to gate arrays. The device core consists of a Sea-of-Tiles™. Each tile can be configured as a flip-flop, latch, or three-input/one-output logic function by programming the appropriate Flash switches. The combination of fine granularity, flexible routing resources, and abundant Flash switches allow 100% utilization and over 95% routability for highly congested designs. Tiles and larger functions are interconnected through a four-level routing hierarchy. Embedded two-port SRAM blocks with built-in FIFO/RAM control logic can have user-defined depths and widths. Users can also select programming for synchronous or asynchronous operation, as well as parity generations or checking. The unique clock conditioning circuitry in each device includes two clock conditioning blocks. Each block provides a PLL core, delay lines, phase shifts (0° and 180°), and clock multipliers/dividers, as well as the circuitry needed to provide bidirectional access to the PLL. The PLL block contains four programmable frequency dividers which allow the incoming clock signal to be divided by a wide range of factors from 1 to 64. The clock conditioning circuit also delays or advances the incoming reference clock up to 8 ns (in increments of 0.25 ns). The PLL can be configured internally or externally during operation without redesigning or reprogramming the part. In addition to the PLL, there are two LVPECL differential input pairs to accommodate high-speed clock and data inputs. To support customer needs for more comprehensive, lower-cost, board-level testing, Actel’s ProASICPLUS devices are fully compatible with IEEE Standard 1149.1 for test access port and boundary-scan test architecture. For more information concerning the Flash FPGA implementation, please refer to the "Boundary Scan (JTAG)" section on page 1-11. ProASICPLUS devices are available in a variety of highperformance plastic packages. Those packages and the performance features discussed above are described in more detail in the following sections. v5.7 1-1 ProASICPLUS Flash Family FPGAs ProASICPLUS Architecture The proprietary ProASICPLUS architecture granularity comparable to gate arrays. provides The ProASICPLUS device core consists of a Sea-of-Tiles (Figure 1-1). Each tile can be configured as a three-input logic function (e.g., NAND gate, D-Flip-Flop, etc.) by programming the appropriate Flash switch interconnections (Figure 1-2 and Figure 1-3 on page 1-3). Tiles and larger functions are connected with any of the four levels of routing hierarchy. Flash switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect programming. Flash switches are programmed to connect signal lines to the appropriate logic cell inputs and outputs. Dedicated high-performance lines are connected as needed for fast, low-skew global signal distribution throughout the core. Maximum core utilization is possible for virtually any design. ProASICPLUS devices also contain embedded, two-port SRAM blocks with built-in FIFO/RAM control logic. Programming options include synchronous or asynchronous operation, two-port RAM configurations, user defined depth and width, and parity generation or checking. Please see the "Embedded Memory Configurations" section on page 1-22 for more information. RAM Block 256x9 Two-Port SRAM or FIFO Block I/Os Logic Tile RAM Block 256x9 Two Port SRAM or FIFO Block Figure 1-1 • The ProASICPLUS Device Architecture Floating Gate Switch In Sensing Switching Word Switch Out Figure 1-2 • Flash Switch 1 -2 v5.7 ProASICPLUS Flash Family FPGAs Local Routing In 1 Efficient Long-Line Routing In 2 (CLK) In 3 (Reset) Figure 1-3 • Core Logic Tile Live at Power-Up The Actel Flash-based ProASIC devices support Level 0 of the live at power-up (LAPU) classification standard. This feature helps in system component initialization, executing critical tasks before the processor wakes up, setting up and configuring memory blocks, clock generation, and bus activity management. The LAPU feature of Flash-based ProASICPLUS devices greatly simplifies total system design and reduces total system cost, often eliminating the need for Complex Programmable Logic Device (CPLD) and clock generation PLLs that are used for this purpose in a system. In addition, glitches and brownouts in system power will not corrupt the ProASICPLUS device's Flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when system power is restored. This enables the reduction or complete removal of the configuration PROM, expensive voltage monitor, brownout detection, and clock generator devices from the PCB design. Flash-based ProASICPLUS devices simplify total system design, and reduce cost and design risk, while increasing system reliability and improving system initialization time. PLUS Flash Switch Unlike SRAM FPGAs, ProASICPLUS uses a live-on-power-up ISP Flash switch as its programming element. In the ProASICPLUS Flash switch, two transistors share the floating gate, which stores the programming information. One is the sensing transistor, which is only used for writing and verification of the floating gate voltage. The other is the switching transistor. It can be used in the architecture to connect/separate routing nets or to configure logic. It is also used to erase the floating gate (Figure 1-2 on page 1-2). Logic Tile The logic tile cell (Figure 1-3) has three inputs (any or all of which can be inverted) and one output (which can connect to both ultra-fast local and efficient long-line routing resources). Any three-input, one-output logic function (except a three-input XOR) can be configured as one tile. The tile can be configured as a latch with clear or set or as a flip-flop with clear or set. Thus, the tiles can flexibly map logic and sequential gates of a design. v5.7 1-3 ProASICPLUS Flash Family FPGAs Routing Resources The routing structure of ProASICPLUS devices is designed to provide high performance through a flexible fourlevel hierarchy of routing resources: ultra-fast local resources, efficient long-line resources, high-speed, very long-line resources, and high performance global networks. The ultra-fast local resources are dedicated lines that allow the output of each tile to connect directly to every input of the eight surrounding tiles (Figure 1-4). The efficient long-line resources provide routing for longer distances and higher fanout connections. These resources vary in length (spanning 1, 2, or 4 tiles), run both vertically and horizontally, and cover the entire ProASICPLUS device (Figure 1-5 on page 1-5). Each tile can drive signals onto the efficient long-line resources, which can in turn access every input of every tile. Active buffers are inserted automatically by routing software to limit the loading effects due to distance and fanout. The high-speed, very long-line resources, which span the entire device with minimal delay, are used to route very long or very high fanout nets. (Figure 1-6 on page 1-6). The high-performance global networks are low-skew, high fanout nets that are accessible from external pins or from internal logic (Figure 1-7 on page 1-7). These nets are typically used to distribute clocks, resets, and other high fanout nets requiring a minimum skew. The global networks are implemented as clock trees, and signals can be introduced at any junction. These can be employed hierarchically with signals accessing every input on all tiles. L L L L Inputs L Output L Ultra-Fast Local Lines (connects a tile to the adjacent tile, I/O buffer, or memory block) L L L Figure 1-4 • Ultra-Fast Local Resources 1 -4 v5.7 ProASICPLUS Flash Family FPGAs Spans 4 Tiles Spans 2 Tiles Spans 1 Tile Logic Tile L L L L L L L L L L L L L L L L L L Spans 1 Tile Spans 2 Tiles Spans 4 Tiles L L L L L L Logic Cell L L L L L L Figure 1-5 • Efficient Long-Line Resources v5.7 1-5 ProASICPLUS Flash Family FPGAs High Speed Very Long-Line Resouces PAD RING SRAM PAD RING I/O RING I/O RING SRAM PAD RING Figure 1-6 • High-Speed, Very Long-Line Resources Clock Resources The family offers powerful and flexible control of circuit timing through the use of analog circuitry. Each chip has two clock conditioning blocks containing a phase-locked loop (PLL) core, delay lines, phase shifter (0° and 180°), clock multiplier/dividers, and all the circuitry needed for the selection and interconnection of inputs to the global network (thus providing bidirectional access to the PLL). This permits the PLL block to drive inputs and/or outputs via the two global lines on each side of the chip (four total lines). This circuitry is discussed in more detail in the "ProASICPLUS Clock Management System" section on page 1-13. ProASICPLUS Clock Trees One of the main architectural benefits of ProASICPLUS is the set of power- and delay-friendly global networks. ProASICPLUS offers four global trees. Each of these trees is based on a network of spines and ribs that reach all the tiles in their regions (Figure 1-7 on page 1-7). This flexible clock tree architecture allows users to map up to 88 different internal/external clocks in an APA1000 device. Details on the clock spines and various numbers of the family are given in Table 1-1 on page 1-7. The flexible use of the ProASICPLUS clock spine allows the designer to cope with several design requirements. Users implementing clock-resource intensive applications can easily route external or gated internal clocks using global routing spines. Users can also drastically reduce delay penalties and save buffering resources by mapping critical high fanout nets to spines. For design hints on using these features, refer to Actel’s Efficient Use of ProASIC Clock Trees application note. 1 -6 v5.7 ProASICPLUS Flash Family FPGAs High-Performance Global Network PAD RING PAD RING I/O RING Top Spine Global Networks Global Pads Global Pads Global Spine Global Ribs Bottom Spine I/O RING Scope of Spine (Shaded area plus local RAMs and I/Os) PAD RING Note: This figure shows routing for only one global path. Figure 1-7 • High-Performance Global Network Table 1-1 • Clock Spines APA075 Global Clock Networks (Trees) Clock Spines/Tree Total Spines Top or Bottom Spine Height (Tiles) Tiles in Each Top or Bottom Spine Total Tiles 4 6 24 16 512 3,072 APA150 4 8 32 24 768 6,144 APA300 4 8 32 32 1,024 8,192 APA450 4 12 48 32 1,024 12,288 APA600 4 14 56 48 1,536 21,504 APA750 4 16 64 64 2,048 32,768 APA1000 4 22 88 80 2,560 56,320 v5.7 1-7 ProASICPLUS Flash Family FPGAs Array Coordinates During many place-and-route operations in Actel’s Designer software tool, it is possible to set constraints that require array coordinates. Table 1-2 is provided as a reference. The array coordinates are measured from the lower left (0,0). They can be used in region constraints for specific groups of core cells, I/Os, and RAM blocks. Wild cards are also allowed. I/O and cell coordinates are used for placement constraints. Two coordinate systems are needed because there is not a one-to-one correspondence between I/O Table 1-2 • Array Coordinates Logic Tile Min. Device APA075 APA150 APA300 APA450 APA600 APA750 APA1000 x 1 1 1 1 1 1 1 y 1 1 5 5 5 5 5 x 96 128 128 192 224 256 352 Max. y 32 48 68 68 100 132 164 Bottom y – – (1,1) or (1,3) (1,1) or (1,3) (1,1) or (1,3) (1,1) or (1,3) (1,1) or (1,3) Memory Rows Top y (33,33) or (33, 35) (49,49) or (49, 51) (69,69) or (69, 71) (69,69) or (69, 71) (101,101) or (101, 103) (133,133) or (133, 135) (165,165) or (165, 167) Min. 0,0 0,0 0,0 0,0 0,0 0,0 0,0 All Max. 97, 37 129, 53 129, 73 193, 73 225, 105 257, 137 353, 169 cells and core cells. In addition, the I/O coordinate system changes depending on the die/package combination. Core cell coordinates start at the lower left corner (represented as (1,1)) or at (1,5) if memory blocks are present at the bottom. Memory coordinates use the same system and are indicated in Table 1-2. The memory coordinates for an APA1000 are illustrated in Figure 1-8. For more information on how to use constraints, see the Designer User’s Guide or online help for ProASICPLUS software tools. (1,169) (1,167) (1,165) (1,164) Memory Blocks (353,169) (352,167) (352,165) (352,164) Core (1,5) (1,3) (1,1) (0,0) Memory Blocks (352,5) (352,3) (352,1) (353,0) Figure 1-8 • Core Cell Coordinates for the APA1000 1 -8 v5.7 ProASICPLUS Flash Family FPGAs Input/Output Blocks To meet complex system demands, the ProASICPLUS family offers devices with a large number of user I/O pins, up to 712 on the APA1000. Table 1-3 shows the available supply voltage configurations (the PLL block uses an independent 2.5 V supply on the AVDD and AGND pins). All I/Os include ESD protection circuits. Each I/O has been tested to 2000 V to the human body model (per JESD22 (HBM)). Six or seven standard I/O pads are grouped with a GND pad and either a VDD (core power) or VDDP (I/O power) pad. Two reference bias signals circle the chip. One protects the cascaded output drivers, while the other creates a virtual VDD supply for the I/O ring. I/O pads are fully configurable to provide the maximum flexibility and speed. Each pad can be configured as an input, an output, a tristate driver, or a bidirectional buffer (Figure 1-9 and Table 1-4). Table 1-3 • ProASICPLUS I/O Power Supply Voltages VDDP 2.5 V 3.3 V 3.3 V 3.3 V Input Compatibility Output Drive 2.5 V 2.5 V 3.3V/2.5V Signal Control Pull-up Control Y EN A Pad 3.3 V/2.5 V Signal Control Drive Strength and Slew-Rate Control Figure 1-9 • I/O Block Schematic Representation Table 1-4 • Function I/O Features Description • • • Selectable 2.5 V or 3.3 V threshold levels Optional pull-up resistor Optionally configurable as Schmitt trigger input. The Schmitt trigger input option can be configured as an input only, not a bidirectional buffer. This input type may be slower than a standard input under certain conditions and has a typical hysteresis of 0.35 V. I/O macros with an “S” in the standard I/O library have added Schmitt capabilities. 3.3 V PCI Compliant (except Schmitt trigger inputs) Selectable 2.5 V or 3.3 V compliant output signals 2.5 V – JEDEC JESD 8-5 3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS) 3.3 V PCI compliant Ability to drive LVTTL and LVCMOS levels Selectable drive strengths Selectable slew rates Tristate Selectable 2.5 V or 3.3 V compliant output signals 2.5 V – JEDEC JESD 8-5 3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS) 3.3 V PCI compliant Optional pull-up resistor Selectable drive strengths Selectable slew rates Tristate I/O pads configured as inputs • I/O pads configured as outputs • • • • • • • • I/O pads configured as bidirectional • buffers • • • • • • • v5.7 1-9 ProASICPLUS Flash Family FPGAs Power-Up Sequencing While ProASICPLUS devices are live at power-up, the order of VDD and VDDP power-up is important during system start-up. VDD should be powered up simultaneously with VDDP on ProASICPLUS devices. Failure to follow these guidelines may result in undesirable pin behavior during system start-up. For more information, refer to Actel’s Power-Up Behavior of ProASICPLUS Devices application note. low voltage differential amplifier) and a signal and its complement, PPECL (I/P) (PECLN) and NPECL (PECLREF). The LVPECL input pad cell differs from the standard I/O cell in that it is operated from VDD only. Since it is exclusively an input, it requires no output signal, output enable signal, or output configuration bits. As a special high-speed differential input, it also does not require pull ups. Recommended termination for LVPECL inputs is shown in Figure 1-10. The LVPECL pad cell compares voltages on the PPECL (I/P) pad (as illustrated in Figure 1-11) and the NPECL pad and sends the results to the global MUX (Figure 1-14 on page 1-14). This high-speed, low-skew output essentially controls the clock conditioning circuit. LVPECLs are designed to meet LVPECL JEDEC receiver standard levels (Table 1-5). LVPECL Input Pads In addition to standard I/O pads and power pads, ProASICPLUS devices have a single LVPECL input pad on both the east and west sides of the device, along with AVDD and AGND pins to power the PLL block. The LVPECL pad cell consists of an input buffer (containing a PPECL Z 0= 50 Ω + From LVPECL Driver Z 0= 50 Ω NPECL R = 100 Ω _ Data Figure 1-10 • Recommended Termination for LVPECL Inputs Voltage 2.72 2.125 1.49 0.86 Figure 1-11 • LVPECL High and Low Threshold Values Table 1-5 • Symbol VIH VIL VID LVPECL Receiver Specifications Parameter Input High Voltage Input Low Voltage Differential Input Voltage Min. 1.49 0.86 0.3 Max 2.72 2.125 VDD Units V V V 1 -1 0 v5.7 ProASICPLUS Flash Family FPGAs Boundary Scan (JTAG) ProASICPLUS devices are compatible with IEEE Standard 1149.1, which defines a set of hardware architecture and mechanisms for cost-effective, board-level testing. The basic ProASICPLUS boundary-scan logic circuit is composed of the TAP (test access port), TAP controller, test data registers, and instruction register (Figure 1-12). This circuit supports all mandatory IEEE 1149.1 instructions (EXTEST, SAMPLE/PRELOAD and BYPASS) and the optional IDCODE instruction (Table 1-6). Each test section is accessed through the TAP, which has five associated pins: TCK (test clock input), TDI and TDO (test data input and output), TMS (test mode selector) and TRST (test reset input). TMS, TDI and TRST are equipped with pull-up resistors to ensure proper operation when no input data is supplied to them. These pins are dedicated for boundary-scan test usage. Actel recommends that a nominal 20 kΩ pull-up resistor is added to TDO and TCK pins. The TAP controller is a four-bit state machine (16 states) that operates as shown in Figure 1-13 on page 1-12. The ’1’s and ‘0’s represent the values that must be present at TMS at a rising edge of TCK for the given state transition to occur. IR and DR indicate that the instruction register or the data register is operating in that state. ProASICPLUS devices have to be programmed at least once for complete boundary-scan functionality to be available. Prior to being programmed, EXTEST is not available. If boundary-scan functionality is required prior to programming, refer to online technical support on the Actel website and search for ProASICPLUS BSDL. I/O I/O I/O I/O I/O Test Data Registers TDI TCK TMS TAP Controller Instruction Register Device Logic TRST TDO I/O I/O I/O I/O I/O Figure 1-12 • ProASICPLUS JTAG Boundary Scan Test Logic Circuit Table 1-6 • Boundary-Scan Opcodes Hex Opcode EXTEST SAMPLE/PRELOAD IDCODE 00 01 0F CLAMP BYPASS Table 1-6 • Boundary-Scan Opcodes Hex Opcode 05 FF v5.7 I/O I/O I/O I/O Bypass Register 1-11 ProASICPLUS Flash Family FPGAs The TAP controller receives two control inputs (TMS and TCK) and generates control and clock signals for the rest of the test logic architecture. On power-up, the TAP controller enters the Test-Logic-Reset state. To guarantee a reset of the controller from any of the possible states, TMS must remain high for five TCK cycles. The TRST pin may also be used to asynchronously place the TAP controller in the Test-Logic-Reset state. ProASICPLUS devices support three types of test data registers: bypass, device identification, and boundary scan. The bypass register is selected when no other register needs to be accessed in a device. This speeds up test data transfer to other devices in a test data path. The 32-bit device identification register is a shift register with four fields (lowest significant byte (LSB), ID number, part number and version). The boundary-scan register observes and controls the state of each I/O pin. Each I/O cell has three boundary-scan register cells, each with a serial-in, serial-out, parallel-in, and parallel-out pin. The serial pins are used to serially connect all the boundary-scan register cells in a device into a boundaryscan register chain, which starts at the TDI pin and ends at the TDO pin. The parallel ports are connected to the internal core logic tile and the input, output, and control ports of an I/O buffer to capture and load data into the register to control or observe the logic state of each I/O. 1 Test-Logic Reset 0 Run-Test/ Idle 1 Select-DRScan 0 1 Capture-DR 0 0 1 Select-IRScan 0 1 Capture-IR 0 Shift-IR 1 1 0 Exit-IR 0 Pause-IR 1 0 Exit2-IR 1 Update-IR 0 1 1 0 1 0 Shift-DR 1 Exit-DR 0 0 Pause-DR 1 0 Exit2-DR 1 Update-DR 0 1 Figure 1-13 • TAP Controller State Diagram 1 -1 2 v5.7 ProASICPLUS Flash Family FPGAs Timing Control and Characteristics ProASICPLUS Clock Management System ProASICPLUS devices provide designers with very flexible clock conditioning capabilities. Each member of the ProASICPLUS family contains two phase-locked loop (PLL) blocks which perform the following functions: • • • • • • • • • Clock Phase Adjustment via Programmable Delay (250 ps steps from –7 ns to +8 ns) Clock Skew Minimization Clock Frequency Synthesis Input Frequency Range (fIN) = 1.5 to 180 MHz Feedback Frequency Range (fVCO) = 24 to 180 MHz Output Frequency Range (fOUT) = 8 to 180 MHz Output Phase Shift = 0 ° and 180 ° Output Duty Cycle = 50% Low Output Jitter (max at 25°C) – – – fVCO 60 MHz. Jitter ±1% or better follows (Figure 1-15 on page 1-15, Table 1-7 on page 115, and Table 1-8 on page 1-16): Global A (secondary clock) • • • • Output from Global MUX A Conditioned version of PLL output (fOUT) – delayed or advanced Divided version of either of the above Further delayed version of either of the above (0.25 ns, 0.50 ns, or 4.00 ns delay)1 Output from Global MUX B Delayed or advanced version of fOUT Divided version of either of the above Further delayed version of either of the above (0.25 ns, 0.50 ns, or 4.00 ns delay)2 Global B • • • • Each PLL has the following key features: Functional Description Each PLL block contains four programmable dividers as shown in Figure 1-14 on page 1-14. These allow frequency scaling of the input clock signal as follows: • • The n divider divides the input clock by integer factors from 1 to 32. The m divider in the feedback path allows multiplication of the input clock by integer factors ranging from 1 to 64. The two dividers together can implement any combination of multiplication and division resulting in a clock frequency between 24 and 180 MHz exiting the PLL core. This clock has a fixed 50% duty cycle. The output frequency of the PLL core is given by the formula EQ 1-1 (fREF is the reference clock frequency): EQ 1-1 Note: Jitter(ps) = Jitter(%)* period For Example: Jitter in picoseconds at 100 MHz = 0.01 * (1/100E6) = 100 ps • Maximum Acquisition = 80 µs for fVCO > 40 MHz Time = 30 µs for fVCO < 40 MHz Low Power Consumption – 6.9 mW (max – analog supply) + 7.0μW/MHz (max – digital supply) • • • fOUT = fREF * m/n • The third and fourth dividers (u and v) permit the signals applied to the global network to each be further divided by integer factors ranging from 1 to 4. Physical Implementation Each side of the chip contains a clock conditioning circuit based on a 180 MHz PLL block (Figure 1-14 on page 114). Two global multiplexed lines extend along each side of the chip to provide bidirectional access to the PLL on that side (neither MUX can be connected to the opposite side's PLL). Each global line has optional LVPECL input pads (described below). The global lines may be driven by either the LVPECL global input pad or the outputs from the PLL block, or both. Each global line can be driven by a different output from the PLL. Unused global pins can be configured as regular I/Os or left unconnected. They default to an input with pull-up. The two signals available to drive the global networks are as The implementations shown in EQ2 and EQ3 enable the user to define a wide range of frequency multiplier and divisors. fGLB = m/(n*u) EQ 1-2 fGLA = m/(n*v) EQ 1-3 1. This mode is available through the delay feature of the Global MUX driver. v5.7 1-13 ProASICPLUS Flash Family FPGAs enable the user to define a wide range of frequency multipliers and divisors. The clock conditioning circuit can advance or delay the clock up to 8 ns (in increments of 0.25 ns) relative to the positive edge of the incoming reference clock. The system also allows for the selection of output frequency clock phases of 0° and 180°. Prior to the application of signals to the rib drivers, they pass through programmable delay units, one per global network. These units permit the delaying of global signals relative to other signals to assist in the control of input set-up times. Not all possible combinations of input and output modes can be used. The degrees of freedom available in the bidirectional global pad system and in the clock conditioning circuit have been restricted. This avoids unnecessary and unwieldy design kit and software work. AVDD AGND VDD GND Global MUX B OUT Input Pins to the PLL See Figure 1-15 + on page 1-14 External Feedback Signal Clock Conditioning Circuitry (Top level view) GLA GLB 27 4 Flash Configuration Bits Dynamic Configuration Bits Global MUX A OUT 8 Clock Conditioning Circuitry Detailed Block Diagram CLK P+ PFIVDIV[4:0] ÷n PLL Core ÷m FBDIV[5:0] Clock from Core (GLINT mode) 0 1 EXTFB XDLYSEL Deskew Delay 2.95 ns 2 3 1 Delay Line 0.25 ns to 4.00 ns, 16 steps, 0.25 ns increments Bypass Primary 1 7 180˚ 0˚ 6 5 4 2 OBMUX[2:0] 0 ÷u OBDIV[1:0] DLYB[1:0] Delay Line 0.0 ns, 0.25 ns, 0.50 ns and 4.00 ns GLB 3 OADIV[1:0] 2 1 OAMUX[1:0] ÷v DLYA[1:0] Delay Line 0.0 ns, 0.25 ns, 0.50 ns and 4.00 ns FBDLY[3:0] FBSEL[1:0] GLA CLKA Clock from Core (GLINT mode) Bypass Secondary Notes: 1. FBDLY is a programmable delay line from 0 to 4 ns in 250 ps increments. 2. DLYA and DLYB are programmable delay lines, each with selectable values 0 ps, 250 ps, 500 ps, and 4 ns. 3. OBDIV will also divide the phase-shift since it takes place after the PLL Core. Figure 1-14 • PLL Block – Top-Level View and Detailed PLL Block Diagram 1 -1 4 v5.7 ProASICPLUS Flash Family FPGAs Package Pins GL NPECL Physical I/O Buffers Std. Pad Cell PECL Pad Cell Global MUX Configuration Tile Global MUX B OUT PPECL External Feedback Global MUX A OUT Configuration Tile GLMX GL Std. Pad Cell Std. Pad Cell CORE Legend Physical Pin DATA Signals to the Core DATA Signals to the PLL Block DATA Signals to the Global MUX Control Signals to the Global MUX Note: When a signal from an I/O tile is connected to the core, it cannot be connected to the Global MUX at the same time. Figure 1-15 • Input Connectors to ProASICPLUS Clock Conditioning Circuitry Table 1-7 • MUX FBSEL 1 2 3 XDLYSEL 0 1 OBMUX 0 1 2 4 5 6 7 OAMUX 0 1 2 3 Primary bypass, no divider Primary bypass, use divider Delay Clock Using FBDLY Phase Shift Clock by 0° Reserved Phase Shift Clock by +180° Reserved GLA Secondary bypass, no divider Secondary bypass, use divider Delay Clock Using FBDLY Phase Shift Clock by 0° +0.25 to +4 ns in 0.25 ns increments +0.25 to +4 ns in 0.25 ns increments Feedback Unchanged Deskew feedback by advancing clock by system delay GLB Fixed delay of -2.95 ns Internal Feedback Internal Feedback and Advance Clock Using FBDLY External Feedback (EXTFB) –0.25 to –4 ns in 0.25 ns increments Clock-Conditioning Circuitry MUX Settings Datapath Comments v5.7 1-15 ProASICPLUS Flash Family FPGAs Table 1-8 • Delay Line DLYB 0 1 2 3 DLYA 0 1 2 3 Clock-Conditioning Circuitry Delay-Line Settings Delay Value (ns) Sample Implementations Frequency Synthesis Figure 1-16 on page 1-17 illustrates an example where the PLL is used to multiply a 33 MHz external clock up to 133 MHz. Figure 1-17 on page 1-17 uses two dividers to synthesize a 50 MHz output clock from a 40 MHz input reference clock. The input frequency of 40 MHz is multiplied by five and divided by four, giving an output clock (GLB) frequency of 50 MHz. When dividers are used, a given ratio can be generated in multiple ways, allowing the user to stay within the operating frequency ranges of the PLL. For example, in this case the input divider could have been two and the output divider also two, giving us a division of the input frequency by four to go with the feedback loop division (effective multiplication) by five. 0 +0.25 +0.50 +4.0 0 +0.25 +0.50 +4.0 Lock Signal An active-high Lock signal (added via the SmartGen PLL development tool) indicates that the PLL has locked to the incoming clock signal. The PLL will acquire and maintain lock even when there is jitter on the incoming clock signal. The PLL will maintain lock with an input jitter up to 5% of the input period, with a maximum of 5 ns. Users can employ the Lock signal as a soft reset of the logic driven by GLB and/or GLA. Note if FIN is not within specified frequencies, then both the FOUT and lock signal are indeterminate. Adjustable Clock Delay Figure 1-18 on page 1-18 illustrates the delay of the input clock by employing one of the adjustable delay lines. This is easily done in ProASICPLUS by bypassing the PLL core entirely and using the output delay line. Notice also that the output clock can be effectively advanced relative to the input clock by using the delay line in the feedback path. This is shown in Figure 1-19 on page 1-18. PLL Configuration Options The PLL can be configured during design (via Flashconfiguration bits set in the programming bitstream) or dynamically during device operation, thus eliminating the need to reprogram the device. The dynamic configuration bits are loaded into a serial-in/parallel-out shift register provided in the clock conditioning circuit. The shift register can be accessed either from user logic within the device or via the JTAG port. Another option is internal dynamic configuration via user-designed hardware. Refer to Actel's ProASICPLUS PLL Dynamic Reconfiguration Using JTAG application note for more information. For information on the clock conditioning circuit, refer to Actel’s Using ProASICPLUS Clock Conditioning Circuits application note. Clock Skew Minimization Figure 1-20 on page 1-19 indicates how feedback from the clock network can be used to create minimal skew between the distributed clock network and the input clock. The input clock is fed to the reference clock input of the PLL. The output clock (GLA) feeds a clock network. The feedback input to the PLL uses a clock input delayed by a routing network. The PLL then adjusts the phase of the input clock to match the delayed clock, thus providing nearly zero effective skew between the two clocks. Refer to Actel's Using ProASICPLUS Clock Conditioning Circuits application note for more information. 1 -1 6 v5.7 ProASICPLUS Flash Family FPGAs Global MUX B OUT 33 MHz ÷1 ÷n PLL Core ÷m ÷4 180˚ 0˚ ÷u ÷1 D 133 MHz GLB D D External Feedback ÷v Global MUX A OUT D GLA Figure 1-16 • Using the PLL 33 MHz In, 133 MHz Out Global MUX B OUT 40 MHz ÷4 ÷n PLL Core ÷m ÷5 180˚ 0˚ ÷u ÷1 GLB D 50 MHz D D External Feedback ÷v Global MUX A OUT D GLA Figure 1-17 • Using the PLL 40 MHz In, 50 MHz Out v5.7 1-17 ProASICPLUS Flash Family FPGAs Global MUX B OUT 133 MHz ÷1 ÷n PLL Core ÷m ÷1 180˚ 0˚ ÷u ÷1 D 133 MHz GLB D D External Feedback ÷v Global MUX A OUT D GLA Figure 1-18 • Using the PLL to Delay the Input Clock Global MUX B OUT 133 MHz ÷1 ÷n PLL Core ÷m ÷1 180˚ 0˚ ÷u ÷1 GLB D 133 MHz D D External Feedback ÷v Global MUX A OUT D GLA Figure 1-19 • Using the PLL to Advance the Input Clock 1 -1 8 v5.7 ProASICPLUS Flash Family FPGAs Off chip On chip Global MUX B OUT /1 ÷n 180˚ 133 MHz ÷m PLL Core 0˚ ÷u D GL B /1 D External Feedback D 133 MHz ÷v D GL A Global MUX A OUT Reference clock Q SET D Q CLR Figure 1-20 • Using the PLL for Clock Deskewing v5.7 1-19 ProASICPLUS Flash Family FPGAs Logic Tile Timing Characteristics Timing characteristics for devices fall into three categories: family dependent, device dependent, and design dependent. The input and output buffer characteristics are common to all ProASICPLUS family members. Internal routing delays are device dependent. Design dependency means that actual delays are not determined until after placement and routing of the user’s design are complete. Delay values may then be determined by using the Timer utility or by performing simulation with post-layout delays. ProASICPLUS Timing Derating Since ProASICPLUS devices are manufactured with a CMOS process, device performance will vary with temperature, voltage, and process. Minimum timing parameters reflect maximum operating voltage, minimum operating temperature, and optimal process variations. Maximum timing parameters reflect minimum operating voltage, maximum operating temperature, and worst-case process variations (within process specifications). The derating factors shown in Table 1-9 should be applied to all timing data contained within this datasheet. All timing numbers listed in this datasheet represent sample timing characteristics of ProASICPLUS devices. Actual timing delay values are design-specific and can be derived from the Timer tool in Actel’s Designer software after place-and-route. Critical Nets and Typical Nets Propagation delays are expressed only for typical nets, which are used for initial design performance evaluation. Critical net delays can then be applied to the most timing-critical paths. Critical nets are determined by net property assignment prior to place-and-route. Refer to the Actel Designer User’s Guide or online help for details on using constraints. Table 1-9 • Temperature and Voltage Derating Factors (Normalized to Worst-Case Commercial, TJ = 70°C, VDD = 2.3 V) –55°C –40°C 0.86 0.82 0.79 0°C 0.91 0.87 0.83 25°C 0.94 0.90 0.86 70°C 1.00 0.95 0.91 85°C 1.02 0.98 0.93 110°C 1.05 1.01 0.96 125°C 1.13 1.09 1.04 135°C 1.18 1.13 1.08 150°C 1.27 1.21 1.16 2.3 V 2.5 V 2.7 V Notes: 0.84 0.81 0.77 1. The user can set the junction temperature in Designer software to be any integer value in the range of –55°C to 175°C. 2. The user can set the core voltage in Designer software to be any value between 1.4 V and 1.6 V. 1 -2 0 v5.7 ProASICPLUS Flash Family FPGAs PLL Electrical Specifications Parameter Frequency Ranges Reference Frequency fIN (min.) Reference Frequency fIN (max.) OSC Frequency fVCO (min.) OSC Frequency fVCO (max.) Clock Conditioning Circuitry fOUT (min.) Clock Conditioning Circuitry fOUT (max.) Long Term Jitter Peak-to-Peak Max.* Temperature fVCO 40 MHz ±1.5% ±2.5% ±2.5% ±2.5% ±3.5% ±3.5% ±1% ±1% ±1% 1.5 MHz 180 MHz 24 MHz 180 MHz 6 MHz 180 MHz Clock conditioning circuitry (min.) lowest input frequency Clock conditioning circuitry (max.) highest input frequency Lowest output frequency voltage controlled oscillator Highest output frequency voltage controlled oscillator Lowest output frequency clock conditioning circuitry Highest output frequency clock conditioning circuitry Value Notes v5.7 1-21 ProASICPLUS Flash Family FPGAs ® User Security devices have FlashLock protection bits that, once programmed, block the entire programmed contents from being read externally. Please refer to Table 1-10 for details on the number of bits in the key for each device. If locked, the user can only reprogram the device employing the user-defined security key. This protects the device from being read back and duplicated. Since programmed data is stored in nonvolatile memory cells (actually very small capacitors) rather than in the wiring, physical deconstruction cannot be used to compromise data. This type of security breach is further discouraged by the placement of the memory cells beneath the four metal layers (whose removal cannot be accomplished without disturbing the charge in the capacitor). This is the highest security provided in the industry. For more information, refer to Actel’s Design Security in Nonvolatile Flash and Antifuse FPGAs white paper. Table 1-10 • Flashlock Key Size by Device Device APA075 APA150 APA300 APA450 APA600 APA750 APA1000 Key Size 79 bits 79 bits 79 bits 119 bits 167 bits 191 bits 263 bits Embedded Memory Configurations The embedded memory in the ProASICPLUS family provides great configuration flexibility (Table 1-11). Each ProASICPLUS block is designed and optimized as a twoport memory (one read, one write). This provides 198 kbits of two-port and/or single port memory in the APA1000 device. Each memory block can be configured as FIFO or SRAM, with independent selection of synchronous or asynchronous read and write ports (Table 1-12). Additional characteristics include programmable flags as well as parity checking and generation. Figure 1-21 on page 1-24 and Figure 1-22 on page 1-25 show the block diagrams of the basic SRAM and FIFO blocks. Table 1-13 on page 1-24 and Table 1-14 on page 1-25 describe memory block SRAM and FIFO interface signals, respectively. A single memory block is designed to operate at up to 150 MHz (standard speed grade typical conditions). Each block is comprised of 256 9-bit words (one read port, one write port). The memory blocks may be cascaded in width and/or depth to create the desired memory organization. (Figure 1-23 on page 1-26). This provides optimal bit widths of 9 (one block), 18, 36, and 72, and optimal depths of 256, 512, 768, and 1,024. Refer to Actel’s SmartGen User’s Guide for more information. Figure 1-24 on page 1-26 gives an example of optimal memory usage. Ten blocks with 23,040 bits have been used to generate three arrays of various widths and depths. Figure 1-25 on page 1-26 shows how RAM blocks can be used in parallel to create extra read ports. In this example, using only 10 of the 88 available blocks of the APA1000 yields an effective 6,912 bits of multiple port RAM. The Actel SmartGen software facilitates building wider and deeper memory configurations for optimal memory usage. ProASICPLUS Embedded Memory Floorplan The embedded memory is located across the top and bottom of the device in 256x9 blocks (Figure 1-1 on page 1-2). Depending on the device, up to 88 blocks are available to support a variety of memory configurations. Each block can be programmed as an independent memory array or combined (using dedicated memory routing resources) to form larger, more complex memory configurations. A single memory configuration could include blocks from both the top and bottom memory locations. Table 1-11 • ProASICPLUS Memory Configurations by Device Maximum Width Device APA075 APA150 APA300 APA450 APA600 APA750 APA1000 Bottom 0 0 16 24 28 32 44 Top 12 16 16 24 28 32 44 D 256 256 256 256 256 256 256 W 108 144 144 216 252 288 396 Maximum Depth D 1,536 2,048 2,048 3,072 3,584 4,096 5,632 W 9 9 9 9 9 9 9 1 -2 2 v5.7 ProASICPLUS Flash Family FPGAs Table 1-12 • Basic Memory Configurations Type RAM RAM RAM RAM RAM RAM RAM RAM RAM RAM RAM RAM FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO FIFO Write Access Asynchronous Asynchronous Asynchronous Asynchronous Asynchronous Asynchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Asynchronous Asynchronous Asynchronous Asynchronous Asynchronous Asynchronous Synchronous Synchronous Synchronous Synchronous Synchronous Synchronous Read Access Asynchronous Asynchronous Synchronous Transparent Synchronous Transparent Synchronous Pipelined Synchronous Pipelined Asynchronous Asynchronous Synchronous Transparent Synchronous Transparent Synchronous Pipelined Synchronous Pipelined Asynchronous Asynchronous Synchronous Transparent Synchronous Transparent Synchronous Pipelined Synchronous Pipelined Asynchronous Asynchronous Synchronous Transparent Synchronous Transparent Synchronous Pipelined Synchronous Pipelined Parity Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Checked Generated Library Cell Name RAM256x9AA RAM256x9AAP RAM256x9AST RAM256x9ASTP RAM256x9ASR RAM256x9ASRP RAM256x9SA RAM256xSAP RAM256x9SST RAM256x9SSTP RAM256x9SSR RAM256x9SSRP FIFO256x9AA FIFO256x9AAP FIFO256x9AST FIFO256x9ASTP FIFO256x9ASR FIFO256x9ASRP FIFO256x9SA FIFO256x9SAP FIFO256x9SST FIFO256x9SSTP FIFO256x9SSR FIFO256x9SSRP v5.7 1-23 ProASICPLUS Flash Family FPGAs DI WADDR WRB WBLKB WCLKS WPE SRAM (256x9) Sync Write and Sync Read Ports DO RADDR RDB RBLKB RCLKS RPE DI WADDR WRB WBLKB WPE SRAM (256x9) Async Write and Async Read Ports DO RADDR RDB RBLKB RCLKS RPE PARODD DI WADDR WRB WBLKB WCLKS WPE DO RADDR RDB RBLKB DI WADDR WRB WBLKB PARODD DO RADDR RDB RBLKB RCLKS RPE SRAM (256x9) Sync Write and Async Read Ports SRAM (256x9) Async Write and Sync Read Ports RPE WPE PARODD PARODD Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when RAM blocks are cascaded and are automatically inserted by the software tools. Figure 1-21 • Example SRAM Block Diagrams Table 1-13 • Memory Block SRAM Interface Signals SRAM Signal WCLKS RCLKS RADDR RBLKB RDB WADDR WBLKB DI WRB DO RPE WPE PARODD Bits 1 1 8 1 1 8 1 9 1 9 1 1 1 In/Out In In In In In In In In In Out Out Out In Description Write clock used on synchronization on write side Read clock used on synchronization on read side Read address Read block select (active Low) Read pulse (active Low) Write address Write block select (active Low) Input data bits , can be used for parity In Write pulse (active Low) Output data bits , can be used for parity Out Read parity error (active High) Write parity error (active High) Selects Odd parity generation/detect when High, Even parity when Low Note: Not all signals shown are used in all modes. 1 -2 4 v5.7 ProASICPLUS Flash Family FPGAs DI LEVEL LGDEP WRB WBLKB RDB RBLKB PARODD WCLKS DO FIFO (256x9) Sync Write and Sync Read Ports WPE RPE FULL EMPTY EQTH GEQTH RESET RCLKS DI LEVEL LGDEP WRB WBLKB RDB RBLKB PARODD WCLKS FIFO (256x9) Sync Write and Async Read Ports DO WPE RPE FULL EMPTY EQTH GEQTH RESET DI LEVEL LGDEP WRB WBLKB RDB RBLKB PARODD DO FIFO (256x9) WPE RPE FULL EMPTY EQTH GEQTH RESET RCLKS DI LEVEL LGDEP WRB WBLKB DO FIFO (256x9) WPE Async Write and Async Read Ports RPE FULL EMPTY EQTH GEQTH RESET Async Write and Sync Read Ports RDB RBLKB PARODD Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when RAM blocks are cascaded and are automatically inserted by the software tools. Figure 1-22 • Basic FIFO Block Diagrams Table 1-14 • Memory Block FIFO Interface Signals FIFO Signal WCLKS RCLKS LEVEL RBLKB RDB RESET WBLKB DI WRB FULL, EMPTY EQTH, GEQTH DO RPE WPE LGDEP PARODD Bits 1 1 8 1 1 1 1 9 1 2 2 9 1 1 3 1 In/Out In In In In In In In In In Out Out Out Out Out In In Description Write clock used for synchronization on write side Read clock used for synchronization on read side Direct configuration implements static flag logic Read block select (active Low) Read pulse (active Low) Reset for FIFO pointers (active Low) Write block select (active Low) Input data bits , will be generated parity if PARGEN is true Write pulse (active Low) FIFO flags. FULL prevents write and EMPTY prevents read EQTH is true when the FIFO holds the number of words specified by the LEVEL signal. GEQTH is true when the FIFO holds (LEVEL) words or more Output data bits . will be parity output if PARGEN is true. Read parity error (active High) Write parity error (active High) Configures DEPTH of the FIFO to 2 (LGDEP+1) Parity generation/detect – Even when Low, Odd when High v5.7 1-25 ProASICPLUS Flash Family FPGAs Word Width 9 9 9 9 9 9 Word Depth 256 256 88 blocks 256 256 256 9 256 256 9 9 256 256 Figure 1-23 • APA1000 Memory Block Architecture Word Width 9 Word Depth 256 9 9 9 9 256 256 256 256 256 words x 18 bits, 1 read, 1 write 256 256 256 256 512 words x 18 bits, 1 read, 1 write 256 1,024 words x 9 bits, 1 read, 1 write Total Memory Blocks Used = 10 Total Memory Bits = 23,040 Figure 1-24 • Example Showing Memory Arrays with Different Widths and Depths Word Width 9 Word Depth 9 9 9 9 9 Write Port 9 9 9 Write Port 256 256 256 256 256 256 Read Ports 256 words x 9 bits, 2 read, 1 write 256 256 256 256 Read Ports 512 words x 9 bits, 4 read, 1 write Total Memory Blocks Used = 10 Total Memory Bits = 6,912 Figure 1-25 • Multi-Port Memory Usage 1 -2 6 v5.7 ProASICPLUS Flash Family FPGAs Design Environment The ProASICPLUS family of FPGAs is fully supported by both Actel's Libero® Integrated Design Environment (IDE) and Designer FPGA Development software. Actel Libero IDE is an integrated design manager that seamlessly integrates design tools while guiding the user through the design flow, managing all design and log files, and passing necessary design data among tools. Additionally, Libero IDE allows users to integrate both schematic and HDL synthesis into a single flow and verify the entire design in a single environment (see Actel’s website for more information about Libero IDE). Libero IDE includes Synplify® AE from Synplicity®, ViewDraw® AE from Mentor Graphics®, ModelSim® HDL Simulator from Mentor Graphics, WaveFormer Lite™ AE from SynaptiCAD®, PALACE™ AE Physical Synthesis from Magma, and Designer software from Actel. PALACE is an effective tool when designing with ProASICPLUS. PALACE AE Physical Synthesis from Magma takes an EDIF netlist and optimizes the performance of ProASICPLUS devices through a physical placement-driven process, ensuring that timing closure is easily achieved. Actel's Designer software is a place-and-route tool that provides a comprehensive suite of back-end support tools for FPGA development. The Designer software includes the following: • Timer – a world-class integrated static timing analyzer and constraints editor that support timing-driven place-and-route NetlistViewer – a design netlist schematic viewer ChipPlanner – a graphical floorplanner viewer and editor SmartPower – allows the designer to quickly estimate the power consumption of a design PinEditor – a graphical application for editing pin assignments and I/O attributes I/O Attribute Editor – displays all assigned and unassigned I/O macros and their attributes in a spreadsheet format With the Designer software, a user can lock the design pins before layout while minimally impacting the results of place-and-route. Additionally, Actel’s back-annotation flow is compatible with all the major simulators. Another tool included in the Designer software is the SmartGen macro builder, which easily creates popular and commonly used logic functions for implementation into your schematic or HDL design. Actel's Designer software is compatible with the most popular FPGA design entry and verification tools from EDA vendors, such as Mentor Graphics, Synplicity, Synopsys, and Cadence Design Systems. The Designer software is available for both the Windows and UNIX operating systems. ISP The user can generate *.bit or *.stp programming files from the Designer software and can use these files to program a device. ProASICPLUS devices can be programmed in-system. For more information on ISP of ProASICPLUS devices, refer to the In-System Programming ProASICPLUS Devices and Performing Internal In-System Programming Using Actel’s ProASICPLUS Devices application notes. Prior to being programmed for the first time, the ProASICPLUS device I/Os are in a tristate condition with the pull-up resistor option enabled. • • • • • v5.7 1-27 ProASICPLUS Flash Family FPGAs Related Documents Application Notes Efficient Use of ProASIC Clock Trees http://www.actel.com/documents/A500K_Clocktree_AN.pdf I/O Features in ProASICPLUS Flash FPGAs http://www.actel.com/documents/APA_LVPECL_AN.pdf Power-Up Behavior of ProASICPLUS Devices http://www.actel.com/documents/APA_PowerUp_AN.pdf ProASICPLUS PLL Dynamic Reconfiguration Using JTAG http://www.actel.com/documents/APA_PLLdynamic_AN.pdf Using ProASICPLUS Clock Conditioning Circuits http://www.actel.com/documents/APA_PLL_AN.pdf In-System Programming ProASICPLUS Devices http://www.actel.com/documents/APA_External_ISP_AN.pdf Performing Internal In-System Programming Using Actel’s ProASICPLUS Devices http://www.actel.com/documents/APA_Microprocessor_AN.pdf ProASICPLUS RAM and FIFO Blocks http://www.actel.com/documents/APA_RAM_FIFO_AN.pdf White Paper Design Security in Nonvolatile Flash and Antifuse FPGAs http://www.actel.com/documents/DesignSecurity_WP.pdf User’s Guide Designer User’s Guide http://www.actel.com/documents/designer_UG.pdf SmartGen Cores Reference Guide http://www.actel.com/documents/gen_refguide_ug.pdf ProASIC and ProASICPLUS Macro Library Guide http://www.actel.com/documents/pa_libguide_UG.pdf Additional Information The following link contains additional information on ProASICPLUS devices. http://www.actel.com/products/proasicplus/default.aspx 1 -2 8 v5.7 ProASICPLUS Flash Family FPGAs Package Thermal Characteristics The ProASICPLUS family is available in several package types with a range of pin counts. Actel has selected packages based on high pin count, reliability factors, and superior thermal characteristics. Thermal resistance defines the ability of a package to conduct heat away from the silicon, through the package to the surrounding air. Junction-to-ambient thermal resistance is measured in degrees Celsius/Watt and is represented as Theta ja (Θja). The lower the thermal resistance, the more efficiently a package will dissipate heat. A package’s maximum allowed power (P) is a function of maximum junction temperature (TJ), maximum ambient operating temperature (TA), and junction-to-ambient thermal resistance Θja. Maximum junction temperature is the maximum allowable temperature on the active surface of the IC and is 110° C. P is defined as: T J – TA P = -----------------Θja EQ 1-4 Θja is a function of the rate (in linear feet per minute (lfpm)) of airflow in contact with the package. When the estimated power consumption exceeds the maximum allowed power, other means of cooling, such as increasing the airflow rate, must be used. The maximum power dissipation allowed for a Military temperature device is specified as a function of Θjc. The absolute maximum junction temperature is 150°C. The calculation of the absolute maximum power dissipation allowed for a Military temperature application is illustrated in the following example for a 456-pin PBGA package: Max. junction temp. ( ° C) – Max. case temp. ( ° C) 150 ° C – 125 ° C Maximum Power Allowed = ------------------------------------------------------------------------------------------------------------------------ = ------------------------------------- = 8.333W 3.0 ° C/W θ jc ( ° C/W) EQ 1-5 Table 1-15 • Package Thermal Characteristics θja Plastic Packages Thin Quad Flat Pack (TQFP) Thin Quad Flat Pack (TQFP) Plastic Quad Flat Pack (PQFP) PQFP with Heat spreader 2 1 Pin Count 100 144 208 208 456 144 256 484 484 676 896 1152 208 352 624 θjc 14.0 11.0 8.0 3.8 3.0 3.8 3.8 3.2 3.2 3.2 2.4 1.8 2.0 2.0 6.5 Still Air 33.5 33.5 26.1 16.2 15.6 26.9 26.6 18.0 20.5 16.4 13.6 12.0 22.0 17.9 8.9 1.0 m/s 200 ft./min. 27.4 28.0 22.5 13.3 12.5 22.9 22.8 14.7 17.0 13.0 10.4 8.9 19.8 16.1 8.5 2.5 m/s 500 ft./min. 25.0 25.7 20.8 11.9 11.6 21.5 21.5 13.6 15.9 12.0 9.4 7.9 18.0 14.7 8.0 Units °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W Plastic Ball Grid Array (PBGA) Fine Pitch Ball Grid Array (FBGA) Fine Pitch Ball Grid Array (FBGA) Fine Pitch Ball Grid Array (FBGA)3 Fine Pitch Ball Grid Array (FBGA)4 Fine Pitch Ball Grid Array (FBGA) Fine Pitch Ball Grid Array (FBGA) Fine Pitch Ball Grid Array (FBGA) Ceramic Quad Flat Pack (CQFP) Ceramic Quad Flat Pack (CQFP) Ceramic Column Grid Array (CCGA/LGA) Notes: 1. 2. 3. 4. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300 Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000 Depopulated Array Full array v5.7 1-29 ProASICPLUS Flash Family FPGAs Calculating Typical Power Dissipation ProASICPLUS device power is calculated with both a static and an active component. The active component is a function of both the number of tiles utilized and the system speed. Power dissipation can be calculated using the following formula: Total Power Consumption—Ptotal Ptotal = Pdc + Pac where: Pdc = 7 mW for the APA075 8 mW for the APA150 11 mW for the APA300 12 mW for the APA450 12 mW for the APA600 13 mW for the APA750 19 mW for the APA1000 Pdc includes the static components of PVDDP + PVDD + PAVDD Pac = Pclock + Pstorage + Plogic + Poutputs + Pinputs + Ppll + Pmemory Global Clock Contribution—Pclock Pclock, the clock component of power dissipation, is given by the piece-wise model: for R < 15000 the model is: (P1 + (P2*R) - (P7*R2)) * Fs (lightly-loaded clock trees) for R > 15000 the model is: (P10 + P11*R) * Fs (heavily-loaded clock trees) where: P1 P2 P7 P10 P11 R Fs = 100 µW/MHz is the basic power consumption of the clock tree per MHz of the clock = 1.3 µW/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of the clock = 0.00003 µW/MHz is a correction factor for partially-loaded clock trees = 6850 µW/MHz is the basic power consumption of the clock tree per MHz of the clock = 0.4 µW/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of the clock = the number of storage tiles clocked by this clock = the clock frequency Storage-Tile Contribution—Pstorage Pstorage, the storage-tile (Register) component of AC power dissipation, is given by Pstorage = P5 * ms * Fs where: P5 ms Fs = = = 1.1 μW/MHz is the average power consumption of a storage tile per MHz of its output toggling rate. The maximum output toggling rate is Fs/2. the number of storage tiles (Register) switching during each Fs cycle the clock frequency 1 -3 0 v5.7 ProASICPLUS Flash Family FPGAs Logic-Tile Contribution—Plogic Plogic, the logic-tile component of AC power dissipation, is given by Plogic = P3 * mc * Fs where: P3 mc Fs = = = 1.4 μW/MHz is the average power consumption of a logic tile per MHz of its output toggling rate. The maximum output toggling rate is Fs/2. the number of logic tiles switching during each Fs cycle the clock frequency I/O Output Buffer Contribution—Poutputs Poutputs, the I/O component of AC power dissipation, is given by Poutputs = (P4 + (Cload * VDDP2)) * p * Fp where: P4 = 326 μW/MHz is the intrinsic power consumption of an output pad normalized per MHz of the output frequency. This is the total I/O current VDDP. the output load the number of outputs the average output frequency Cload = p = Fp = I/O Input Buffer's Buffer Contribution—Pinputs The input’s component of AC power dissipation is given by Pinputs = P8 * q * Fq where: P8 q Fq = = = 29 μW/MHz is the intrinsic power consumption of an input pad normalized per MHz of the input frequency. the number of inputs the average input frequency PLL Contribution—Ppll Ppll = P9 * Npll where: P9 NPll = = 7.5 mW. This value has been estimated at maximum PLL clock frequency. number of PLLs used RAM Contribution—Pmemory Finally, Pmemory, the memory component of AC power consumption, is given by Pmemory = P6 * Nmemory * Fmemory * Ememory where: P6 Nmemory Fmemory Ememory = = = = 175 μW/MHz is the average power consumption of a memory block per MHz of the clock the number of RAM/FIFO blocks (1 block = 256 words * 9 bits) the clock frequency of the memory the average number of active blocks divided by the total number of blocks (N) of the memory. • • Typical values for Ememory would be 1/4 for a 1k x 8,9,16, 32 memory and 1/16 for a 4kx8, 9, 16, and 32 memory configuration In addition, an application-dependent component to Ememory can be considered. For example, for a 1kx8 memory configuration using only 1 cycle out of 2, Ememory = 1/4*1/2 = 1/8 v5.7 1-31 ProASICPLUS Flash Family FPGAs The following is an APA750 example using a shift register design with 13,440 storage tiles (Register) and 0 logic tiles. This design has one clock at 10 MHz, and 24 outputs toggling at 5 MHz. We then calculate the various components as follows: Pclock Fs R => = 10 MHz = 13,440 Pclock = (P1 + (P2*R) - (P7*R2)) * Fs = 121.5 mW ms = 13,440 (in a shift register 100% of storage tiles are toggling at each clock cycle and Fs = 10 MHz) Pstorage => Pstorage = P5 * ms * Fs = 147.8 mW mc => = 0 (no logic tiles in this shift register) Plogic Plogic = 0 mW Cload VDDP p Fp => = = = = 40 pF 3.3 V 24 5 MHz Poutputs Poutputs = (P4 + (Cload * VDDP2)) * p * Fp = 91.4 mW q Fq = = 1 10 MHz Pinputs => Pinputs = P8 * q * Fq = 0.3 mW Nmemory = 0 (no RAM/FIFO blocks in this shift register) Pmemory => Pac => 361 mW Ptotal Pdc + Pac = 374 mW (typical) Pmemory = 0 mW 1 -3 2 v5.7 ProASICPLUS Flash Family FPGAs Operating Conditions Standard and –F parts are the same unless otherwise noted. All –F parts are only available as commercial. Table 1-16 • Absolute Maximum Ratings* Parameter Supply Voltage Core (VDD) Supply Voltage I/O Ring (VDDP) DC Input Voltage PCI DC Input Voltage PCI DC Input Clamp Current (absolute) LVPECL Input Voltage GND VIN < –1 or VIN = VDDP + 1 V Condition Minimum –0.3 –0.3 –0.3 –1.0 10 –0.3 0 VDDP + 0.5 0 Maximum 3.0 4.0 VDDP + 0.3 VDDP + 1.0 Units V V V V mA V V Note: *Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the Recommended Operating Conditions. Table 1-17 • Programming, Storage, and Operating Limits Storage Temperature Operating TJ Max. Junction Temperature 110°C 110°C 150°C 150°C Product Grade Commercial Industrial Military MIL-STD-883 Programming Cycles (min.) 500 500 100 100 Program Retention (min.) 20 years 20 years Refer to Table 1-18 on page 1-34 Refer to Table 1-18 on page 1-34 Min. –55°C –55°C –65°C –65°C Max. 110°C 110°C 150°C 150°C Performance Retention For devices operated and stored at 110°C or less, the performance retention period is 20 years after programming. For devices operated and stored at temperatures greater than 110°C, refer to Table 1-18 on page 1-34 to determine the performance retention period. Actel does not guarantee performance if the performance retention period is exceeded. Designers can determine the performance retention period from the following table. Evaluate the percentage of time spent at the highest temperature, then determine the next highest temperature to which the device will be exposed. In Table 1-18 on page 1-34, find the temperature profile that most closely matches the application. Example – the ambient temperature of a system cycles between 100°C (25% of the time) and 50°C (75% of the time). No forced ventilation cooling system is in use. An APA600-PQ208M FPGA operates in the system, dissipating 1 W. The package thermal resistance (junction-to-ambient) in still air Θja is 20°C/W, indicating that the junction temperature of the FPGA will be 120°C (25% of the time) and 70°C (75% of the time). The entry in Table 1-18 on page 1-34, which most closely matches the application, is 25% at 125°C with 75% at 110°C. Performance retention in this example is at least 16.0 years. Note that exceeding the stated retention period may result in a performance degradation in the FPGA below the worst-case performance indicated in the Actel Timer. To ensure that performance does not degrade below the worst-case values in the Actel Timer, the FPGA must be reprogrammed within the performance retention period. In addition, note that performance retention is independent of whether or not the FPGA is operating. The retention period of a device in storage at a given temperature will be the same as the retention period of a device operating at that junction temperature. v5.7 1-33 ProASICPLUS Flash Family FPGAs Table 1-18 • Military Temperature Grade Product Performance Retention Minimum Time at TJ 110°C or below 100% 90% 75% 90% 50% 90% 75% 100% 90% 50% 75% 90% 75% 50% 75% 100% 90% 50% 50% 75% 50% 10% 50% 50% 25% 50% 100% 50% 25% 10% 50% 25% 10% 25% 25% 50% 10% 10% 25% 10% Minimum Time at TJ 125°C or below Minimum Time at TJ 135°C or below Minimum Time at TJ 150°C or below Minimum Performance Retention (Years) 20.0 18.2 16 15.4 13.3 11.8 11.4 10 9.1 8 8 7.7 7.3 6.7 5.7 5 4.5 4.4 4 4 3.3 2.5 1 -3 4 v5.7 ProASICPLUS Flash Family FPGAs Table 1-19 • Recommended Maximum Operating Conditions Programming and PLL Supplies Commercial/Industrial/Military/MIL-STD-883 Parameter VPP VPN IPP IPN AVDD AGND Condition During Programming Normal Operation Normal Operation 1 Minimum 15.8 0 –13.8 –13.8 Maximum 16.5 16.5 –13.2 0.5 25 10 Units V V V V mA mA V V During Programming 2 During Programming During Programming VDD GND VDD GND Notes: 1. Please refer to the "VPP Programming Supply Pin" section on page 1-74 for more information. 2. Please refer to the "VPN Programming Supply Pin" section on page 1-74 for more information. Table 1-20 • Recommended Operating Conditions Limits Parameter DC Supply Voltage (2.5 V I/Os) DC Supply Voltage (3.3 V I/Os) Operating Ambient Temperature Range Maximum Operating Junction Temperature Symbol VDD and VDDP VDDP VDD TA, TC TJ Commercial 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2.5 V ± 0.2 V 0°C to 70°C 110°C Industrial 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2.5 V ± 0.2 V –40°C to 85°C 110°C Military/MIL-STD-883 2.5 V ± 0.2 V 3.3 V ± 0.3 V 2.5 V ± 0.2 V –55°C (TA) to 125°C (TC) 150°C Note: For I/O long-term reliability, external pull-up resistors cannot be used to increase output voltage above VDDP. v5.7 1-35 ProASICPLUS Flash Family FPGAs Table 1-21 • DC Electrical Specifications (VDDP = 2.5 V ±0.2V) Commercial/Industrial/ Military/MIL-STD-8831, 2 Symbol VOH Parameter Output High Voltage High Drive (OB25LPH) IOH = –6 mA IOH = –12 mA IOH = –24 mA IOH = –3 mA IOH = –6 mA IOH = –8 mA IOL = 8 mA IOL = 15 mA IOL = 24 mA IOL = 4 mA IOL = 8 mA IOL = 15 mA 1.7 –0.3 VIN ≥ 1.25 V See Table 1-4 on page 1-9 with pull up (VIN = GND) without pull up (VIN = GND or VDD) IDDQ Quiescent Supply Current (standby) Commercial Quiescent Supply Current (standby) Industrial Quiescent Supply Current (standby) Military/MIL-STD-883 VIN = GND4 or VDD Std. –F3 VIN = GND4 or VDD Std. 5.0 VIN = GND4 or VDD Std. 5.0 Std. –F3, 5 Notes: 1. 2. 3. 4. 5. 6. 7. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C. All process conditions. Military: Junction Temperature: –55 to +150°C. All –F parts are available only as commercial. No pull-up resistor. This will not exceed 2 mA total per device. During transitions, the input signal may overshoot to VDDP +1.0V for a limited time of no larger than 10% of the duty cycle. During transitions, the input signal may undershoot to -1.0V for a limited time of no larger than 10% of the duty cycle. –10 –10 25 10 100 mA µA µA 20 mA 6 0.3 –240 –10 5.0 5.0 0.35 2.1 2.0 1.7 2.1 1.9 1.7 0.2 0.4 0.7 0.2 0.4 0.7 VDDP + 0.3 0.7 56 0.45 – 20 10 15 25 V V kΩ V µA µA mA mA Conditions Min. Typ. Max. Units V Low Drive (OB25LPL) VOL Output Low Voltage High Drive (OB25LPH) V Low Drive (OB25LPL) VIH6 VIL7 Input High Voltage Input Low Voltage RWEAKPULLUP Weak Pull-up Resistance (OTB25LPU) HYST IIN Input Hysteresis Schmitt Input Current IDDQ IDDQ IOZ Tristate Output Leakage Current VOH = GND or VDD 1 -3 6 v5.7 ProASICPLUS Flash Family FPGAs Table 1-21 • DC Electrical Specifications (VDDP = 2.5 V ±0.2V) (Continued) Commercial/Industrial/ Military/MIL-STD-8831, 2 Symbol IOSH Parameter Conditions Min. –120 –100 mA 100 30 10 10 pF pF Typ. Max. Units mA Output Short Circuit Current High High Drive (OB25LPH) VIN = VSS VIN = VSS Low Drive (OB25LPL) Output Short Circuit Current Low High Drive (OB25LPH) VIN = VDDP VIN = VDDP Low Drive (OB25LPL) I/O Pad Capacitance Clock Input Pad Capacitance IOSL CI/O CCLK Notes: 1. 2. 3. 4. 5. 6. 7. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C. All process conditions. Military: Junction Temperature: –55 to +150°C. All –F parts are available only as commercial. No pull-up resistor. This will not exceed 2 mA total per device. During transitions, the input signal may overshoot to VDDP +1.0V for a limited time of no larger than 10% of the duty cycle. During transitions, the input signal may undershoot to -1.0V for a limited time of no larger than 10% of the duty cycle. v5.7 1-37 ProASICPLUS Flash Family FPGAs Table 1-22 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) Commercial/Industrial/ Military/MIL-STD-8831, 2 Symbol VOH Parameter Output High Voltage 3.3 V I/O, High Drive (OB33P) Conditions IOH = –14 mA IOH = –24 mA IOH = –6 mA IOH = –12 mA IOL = 15 mA IOL = 20 mA IOL = 28 mA IOL = 7 mA IOL = 10 mA IOL = 15 mA VIH6 Input High Voltage 3.3 V Schmitt Trigger Inputs 3.3 V LVTTL/LVCMOS 2.5 V Mode Input Low Voltage 3.3 V Schmitt Trigger Inputs 3.3 V LVTTL/LVCMOS 2.5 V Mode Resistance VIN ≥ 1.5 V Resistance VIN ≥ 1.5 V with pull up (VIN = GND) without pull up (VIN = GND or VDD) IDDQ Quiescent Supply Current (standby) Commercial Quiescent Supply Current (standby) Industrial Quiescent Supply Current (standby) Military VIN = GND4 or VDD Std. –F3 VIN = GND4 or VDD Std. VIN = GND4 or VDD Std. 5.0 25 mA 5.0 20 mA 1.6 2 1.7 –0.3 –0.3 –0.3 7 7 –300 –10 5.0 5.0 Min. 0.9∗VDDP 2.4 0.9∗VDDP 2.4 0.1VDDP 0.4 0.7 0.1VDDP 0.4 0.7 VDDP + 0.3 VDDP + 0.3 VDDP + 0.3 0.8 0.8 0.7 43 43 –40 10 15 25 Typ. Max. Units V 3.3 V I/O, Low Drive (OB33L) VOL Output Low Voltage 3.3 V I/O, High Drive (OB33P) 3.3 V I/O, Low Drive (OB33L) V V VIL7 V kΩ kΩ µA µA mA mA Pull-up RWEAKPULLUP Weak (IOB33U) RWEAKPULLUP Weak Pull-up (IOB25U) IIN Input Current IDDQ IDDQ Notes: 1. 2. 3. 4. 5. 6. 7. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C. All process conditions. Military: Junction Temperature: –55 to +150°C. All –F parts are only available as commercial. No pull-up resistor required. This will not exceed 2 mA total per device. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle. 1 -3 8 v5.7 ProASICPLUS Flash Family FPGAs Table 1-22 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) (Continued) Commercial/Industrial/ Military/MIL-STD-8831, 2 Symbol IOZ Parameter Tristate Current Output Conditions Leakage VOH = GND or VDD Std. –F3, 5 Min. –10 –10 Typ. Max. 10 100 Units µA µA IOSH Output Short Circuit Current High 3.3 V High Drive (OB33P) VIN = GND 3.3 V Low Drive (OB33L) VIN = GND Output Short Circuit Current Low 3.3 V High Drive VIN = VDD VIN = VDD 3.3 V Low Drive I/O Pad Capacitance Clock Input Pad Capacitance –200 –100 IOSL 200 100 10 10 pF pF CI/O CCLK Notes: 1. 2. 3. 4. 5. 6. 7. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C. All process conditions. Military: Junction Temperature: –55 to +150°C. All –F parts are only available as commercial. No pull-up resistor required. This will not exceed 2 mA total per device. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle. v5.7 1-39 ProASICPLUS Flash Family FPGAs Table 1-23 • DC Specifications (3.3 V PCI Operation)1 Commercial/ Industrial2,3 Symbol VDD VDDP VIH VIL IIPU IIL Parameter Supply Voltage for Core Supply Voltage for I/O Ring Input High Voltage Input Low Voltage Input Pull-up Voltage 4 Military/MIL-STD- 8832,3 Min. 2.3 3.0 0.5VDDP –0.5 0.7VDDP Max. 2.7 3.6 VDDP + 0.5 0.3VDDP Units V V V V V 50 μA μA 0.9VDDP V 0.1VDDP 10 5 12 V pF pF Condition Min. 2.3 3.0 Max. 2.7 3.6 0.5VDDP VDDP + 0.5 –0.5 0.7VDDP 0 < VIN < VDDP Std. –F 3, 6 0.3VDDP Input Leakage Current5 –10 –10 0.9VDDP 10 100 –50 VOH VOL CIN CCLK Notes: 1. 2. 3. 4. Output High Voltage Output Low Voltage Input Pin Capacitance (except CLK) CLK Pin Capacitance IOUT = –500 µA IOUT = 1500 µA 0.1VDDP 10 5 12 For PCI operation, use GL33, OTB33PH, OB33PH, IOB33PH, IB33, or IB33S macro library cell only. All process conditions. Junction Temperature: –40 to +110°C for Commercial and Industrial devices and –55 to +125°C for Military. All –F parts are available as commercial only. This specification is guaranteed by design. It is the minimum voltage to which pull-up resistors are calculated to pull a floated network. Designers with applications sensitive to static power utilization should ensure that the input buffer is conducting minimum current at this input voltage. 5. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs. 6. The sum of the leakage currents for all inputs shall not exceed 2mA per device. 1 -4 0 v5.7 ProASICPLUS Flash Family FPGAs Table 1-24 • AC Specifications (3.3 V PCI Revision 2.2 Operation) Commercial/Industrial/Military/MIL-STD- 883 Symbol Parameter IOH(AC) Switching Current High Condition 0 < VOUT ≤ 0.3VDDP* 0.3VDDP ≤ VOUT < 0.7VDDP < VOUT < 0.9VDDP* VDDP* Min. –12VDDP (–17.1 + (VDDP – VOUT)) See equation C – page 124 of the PCI Specification document rev. 2.2 –32VDDP 16VDDP 1 Max. Units mA mA (Test Point) IOL(AC) Switching Current Low VOUT = 0.7VDDP* VDDP > VOUT ≥ 0.6VDDP* mA mA mA 0.6VDDP > VOUT > 0.1VDDP 0.18VDDP > VOUT > 0* (26.7VOUT) See equation D – page 124 of the PCI Specification document rev. 2.2 38VDDP –25 + (VIN + 1)/0.015 25 + (VIN – VDDP – 1)/0.015 1 1 4 4 (Test Point) ICL ICH slewR slewF Low Clamp Current High Clamp Current Output Rise Slew Rate Output Fall Slew Rate VOUT = 0.18VDDP –3 < VIN ≤ –1 VDDP + 4 > VIN ≥ VDDP + 1 0.2VDDP to 0.6VDDP 0.6VDDP to 0.2VDDP load* load* mA mA mA V/ns V/ns Note: * Refer to the PCI Specification document rev. 2.2. Pad Loading Applicable to the Rising Edge PCI pin 1/2 in. max output buffer 1kΩ 10 pF Pad Loading Applicable to the Falling Edge PCI pin output buffer 1kΩ 10 pF v5.7 1-41 ProASICPLUS Flash Family FPGAs Tristate Buffer Delays EN A OTBx A PAD VOL tDLH 50% 50% VOH 50% tDHL 50% 50% 50% VDDP 50% PAD VOL tENZL EN PAD 35pF EN 10% PAD GND tENZH 50% 50% VOH 50% 90% Figure 1-26 • Tristate Buffer Delays Table 1-25 • Worst-Case Commercial Conditions VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C Max tDLH1 Macro Type OTB33PH OTB33PN OTB33PL OTB33LH OTB33LN OTB33LL Notes: 1. 2. 3. 4. 5. tDLH=Data-to-Pad High tDHL=Data-to-Pad Low tENZH=Enable-to-Pad, Z to High tENZL = Enable-to-Pad, Z to Low All –F parts are only available as commercial. Description 3.3 V, PCI Output Current, High Slew Rate 3.3 V, High Output Current, Nominal Slew Rate 3.3 V, High Output Current, Low Slew Rate 3.3 V, Low Output Current, High Slew Rate 3.3 V, Low Output Current, Nominal Slew Rate 3.3 V, Low Output Current, Low Slew Rate Std. 2.0 2.2 2.5 2.6 2.9 3.0 –F 2.4 2.6 3.0 3.1 3.5 3.6 Max tDHL2 Std. 2.2 2.9 3.2 4.0 4.3 5.6 –F 2.6 3.5 3.9 4.8 5.2 6.7 Max tENZH3 Std. 2.2 2.4 2.7 2.8 3.2 3.3 2.6 2.9 3.3 3.4 3.8 3.9 Max tENZL4 –F 2.4 2.5 3.4 3.6 4.9 6.6 Units ns ns ns ns ns ns 2.0 2.1 2.8 3.0 4.1 5.5 –F Std. Table 1-26 • Worst-Case Commercial Conditions VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C Max tDLH1 Macro Type OTB25LPHH OTB25LPHN OTB25LPHL OTB25LPLH OTB25LPLN OTB25LPLL Notes: 1. 2. 3. 4. 5. 6. 1 -4 2 Max tDHL2 Std. 2.1 3.0 3.2 4.6 4.2 5.3 –F 2.5 3.6 3.8 5.5 5.1 6.4 Max tENZH3 Std. 2.3 2.7 3.1 3.0 3.8 4.2 2.7 3.2 3.8 3.6 4.5 5.1 Max tENZL4 –F 2.4 2.5 3.2 3.1 4.6 6.1 Units ns ns ns ns ns ns 2.0 2.1 2.7 2.6 3.8 5.1 Description 2.5 V, Low Power, High Output Current, High Slew Rate5 2.5 V, Low Power, High Output Current, Nominal Slew Rate 2.5 V, Low Power, High Output Current, Low Slew Rate5 Rate5 2.5 V, Low Power, Low Output Current, High Slew Rate5 2.5 V, Low Power, Low Output Current, Nominal Slew 2.5 V, Low Power, Low Output Current, Low Slew Rate5 5 Std. 2.0 2.4 2.9 2.7 3.5 4.0 –F 2.4 2.9 3.5 3.3 4.2 4.8 –F Std. tDLH=Data-to-Pad High tDHL=Data-to-Pad Low tENZH=Enable-to-Pad, Z to High tENZL = Enable-to-Pad, Z to Low Low power I/O work with VDDP=2.5 V ±10% only. VDDP=2.3 V for delays. All –F parts are only available as commercial. v5.7 ProASICPLUS Flash Family FPGAs Table 1-27 • Worst-Case Military Conditions VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 125°C for Military/MIL-STD-883 Max tDLH1 Macro Type OTB33PH OTB33PN OTB33PL OTB33LH OTB33LN OTB33LL Notes: 1. 2. 3. 4. tDLH=Data-to-Pad High tDHL=Data-to-Pad Low tENZH=Enable-to-Pad, Z to High tENZL = Enable-to-Pad, Z to Low Description 3.3 V, PCI Output Current, High Slew Rate 3.3 V, High Output Current, Nominal Slew Rate 3.3 V, High Output Current, Low Slew Rate 3.3 V, Low Output Current, High Slew Rate 3.3 V, Low Output Current, Nominal Slew Rate 3.3 V, Low Output Current, Low Slew Rate Std. 2.2 2.4 2.7 2.7 3.3 3.2 Max tDHL2 Std. 2.4 3.2 3.5 4.3 4.7 6.0 Max tENZH3 Std. 2.3 2.7 2.9 3.0 3.4 3.5 Max tENZL4 Std. 2.1 2.3 3.0 3.1 4.4 5.9 Units ns ns ns ns ns ns Table 1-28 • Worst-Case Military Conditions VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 125°C for Military/MIL-STD-883 Max tDLH1 Macro Type OTB25LPHH OTB25LPHN OTB25LPHL OTB25LPLH OTB25LPLN OTB25LPLL Notes: 1. 2. 3. 4. 5. tDLH=Data-to-Pad High tDHL=Data-to-Pad Low tENZH=Enable-to-Pad, Z to High tENZL = Enable-to-Pad, Z to Low Low power I/O work with VDDP=2.5V ±10% only. VDDP=2.3V for delays. Description 2.5 V, Low Power, High Output Current, High Slew Rate 5 Max tDHL2 Std. 2.3 3.2 3.5 5.0 4.5 5.8 Max tENZH3 Std. 2.4 2.8 3.3 3.2 4.1 4.4 Max tENZL4 Std. 2.1 2.1 2.8 2.8 4.1 5.4 Units ns ns ns ns ns ns Std. 2.3 2.7 3.2 3.0 5 2.5 V, Low Power, High Output Current, Nominal Slew Rate5 2.5 V, Low Power, High Output Current, Low Slew Rate5 2.5 V, Low Power, Low Output Current, High Slew Rate5 2.5 V, Low Power, Low Output Current, Nominal Slew Rate 2.5 V, Low Power, Low Output Current, Low Slew Rate 5 3.7 4.4 v5.7 1-43 ProASICPLUS Flash Family FPGAs Output Buffer Delays A A OBx PAD 35pF 50% 50% VOH 50% PAD 50% VOL tDLH tDHL Figure 1-27 • Output Buffer Delays Table 1-29 • Worst-Case Commercial Conditions VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C Max tDLH1 Macro Type OB33PH OB33PN OB33PL OB33LH OB33LN OB33LL Notes: 1. tDLH = Data-to-Pad High 2. tDHL = Data-to-Pad Low 3. All –F parts are only available as commercial. Table 1-30 • Worst-Case Commercial Conditions VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C Max tDLH1 Macro Type OB25LPHH OB25LPHN OB25LPHL OB25LPLH OB25LPLN OB25LPLL Notes: 1. 2. 3. 4. tDLH = Data-to-Pad High tDHL = Data-to-Pad Low Low-power I/Os work with VDDP=2.5 V ±10% only. VDDP=2.3 V for delays. All –F parts are only available as commercial. Description 2.5 V, Low Power, High Output Current, High Slew Rate3 Std. 2.0 2.4 2.9 2.7 3 Max tDHL2 Std. 2.2 2.9 3.2 4.0 4.3 5.6 –F 2.6 3.5 3.9 4.8 5.2 6.7 Units ns ns ns ns ns ns Description 3.3 V, PCI Output Current, High Slew Rate 3.3 V, High Output Current, Nominal Slew Rate 3.3 V, High Output Current, Low Slew Rate 3.3 V, Low Output Current, High Slew Rate 3.3 V, Low Output Current, Nominal Slew Rate 3.3 V, Low Output Current, Low Slew Rate Std. 2.0 2.2 2.5 2.6 2.9 3.0 –F 2.4 2.6 3.0 3.1 3.5 3.6 Max tDHL2 Std. 2.1 3.0 3.2 4.6 4.2 5.3 –F 2.6 3.6 3.8 5.5 5.1 6.4 Units ns ns ns ns ns ns –F 2.4 2.9 3.5 3.3 4.2 4.8 2.5 V, Low Power, High Output Current, Nominal Slew Rate3 2.5 V, Low Power, High Output Current, Low Slew Rate 2.5 V, Low Power, Low Output Current, High Slew 3 Rate3 2.5 V, Low Power, Low Output Current, Nominal Slew Rate 2.5 V, Low Power, Low Output Current, Low Slew Rate3 3.5 4.0 1 -4 4 v5.7 ProASICPLUS Flash Family FPGAs Table 1-31 • Worst-Case Military Conditions VDDP = 3.0V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883 Max. tDLH1 Macro Type OB33PH OB33PN OB33PL OB33LH OB33LN OB33LL Notes: 1. tDLH = Data-to-Pad High 2. tDHL = Data-to-Pad Low Table 1-32 • Worst-Case Military Conditions VDDP = 2.3 V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883 Max. tDLH1 Macro Type OB25LPHH OB25LPHN OB25LPHL OB25LPLH OB25LPLN OB25LPLL Notes: 1. tDLH = Data-to-Pad High 2. tDHL = Data-to-Pad Low 3. Low power I/O work with VDDP=2.5V ±10% only. VDDP=2.3V for delays. Description 2.5V, Low Power, High Output Current, High Slew Rate 3 3 Max. tDHL2 Std. 2.3 3.2 3.5 4.3 4.7 6.1 Units ns ns ns ns ns ns Description 3.3V, PCI Output Current, High Slew Rate 3.3V, High Output Current, Nominal Slew Rate 3.3V, High Output Current, Low Slew Rate 3.3V, Low Output Current, High Slew Rate 3.3V, Low Output Current, Nominal Slew Rate 3.3V, Low Output Current, Low Slew Rate Std. 2.1 2.5 2.7 2.7 3.3 3.3 Max. tDHL2 Std. 2.4 3.3 3.5 5.0 4.6 5.7 Units ns ns ns ns ns ns Std. 2.3 2.7 3.2 3.0 3 2.5V, Low Power, High Output Current, Nominal Slew Rate 2.5V, Low Power, High Output Current, Low Slew Rate3 2.5V, Low Power, Low Output Current, High Slew Rate3 2.5V, Low Power, Low Output Current, Nominal Slew Rate 2.5V, Low Power, Low Output Current, Low Slew Rate3 3.9 4.3 v5.7 1-45 ProASICPLUS Flash Family FPGAs Input Buffer Delays V DDP PAD PAD IBx Y Y GND 50% 50% VDD 50% tINYH 0V 50% tIN YL Figure 1-28 • Input Buffer Delays Table 1-33 • Worst-Case Commercial Conditions VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C Max. tINYH1 Macro Type IB33 IB33S Notes: 1. 2. 3. 4. 5. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3 V for delays. All –F parts are only available as commercial. 3.3 V, CMOS Input Levels3, Description No Pull-up Resistor Std. 0.4 0.6 –F 0.5 0.7 Max. tINYL2 Std. 0.6 0.8 –F 0.7 0.9 Units ns ns 3.3 V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger Table 1-34 • Worst-Case Commercial Conditions VDDP = 2.3 V, VDD = 2.3 V, TJ = 70°C Max. tINYH1 Macro Type IB25LP IB25LPS Notes: 1. 2. 3. 4. 5. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3 V for delays. All –F parts are only available as commercial. 2.5 V, CMOS Input Levels3, 3, Max. tINYL2 Std. 0.6 0.9 –F 0.8 1.1 Units ns ns Description Low Power Std. 0.9 0.7 –F 1.1 0.9 2.5 V, CMOS Input Levels Low Power, Schmitt Trigger 1 -4 6 v5.7 ProASICPLUS Flash Family FPGAs Table 1-35 • Worst-Case Military Conditions VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Max. tINYH1 Macro Type IB33 IB33S Notes: 1. 2. 3. 4. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3V for delays. Description 3.3V, CMOS Input Levels3 , No Pull-up Resistor Std. 0.5 0.6 Max. tINYL2 Std. 0.6 0.8 Units ns ns 3.3V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger Table 1-36 • Worst-Case Military Conditions VDDP = 2.3V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Max. tINYH1 Macro Type IB25LP IB25LPS Notes: 1. 2. 3. 4. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3V for delays. Description 2.5V, CMOS Input Levels Low Power 2.5V, CMOS Input Levels3, Low Power, Schmitt Trigger 3, Max. tINYL2 Std. 0.7 1.0 Units ns ns Std. 0.9 0.8 v5.7 1-47 ProASICPLUS Flash Family FPGAs Global Input Buffer Delays Table 1-37 • Worst-Case Commercial Conditions VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C Max. tINYH1 Macro Type GL33 GL33S PECL Notes: 1. 2. 3. 4. 5. 6. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low Applies to Military ProASICPLUS devices. LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3 V for delays. All –F parts are only available as commercial. 4 Max. tINYL2 Std. 1.1 1.1 1.1 3 Units ns ns ns Description 3.3 V, CMOS Input Levels4, No Pull-up Resistor 3.3 V, CMOS Input Levels , No Pull-up Resistor, Schmitt Trigger PPECL Input Levels Std. 1.0 1.0 1.0 3 –F 1.2 1.2 1.2 –F 1.3 1.3 1.3 Table 1-38 • Worst-Case Commercial Conditions VDDP = 2.3 V, VDD = 2.3 V, TJ = 70°C Max. tINYH1 Macro Type GL25LP GL25LPS Notes: 1. 2. 3. 4. 5. 6. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low Applies to Military ProASICPLUS devices. LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3 V for delays. All –F parts are only available as commercial. 4, Max. tINYL2 Std.3 1.0 1.0 –F 1.3 1.1 Units ns ns Description 2.5 V, CMOS Input Levels Low Power 2.5 V, CMOS Input Levels4, Low Power, Schmitt Trigger Std. 1.1 1.3 3 –F 1.2 1.6 1 -4 8 v5.7 ProASICPLUS Flash Family FPGAs Table 1-39 • Worst-Case Military Conditions VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Max. tINYH1 Macro Type GL33 GL33S PECL Notes: 1. 2. 3. 4. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3V for delays. 3 Max. tINYL2 Std. 1.1 1.1 1.1 Description 3.3V, CMOS Input Levels , No Pull-up Resistor 3.3V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger PPECL Input Levels Std. 1.1 1.1 1.1 Table 1-40 • Worst-Case Military Conditions VDDP = 2.3V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Max. tINYH1 Macro Type GL25LP GL25LPS Notes: 1. 2. 3. 4. tINYH = Input Pad-to-Y High tINYL = Input Pad-to-Y Low LVTTL delays are the same as CMOS delays. For LP Macros, VDDP=2.3V for delays. 2.5V, CMOS Input Levels3, 3, Max. tINYL2 Std. 1.1 1.0 Description Low Power Std. 1.0 1.4 2.5V, CMOS Input Levels Low Power, Schmitt Trigger v5.7 1-49 ProASICPLUS Flash Family FPGAs Predicted Global Routing Delay Table 1-41 • Worst-Case Commercial Conditions1 VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C Max. Parameter tRCKH tRCKL tRCKH tRCKL Notes: 1. 2. 3. 4. The timing delay difference between tile locations is less than 15ps. All –F parts are only available as commercial. Highly loaded row 50%. Minimally loaded row. Input Low to High Input High to Low Input Low to High Input High to Low 3 3 4 4 Description Std. 1.1 1.0 0.8 0.8 –F2 1.3 1.2 1.0 1.0 Units ns ns ns ns Table 1-42 • Worst-Case Military Conditions VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Parameter tRCKH tRCKL tRCKH tRCKL Description Input Low to High (high loaded row of 50%) Input High to Low (high loaded row of 50%) Input Low to High (minimally loaded row) Input High to Low (minimally loaded row) Max. 1.1 1.0 0.8 0.8 Units ns ns ns ns Note: * The timing delay difference between tile locations is less than 15 ps. Global Routing Skew Table 1-43 • Worst-Case Commercial Conditions VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C Max. Parameter tRCKSWH tRCKSHH Description Maximum Skew Low to High Maximum Skew High to Low Std. 270 270 –F* 320 320 Units ps ps Note: *All –F parts are only available as commercial. Table 1-44 • Worst-Case Commercial Conditions VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883 Parameter tRCKSWH tRCKSHH Description Maximum Skew Low to High Maximum Skew High to Low Max. 270 270 Units ps ps 1 -5 0 v5.7 ProASICPLUS Flash Family FPGAs Module Delays A B C Y A B C Y 50%50% 50% 50% 50%50% 50% 50% 50% 50% 50% 50% tDBLH tDALH tDAHL tDBHL tDCLH tDCHL Figure 1-29 • Module Delays Sample Macrocell Library Listing Table 1-45 • Worst-Case Military Conditions1 VDD = 2.3 V, TJ = 70º C, TJ = 70°C, TJ = 125°C for Military/MIL-STD-883 Std. Cell Name NAND2 AND2 NOR3 MUX2L OA21 XOR2 LDL 2-Input NAND 2-Input AND 3-Input NOR 2-1 MUX with Active Low Select 2-Input OR into a 2-Input AND 2-Input Exclusive OR Active Low Latch (LH/HL) CLK-Q tsetup thold DFFL Negative Edge-Triggered D-type Flip-Flop (LH/HL) CLK-Q tsetup thold Notes: 1. Intrinsic delays have a variable component, coupled to the input slope of the signal. These numbers assume an input slope typical of local interconnect. 2. All –F parts are only available as commercial. 3. LH and HL refer to the Q transitions from Low to High and High to Low, respectively. LH3 HL3 0.9 0.8 0.6 0.0 LH3 HL3 Description Max 0.5 0.7 0.8 0.5 0.8 0.6 0.9 0.8 0.7 0.1 1.1 1.0 0.7 0.0 ns ns ns Min Max 0.6 0.8 1.0 0.6 1.0 0.8 1.1 0.9 0.8 0.2 ns ns ns ns –F2 Min Units ns ns ns ns ns ns ns v5.7 1-51 ProASICPLUS Flash Family FPGAs Table 1-46 • Recommended Operating Conditions Limits Parameter Maximum Clock Frequency* Maximum RAM Frequency* Maximum Rise/Fall Time on Inputs* • • Schmitt Trigger Mode (10% to 90%) Non-Schmitt Trigger Mode (10% to 90%) tR/tF tR/tF N/A 100 ns 180 MHz fTCK 10 MHz 100 ns 10 ns 180 MHz 10 MHz Symbol fCLOCK fRAM Commercial/Industrial 180 MHz 150 MHz Military/MIL-STD-883 180 MHz 150 MHz Maximum LVPECL Frequency* Maximum TCK Frequency (JTAG) Note: *All –F parts will be 20% slower than standard commercial devices. Table 1-47 • Slew Rates Measured at C = 30pF, Nominal Power Supplies and 25°C Type OB33PH OB33PN OB33PL OB33LH OB33LN OB33LL OB25LPHH OB25LPHN OB25LPHL OB25LPLH OB25LPLN OB25LPLL Notes: 1. Standard and –F parts. 2. All –F only available as commercial. Trig. Level Rising Edge (ns) 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 10%-90% 1.60 1.57 1.57 3.80 4.19 5.49 1.55 1.70 1.97 3.57 4.65 5.52 Slew Rate (V/ns) 1.65 1.68 1.68 0.70 0.63 0.48 1.29 1.18 1.02 0.56 0.43 0.36 Falling Edge (ns) 1.65 3.32 1.99 4.84 3.37 2.98 1.56 2.08 2.09 3.93 3.28 3.44 Slew Rate (V/ns) 1.60 0.80 1.32 0.55 0.78 0.89 1.28 0.96 0.96 0.51 0.61 0.58 PCI Mode Yes No No No No No No No No No No No 1 -5 2 v5.7 ProASICPLUS Flash Family FPGAs Table 1-48 • JTAG Switching Characteristics Description Output delay from TCK falling to TDI, TMS TDO Setup time before TCK rising TDO Hold time after TCK rising TCK period RCK period Notes: 1. For DC electrical specifications of the JTAG pins (TCK, TDI, TMS, TDO, TRST), refer to Table 1-21 on page 1-36 when VDDP = 2.5 V and Table 1-22 on page 1-38 when VDDP = 3.3 V. 2. If RCK is being used, there is no minimum on the TCK period. Symbol tTCKTDI tTDOTCK tTCKTDO tTCK tRCK Min –4 10 0 100 2 Max 4 Unit ns ns ns 1,000 1,000 ns ns 100 TCK tTCK TMS, TDI tTCKTDI TDO tTDOTCK tTCKTDO Figure 1-30 • JTAG Operation Timing v5.7 1-53 ProASICPLUS Flash Family FPGAs Embedded Memory Specifications This section discusses ProASICPLUS SRAM/FIFO embedded memory and its interface signals, including timing diagrams that show the relationships of signals as they pertain to single embedded memory blocks (Table 1-49). Table 1-12 on page 1-23 shows basic SRAM and FIFO configurations. Simultaneous read and write to the same location must be done with care. On such accesses the DI bus is output to the DO bus. Refer to the ProASICPLUS RAM and FIFO Blocks application note for more information. • • • "Asynchronous SRAM Read, RDB Controlled" section on page 1-59 "Synchronous SRAM Write" Embedded Memory Specifications Enclosed Timing Diagrams—SRAM Mode: • "Synchronous SRAM Read, Access Timed Output Strobe (Synchronous Transparent)" section on page 1-55 "Synchronous SRAM Read, Pipeline Mode Outputs (Synchronous Pipelined)" section on page 1-56 "Asynchronous SRAM Write" section on page 1-57 "Asynchronous SRAM Read, Address Controlled, RDB=0" section on page 1-58 • • • The difference between synchronous transparent and pipeline modes is the timing of all the output signals from the memory. In transparent mode, the outputs will change within the same clock cycle to reflect the data requested by the currently valid access to the memory. If clock cycles are short (high clock speed), the data requires most of the clock cycle to change to valid values (stable signals). Processing of this data in the same clock cycle is nearly impossible. Most designers add registers at all outputs of the memory to push the data processing into the next clock cycle. An entire clock cycle can then be used to process the data. To simplify use of this memory setup, suitable registers have been implemented as part of the memory primitive and are available to the user in the synchronous pipeline mode. In this mode, the output signals will change shortly after the second rising edge, following the initiation of the read access. Table 1-49 • Memory Block SRAM Interface Signals SRAM Signal WCLKS RCLKS RADDR RBLKB RDB WADDR WBLKB DI WRB DO RPE WPE PARODD Bits 1 1 8 1 1 8 1 9 1 9 1 1 1 In/Out In In In In In In In In In Out Out Out In Description Write clock used on synchronization on write side Read clock used on synchronization on read side Read address True read block select (active Low) True read pulse (active Low) Write address Write block select (active Low) Input data bits , can be used for parity In Negative true write pulse Output data bits , can be used for parity Out Read parity error (active High) Write parity error (active High) Selects Odd parity generation/detect when high, Even when low Note: Not all signals shown are used in all modes. 1 -5 4 v5.7 ProASICPLUS Flash Family FPGAs Synchronous SRAM Read, Access Timed Output Strobe (Synchronous Transparent) RCLKS Cycle Start RBD, RBLKB RADDR New Valid Address DO Old Data Out New Valid Data Out RPE tRACS tRDCS tRDCH tRACH tOCH tRPCH tCMH tOCA tRPCA tCCYC tCML Note: The plot shows the normal operation status. Figure 1-31 • Synchronous SRAM Read, Access Timed Output Strobe (Synchronous Transparent) Table 1-50 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML OCA OCH RACH RACS RDCH RDCS RPCA RPCH Cycle time Clock high phase Clock low phase New DO access from RCLKS ↑ Old DO valid from RCLKS ↑ RADDR hold from RCLKS ↑ RADDR setup to RCLKS ↑ RDB hold from RCLKS ↑ RDB setup to RCLKS ↑ New RPE access from RCLKS ↑ Old RPE valid from RCLKS ↑ 0.5 1.0 0.5 1.0 9.5 3.0 Description Min. 7.5 3.0 3.0 7.5 3.0 Max. Units ns ns ns ns ns ns ns ns ns ns ns Notes Note: All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-55 ProASICPLUS Flash Family FPGAs Synchronous SRAM Read, Pipeline Mode Outputs (Synchronous Pipelined) RCLKS Cycle Start RDB, RBLKB RADDR New Valid Address DO Old Data Out New Valid Data Out RPE Old RPE Out New RPE Out tRACS tRACH tRDCH tRDCS tCMH tCCYC Note: The plot shows the normal operation status. Figure 1-32 • Synchronous SRAM Read, Pipeline Mode Outputs (Synchronous Pipelined) Table 1-51 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = 0°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML OCA OCH RACH RACS RDCH RDCS RPCA RPCH Cycle time Clock high phase Clock low phase New DO access from RCLKS ↑ Old DO valid from RCLKS ↑ RADDR hold from RCLKS ↑ RADDR setup to RCLKS ↑ RDB hold from RCLKS ↑ RDB setup to RCLKS ↑ New RPE access from RCLKS ↑ Old RPE valid from RCLKS ↑ 0.5 1.0 0.5 1.0 4.0 1.0 Description Min. 7.5 3.0 3.0 2.0 0.75 Max. Units ns ns ns ns ns ns ns ns ns ns ns tOCA tRPCH tOCH tRPCA tCML Notes Note: All –F speed grade devices are 20% slower than the standard numbers. 1 -5 6 v5.7 ProASICPLUS Flash Family FPGAs Asynchronous SRAM Write WADDR WRB, WBLKB DI WPE tAWRS tAWRH tDWRH tWPDA tDWRS tWRML tWRCYC Note: The plot shows the normal operation status. Figure 1-33 • Asynchronous SRAM Write Table 1-52 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883B Symbol txxx AWRH AWRS DWRH DWRS DWRS WPDA WPDH WRCYC WRMH WRML Description WADDR hold from WB ↑ WADDR setup to WB ↓ DI hold from WB ↑ DI setup to WB ↑ DI setup to WB ↑ WPE access from DI WPE hold from DI Cycle time WB high phase WB low phase 7.5 3.0 3.0 Min. 1.0 0.5 1.5 0.5 2.5 3.0 1.0 Max. Units ns ns ns ns ns ns ns ns ns ns tWPDH tWRMH Notes PARGEN is inactive. PARGEN is active. WPE is invalid, while PARGEN is active. Inactive Active Note: All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-57 ProASICPLUS Flash Family FPGAs Asynchronous SRAM Read, Address Controlled, RDB=0 RADDR DO RPE tOAH tRPAH tOAA tRPAA tACYC Note: The plot shows the normal operation status. Figure 1-34 • Asynchronous SRAM Read, Address Controlled, RDB=0 Table 1-53 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883B Symbol txxx ACYC OAA OAH RPAA RPAH Description Read cycle time New DO access from RADDR stable Old DO hold from RADDR stable New RPE access from RADDR stable Old RPE hold from RADDR stable 10.0 3.0 Min. 7.5 7.5 3.0 Max. Units ns ns ns ns ns Notes Note: All –F speed grade devices are 20% slower than the standard numbers. 1 -5 8 v5.7 ProASICPLUS Flash Family FPGAs Asynchronous SRAM Read, RDB Controlled RB=(RDB+RBLKB) DO RPE tORDH tRPRDH tORDA tRPRDA tRDML tRDCYC Note: The plot shows the normal operation status. Figure 1-35 • Asynchronous SRAM Read, RDB Controlled Table 1-54 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx ORDA ORDH RDCYC RDMH RDML RPRDA RPRDH Description New DO access from RB ↓ Old DO valid from RB ↓ Read cycle time RB high phase RB low phase New RPE access from RB ↓ Old RPE valid from RB ↓ 7.5 3.0 3.0 9.5 3.0 Min. 7.5 3.0 Max. Units ns ns ns ns ns ns ns Inactive setup to new cycle Active Notes tRDMH Note: All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-59 ProASICPLUS Flash Family FPGAs Synchronous SRAM Write WCLKS Cycle Start WRB, WBLKB WADDR, DI WPE tWRCH, tWBCH tWRCS, tWBCS tDCS, tWDCS tWPCH tDCH, tWACH tWPCA tCMH tCCYC tCML Note: The plot shows the normal operation status. Figure 1-36 • Synchronous SRAM Write Table 1-55 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML DCH DCS WACH WDCS WPCA WPCH Cycle time Clock high phase Clock low phase DI hold from WCLKS ↑ DI setup to WCLKS ↑ WADDR hold from WCLKS ↑ WADDR setup to WCLKS ↑ New WPE access from WCLKS ↑ Old WPE valid from WCLKS ↑ 0.5 1.0 Description Min. 7.5 3.0 3.0 0.5 1.0 0.5 1.0 3.0 0.5 Max. Units ns ns ns ns ns ns ns ns ns ns ns WPE is invalid while PARGEN is active Notes WRCH, WBCH WRB & WBLKB hold from WCLKS ↑ WRCS, WBCS Notes: WRB & WBLKB setup to WCLKS ↑ 1. On simultaneous read and write accesses to the same location, DI is output to DO. 2. All –F speed grade devices are 20% slower than the standard numbers. 1 -6 0 v5.7 ProASICPLUS Flash Family FPGAs Synchronous Write and Read to the Same Location tCCYC tCMH RCLKS tCML DO Last Cycle Data New Data* WCLKS t WCLKRCLKH t WCLKRCLKS tOCH tOCA * New data is read if WCLKS ↑ occurs before setup time. The data stored is read if WCLKS ↑ occurs after hold time. Note: The plot shows the normal operation status. Figure 1-37 • Synchronous Write and Read to the Same Location Table 1-56 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML WCLKRCLKS WCLKRCLKH OCH OCA Notes: 1. This behavior is valid for Access Timed Output and Pipelined Mode Output. The table shows the timings of an Access Timed Output. 2. During synchronous write and synchronous read access to the same location, the new write data will be read out if the active write clock edge occurs before or at the same time as the active read clock edge. The negative setup time insures this behavior for WCLKS and RCLKS driven by the same design signal. 3. If WCLKS changes after the hold time, the data will be read. 4. A setup or hold time violation will result in unknown output data. 5. All –F speed grade devices are 20% slower than the standard numbers. Cycle time Clock high phase Clock low phase WCLKS ↑ to RCLKS ↑ setup time WCLKS ↑ to RCLKS ↑ hold time Old DO valid from RCLKS ↑ New DO valid from RCLKS ↑ 7.5 Description Min. 7.5 3.0 3.0 – 0.1 7.0 3.0 Max. Units ns ns ns ns ns ns ns OCA/OCH displayed for Access Timed Output Notes v5.7 1-61 ProASICPLUS Flash Family FPGAs Asynchronous Write and Synchronous Read to the Same Location t CMH RCLKS t CML DO Last Cycle Data New Data* WB = {WRB + WBLKB} DI t WRCKS t BRCLKH t OCH t OCA t DWRRCLKS tCCYC t DWRH * New data is read if WB ↓ occurs before setup time. The stored data is read if WB ↓ occurs after hold time. Note: The plot shows the normal operation status. Figure 1-38 • Asynchronous Write and Synchronous Read to the Same Location Table 1-57 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML WBRCLKS WBRCLKH OCH OCA DWRRCLKS DWRH Notes: 1. This behavior is valid for Access Timed Output and Pipelined Mode Output. The table shows the timings of an Access Timed Output. 2. In asynchronous write and synchronous read access to the same location, the new write data will be read out if the active write signal edge occurs before or at the same time as the active read clock edge. If WB changes to low after hold time, the data will be read. 3. A setup or hold time violation will result in unknown output data. 4. All –F speed grade devices are 20% slower than the standard numbers. Cycle time Clock high phase Clock low phase WB ↓ to RCLKS ↑ setup time WB ↓ to RCLKS ↑ hold time Old DO valid from RCLKS ↑ New DO valid from RCLKS ↑ DI to RCLKS ↑ setup time DI to WB ↑ hold time 7.5 0 1.5 Description Min. 7.5 3.0 3.0 –0.1 7.0 3.0 Max. Units ns ns ns ns ns ns ns ns ns OCA/OCH displayed Access Timed Output for Notes 1 -6 2 v5.7 ProASICPLUS Flash Family FPGAs Asynchronous Write and Read to the Same Location RB, RADDR DO OLD NEW NEWER WB = {WRB+WBLKB} tORDA tORDH tRAWRS tOWRA tOWRH Note: The plot shows the normal operation status. Figure 1-39 • Asynchronous Write and Read to the Same Location Table 1-58 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx ORDA ORDH OWRA OWRH RAWRS RAWRH Notes: 1. During an asynchronous read cycle, each write operation (synchronous or asynchronous) to the same location will automatically trigger a read operation which updates the read data. Refer to the ProASICPLUS RAM and FIFO Blocks application note for more information. 2. Violation or RAWRS will disturb access to the OLD data. 3. Violation of RAWRH will disturb access to the NEWER data. 4. All –F speed grade devices are 20% slower than the standard numbers. Description New DO access from RB ↓ Old DO valid from RB ↓ New DO access from WB ↑ Old DO valid from WB ↑ RB ↓ or RADDR from WB ↓ RB ↑ or RADDR from WB ↑ 5.0 5.0 3.0 0.5 Min. 7.5 3.0 Max. Units ns ns ns ns ns ns Notes tRAWRH v5.7 1-63 ProASICPLUS Flash Family FPGAs Synchronous Write and Asynchronous Read to the Same Location RB, RADDR DO OLD NEW NEWER WCLKS t ORDA t ORDH t OWRA t OWRH t RAWCLKS Note: The plot shows the normal operation status. Figure 1-40 • Synchronous Write and Asynchronous Read to the Same Location Table 1-59 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx ORDA ORDH OWRA OWRH RAWCLKS RAWCLKH Notes: 1. During an asynchronous read cycle, each write operation (synchronous or asynchronous) to the same location will automatically trigger a read operation which updates the read data. 2. Violation of RAWCLKS will disturb access to OLD data. 3. Violation of RAWCLKH will disturb access to NEWER data. 4. All –F speed grade devices are 20% slower than the standard numbers. Description New DO access from RB ↓ Old DO valid from RB ↓ New DO access from WCLKS ↓ Old DO valid from WCLKS ↓ RB ↓ or RADDR from WCLKS ↑ RB ↑ or RADDR from WCLKS ↓ 5.0 5.0 3.0 0.5 Min. 7.5 3.0 Max. Units ns ns ns ns ns ns Notes t RAWCLKH 1 -6 4 v5.7 ProASICPLUS Flash Family FPGAs Asynchronous FIFO Full and Empty Transitions The asynchronous FIFO accepts writes and reads while not full or not empty. When the FIFO is full, all writes are inhibited. Conversely, when the FIFO is empty, all reads are inhibited. A problem is created if the FIFO is written to during the transition from full to not full, or read during the transition from empty to not empty. The exact time at which the write or read operation changes from inhibited to accepted after the read (write) signal which causes the transition from full or empty to not full or not empty is indeterminate. For slow cycles, this indeterminate period starts 1 ns after the RB (WB) transition, which deactivates full or not empty and ends 3 ns after the RB (WB) transition. For fast cycles, the indeterminate period ends 3 ns (7.5 ns – RDL (WRL)) after the RB (WB) transition, whichever is later (Table 1-1 on page 1-7). The timing diagram for write is shown in Figure 1-38 on page 1-62. The timing diagram for read is shown in Figure 1-39 on page 1-63. For basic SRAM configurations, see Table 1-13 on page 1-24. When reset is asserted, the Table 1-60 • Memory Block FIFO Interface Signals FIFO Signal WCLKS RCLKS LEVEL * RBLKB RDB RESET WBLKB DI WRB FULL, EMPTY EQTH, GEQTH* DO RPE WPE LGDEP PARODD Bits 1 1 8 1 1 1 1 9 1 2 2 9 1 1 3 1 In/Out In In In In In In In In In Out Out Out Out Out In In Description Write clock used for synchronization on write side Read clock used for synchronization on read side Direct configuration implements static flag logic Read block select (active Low) Read pulse (active Low) Reset for FIFO pointers (active Low) Write block select (active Low) Input data bits , will be generated if PARGEN is true Write pulse (active Low) FIFO flags. FULL prevents write and EMPTY prevents read EQTH is true when the FIFO holds the number of words specified by the LEVEL signal. GEQTH is true when the FIFO holds (LEVEL) words or more Output data bits Read parity error (active High) Write parity error (active High) Configures DEPTH of the FIFO to 2 (LGDEP+1) Selects Odd parity generation/detect when high, Even when low empty flag will be asserted, the counters will reset, the outputs go to zero, but the internal RAM is not erased. Enclosed Timing Diagrams – FIFO Mode: The following timing diagrams apply only to single cell; they are not applicable to cascaded cells. For more information, refer to the ProASICPLUS RAM/FIFO Blocks application note. • • • "Asynchronous FIFO Read" section on page 1-67 "Asynchronous FIFO Write" section on page 1-68 "Synchronous FIFO Read, Access Timed Output Strobe (Synchronous Transparent)" section on page 1-69 "Synchronous FIFO Read, Pipeline Mode Outputs (Synchronous Pipelined)" section on page 1-70 "Synchronous FIFO Write" section on page 1-71 "FIFO Reset" section on page 1-72 • • • Note: *LEVEL is always eight bits (0000.0000, 0000.0001). That means for values of DEPTH greater than 256, not all values will be possible, e.g. for DEPTH=512, the LEVEL can only have the values 2, 4, . . ., 512. The LEVEL signal circuit will generate signals that indicate whether the FIFO is exactly filled to the value of LEVEL (EQTH) or filled equal or higher (GEQTH) than the specified LEVEL. Since counting starts at 0, EQTH will become true when the FIFO holds (LEVEL+1) words for 512-bit FIFOs. v5.7 1-65 ProASICPLUS Flash Family FPGAs FULL RB Write cycle Write inhibited Write accepted 1 ns 3 ns WB Note: All –F speed grade devices are 20% slower than the standard numbers. Figure 1-41 • Write Timing Diagram EMPTY WB Read cycle Read inhibited Read accepted 1 ns 3 ns RB Note: All –F speed grade devices are 20% slower than the standard numbers. Figure 1-42 • Read Timing Diagram 1 -6 6 v5.7 ProASICPLUS Flash Family FPGAs Asynchronous FIFO Read tRPRDA tRDL Cycle Start RB = (RDB+RBLKB) tRDH RDATA (Empty inhibits read) RPE WB EMPTY FULL EQTH, GETH tRDWRS tORDH tRPRDH tORDA tRPRDA tRDL tRDCYC tRDH tTHRDH tTHRDA tERDH, tFRDH tERDA, tFRDA Note: The plot shows the normal operation status. Figure 1-43 • Asynchronous FIFO Read Table 1-61 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx Description Min. Max. 0.5 3.01 3.0 1 Units ns ns ns ns Notes Empty/full/thresh are invalid from the end of hold until the new access is complete ERDH, FRDH, Old EMPTY, FULL, EQTH, & GETH valid hold THRDH time from RB ↑ ERDA FRDA ORDA ORDH RDCYC RDWRS RDH RDL RPRDA RPRDH THRDA Notes: New EMPTY access from RB ↑ FULL↓ access from RB ↑ New DO access from RB ↓ Old DO valid from RB ↓ Read cycle time WB ↑, clearing EMPTY, setup to RB ↓ RB high phase RB low phase New RPE access from RB ↓ Old RPE valid from RB ↓ EQTH or GETH access from RB↑ 4.5 7.5 3.0 2 7.5 3.0 ns ns ns Enabling the read operation Inhibiting the read operation Inactive Active 1.0 3.0 3.0 9.5 4.0 ns ns ns ns ns ns 1. At fast cycles, ERDA and FRDA = MAX (7.5 ns – RDL), 3.0 ns. 2. At fast cycles, RDWRS (for enabling read) = MAX (7.5 ns – WRL), 3.0 ns. 3. All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-67 ProASICPLUS Flash Family FPGAs Asynchronous FIFO Write WB = (WRB+WBLKB) Cycle Start WDATA (Full inhibits write) WPE RB FULL EMPTY EQTH, GETH tWRRDS tWPDA tDWRS tEWRH, tFWRH tEWRA, tFWRA tTHWRH tTHWRA tWRL tWRCYC tWRH tDWRH tWPDH Note: The plot shows the normal operation status. Figure 1-44 • Asynchronous FIFO Write Table 1-62 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx DWRH DWRS DWRS Description DI hold from WB ↑ DI setup to WB ↑ DI setup to WB ↑ Min. 1.5 0.5 2.5 0.5 3.01 3.01 4.5 3.0 1.0 7.5 3.02 1.0 3.0 3.0 ns ns Max. Units ns ns ns ns ns ns ns ns ns ns ns Enabling the write operation Inhibiting the write operation Inactive Active WPE is invalid while PARGEN is active PARGEN is inactive PARGEN is active Empty/full/thresh are invalid from the end of hold until the new access is complete Notes EWRH, FWRH, Old EMPTY, FULL, EQTH, & GETH valid hold THWRH time after WB ↑ EWRA FWRA THWRA WPDA WPDH WRCYC WRRDS WRH WRL Notes: 1. 2. 3. 4. EMPTY ↓ access from WB ↑ New FULL access from WB ↑ EQTH or GETH access from WB ↑ WPE access from DI WPE hold from DI Cycle time RB ↑, clearing FULL, setup to WB ↓ WB high phase WB low phase At fast cycles, EWRA, FWRA = MAX (7.5 ns – WRL), 3.0 ns. At fast cycles, WRRDS (for enabling write) = MAX (7.5 ns – RDL), 3.0 ns. All –F speed grade devices are 20% slower than the standard numbers. After FIFO reset, WRB needs an initial falling edge prior to any write actions. 1 -6 8 v5.7 ProASICPLUS Flash Family FPGAs Synchronous FIFO Read, Access Timed Output Strobe (Synchronous Transparent) RCLK Cycle Start RDB RDATA Old Data Out New Valid Data Out (Empty Inhibits Read) RPE EMPTY FULL EQTH, GETH tRDCH tRDCS tOCH tRPCH tOCA tRPCA tCMH tCCYC tCML tTHCBH tHCBA tECBH, tFCBH tECBA, tFCBA Note: The plot shows the normal operation status. Figure 1-45 • Synchronous FIFO Read, Access Timed Output Strobe (Synchronous Transparent) Table 1-63 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML ECBA FCBA Cycle time Clock high phase Clock low phase New EMPTY access from RCLKS ↓ FULL ↓ access from RCLKS ↓ Description Min. 7.5 3.0 3.0 3.01 3.01 1.0 7.5 3.0 0.5 1.0 9.5 3.0 4.5 Max. Units ns ns ns ns ns ns ns ns ns ns ns ns ns Empty/full/thresh are invalid from the end of hold until the new access is complete Notes ECBH, FCBH, Old EMPTY, FULL, EQTH, & GETH valid hold THCBH time from RCLKS ↓ OCA OCH RDCH RDCS RPCA RPCH HCBA Notes: New DO access from RCLKS ↑ Old DO valid from RCLKS ↑ RDB hold from RCLKS ↑ RDB setup to RCLKS ↑ New RPE access from RCLKS ↑ Old RPE valid from RCLKS ↑ EQTH or GETH access from RCLKS ↓ 1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMH), 3.0 ns. 2. All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-69 ProASICPLUS Flash Family FPGAs Synchronous FIFO Read, Pipeline Mode Outputs (Synchronous Pipelined) RCLK Cycle Start RDB RDATA Old Data Out New Valid Data Out RPE Old RPE Out New RPE Out EMPTY FULL EQTH, GETH tECBH, tFCBH tRDCH tRDCS tTHCBH tHCBA tRPCA tCMH tCCYC tCML tOCA tECBA, tFCBA tRPCH tOCH Note: The plot shows the normal operation status. Figure 1-46 • Synchronous FIFO Read, Pipeline Mode Outputs (Synchronous Pipelined) Table 1-64 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML ECBA FCBA ECBH, THCBH OCA OCH RDCH RDCS RPCA RPCH HCBA Notes: 1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMS), 3.0 ns. 2. All –F speed grade devices are 20% slower than the standard numbers. Cycle time Clock high phase Clock low phase New EMPTY access from RCLKS ↓ FULL ↓ access from RCLKS ↓ FCBH, Old EMPTY, FULL, EQTH, & GETH valid hold time from RCLKS ↓ New DO access from RCLKS ↑ Old DO valid from RCLKS ↑ RDB hold from RCLKS ↑ RDB setup to RCLKS ↑ New RPE access from RCLKS ↑ Old RPE valid from RCLKS ↑ EQTH or GETH access from RCLKS ↓ 4.5 0.5 1.0 4.0 1.0 2.0 0.75 Description Min. 7.5 3.0 3.0 3.01 3.0 1 Max. Units ns ns ns ns ns Notes 1.0 ns ns ns ns ns ns ns ns Empty/full/thresh are invalid from the end of hold until the new access is complete 1 -7 0 v5.7 ProASICPLUS Flash Family FPGAs Synchronous FIFO Write WCLKS Cycle Start WRB, WBLKB (Full Inhibits Write) DI WPE FULL EMPTY EQTH, GETH tWRCH, tWBCH tWRCS, tWBCS tDCS tWPCH tDCH tWPCA tCMH tCCYC tCML tHCBA tECBH, tFCBH tECBA, tFCBA tHCBH Note: The plot shows the normal operation status. Figure 1-47 • Synchronous FIFO Write Table 1-65 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CCYC CMH CML DCH DCS FCBA ECBA ECBH, FCBH, HCBH HCBA WPCA WPCH Cycle time Clock high phase Clock low phase DI hold from WCLKS ↑ DI setup to WCLKS ↑ New FULL access from WCLKS ↓ EMPTY↓ access from WCLKS ↓ Old EMPTY, FULL, EQTH, & GETH valid hold time from WCLKS ↓ EQTH or GETH access from WCLKS ↓ New WPE access from WCLKS ↑ Old WPE valid from WCLKS ↑ 0.5 1.0 WRB & WBLKB setup to WCLKS ↑ 4.5 3.0 0.5 Description Min. 7.5 3.0 3.0 0.5 1.0 3.01 3.01 1.0 Max. Units ns ns ns ns ns ns ns ns Empty/full/thresh are invalid from the end of hold until the new access is complete Notes ns ns ns ns ns WPE is invalid, while PARGEN is active WRCH, WBCH WRB & WBLKB hold from WCLKS ↑ WRCS, WBCS Notes: 1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMH), 3.0 ns. 2. All –F speed grade devices are 20% slower than the standard numbers. v5.7 1-71 ProASICPLUS Flash Family FPGAs FIFO Reset RESETB Cycle Start WRB/RBD1 WCLKS, RCLKS1 Cycle Start FULL EMPTY EQTH, GETH tCBRSS tERSA, tFRSA tTHRSA tRSL tWBRSS tCBRSH tWBRSH Notes: 1. During reset, either the enables (WRB and RBD) OR the clocks (WCLKS and RCKLS) must be low. 2. The plot shows the normal operation status. Figure 1-48 • FIFO Reset Table 1-66 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883 Symbol txxx CBRSH1 CBRSS1 ERSA FRSA RSL THRSA WBRSH WBRSS Notes: 1. During rest, the enables (WRB and RBD) must be high OR the clocks (WCLKS and RCKLS) must be low. 2. All –F speed grade devices are 20% slower than the standard numbers. 1 Description WCLKS or RCLKS ↑ hold from RESETB ↑ WCLKS or RCLKS ↓ setup to RESETB ↑ New EMPTY ↑ access from RESETB ↓ FULL ↓ access from RESETB ↓ RESETB low phase EQTH or GETH access from RESETB ↓ WB ↓ hold from RESETB ↑ WB ↑ setup to RESETB ↑ Min. 1.5 1.5 3.0 3.0 7.5 4.5 1.5 1.5 Max. Units ns ns ns ns ns ns ns ns Notes Synchronous mode only Synchronous mode only Asynchronous mode only Asynchronous mode only 1 1 -7 2 v5.7 ProASICPLUS Flash Family FPGAs Pin Description User Pins I/O User Input/Output TMS Test Mode Select The TMS pin controls the use of boundary-scan circuitry. This pin has an internal pull-up resistor. TCK Test Clock The I/O pin functions as an input, output, tristate, or bidirectional buffer. Input and output signal levels are compatible with standard LVTTL and LVCMOS specifications. Unused I/O pins are configured as inputs with pull-up resistors. NC No Connect Clock input pin for boundary scan (maximum 10 MHz). Actel recommends adding a nominal 20 kΩ pull-up resistor to this pin. TDI Test Data In Serial input for boundary scan. A dedicated pull-up resistor is included to pull this pin high when not being driven. TDO Test Data Out To maintain compatibility with other Actel ProASICPLUS products, it is recommended that this pin not be connected to the circuitry on the board. GL Global Pin Serial output for boundary scan. Actel recommends adding a nominal 20kΩ pull-up resistor to this pin. TRST Test Reset Input Low skew input pin for clock or other global signals. This pin can be configured with an internal pull-up resistor. When it is not connected to the global network or the clock conditioning circuit, it can be configured and used as a normal I/O. GLMX Global Multiplexing Pin Asynchronous, active-low input pin for resetting boundary-scan circuitry. This pin has an internal pull-up resistor. For more information, please refer to Power-up Behavior of ProASICPLUS Devices application note. Low skew input pin for clock or other global signals. This pin can be used in one of two special ways (refer to Actel’s Using ProASICPLUS Clock Conditioning Circuits). When the external feedback option is selected for the PLL block, this pin is routed as the external feedback source to the clock conditioning circuit. In applications where two different signals access the same global net at different times through the use of GLMXx and GLMXLx macros, this pin will be fixed as one of the source pins. This pin can be configured with an internal pull-up resistor. When it is not connected to the global network or the clock conditioning circuit, it can be configured and used as any normal I/O. If not used, the GLMXx pin will be configured as an input with pull-up. Special Function Pins RCK Running Clock A free running clock is needed during programming if the programmer cannot guarantee that TCK will be uninterrupted. If not used, this pin has an internal pullup and can be left floating. NPECL User Negative Input Provides high speed clock or data signals to the PLL block. If unused, leave the pin unconnected. PPECL User Positive Input Provides high speed clock or data signals to the PLL block. If unused, leave the pin unconnected. AVDD PLL Power Supply Dedicated Pins GND Ground Common ground supply voltage. VDD Logic Array Power Supply Pin Analog VDD should be VDD (core voltage) 2.5 V (nominal) and be decoupled from GND with suitable decoupling capacitors to reduce noise. For more information, refer to Actel’s Using ProASICPLUS Clock Conditioning Circuits application note. If the clock conditioning circuitry is not used in a design, AVDD can either be left floating or tied to 2.5 V. AGND PLL Power Ground 2.5 V supply voltage. VDDP I/O Pad Power Supply Pin 2.5 V or 3.3 V supply voltage. The analog ground can be connected to the system ground. For more information, refer to Actel’s Using ProASICPLUS Clock Conditioning Circuits application note. If the PLLs or clock conditioning circuitry are not used in a design, AGND should be tied to GND. v5.7 1-73 ProASICPLUS Flash Family FPGAs VPP Programming Supply Pin This pin may be connected to any voltage between GND and 16.5 V during normal operation, or it can be left unconnected.2 For information on using this pin during programming, see the In-System Programming ProASICPLUS Devices application note. Actel recommends floating the pin or connecting it to VDDP. VPN Programming Supply Pin finite length conductors that distribute the power to the device. This can be accomplished by providing sufficient bypass capacitance between the VPP and VPN pins and GND (using the shortest paths possible). Without sufficient bypass capacitance to counteract the inductance, the VPP and VPN pins may incur a voltage spike beyond the voltage that the device can withstand. This issue applies to all programming configurations. The solution prevents spikes from damaging the ProASICPLUS devices. Bypass capacitors are required for the VPP and VPN pads. Use a 0.01 µF to 0.1 µF ceramic capacitor with a 25 V or greater rating. To filter lowfrequency noise (decoupling), use a 4.7 µF (low ESR,

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