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AT28C010E-15JU-T

AT28C010E-15JU-T

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    LCC-32

  • 描述:

    IC EEPROM 1MBIT PARALLEL 32PLCC

  • 数据手册
  • 价格&库存
AT28C010E-15JU-T 数据手册
1-Megabit (128K x 8) Paged Parallel EEPROM Features • • • • • • • • • • • • Fast Read Access Time: 120 ns Automatic Page Write Operation: – Internal address and data latches for 128 bytes – Internal control timer Fast Write Cycle Time: – Page Write cycle time: 10 ms maximum – 1 to 128-byte Page Write operation Low-Power Dissipation: – 40 mA active current – 200 µA CMOS standby current Hardware and Software Data Protection DATA Polling for End of Write Detection High Reliability CMOS Technology: – Endurance: 10,000 or 100,000 cycles – Data retention: 10 years Single 5V ± 10% Supply CMOS and TTL Compatible Inputs and Outputs ® JEDEC Approved Byte-Wide Pinout Industrial Temperature Ranges Green (Pb/Halide-free) Packaging Option Only Packages • 32-Lead PLCC, 32-Lead TSOP © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 1 Table of Contents Features......................................................................................................................................................... 1 Packages........................................................................................................................................................1 1. Package Types (not to scale)..................................................................................................................4 2. Pin Descriptions...................................................................................................................................... 5 3. Description.............................................................................................................................................. 6 3.1. 4. Electrical Characteristics.........................................................................................................................7 4.1. 4.2. 4.3. 4.4. 5. Operating Modes........................................................................................................................10 AC Read Characteristics............................................................................................................ 10 AC Read Waveforms.................................................................................................................. 11 Input Test Waveforms and Measurement Level......................................................................... 11 Output Test Load........................................................................................................................ 12 AC Write Characteristics............................................................................................................ 12 AC Write Waveforms.................................................................................................................. 13 Page Mode Characteristics........................................................................................................ 14 Page Mode Write Waveforms(1,2)............................................................................................... 14 Chip Erase Waveforms...............................................................................................................15 Software Data Protection Enable Algorithm(1)............................................................................16 Software Data Protection Disable Algorithm(1)...........................................................................17 Software Protected Program Cycle Waveform(1,2,3)................................................................... 18 Data Polling Characteristics(1)....................................................................................................18 Data Polling Waveforms............................................................................................................. 19 Toggle Bit Characteristics(1)....................................................................................................... 19 Toggle Bit Waveforms.................................................................................................................19 Packaging Information.......................................................................................................................... 21 6.1. 7. Absolute Maximum Ratings..........................................................................................................7 DC and AC Operating Range.......................................................................................................7 DC Characteristics....................................................................................................................... 7 Pin Capacitance........................................................................................................................... 8 Device Operation.................................................................................................................................... 9 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 5.8. 5.9. 5.10. 5.11. 5.12. 5.13. 5.14. 5.15. 5.16. 5.17. 6. Block Diagram.............................................................................................................................. 6 Package Marking Information.....................................................................................................21 Revision History.................................................................................................................................... 24 The Microchip Website.................................................................................................................................25 Product Change Notification Service............................................................................................................25 Customer Support........................................................................................................................................ 25 Product Identification System.......................................................................................................................26 Microchip Devices Code Protection Feature................................................................................................ 27 © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 2 Legal Notice................................................................................................................................................. 27 Trademarks.................................................................................................................................................. 27 Quality Management System....................................................................................................................... 28 Worldwide Sales and Service.......................................................................................................................29 © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 3 Package Types (not to scale) Package Types (not to scale) 32-Lead PLCC 32-Lead TSOP Top View 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 14 15 16 17 18 19 20 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 4 3 2 1 32 31 30 A12 A15 A16 DC(1) VCC WE NC Top View A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 1. A11 A9 A8 A13 A14 NC WE VCC NC A16 A15 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 Note 1: PLCC package pin 1 is Don’t Connect. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 4 Pin Descriptions 2. Pin Descriptions The descriptions of the pins are listed in Table 2-1. Table 2-1. Pin Function Table Name DC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 I/O7 CE A10 OE A11 A9 A8 A13 A14 NC WE VCC © 2020 Microchip Technology Inc. 32-Lead PLCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 32-Lead TSOP — 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6, 9 7 8 Datasheet Function Don’t Connect Address Address Address Address Address Address Address Address Address Address Address Data Input/Output Data Input/Output Data Input/Output Ground Data Input/Output Data Input/Output Data Input/Output Data Input/Output Data Input/Output Chip Enable Address Output Enable Address Address Address Address Address No Connect Write Enable Device Power Supply DS20006331A-page 5 Description 3. Description The AT28C010 is a high‑performance Electrically Erasable and Programmable Read‑Only Memory (EEPROM). Its 1‑Mb memory is organized as 131,072 words by 8 bits. Manufactured with Microchip’s advanced nonvolatile CMOS technology, the device offers access times of 120 ns with power dissipation of just 220 mW. When the device is deselected, the CMOS standby current is less than 200 µA. The AT28C010 is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 128‑byte page register to allow writing of up to 128 bytes simultaneously. During a write cycle, the address and 1 to 128 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA Polling of I/O7. Once the end of a write cycle has been detected, a new access for a read or write can begin. The AT28C010 has additional features to ensure high quality and manufacturability. The device utilizes internal error correction for extended endurance and improved data retention characteristics. An optional software data protection mechanism is available to guard against inadvertent writes. The device also includes an extra 128 bytes of EEPROM for device identification or tracking. 3.1 Block Diagram VCC Data Inputs/Outputs I/O0-I/O7 GND OE WE OE, CE and WE Logic CE Address Inputs © 2020 Microchip Technology Inc. Data Latch Input/Output Buffers Y-Gating Y Decoder X Decoder Datasheet Cell Matrix Identification DS20006331A-page 6 Electrical Characteristics 4. Electrical Characteristics 4.1 Absolute Maximum Ratings Temperature under bias -55°C to +125°C Storage temperature -65°C to +150°C All input voltages (including NC pins) with respect to ground -0.6V to +6.25V All output voltages with respect to ground -0.6V to VCC + 0.6V Voltage on OE and A9 with respect to ground -0.6V to +13.5V Note:  Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4.2 DC and AC Operating Range Table 4-1. DC and AC Operating Range Operating Temperature (Case) Industrial VCC Power Supply 4.3 AT28C010‑12 AT28C010‑15 -40°C to +85°C -40°C to +85°C 5V ± 10% 5V ± 10% DC Characteristics Table 4-2. DC Characteristics Parameter Symbol Minimum Maximum Units Input Load Current ILI — 10 μA VIN = 0V to VCC + 1V Output Leakage Current ILO — 10 μA VI/O = 0V to VCC VCC Standby Current CMOS ISB1 — 200 μA CE = VCC - 0.3V to VCC + 1V VCC Standby Current TTL ISB2 — 3 mA CE = 2.0V to VCC + 1V VCC Active Current ICC — 40 mA f = 5 MHz; IOUT = 0 mA Input Low Voltage VIL — 0.8 V Input High Voltage VIH 2.0 — V Output Low Voltage VOL — 0.45 V IOL = 2.1 mA Output High Voltage VOH1 2.4 — V IOH = -400 μA Output High Voltage CMOS VOH2 4.2 — V IOH = -100 μA; VCC = 4.5V © 2020 Microchip Technology Inc. Datasheet Test Conditions DS20006331A-page 7 Electrical Characteristics 4.4 Pin Capacitance Table 4-3. Pin Capacitance(1,2) Symbol Typical Maximum Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note:  1. This parameter is characterized but is not 100% tested in production. 2. f = 1 MHz, TA = 25°C © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 8 Device Operation 5. Device Operation READ: The AT28C010 is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the highimpedance state when either CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention in their system. BYTE WRITE: A low pulse on the WE or CE input with CE or WE low (respectively) and OE high initiates a write cycle. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. Once a byte write is started, it will automatically time itself to completion. Once a programming operation is initiated and for the duration of tWC, a read operation will effectively be a polling operation. PAGE WRITE: The page write operation of the AT28C010 allows 1 to 128‑byte of data to be written into the device during a single internal programming period. A page write operation is initiated in the same manner as a byte write; the first byte written can then be followed by 1 to 127 additional bytes. Each successive byte must be written within 150 µs (tBLC) of the previous byte. If the tBLC limit is exceeded, the AT28C010 will cease accepting data and commence the internal programming operation. All bytes during a page write operation must reside on the same page as defined by the state of the A7‑A16 inputs. For each WE high‑to‑low transition during the page write operation, A7‑A16 must be the same. The A0 to A6 inputs are used to specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur. DATA POLLING: The AT28C010 features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle, an attempted read of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at anytime during the write cycle. TOGGLE BIT: In addition to DATA Polling, the AT28C010 provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write cycle. DATA PROTECTION: If precautions are not taken, inadvertent writes may occur during transitions of the host system power supply. Microchip incorporated both hardware and software features that will protect the memory against inadvertent writes. HARDWARE PROTECTION: Hardware features protect against inadvertent writes to the AT28C010 in the following ways: • VCC sense – if VCC is below 3.8V (typical), the write function is inhibited • VCC power‑on delay – once VCC has reached 3.8V, the device will automatically time out 5 ms (typical) before allowing a write • write inhibit – holding any one of OE low, CE high or WE high inhibits write cycles • noise filter – pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a write cycle SOFTWARE DATA PROTECTION: A software-controlled data protection feature has been implemented on the AT28C010. When enabled, the software data protection (SDP) will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28C010 is shipped with SDP disabled. SDP is enabled by the host system issuing a series of three write commands; three specific bytes of data are written to three specific addresses (refer to Software Data Protection Algorithm). After writing the 3‑byte command sequence and after tWC, the entire AT28C010 will be protected against inadvertent write operations. It should be noted that, once protected, the host may still perform a byte or page write to the AT28C010. This is done by preceding the data to be written by the same 3‑byte command sequence used to enable SDP. Once set, SDP will remain active unless the disable command sequence is issued. Power transitions do not disable SDP and SDP will protect the AT28C010 during power‑up and power‑down conditions. All command sequences must conform to the page write timing specifications. The data in the enable and disable command sequences is not written to the device and the memory addresses used in the sequence may be written with data in either a byte or page write operation. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 9 Device Operation After setting SDP, any attempt to write to the device without the 3‑byte command sequence will start the internal write timers. No data will be written to the device; however, for the duration of tWC, read operations will effectively be polling operations. DEVICE IDENTIFICATION: An extra 128 of EEPROM memory are available to the user for device identification. By raising A9 to 12V ± 0.5V and using address locations 1FF80H to 1FFFFH, the bytes may be written to or read from in the same manner as the regular memory array. OPTIONAL CHIP ERASE MODE: The entire device can be erased using a 6‑byte software code. See Software Chip Erase application note for details. 5.1 Operating Modes Table 5-1. Operating Modes Mode CE OE WE I/O Read VIL VIL VIH DOUT Write(1) VIL VIH VIL DIN VIH X(2) X High-Z Write Inhibit X X VIH Write Inhibit X VIL X Output Disable X VIH X Standby/Write Inhibit High-Z Note:  1. Refer to AC Programming Waveforms. 2. X can be VIL or VIH. 5.2 AC Read Characteristics Table 5-2. AC Read Characteristics Parameter Symbol AT28C010‑12 AT28C010‑15 Units Min. Max. Min. Max. Address to Output Delay tACC — 120 — 150 ns CE to Output Delay tCE(1) — 120 — 150 ns OE to Output Delay tOE(2) 0 50 0 55 ns 0 50 0 55 ns tOH 0 — 0 — ns tCEPH(5) 50 — 50 — ns CE or OE to Output Float Output Hold from OE, CE or Address, whichever occurred first CE Pulse High Time © 2020 Microchip Technology Inc. (3,4) tDF Datasheet DS20006331A-page 10 Device Operation Note:  1. CE may be delayed up to tACC‑tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE‑tOE after the falling edge of CE without impact on tCE or by tACC‑tOE after an address change without impact in tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. 5. If CE is de-asserted, it must remain de-asserted for at least 50 ns during read operations otherwise incorrect data may be read. 5.3 AC Read Waveforms tCE tOE tOH tACC tDF High-Z Note:  1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. 5. If CE is de-asserted, it must remain de-asserted for at least 50 ns during read operations otherwise incorrect data may be read. 5.4 Input Test Waveforms and Measurement Level 3.0V AC DRIVING LEVELS AC MEASUREMENT LEVELS 1.5V 0.0V © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 11 Device Operation 5.5 Output Test Load 5.0V 1.8K OUTPUT PIN 100 pF 1.3K 5.6 AC Write Characteristics Table 5-3. AC Write Characteristics Parameter Symbol Minimum Maximum Units Address, OE Set-Up Time tAS, tOES 0 — ns Address Hold Time tAH 50 — ns Chip Select Set-Up Time tCS 0 — ns Chip Select Hold Time tCH 0 — ns Write Pulse Width (WE or CE) tWP 100 — ns Data Set-Up Time tDS 50 — ns tDH, tOEH 0 — ns Data, OE Hold Time © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 12 Device Operation 5.7 AC Write Waveforms 5.7.1 WE Controlled OE tOES tOEH ADDRESS tAS CE tAH tCH tCS WE tWPH tWP tDS tDH DATA IN 5.7.2 CE Controlled OE tOES tOEH ADDRESS tAS WE tAH tCH tCS CE tWPH tWP tDS tDH DATA IN © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 13 Device Operation 5.8 Page Mode Characteristics Table 5-4. Page Mode Characteristics Parameter 5.9 Symbol Minimum Maximum Units Write Cycle Time tWC — 10 ms Address Set-Up Time tAS 0 — ns Address Hold Time tAH 50 — ns Data Set-Up Time tDS 50 — ns Data Hold Time tDH 0 — ns Write Pulse Width tWP 100 — ns Byte Load Cycle Time tBLC — 150 µs Write Pulse Width High tWPH 50 — ns Page Mode Write Waveforms(1,2) OE CE WE A0-A16 tWPH tWP tAS tBLC tDH tAH VALID ADD tDS DATA VALID DATA BYTE 0 BYTE 1 BYTE 2 BYTE 3 BYTE 126 BYTE 127 tWC Note:  1. A7 through A16 must specify the page address during each high-to-low transition of WE (or CE). 2. OE must be high only when WE and CE are both low. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 14 Device Operation 5.10 Chip Erase Waveforms VIH CE VIL VH(3) OE VIH tS(1) tH VIH WE VIL tW(2) Note:  1. tS = 5 msec (minimum) 2. tW = tH = 10 msec (minimum) 3. VH = 12.0V ± 0.5V © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 15 Device Operation 5.11 Software Data Protection Enable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 WRITES ENABLED(2) LOAD DATA XX TO ANY ADDRESS(3) LOAD LAST BYTE TO LAST ADDRESS ENTER DATA PROTECT STATE Note:  1. Data format: I/O7-I/O0 (Hex); Address format: A16-A0 (Hex). 2. Write-Protect state will be activated at end of write even if no other data is loaded. 3. 1 to 128 bytes of data are loaded. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 16 Device Operation 5.12 Software Data Protection Disable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 80 TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 20 TO ADDRESS 5555 EXIT DATA PROTECT STATE(2) LOAD DATA XX TO ANY ADDRESS(3) LOAD LAST BYTE TO LAST ADDRESS Note:  1. Data format: I/O7-I/O0 (Hex); Address format: A16-A0 (Hex). 2. Write-Protect state will be deactivated at end of write period even if no other data is loaded. 3. 1 to 128 bytes of data are loaded. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 17 Device Operation 5.13 Software Protected Program Cycle Waveform(1,2,3) OE CE tWPH tWP WE tAS tBLC tAH BYTE ADDRESS A0-A6 A7-A16 tDS tDH PAGE ADDRESS DATA BYTE 0 BYTE 126 BYTE 127 tWC Note:  1. A0-A16 must conform to the addressing sequence for the first 3 bytes as shown above. 2. After the command sequence has been issued and a page write operation follows, the page address inputs (A7‑A16) must be the same for each high‑to‑low transition of WE (or CE). 3. OE must be high only when WE and CE are both low. 5.14 Data Polling Characteristics(1) Table 5-5. Data Polling Characteristics Parameter Symbol Minimum Typical Maximum Units Data Hold Time tDH 10 — — ns OE Hold Time tOEH 10 — — ns tOE — — — ns tWR 0 — — ns OE to Output Delay(2) Write Recovery Time Note:  1. These parameters are characterized and not 100% tested. 2. See AC Read Characteristics. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 18 Device Operation 5.15 Data Polling Waveforms WE CE tOEH OE tDH tOE I/O7 5.16 High-Z AN A0-A16 tWR AN AN AN AN Toggle Bit Characteristics(1) Table 5-6. Toggle Bit Characteristics Parameter Symbol Minimum Typical Maximum Units Data Hold Time tDH 10 — — ns OE Hold Time tOEH 10 — — ns OE to Output Delay(2) tOE — — — ns tOEHP 150 — — ns tWR 0 — — ns OE High Pulse(2) Write Recovery Time Note:  1. These parameters are characterized and not 100% tested. 2. See AC Read Characteristics. 5.17 Toggle Bit Waveforms WE CE tOEH OE tDH I/O6 (2) © 2020 Microchip Technology Inc. tOE High-Z Datasheet tWR DS20006331A-page 19 Device Operation Note:  1. Toggling either OE or CE or both OE and CE will operate toggle bit. 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 20 Packaging Information 6. Packaging Information 6.1 Package Marking Information AT28C010: Package Marking Information (Industrial Grade) 32-Lead TSOP Topside 32-Lead PLCC Backside Topside Backside Δ Δ ATMEL AT28C010@ %%U-19506V YYWWNNN ATMEL AT28C010@ %%U-19506V YYWWNNN %%= Access Time 12: 120 ns 15: 150 ns @ = Write Endurance Rating Blank: Standard (10K) E: Extended (100K) Lot Trace Code YWWNNN: Lot Trace Code © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 21 M Packaging Information Packaging Diagrams and Parameters 32-Lead Plastic Leaded Chip Carrier (L) – Rectangle [PLCC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 #LEADS=ND E #LEADS=NE E1 NOTE 1 N12 3 CH2 x 45° CH1 x 45° CH3 x 30° A A1 c b1 b e D2 E2 Units Dimension Limits Number of Pins Pitch A3 INCHES MIN NOM N 32 e .050 Pins along Length ND 7 Pins along Width NE MAX 9 Overall Height A .125 – .140 Contact Height A1 .060 – .095 Standoff § A3 .015 – – Corner Chamfer CH1 .042 – .048 Chamfers CH2 – – .020 Side Chamfer Height CH3 .023 – .029 Overall Length D .485 – .495 Overall Width E .585 – .595 Molded Package Length D1 .447 – .453 Molded Package Width E1 .547 – .553 Footprint Length D2 .376 – .446 Footprint Width E2 .476 – .546 Lead Thickness c .008 – .013 b1 .026 – .032 Upper Lead Width Lower Lead Width b .013 – .021 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic. 3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. Microchip Technology Drawing C04-023B © 2007 Microchip Technology Inc. DS00049AR-page 68 © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 22 Packaging Information 32-Lead (8 x 20 mm package) Plastic Thin Small Outline Package, Type I (TSOP) PIN 1 0º ~ 8º c Pin 1 Identifier D1 D L b e L1 A2 E A GAGE PLANE SEATING PLANE COMMON DIMENSIONS (Unit of measure = mm) A1 MIN NOM MAX A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 SYMBOL Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15mm per side and on D1 is 0.25mm per side. 3. Lead coplanarity is 0.10mm maximum. L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e NOTE 0.50 BASIC 10/18/01 TITLE 32T, 32-lead (8 x 20mm package) Plastic Thin Small Outline Package, Type I (TSOP) DRAWING NO. REV. 32T B Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http:// www.microchip.com/packaging. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 23 Revision History 7. Revision History Revision A (March 2020) Updated to the Microchip template. Microchip DS20006331 replaces Atmel document 0353. Added marking details and product identification system details. Atmel Document 0353 Revision I (August 2009) Updated AC Characteristics and ordering information. Atmel Document 0353 Revision I (July 2009) Added a revision history page and update this version "I" with the changes (AC Characteristics and ordering info from the word file). © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 24 The Microchip Website Microchip provides online support via our website at http://www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes: • • • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Product Change Notification Service Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will receive email notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, go to http://www.microchip.com/pcn and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Embedded Solutions Engineer (ESE) Technical Support Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document. Technical support is available through the website at: http://www.microchip.com/support © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 25 Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. AT28 C 010 (E)- 12 T U AT28 = Parallel EEPROM U = -40°C to +85°C Industrial Temperature Grade, matte Sn Terminal Finish C = 4.5V to 5.5V 010 = 1 Mbit Size Blank = 10K Standard Write Endurance E = 100K Extended Write Endurance Option J = 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) T = 32-Lead, Plastic Thin Small Outline Package (TSOP) 12 = 120 ns Speed 15 = 150 ns Speed Examples Table 11-1. AT28C010 Ordering Information Ordering Code Package Number tACC(ns) Quantity AT28C010-12JU P3X AT28C010-12JU-T P3X AT28C010-12TU 32T AT28C010-12TU-T 32T Reel 1500 AT28C010-15JU P3X Tube 32 AT28C010-15JU-T P3X AT28C010-15TU 32T AT28C010-15TU-T 32T Operating Range Tube 32 120 150 Reel 750 Tray 156 Industrial (-40°C to +85°C) Reel 750 Tray 156 Reel 1500 Table 11-2. AT28C010E Ordering Information Ordering Code Package Number tACC(ns) Quantity AT28C010E-12JU P3X AT28C010E-12JU-T P3X AT28C010E-12TU 32T AT28C010E-12TU-T 32T Reel 1500 AT28C010E-15JU P3X Tube 32 AT28C010E-15JU-T P3X AT28C010E-15TU 32T AT28C010E-15TU-T 32T © 2020 Microchip Technology Inc. Operating Range Tube 32 120 150 Reel 750 Tray 156 Industrial (-40°C to +85°C) Reel 750 Tray 156 Reel 1500 Datasheet DS20006331A-page 26 Package Types P3X 32-Lead, Plastic J-leaded Chip Carrier (PLCC) 32T 32-Lead, Plastic Thin Small Outline Package (TSOP) Options Blank E Standard Device: Endurance = 10K Write Cycles; Write Time 10 ms High Endurance Option: Endurance = 100K Write Cycles Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • • • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 27 ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2020, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-5808-1 AMBA, Arm, Arm7, Arm7TDMI, Arm9, Arm11, Artisan, big.LITTLE, Cordio, CoreLink, CoreSight, Cortex, DesignStart, DynamIQ, Jazelle, Keil, Mali, Mbed, Mbed Enabled, NEON, POP, RealView, SecurCore, Socrates, Thumb, TrustZone, ULINK, ULINK2, ULINK-ME, ULINK-PLUS, ULINKpro, µVision, Versatile are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. Quality Management System For information regarding Microchip’s Quality Management Systems, please visit http://www.microchip.com/quality. © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 28 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/support Web Address: http://www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 © 2020 Microchip Technology Inc. Datasheet DS20006331A-page 29
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