ZigBit 2.4GHz Single chip Wireless Module
ATZB-S1-256-3-0-C
DATASHEET
Features
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Notes:
Ultra compact size (30.0 × 20.0mm)
High RX sensitivity (-97dBm)
Outperforming link budget (up to 100.6dB)
Up to +3.6dBm output power
Very low power consumption:
• 9.6mA in RX mode (1)
• 16.4mA in TX mode (1)
• 0.6µA in sleep mode (2)
Ample memory resources (256K Bytes In-System, Self-Programmable Flash
memory, 8K Bytes EEPROM, 32K Bytes SRAM)
Wide range of interfaces (both analog and digital)
• 4- wire SPI, TWI
• ISP, JTAG
• 2 Analog comparator Input
• UART, USART
• Timer, PWM
• 4 ADC lines
• External Clock Input, Internal Clock Output
• Upto 31 lines configurable as GPIO
Preassigned Atmel® MAC address that can be used on end product
Capability to use MAC address into the internal EEPROM
IEEE® 802.15.4 compliant Transceiver
2.4GHz ISM band
Serial bootloader
High Performance Low power AVR® 8-bit Microcontroller
Rapid design-in with built-in Chip Antenna
RF Test point using MS-147 RF connector
Small physical footprint and low profile for optimum fit in very small application
boards
Mesh networking capability
Easy-to-use low cost development kit
Single source of support for HW and SW
Worldwide license-free operation
1. MCU is in active state with 3V Supply, CPU clock @ 16MHz, RX RPC enabled (for RX current),
PHY_TX_PWR=0x0 (for TX current), All digital outputs pulled high.
2. Controller Sleep Mode: SLEEP_MODE_PWR_DOWN.
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Table of Contents
1. Introduction ........................................................................................ 3
1.1
1.2
1.3
1.4
Summary ........................................................................................................... 3
Applications ....................................................................................................... 3
Abbreviations and Acronyms ............................................................................ 3
Related Documents........................................................................................... 5
2. ZigBit Module Overview ..................................................................... 6
2.1
Overview ........................................................................................................... 6
3. Specifications ..................................................................................... 8
3.1
3.2
3.3
3.4
3.5
3.6
3.7
Electrical Characteristics ................................................................................... 8
3.1.1
Absolute Maximum Ratings ................................................................ 8
3.1.2
Power Supply...................................................................................... 8
3.1.3
RF Characteristics .............................................................................. 9
3.1.4
Microcontroller Characteristics.......................................................... 10
3.1.5
Module Interfaces Characteristics ..................................................... 10
Physical/Environmental Characteristics and Outline ....................................... 10
Pin Configuration............................................................................................. 11
Antenna Orientation Recommendation ........................................................... 12
Mounting Information ...................................................................................... 12
Soldering Profile .............................................................................................. 16
Antenna Reference Designs ........................................................................... 16
4. Schematics ...................................................................................... 16
4.1
4.2
Handling Instructions....................................................................................... 17
General Recommendations ............................................................................ 17
5. Persistence Memory ........................................................................ 17
6. Ordering Information ........................................................................ 19
7. Agency Certifications ....................................................................... 20
7.1
7.2
7.3
United States (FCC) ........................................................................................ 20
European Union (ETSI) ................................................................................... 20
Industry Canada (IC) Compliance statements ................................................ 21
8. Revision History ............................................................................... 22
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1.
Introduction
1.1
Summary
ATZB-S1-256-3-0-C ZigBit® is an ultra-compact and low-power 2.4GHz IEEE 802.15.4/ZigBee® OEM module from
Atmel. Based on the innovative mixed-signal hardware platform from Atmel, this module uses the ATmega256RFR2
SoC with the AVR 8-Bit Microcontroller and a high data rate transceiver for the 2.4GHz ISM band. The radio transceiver
provides high data rates from 250kb/s up to 2Mb/s, frame handling, outstanding receiver sensitivity and high transmit
output power enabling a very robust wireless communication. The module is designed for wireless sensing, monitoring,
control, data acquisition applications, to name a few. This ZigBit module eliminates the need for costly and timeconsuming RF development, and shortens time-to-market for wireless applications.
The module has an MS-147 RF connector that can be used as an RF test port. The built-in chip antenna is designed
and tuned for the ZigBit design to enable quick integration of the ZigBit into any application.
1.2
Applications
The ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self-organizing
mesh network, while optimizing network traffic and minimizing power consumption.
For detailed Software support information, please visit http://www.atmel.com/products/wireless.
The applications include, but are not limited to:
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•
•
1.3
Building automation & monitoring
o Lighting controls
o Wireless smoke- and CO-detectors
o Structural integrity monitoring
HVAC monitoring & control
Inventory management
Environmental monitoring
Security
Water metering
Industrial monitoring
o Machinery condition and performance monitoring
o Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity, vibration, etc.
Automated meter reading (AMR)
Abbreviations and Acronyms
ADC
Analog-to-Digital Converter
API
Application Programming Interface
DC
Direct Current
DTR
Data Terminal Ready
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
Electrostatic Discharge
GPIO
General Purpose Input/Output
HAF
High Frequency
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
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HVAC
Heating, Ventilating, and Air Conditioning
HW
Hardware
I2 C
Inter-Integrated Circuit
IEEE
Institute of Electrical and Electronics Engineers
IRQ
Interrupt Request
ISM
Industrial, Scientific and Medical radio band
JTAG
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
MAC
Medium Access Control layer
MCU
Microcontroller Unit. In this document it also means the processor, which is the core of a ZigBit
module
NRE
Network layer
OEM
Original Equipment Manufacturer
OTA
Over-The-Air upgrade
PA
Power Amplifier
PCB
Printed Circuit Board
PER
Package Error Ratio
RAM
Random Access Memory
RF
Radio Frequency
RTS/CTS
Request to Send/ Clear to Send
RX
Receiver
SMA
Surface Mount Assembly
SoC
System on Chip
SPI
Serial Peripheral Interface
SW
Software
TTM
Time-To-Market
TX
Transmitter
UART
Universal Asynchronous Receiver/Transmitter
USART
Universal Synchronous/Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
ZigBee, ZigBee PRO
Wireless networking standards targeted at low-power applications
802.15.4
The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network
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1.4
Related Documents
[1] ATmegaAllRFR2 8-bit AVR Microcontroller with 2.4GHz Transceiver for ZigBee and IEEE 802.15.4
[2] MS-147 Series Interface RF Connector with Switch, 3.9mm High, DC to 6GHz
http://www.hirose.co.jp/cataloge_hp/e35801505.pdf
[3] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium Access Control
(MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[4] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
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2.
ZigBit Module Overview
2.1
Overview
The ATZB-S1-256-3-0-C ZigBit is an ultra compact, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module.
Based on a solid combination of the latest Atmel MCU Wireless hardware platform, 2.4GHz ISM band transceiver and
Atmel Studio Wireless Composer - the ZigBit offers an unmatched combination of superior radio performance, ultra-low
power consumption and exceptional ease of integration.
Figure 2-1. ATZB-S1-256-3-0-C Block Diagram.
This ZigBit module contains the Atmel ATmega256RFR2 Microcontroller and a 2.4GHz ISM band Transceiver for
ZigBee and IEEE 802.15.4 [1]. The module features 256KB In-System Self-Programmable flash memory, 32KB SRAM
and 8KB EEPROM.
The compact all-in-one integration of MCU and Radio Transceiver inside the chip along with very minimal components
on the RF path to Antenna dramatically improves the ZigBit's compact size, range performance on signal transmission
and increases its sensitivity. This ensures stable connectivity within a larger coverage area, and helps develop
applications on smaller footprint. The MS-147 connector [2] can be used as an RF Test port.
ZigBit Module contains a complete RF/MCU design with all the necessary passive components included. The module
can be easily mounted on a simple 2-layer PCB with a minimum of required external connection. The ZigBit Module
Evaluation kit containing the ZigBit Extension board for the Atmel Xplained PRO HW Evaluation platform can be used to
develop FW using the Atmel Studio and evaluate using the Wireless Composer. Compared to a custom RF/MCU
solution, a module-based solution offers considerable savings in development time and NRE cost per unit during the
HW/FW design, prototyping, and mass production phases of product development.
All ZigBits are preloaded with a Bootloader when they are sold as Modules, either in Single units or T&R.
Depending on end-user design requirements, the ZigBit can operate as a self-contained sensor node, where it would
function as a single MCU, or it can be paired with a host processor driving the module over a serial interface.
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The MAC stack running on the host processor can then control data transmission and manages module peripherals.
Thus very minimal firmware customization is required for a successful module design-in. Third-party sensors can then
be connected directly to the module, thus expanding the existing set of peripheral interfaces.
Every ZigBit Module come pre loaded with Atmel assigned 64-bit MAC address stored in the signature bytes of the
device. This unique IEEE MAC address can be used as the MAC address of the end product, so there is no need to buy
a MAC address separately for the product using the ZigBit.
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3.
Specifications
3.1
Electrical Characteristics
3.1.1
Absolute Maximum Ratings
Table 3-1.
Absolute maximum ratings
(1)(2)
.
Parameter
Minimum
Maximum
Voltage on any pin, except RESET with respect to ground
-0.3V
3.6V (VDD max)
Input RF level
Voltage on any Analog configured pin
-0.3V
2.0V
Voltage on Aref (pin 24)
-0.3V
2.0V
Notes:
1.
a)
3.1.2
+14dBm
Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no circumstances must the
absolute maximum ratings given in this table be violated. Stresses beyond those listed under "Absolute Maximum Ratings"
may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those indicated in the
operational sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Attention! The ZigBit is an ESD-sensitive device. Precaution should be taken when handling the device in order to prevent
permanent damage.
Power Supply
Table 3-2.
Test conditions (unless otherwise stated), F = 2.45GHz, VDD = 3V, Tamb = 25°C.
Parameter
Range
Unit
Supply voltage, VDD
1.8 to 3.6
V
Active Current consumption: RX mode - RX_ON – Listening state
17.0
mA
Active Current consumption: RX in RPC Mode
9.6
mA
16.3
mA
Active Current consumption: TX mode – PLL_ON
9.9
mA
Active Current consumption: TRX_OFF
4.7
mA
0.62
µA
0.6
µA
2.4
mA
4.9
mA
0.9
mA
Active Current consumption: TX mode
(1)
– BUSY_TX – Transmit state
Sleep Current consumption: Power-save mode
Sleep Current consumption: Power-down mode
Sleep Current consumption: Standby
Sleep Current consumption: Idle
(2)
(2)
(2)
(2)
Sleep Current consumption: Ext_Standby
(2)
Note 1:
a)
Output TX power (when measuring consumption in TX mode) is +3 dBm.
Note 2:
a)
All interfaces are set to the default state (see Pin Assignment Table).
b)
JTAG is not connected.
c)
CPU Clock configured when doing this measurement – 16MHz for all modes except Power save and Power down modes
Current consumption depends on multiple factors, including but not limited to, the board design and materials, Protocol
settings, network activity, EEPROM read/write operations. It also depends on MCU load and/or peripherals used by an
application.
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3.1.3
RF Characteristics
Table 3-3.
RF characteristics.
Parameter
Condition
Typical Values
Unit
Frequency band
2.4000 to 2.4835
GHz
Numbers of channels
16
Channel spacing
5
MHz
Transmitter output power
Adjusted in 16 steps
-16.5 to +3.5
dBm
Receiver sensitivity
PER = 1%
-97
dBm
250, upto 2000
kbps
50
Ω
On-air data rate
TX output/ RX input nominal impedance
Range
Unbalanced
Open field, LoS,
Elevated
170 - 570
#
m
#
Note Range measured is Line of Sight at 10ft elevation from Ground at different combinations of orientation of
transmitter and receiver, with special conditions were there is minimal or no RF interference from other sources.
For best case orientation of the ZigBits to achieve maximum range, refer to section 3.4.
Table 3-4.
TX power settings
PHY_TX_PWR 3:0
Register value
Power register setting [dBm]
Typical Output power [dBm] (at RF connector)
0
+3.5
+3.79
1
+3.3
+3.40
2
+2.8
+3.41
3
+2.3
+2.43
4
+1.8
+2.41
5
+1.2
+1.21
6
+0.5
+0.58
7
-0.5
-0.11
8
-1.5
-1.02
9
-2.5
-1.97
10
-3.5
-3.12
11
-4.5
-4.48
12
-6.5
-6.28
13
-8.5
-8.52
14
-11.5
-11.64
15
-16.5
-16.26
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3.1.4
Microcontroller Characteristics
Table 3-5.
ATmega256RFR2 characteristics.
Parameters
3.1.5
Condition
Range
Unit
On-chip flah memory size
256K
Bytes
On-chip SRAM size
32K
Bytes
On-chip EEPROM size
8K
Bytes
Operation frequency
16
MHz
Module Interfaces Characteristics
Table 3-6.
Module interfaces characteristics.
Parameters
Condition
UART maximum baud rate
Range
Unit
115.2
Kbps
ADC resolution conversion time
Free running conversion
3 - 240
µs
ADC input resistance
Static load resistor of input signal
100
MΩ
ADC reference voltage (VREF)
AVDD=1.8V
1.5V to AVDD
V
ADC input voltage
AVDD=1.8V
0 - AVDD
V
TWI maximum clock
400
kHz
GPIO High level input voltage
Except nRST
Min 0.7 VDD
V
GPIO Low level input voltage
Except nRST
Max 0.3 VDD
V
GPIO High level input voltage
nRST
Min 0.9 VDD
V
GPIO Low level input voltage
nRST
Max 0.1 VDD
V
GPIO High level output voltage VOH
IOH = -12mA, VDD = 3.6V
IOH = -6mA, VDD = 1.8V
Min VDD – 0.4
V
GPIO Low level output voltage VOL
IOL = 16mA, VDD = 3.6V
IOL = 10mA, VDD = 1.8V
Max 0.4
V
32.768
kHz
Real-time oscillator frequency
3.2
Physical/Environmental Characteristics and Outline
Table 3-7.
Physical characteristics.
Parameters
Value
Size
30.0 x 20.0mm
Operating temperature range
-40°C to +85°C
Comments
-40°C to +85°C operational
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3.3
Pin Configuration
Table 3-8.
ATZB-S1-256-3-0-C Pinout description
Pinout
Pin descriptions
Function
1
AVSS
Analog Ground
2
AVSS
Analog Ground
3
DEVDD
Digital Power input pin
4
DEVDD
Digital Power input pin
5
RSTN
RESET
6
PB0/SSN/PCINT0
SPI
7
PB2/MOSI/PDI/PCINT2
SPI/ ISP Prog
8
PB3/MISO/PDO/PCINT3
SPI/ ISP Prog
9
PB1/SCK/PCINT1
SPI/ ISP Prog
10
PE2/AINO
GPIO/AINO
11
PE3/AIN1/OC3A
GPIO/AIN1/PWM out
12
DVSS
Digital Ground
13
PD2/RXD1/INT2
UART
14
PD3/TXD1/INT3
UART
15
PD5/XCK1
USART
16
17
PD4/ICP1
PD6/T1
TIMER counter input trigger
TC
18
PG2/AMR
GPIO/TC
19
PB4/OC2A/PCINT4
PWM/PCINT4
20
PB6/OC1B/PCINT6
PWM/PCINT6
21
PB7/OC0A/OC1C/PCINT7
PWM/PCINT/GPIO
22
PE0:RXD0:PCINT8
GPIO/PCINT8/RXD0
23
PE1:TXD0
GPIO/TXD0
24
25
AREF
PF0/ADC0
Adc ref
ADC/ GPIO
26
PF1/ADC1
ADC/ GPIO
27
PF2/ADC2/DIG2
ADC/ GPIO
28
PF3/ADC3/DIG4
ADC/ GPIO
29
DVSS
Digital Ground
30
PF4/ADC4/TCK
JTAG
31
PF5/ADC5/TMS
JTAG
32
PF6/ADC6/TDO
JTAG
33
PF7/ADC7/TDI
JTAG
34
PG5/OC0B
pwm output timer
35
36
PE4/OC3B/INT4
PD0/SCL/INT0
Wakeup INT
TWI/INT/GPIO
37
PD1/SDA/INT1
TWI/INT/GPIO
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Pinout
Pin descriptions
Function
38
CLKI
Ext CLKI/ ISP Programming
39
PE7/ICP3/INT7/CLKO
Clock out put
40
PD7/T0
TC
41
DVSS
Digital Ground
42
DVSS
Digital Ground
3.4
Antenna Orientation Recommendation
The Antenna in this module is designed to provide the best possible LoS range in the direction indicated in this
illustration.
3.5
Mounting Information
The Figure below shows the PCB layout recommended for a ZigBit module. Neither via-holes nor wires are allowed on
the PCB upper layer in the area occupied by the module. As a critical requirement, RF_GND pins should be grounded
via several via-holes to be located right next to the pins thus minimizing inductance and preventing both mismatch and
losses.
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Figure 3-1. ATZB-S1-256-3-0-C Dimensions
Figure 3-2. ATZB-S1-256-3-0-C Pinout
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
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Figure 3-3. ATZB-S1-256-3-0-C Foot Print Dimensions
Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)
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Figure 3-5. Figure 3-4. ATZB-S1-256-3-0-C Mounting Information (Preferred Placement)
The ZigBit’s location and orientation on the carrier board is illustrated in the above Mounting information drawing. The
Recommended placements of ZigBit on Carrier Board needs to be accurately followed to ensure performance on the
end application.
Please note the areas in the Mounting information drawing for copper and component keep out to ensure superior
performance of the ZigBits on your End application. Copper keep out recommended in the drawing applies for all layers
of the carrier board
The dimension A of the carrier board should be equal to or greater than 20mm. Similarly, the dimension B should be
equal to or greater than 30mm.
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3.6
Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-9.
Table 3-9.
Profile feature
Green package
Average ramp-up rate (217°C to peak)
3°C/s max
Preheat temperature 175°C ±25°C
180s max
Temperature maintained above 217°C
60s to 150s
Time within 5°C of actual peak temperature
20s to 40s
Peak temperature range
260°C
Ramp-down rate
6°C/s max
Time within 25°C to peak temperature
8 minutes
Note:
3.7
(1)
Soldering Profile .
1.
The package is backward compatible with PB/Sn soldering profile.
Antenna Reference Designs
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors are the board
material and thickness, shields, the material used for enclosure, the board neighborhood, and other components
adjacent to antenna. Following guidelines need to be followed when designing the base board for the ZigBit.
General Recommendations:
•
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
•
Placing high profile components next to antenna should be avoided.
•
Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
•
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit’s RF band
frequency.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of
high frequency may penetrate the board thus making the edges of the board radiate, which may distort the antenna
pattern. To eliminate this effect, metalized and grounded holes/vias must be placed around the board's edges.
4.
Schematics
The following schematic drawings for the ATZB-S1-256-3-0-c are in the following order_
•
Top level schematics
•
Connector schematics
•
ATmega256RFR2 schematics
•
ATmega256RFR2 RF antenna schematics
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
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1
2
3
4
5
6
7
8
A
A
RFR2
mega256RFR2_RFR2.SchDoc
Connector
mega256RFR2_Connector.SchDoc
SPI
SPI
TWI
TWI
UART0
RF_Antenna
UART1
COE1
E1
COLABEL1
LABEL1
UART0
Product number/revision
Serial number
UART1
PIE101
Label ZigBit Shield
ANALOG COMPARATOR
FIDUCIAL
FIDUCIAL 1.5mm
ANALOG COMPARATOR
B
B
Timer/Counter
Timer/Counter
ADC
RF_N
RF_N
RF_P
RF_P
PCINT/ PWM
COTEST
PROCEDURE
TEST
PROCEDURE
COTESTSW
SW
TEST
ADC
$ >_
PCINT/ PWM
A11-0200
CLK IO
CLK IO
JTAG
A12-0669
JTAG
wk_INT
wk_INT
B
C
a
C
COPCB1
PCB1
COPCBA
PCBA
A12-0627
A08-1569
ZigBit XmegaRFR2 board PCB
ATMEL Norway
Sanjay Yadav
Vestre Rosten 79 MSK
D
N-7075 TILLER
D
*
NORWAY
Date:
7/25/2013
Document number: *
2:34:35 PM
PAGE:
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of
Revision: A
TITLE: *
mega256RFR2_TopLevel.SchDoc
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1
2
3
4
5
6
7
8
A
A
PD7_T0
nRST
POSPI0SS
POSPI0SCK
POSPI0MOSI
POSPI0MISO
POSPI
SPI
SPI
PE7_ICP3_INT7_CLKO
SS
MOSI
MISO
SCK
CLKI
VCC_3V3
2
GND_RF
3
4
5
nRST
ANALOGCOMPARATOR0AIN1
COMPARATOR
POANALOG
POANALOG
COMPARATOR0AIN0
COMPARATOR
AIN1
PB0_SSN_PCINT0
6
PB2_MOSI_PDI_PCINT2
7
PB3_MISO_PDO_PCINT3
8
PB1_SCK_PCINT1
9
Analog Comparator I/P
B
10
PE2_AINO
PE3_AIN1_OC3A
11
12
GND_RF
UART1
POUART10XLK1
POUART10UART0TX1
POUART10UART0RX1
POUART1
13
PD2_RXD1_INT2
PD3_TXD1_INT3
PD5_XCK1
UART_RX1
UART_TX1
XLK1
14
15
UART1
16
17
18
Timer/Counter
POTIMER0COUNTER0AMR0INPUT
POTIMER0COUNTER
POTIMER0COUNTER0PWM
POTIMER0COUNTER0TRIGGER
POTIMER0COUNTER0T1
POTIMER0COUNTER0T00IRQ
INPUT
OUT TC0
TC2
TC1
19
PD4_ICP1
PD6_T1
PG2_AMR
Trigger Input TC1
T1
AMR/input TC2
PWM Out TC0
T0/IRQ
20
PG5_OC0B
POCLK
POCLK
IO0CLKI
CLK IO0CLKO
IO IO
CLK IO
CLKI
Z1
1
AIN0
CLKO
21
GND
GND
GND
GND
VDD
PD7/T0
VDD
PE7/ICP3/INT7/CLKO
RSTN
CLKI
PB0/SSN/PCINT0
PD1/SDA/INT1
PB2/MOSI/PDI/PCINT2
PD0/SCL/INT0
PB3/MISO/PDO/PCINT3
PE4/OC3B/INT4
PB1/SCK/PCINT1
PG5/OC0B
PE2/XCK0/AIN0
PF7/ADC7/TDI
PE3/OC3A/AIN1
PF6/ADC6/TDO
GND
PF5/ADC5/TMS
PD2/RXD1/INT2
PF4/ADC4/TCK
PD3/TXD1/INT3
GND
PD5/XCK1
PF3/ADC3/DIG4
PD4/ICP1
PF2/ADC2/DIG2
PD6/T1
PF1/ADC1
PG2/AMR
PF0/ADC0
PB4/OC2A/PCINT4
AREF
PB6/OC1B/PCINT6
PE1/TXD0
PB7/OC0A/OC1C/PCINT7
PE0/RXD0/PCINT8
42
41
40
TWI
GND_RF
PD7_T0
PD1_SDA_INT1
PD0_SCL_INT0
POTWI0SDA
POTWI0SCL
POTWI
TWI
SDA
SCL
39
38
37
36
35
34
Wake up INT
PE4_OC3B_INT4
PG5_OC0B
WK_INT
POWK0INT
PG5_OC0B
B
33
32
nRST
PF7_ADC7_TDI
PF6_ADC6_TDO
PF5_ADC5_TMS
PF4_ADC4_TCK
31
30
nRST
TDI
TDO
TMS
TCK
JTAG
POJTAG0TMS
POJTAG0TDO
POJTAG0TDI
POJTAG0TCK
POJTAG0NRST
POJTAG
JTAG
29
28
27
GND_RF
26
25
24
23
PF3_ADC3_DIG4
PF2_ADC2_DIG2
PF1_ADC1
PF0_ADC0
AREF
ADC3
ADC2
ADC1
ADC0
AREF
ADC
POADC0AREF
POADC0ADC3
POADC0ADC2
POADC0ADC1
POADC0ADC0
POADC
ADC
22
PD7_T0
Timer/Counter
ZB_RFR2_outline
C
PCINT/
PWM
POPCINT0
POPCINT0
PWM0PWM0INT4
PWM0PWM0INT6
PWM0PWM0INT7
PWM
C
PE1_TXD0
PE0_PCINT8
PB4_OC2A_PCINT4
PB6_OC1B_PCINT6
PB7_OC0A_OC1C_PCINT7
PWM/INT4
PWM/INT6
PWM/INT7
UART_TXD0
UART_RXD0
UART0
UART0
POUART00UART0TXD0
POUART00UART0RXD0
POUART0
PCINT/ PWM output
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1
2
3
4
5
6
7
8
4
3
4
RF_VCC_3V3
PIR102
PIR202
COR2
R2
COR1
R1
PORF0P
RF_P
RF_P
PORF0N
RF_N
RF_N
14
15
16
PIU1016
17
PIU1017
18
PIU1018
19
PIU1019
TOSC2
PIU1014
PIU1015
FC-135 32.768 kHz
PIQ202
TOSC1
PIC1402 PIC1401
20
10 pF
COC2
C2
1uF
PIU1020
PIC202
PIC201
21
PIU1021
22
PIU1022
GND_RF
PG0:DIG3
PG1:DIG1
PG2 / AMR
PG3:TOSC2
PG4:TOSC1
PG5:OC0B
B
TWI
POTWI0SDA
POTWI0SCL
POTWI
TWI
UART_RX1
UART_TX1
XLK1
UART1
POUART10XLK1
POUART10UART0TX1
POUART10UART0RX1
POUART1
GND_RF
PD0_SCL_INT0
PD1_SDA_INT1
PD2_RXD1_INT2
PD3_TXD1_INT3
PD5_XCK1
CLKI
UART
PIR302
Timer/Counter
POTIMER0COUNTER0AMR0INPUT
POTIMER0COUNTER
POTIMER0COUNTER0PWM
POTIMER0COUNTER0TRIGGER
POTIMER0COUNTER0T1
POTIMER0COUNTER0T00IRQ
INPUT
OUT TC0
TC2
TC1
Timer/Counter
PG2_AMR
PG5_OC0B
PD4_ICP1
PD6_T1
PD7_T0
33
PIU1033
36
PIU1036
37
PIU1037
38
PIU1038
39
PIU1039
40
PIU1040
41
PIU1041
42
PIU1042
43
PIU1043
COR3
R3
AMR/input TC2
PWM Out TC0
Trigger Input TC1
T1
T0/IRQ
25
PIU1025
26
PIU1026
27
PIU1027
28
PIU1028
29
PIU1029
30
PIU1030
31
PIU1031
32
PIU1032
PIU106
AREF
PIU1062
AVSS
AVDD
EVDD
AVSS:ASVSS
PIU1061
60
PIU1060
59
PIU1059
58
PIU1058
XTAL1
XTAL2
PIU1057
56
PIU1056
DVSS:DSVSS
DVDD
DVDD
10 k
PIR301
IRQ
GND_RF
PD0:SCL:INT0
PD1:SDA:INT1
PD2:RXD1:INT2
PD3:TXD1:INT3
PD4:ICP1
PD5:XCK1
PD6:T1
PD7:T0
6
5
PIU105
4
PIU104
3
PIU103
2
PIU102
1
PIU101
64
PIU1064
63
PIU1063
PF7:ADC7:TDI
PF6:ADC6:TDO
PF5:ADC5:TMS
PF4:ADC4:TCK
PF3:ADC3:DIG4
PF2:ADC2:DIG2
PF1:ADC1
PF0:ADC0
GND_RF
SCL
SDA
PF3_ADC3_DIG4
PF2_ADC2_DIG2
PF1_ADC1
PF0_ADC0
AREF
GND_RF
PE7:ICP3:INT7:CLKO
PE6:T3:INT6
PE5:OC3C:INT5
PE4:OC3B:INT4
PE3:OC3A:AIN1
PE2:XCK0:AIN0
PE1:TXD0
PE0:RXD0:PCINT8
CLKI
PB0:SSN:PCINT0
PB1:SCK:PCINT1
PB2:MOSI:PDI:PCINT2
PB3:MISO:PDO:PCINT3
PB4:OC2A:PCINT4
PB5:OC1A:PCINT5
PB6:OC1B:PCINT6
PB7:OC0A:OC1C:PCINT7
PIC101
PIC102
ADC3
ADC2
ADC1
ADC0
AREF
POADC0AREF
POADC0ADC3
POADC0ADC2
POADC0ADC1
POADC0ADC0
POADC
ADC
ADC
COC1 C1 Capacitor placed
C1
100n closed to IC Pin 62.
GND_RF
62
61
PIC301
PIC302
GND_RF
RF_VCC_3V3
57
COC3
C3
1uF
COC4
C4
PIC401
10 pF
PIC402
GND_RF
GND_RF
2
XTAL1
XTAL2
53
PIU1053
52
PIU1052
51
PIU1051
50
PIU1050
49
PIU1049
48
PIU1048
47
PIU1047
46
PIQ102
PIQ101
COQ1
Q1
16.0MHz
4
PIQ104
B
PIQ103
3
COC11
C11
COQ2
Q2
POJTAG0TMS
POJTAG0TDO
POJTAG0TDI
POJTAG0TCK
POJTAG0NRST
POJTAG
JTAG
JTAG
1
7
AVSS_RFP
8
RFP
11
TST
12
PIU1012 RSTN
13
PIU1013 RSTON
9
PIU10 PIU109 PIU108 PIU107
COU1 GND_RF
U1
PIU1011
COC14
C14
nRST
TDI
TDO
TMS
TCK
A
nRST
PIQ201
8
PIR201
GND_RF
10 pF
7
nRST
PF7_ADC7_TDI
PF6_ADC6_TDO
PF5_ADC5_TMS
PF4_ADC4_TCK
RFN
PIR101
PIC1102 PIC1101
6
10 k
100K
A
5
10
2
AVSS_RFN
1
GND_RF
GND_RF
COC13
C13
10 pF
PIC1301 PIC1302
Place xtal circuit closer
to MCU. Isolate from
digital signals.
PIU1046
23
DEVDD
DEVDD
DEVDD
DEVDD
DVSS
DVSS
DVSS
DVSS
PIU1023
34
PIU1034
44
PIU1044
54
PIU1054
24
PIU1024
35
PIU1035
45
PIU1045
55
PIU1055
Paddle
PIU1065
RF_VCC_3V3
PE7_ICP3_INT7_CLKO
CLKO
CLKI
65
GND_RF
PE4_OC3B_INT4
CLKI
CLK IO
CLK IO0CLKO
IO IO
POCLK
POCLK
IO0CLKI
CLKI
Wake up INT
WK_INT
POWK0INT
ATMEGA256RFR2ZU
SPI
POSPI0SS
POSPI0SCK
POSPI0MOSI
POSPI0MISO
POSPI
SPI
SS
SCK
MOSI
MISO
PB0_SSN_PCINT0
PB1_SCK_PCINT1
PB2_MOSI_PDI_PCINT2
PB3_MISO_PDO_PCINT3
PE3_AIN1_OC3A
PE2_AINO
C
ANALOGCOMPARATOR0AIN1
COMPARATOR
POANALOG
POANALOG
COMPARATOR0AIN0
COMPARATOR
AIN1
AIN0
C
Analog Comparator I/P
PWM/INT4
PWM/INT6
PWM/INT7
PCINT/
PWM
POPCINT0
POPCINT0
PWM0PWM0INT4
PWM0PWM0INT6
PWM0PWM0INT7
PWM
PB4_OC2A_PCINT4
PB6_OC1B_PCINT6
PB7_OC0A_OC1C_PCINT7
PCINT/ PWM output
PE1_TXD0
PE0_PCINT8
RF_VCC_3V3
COZ2
Z2
VCC_3V3
PIC1201
PIC601
PIC701
COC6
COC7
C6
C7
PIC602 100n PIC702 100n
+
C12
COC12
PIC1202 4.7uF/10V
COL1
L1
PIL101
UART0
POUART00UART0TXD0
POUART00UART0RXD0
POUART0
RF_VCC_3V3
PIC801
PIC901
C8
C9
COC8
COC9
PIC802 100n PIC902 100n
PIC10 1
PIC10 2
EMI Shield
COC10
C10
100n
PIZ201 PIZ202 PIZ203 PIZ204
1
2
3
4
RF_VCC_3V3
RF_VCC_3V3
UART_TXD0
UART_RXD0
UART0
PIL102
EMI_SHIELD
BLM15BB221SN1
GND_RF
GND_RF
Place de-coupling closer
to MCU
Place 4.7uF closer to
Vcc input for module
GND_RF
ATMEL Norway
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7
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4
1
2
3
4
5
6
7
8
A
A
1
RF_IN RF_OUT
GND
PIJ101
RF_P
4
PIB104
Bal
6
PIB105 PIB106
5
PIJ104
4
i
PCB Rule
tune the values for
Antenna matching
3
GND_RF
2
6.2nH RF Inductor, L-07C6N2SV6T
PIA103
COL2
L2
1
PIL202 PIA101 FEED POINT
PIJ102 PIL201
PIL301 L3
COL3
GND_RF
GND_RF
2
PIA102
2450AT42B100
B
COL4
L4
N.M.
PIL3022.2nH
2450BM15A0015E
PIA104
PIL401
COA1
A1
NC
4
1
PIB101
GND
RF_P
PORF0P
GND
B
3
50Ohm
PIJ103
GND_RF
GND
COB1
B1
2
PIB102
GND
COJ1 MS147
J1
PCB Rule
DifferentialPair: True
i
3
RF_N
PIB103 Bal
RF_N
PORF0N
5.6nH RF Inductor
PIL402
GND_RF
GND_RF
C
C
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4
4.1
Handling Instructions
The ZigBit Modules are fixed with an EMI Shield to ensure compliance to Emission and Immunity rules. This shield is
galvanic and NOT air tight. So cleaning of the module with IPA / other similar agents is not advised. Humidity protection
coating (conformal) will cause deviated RF behavior and coating material being trapped inside EMI Shield. So this
should be avoided. For products requiring conformal coating, it is advised to suitably mask the ZigBit before applying
the coating to rest of the ZigBit carrier board. To protect ZigBit from humidity, the housing of the product should ensure
suitable Ingress Protection standards are complied with.
The MS-147 connector should never be exposed to Varnish / similar conformal coating material which will affect
electrical connection on the surfaces of connector.
The in-built chip antenna has been tuned for the particular design
4.2
General Recommendations
• Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning
• Placing high profile components next to antenna should be avoided
• Having holes/vias punched around the periphery of the board eliminates parasitic radiation from the board edges
also distorting antenna pattern
•
5.
ZigBit module should not be placed next to consumer electronics which might interfere with ZigBit's RF frequency
band
Persistence Memory
A dedicated memory space is allocated to store product specific information and called the Persistence Memory. The
organization of the persistence memory is as follows:
Table 5-1.
Persistence Memory
Data
Size
Structure Revision
MAC address
2 bytes
(1)
8 bytes
Board information overall
49 bytes
Board information – PCBA Name
30 bytes
Board information – PCBA Serial number
10 bytes
Board information – PCBA Atmel Part Number
8 bytes
Board information – PCBA Revision
1 byte
Reserved
3 bytes
Xtal Calibration Value
1 byte
Reserved
7 bytes
Reserved
4 bytes
CRC
2 bytes
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
17
In ATZB-S1-256-3-0-C persistence memory is stored in the User Signature Data (Page 1) of Atmega256RFR2 SoC with
starting address 0x0100. User Signature Data is isolated from the main flash and will not be cleared by Chip erase
Command.
Special commands are available to erase and write data to user signature pages via the JTAG interface (see section on
"Programming via the JTAG Interface” in Atmega256RFR2 datasheet [1] for details). User signature rows can be read
from software in the same way as the device and JTAG identifiers (see section "Reading the Signature Row from
Software" of Atmega256RFR2 datasheet[1]).
Note: 1 The MAC address stored inside the MCU is a uniquely assigned ID for each ZigBit and owned by Atmel.
User of the ZigBit application can use this unique MAC ID to address the ZigBit in end-applications. The MAC ID
can be read from the ZigBit using the Performance Analyzer Application that can be downloaded from
www.atmel.com/wireless
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
18
6.
Ordering Information
Part number
Description
ATZB-S1-256-3-0-C
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with MS-147 test
connector and chip antenna, Single unit
ATZB-S1-256-3-0-CR
2.4GHz IEEE802.15.4/ZigBee OEM module based on ATmega256RFR2 SoC with MS-147 test
connector and chip antenna, tape and reel
Note:
Tape and reel quantity: 200.
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
19
7.
Agency Certifications
7.1
United States (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an
OEM manufacturer must comply with the following regulations:
1.
The ATZB-S1-256-3-0-C modular transmitter must be labeled with its own FCC ID number, and, if the FCC ID
is not visible when the module is installed inside another device, then the outside of the device into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording such as the following:
IMPORTANT: Contains FCC ID : VW4A091732. This equipment complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause undesired operation (FCC
15.19).
The internal antenna used for this mobile transmitter must provide a separation distance of at least 20 cm from all
persons and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF
exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may
only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment
authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this
equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference when the equipment is operated in a commercial environment. This equipment generates, uses, and
can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at his own expense
(FCC section 15.105).
7.2
European Union (ETSI)
The ATZB-S1-256-3-0-C Module has been certified for use in European Union countries. If these modules are
incorporated into a product, the manufacturer must ensure compliance of the final product to the European harmonized
EMC and lowvoltage/safety standards. A Declaration of Conformity must be issued for each of these standards and
kept on file as described in Annex II of the R&TTE Directive.
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
20
Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user
manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body
for compliance testing to all required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall
consist of the initials "CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the
apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE
EUROPEAN PARLIAMENT AND OF THE COUNCIL" on 9 March 1999 at section 12.
7.3
Industry Canada (IC) Compliance statements
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
This equipment complies with radio frequency exposure limits set forth by Industry Canada for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20 cm between the device and
the user or bystanders.
Cet équipement est conforme aux limites d'exposition aux radiofréquences définies par Industrie Canada pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm de distance entre le
dispositif et l'utilisateur ou des tiers
CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
The OEM integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
This Module is labelled with its own IC ID. If the IC ID Certification Number is not visible while installed inside another
device, then the device should display the label on it referring the enclosed module. In that case, the final end product
must be labelled in a visible area with the following:
“Contains Transmitter Module IC:11019A-091732”
OR
“Contains IC: 11019A-091732”
Ce module est étiqueté avec son propre ID IC. Si le numéro de certification IC ID n'est pas visible lorsqu'il est installé à
l'intérieur d'un autre appareil, l'appareil doit afficher l'étiquette sur le module de référence ci-joint. Dans ce cas, le
produit final doit être étiqueté dans un endroit visible par le texte suivant:
“Contains Transmitter Module IC: 11019A-091732”
OR
“Contains IC: 11019A-091732”
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
21
8.
Revision History
Doc. Rev.
Date
Comments
42191B
03/2014
Updated the Table 3-9. Removed the table note.
42191A
11/2013
Initial revision.
ATZB-S1-256-3-0-C ZigBit 2.4GHz Single chip Wireless Module [DATASHEET]
42191B−WIRELESS−03/2014
22
Atmel Corporation
Atmel Asia Limited
Atmel Munich GmbH
Atmel Japan G.K.
1600 Technology Drive
Unit 01-5 & 16, 19F
Business Campus
16F Shin-Osaki Kangyo Building
San Jose, CA 95110
BEA Tower, Millennium City 5
Parkring 4
1-6-4 Osaki
USA
418 Kwun Tong Road
D-85748 Garching b. Munich
Shinagawa-ku, Tokyo 141-0032
Tel: (+1)(408) 441-0311
Kwun Tong, Kowloon
GERMANY
JAPAN
Fax: (+1)(408) 487-2600
HONG KONG
Tel: (+49) 89-31970-0
Tel: (+81)(3) 6417-0300
www.atmel.com
Tel: (+852) 2245-6100
Fax: (+49) 89-3194621
Fax: (+81)(3) 6417-0370
Fax: (+852) 2722-1369
© 2014 Atmel Corporation. All rights reserved. / Rev.: 42191B−WIRELESS−03/2014
Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, ZigBit®, and others are registered trademarks or trademarks of Atmel
Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
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