30077 新竹科學工業園區工業東七路5號5樓
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park, Hsinchu 30077, Taiwan, R.O.C.
TEL : 886-3-577-8385 FAX : 886-3-577-8945
www.issc-tech.com
BM77SPPx3MC2
Bluetooth® 4.0 Dual Mode Module
Features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Complete, Fully Certified, Embedded 2.4 GHz
Bluetooth® Version 4.0 Module
Bluetooth Classic (BR/EDR) and Low Energy (LE)
Bluetooth SIG Certified
Onboard embedded Bluetooth Stack
Transparent UART mode for seamless serial data over
UART interface
Easy to configure with Windows GUI or direct by MCU
Firmware can be field upgradable via UART
Compact surface mount module: 22 x 12 x 2.4 mm
Castellated surface mount pads for easy and reliable
host PCB mounting
Environmentally friendly, RoHS compliant
Perfect for Portable Battery Operated Devices
Internal Battery Regulator Circuitry
Worldwide regulatory certifications
FIGURE 1:
Operational:
•
•
•
•
•
Single operating voltage: 3.2V to 4.3V
Temperature range: -20 to 70°C
Simple, UART interface
Integrated crystal, internal voltage regulator, and
matching circuitry
Multiple I/O pins for control and status
General Description:
RF/Analog:
•
•
•
Frequency: 2.402 to 2.480 GHz
Receive Sensitivity: -90 dBm (Classic); -92 dBm (LE)
Power Output: 2 dBm (typ.)
Data Throughput:
•
•
50 kilobyte (Classic on Android)
8 kilobyte (LE on iOS7)
MAC/Baseband/Higher Layer:
•
•
Secure AES128 encryption
GAP, SDP, SPP, GATT profiles
Antenna:
•
•
Ceramic Chip Antenna (BM77SPPS3MC2)
External Antenna Connection via RF Pad
(BM77SPP03MC2)
Compliance:
•
•
•
•
This Bluetooth SIG certified module provides a complete
wireless solution with Bluetooth stack onboard, integrated
antenna, and worldwide radio certifications in a compact
surface mount package, 22 x 12 x 2.4 mm. It supports GAP,
SDP, SPP, and GATT profiles. Data is transferred over the
Bluetooth link by sending/receiving data via transparent
UART mode, making it easy to integrate with any processor
or Microcontroller with a UART interface. Configuration is
made easy using a Windows® based GUI or directly via UART
by a MCU.
Applications:
Bluetooth SIG QDID: B021961
Modular Certified for the United States (FCC) and
Canada (IC)
European R&TTE Directive Assessed Radio Module
Australia, New Zealand, Korea, Taiwan, Japan
© 2014 ISSC Technologies Corp.
The BM77 is a fully-certified Bluetooth® Version 4.0
(BR/EDR/LE) module for designers who want to easily add
dual mode Bluetooth® wireless capability to their products.
Delivering local connectivity for the Internet of Things (IoT),
the BM77 bridges your product to Smart Phones and Tablets
for convenient data transfer, control and access to cloud
applications.
•
•
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•
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Mobile Point of Sales (mPOS)
LED lighting
Wearables
Digital Sports
Fitness Devices
Health Care/ Medical
Automotive Accessories
Home Automation
Remote Control Toys
Preliminary
Revision 2.1.1 – June 16, 2015 Page 1
BM77SPPx3MC2
1.0
DEVICE OVERVIEW
The BM77 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0 (BR/EDR/LE) wireless
module. It incorporates an on-board Bluetooth stack, cryptographic accelerator, power management
subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1-1). With the BM77, designers can
embed Bluetooth functionality rapidly into virtually any device.
The BM77 provides cost and time-to-market savings as a self-contained module solution. The module
has been designed to provide integrators with a simple Bluetooth solution that features:
• Ease of integration and programming
• Vastly reduced development time
• Minimum system cost
• Interoperability with Bluetooth hosts
• Maximum value in a range of applications
The BM77 can independently maintain a low-power wireless connection. Low-power usage and flexible
power management maximize the module’s lifetime in battery-operated devices.
The BM77 module comes in two varieties. The BM77SPPS3MC2 is a complete, fully regulatory certified
module with integral ceramic chip antenna and shield. The BM77SPP03MC2 is a lower cost alternative
with external antenna and no shield. The integrator is responsible for the antenna, antenna matching,
and regulatory certifications.
The BM77 is a small, compact, surface mount module with castellated pads for easy and reliable host
PCB mounting. The module is compatible with standard pick-and-place equipment.
TABLE 1-1: BM77 MODULE FAMILY TYPES
Device
BM77SPPS3MC2-0007AA
BM77SPP03MC2-0007AA
Antenna
Integral ceramic chip
External
Shield
Yes
No
Regulatory Certifications
FCC, IC, CE, KCC, NCC, Japan
CE
FIGURE 1-1: BM77 BLOCK DIAGRAM
BM77SPPx3MC2
Ceramic Chip Antenna
(BM77SPPS3MC2)
External Antenna
(BM77SPP03MC2)
IS1677SM
16 MHz
RF Matching
Configurable
Control and
Indication I/O
UART
Power
I2C
8Kbit
Serial
EEPROM
1.1
Interface Description
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 2
BM77SPPx3MC2
The BM77SPPS3MC2 pin diagram is shown in Figure 1-2 and the BM77SPP03MC2 is shown in Figure 1-3.
The pin descriptions are shown in Table 1-1
FIGURE 1-2: BM77SPPS3MC2 PIN DIAGRAM
33 GND
32 GND
GND 1
GND 2
GND 3
BAT_IN 4
SW_BTN 5
LDO33_O 6
VDD_IO 7
LDO18_O 8
WAKEUP 9
PMULDO_O 10
P04 11
P15 12
P12/SCL 13
P13/SDA 14
GND
LED1
P37
P36
P34
P33
P32
P31
TXD
RXD
P17/CTS 15
P05 16
P00/RTS 17
P20 18
P24 19
EAN 20
RESET 21
31
30
29
28
27
26
25
24
23
22
FIGURE 1-3: BM77SPP03MC2 PIN DIAGRAM
GND 1
BAT_IN 2
SW_BTN 3
LDO33_O 4
VDD_IO 5
LDO18_O 6
WAKEUP 7
PMULDO_O 8
P04 9
P15 10
P12/SCL 11
P13/SDA 12
30 BT_RF
GND
LED1
P37
P36
P34
P33
P32
P31
TXD
RXD
P17/CTS
P05
P00/RTS
P20
P24
EAN
RST_N
13
14
15
16
17
18
19
29
28
27
26
25
24
23
22
21
20
TABLE 1-1: PIN DESCRIPTION
BM77SPPS3MC2
BM77SPP03MC2
© 2014 ISSC Technologies Corp.
Symbol
Type
Preliminary
Description
Revision 2.1.1 – June 16, 2015 Page 3
BM77SPPx3MC2
Pin
1
2
3
4
Pin
--1
2
GND
GND
GND
BAT_IN
Power
Power
Power
Power
5
3
SW_BTN
DI
6
4
LDO33_O
Power
7
5
VDD_IO
Power
8
6
LDO18_O
Power
9
7
WAKEUP
DI
10
8
PMULDO_O
Power
11
12
13
14
15
16
17
9
10
11
12
13
14
15
P04
P15
P12/SCL
P13/SDA
P17/CTS
P05
P00/RTS
DO
DO
DO
DIO
DIO
DIO
DIO
18
16
P20
DI
19
17
P24
DI
20
18
EAN
DI
21
19
RST_N
DI
22
23
24
20
21
22
RXD
TXD
P31
DI
DO
DIO
25
23
P32
DIO
26
24
P33
DIO
27
25
P34
DIO
28
29
26
27
P36
P37
DIO
DIO
30
31
-32
33
28
29
30
---
LED1
GND
BT_RF
GND
GND
DO
Power
AIO
Power
Power
Ground reference
Ground reference
Ground reference
Battery Input. Main positive supply input. Connect to 10
uF low ESR ceramic capacitor.
Software Button H: Power On / L: Power Off
(See Section 1.6)
Internal 3.3V LDO regulator output. Connect to 10 uF low
ESR ceramic capacitor.
I/O positive supply input. Ensure VDD_IO and MCU I/O
voltages are compatible.
Internal 1.8V LDO regulator output. Connect to 10 uF low
ESR ceramic capacitor.
Wakeup from shutdown mode (active low)
(internal pull-up)
Power management unit output. Connect to 1 uF low ESR
ceramic capacitor.
Status Indicator 2 (STATUS_IND_2). See Section 1.5
Status Indicator 1 (STATUS_IND_1). See Section 1.5
2
I C SCL (Do Not Connect)
2
I C SDA (Do Not Connect)
Configurable Control or Indication pin or UART CTS (input)
Configurable Control or Indication pin
Configurable Control or Indication pin or UART RTS
(output)
System configuration (internal pull-up)
(See Section 1.10)
System configuration (internal pull-up)
(See Section 1.10)
System configuration (internal pull-down)
(See Section 1.10)
Module reset (active low) (internal pull-up)
Apply a pulse of at least 63 ns.
UART data input
UART data output
Configurable Control or Indication pin
(when configured as input: internal pull-up)
Configurable Control or Indication pin
(when configured as input: internal pull-up)
Configurable Control or Indication pin
(when configured as input: internal pull-up)
Configurable Control or Indication pin
(when configured as input: internal pull-up)
(Do Not Connect)
Configurable Control or Indication pin
(when configured as input: internal pull-up)
Status LED (See Section 1.9)
Ground reference
External antenna connection (50 ohm)
Ground reference
Ground reference
Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.
1.2
Configuring the BM77
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 4
BM77SPPx3MC2
Configuring the BM77 features can be performed using either MCU commands documented in the “ISSC
Flash Protocol Programmer’s Guide,” or with the “Windows UI Configuration tool” and “Write EEPROM
tool.” MCU UART commands are documented in “BM77SPP Command Set.”
1.3
UART Interface
Figures 1-4 and 1-5 show Power and MCU interface examples.
The BM77 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly
recommended to use hardware flow control pins RTS and CTS. The BM77 hardware flow control is
disabled by default and must be configured to enable. The UART Baud is configurable. The available
signal rates are listed in Table 4-5.
1.4
Control and Indication I/O Pins
I/O pins P00, P05, P17, P31, P32, P33, P34 and P37 are configurable control and indication I/O. Control
signals are input to the BM77. Indication signals are output from the BM77. Table 1-2 shows
configurable I/O pin assignment to control and indication signals. Note that RTS can only be assigned to
P00 and CTS to P17.
P00
P05
P17
P31
P32
P33
P34
P37
PROFILE_IND
INQUIRY CONTROL
DISCOVERY_CONTROL
UART_RX_IND
DISCONNECT_CONTROL
LINK_QUALITY_IND
LOW_BATTERY_IND
UART_CTS
N/C
UART_RTS
TABLE 1-2: CONFIGURATION AND INDICATION I/O ASSIGNMENTS
Default
Default
Default
Default
Default
Default
Default
Default
1.5
Status Indication I/O Pins
I/O pins P15 and P04 are Status Indicator 1 and 2 signals respectively. Together they provide status
indication to the MCU as shown in Table 1-3.
TABLE 1-3: STATUS INDICATION
P04/STATUS_IND_2
H
H
L
L
1.6
P15/STATUS_IND_1
H
L
H
L
Software Button (SW_BTN)
© 2014 ISSC Technologies Corp.
Indication
Power default / Shutdown state
Access state
Link state (no UART data being transmitted)
Link state (UART data being transmitted)
Preliminary
Revision 2.1.1 – June 16, 2015 Page 5
BM77SPPx3MC2
The Software Button (SW_BTN) input pin powers the BM77 on (high) or off (low)
1.7
WAKE UP (WAKEUP)
The Wake Up (WAKEUP) input pin wakes the BM77 from shutdown mode (active low).
1.8
RESET (RST_N)
The Reset (RST_N) input pin resets the BM77 (active low pulse for at least 63 ns).
1.9
Status LED (LED1)
The status LED (LED1) indicates:
• Standby
• Inquiry
• Link
• Link Back
• Low Battery
• Page
Each indication is a configurable flashing sequence. LED brightness can also be configured.
1.10
System Configuration
I/O pins P20, P24, and EAN place the BM77 into operation modes as shown in Table 1-4. P20 and P24
each have internal pull-ups. EAN has internal pull-down.
TABLE 1-4:
P20
High
Low
Low
SYSTEM CONFIGURATION SETTINGS
P24
EAN
Operational Mode
High
Low
Normal operation
High
Low
Test (Write EEPROM)
Low
High
Write Flash (Firmware programming)
1.11
Power
Figure 1-4 shows an example power scheme using a 3.3 volt low-dropout (LDO) regulator supplying 3.3
volts to both the BM77 (BAT_IN and VDD_IO) and MCU VDD. This power scheme ensures that BM77
and MCU I/O voltages are compatible.
Figure 1-5 shows an example power scheme using a 3.7 volt lithium-ion battery. The BM77 has an
internal 3.3 volt LDO regulator. Battery power is applied to BAT_IN pin. The regulated 3.3 volts output
is on the LDO33_O pin. From the LDO33_O pin, voltage can be routed the VDD_IO pin and external
circuitry including the MCU. This power scheme ensures that BM77 and MCU I/O voltages are
compatible.
CAUTION: The internal 3.3 volt LDO current source: 50 mA maximum
Recommended bypass capacitor location and values are shown in Figures 1-4 and 1-5. Capacitors can be
low ESR ceramic. Place capacitors close to BM77 module.
FIGURE 1-4: BM77 TO MCU INTERFACE EXAMPLE – LDO
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 6
BM77SPPx3MC2
FIGURE 1-5: BM77 TO MCU INTERFACE EXAMPLE – BATTERY
Li-ion Battery
(3.7V)
LDO
(3.3V)
BM77 Module
BAT_IN
(3.2 – 4.3V)
10uF
MCU
P15/STATUS_IND_1
P04/STATUS_IND_2
I/O
I/O
SW_BTN
WAKEUP
RST_N
I/O
I/O
I/O
P37
P34
P33
P32
P31
P05
I/O
I/O
I/O
I/O
I/O
I/O
LDO33_O
10uF
VDD_IO (Note 1)
(2.8 – 3.63V)
NC
LDO18_O
Note 2
PMULDO_O
TXD
RXD
P20
P24
EAN
LED1
P12/SCL
P13/SDA
P36
System Configuration
1.12
Note 1
CTS
RTS
P00/RTS
P17/CTS
NC
VDD
RX
TX
NC
NC
NC
Note: 1. Ensure VDD_IO and MCU VDD voltages are compatible.
2. Control and indication ports are configurable.
Mounting Details
The BM77SPPS3MC2 physical dimensions are shown in Figure 1-6, recommended host PCB footprint in
Figure 1-7, and mounting suggestion in Figure 1-8. There should not be top copper layer near the test
pin area shown in Figure 1-7. When laying out the host PCB, the areas under the antenna should not
contain any top, inner layer, or bottom copper as shown in Figure 1-8. A low-impedance ground plane
will ensure best radio performance (best range, lowest noise). Figure 1-8 shows a minimum ground
plane area to the left and right of the module for best antenna performance. The ground plane can be
extended beyond the minimum recommended as need for host PCB EMC noise reduction. For best
range performance, keep all external metal away from the ceramic chip antenna at least 31 mm.
The BM77SPP03MC2 physical dimensions are shown in Figure 1-9, recommended host PCB footprint in
Figure 1-10, and mounting suggestion in Figure 1-11. It is highly recommended to layout the host PCB as
suggested in Figure 1-11. A low-impedance ground plane will ensure best radio performance (best
range, lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB
trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This
trace can be extended to include passive parts for antenna attenuation padding, impedance matching,
or to provide test posts. It is recommended that the micro-strip trace be as short as possible for
minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm
impedance. Figure 1-11 shows an example connection to U.FL connector.
1.13
Soldering Recommendations
The BM77 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recommendations are given:
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 7
BM77SPPx3MC2
•
•
•
•
•
•
Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations
Do not exceed peak temperature (TP) of 250 deg C
Refer to the solder paste data sheet for specific reflow profile recommendations
Use no-clean flux solder paste
Do not wash as moisture can be trapped under the shield
Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 8
BM77SPPx3MC2
FIGURE 1-6: BM77SPPS3MCS MODULE DIMENSIONS
(Side View)
1
2.0
10.2
22.0
21.2
20.1
21.5
33
19.9
18.0
18.95
17.3
18.0
16.95
shield mounting hole
14.90
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
1.0mm
0.7mm
(Bottom View)
1.1mm
0.7
0.0
Dimentions are in millimeters
Tolerances:
0.0
0.7mm
0.5mm
9.3
8.2
7.1
6.0
4.9
3.8
2.7
2.4
0.6
0.0
shield
mounting
hole
11.2
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.8
0.0
12.0
22.0
21.2
20.1
(Bottom View)
11.2
0.8
2.0
(Top View)
PCB Outline: +/- 0.4 mm
PCB Thickness: +/- 0.06 mm
1.0mm
Pad Detail
FIGURE 1-7: BM77SPPS3MC2 RECOMMEDED PCB FOOTPRINT
9.2
11.2
2.0
(Top View)
22.0
21.2
20.1
Top Copper
Keep Out Area
18.0
18.0
16.0
0.5mm
1.5mm
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
0.7mm
1.1mm
© 2014 ISSC Technologies Corp.
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.0
Preliminary
Revision 2.1.1 – June 16, 2015 Page 9
BM77SPPx3MC2
FIGURE 1-8: BM77SPPS3MCS HOST PCB MOUNTING SUGGESTION
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 10
BM77SPPx3MC2
FIGURE 1-9: BM77SPP03MCS MODULE DIMENSIONS
(Top View)
(Bottom View)
2.0
2.0
(Side View)
1.0mm
15.0
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
1
15.0
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
30
0.7mm
(Bottom View)
1.1mm
0.0
Dimentions are in millimeters
Tolerances:
0.0
9.3
8.2
7.1
6.0
4.9
3.8
2.7
0.7mm
0.5mm
12.0
1.8
0.6
0.0
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.0
PCB Outline: +/- 0.4 mm
PCB Thickness: +/- 0.06 mm
1.0mm
Pad Detail
FIGURE 1-10: BM77SPP03MC2 RECOMMEDED PCB FOOTPRINT
2.0
(Top View)
0.5mm
1.5mm
15.0
13.9
12.8
11.7
10.6
9.5
8.4
7.3
6.2
5.1
4.0
2.9
1.8
0.7mm
1.1mm
© 2014 ISSC Technologies Corp.
12.0
2.7
3.8
4.9
6.0
7.1
8.2
9.3
0.0
0.0
Preliminary
Revision 2.1.1 – June 16, 2015 Page 11
BM77SPPx3MC2
FIGURE 1-11: BM77SPP03MCS HOST PCB MOUNTING SUGGESTION
© 2014 ISSC Technologies Corp.
Preliminary
Revision 2.1.1 – June 16, 2015 Page 12
BM77SPPx3MC2
2.0
APPLICATION INFORMATION
2.2
BM77SPPS3MC2 Ceramic Chip Antenna
The BM77SPPS3MC2 module contains an integral ceramic chip antenna. The antenna performance on
the module is shown in Figure 2-1.
FIGURE 2-1: BM77SPPS3MC2 ANTENNA RADIATION PATTERN
Frequency
Max Gain
Efficiency
© 2014 ISSC Technologies Corp.
2450 MHz
1.63 dBi
71.55%
Preliminary
Revision 2.1.1 – June 16, 2015 Page 13
BM77SPPx3MC2
2.3
External Configuration and Programming
The BM77 module can be configured and firmware programmed using an external configuration and
programming tool available from ISSC Technologies. Figure 2-2 shows the connections between the
BM77 and header J1, a standard 8-pin 0.100” (2.54 mm) spaced header. It is recommended to include
this header on the host PCB for development.
Configuration and firmware programming modes are entered according to the system configuration I/O
pins (see Section 1.8).
FIGURE 2-2: EXTERNAL PROGRAMMING HEADER CONNECTIONS
BM77 Module
BAT_IN
(BM77SPP03MC2) BT_RF
GND
LED1
J1
8
P24
7
6
5
4
GND
TXD
RXD
5V_USB
EAN
3
2
1
BAT_IN
P20
NC
SW_BTN
P37
LDO33_O
VDD_IO
LDO18_O
P36
WAKEUP
P33
PMULDO_O
P32
P04
P15
P31
P34
TXD
RXD
© 2014 ISSC Technologies Corp.
Preliminary
RST_N
P20
P24
EAN
RTS/P00
P05
CTS/P17
P12/SCL
P13/SDA
Revision 2.1.1 – June 16, 2015 Page 14
BM77SPPx3MC2
3.0
REGULATORY APPROVAL
This section outlines the regulatory information for the BM77SSPS3MC2 module for the following
countries:
• United States
• Canada
• Europe
• Australia
• New Zealand
• Japan
• Korea
• Taiwan
• Other Regulatory Jurisdictions
3.2
United States
The BM77SSPS3MC2 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with
Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM77
module into a finished product without obtaining subsequent and separate FCC approvals for intentional
radiation, provided no changes or modifications are made to the module circuitry. Changes or
modifications could void the user’s authority to operate the equipment. The end user must comply with
all of the instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated with the transmitter module portion. For
example, compliance must be demonstrated to regulations for other transmitter components within the
host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”),
such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization
requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or
Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as
appropriate.
3.2.1
LABELING AND USER INFORMATION REQUIREMENTS
The BM77 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when
the module is installed inside another device, then the outside of the finished product into which the
module is installed must also display a label referring to the enclosed module. This exterior label can use
wording as follows:
Contains Transmitter Module FCC ID: A8TBM77SPPSYC2A
or
Contains FCC ID: A8TBM77SPPSYC2A
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference,
and (2) this device must accept any interference received, including
interference that may cause undesired operation
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A user’s manual for the finished product should include the following statement:
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in accordance with the
instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Additional information on labeling and user information requirements for Part 15 devices can be found
in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory
Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.
3.2.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold
to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted
for use with the specific antenna(s) tested in this application for Certification and must not be co-located
or operating in conjunction with any other antenna or transmitters within a host device, except in
accordance with FCC multi-transmitter product procedures.
3.2.3
HELPFUL WEB SITES
Federal Communications Commission (FCC): http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
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3.3
Canada
The BM77SSPS3MC2 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a
module in a host device without the need to recertify the device.
3.3.1
LABELING AND USER INFORMATION REQUIREMENTS
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The
host device shall be properly labeled to identify the module within the host device.
The Industry Canada certification label of a module shall be clearly visible at all times when installed in
the host device, otherwise the host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”,
or similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 12246A-BM77SPPSYC2
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux
appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.
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Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for
transmitters shall display the following notice in a conspicuous location:
Under Industry Canada regulations, this radio transmitter may only operate
using an antenna of a type and maximum (or lesser) gain approved for the
transmitter by Industry Canada. To reduce potential radio interference to
other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur
radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de
réduire les risques de brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
The above notice may be affixed to the device instead of displayed in the user manual.
User manuals for transmitters equipped with detachable antennas shall also contain the following
notice in a conspicuous location:
This radio transmitter (identify the device by certification number, or model
number if Category II) has been approved by Industry Canada to operate with
the antenna types listed below with the maximum permissible gain and
required antenna impedance for each antenna type indicated. Antenna types
not included in this list, having a gain greater than the maximum gain
indicated for that type, are strictly prohibited for use with this device.
Conformément à la réglementation d'Industrie Canada, le présent émetteur
radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de
réduire les risques de brouillage radioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication satisfaisante.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types
approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and
required impedance for each.
3.3.2
RF EXPOSURE
All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio
Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).
(Get direct quote from Certificate and place here)
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3.3.3
HELPFUL WEB SITES
Industry Canada: http://www.ic.gc.ca/
3.4
Europe
The BM77SPPS3MC2 module is an R&TTE Directive assessed radio module that is CE marked and has
been manufactured and tested with the intention of being integrated into a final product.
The BM77 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and
are summarized in Table 3-1: European Compliance Testing. A Notified Body Opinion has also been
issued. All test reports are available on the BM77 product web page at
http://www.microchip.com/bm77.
PENDING
The R&TTE Compliance Association provides guidance on modular devices in document Technical
Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm.
Note: To maintain conformance to the testing listed in Table 3-1: European Compliance Testing, the
module shall be installed in accordance with the installation instructions in this data sheet and shall
not be modified.
When integrating a radio module into a completed product the integrator becomes the manufacturer
of the final product and is therefore responsible for demonstrating compliance of the final product
with the essential requirements of the R&TTE Directive.
3.4.1
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM77 module must follow CE marking requirements.
The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE
marking.
3.4.2
ANTENNA REQUIREMENTS
From R&TTE Compliance Association document Technical Guidance Note 01:
Provided the integrator installing an assessed radio module with an integral or specific antenna
and installed in conformance with the radio module manufacturer’s installation instructions
requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require
further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]
The European Compliance Testing listed in Table 3-1 was performed using the integral ceramic chip
antenna.
TABLE 3-1: EUROPEAN COMPLIANCE TESTING
Certification
Safety
Health
EMC
Radio
Notified Body
Opinion
Standards
EN 60950-1:2006+A11:2009+A1:2010
EN 50371:2002-03
EN 301 489-1 V1.8.1 (2008-04)
EN 301 489-17 V2.1.1 (2009-05)
EN 300 328 V1.7.1 (2006-10)
© 2014 ISSC Technologies Corp.
Article
(3.1(a))
Laboratory
Report Number
Date
(3.1(b))
(3.2)
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3.4.3
HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can
be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.
Additional helpful web sites are:
• Radio and Telecommunications Terminal Equipment (R&TTE):
http://ec.europa.eu/enterprise/rtte/index_en.htm
•
European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
•
European Telecommunications Standards Institute (ETSI):
http://www.etsi.org
•
European Radio Communications Office (ERO):
http://www.ero.dk
•
The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA):
http://www.rtteca.com/
3.5
Australia
The Australia radio regulations do not provide a modular approval policy similar to the United States
(FCC) and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to
demonstrate compliance in accordance with ACMA Radio communications “Short Range Devices”
Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard).
The BM77 module test reports can be used as part of the product certification and compliance folder.
For more information on the RF transmitter test reports, contact Microchip Technology Australia sales
office.
PENDING
To meet overall Australian final product compliance, the developer must construct a compliance folder
containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of
Conformity) etc. It is the responsibility of the integrator to know what is required in the compliance
folder for ACMA compliance. All test reports are available on the BM77 product web page at
http://www.microchip.com. For more information on Australia compliance, refer to the Australian
Communications and Media Authority web site http://www.acma.gov.au/.
3.5.1
HELPFUL WEB SITES
The Australian Communications and Media Authority: www.acma.gov.au/.
3.6
PENDING
New Zealand
The New Zealand radio regulations do not provide a modular approval policy similar to the United States
(FCC) and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to
demonstrate compliance against the New Zealand “General User Radio License for Short Range
Devices”. New Zealand Radio communications (Radio Standards) Notice 2010 calls up the AS / NZS
4268:2008 industry standard. The BM77 module test reports can be used as part of the product
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certification and compliance folder. All test reports are available on the BM77 product web page at
http://www.microchip.com/bm77. For more information on the RF transmitter test reports, contact
Microchip Technology sales office.
Information on the New Zealand short range devices license can be found in the following web links:
http://www.rsm.govt.nz/cms/licensees/types-oflicence/general-user-licences/short-range-devices
and
http://www.rsm.govt.nz/cms/policy-and-planning/spectrum-policy-overview/legislation/gazettenotices/product-compliance/ .
To meet overall New Zealand final product compliance, the developer must construct a compliance
folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC
(Declaration of Conformity) etc. It is the responsibility of the developer to know what is required in the
compliance folder for New Zealand Radio communications. For more information on New Zealand
compliance, refer to the web site http://www.rsm.govt.nz/.
3.6.1
HELPFUL WEB SITES
Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/.
3.7
Japan
The BM77SSPS3MC2 module has received type certification and is labeled with its own technical
conformity mark and certification number as required to conform to the technical standards regulated
by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of
Japan.
Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed. Additional testing
may be required:
•
•
If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this testing
is required.
There is an voluntary Electromagnetic Compatibility (EMC) test for the host product
administered by VCCI: http://www.vcci.jp/vcci_e/index.html
3.7.1
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM77 module must follow Japan marking
requirements. The integrator of the module should refer to the labeling requirements for Japan
available at the Ministry of Internal Affairs and Communications (MIC) website.
The BM77 module is labeled with its own technical conformity mark and certification number. The final
product in which this module is being used must have a label referring to the type certified module
inside:
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BM77SPPx3MC2
Contains transmitter module with certificate number:
202-SMC066
3.7.2
HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/
3.8
Korea
The BM77SSPS3MC2 module has received certification of conformity in accordance with the Radio
Waves Act. Integration of this module into a final product does not require additional radio certification
provided installation instructions are followed and no modifications of the module are allowed.
3.8.1
PENDING
LABELING AND USER INFORMATION REQUIREMENTS
The label on the final product which contains the BM77 module must follow KC marking requirements.
The integrator of the module should refer to the labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The BM77 module is labeled with its own KC mark. The final product requires the KC mark and
certificate number of the module:
(Number)
3.8.2
HELPFUL WEB SITES
Korea Communications Commission (KCC): http://www.kcc.go.kr
National Radio Research Agency (RRA): http://rra.go.kr
3.9
Taiwan
The BM77SSPS3MC2 module has received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product should
contact Microchip Technology sales or distribution partners to obtain a Letter of Authority.
Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.
3.9.1
LABELING AND USER INFORMATION REQUIREMENTS
The BM77 module is labeled with its own NCC mark and certificate number as below:
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The user’s manual should contain below warning (for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機,非經許可,
公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信;
經發現有干擾現象時,應立即停用,並改善至無干擾時方得繼續使用。
前項合法通信,指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。
3.9.2
HELPFUL WEB SITES
National Communications Commission (NCC): http://www.ncc.gov.tw
3.10
Other Regulatory Jurisdictions
Should other regulatory jurisdiction certification be required by the customer, or the customer need to
recertify the module for other reasons, a certification utility is available. For further regulatory
Certification Utility and documentation, contact ISSC Technologies Corp.
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4.0
ELECTRICAL CHARACTERISTICS
TABLE 4-1: ENVIRONMENTAL CONDITIONS
Parameter
Temperature Range (Operating)
Temperature Range (Storage)
Relative Humidity (Operating)
Relative Humidity (Storage)
Moisture Sensitivity Level
Value
-20 to 70°C
-40 to 85°C
10% to 90%
10% to 90%
2
TABLE 4-2: ELECTRICAL CHARACTERISTICS
Parameter
Supply Voltage (BAT_IN)
I/O Supply Voltage (VDD_IO)
I/O Voltage Levels
VIL input logic levels low
VIH input logic levels high
VOL output logic levels low
VOH output logic levels high
RESET
VTH,res threshold voltage
Input and Tri-State Current with
Pull-up Resistor
Leakage current
Supply Current
TX mode
RX mode
Min.
3.2
2.8
3.3
-0.3
2.0
2.4
Max.
4.3
3.63
Units
V
V
0.8
3.6
0.4
V
V
V
V
1.6
-10
TABLE 4-3: SUPPLY CONSUMPTION – CLASSIC (1)
Current
Units
Parameter
(avg.)
Standby mode
2.543
mA
Deep power down mode
0.343
mA
Connected + Sniff, Master (no data)
0.858
mA
Connected + Sniff, Slave (no data)
0.864
mA
Data, Master
23.03
mA
Data, Slave
25.597
mA
Note 1: Classic BR/EDR, RX_IND Function Enabled
© 2014 ISSC Technologies Corp.
Typ.
V
65
10
Kohm
uA
70
70
mA
mA
Notes
No data was transmitted
Sniff interval = 500ms
No data was transmitted
Sniff interval = 500ms
(Data transmitted at 115200 bps; block
size=500)
(Data transmitted at 115200 bps; block
size=500)
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TABLE 4-4: SUPPLY CONSUMPTION –LOW ENERGY (1)
Current
Units
Parameter
(avg.)
Standby mode (Discoverable &
mA
1.237
Connectable mode)
Standby mode (Discoverable &
mA
0.765
Connectable mode)
Deep power down mode
0.348
mA
mA
Connected (No data),connection
0.679
interval = 500ms
Connected (transfer
mA
13.073
data),connection interval = 500ms
mA
Connected (No data),connection
1.648
interval = 20ms
Connected (transfer
mA
18.581
data),connection interval = 20ms
Note 1: Low Energy, RX_IND Function Enabled
TABLE 4-5: UART BAUD
Notes
LE fast advertising interval = 160 ms,
standby at 0 ~ 30 sec
LE Reduced Power advertising
interval = 961 ms, standby after 30 sec
No data was transmitted
connection interval = 500 ms, latency=2.
Connection interval = 500 ms, latency=2.
No data was transmitted
connection interval = 20 ms, latency=2.
Connection interval = 20 ms, latency=2.
921600
Crystal Frequency
(MHz)
16
460800
16
457143
-0.79
307200
16
307692
0.16
230400
16
231884
0.64
115200
16
117647
2.1
57600
16
57145
-0.97
38400
16
38462
0.16
28800
16
28623
-0.62
19200
16
19231
0.16
14400
16
14480
0.55
9600
16
9615
0.16
4800
16
4808
0.16
2400
16
2399
-0.03
Baud
© 2014 ISSC Technologies Corp.
Actual Baud
Error Rate (%)
941176
2.12
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4.0
ORDERING INFORMATION
TABLE 4-1: ORDERING INFORMATION
Part Number
Description
BM77SPPS3MC2-0007AA
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module with integral
antenna, with shield
BM77SPP03MC2-0007AA
Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module, external
antenna, no shield
EV77SPPS3MC2A
Evaluation board for the BM77SPPS3MC2 Bluetooth Dual Mode module
with USB cable
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APPENDIX A: REVISION HISTORY
Revision 2.0 (October 2014)
Added content and editing.
Revision 2.1.1 (June 2015)
Updated operating temperature range and Taiwan NCC certification information.
© 2014 ISSC Technologies Corp.
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NOTES:
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