CL320/CL325/CL330
3-Channel Linear LED Drivers
Features
General Description
• ±6% Current Accuracy when VOUT is between 4V
and 15V
• 90V Standoff Voltage
• Separate Enable Pins for each Channel for PWM
Dimming
• Overtemperature Protection
• 8-Lead SOIC (with Heat Slug) Package
The CL320/CL325/CL330 are designed to drive three
strings of LEDs at a constant current of 20 mA, 25 mA
and 30 mA, respectively.
Applications
Overtemperature protection circuitry shuts down all
three channels when the nominal die temperature
reaches 135°C. Normal operation resumes when the
die temperature drops by 30°C.
• LCD Backlighting
• Indicator Lamps
The drive current is fixed, with a ±6% tolerance over a
VOUT range of 4V to 15V. Separate enable pins for
each channel allow for PWM dimming, three-step linear
dimming or individual disconnection of faulty LED
strings.
The CL320/CL325/CL330 are available in the 8-lead
SOIC (with heat slug) package and require a single
ceramic bypass capacitor which may be shared among
several drivers.
Package Type
8-lead SOIC
with heat slug
(Top view)
OUT3
OUT2
OUT1
VIN
GND
Underside plate
is ground
EN3
EN2
EN1
See Table 2-1 for pin information.
2017 Microchip Technology Inc.
DS20005599A-page 1
CL320/CL325/CL330
Functional Block Diagram and Typical Application Circuit
6.5 - 90V
CIN
100 nF
8
VIN
REG
Host
Controller
1
EN1
2
EN2
3
EN3
7
6
5
OUT1
OUT2
OUT3
VDD
GND
4
CL320/CL325/CL330
DS20005599A-page 2
2017 Microchip Technology Inc.
CL320/CL325/CL330
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage, VIN ................................................................................................................................ –0.5V to +100V
Output Voltage, VOUT .............................................................................................................................–0.5V to +100V
Enable Voltage, VEN................................................................................................................................. –0.5V to +6.5V
Minimum Operating Junction Temperature, TJ (Note 1) .......................................................................................–40°C
Storage Temperature, TS .....................................................................................................................–65°C to +150°C
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Maximum junction temperature internally limited
RECOMMENDED OPERATING CONDITIONS
Electrical Specifications: All voltages with respect to GND pin
Parameter
Sym.
Min.
Typ.
Max.
Unit
Supply Voltage
VIN
6.5
—
90
V
Output Voltage
VOUT
4
—
Enable Toggling Frequency
fEN
0
—
100
kHz
Operating Junction
Temperature
TJ
–40
—
—
°C
VIN Capacitor
CIN
—
100
—
nF
15
90
V
Conditions
EN = 0
EN = 1
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions. TA = 25°C unless otherwise noted.
Parameter
Sym.
VIN Supply Current
IIN
Output Current, Off
IOUT(OFF)
CL320
Output Current, On
CL325
IOUT(ON)
CL330
Min.
Typ.
Max.
Unit
—
220
250
µA
EN1-3 = 1
—
2.2
2.3
mA
EN1-3 = 0
—
4
10
µA
ENX = 1
—
—
21.2
ENX = 0, VOUT = 0V–4V
18.8
20
21.2
ENX = 0, VOUT = 4V–15V
18
20
22
ENX = 0, VOUT = 15V–90V
—
—
26.5
23.5
25
26.5
22.5
25
27.5
ENX = 0, VOUT = 15V–90V
—
—
31.8
ENX = 0, VOUT = 0V–4V
28.2
30
31.8
ENX = 0, VOUT = 4V–15V
27
30
33
ENX = 0, VOUT = 15V–90V
ENX = 0, VOUT = 0V–4V
mA
Enable Voltage, On
VEN(ON)
—
—
0.8
V
Enable Voltage, Off
VEN(OFF)
2.4
—
—
V
CEN
—
5
10
pF
Enable Input Capacitance
2017 Microchip Technology Inc.
Conditions
ENX = 0, VOUT = 4V–15V
DS20005599A-page 3
CL320/CL325/CL330
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Over recommended operating conditions. TA = 25°C unless otherwise noted.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
Enable Low Input Current
IENL
—
—
1
µA
VEN = 0V
Enable High Input Current
IENH
—
—
1
µA
VEN = 5V
Enable on Delay
tON
—
2
2.4
µs
Output Current Rise Time
tRISE
—
1
1.2
µs
Enable Off Delay
tOFF
—
440
800
ns
Output Current Fall Time
tFALL
—
170
250
ns
Sym.
Min.
Typ.
Max.
Unit
Operating Junction Temperature
TJ
–40
—
—
°C
Storage Temperature
TS
–65
—
+150
°C
Overtemperature Limit
TLIM
+120
+135
+150
°C
THYST
—
30
—
°C
JA
—
84
—
°C/W
TEMPERATURE SPECIFICATIONS
Parameter
Conditions
TEMPERATURE RANGE
Overtemperature Hysteresis
PACKAGE THERMAL RESISTANCE
8-lead SOIC (with heat slug)
Note 1:
Note 1
Mounted on JEDEC test PCB (2s 2p)
DS20005599A-page 4
2017 Microchip Technology Inc.
CL320/CL325/CL330
Timing Waveforms
EN
VEN(OFF)
VEN(ON)
tOFF
tON
tRISE
tFALL
90%
IOUT(ON)
IOUT
90%
IOUT(ON)
10%
10%
Temperature Effects
Current (normalized to 25OC)
1.05
1.00
0.95
0.90
0.85
0.80
-50 -40
0
25
50
100 120
150
Junction Temperature (OC)
2017 Microchip Technology Inc.
DS20005599A-page 5
CL320/CL325/CL330
Load Regulation
IOUT (normalized to nominal)
1.20
1.00
0.80
0.60
0.40
0.20
scale change
0
0
5
10
15
20
40
60
80
100
VOUT (V)
Recommended PCB Layout
1cm2 exposed copper
Underside plate soldered
to copper area.
Exposed copper area
may be plated.
1cm2 exposed copper
DS20005599A-page 6
2017 Microchip Technology Inc.
CL320/CL325/CL330
2.0
PIN DESCRIPTION
The pin details of CL320/CL325/CL330 are listed on
Table 2-1. Refer to Package Type for the location of
the pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
EN1
2
EN2
Description
Output enable, active low
3
EN3
4
GND
5
OUT3
6
OUT2
7
OUT1
8
VIN
Supply voltage 6.5V to 90V. Bypass locally with a 100 nF capacitor to ground.
Underside
Plate
GND
The exposed underside plate is internally connected to the GND pin. The plate may
either be left floating or connected to ground. Solder the plate to an exposed copper
area on the PCB for heatsinking purposes. (See Recommended PCB Layout.)
Circuit common
Constant current output (sinking). Connect the cathodes of the LEDs to these pins.
2017 Microchip Technology Inc.
DS20005599A-page 7
CL320/CL325/CL330
3.0
DETAILED DESCRIPTION
3.1
Higher LED Current
By paralleling outputs, higher LED currents can be
achieved. In addition, linear dimming in three discrete
steps may be obtained by enabling 1, 2 or 3 outputs.
VLL
CIN
100 nF
8
VIN
REG
Host
Controller
1
EN1
2
EN2
3
EN3
7
6
5
OUT1
OUT2
OUT3
VDD
GND
4
CL320/CL325/CL330
FIGURE 3-1:
3.2
Paralleling Outputs of the CL320/CL325/CL330 LED Drivers.
Lower Power Dissipation in the
CL320/CL325/CL330
Power dissipation in the CL320/Cl325/Cl330 can be
lowered in multiple ways. The following figures indicate
some of the possible means to reduce power
dissipation in the IC. Refer to Figure 3-2, Figure 3-3
and Figure 3-4.
VLL
VIN
CIN
100nF
8
7
6
5
VIN
OUT1
OUT2
OUT3
REG
Host
Controller
1
EN1
2
EN2
3
EN3
VDD
GND
4
CL320/CL325/CL330
FIGURE 3-2:
DS20005599A-page 8
Using a Separate Voltage Source for VIN that is lower than VLL.
2017 Microchip Technology Inc.
CL320/CL325/CL330
VLL
RDROP
CIN
100nF
8
VIN
REG
Host
Controller
1
EN1
2
EN2
3
EN3
7
6
5
OUT1
OUT2
OUT3
VDD
GND
RDROP <
4
VLL(MIN) - 6.5V
2.3mA
where: RDROP = Dropping resistance
VLL(MIN) = minimum supply voltage
CL320/CL325/CL330
FIGURE 3-3:
Using an External Resistor in Series with the VIN pin.
VLL
ZDROP
CIN
100nF
8
VIN
REG
Host
Controller
1
EN1
2
EN2
3
EN3
7
6
5
OUT1
OUT2
OUT3
VDD
GND
VZ < (VLL(MIN) - 6.5V)
4
where: V = Zener voltage
Z
VLL(MIN) = minimum supply voltage
CL320/CL325/CL330
FIGURE 3-4:
Using an External Zener Diode in Series with the VIN pin.
2017 Microchip Technology Inc.
DS20005599A-page 9
CL320/CL325/CL330
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-lead SOIC
XXXXXXX
e3 YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005599A-page 10
Example
Example
Example
CL320SG
e3 1726
715
CL325SG
e3 1722
815
CL330SG
e3 1795
657
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2017 Microchip Technology Inc.
CL320/CL325/CL330
8-Lead SOIC (Narrow Body w/Heat Slug) Package Outline (SG)
4.90x3.90mm body, 1.70mm height (max), 1.27mm pitch
D1
D
8
8
Exposed
Thermal
Pad Zone
E2
E
E1
Note 1
(Index Area
D/2 x E1/2)
1
1
Top View
Bottom View
θ1
A
View B
h
h
A
A2
Note 1
Seating
Plane
e
A1
L
b
L1
L2
Gauge
Plane
θ
Seating
Plane
A
Side View
View A - A
View B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
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LGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RUDSULQWHGLQGLFDWRU
Symbol
MIN
Dimension
NOM
(mm)
MAX
A
A1
A2
b
1.25*
0.00
1.25
0.31
-
-
-
-
1.70
0.15
1.55*
0.51
D
D1
E
E1
E2
e
4.80* 3.30† 5.80* 3.80* 2.29†
4.90
-
6.00
3.90
-
5.00* 3.81† 6.20* 4.00* 2.79†
1.27
BSC
h
L
0.25
0.40
-
-
0.50
1.27
L1
1.04
REF
L2
0.25
BSC
ș
ș
0O
5O
-
-
8O
15O
JEDEC Registration MS-012, Variation BA, Issue E, Sept. 2005.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ
Drawings not to scale.
2017 Microchip Technology Inc.
DS20005599A-page 11
CL320/CL325/CL330
NOTES:
DS20005599A-page 12
2017 Microchip Technology Inc.
CL320/CL325/CL330
APPENDIX A:
REVISION HISTORY
Revision A (May 2017)
• Consolidated and converted Supertex
Doc# DSFP-CL320, Doc# DSFP-CL325 and
Doc# DSFP-CL330 to Microchip DS20005599A
• Changed package marking format
• Changed the quantity of the SG package from
2500/Reel to 3300/Reel
• Made minor text changes throughout the document
2017 Microchip Technology Inc.
DS20005599A-page 13
CL320/CL325/CL330
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
Devices:
XX
-
Package
Options
X
-
Environmental
X
Media Type
CL320
=
3-Channel, 20 mA Linear LED Driver
CL325
=
3-Channel, 25 mA Linear LED Driver
CL330
=
3-Channel, 30 mA Linear LED Driver
Package:
SG
=
8-lead SOIC (with Heat Slug)
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
3300/Reel for an SG Package
DS20005599A-page 14
Examples:
a)
CL320SG-G:
3-Channel, 20 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
b)
CL325SG-G:
3-Channel, 25 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
c)
CL330SG-G:
3-Channel, 30 mA Linear LED Driver,
8-lead SOIC Package, 3300/Reel
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
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and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
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and other countries.
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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
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Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip Technology Incorporated in
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All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1719-4
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005599A-page 15
Worldwide Sales and Service
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DS20005599A-page 16
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Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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11/07/16
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