DSC60XX
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
General Description
• Wide Frequency Range: 2 kHz to 80 MHz
• Ultra-Low Power Consumption: 1.3 mA/12 A
(Active/Stdby)
• Ultra-Small Footprints
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
- 3.2 mm 2.5 mm
• Frequency Select Input Supports 2 Predefined
Frequencies
• High Stability: ±25, ±50 ppm
• Wide Temperature Range
- Industrial: –40°C to 85°C
- Ext. Commercial: –20° to 70°C
• Excellent Shock & Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: 3.3V VDD.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to 1 Period of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
2016 Microchip Technology Inc.
DS20005625A-page 3
DSC60XX
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD= 1.8V –5% to 3.3V +10%, TA= –40°C to 85°C.
Parameters
Sym.
Min.
Typ.
Max.
—
2.5
3.5
tRX/tFX
Units
ns
—
1.5
2.2
—
1.2
2.0
Conditions
DSC60x3
Low Drive,
20% to 80%
CL=5 pF
VDD = 1.8V
DSC60x1
Std. Drive,
20% to 80%
CL=10 pF
VDD = 1.8V
VDD =
2.5V/3.3V
Output Transition Time
Rise Time/Fall Time
tRY/tFY
Frequency
Output Duty Cycle, Note 8
Period Jitter, RMS
ns
0.6
1.2
f0
0.002
—
80
MHz
Output on Pin 1 for < 1 MHz
SYM
45
—
55
%
—
—
32
40
—
25
32
—
23
30
—
20
28
—
180
240
VDD = 1.8V
DSC60x1
Std. Drive,
FOUT =
27 MHz
VDD = 1.8V
VDD =
2.5V/3.3V
170
VDD =
2.5V/3.3V
DSC60x3
Low Drive,
FOUT =
27 MHz
VDD = 1.8V
DSC60x1,
Std. Drive,
FOUT =
27 MHz
VDD =
2.5V/3.3V
ps
—
3:
4:
5:
6:
7:
8:
120
JCy–Cy
—
Note 1:
2:
DSC60x3
Low Drive,
FOUT =
27 MHz
psRMS
JPER
—
Cycle-to-Cycle Jitter
(peak)
VDD =
2.5V/3.3V
—
115
90
190
150
Pin 4 VDD should be filtered with 0.1 uf capacitor.
Not including current through pull-up resistor on EN pin (if configured). Higher standby current seen at
>3.3V VDD.
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to 1 Period of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Output Duty Cycle will be 40% to 60% when output frequency is between 40 MHz to 60 MHz.
DS20005625A-page 4
2016 Microchip Technology Inc.
DSC60XX
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TJ
—
+150
—
°C
—
Storage Temperature Range
TA
–55
—
+150
°C
—
Soldering Temperature
TS
—
+260
—
°C
40 Sec. Max.
Temperature Ranges
Junction Operating Temperature
2016 Microchip Technology Inc.
DS20005625A-page 5
DSC60XX
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
DSC6001/03/11/13/21/23/41/43/51/53/61/63 PIN FUNCTION TABLE (OUTPUT ≥1 MHZ)
Pin Number
Pin Name
Pin Type
Output Enable: H = Specified Frequency Output, Note 1
L = Output is high impedance
OE
1
STBY
Description
I
Standby: H = Specified Frequency Output, Note 1
L = Output is high impedance, Device is in low power
mode, Supply current is at ISTBY
Frequency Select: H = Output Frequency 1, Note 2
L = Output Frequency 2
FS
2
GND
Power
Power supply ground
3
Output
O
Oscillator clock output
4
VDD
Power
Power supply, Note 3
Note 1: DSC600x/1x/2x has 300 kΩ internal pull-up resistor on pin1. DSC604x/5x/6x has no internal pull-up resistor
on pin1 and needs external pull up or being driven by other chip.
2: Two pre-programmed frequencies can be configured at http://clockworks.microchip.com/timing/.
3: Bypass with 0.1 μF capacitor placed as close to VDD pin as possible.
TABLE 2-2:
DSC6083 PIN FUNCTION TABLE (OUTPUT FREQUENCY < 1 MHZ)
Pin Number
Pin Name
Pin Type
1
Output
O
2
GND
Power
3
DNC
DNC
4
Note 1:
Description
Oscillator clock output
Power supply ground
Do Not Connect
VDD
Power
Power supply, Note 1
Bypass with 0.1 μF capacitor placed as close to VDD pin as possible.
DSC60xx family is available in multiple output driver configurations.
The low-drive DSC60x3 is configured with a low-power driver minimizing current consumption and EMI while delivering
greater than 1 mA output current at 20%/80% of the supply voltage. The standard-drive DSC60x1 delivers greater than
3 mA output current at 20%/80% of the supply voltage.
DS20005625A-page 6
2016 Microchip Technology Inc.
DSC60XX
3.0
OUTPUT WAVEFORM
FIGURE 3-1:
OUTPUT WAVEFORM
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
2016 Microchip Technology Inc.
VIL
DS20005625A-page 7
DSC60XX
4.0
TEST CIRCUIT
FIGURE 4-1:
TEST CIRCUIT
µ
DS20005625A-page 8
4
3
1
2
CL
2016 Microchip Technology Inc.
DSC60XX
5.0
BOARD LAYOUT (RECOMMENDED)
FIGURE 5-1:
BOARD LAYOUT (RECOMMENDED)
2016 Microchip Technology Inc.
DS20005625A-page 9
DSC60XX
6.0
SOLDER REFLOW PROFILE
FIGURE 6-1:
SOLDER REFLOW
20-40
Sec
Se
ax
cM
Se
3C
/
Reflow
Pre heat
8 min max
x.
25°C
60-180
Sec
Ma
150°C
60-150
Sec
ec
.
3C
/
217°C
200°C
S
6C/
Temperature (°C)
cM
ax
.
260°C
Cool
Time
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/Sec Max.
Preheat Time 150°C to 200°C
60-180 Sec
Time maintained above 217°C
60-150 Sec
Peak Temperature
255-260°C
Time within 5°C of actual Peak
Ramp-Down Rate
Time 25°C to Peak Temperature
DS20005625A-page 10
20-40 Sec
6°C/Sec Max.
8 min. Max.
2016 Microchip Technology Inc.
DSC60XX
7.0
PACKAGING INFORMATION
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
3X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005625A-page 11
DSC60XX
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
A
Overall Height
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
E
Overall Width
b1
Terminal Width
Terminal Width
b2
L
Terminal Length
Terminal 1 Index Chamfer
CH
MILLIMETERS
NOM
MAX
4
1.20 BSC
0.75 BSC
0.79
0.89
0.84
0.00
0.05
0.02
0.20 REF
1.60 BSC
1.20 BSC
0.25
0.30
0.35
0.325
0.425
0.375
0.30
0.40
0.35
0.125
MIN
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
DS20005625A-page 12
2016 Microchip Technology Inc.
DSC60XX
4-Lead VFLGA 1.6 mm x 1.2 mm Recommended Land Pattern
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E1
Contact Pitch
E2
Contact Spacing
C
Contact Width (X3)
X1
Contact Width
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.20 BSC
1.16 BSC
0.75
MAX
0.35
0.43
0.50
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
2016 Microchip Technology Inc.
DS20005625A-page 13
DSC60XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
C
A1
A
SEATING
PLANE
4X
(A3)
SIDE VIEW
b2
3X b1
0.07
0.03
CH
1
0.08 C
2
CH
NOTE 1
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
DS20005625A-page 14
2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.0 mm x 1.6 mm Package Outline (Continued)
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
b1
Terminal Width
Terminal Width
b2
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.30
0.40
0.50
-
MILLIMETERS
NOM
6
1.55 BSC
0.95 BSC
0.84
0.02
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
0.15
MAX
0.89
0.05
0.40
0.50
0.60
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
2016 Microchip Technology Inc.
DS20005625A-page 15
DSC60XX
4-Lead VFLGA 2.0 mm x 1.6 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X1
Contact Width (X2)
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.55 BSC
0.95
MAX
0.50
0.40
0.70
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
DS20005625A-page 16
2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
0.05 C
2
TOP VIEW
0.10 C
A1
C
A
SEATING
PLANE
(A3)
4X
SIDE VIEW
0.08 C
4X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005625A-page 17
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Package Outline (Continued)
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
e1
Terminal Pitch
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
Terminal Width
b1
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.60
0.60
-
MILLIMETERS
NOM
4
1.65 BSC
1.25 BSC
0.84
0.02
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
MAX
0.89
0.05
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
DS20005625A-page 18
2016 Microchip Technology Inc.
DSC60XX
4-Lead VLGA 2.5 mm x 2.0 mm Recommended Land Pattern
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.65 BSC
1.25
MAX
0.70
0.80
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
2016 Microchip Technology Inc.
DS20005625A-page 19
DSC60XX
4-Lead CDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
TITLE
4 LEAD CDFN 3.2x2.5mm COL PACKAGE OUTLINE & RECOMMENDED LAND PATTERN
DRAWING # CDFN3225-4LD-PL-1
UNIT MM
NOTE:
1.
Green shaded rectangles in Recommended Land Pattern are solder stencil opening.
DS20005625A-page 20
2016 Microchip Technology Inc.
DSC60XX
APPENDIX A:
REVISION HISTORY
Revision A (September 2016)
• Initial creation of DSC60XX Microchip data sheet
DS20005625A.
2015 Microchip Technology Inc.
DS20005625A-page 21
DSC60XX
NOTES:
DS20005625A-page 22
2015 Microchip Technology Inc.
DSC60XX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
Examples:
X
X
X
X
X – XXX.XXXX
X
a)
Device Pin 1 Output Package Temperature Frequency Revision Frequency Tape
Definition Drive
and
Range
Stability
Strength
Reel
Device:
DSC60XX:
Pin Definition:
Selection
Pin 1
0
OE
Pull-up
1
STDBY
Pull-up
2
FS
Pull-up
4
OE
None
5
STDBY
None
6
FS
None
8
KHz
Output
None
Output Drive
Strength:
1
3
Standard
Low
Packages:
C
J
M
H
=
=
=
=
4-Lead 3.2 mm x 2.5 mm DFN
4-Lead 2.5 mm x 2.0 mm VFLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
E
I
=
=
-20C to +70C (Extended Commercial)
-40C to +85C (Industrial)
Frequency
Stability:
1
2
=
=
± 50 ppm
± 25 ppm
Revision:
A
=
Revision A
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 80.0000 MHz
xxxkxxx = User-Defined Frequency between 002.000 kHz
and 999.999 kHz
xxxx
= Frequency configuration code when pin 1 = FS.
Configure the part online through ClockWorks
configurator.
Tape and Reel:
Note 1:
Blank
T
=
=
Ultra-Low Power MEMS Oscillator
Internal Pull Register
Bulk
Tape and Reel
b)
c)
d)
DSC6013JI2A-024.0000: Ultra–Low Power MEMS
Oscillator, Pin1= Standby
with internal Pull–Up, Low
Output Drive Strength, 4Lead 2.5 mm x2.0 mm
VFLGA, Industrial Temperature (–40°C to 85°C),
±25 ppm,
Revision
A,
24 MHz Frequency, Bulk
DSC6001HE1A-016.0000T: Ultra–Low
Power
MEMS Oscillator, Pin1= OE
with internal Pull–Up, Standard Output Drive Strength,
4-Lead 1.6 mm x1.2 mm
VFLGA, Extended Commercial Temperature
(–20°C to 70°C), ±50 ppm,
Revision A, 16 MHz Frequency, Tape and Reel
DSC6083ME1A-032k768:
Ultra–Low
Power
MEMS Oscillator, Pin1=
32.768KHz Clock Output ,
Low Output Drive Strength,
4-Lead 2.0 mm x1.6 mm
VFLGA, Extended Commercial Temperature
(–20°C to 70°C), ±50 ppm,
Revision A, Bulk
DSC6023CI2A-001B:
Ultra–Low Power MEMS
Oscillator, Pin1= FS with
internal Pull-up, Low Output Drive Strength, 4-Lead
3.2 mm x2.5 mm CDFN,
Industrial Temperature
(–40°C to 85°C), ±25 ppm,
Revision A, Frequency
code = 001B (configured
through ClockWorks), Bulk
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/.
2016 Microchip Technology Inc.
DS20005625A-page 23
DSC60XX
NOTES:
DS20005625A-page 24
2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0960-1
2016 Microchip Technology Inc.
DS20005625A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
06/23/16
DS00000A-page 26
2016 Microchip Technology Inc.
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