HV2662/HV2762
Low Harmonic Distortion, 24-Channel SPST
High-Voltage Analog Switch
Features
General Description
•
•
•
•
•
•
•
•
•
•
•
•
•
•
HV2662/HV2762 are low-charge injection, low harmonic distortion, 24-channel, high-voltage analog
switch integrated circuits (ICs). These ICs excel in
applications requiring high-voltage switching controlled
by low-voltage control signals, such as medical ultrasound imaging, piezoelectric transducer driver, and
printers. HV2762 provides integrated bleed resistors
that eliminate voltage build-up on capacitive loads such
as piezoelectric transducers. HV2662 does not have
integrated bleed resistors.
24-Channel of High-Voltage Analog Switch
3.3V or 5.0V CMOS Input Logic Level
24-Channel SPST Configuration
20 MHz Data Shift Clock Frequency
HVCMOS Technology for High Performance
Very Low Quiescent Power Dissipation (~10 µA)
Low Parasitic Capacitance
DC to 50 MHz Analog Signal Frequency
-60 dB Typical OFF-Isolation at 5.0 MHz
CMOS Logic Circuitry for Low Power
Excellent Noise Immunity
Cascadable Serial Data Register with Latches
Flexible Operating Supply Voltages
Integrated Bleed Resistors on Outputs (HV2762
HV2662/HV2762 shift input data into a 24-bit shift register that can then be retained in a 24-bit latch. To
reduce any possible clock feed through noise, the
latch-enable bar should be left high until all bits are
clocked in during the rising edge of the clock. Using
High-Voltage CMOS technology, these ICs combine
high-voltage, bilateral DMOS switches and low-power
CMOS logic to provide efficient control of high voltage
analog signals.
Only)
Applications
•
•
•
•
Medical Ultrasound Imaging
Piezoelectric Transducer Drivers
Inkjet Printer Heads
Optical MEMS Modules
The device is suitable for various combinations of high
voltage supplies, e.g., VPP/VNN: +40V/-160V, +100V/100V, and +160V/-40V.
Package Types
1
2
3
4
5
6
7
8
9
10
A
B
C
D
E
Top View
F
G
H
J
K
See Table 2-1 for pin information.
2016-2020 Microchip Technology Inc.
64-ball VFBGA
DS20005372B-page 1
HV2662/HV2762
Functional Block Diagram
Latches
CLK
DIN
24-Bit
Shift
Register
DOUT
VDD
Note:
GND
LE CLR
Level
Output
Shifters Switches
D
LE
CLR
SW0
D
LE
CLR
SW1
D
LE
CLR
SW2
D
LE
CLR
SW22
D
LE
CLR
SW23
VPP VNN
RGND
Bleed resistors and RGND only apply to HV2762.
DS20005372B-page 2
2016-2020 Microchip Technology Inc.
HV2662/HV2762
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
VDD Logic Supply ............................................................................................................................................................. -0.50 to +6.5V
VPP - VNN Differential Supply ......................................................................................................................................................... 220V
VPP Positive Supply ..................................................................................................................................................-0.5 to VNN + 200V
VNN Negative Supply ........................................................................................................................................................ +0.5 to -200V
Logic Input Voltage .................................................................................................................................................. -0.5V to VDD +0.3V
Analog Signal Range ............................................................................................................................................................ VNN to VPP
Peak Analog Signal Current/Channel ............................................................................................................................................. 2.0A
Storage Temperature ................................................................................................................................................... -65°C to +150°C
Power Dissipation .......................................................................................................................................................................... 1.0W
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS (1,2,3)
Symbol
Parameter
Value
VDD
Logic Power Supply Voltage
3.0V to 5.5V (2)
VPP
Positive High-Voltage Supply
VNN
Negative High-Voltage Supply
-40V to -160V (2)
VIH
High-Level Input Voltage
0.9VDD to VDD
VIL
Low-Level Input Voltage
VSIG
TA
+40V to VNN +200V (2)
0V to 0.1 VDD
Analog Signal Voltage Peak-to-Peak
VNN +10V to VPP -10V (3)
Operating Free Air Temperature
0°C to +70°C
Note 1: Power-up/down sequence is arbitrary except GND must be powered-up first and powered-down last.
2: Rise and fall times of power supplies VDD, VPP, and VNN should not be less than 1.0 msec.
3: VSIG must be VNN ≤ VSIG ≤ VPP or floating during power-up/down transition.
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise specified.
See test circuits in Figure 3-2.
Parameter
Small Signal Switch
ON-Resistance
Symbol
0°C
+25°C
Min. Max. Min.
RONS
Typ.
+70°C
Max. Min. Max.
Units
Conditions
—
—
—
26
—
—
—
—
—
—
22
—
—
—
ISIG = 5.0 mA VPP = +40V,
I
200 mA VNN = -160V
—
—
—
22
—
—
—
ISIG = 5.0 mA
—
—
—
18
—
—
—
—
—
—
20
—
—
—
—
—
—
16
—
—
—
SIG =
Ω
VPP = +100V,
ISIG = 200 mA VNN = -100V
ISIG = 5.0 mA VPP = +160V,
I
= 200 mA VNN = -40V
SIG
Small Signal Switch
ΔRONS
ON-Resistance Matching
—
20
—
5.0
20
—
20
%
ISIG = 5.0 mA, VPP = +100V,
VNN = -100V
Large Signal Switch
ON-Resistance
—
—
—
30
—
—
—
Ω
VSIG = VPP -10V, ISIG = 1A
(Note 1)
RONL
Note 1: Specification is obtained by characterization and is not 100% tested.
2: Design guidance only.
2016-2020 Microchip Technology Inc.
DS20005372B-page 3
HV2662/HV2762
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Over recommended operating conditions unless otherwise specified.
See test circuits in Figure 3-2.
Parameter
Symbol
0°C
+25°C
Min. Max. Min.
Typ.
+70°C
Max. Min. Max.
Units
Conditions
Output-Switch Shunt
Resistance
(HV2762 Only)
RINT
—
—
20
35
50
—
—
KΩ
Output Switch to RGND,
IRINT = 0.5 mA
Switch OFF-Leakage
per Switch
ISOL
—
5.0
—
1.0
10
—
15
μA
VSIG = VPP -10V, VNN +10V
DC Offset Switch OFF
VOS
—
300
—
100
300
—
300
mV
—
500
—
100
500
—
500
No load for HV2762.
RLOAD = 100 KΩ for HV2662
μA
All switches OFF
μA
All switches ON,
ISW = 5.0 mA
VSIG duty cycle < 0.1%
(Note 1)
DC Offset Switch ON
Quiescent VPP Supply
Current
IPPQ
—
—
—
10
50
—
—
Quiescent VNN Supply
Current
INNQ
—
—
—
-10
-50
—
—
Quiescent VPP Supply
Current
IPPQ
—
—
—
10
50
—
—
Quiescent VNN Supply
Current
INNQ
—
—
—
-10
-50
—
—
Switch Output Peak
Current
ISW
—
—
—
2.0
1.3
—
—
A
Output Switching
Frequency
fSW
—
—
—
—
50
—
—
kHz
—
4.0
—
—
4.5
—
5.0
—
4.0
—
—
4.5
—
5.0
—
4.0
—
—
4.5
—
5.0
VPP= +160V,
VNN = -40V
—
4.0
—
—
4.5
—
5.0
VPP = +40V,
VNN = -160V
—
4.0
—
—
4.5
—
5.0
—
4.0
—
—
4.5
—
5.0
Average VPP Supply
Current
Average VNN Supply
Current
IPP
INN
Duty cycle = 50%
(Note 1)
VPP= +40V,
VNN = -160V
mA
mA
VPP= +100V,
VNN = -100V
VPP= +100V,
VNN = -100V
VPP= +160V,
VNN = -40V
All output
switches are
turning ON
and OFF at
50 kHz with
no load.
All output
switches are
turning ON
and OFF at
50 kHz with
no load.
Average VDD Supply
Current
IDD
—
8.0
—
—
8.0
—
8.0
mA
fCLK = 5.0 MHz, VDD = 5.0V
Quiescent VDD Supply
Current
IDDQ
—
10
—
—
10
—
10
μA
All logic inputs are static
Data Out Source Current
ISOR
0.45
—
0.45
0.70
—
0.40
—
mA
VOUT = VDD -0.7V
Data Out Sink Current
ISINK
0.45
—
0.45
0.70
—
0.40
—
mA
VOUT = 0.7V
Logic Input Capacitance
CIN
—
10
—
—
10
—
10
pF
(Note 2)
Note 1: Specification is obtained by characterization and is not 100% tested.
2: Design guidance only.
DS20005372B-page 4
2016-2020 Microchip Technology Inc.
HV2662/HV2762
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise specified.
See test circuits in Figure 3-2.
Parameter
Symbol
Setup Time Before
LE Rises
tSD
Min.
Typ.
Max.
Min.
Max.
25
—
25
—
—
25
—
56
12
9.0
8.0
55
21
7.0
5.0
5.0
—
—
—
—
40
30
—
—
—
—
—
8
20
56
12
9.0
8.0
55
21
7.0
5.0
5.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
40
30
—
—
—
—
—
8
20
56
12
9.0
8.0
55
21
7.0
5.0
5.0
—
—
—
—
40
30
—
—
—
—
—
8
20
tR, tF
—
50
—
—
50
—
50
tON
tOFF
—
—
—
5.0
5.0
20
—
—
—
—
—
—
5.0
5.0
20
—
—
—
5.0
5.0
20
—
20
—
—
20
—
20
—
20
—
—
20
—
20
-30
—
-30
-33
—
-30
—
-58
—
-58
-60
—
-58
—
Clock Delay Time to
Data Out
tDO
Clock Frequency
Clock Rise and Fall
Times
Turn ON Time
Turn OFF Time
Maximum VSIG
Slew Rate
70°C
Max.
tWLE
Hold Time Data
from Clock
25°C
Min.
Time Width of LE
Time Width of CLR
Setup Time Data to
Clock
0°C
tWCLR
tSU
tH
fCLK
dv/dt
OFF Isolation
KO
Switch Crosstalk
KCR
-60
—
-60
-70
—
-60
—
IID
—
300
—
—
300
—
300
CSG(OFF)
—
14
—
9.0
14
—
14
CSG(ON)
—
17
—
12
17
—
17
Output Switch
Isolation Diode
Current
OFF Capacitance
SW to GND
ON Capacitance
SW to GND
—
—
—
—
150
—
—
+VSPK
-VSPK
—
—
—
—
150
—
—
+VSPK
—
—
—
—
150
—
—
Output Voltage
Spike (per Switch)
-VSPK
—
—
—
—
150
—
—
+VSPK
—
—
—
—
150
—
—
-VSPK
—
—
—
—
150
—
—
Note 1: Specification is obtained by characterization and is not 100% tested.
2016-2020 Microchip Technology Inc.
Units
ns
Conditions
(Note 1)
VDD = 3.0V (Note 1)
VDD = 5.0V (Note 1)
VDD = 3.0V (Note 1)
ns
VDD = 5.0V (Note 1)
ns (Note 1)
VDD = 3.0V (Note 1)
ns
VDD = 5.0V (Note 1)
VDD = 3.0V (Note 1)
ns
VDD = 5.0V (Note 1)
VDD = 3.0V
MHz
VDD = 5.0V (Note 1)
ns
ns
(Note 1)
μs
VSIG = VPP -10V,
RLOAD = 10 kΩ
VPP = +40V, VNN = -160V
(Note 1)
VPP = +100V, VNN = -100V
V/ns
(Note 1)
VPP = +160V, VNN = -40V
(Note 1)
f = 5.0 MHz,
1.0 KΩ//15 pF load (Note 1)
dB
f = 5.0 MHz, 50Ω load
(Note 1)
f = 5.0 MHz, 50Ω load
dB
(Note 1)
mA
300 ns pulse width,
2.0% duty cycle (Note 1)
pF
VSIG = 0V, f = 1.0 MHz
(Note 1)
VPP = +40V, VNN = -160V
RLOAD = 50Ω (Note 1)
mV
VPP = +100V, VNN = -100V
RLOAD = 50Ω (Note 1)
VPP = +160V, VNN = -40V
RLOAD = 50Ω (Note 1)
DS20005372B-page 5
HV2662/HV2762
AC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Over recommended operating conditions unless otherwise specified.
See test circuits in Figure 3-2.
Parameter
Charge Injection
(per Switch)
Symbol
QC
0°C
25°C
70°C
Min.
Max.
Min.
Typ.
Max.
Min.
Max.
—
—
—
820
—
—
—
—
—
—
600
—
—
—
—
—
—
350
—
—
—
Units
Conditions
pC
VPP = +40V, VNN = -160V
(Note 1)
VPP = +100V, VNN = -100V
(Note 1)
VPP = +160V, VNN = -40V
(Note 1)
Note 1: Specification is obtained by characterization and is not 100% tested.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, for all specifications TA =TJ = +25°C
Parameter
Symbol
Min
Typ
Max
Units
TA
-65
—
+150
°C
θja
—
36
—
°C/W
Conditions
Temperature Ranges
Storage Temperature
Package Thermal Resistances
Thermal Resistance, 64-Ball VFBGA
DS20005372B-page 6
2016-2020 Microchip Technology Inc.
HV2662/HV2762
2.0
PIN DESCRIPTION
The locations of the balls are listed in Package Types.
TABLE 2-1:
BALL DESCRIPTION 64-BALL VFBGA
Pin #
HV2662
HV2762
Description
A1
SW22B
SW22B
Analog switch 22 terminal B
A2
VNN
VNN
A3
SW21B
SW21B
Analog switch 21 terminal B
A4
SW20B
SW20B
Analog switch 20 terminal B
A5
SW19B
SW19B
Analog switch 19 terminal B
A6
SW18B
SW18B
Analog switch 18 terminal B
A7
SW17B
SW17B
Analog switch 17 terminal B
A8
SW16B
SW16B
Analog switch 16 terminal B
A9
SW15B
SW15B
Analog switch 15 terminal B
A10
SW15A
SW15A
Analog switch 15 terminal A
B1
SW23B
SW23B
Analog switch 23 terminal B
B2
SW23A
SW23A
Analog switch 23 terminal A
B3
SW22A
SW22A
Analog switch 22 terminal A
B4
SW21A
SW21A
Analog switch 21 terminal A
B5
SW20A
SW20A
Analog switch 20 terminal A
B6
SW19A
SW19A
Analog switch 19 terminal A
B7
SW18A
SW18A
Analog switch 18 terminal A
B8
SW17A
SW17A
Analog switch 17 terminal A
B9
SW16A
SW16A
Analog switch 16 terminal A
B10
SW14B
SW14B
C1
NC
NC
No connect
C2
VPP
VPP
Positive supply voltage
Negative supply voltage
Analog switch 14 terminal B
C9
SW14A
SW14A
Analog switch 14 terminal A
C10
SW13B
SW13B
Analog switch 13 terminal B
D1
CLR
CLR
D2
NC
RGND
D9
VNN
VNN
D10
SW13A
SW13A
Latch clear logic input
No connect/Ground for bleed resistor
Negative supply voltage
Analog switch 13 terminal A
E1
LE
LE
E2
CLK
CLK
E9
SW12B
SW12B
E10
SW12A
SW12A
F1
VDD
VDD
Logic supply voltage
F2
GND
GND
Ground
F9
SW11B
SW11B
F10
SW11A
SW11A
G1
DIN
DIN
G2
DOUT
DOUT
G9
SW10B
SW10B
G10
VNN
VNN
H1
NC
RGND
VPP
VPP
H2
2016-2020 Microchip Technology Inc.
Latch-enable logic input, low active
Clock logic input for shift register
Analog switch 12 terminal B
Analog switch 12 terminal A
Analog switch 11 terminal B
Analog switch 11 terminal A
Data-in logic input
Data-out logic output
Analog switch 10 terminal B
Negative supply voltage
No connect/ Ground for bleed resistor
Positive supply voltage
DS20005372B-page 7
HV2662/HV2762
TABLE 2-1:
BALL DESCRIPTION 64-BALL VFBGA (CONTINUED)
Pin #
HV2662
HV2762
Description
H9
SW10A
SW10A
Analog switch 10 terminal A
H10
SW9B
SW9B
Analog switch 9 terminal B
J1
SW0A
SW0A
Analog switch 0 terminal A
J2
SW0B
SW0B
Analog switch 0 terminal B
J3
SW1B
SW1B
Analog switch 1 terminal B
J4
SW2B
SW2B
Analog switch 2 terminal B
J5
SW3B
SW3B
Analog switch 3 terminal B
J6
SW4B
SW4B
Analog switch 4 terminal B
J7
SW5B
SW5B
Analog switch 5 terminal B
J8
SW6B
SW6B
Analog switch 6 terminal B
J9
SW7B
SW7B
Analog switch 7 terminal B
J10
SW9A
SW9A
Analog switch 9 terminal A
K1
SW1A
SW1A
Analog switch 1 terminal A
K2
VNN
VNN
K3
SW2A
SW2A
Analog switch 2 terminal A
K4
SW3A
SW3A
Analog switch 3 terminal A
K5
SW4A
SW4A
Analog switch 4 terminal A
K6
SW5A
SW5A
Analog switch 5 terminal A
K7
SW6A
SW6A
Analog switch 6 terminal A
K8
SW7A
SW7A
Analog switch 7 terminal A
K9
SW8A
SW8A
Analog switch 8 terminal A
K10
SW8B
SW8B
Analog switch 8 terminal B
DS20005372B-page 8
Negative supply voltage
2016-2020 Microchip Technology Inc.
HV2662/HV2762
3.0
FUNCTIONAL DESCRIPTION
DN - 1
DN
DN + 1
DATA IN
DIN
5 0%
LE
50%
50%
50%
tWLE
tSD
50%
CLOCK
50%
th
tSU
tDO
DATA OUT
DOUT
VOUT
50%
tON
tOFF
OFF
90%
(typ)
1 0%
ON
CLR
5 0%
5 0%
tWCL
FIGURE 3-1:
TABLE 3-1:
D0
1
D1
L
H
—
—
—
—
—
—
—
—
—
—
L
H
—
—
—
—
—
—
—
—
—
—
—
—
X
X
—
—
—
—
—
—
X
X
Logic Timing Waveforms.
TRUTH TABLE
...
...
X
X
D15
D16
—
—
—
—
—
—
L
H
—
—
—
—
—
—
—
—
—
—
L
H
—
—
—
—
—
—
X
X
—
—
—
—
—
—
X
X
...
...
X
X
CLR4 SW05,6
D232
LE3
—
—
—
—
—
—
—
—
—
—
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
OFF
ON
—
—
—
—
—
—
—
—
—
—
—
—
L
H
X
X
L
L
L
L
L
L
H
X
L
L
L
L
L
L
L
H
—
—
—
—
—
—
SW1
—
—
OFF
ON
—
—
—
—
—
—
...
...
SW15
SW16
—
—
—
—
—
—
OFF
ON
—
—
—
—
—
—
—
—
—
—
OFF
ON
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
HOLD PREVIOUS STATE
ALL SWITCHES OFF
...
...
SW23
—
—
—
—
—
—
—
—
—
—
—
—
—
—
OFF
ON
Note 1: Serial data is clocked in on the L to H transition of the CLK.
2: DOUT is high when data in the register 23 is high.
3: Shift registers clocking has no effect on the switch states if LE is high.
4: The CLR clear input overrides all other inputs.
5: The 24 switches operate independently.
6: All 24 switches go to a state retaining their latched condition at the rising edge of LE. When LE is low, the
shift registers data flow through the latch.
2016-2020 Microchip Technology Inc.
DS20005372B-page 9
HV2662/HV2762
3.1
Application Information
VPP -10V
ISOL
VPP -10V
10kΩ
RLOAD
VOUT
VOUT
Open
Open
RGND
RGND
RGND
VPP
VPP
VDD
VNN
VNN
GND
5V
VPP
VPP
VDD
VNN
VNN
GND
Switch Off Leakage
per Switch
5V
VPP
VDD
VNN
VNN
GND
5V
TON/TOFF
Test Circuit
DC Offset Switch
ON/OFF
VIN =10VPP
@5.0MHz
VIN =10VPP
@5.0MHz
VSIG
IID
VOUT
VNN
RLOAD
VPP
VPP
VDD
VNN
VNN
GND
KO = 20Log
5V
NC
50Ω
RGND
RGND
50Ω
RGND
VPP
VPP
VDD
VNN
VNN
GND
5V
VPP
VPP
VDD
VNN
VNN
GND
VOUT
VIN
KCR = 20Log
Output Switch
Isolation Diode Current
OFF Isolation
5V
VOUT
VIN
Switch Crosstalk
+VSPK
ΔVOUT
VOUT
VOUT
–VSPK
1000pF
VSIG
RGND
RLOAD
50Ω
RGND
1kΩ
VPP
VPP
VDD
VNN
VNN
GND
Q = 1000pF x ΔVOUT
Charge Injection
Note:
VPP
5V
VPP
VPP
VDD
VNN
VNN
GND
5V
Output Voltage Spike
RGND only applies to HV2762.
FIGURE 3-2:
DS20005372B-page 10
Test Circuits.
2016-2020 Microchip Technology Inc.
HV2662/HV2762
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
64-Ball VFBGA
XXXXXXXXX
XXXXXXXXX
XXXXXXX e3
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
HV2662
GA e3 15
03343
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator (e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2016-2020 Microchip Technology Inc.
DS20005372B-page 11
HV2662/HV2762
64-Ball Very Thin Fine Pitch Ball Grid Array (GA) - 7x7x1.0 mm Body [VFBGA]
Supertex Legacy
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
D/4
B
E/4
E
0.10 C
2X
0.10 C
TOP VIEW
A3
A
SEATING
PLANE
C
SIDE VIEW
SEE DETAIL B
D1
e
e/2
E1
DETAIL A
BOTTOM VIEW
Microchip Technology Drawing C04-370-GA Rev A Sheet 1 of 2
DS20005372B-page 12
2016-2020 Microchip Technology Inc.
HV2662/HV2762
64-Ball Very Thin Fine Pitch Ball Grid Array (GA) - 7x7x1.0 mm Body [VFBGA]
Supertex Legacy
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NX Øb
Ø0.15
Ø0.05
C A B
C
SOLDER BALL
DETAIL A
0.10 C
0.08 C
C
A1
DETAIL A
Units
Dimension Limits
N
Number of Pins
e
Pitch
A
Overall Height
Standoff
A1
A3
Molded Cap Thickness
E
Overall Width
E1
Overall Ball Pitch
D
Overall Length
D1
Overall Ball Pitch
Øb
Ball Diameter
MIN
0.16
0.25
MILLIMETERS
NOM
64
0.65 BSC
0.45 REF
7.00 BSC
5.85 BSC
7.00 BSC
5.85 BSC
0.30
MAX
1.00
0.25
0.35
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-370-GA Rev A Sheet 2 of 2
2016-2020 Microchip Technology Inc.
DS20005372B-page 13
HV2662/HV2762
64-Ball Very Thin Fine Pitch Ball Grid Array (GA) - 7x7x1.0 mm Body [VFBGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
ØX
C2
E1
E2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E1
Contact Pitch
E2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Diameter (X64)
X
MIN
MILLIMETERS
NOM
0.65 BSC
0.65 BSC
5.85
5.85
0.25
MAX
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2370-GA Rev A
DS20005372B-page 14
2016-2020 Microchip Technology Inc.
HV2662/HV2762
APPENDIX A:
REVISION HISTORY
Revision A (May 2016)
• Converted Supertex Docs #’s DSFP-2662 and
DSFP-HV2762 to Microchip DS20005372.
• Merged HV2662 and HV2762 into one document.
• Updated “Product Identification System”.
Removed parts with a package code of “LA”;
Added package “GA”.
• EOL of 64-Ball LFGA package (LB) per PCN
JAON-20WQKC840.
• Added information for 64-Ball VFBGA (GA)
throughout.
• Minor text changes throughout.
Revision B (August 2020)
• Updated Packaging Information section.
• Made minor typographical corrections.
2016-2020 Microchip Technology Inc.
DS20005372B-page 15
HV2662/HV2762
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
-
XX
X
-
Package Environmental
Options
X
Media
Type
Device:
HV2662 = 24-Channel, HV Analog Switch
HV2762 = 24-Channel, HV Analog Switch with Bleed
Resistors
Package:
GA
= 64-ball VFBGA
Environmental
G
= Lead (Pb)-free/RoHS-compliant package
Media Type:
(blank)
= 120/Tray for GA package
DS20005372B-page 16
Examples:
a)
HV2662GA-G:
64-ball VFBGA package,
120/Tray
b)
HV2762GA-G:
64-ball VFBGA package,
120/Tray
2016-2020 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Information regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2016-2020, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2016-2020 Microchip Technology Inc.
ISBN: 978-1-5224-6674-1
DS20005372B-page 17
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
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Corporate Office
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DS20005372B-page 18
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2016-2020 Microchip Technology Inc.
02/28/20