MCP1256/7/8/9
Regulated 3.3V, Low-Ripple Charge Pump with LowOperating Current SLEEP Mode or BYPASS Mode
Features
Description
• Inductorless 1.5x, 2x Boost DC/DC Converter
• Output Voltage: 3.3V
• High Output Voltage Accuracy:
- ±3.0% (VOUT Fixed)
• Output Current Up To 100 mA
• 20 mVPP Output Voltage Ripple
• Thermal Shutdown and Short Circuit Protection
• Uses Small Ceramic Capacitors
• Switching Frequency: 650 kHz
• Low-Power SLEEP Mode: MCP1256/7
• BYPASS Mode: MCP1258/9
• Low-Power Shutdown Mode: 0.1 µA (Typical)
• Shutdown Input Compatible with 1.8V Logic
• VIN Range: 1.8V to 3.6V
• Soft-Start Circuitry to Minimize Inrush Current
• Temperature Range: -40°C to +125°C
• Packaging:
- 10-Pin, 3 mm x 3 mm DFN
- 10-Pin, MSOP
The MCP1256, MCP1257, MCP1258 and MCP1259
are inductorless, positive regulated charge pump
DC/DC converters. The devices generate a regulated
3.3V output voltage from a 1.8V to 3.6V input. The
devices are specifically designed for applications
operating from 2-cell alkaline, Ni-Cd, or Ni-MH
batteries or by one primary lithium MnO2 (or similar)
coin cell battery.
Applications
•
•
•
•
Pagers
Portable Measurement Instruments
Home Automation Products
PIC® MCU Bias
Typical Application
MCP1256
INPUT
1.8V to 3.6V
CIN
10 µF
7 V
IN
VOUT
10 SHDN
1
PGOOD
C1
1 µF
ON / OFF
4 C +
1
8 C 1
OUTPUT
3.3V
5
C2+
6
C2-
3
R1
COUT
10 µF
Power-Good
Indication
C2
1 µF
The MCP1256, MCP1257, MCP1258 and MCP1259
provide high efficiency by automatically switching
between 1.5x and 2x boost operation. In addition, at
light output loads, the MCP1256 and MCP1257 can be
placed in a SLEEP mode, lowering the quiescent
current while maintaining the regulated output voltage.
Alternatively, the MCP1258 and MCP1259 provide a
BYPASS feature connecting the input voltage to the
output.
This
allows
for
real-time
clocks,
microcontrollers or other system devices to remain
biased with virtually no current being consumed by the
MCP1258 or MPC1259.
In normal operation, the output voltage ripple is below
20 mVPP at load currents up to 100 mA. Normal operation occurs at a fixed switching frequency of 650 kHz,
avoiding interference with sensitive IF bands.
The MCP1256 and MCP1258 feature a power-good
output that can be used to detect out-of-regulation
conditions. The MCP1257 and MCP1259 feature a lowbattery indication that issues a warning if the input
voltage drops below a preset voltage threshold.
Extremely low supply current and few external parts (4
capacitors) make these devices ideal for small, batterypowered applications. A Shutdown mode is also
provided for further power reduction.
The devices incorporate thermal and short-circuit protection. Two package offerings are provided: 10-pin
MSOP and 10-lead 3 mm x 3 mm DFN. The devices
are completely characterized over the junction temperature range of -40°C to +125°C.
2 SLEEP
GND
9
Typical Application with Power-Good Indication
2006-2013 Microchip Technology Inc.
DS21989B-page 1
MCP1256/7/8/9
Package Pinouts
MCP1256
10
LBO
1
SLEEP
C1 -
7
6
SHDN
2
9
GND
C2 -
3
8
C1-
VIN
C1+
4
7
VIN
C2 +
VOUT
5
6
C2+
LBO
1
10
SHDN
BYPASS
2
9
GND
C1 -
C2 -
3
8
C1-
7
VIN
C1+
4
7
VIN
6
C2 +
VOUT
5
6
C2+
1
SLEEP
2
9
GND
C2-
3
8
C1 +
4
VOUT
5
PGOOD
1
BYPASS
2
9
GND
C2-
3
8
C1+
4
VOUT
5
MCP1258
MCP1257
10
PGOOD
10
SHDN
SHDN
MCP1259
Functional Block Diagram
C2 -
C2 +
C1 -
C1 +
VIN
1.5x, 2x Mode
Comparator
+
DQ
-
840 k
Gate Drives
S5,S7
S6
S4
S1,S3,CE
650 kHz
Osc.
S1
S4
VOUT
840 k
Bandgap
Ref.
720k
S6
S5
480 k
CE
S2
S3
S7
+
Feedback
Amplifier
GND
TABLE 1:
VOUT
SWITCH LOGIC
Mode
Phase
Oscillator
Q
S1
S2(CE)
S3
S4
S5
1.5x
Charging
H
L
H
H
1.5x
Transfer
L
L
L
L
2x
Charging
H
H
H
H
2x
Transfer
L
H
L
L
BYPASS
—
—
—
H
L
S6
S7
H
L
L
H
H
L
H
L
H
L
H
L
L
L
H
L
H
L
H
L
H
H
H
L
L
Legend: L is Logic Low, H is Logic High
DS21989B-page 2
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings†
Power Supply Voltage, VIN ...............................................3.8V
Voltage on Any Pin w.r.t. GND ................. -0.3V to (VIN+0.3V)
Output Short Circuit Duration ................................continuous
Storage Temperature Range .........................-65°C to +150°C
Ambient Temperature with Power Applied ....-55°C to +125°C
Maximum Junction Temperature ................................. +150°C
ESD protection on all pins
Human Body Model (1.5 k in Series with 100 pF)2 kV
Machine Model (200 pF, No Series Resistance) .............200V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 µF,
C1 = C2 = 1 µF, IOUT = 10 mA, TJ = -40°C to +125°C. Typical values are at TJ = +25°C.
Sym
Min
Typ
Max
Unit
s
Supply Voltage
VIN
1.8
—
3.6
V
Output Voltage
VOUT
—
3.3
—
V
Output Voltage Accuracy
VOUT
-3.0
±0.5
+3.0
%
IOUT(MAX)
30
—
—
mA
70
—
—
mA
1.8V < VIN < 2.0V
2.0V < VIN < 2.2V
2.2V < VIN < 3.6V
Parameters
Conditions
ALL DEVICES
Output Current
Short Circuit Current
Power Efficiency
IOUT = 10 mA to IOUT(MAX)
100
—
—
mA
ISC
—
150
—
mA
—
84.5
—
%
VIN = 1.8V, IOUT = 10 mA
—
84.5
—
%
VIN = 1.8V, IOUT = 50 mA
—
76.4
—
%
VIN = 2.0V, IOUT = 10 mA
—
80.1
—
%
VIN = 2.0V, IOUT = 50 mA
—
64.0
—
%
VIN = 2.4V, IOUT = 10 mA
—
67.1
—
%
VIN = 2.4V, IOUT = 50 mA
—
67.5
—
%
VIN = 2.4V, IOUT = 100 mA
—
69.7
—
%
VIN = 2.8V, IOUT = 10 mA
—
76.0
—
%
VIN = 2.8V, IOUT = 50 mA
—
76.7
—
%
VIN = 2.8V, IOUT = 100 mA
—
65.0
—
%
VIN = 3.0V, IOUT = 10 mA
—
71.0
—
%
VIN = 3.0V, IOUT = 50 mA
—
71.6
—
%
VIN = 3.0V, IOUT = 100 mA
VOUT = 0V, VIN = 1.8V to 3.6V
Shutdown Input - SHDN
SHDN Input Voltage Low
VIL(SHDN)
—
—
0.4
V
SHDN Input Voltage High
VIH(SHDN)
1.4
—
—
V
SHDN Input Leakage
Current
ILK(SHDN)
—
0.001
0.1
µA
IQ
—
0.25
2
µA
Thermal Shutdown
Threshold
TJ
—
160
—
C
Thermal Shutdown
Hysteresis
TJ(HYS)
—
15
—
C
SHDN Quiescent Current
VSHDN = 0V, TJ = +25°C
Thermal Shutdown
2006-2013 Microchip Technology Inc.
DS21989B-page 3
MCP1256/7/8/9
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 µF,
C1 = C2 = 1 µF, IOUT = 10 mA, TJ = -40°C to +125°C. Typical values are at TJ = +25°C.
Parameters
Sym
Min
Typ
Max
Unit
s
Conditions
MCP1256 and MCP1257 Devices
SLEEP Mode Input - SLEEP
SLEEP Input Voltage Low
VIL(SLEEP)
—
—
0.4
V
SLEEP Input Voltage High
VIH(SLEEP)
1.4
—
—
V
SLEEP Input Leakage
Current
ILK(SLEEP)
—
0.001
0.1
µA
IQ
—
10
20
µA
PGOOD Threshold
VTH
—
93
—
%
PGOOD Hysteresis
VHYS
—
110
—
mV
VOUT Rising
PGOOD Output Low
Voltage
VOL
—
25
100
mV
ISINK = 0.5 mA, VIN = 1.8V
ILK(PGOOD)
—
0.02
1
µA
VPGOOD = VIN
LBO Threshold
VTH
—
1.95
—
V
VIN Falling
LBO Hysteresis
VHYS
—
240
—
mV
VIN Rising
VOL
—
25
100
mV
ISINK = 0.5 mA, VIN = 1.8V
ILK(LBO)
—
0.02
1
µA
VLBO = VIN
SLEEP Quiescent Current
VSLEEP = 0V, IOUT = 0 mA
MCP1256 and MCP1258 Devices
Power-Good Output - PGOOD
PGOOD Input Leakage
Current
Percent of VOUT Falling
MCP1257 and MCP1259
Low-Battery Output - LBO
LBO Output Low Voltage
LBO Input Leakage Current
MCP1258 and MCP1259
BYPASS Mode Input - BYPASS
BYPASS Input Voltage Low
VIL(BYPASS)
—
—
0.4
V
BYPASS Input Voltage
High
VIH(BYPASS)
1.4
—
—
V
BYPASS Input Leakage
Current
ILK(BYPASS)
—
0.001
0.1
µA
IQ
—
0.25
2
µA
VBYPASS = 0V, IOUT = 0 mA,
TJ = +25°C
RBYPASS
—
1.5
—
VIN = 2.4V
BYPASS Quiescent
Current
BYPASS Input-to-Output
Impedance
DS21989B-page 4
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 µF,
C1 = C2 = 1 µF, IOUT = 10 mA, TJ = -40°C to +125°C. Typical values are at TJ = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Internal Oscillator Frequency
FOSC
—
650
—
kHz
Output Voltage Ripple,
VRIP
—
5
—
mVp-p
COUT = 10 µF, IOUT = 10 mA
—
20
—
mVp-p
COUT = 10 µF, IOUT = 100 mA
—
12
—
mVp-p
COUT = 2.2 µF, IOUT = 10 mA
—
55
—
mVp-p
COUT = 2.2 µF, IOUT = 100 mA
TWKUP
—
175
—
µs
VRIP
—
40
—
mVp-p
COUT = 10 µF, IOUT = 0.1 mA
—
60
—
mVp-p
COUT = 10 µF, IOUT = 4 mA
—
40
—
mVp-p
COUT = 2.2 µF, IOUT = 0.1 mA
—
60
—
mVp-p
COUT = 2.2 µF, IOUT = 4 mA
—
150
—
µs
ALL DEVICES
Normal Operation
VOUT Wake-up Time From
Shutdown
VIN = 3.0V, IOUT = 10 mA,
SHDN = VIH(MIN),
VOUT from 0 to 90% Nominal Regulated
Output Voltage
MCP1256 and MCP1257
Output Voltage Ripple,
SLEEP Mode
MCP1258 and MCP1259
VOUT Wake-up Time From
BYPASS
TWKUP
VIN = 3.0V, IOUT = 10 mA,
SHDN = VIH(MIN),
VOUT from 0 to 90% Nominal Regulated
Output Voltage
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VIN = 1.8V to 3.6V, SHDN = VIN, CIN = COUT = 10 µF,
C1 = C2 = 1 µF, IOUT = 10 mA, TJ = -40°C to +125°C. Typical values are at TJ = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range
TJ
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 10-Lead, MSOP
JA
—
200
—
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection
Thermal Resistance, 10-Lead, DFN
3 mm x 3 mm
JA
—
57
—
°C/W
4-Layer JC51-7 Standard Board,
Natural Convection
Temperature Ranges
Thermal Package Resistances
2006-2013 Microchip Technology Inc.
DS21989B-page 5
MCP1256/7/8/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
90
80
70
60
50
40
30
20
10
0
VIN = 1.8V
VIN = 2.1V
Efficiency (%)
Efficiency (%)
NOTE: Unless otherwise indicated, CIN = COUT = 10 µF, C1 = C2 = 1 µF, IOUT = 10 mA, and TA= +25°C.
VIN = 2.4V
VIN = 2.7V
10
30
50
70
90
110
100
90
80
70
60
50
40
30
20
10
0
130
IOUT = 25 mA
Mode Transition
1.8
2.1
Output Current (mA)
Efficiency () vs. Output
90
80
70
60
50
40
30
20
10
0
VIN = 2.7V
VIN = 3.0V
VIN = 3.3V
10
30
50
70
90
110
100
90
80
70
60
50
40
30
20
10
0
130
Mode Transition
1.8
2.1
2.4
2.7
3.0
3.3
Efficiency (%)
Efficiency (%)
Mode Transition
2.1
100
90
80
70
60
50
40
30
20
10
0
DS21989B-page 6
2.7
3.0
3.3
IOUT = 100 mA
Mode Transition
1.8
Input Voltage (V)
FIGURE 2-3:
Voltage (VIN).
2.4
Efficiency () vs. Supply
FIGURE 2-5:
Voltage (VIN).
IOUT = 10 mA
1.8
3.3
Input Voltage (V)
Efficiency () vs. Output
100
90
80
70
60
50
40
30
20
10
0
3.0
IOUT = 50 mA
Output Current (mA)
FIGURE 2-2:
Current (IOUT).
2.7
Efficiency () vs. Supply
FIGURE 2-4:
Voltage (VIN).
Efficiency (%)
Efficiency (%)
FIGURE 2-1:
Current (IOUT).
2.4
Input Voltage (V)
Efficiency () vs. Supply
2.1
2.4
2.7
3.0
3.3
Input Voltage (V)
FIGURE 2-6:
Voltage (VIN).
Efficiency () vs. Supply
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 µF, C1 = C2 = 1 µF, IOUT = 10 mA, and TA= +25°C.
2.4
Quiescent Supply Current
(mA)
Output Voltage (V)
3.5
3.4
VIN = 3.6V
3.3
VIN = 2.1V
3.2
VIN = 1.8V
3.1
3.0
2.9
10
30
50
70
90
110
2.2
VIN = 2.4V
2.0
1.8
1.6
1.4
1.2
0
130
10
20
FIGURE 2-7:
Output Voltage (VOUT) vs.
Output Current (IOUT).
50
60
70
140
3.4
Quiescent Supply Current
(µA)
Output Voltage (V)
40
IOUT = 10 mA
3.3
3.2
IOUT = 50 mA
3.1
IOUT = 100 mA
3.0
2.9
1.8
2.1
2.4
2.7
3.0
3.3
100
80
VIN = 3.0V
60
40
20
0
3.6
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
FIGURE 2-11:
Quiescent Supply Current
(IQ) vs. Output Current (IOUT) - SLEEP Mode.
1.8
Quiescent Supply Current
(mA)
0.8
1.7
1.6
VIN = 2.4V
1.5
1.4
1.3
1.2
2
3
4
5
6
7
8
9
10
Output Current (mA)
FIGURE 2-9:
Quiescent Supply Current
(IQ) vs. Output Current (IOUT) - Normal Mode.
2006-2013 Microchip Technology Inc.
2
Output Current (mA)
FIGURE 2-8:
Output Voltage (VOUT) vs.
Input Voltage (VIN).
1
90 100
VIN = 2.4V
120
Input Voltage (V)
0
80
FIGURE 2-10:
Quiescent Supply Current
(IQ) vs. Output Current (IOUT) - Normal Mode.
3.5
Quiescent Supply Current
(mA)
30
Output Current (mA)
Output Current (mA)
VIN = 2.4V
0.7
0.6
0.5
VIN = 3.0V
0.4
0.3
0.2
0.1
0
0
2
4
6
8
10
12
14
16
18
20
Output Current (mA)
FIGURE 2-12:
Quiescent Supply Current
(IQ) vs. Output Current (IOUT) - SLEEP Mode.
DS21989B-page 7
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 µF, C1 = C2 = 1 µF, IOUT = 10 mA, and TA= +25°C.
0.04
Output Voltage Ripple (V)
BYPASS Impedance (Ω)
2.0
1.8
1.6
1.4
1.2
1.0
1.8
2.1
2.4
2.7
3.0
3.3
VIN = 2.4V
IOUT = 100 mA
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
3.6
0
1
2
3
Input Voltage (V)
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
3
4
5
6
7
8
9
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0
1
2
3
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
4
5
6
7
8
9
10
Time (µs)
FIGURE 2-15:
Output Voltage Ripple vs.
Time - Normal 2x Mode.
DS21989B-page 8
4
5
6
7
8
9
10
FIGURE 2-17:
Output Voltage Ripple vs.
Time - Normal 1.5x Mode.
0.04
Output Voltage Ripple (V)
Output Voltage Ripple (V)
VIN = 2.4V
IOUT = 50 mA
0.03
3
10
Time (µs)
0.04
2
9
0.02
10
FIGURE 2-14:
Output Voltage Ripple vs.
Time - Normal 2x Mode.
1
8
VIN = 3.0V
IOUT = 10 mA
0.03
Time (µs)
0
7
0.04
VIN = 2.4V
IOUT = 10 mA
0.03
2
6
FIGURE 2-16:
Output Voltage Ripple vs.
Time - Normal 2x Mode.
Output Voltage Ripple (V)
Output Voltage Ripple (V)
0.04
1
5
Time (µs)
FIGURE 2-13:
BYPASS Impedance
(RBYPASS) vs. Supply Voltage (VIN).
0
4
VIN = 3.0V
IOUT = 50 mA
0.03
0.02
0.01
0.00
-0.01
-0.02
-0.03
-0.04
0
1
2
3
4
5
6
7
8
9
10
Time (µs)
FIGURE 2-18:
Output Voltage Ripple vs.
Time - Normal 1.5x Mode.
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
8
9
10
Time (µs)
-0.15
Time (µs)
Time (µs)
1000
900
800
700
600
500
400
300
200
100
0
-0.20
Time (µs)
FIGURE 2-21:
Output Voltage Ripple vs.
Time - SLEEP Mode.
-0.20
3
-0.30
2
-0.40
1
-0.50
0
-0.60
Output Voltage Ripple (V)
-0.15
-0.10
500
-0.10
VIN = 2.4V
IOUT = 10 mA
4
250
-0.05
0.00
5
200
0.00
0.10
6
150
0.05
0.20
7
100
0.10
8
50
VIN = 2.4V
IOUT = 10 mA
0.15
0
0.20
FIGURE 2-23:
Output Voltage Ripple vs.
Time - SLEEP Mode.
SLEEP Input Voltage (V)
FIGURE 2-20:
Output Voltage Ripple vs.
Time - SLEEP Mode.
Output Voltage Ripple (V)
1000
-0.20
1000
900
800
700
600
500
400
300
200
100
-0.20
-0.10
900
-0.15
800
-0.10
0.00
-0.05
400
-0.05
0.05
300
0.00
0.10
200
0.05
VIN = 3.0V
IOUT = 10 mA
0.15
100
0.10
0.20
0
VIN = 2.4V
IOUT = 1 mA
0.15
FIGURE 2-22:
Output Voltage Ripple vs.
Time - SLEEP Mode.
Output Voltage Ripple (V)
0.20
0
Output Voltage Ripple (V)
FIGURE 2-19:
Output Voltage Ripple vs.
Time - Normal 1.5x Mode.
2006-2013 Microchip Technology Inc.
1000
7
700
6
450
5
Time (µs)
600
4
400
3
500
2
350
1
300
0
900
-0.20
800
-0.04
-0.15
700
-0.03
-0.10
600
-0.02
0.00
-0.05
500
-0.01
0.05
400
0.00
0.10
300
0.01
VIN = 3.0V
IOUT = 1 mA
0.15
200
0.02
0.20
100
VIN = 3.0V
IOUT = 100 mA
0.03
0
Output Voltage Ripple (V)
0.04
Output Voltage Ripple (V)
NOTE: Unless otherwise indicated, CIN = COUT = 10 µF, C1 = C2 = 1 µF, IOUT = 10 mA, and TA= +25°C.
Time (µs)
FIGURE 2-24:
Output Voltage Ripple vs.
Time - Mode Transition: SLEEP Mode-to-Normal
2x Mode-to-SLEEP Mode.
DS21989B-page 9
MCP1256/7/8/9
TYPICAL PERFORMANCE CURVES (CONTINUED)
NOTE: Unless otherwise indicated, CIN = COUT = 10 µF, C1 = C2 = 1 µF, IOUT = 10 mA, and TA= +25°C.
8
0.10
7
-0.40
-0.50
IOUT
-0.30
-0.40
1
-0.50
0
-0.60
0
500
450
400
350
Time (µs)
FIGURE 2-27:
8
0.10
7
0.10
-0.40
0.05
-0.50
IOUT
500
450
400
350
300
250
200
150
100
0
-0.60
50
0.00
VIN
3
DS21989B-page 10
-0.20
-0.30
2
-0.40
1
-0.50
0
-0.60
Time (µs)
Time (µs)
FIGURE 2-26:
Load Transient Response Normal 1.5x Mode.
-0.10
500
-0.30
450
0.15
IOUT = 100 mA
4
400
-0.20
350
VIN = 3.0V
0.20
0.00
5
300
-0.10
150
0.25
0.10
VOUT
6
50
0.00
0.20
0
VOUT
0.30
Line Transient Response.
Output Voltage Ripple
(V)
0.20
0.35
Input Voltage (V)
0.40
100
Load Transient Response -
Output Voltage Ripple
(V)
Output Current (A)
FIGURE 2-25:
Normal 2x Mode.
Time (µs)
250
300
250
200
150
100
0
-0.60
50
0.00
-0.20
2
200
0.05
-0.10
500
0.10
VIN
3
450
-0.30
400
0.15
IOUT = 10 mA
4
350
-0.20
300
VIN = 2.4V
0.20
0.00
5
250
-0.10
200
0.25
0.10
VOUT
6
150
0.00
50
0.30
0.20
Output Voltage Ripple
(V)
0.20
100
VOUT
Input Voltage (V)
0.35
Output Voltage Ripple
(V)
Output Current (A)
0.40
FIGURE 2-28:
Line Transient Response.
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
DFN
MSOP
1
1
Symbol
Function
PGOOD
Power-Good Indication Open-Drain Output Pin: MCP1256 and MCP1258
LBO
Low-Battery Indication Open-Drain Output Pin: MCP1257 and MCP1259
SLEEP
Active Low SLEEP Mode Input Pin: MCP1256 and MCP1257
2
2
3
3
4
4
C1+
Flying Capacitor Positive Pin
5
5
VOUT
Regulated 3.3V Output Voltage
6
6
C2+
Flying Capacitor Positive Pin
7
7
VIN
Power Supply Input Voltage
8
8
C1-
Flying Capacitor Negative Pin
9
9
GND
10
10
SHDN
BYPASS
3.1
3.1.1
C2-
Active Low BYPASS Mode Input Pin: MCP1258 and MCP1259
Flying Capacitor Negative Pin
0V Reference
Active Low SHUTDOWN Mode Input Pin
Status Indication (PGOOD, LBO)
POWER-GOOD OUTPUT PIN
(PGOOD)
MCP1256/8: PGOOD is high impedance when the output voltage is in regulation. A logic low is asserted
when the output falls 7% (typical) below the nominal
value. The PGOOD output remains low until VOUT is
within 3% (typical) of its nominal value. On start-up, this
pin indicates when the output voltage reaches its final
value. PGOOD is high impedance when SHDN is low
or when BYPASS is low (MCP1258).
3.1.2
LOW-BATTERY OUTPUT PIN (LBO)
MCP1257/9: LBO is high impedance when the input
voltage is above the low-battery threshold voltage. A
logic low is asserted when the input falls below the lowbattery threshold voltage. The LBO output remains low
until VIN is above the low-battery threshold voltage plus
the low-battery hysteresis voltage. LBO is high
impedance when SHDN is low or when BYPASS is low
(MCP1259).
3.2
3.2.1
Mode Selection (SLEEP, BYPASS)
ACTIVE LOW SLEEP MODE
(SLEEP)
MCP1256/7: A logic low signal applied to this pin
places the device into a SLEEP mode of operation. In
this mode, the device maintains regulation. SLEEP
mode performs pulse skip operation reducing the
current draw of the device at the expense of increased
output voltage ripple.
3.2.2
ACTIVE LOW BYPASS MODE
(BYPASS)
MCP1258/9: A logic low signal applied to this pin
places the device into a BYPASS mode of operation. In
this mode, the input supply voltage is connected
directly to the output.
3.3
Flying Capacitor Negative (C2-)
A 1 µF ceramic flying capacitor is recommended.
3.4
Flying Capacitor Positive (C1+)
A 1 µF ceramic flying capacitor is recommended.
3.5
Regulated Output Voltage (VOUT)
Regulated 3.3V output. Bypass to GND with a
minimum of 2.2 µF.
3.6
Flying Capacitor Positive (C2+)
A 1 µF ceramic flying capacitor is recommended.
3.7
Power Supply Input Voltage (VIN)
A supply voltage of 1.8V to 3.6V is recommended.
Bypass to GND with a minimum of 1 µF.
3.8
Flying Capacitor Negative (C1-)
A 1 µF ceramic flying capacitor is recommended.
3.9
0V Reference (GND)
Connect to negative terminal of and input supply.
3.10
Device Shut Down (SHDN)
A logic low signal applied to this pin disables the
device. A logic high signal applied to this pin allows
normal operation.
2006-2013 Microchip Technology Inc.
DS21989B-page 11
MCP1256/7/8/9
4.0
DEVICE OVERVIEW
The MCP1256/7/8/9 devices are positive regulated
charge pumps that accept an input voltage from +1.8V
to +3.6V and convert it to a regulated 3.3V output voltage. The MCP1256/7/8/9 provide a low-cost, compact
and simple solution for step-up DC/DC conversions,
primarily in battery applications, that do not want to use
switching regulator solutions because of EMI noise and
inductor size.
The MCP1256/7/8/9 are designed to offer the highest
possible efficiency under common operating conditions, i.e. VIN = 2.4V or 2.8V, VOUT = 3.3V,
IOUT = 100 mA. A fixed switching frequency, 650 kHz
typically, allows for easy external filtering.
(2x mode), when the energy is transferred to the output. The transfer mode determines which switches are
closed for the transfer.
Both phases occur in one clock period of the internal
oscillator. When the second phase (transfer) has been
completed, the cycle repeats.
4.2
Power Efficiency
The power efficiency,, is determined by the mode of
operation, 1.5x mode or 2x mode. Equation 4-1 and
Equation 4-2 are used to approximate the power efficiency with any significant amount of output current. At
light loads, the device quiescent current must be taken
into consideration.
The MCP1256/7 provide a unique SLEEP mode
feature which reduces the current drawn from the input
supply while maintaining a regulated bias on external
peripherals. SLEEP mode can substantially increase
battery run-time in portable applications.
EQUATION 4-1:
The MCP1258/9 provide a unique BYPASS mode
feature which virtually eliminates the current drawn
from the input supply by the device while maintaining
an unregulated bias on external peripherals. BYPASS
connects the input supply voltage to the output. All
remaining functions of the device are shutdown.
BYPASS mode can substantially increase battery runtime in portable applications.
EQUATION 4-2:
VOUT I OUT
V OUT
P OUT
1.5x = ------------= ----------------------------------------- = ---------------------PIN
VIN 1.5 I OUT
VIN 1.5
POUT
VOUT I OUT
V OUT
2x = ------------= ------------------------------------ = -----------------P IN
V IN 2 I OUT
VIN 2
4.3
Shutdown Mode (SHDN)
The devices supply up to 100 mA of output current for
input voltages, VIN, greater than or equal to 2.2V. The
devices are available in small 10-Pin MSOP or DFN
packages with an operating junction temperature range
of -40°C to +125°C.
Driving SHDN low places the MCP1256/7/8/9 in a lowpower Shutdown mode. This disables the charge-pump
switches, oscillator and control logic, reducing the
quiescent current to 0.25 µA (typical). The PGOOD
output and LBO are in a high impedance state during
shutdown.
4.1
4.4
Theory of Operation
The MCP1256/7/8/9 devices employ a switched capacitor charge pump to boost an input supply, VIN, to a regulated 3.3V output voltage. Refering to the Functional
Block Diagram, the devices perform conversion and
regulation in two phases: charge and transfer. When
the devices are not in shutdown, SLEEP or BYPASS,
the two phases are continuously cycled through.
Charge transfers charge from the input supply to the
flying capacitors, C1 and C2, connected to pins C1+,
C1-, C2+ and C2-, respectively. During this phase,
switches S4 and S6 are closed. Switch S2 controls the
amount of charge transferred to the flying capacitors.
The amount of charge is determined by a sample and
hold error amplifier with feedback from the output
voltage at the beginning of the phase.
Once the first phase (charge) is complete, transfer is
initiated. The second phase transfers the energy from
the flying capacitors to the output. The MCP1256/7/8/9
devices autonomously switch between 1.5x mode and
2x mode. This determines whether the flying capacitors
are placed in parallel (1.5x mode), or remain in series
DS21989B-page 12
SLEEP Mode (SLEEP)
The MCP1256/7 provide a unique SLEEP mode feature. SLEEP mode reduces the current drawn from the
input supply while maintaining a regulated bias on
external peripherals. SLEEP mode can substantially
increase battery run-time in portable applications.
The regulation control is referred to as a bang-bang
control due to the output being regulated around a fixed
reference with some hysteresis. As a result, some
amount of peak-to-peak ripple will be observed at the
output independent of load current. The frequency of
the output ripple, however, will be influenced heavily by
the load current and output capacitance.
4.5
BYPASS Mode (BYPASS)
The MCP1258/9 provide a unique BYPASS mode feature which virtually eliminates the current drawn from
the input supply by the device, while maintaining an
unregulated bias on external peripherals. BYPASS
connects the input supply voltage to the output. All
remaining functions of the device are shutdown.
BYPASS mode can substantially increase battery runtime in portable applications.
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
4.6
Power-Good Output (PGOOD)
For the MCP1256/8 devices, the PGOOD output is an
open-drain output that sinks current when the regulator
output voltage falls below 0.93VOUT (typical). If the regulator output voltage falls below 0.93VOUT (typical) for
less than 200 µs and then recovers, glitch immunity circuits prevent the PGOOD signal from transitioning low.
A 10 k to 1 M pull-up resistor from PGOOD to VOUT
may be used to provide a logic output. If not used,
connect PGOOD to GND or leave unconnected.
PGOOD is high impedance when the output voltage is
in regulation. A logic low is asserted when the output
falls 7% (typical) below the nominal value. The PGOOD
output remains low until VOUT is within 3% (typical) of
its nominal value. On start-up, this pin indicates when
the output voltage reaches its final value. PGOOD is
high impedance when SHDN is low or when BYPASS
is low (MCP1258).
4.7
Low-Battery Output (LBO)
For the MCP1257/9 devices, the LBO output is an
open-drain output that sinks current when the input
voltage falls below a preset threshold. If the input voltage falls below the preset threshold for less than
200 µs and then recovers, glitch immunity circuits prevent the LBO signal from transitioning low. A 10 k to
1 M pull-up resistor from LBO to VOUT may be used
to provide a logic output. If not used, connect LBO to
GND or leave unconnected.
LBO is high impedance when the input voltage is above
the low-battery threshold voltage. A logic low is
asserted when the input falls below the low-battery
threshold voltage. The LBO output remains low until
VIN is above the low-battery threshold voltage plus the
low-battery hysteresis voltage. LBO is high impedance
when SHDN is low or when BYPASS is low
(MCP1259).
4.8
Soft-Start and Short-Circuit
Protection
The MCP1256/7/8/9 devices feature fold back shortcircuit protection. This circuitry provides an internal
soft-start function by limiting inrush current during
startup and also limits the output current to 150 mA
(typical), if the output is short-circuited to GND. The
internal soft-start circuitry requires approximately
175 µs, typical, from either initial power-up, release
from Shutdown, or release from BYPASS (MCP1258/9)
for the output voltage to be in regulation.
2006-2013 Microchip Technology Inc.
4.9
Thermal Shutdown
The MCP1256/7/8/9 devices feature thermal shutdown
with temperature hysteresis. When the die temperature
exceeds 160°C, the device shuts down. When the die
cools by 15°C, the MCP1256/7/8/9 automatically turns
back on again. If high die temperature is caused by output overload and the load is not removed, the device
will turn on and off resulting in a pulsed output.
5.0
APPLICATIONS
5.1
Capacitor Selection
The style and value of capacitors used with the
MCP1256/7/8/9 family determine several important
parameters, such as output voltage ripple and charge
pump strength. To minimize noise and ripple, it is recommended that low ESR (0.1) capacitors be used for
both CIN and COUT. These capacitors should be
ceramic and should be 10 µF or higher for optimum
performance.
If the source impedance to VIN is very low, up to several
megahertz, CIN may not be required. Alternatively, a
somewhat smaller value of CIN may be substituted for
the recommended 10 µF, but will not be as effective in
preventing ripple on the VIN pin.
The value of COUT controls the amount of output voltage ripple present on VOUT. Increasing the size of
COUT will reduce output ripple at the expense of a
slower turn-on time from shutdown and a higher inrush
current.
The flying capacitors (C1 and C2) control the strength
of the charge pump and in order to achieve the maximum rated output current (100 mA), it is necessary to
have at least 1 µF of capacitance for the flying capacitor. A smaller flying capacitor delivers less charge per
clock cycle to the output capacitor resulting in lower
available output current.
5.2
PCB Layout Issues
The MCP1256/7/8/9 devices transfer charge at high
switching frequencies producing fast, high peak, transient currents. As a result, any stray inductance in the
component layout will produce unwanted noise in the
system. Proper board layout techniques are required to
ensure optimum performance.
DS21989B-page 13
MCP1256/7/8/9
6.0
TYPICAL APPLICATION
CIRCUITS
The MCP1256/7/8/9 devices are inductorless, positive
regulated, switched capacitor DC/DC converters.
Typical application circuits are depicted in Figure 6-1.
MCP1256
INPUT
1.8V to 3.6V
7
VIN
VOUT
OUTPUT
3.3V
5
CIN
COUT
R1
10 µF
10
4
C1
1 µF
8
2
SHDN
PGOOD
C1 +
C2 +
C1 -
C2-
10 µF
1
Power-Good
Indication
6
3
C2
1 µF
SLEEP
GND
ON / OFF
9
Typical Application with Power-Good Indication
MCP1259
INPUT
1.8V to 3.6V
7
CIN
VIN
VOUT
OUTPUT
3.3V
5
COUT
R1
10 µF
10
4
C1
1 µF
8
2
SHDN
LBO
C1 +
C2 +
C1 -
C2 -
10 µF
1
Low-Battery
Indication
6
3
C2
1 µF
BYPASS
ON / OFF
GND
9
Typical Application with Low-Battery Indication
FIGURE 6-1:
DS21989B-page 14
Typical Application Circuits.
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
10-Lead DFN
1
2
3
4
XXXX
XYWW
NNN
5
Example:
10
1
9
2
8
3
7
4
6
5
e3
Note:
8
7
6
1259E
607256
XXXXX
YWWNNN
*
9
Example:
10-Lead MSOP
Legend: XX...X
Y
YY
WW
NNN
10
1256
E607
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2006-2013 Microchip Technology Inc.
DS21989B-page 15
MCP1256/7/8/9
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
b
E
p
n
L
K
D
PIN 1
ID INDEX
AREA
(NOTE 1)
D2
EXPOSED
METAL
PAD
(NOTE 2)
2
1
E2
TOP VIEW
BOTTOM VIEW
A
EXPOSED
TIE BAR
(NOTE 3)
A3
A1
INCHES
Units
MIN
Dimension Limits
Number of Pins
n
MILLIMETERS*
NOM
MIN
MAX
MAX
NOM
10
10
Pitch
e
Overall Height
A
.031
.035
.039
0.80
0.90
1.00
Standoff
A1
.000
.001
.002
0.00
0.02
0.05
Lead Thickness
A3
.020 BSC
0.50 BSC
.008 REF.
0.20 REF.
E
.112
.118
.124
2.85
3.00
3.15
E2
.082
.094
.096
2.08
2.39
2.45
D
.112
.118
.124
2.85
3.00
3.15
D2
.051
.065
.067
1.30
1.65
1.70
Lead Width
b
.008
.010
.015
0.18
0.25
0.30
Contact Length §
L
.012
.016
.020
0.30
0.40
0.50
Contact-to-Exposed Pad §
K
.008
—
—
0.20
—
—
Overall Length
Exposed Pad Length
(Note 3)
Overall Width
Exposed Pad Width
(Note 3)
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: Not Registered
Drawing No. C04-063
DS21989B-page 16
Revised 09-12-05
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
p
D
2
B
n
1
c
A1
L
Number of Pins
Pitch
A2
A
(F)
Units
Dimension Limits
n
p
Overall Height
INCHES
NOM
MIN
MIN
MAX
MILLIMETERS*
NOM
10
MAX
10
0.50 BSC
.020 BSC
A
.043
–
–
1.10
.037
.006
0.75
0.00
0.85
0.95
0.15
Molded Package Thickness
Standoff
A2
A1
Overall Width
Molded Package Width
E
E1
Overall Length
D
Foot Length
L
Footprint
F
0°
–
8°
0°
–
8°
c
.003
–
.009
0.08
–
0.23
B
.006
.009
.012
0.15
0.23
0.30
5°
5°
–
–
15°
15°
5°
5°
–
–
15°
15°
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bott om
.030
.000
.033
.193 BSC
.118 BSC
4.90 BSC
3.00 BSC
.118 BSC
.016
3.00 BSC
.024
.031
0.40
.037 REF
0.60
0.80
0.95 REF
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dime
nsion, usually witho ut tolerance, for information purposes only.
See ASME Y14.5M
JEDEC Equivalent: MO-187 BA
Revised 09-16-05
Drawing No. C04-021
2006-2013 Microchip Technology Inc.
DS21989B-page 17
MCP1256/7/8/9
NOTES:
DS21989B-page 18
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
APPENDIX A:
REVISION HISTORY
Revision A (March 2006)
• Original Release of this Document.
Revision B (January 2013)
Added a note to each package outline drawing.
2006-2013 Microchip Technology Inc.
DS21989B-page 19
MCP1256/7/8/9
NOTES:
DS21989B-page 20
2006-2013 Microchip Technology Inc.
MCP1256/7/8/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device
MCP1256:
MCP1256T:
MCP1257:
MCP1257T:
MCP1258:
MCP1258T:
MCP1259:
MCP1259T:
Temperature Range
E
Package
MF
UN
Positive Regulated Charge Pump with SLEEP
Mode and Power-Good Indication
Positive Regulated Charge Pump with SLEEP
Mode and Power-Good Indication,
Tape and Reel
Positive Regulated Charge Pump with SLEEP
Mode and Low-Battery Indication
Positive Regulated Charge Pump with SLEEP
Mode and Low-Battery Indication,
Tape and Reel
Positive Regulated Charge Pump with
BYPASS Mode and Power-Good Indication
Positive Regulated Charge Pump with
BYPASS Mode and Power-Good Indication,
Tape and Reel
Positive Regulated Charge Pump with
BYPASS Mode and Low-Battery Indication
Positive Regulated Charge Pump with
BYPASS Mode and Low -Battery Indication,
Tape and Reel
= -40C to +125C
= Dual Flat, No Lead (3x3 mm body), 10-Lead
= Plastic Micro Small Outline (MSOP), 10-Lead
2006-2013 Microchip Technology Inc.
Examples:
a)
b)
MCP1256-EMF:
MCP1256T-EMF:
c)
d)
MCP1256-EUN:
MCP1256T-EUN:
a)
b)
MCP1257-EMF:
MCP1257T-EMF:
c)
d)
MCP1257-EUN:
MCP1257T-EUN:
a)
b)
MCP1258-EMF:
MCP1258T-EMF:
c)
d)
MCP1258-EUN:
MCP1258T-EUN:
a)
b)
MCP1259-EMF:
MCP1259T-EMF:
c)
d)
MCP1259-EUN:
MCP1259T-EUN:
E-Temp, DFN package
Tape and Reel, E-Temp,
DFN package
E-Temp, MSOP package
Tape and Reel, E-Temp,
MSOP package
E-Temp, DFN package
Tape and Reel, E-Temp,
DFN package
E-Temp, MSOP package
Tape and Reel, E-Temp,
MSOP package
E-Temp, DFN package
Tape and Reel, E-Temp,
DFN package
E-Temp, MSOP package
Tape and Reel, E-Temp,
MSOP package
E-Temp, DFN package
Tape and Reel, E-Temp,
DFN package
E-Temp, MSOP package
Tape and Reel, E-Temp,
MSOP package
DS21989B-page 21
MCP1256/7/8/9
NOTES:
DS21989B-page 22
2006-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769249
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2006-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21989B-page 23
Worldwide Sales and Service
AMERICAS
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Technical Support:
http://www.microchip.com/
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Web Address:
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Tel: 91-11-4160-8631
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Tel: 43-7242-2244-39
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Tel: 49-89-627-144-0
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Tel: 86-755-8864-2200
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Tel: 886-7-213-7828
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Tel: 86-27-5980-5300
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Taiwan - Taipei
Tel: 886-2-2508-8600
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Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
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Tel: 86-592-2388138
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Tel: 86-756-3210040
Fax: 86-756-3210049
DS21989B-page 24
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
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Fax: 81-3-6880-3771
11/29/12
2006-2013 Microchip Technology Inc.
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