MIC22600
1 MHz, 6A Integrated Switch Synchronous Buck Regulator
Features
General Description
•
•
•
•
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The MIC22600 is a high-efficiency, 6A, integrated
switch, synchronous buck (step-down) regulator. The
MIC22600 is optimized for highest efficiency and
achieves more than 90% efficiency, while still switching
at 1 MHz over a broad load range with only 1 μH
inductor and down to 47 μF output capacitor. The ultra
high-speed control loop keeps the output voltage within
regulation even under extreme transient load swings
commonly found in FPGAs and low voltage ASICs. The
output voltage can be adjusted down to 0.7V to
address all low voltage power needs. The MIC22600
offers a full range of sequencing and tracking options.
The EN/DLY pin combined with the Power Good/POR
pin allows multiple outputs to be sequenced in any way
during turn-on and turn-off. The RC (Ramp Control) pin
allows the device to be connected to another product in
the MIC22xxx and/or MIC68xxx family, to keep the
output voltages within a certain ∆V on start up.
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•
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Input Voltage: 2.6V to 5.5V
Output Voltage Adjustable Down to 0.7V
Output Current Up to 6A
Full Sequencing and Tracking Ability
Power-on-Reset/Power Good
Efficiency >90% Across a Broad Load Range
Ultra-Fast Transient Response, Easy RC
Compensation
100% Maximum Duty Cycle
Fully Integrated MOSFET Switches
Micropower Shutdown
Thermal Shutdown and Current-Limit Protection
24-Pin 4 mm x 4 mm QFN
24-Pin ePad TSSOP
–40°C to +125°C Junction Temperature Range
Applications
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High Power Density Point-of-Load Conversion
Servers and Routers
DVD Recorders
Computing Peripherals
Base Stations
FPGAs, DSP, and Low Voltage ASIC Power
The MIC22600 is available in a 24-pin 4mm x 4mm
QFN and thermally enhanced 24-pin ePad TSSOP with
a junction operating range from –40°C to +125°C.
Package Types
24
23
22
21
20
PGND
SW
SW
SW
SW
PGND
MIC22600
24-Lead 4 mm x 4 mm QFN (ML)
(Top View)
MIC22600
24-Lead ePad TSSOP (TSE)
(Top View)
SGND
1
24
SVIN
2
23
COMP
FB
PVIN
3
22
PVIN
PGND
4
21
PGND
SW
5
20
SW
SW
6
19
SW
SW
7
18
SW
SW
8
17
SW
PGND
9
16
PGND
19
PVIN
1
18
PVIN
EN/DLY
2
17
SVIN
DELAY
3
RC
4
POR/PG
5
14
FB
PVIN
6
13
PVIN
16
EP
7
8
9
10
11
12
PVIN
10
15
PVIN
SW
SW
SW
PGND
EP
SW
COMP
PGND
15
SGND
EN/DLY
11
14
POR/PG
DELAY
12
13
RC
2020 Microchip Technology Inc.
DS20006288A-page 1
MIC22600
Typical Application Circuit
MIC22600
PVIN
PVIN
PVIN
SVIN
VIN = 2.6V–5.5V
SW
SW
SW
SW
1μH
VOUT
1.8V / 6A
(optional)
EN/DLY
100μF
ceramic
POR/PG
RC (Ramp Control)
Delay
PGND
FB
Comp
SGND
Functional Block Diagram
SVIN
PVIN
VDD
1μA
1.24V
0.7V
EN
VL
VREF
+ 360mV
-
Blank
SW
Adaptive
Drive
1V
R
SW
Q
120Nȍ
FB
S
VREF
120Nȍ
24Nȍ 50pF
PGND
Comp
1μA
Delay
1μA
VDD
1μA
Sequence
& Tracking
Control
POR
RC
1μA
SGND
DS20006288A-page 2
2020 Microchip Technology Inc.
MIC22600
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (SVIN, PVIN) ........................................................................................................................ –0.3V to +6V
Output Switch Voltage (SW)......................................................................................................................... –0.3V to +6V
Output Switch Current (ISW)...................................................................................................................Internally Limited
Logic Input Voltage (EN, POR, DELAY)........................................................................................................ –0.3V to VIN
Control Voltage (RC, COMP, FB) .................................................................................................................. –0.3V to VIN
ESD Rating (Note 1) ..................................................................................................................................................2 kV
Operating Ratings ††
Supply Voltage (VIN) ................................................................................................................................. +2.6V to +5.5V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
†† Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions recommended.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = +25°C with VIN = VEN = 3.3V; VOUT = 1.8V, unless otherwise specified. Bold values
indicate –40°C≤ TJ ≤ +125°C. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
Supply Voltage Range
2.6
—
5.5
V
—
VIN Turn-On Voltage Threshold
2.4
2.5
2.6
V
VIN rising
UVLO Hysteresis
—
280
—
mV
—
Quiescent Current, PWM Mode
—
850
1300
μA
VEN ≥ 1.34V; VFB = 0.9V (not
switching)
—
5
10
μA
VEN = 0V
0.693
0.7
0.707
V
±1%
0.686
0.7
0.714
V
±2% (over temperature)
—
1
100
nA
—
6.5
9
11.5
A
VFB = 0.5*VNOM
Output Voltage Line Regulation
—
0.2
—
%
VOUT = 1.8V, VIN = 2.6 to 5.5V,
ILOAD = 100 mA
Output Voltage Load Regulation
—
0.2
—
%
100 mA < ILOAD < 6000 mA,
VIN = 3.3V
100
—
—
%
VFB ≤ 0.5V
Switch ON-Resistance PFET
—
0.03
—
Ω
ISW = 1000 mA; VFB = 0.5V
Switch ON-Resistance NFET
—
0.025
—
Ω
ISW = 1000 mA; VFB = 0.9V
0.8
1
1.2
MHz
—
EN/DLY Threshold Voltage
1.14
1.24
1.34
V
—
EN/DLY Source Current
0.6
1
1.8
μA
VIN = 2.6V to 5.5V
0.5
1
1.7
μA
Ramp Control current
Shutdown Current
ISHDN
Feedback Voltage
VFB
FB Pin Input Current
Current Limit in PWM Mode
ILIM
Maximum Duty Cycle
Oscillator Frequency
RC Pin Current
Note 1:
fO
IRAMP
Conditions
Specification for packaged product only.
2020 Microchip Technology Inc.
DS20006288A-page 3
MIC22600
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = +25°C with VIN = VEN = 3.3V; VOUT = 1.8V, unless otherwise specified. Bold values
indicate –40°C≤ TJ ≤ +125°C. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
—
—
1
μA
—
—
2
μA
—
130
—
mV
7.5
10
12.5
%
Threshold,% of VOUT below
nominal
—
2
—
%
Hysteresis
Overtemperature Shutdown
—
160
—
°C
—
Overtemperature Shutdown
Hysteresis
—
20
—
°C
—
Power-on-Reset
IPG(LEAK)
Power-on-Reset
VPG(LO)
Power-on-Reset
Note 1:
VPG
Conditions
VPORH = 5.5V; POR = High
Output Logic Low Voltage
(undervoltage condition),
IPOR = 5 mA
Specification for packaged product only.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Temperature Range
TJ
–40
—
+125
°C
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
+260
—
°C
Soldering, 10 sec.
θJC
—
14
—
°C/W
—
Temperature Ranges
—
Package Thermal Resistance
Thermal Resistance, QFN 24-Ld
Thermal Resistance, TSSOP ePad
24-Ld
Note 1:
θJA
—
40
—
°C/W
—
θJC
—
12.9
—
°C/W
—
θJA
—
32.2
—
°C/W
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006288A-page 4
2020 Microchip Technology Inc.
MIC22600
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
INPUT CURRENT (mA)
INPUT CURRENT (μA)
10
8
6
25°C
4
2
0
0
FIGURE 2-1:
Voltage.
1
2
3
4
5
INPUT VOLTAGE (V)
6
Shutdown Current vs. Input
4
2
VIN = 3.3V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
Shutdown Current vs.
REFERENCE VOLTAGE (V)
INPUT CURRENT (μA)
6
25°C
0.6
0.4
0.2
Not switching FB = 1V
3
4
5
6
INPUT VOLTAGE (V)
Operating Current vs. Input
2020 Microchip Technology Inc.
REFERENCE VOLTAGE (V)
INPUT CURRENT (μA)
1.0
FIGURE 2-3:
Voltage.
0.4
0.3
0.2
0.1
VIN = 3.3V
Not switching FB = 1V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
0.708
0.706
0.704
0.702
0.700
0.698
0.696
0.694
0.692
0.690
2
FIGURE 2-5:
Voltage.
1.2
0
2
0.7
0.6
0.5
Operating Current vs.
0.710
8
0.8
0.8
FIGURE 2-4:
Temperature.
10
FIGURE 2-2:
Temperature.
1.0
0.9
25°C
3
4
5
INPUT VOLTAGE (V)
6
Reference Voltage vs. Input
0.710
0.708
0.706
0.704
0.702
0.700
0.698
0.696
0.694
0.692
VIN = 3.3V
0.690
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-6:
Temperature.
Reference Voltage vs.
DS20006288A-page 5
MIC22600
1100
1080
FREQUENCY (kHz)
ENABLE VOLTAGE (V)
1.30
1.25
1.20
25°C
1.15
1.10
2
FIGURE 2-7:
Voltage.
3
4
5
INPUT VOLTAGE (V)
1060
1040
1020
1000
960
940
920
900
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
6
Enable Voltage vs. Input
980
FIGURE 2-10:
1.25
5'621 P
ENABLE VOLTAGE (V)
1.30
1.20
1.15
1.10
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-8:
Temperature.
Enable Voltage vs.
12
VIN = 5V
8
4
VIN = 3V
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 2-9:
Temperature.
DS20006288A-page 6
Enable Hysteresis vs.
OUTPUT VOLTAGE (V)
ENABLE HYSTERSIS (mV)
16
90°C
2.5
FIGURE 2-11:
Voltage.
24
20
50
45
40
35
30
25
20
15
10
5
0
2
Frequency vs. Temperature.
3 3.5 4 4.5 5
INPUT VOLTAGE (V)
5.5
P-Channel RDS(ON) vs. Input
2.0
1.8
1.6
VIN - 5V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
VIN - 2.5V
0.2 0.4 0.6 0.8 1.0 1.2
RAMP CONTROL VOLTAGE (V)
FIGURE 2-12:
Control Voltage.
Output Voltage vs. Ramp
2020 Microchip Technology Inc.
180
144
30
108
20
72
10
36
0
-36
-20
-30
-72
-108
-50
1
100
95
90
85
80
75
70
65
60
55
50
0
FIGURE 2-15:
FIGURE 2-16:
1.8V).
GAIN (dB)
7
Efficiency VO = 1.8V.
VIN - 5V
1
2
3
4
5
6
OUTPUT CURRENT (A)
7
Efficiency VO = 3.3V.
2020 Microchip Technology Inc.
-144
10
100
FREQUENCY (kHz)
40
30
20
10
0
-10
-20
-30
-40
-50
1
FIGURE 2-17:
1.8V).
50
40
30
20
10
0
-10
-20
-30
-40
-50
1
FIGURE 2-18:
3.3V).
-180
1000
Bode Plot (VIN = 3.3V, VO =
180
144
50
GAIN (dB)
EFFICIENCY (%)
100
VIN - 3.6V
95
VIN - 2.5V
90
85
VIN - 5V
80
75
70
65
60
55
50
0
1
2
3
4
5
6
OUTPUT CURRENT (A)
FIGURE 2-14:
EFFICIENCY (%)
Efficiency VO = 1.2V.
Gain 6A
Phase 6A
108
72
36
Gain 6A
Phase 6A
10
100
FREQUENCY (kHz)
-36
-72
-108
-144
-180
1000
PHASE (°)
-40
FIGURE 2-13:
0
-10
PHASE (°)
50
40
Bode Plot (VIN = 5.0V, VO =
180
144
108
72
36
Gain 6A
Phase 6A
10
100
FREQUENCY (kHz)
-36
-72
-108
-144
-180
1000
PHASE (°)
GAIN (dB)
MIC22600
Bode Plot (VIN = 5.0V, VO =
DS20006288A-page 7
SWITCH VOLTAGE
(2V/div)
VIN = 3V
VO = 1.8V
RO
VIN = 5V
IO = 1A
Time (2ms/div)
Time (200ns/div)
FIGURE 2-22:
VIN = 3V
VO = 1.8V
IO = 0.6A to 6A
VIN = 5V
VO = 3.3V
IO = 6A
Time (200μs/div)
DS20006288A-page 8
VIN = 3V
VO = 1V
IO = 6A
Time (20μs/div)
Time (200μs/div)
Transient Response.
Output Noise and Ripple.
ENABLE VOLTAGE
(1V/div)
RAMP CONTROL VOLTAGE
(500mV/div)
VIN = 5V
VO = 1.8V
IO = 0.6A to 6A
OUTPUT VOLTAGE
(500mV/div)
INPUT VOLTAGE
(1V/div)
OUTPUT CURRENT
(2A/div)
FIGURE 2-21:
Time (400ns/div)
FIGURE 2-23:
OUTPUT CURRENT
(2A/div)
Transient Response.
OUTPUT VOLTAGE
(50mV/div)
FIGURE 2-20:
High DC Operation.
OUTPUT VOLTAGE
(10mV/div)
Start-Up/Shutdown (CRC =
SWITCH VOLTAGE
(2V/div)
OUTPUT CURRENT OUTPUT VOLTAGE
(50mV/div)
(2A/div)
INPUT VOLTAGE
(500mV/div)
FIGURE 2-19:
10 nF).
OUTPUT VOLTAGE
(10mV/div)
ENABLE VOLTAGE
(2V/div)
OUTPUT CURRENT
(2A/div)
OUTPUT VOLTAGE
(1V/div)
RAMP CONTROL VOLTAGE
(500mV/div)
MIC22600
FIGURE 2-24:
Start-Up (CRC = 0 nF).
2020 Microchip Technology Inc.
FIGURE 2-25:
OUTPUT CURRENT OUTPUT VOLTAGE
(2A/div)
(500mV/div)
VIN = 3V
INPUT VOLTAGE
(500mV/div)
ENABLE VOLTAGE
(2V/div)
SWITCH VOLTAGE
(2V/div)
OUTPUT VOLTAGE
(100mV/div)
INPUT CURRENT
(2A/div)
MIC22600
Time (20μs/div)
Start-Up into Short.
2020 Microchip Technology Inc.
VIN = 3V
VO = 1.8V
IOSET = 12A
Time (200μs/div)
FIGURE 2-26:
Current Limit Behavior.
DS20006288A-page 9
MIC22600
Typical Circuits and Waveforms
EN1
RC1
DLY1
4N[
1.8V
10nF
MIC22600
IN
SW
EN MASTER
RC
U1
DLY
POR
GND
1.5V
1nF
MIC22600
IN
SW
EN SLAVE
RC
U2
DLY
POR
GND
VIN = 3.3V
Enable
0.6nF
0.7nF
I/O
47μF
VOUT1
μProcessor
POR1/EN2
CORE
47μF
RESET
RC2
DLY2
VOUT2
POR2
FIGURE 2-27:
Sequencing Circuit and Waveform.
EN1 = EN2
RC1
500mV/BOX
4N
VIN = 3.3V
Enable
10nF
10nF
MIC22600
IN
SW
EN MASTER
RC
U1
DLY
POR
GND
1.5V
MIC22600
IN
SW
EN SLAVE
RC
U2
DLY
POR
GND
1.2V
I/O
47μF
μProcessor
DLY1
1V/BOX
RC2 = VOUT1
CORE
47μF
RESET
DLY2
1V/BOX
VOUT2
POR1 = POR2
1V/BOX
FIGURE 2-28:
DS20006288A-page 10
Tracking Circuit and Waveform.
2020 Microchip Technology Inc.
MIC22600
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
QFN-24
Pin Number
TSSOP-24
Pin Name
1, 6, 13, 18
3, 10, 15, 22
PVIN
Power Supply Voltage (Input): Requires bypass capacitor to GND.
17
2
SVIN
Signal Power Supply Voltage (Input): Requires bypass capacitor to
GND.
2
11
Description
EN/DLY
EN/DLY (Input): When this pin is pulled higher than the enable threshold, the part will start up. Below this voltage, the device is in its low quiescent current mode. The pin has a 1 μA current source charging it to
VIN. By adding a capacitor to this pin a delay may easily be generated.
The enable function will not operate with an input voltage lower than
the min specified voltage.
4
13
RC
Ramp Control: Capacitor to ground from this pin determines slew rate
of output voltage during start-up. This can be used for tracking capability as well as soft start. RC pin cannot be left floating. Use a minimum capacitor value of 220 pF or larger.
14
23
FB
Feedback: Input to the error amplifier, connect to the external resistor
divider network to set the output voltage.
15
24
COMP
Compensation pin (Input): Place a RC network to GND to compensate
the device, see applications section.
5
14
POR/PG
7, 12, 19, 24
4, 9, 16, 21
PGND
Power Ground (Signal): Ground
16
1
SGND
Signal Ground (Signal): Ground
3
12
DELAY
DELAY (Input): Capacitor to ground sets internal delay timer. Timer
delays power-on-reset (POR) output at turn-on and ramp down at
turn-off.
8, 9, 10, 11,
20, 21, 22, 23
5, 6, 7, 8,
17, 18 19, 20
SW
EP
EP
GND
2020 Microchip Technology Inc.
Power-on-Reset (Output): Open-drain output device indicates when
the output is out of regulation and is active after the delay set by the
DELAY pin.
Switch (Output): Internal power MOSFET output switches.
Exposed Pad (Power): Must make a full connection to a GND plane
for full output power to be realized.
DS20006288A-page 11
MIC22600
4.0
FUNCTIONAL DESCRIPTION
4.1
PVIN, SVIN
PVIN is the input supply to the internal 30 mΩ
P-Channel Power MOSFET. This should be connected
externally to the SVIN pin. The supply voltage range is
from 2.6V to 5.5V. A 10 μF ceramic is recommended
for bypassing each PVIN supply.
4.2
EN/DLY
This pin is internally fed with a 1 μA current source from
VIN. A delayed turn on is implemented by adding a
capacitor to this pin. The delay is proportional to the
capacitor value. The internal circuits are held off until
EN/DLY reaches the enable threshold of 1.24V.
4.3
RC
RC allows the slew rate of the output voltage to be
programmed by the addition of a capacitor from RC to
ground. RC is internally fed with a 1 μA current source
and VOUT slew rate is proportional to the capacitor and
the 1 μA source. RC pin cannot be left floating. Use a
minimum capacitor value of 220 pF or larger.
4.4
asserted low without delay when enable is set low or
when the output goes below the –10% threshold. For a
Power Good (PG) function, the delay can be set to a
minimum. This can be done by removing the DELAY
capacitor.
4.8
SW
This is the connection to the drain (see Functional
Block Diagram) of the internal P-Channel MOSFET
and drain of the N-Channel MOSFET. This is a high
frequency, high power connection. Therefore, traces
should be kept as short and as wide as practical.
4.9
SGND
Internal signal ground for all low power sections.
4.10
PGND
Internal ground connection to the source of the internal
N-Channel MOSFETs.
DELAY
Adding a capacitor to this pin allows the delay of the
POR signal.
When VOUT reaches 90% of its nominal voltage, the
DELAY pin current source (1 μA) starts to charge the
external capacitor. At 1.24V, POR is asserted high.
4.5
COMP
The MIC22600 uses an internal compensation network
containing a fixed frequency zero (phase lead
response) and pole (phase lag response) which allows
the external compensation network to be much
simplified for stability. The addition of a single capacitor
and resistor will add the necessary pole and zero for
voltage mode loop stability using low value, low ESR
ceramic capacitors.
4.6
FB
The feedback pin provides the control path to control
the output. A resistor divider connecting the feedback
to the output is used to adjust the desired output
voltage. Refer to the feedback section in the
“Applications Information” for more detail.
4.7
POR
This is an open-drain output. A 47 kΩ resistor can be
used for a pull-up to this pin. POR is asserted high
when output voltage reaches 90% of nominal set
voltage and after the delay set by CDELAY. POR is
DS20006288A-page 12
2020 Microchip Technology Inc.
MIC22600
5.0
APPLICATION INFORMATION
The MIC22600 is a 6A synchronous step-down
regulator IC with a fixed 1 MHz, voltage mode PWM
control scheme. The other features include tracking
and sequencing control for controlling multiple output
power systems, and power-on-reset.
5.1
Input Capacitor
A minimum 10 μF ceramic is recommended on each of
the PVIN pins for bypassing. X5R or X7R dielectrics
are recommended for the input capacitor. Y5V
dielectrics is not recommended.
5.2
Output Capacitor
The MIC22600 was designed specifically for the use of
ceramic output capacitors and 22 μF is optimum output
capacitor. 22 μF can be increased to 100 μF to improve
transient performance. Because the MIC22600 is a
voltage mode controller, the control loop relies on the
inductor and output capacitor for compensation. For
this reason, do not use excessively large output
capacitors. The output capacitor requires either an X7R
or X5R dielectric. Y5V and Z5U dielectric capacitors,
aside from the undesirable effect of their wide variation
in capacitance over temperature, become resistive at
high frequencies. Using Y5V or Z5U capacitors can
cause instability in the MIC22600.
5.3
Inductor Selection
Inductor selection will be determined by the following
(not necessarily in the order of importance):
•
•
•
•
Inductance
Rated current value
Size requirements
DC resistance (DCR)
The MIC22600 is designed to use a 0.47 μH to 4.7 μH
inductor.
Maximum current ratings of the inductor are generally
given in two methods: permissible DC current and
saturation current. Permissible DC current can be rated
either for a 40°C temperature rise or a 10% loss in
inductance. Ensure the inductor selected can handle
the maximum operating current. When saturation
current is specified, make sure that there is enough
margin that the peak current will not saturate the
inductor. The ripple can add as much as 1.2A to the
output current level. The RMS rating should be chosen
to be equal or greater than the current limit of the
MIC22600 to prevent overheating in a fault condition.
For best electrical performance, the inductor should be
placed very close to the SW nodes of the IC.
It is important to test all operating limits before settling
on the final inductor choice.
2020 Microchip Technology Inc.
The size requirements refer to the area and height
requirements that are necessary to fit a particular
design. Please refer to the inductor dimensions on their
data sheet.
DCR is inversely proportional to size and can represent
a significant efficiency loss. Refer to the Efficiency
Considerations section for a more detailed description.
5.4
EN/DLY Capacitor
EN/DLY sources 1 μA out of the IC to allow a startup
delay to be implemented. The delay time is simply the
time it takes 1 μA to charge CDLY to 1.24V. Therefore:
EQUATION 5-1:
1.24 C DLY
t DLY = -----------------------------–6
1.10
5.5
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power consumed.
EQUATION 5-2:
V OUT I OUT
Efficiency % = --------------------------------- 100
V I
IN
IN
Maintaining high efficiency serves two purposes. It
decreases power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it decreases consumption of
current for battery powered applications. Reduced
current drawn from a battery increases the devices
operating time, particularly in hand-held devices.
There are mainly two loss terms in switching
converters: conduction losses and switching losses.
Conduction losses are simply the power losses due to
VI or I2R. For example, power is dissipated in the high
side switch during the on cycle. The power loss is equal
to the high-side MOSFET RDS(ON) multiplied by the
RMS Switch Current squared (ISW2). During the off
cycle, the low-side N-Channel MOSFET conducts, also
dissipating power. Similarly, the inductor’s DCR and
capacitor’s ESR also contribute to the I2R losses.
Device operating current also reduces efficiency by the
product of the quiescent (operating) current and the
supply voltage. The power consumed at 1 MHz
frequency and power loss due to switching transitions
DS20006288A-page 13
MIC22600
add up to switching losses. A free wheeling Schottky
diode is recommended to use in parallel with
synchronous N-MOSFET to improve the efficiency.
95
90
85
Figure 5-1 shows an efficiency curve. In the portion
from 0A to 1A, efficiency losses are dominated by
quiescent current losses, gate drive, and transition
losses. In this case, lower supply voltages yield greater
efficiency in that they require less current to drive the
MOSFETs and have reduced input power
consumption.
L = 1μH
80
75
L = 4.7μH
70
65
60
55
50
0
FIGURE 5-2:
200
400
600
800
OUTPUT CURRENT (mA)
Efficiency vs. Inductance.
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
FIGURE 5-1:
Efficiency Curve.
In the region of 1A to 6A, efficiency loss is dominated
by MOSFET RDS(ON) and inductor DC losses. Higher
input supply voltages will increase the Gate-to-Source
voltage on the internal MOSFETs, reducing the internal
RDS(ON). This improves efficiency by decreasing
conduction loss in the device but the inductor DCR loss
is inherent to the device. Inductor selection becomes
increasingly critical in efficiency calculations. As the
inductors are reduced in size, the DC resistance (DCR)
can become quite significant. The DCR losses can be
calculated as follows:
EQUATION 5-3:
2
L PD = I OUT DCR
From that, the loss in efficiency due to inductor
resistance can be calculated as in Equation 5-4.
EQUATION 5-4:
V OUT I OUT
EL = 1 – ------------------------------------------------------- 100
V
OUT I OUT + L PD
Where:
EL = Efficiency loss value in percent.
DS20006288A-page 14
Alternatively, under lighter loads, the ripple current
becomes a significant factor. When light load
efficiencies become more critical, a larger inductor
value maybe desired. Larger inductance reduces the
peak-to-peak inductor ripple current, which minimizes
losses. The graph in Figure 5-2 illustrates the effects of
inductance value at light load.
5.6
Compensation
The MIC22600 has a combination of internal and
external stability compensation to simplify the circuit for
small, high efficiency designs. In such designs, voltage
mode conversion is often the optimum solution. Voltage
mode is achieved by creating an internal 1 MHz ramp
signal and using the output of the error amplifier to
modulate the pulse width of the switch node, thereby
maintaining output voltage regulation. With a typical
gain bandwidth of 100 kHz to 200 kHz, the MIC22600
is capable of extremely fast transient responses.
The MIC22600 is designed to be stable with a typical
application using a 1 μH inductor and a 47 μF ceramic
(X5R) output capacitor. These values can be varied
dependent upon the trade off between size, cost and
efficiency, keeping the LC natural frequency ideally
less than 26 kHz to ensure stability can be achieved.
The minimum recommended inductor value is 0.47 μH
and minimum recommended output capacitor value is
22 μF. With a larger inductor, there is a reduced
peak-to-peak current that yields a greater efficiency at
lighter loads. A larger output capacitor will improve
transient response by providing a larger hold up
reservoir of energy to the output.
The integration of one pole-zero pair within the control
loop greatly simplifies compensation. The optimum
values for CCOMP (in series with a 20 kΩ resistor) are
shown below.
2020 Microchip Technology Inc.
MIC22600
TABLE 5-1:
COMPENSATION CAPACITOR
SELECTION
C
L
22 μF 47 μF
47 μF 100 μF
100 μF 470 μF
0.47 μH
0 pF - 10 pF
(Note 1)
22 pF
33 pF
1 μH
0 pF - 15 pF
(Note 2)
15 pF 22 pF
33 pF
2.2 μH
15 pF 33 pF
33 pF 47 pF
100 pF 220 pF
Note 1:
2:
VOUT > 1.2V
VOUT > 1V
5.7
PWM control provides fixed-frequency operation. By
maintaining a constant switching frequency,
predictable fundamental and harmonic frequencies are
achieved.
5.9
Feedback
EQUATION 5-5:
R1
R2 = ----------------------------V
OUT
--------------- – 1
V
REF
Where:
VREF = 0.7V
VOUT = The desired output voltage.
A 10 kΩ or lower resistor value from the output to the
feedback is recommended because large feedback
resistor values increase the impedance at the feedback
pin, making the feedback node more susceptible to
noise pick-up. A small capacitor (50 pF to 100 pF)
across the lower resistor can reduce noise pick-up by
providing a low impedance path to ground.
PWM Operation
The MIC22600 is a voltage mode, pulse width
modulation (PWM) controller. By controlling the duty
cycle, a regulated DC output voltage is achieved. As
load or supply voltage changes, so does the duty cycle
to maintain a constant output voltage. In cases where
the input supply runs into a dropout condition, the
MIC22600 will run at 100% duty cycle.
Sequencing and Tracking
The MIC22600 provides additional pins to provide
up/down sequencing and tracking capability for
connecting multiple voltage regulators together.
5.9.1
The MIC22600 provides a feedback pin to adjust the
output voltage to the desired level. This pin connects
internally to an error amplifier. The error amplifier then
compares the voltage at the feedback to the internal
0.7V reference voltage and adjusts the output voltage
to maintain regulation. The resistor divider network for
a desired VOUT is given by:
5.8
Since the low-side N-Channel MOSFET provides the
current during the off cycle, a freewheeling Schottky
diode from the switch node-to-ground is not required.
EN/DLY PIN
The EN pin contains a trimmed, 1 μA current source
that can be used with a capacitor to implement a fixed
desired delay in some sequenced power systems. The
threshold level for power on is 1.24V with a hysteresis
of 20 mV.
5.9.2
DELAY PIN
The DELAY pin also has a 1 μA trimmed current source
and a 1 μA current sink that acts with an external
capacitor to delay the operation of the Power-on-Reset
(POR) output. This can be used also in sequencing
outputs in a sequenced system, but with the addition of
a conditional delay between supplies; allowing a first
up, last down power sequence.
After EN is driven high, VOUT will start to rise (rate
determined by RC capacitor). As the FB voltage goes
above 90% of its nominal set voltage, DELAY begins to
rise as the 1 μA source charges the external capacitor.
When the threshold of 1.24V is crossed, POR is
asserted high and DELAY continues to charge to a
voltage SVIN. When FB falls below 90% of nominal,
POR is asserted low immediately. However, if EN is
driven low, POR will fall immediately to the low state
and DELAY will begin to fall as the external capacitor is
discharged by the 1 μA current sink. When the
threshold of ((VTP + 1.24V) – 1.24V) is crossed (VTP is
the internal voltage clamp, VTP = 0.9V), VOUT will begin
to fall at a rate determined by the RC capacitor. As the
voltage change in both cases is 1.24V, both rising and
falling delays are matched at:
EQUATION 5-6:
1.24 C DLY
t POR = -----------------------------–6
1.10
The MIC22600 provides constant switching at 1 MHz
with synchronous internal MOSFETs. The internal
MOSFETs include a high-side P-Channel MOSFET
from the input supply to the switch pin and an
N-Channel MOSFET from the switch pin-to-ground.
2020 Microchip Technology Inc.
DS20006288A-page 15
MIC22600
5.9.3
RC PIN
The RC pin provides a trimmed 1 μA current
source/sink similar to the DELAY pin for accurate
ramp-up (soft-start) and ramp-down control. This
allows the MIC22600 to be used in systems requiring
voltage tracking or ratio-metric voltage tracking at
startup.
There are two ways of using the RC pin:
• Externally driven from a voltage source
• Externally attached capacitor sets output ramp
up/down rate
In the first case, driving RC with a voltage from 0V to
VREF programs the output voltage between 0% and
100% of the nominal set voltage.
In the second case, the external capacitor sets the
ramp up and ramp down time of the output voltage. The
time is given by:
EQUATION 5-7:
0.7 C RC
t RAMP = -----------------------–6
1.10
Where:
tRAMP = The time from 0% to 100% nominal output
voltage.
The RC pin cannot be left floating. Use a minimum
capacitor value of 220 pF or larger.
DS20006288A-page 16
2020 Microchip Technology Inc.
MIC22600
5.9.4
SEQUENCING AND TRACKING EXAMPLES
There are four distinct variations that are easily implemented using the MIC22600. The two sequencing variations are
Delayed and Windowed. The two tracking variants are Normal and Ratio Metric. The following diagrams illustrate
methods for connecting two MIC22600’s to achieve these requirements.
Sequencing
Normal Tracking
3.3V
EN
EN
IN
RC
MIC22600
3.3V
VO1
SW
EN
EN
RC
Delay
GND
POR
CRC1 CDLY1
EN
IN
RC
MIC22600
Delay
GND
SW
Delay
POR
POR
MIC22600
GND
CRC1 CDLY1
GND
VO1
SW
R1
R3
R2
R4
FB
VO2
CRC2 CDLY2
FIGURE 5-3:
Circuit.
IN
EN
POR
3.3V
EN
IN
RC
MIC22600
VO2
SW
R3
FB
R4
Sequencing MIC22600
Delay
GND
POR
POR
CDLY2
GND
EN
VO1
POR1/EN2
VO2
CRC1 = CRC2 = 0nF
CDLY1 = 3.3nF
CDLY2 = 0nF
FIGURE 5-4:
Example.
FIGURE 5-6:
RCR1 = 3.3nF
CRC2 = 0nF
CDLY1 = 3.3nF
5 Nȍ
5 ȍ
5 ȍ
5 ȍ
Normal Tracking Circuit.
VO1
POR
VO2
EN
POR
Window Sequencing
EN
FIGURE 5-7:
Normal Tracking Example.
VO1
POR1/EN2
VO2
CRC1 = CRC2 = 0nF
CDLY1 = 3.3nF
CDLY2 = 6.8nF
FIGURE 5-5:
Example.
POR
Delayed Sequencing
2020 Microchip Technology Inc.
DS20006288A-page 17
MIC22600
Ratio Metric Tracking
DDR Memory VDD and VTT Tracking
3.3V
3.3V
IN
EN
EN
RC
VO1
SW
EN
R1
MIC22600
EN
IN
SW
RC
MIC22600
FB
FB
Delay
Delay
GND
CRC1 CDLY1
POR
EN
IN
SW
RC
MIC22600
FB
CRC1 CDLY1
VO2
½ R2
½ R2
3.3V
EN
IN
SW
RC
MIC22600
FB
VO2 = ½ VO1
R1
R2
Delay
POR
GND
GND
FIGURE 5-10:
Circuit.
GND
Ratio Metric Tracking
POR
POR
CDLY2
POR
CDLY2
FIGURE 5-8:
Circuit.
POR
R3
R4
GND
GND
R2
3.3V
Delay
VO1
R1
DDR Memory Tracking
RCR1 = 3.3nF
CRC2 = 0nF
CDLY1 = 3.3nF
5 Nȍ
5 ȍ
5 ȍ
5 ȍ
RCR1 = 3.3nF
CRC2 = 0nF
CDLY1 = 3.3nF
5 Nȍ
5 ȍ
5 ȍ
5 ȍ
VO1
POR
VO1
VO2
EN
POR
VO2
EN
FIGURE 5-9:
Example.
Ratio Metric Tracking
FIGURE 5-11:
Example.
DDR Memory Tracking
An alternative method here shows an example of a VDDQ & VTT solution for a DDR memory power supply. Note that
POR is taken from VO1 as POR2 will not go high. This is because POR is set high when FB > 0.9 x VREF. In this
example, FB2 is regulated to ½VREF.
DS20006288A-page 18
2020 Microchip Technology Inc.
MIC22600
5.10
Current Limit
EQUATION 5-8:
The MIC22600 is protected against overload in two
stages. The first is to limit the current in the P-channel
switch; the second is by overtemperature shutdown.
Current is limited by measuring the current through the
high-side MOSFET during its power stroke and
immediately switching off the driver when the preset
limit is exceeded.
The circuit in Figure 5-12 describes the operation of the
current-limit circuit. Because the actual RDS(ON) of the
P-Channel MOSFET varies part-to-part, over
temperature and with input voltage, simple IR voltage
detection is not employed. Instead, a smaller copy of
the Power MOSFET (Reference FET) is fed with a
constant current that is directly proportional to the
factory set current limit. This sets the current limit as a
current ratio and is not dependent upon the RDS(ON)
value. Current limit is set to 9A nominal. Variations in
the scale factor K between the Power PFET and the
reference PFET used to generate the limit threshold
account for a relatively small inaccuracy.
T J = T A + P DISS R JA
Where:
PDISS = The power dissipated within the QFN
package and is typically 1.5W at 6A load. This has
been calculated for a 1 μH inductor and details can
be found in Table 5-2 for reference.
RθJA = A combination of junction to case thermal
resistance (RθJC) and Case-to-Ambient thermal
resistance (RθCA), since thermal resistance of the
solder connection from the ePad to the PCB is
negligible; RθCA is the thermal resistance of the
ground plane to ambient, so RθJA = RθJC + RθCA.
TA = The operating ambient temperature.
Example:
The Evaluation Board has two copper planes that
contribute to an RθJA of approximately 25°C/W. The
worst case RθJC of the QFN 4x4 is 14°C/W.
EQUATION 5-9:
VIN
R JA = R JC + R CA
PFET
K.R
PFET
R
Current Limit
comparator
Current
Limit
R JA = 14C/W + 25C/W = 39C/W
SW
Ilim/K
Blanking
NFET
R
PGND
FIGURE 5-12:
5.11
To calculate the junction temperature for a 50°C
ambient:
EQUATION 5-10:
Current Limit Detail.
T J = T A + P DISS R JA
Thermal Considerations
The MIC22600 is packaged in a 4 mm x 4 mm QFN, a
package that has excellent thermal performance
equaling that of the larger TSSOP packages. This
maximizes heat transfer from the junction to the
exposed pad (ePad) that connects to the ground plane.
The size of the ground plane attached to the exposed
pad determines the overall thermal resistance from the
junction to the ambient air surrounding the printed
circuit board. The junction temperature for a given
ambient temperature can be calculated using:
2020 Microchip Technology Inc.
T J = 50C + 1.5W 39C/W
T J = 108.5C
This is below the maximum of 125°C.
TABLE 5-2:
POWER DISSIPATION FOR 6A
OUTPUT
VIN
VOUT
at 6A
3V
3.5V
4V
4.5V
5V
1V
1.47W
1.50W
1.52W
1.54W
1.56W
1.2V
1.45W
1.47W
1.49W
1.51W
1.54W
1.8V
1.46W
1.45W
1.45W
1.47W
1.48W
2.5V
1.61W
1.53W
1.49W
1.47W
1.47W
3.3V
—
1.70W
1.62W
1.56W
1.53W
DS20006288A-page 19
MIC22600
6.0
RIPPLE MEASUREMENTS
To properly measure ripple on either input or output of
a switching regulator, a proper ring in tip measurement
is required. Standard oscilloscope probes come with a
grounding clip, or a long wire with an alligator clip.
Unfortunately, for high-frequency measurements, this
ground clip can pick up high frequency noise and
erroneously inject it into the measured output ripple.
The standard evaluation board accommodates a home
made version by providing probe points for both the
input and output supplies and their respective grounds.
This requires the removing of the oscilloscope probe
sheath and ground clip from a standard oscilloscope
probe and wrapping a non-shielded bus wire around
the oscilloscope probe. If there does not happen to be
any non-shielded bus wire immediately available, the
leads from axial resistors will work. By maintaining the
shortest possible ground lengths on the oscilloscope
probe, true ripple measurements can be obtained.
FIGURE 6-1:
DS20006288A-page 20
Ripple Measurement.
2020 Microchip Technology Inc.
MIC22600
PCB Layout Guidelines
Output Capacitor
PCB Layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power,
signal and return paths.
• Use a wide trace to connect the output capacitor
ground terminal to the input capacitor ground
terminal.
• Phase margin will change as the output capacitor
value and ESR changes. Contact the factory if the
output capacitor is different from what is shown in
the BOM.
• The feedback trace should be separate from the
power trace and connected as close as possible
to the output capacitor. Sensing a long high
current load trace can degrade the DC load
regulation.
The following guidelines should be followed to ensure
proper operation of the MIC22600 converter.
IC
• Place the IC close to the point of load (POL).
• Use fat traces to route the input and output power
lines.
• The exposed pad (EP) on the bottom of the IC
must be connected to the ground.
• Use several vias to connect the EP to the ground
plane, layer 2.
• Signal and power grounds should be kept
separate and connected at only one location.
Input Capacitor
• Place the input capacitor next.
• Place the input capacitors on the same side of the
board and as close to the IC as possible.
• Place a 22 μF/6.3V ceramic bypass capacitor
next to each of the 4 PVIN pins.
• Keep both the VIN and PGND connections short.
• Place several vias to the ground plane close to
the input capacitor ground terminal, but not
between the input capacitors and IC pins.
• Use either X7R or X5R dielectric input capacitors.
Do not use Y5V or Z5U type capacitors.
• Do not replace the ceramic input capacitor with
any other type of capacitor. Any type of capacitor
can be placed in parallel with the input capacitor.
• If a Tantalum input capacitor is placed in parallel
with the input capacitor, it must be recommended
for switching regulator applications and the
operating voltage must be derated by 50%.
• In “Hot-Plug” applications, a Tantalum or
Electrolytic bypass capacitor must be used to limit
the over-voltage spike seen on the input supply
when power is suddenly applied.
Diode
• Place the Schottky diode on the same side of the
board as the IC and input capacitor.
• The connection from the Schottky diode’s Anode
to the input capacitors ground terminal must be as
short as possible.
• The diode’s Cathode connection to the switch
node (SW) must be keep as short as possible.
Inductor
• Keep the inductor connection to the switch node
(SW) short.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the
feedback (FB) pin.
• To minimize noise, place a ground plane
underneath the inductor.
2020 Microchip Technology Inc.
DS20006288A-page 21
MIC22600
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
24-Lead QFN*
XXXXX
XXX
WNNN
24-Lead TSSOP*
XXXXX
XXXX
WNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
22600
YML
8112
Example
22600
YTSE
9312
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
DS20006288A-page 22
2020 Microchip Technology Inc.
MIC22600
24-Lead QFN 4 mm x 4 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2020 Microchip Technology Inc.
DS20006288A-page 23
MIC22600
24-Lead TSSOP ePad Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006288A-page 24
2020 Microchip Technology Inc.
MIC22600
APPENDIX A:
REVISION HISTORY
Revision A (January 2020)
• Converted Micrel document MIC22600 to Microchip data sheet template DS20006288A.
• Minor grammatical text changes throughout.
• Evaluation Board Schematic, BOM, and PCB Layout sections from original data sheet moved to the
part’s Evaluation Board User’s Guide.
2020 Microchip Technology Inc.
DS20006288A-page 25
MIC22600
NOTES:
DS20006288A-page 26
2020 Microchip Technology Inc.
MIC22600
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
Device
X
XX
-XX
Part No.
Junction
Temp. Range
Package
Media Type
Device:
MIC22600:
1 MHz, 6A Integrated Switch Synchronous
Buck Regulator
Junction
Temperature
Range:
Y
Package:
ML =
TSE =
Media Type:
= 62/Tube (TSSOP Package Only)
TR =
2,500/Reel (TSSOP Package Only)
TR =
5,000/Reel (QFN Package Only)
=
–40°C to +125°C, RoHS-Compliant
a) MIC22600YML-TR:
MIC22600, Adj. Output Voltage,
–40°C to +125°C Temperature
Range, 24-Lead QFN,
5,000/Reel
b) MIC22600YTSE:
MIC22600, Adj. Output Voltage,
–40°C to +125°C Temperature
Range, 24-Lead TSSOP,
62/Tube
c) MIC22600YTSE-TR:
MIC22600, Adj. Output Voltage,
–40°C to +125°C Temperature
Range, 24-Lead TSSOP,
2,5000/Reel
24-Lead 4 mm x 4 mm QFN
24-Lead ePad TSSOP
Note 1:
2020 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006288A-page 27
MIC22600
NOTES:
DS20006288A-page 28
2020 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 Microchip Technology Inc.
ISBN: 978-1-5224-5472-4
DS20006288A-page 29
Worldwide Sales and Service
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DS20006288A-page 30
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2020 Microchip Technology Inc.
05/14/19
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