0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
MIC3172BM

MIC3172BM

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SOIC8

  • 描述:

    IC REG MULTI CONFG 1.25A 8SOIC

  • 数据手册
  • 价格&库存
MIC3172BM 数据手册
MIC2172/3172 100 kHz, 1.25A Switching Regulators Features General Description • • • • • • • • The MIC2172 and MIC3172 are complete 100 kHz SMPS current mode controllers with internal 65V 1.25A power switches. The MIC2172 features external frequency synchronization or frequency adjustment, while the MIC3172 features an enable/shutdown control input. • • • • 1.25A, 65V Internal Switch Rating 3V to 40V Input Voltage Range Current Mode Operation Internal Cycle-by-Cycle Current Limit Low External Parts Count Operates in Most Switching Topologies 7 mA Quiescent Current (Operating) 2" MIC3172 5V Flyback Converter VIN 4V to 6V R4* C1 22μF VSW EN C3* D1* VIN Enable Shutdown MIC3172 R3 1k VOUT 5V, 0.25A T1 D2 1N5818 C4 470μF R1 3.74k 1% 1:1.11 LPRI = 18μH COMP GND FB P1 P2 S R2 1.24k 1% C2 1μF * Optional voltage clipper (may be req’d if T1 leakage inductance too high) Package Types 8-Pin DIP (N) 8-Pin DIP (M) SGND 1 8 PGND1 SGND 1 8 PGND1 COMP 2 7 VSW COMP 2 7 VSW FB 3 *SYNC/†EN 4 DS20006208A-page 2 6 PGND2 5 VIN FB 3 *SYNC/†EN 4 6 PGND2 5 VIN  2019 Microchip Technology Inc. MIC2172/3172 Functional Block Diagrams MIC2172 Functional Block Diagram VSW Pin 7 VI N Pin 5 Reg. D1 2.3V Anti-Sat. 100kHz Osc. SYNC Pin 4 Logic Q1 Driver Comparator FB Pin 3 1.24V Ref. Current Amp. Error Amp. COMP Pin 2 SGND Pin 1 PGND2 PGND1 Pin 6 Pin 8 MIC3172 Functional Block Diagram VSW Pin 7 VI N Pin 5 Reg. Anti-Sat. 100kHz Osc. EN Pin 4 D1 2.3V Logic Driver Q1 Comparator FB Pin 3 1.24V Ref. SGND Pin 1  2019 Microchip Technology Inc. Current Amp. Error Amp. COMP Pin 2 PGND2 PGND1 Pin 6 Pin 8 DS20006208A-page 3 MIC2172/3172 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage (VIN)...................................................................................................................................................... 40V Switch Voltage (VSW) ................................................................................................................................................. 65V Feedback Voltage (VFB) (Transient, 1 ms) ............................................................................................................... ±15V Sync Current (ISYNC) .............................................................................................................................................. 50 mA Junction Temperature (TJ)......................................................................................................................–55°C to +150°C Storage Temperature (TS) ......................................................................................................................–65°C to +150°C Lead Temperature (Soldering 10 sec.) ....................................................................................................................300°C Operating Ratings ‡ Operating Junction Temperature (TJ) .....................................................................................................–40°C to +125°C Operating Ambient Temperature Range (TA) 8-Pin PDIP................................................................................................................................................–40°C to +85°C 8-Pin SOIC ...............................................................................................................................................–40°C to +85°C Thermal Resistance 8-Pin PDIP (JA) ................................................................................................................................................. 130°C/W 8-Pin SOIC (JA)................................................................................................................................................. 120°C/W † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. ELECTRICAL CHARACTERISTICS (MIC2172) Electrical Characteristics: VIN = 5V; TA = 25°C, unless otherwise specified. Bold values indicate –40°C ≤ TA ≤ 85°C. Note 1, Note 2 Parameter Symbol Min. Typ. Max. 1.220 1.240 1.264 1.214 — 1.274 — — 0.03 — 310 750 — — 1100 3.0 3.9 6.0 2.4 — 7.0 500 800 2000 125 175 350 100 — 400 Units Conditions Reference (Pin 2 tied to Pin 3) Feedback Voltage VFB Feedback Voltage Line Regulation ∆VFB(LINE) Feedback Bias Current IFB V %/V nA — — 3V ≤ VIN ≤ 40V — — Error Amplifier Transconductance ∆ICOMP/∆VFB Voltage Gain ∆VCOMP/∆VFB Output Current Output Swing Compensation Pin Threshold ICOMP VCOMP(MAX) 1.8 2.1 2.3 VCOMP(MIN) 0.25 0.35 0.52 0.8 0.9 1.08 0.6 — 1.25 — 0.76 1 — — 1.1 VCOMP_TH μA/mV ∆ICOMP = ±25 μA V/V 0.9V ≤ VCOMP ≤ 1.4V μA VCOMP = 1.5V V High Clamp, VFB = 1V Low Clamp, VFB = 1.5V V Duty Cycle = 0 Ω ISW = 1A, VFB = 0.8V Output Switch ON Resistance DS20006208A-page 4 RSW(ON)  2019 Microchip Technology Inc. MIC2172/3172 ELECTRICAL CHARACTERISTICS (MIC2172) (CONTINUED) Electrical Characteristics: VIN = 5V; TA = 25°C, unless otherwise specified. Bold values indicate –40°C ≤ TA ≤ 85°C. Note 1, Note 2 Parameter Current Limit Breakdown Voltage Symbol ICL VBR Min. Typ. Max. 1.25 — 3 1.25 — 3.5 1 — 2.5 65 75 — 88 100 Units Conditions Duty Cycle = 50%, TJ ≥ 25°C A Duty Cycle = 50%, TJ < 25°C Duty Cycle = 80%, Note 3 V 3V ≤ VIN ≤ 40V, ISW = 5 mA Oscillator Frequency fO Maximum Duty Cycle Sync Coupling Capacitor for Frequency Lock δmax 85 112 115 — kHz — 80 89 95 22 51 120 2.2 4.7 10 VIN(MIN) — 2.7 3.0 V IQ — 7 9 mA 3V ≤ VIN ≤ 40V, VCOMP = 0.6V, ISW = 0A ∆IIN — 9 20 mA ∆ISW = 1A, VCOMP = 1.5V CSYNC % — VPP = 3.0V pF VPP = 40V Input Supply Voltage Minimum Operating Voltage Quiescent Current Supply Current Increase Note 1: 2: 3: — Exceeding the absolute maximum rating may damage the device. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5 kΩ in series with 100 pF. For duty cycles (δ) between 50% and 95%, minimum guaranteed switch current is given by ICL = 0.833 (2 - δ) for the MIC2172. ELECTRICAL CHARACTERISTICS (MIC3172) Electrical Characteristics: VIN = 5V; TA = 25°C, unless otherwise specified. Bold values indicate –40°C ≤ TA ≤ 85°C. Note 1, Note 2 Parameter Symbol Min. Typ. Max. 1.224 1.240 1.264 1.214 — 1.274 — 0.07 — — 310 750 — — 1100 3.0 3.9 6.0 2.4 — 7.0 500 800 2000 125 175 350 100 — 400 VCOMP(MAX) 1.8 2.1 2.3 VCOMP(MIN) 0.25 0.35 0.52 0.8 0.9 1.08 0.6 — 1.25 Units Conditions Reference (Pin 2 tied to Pin 3) Feedback Voltage VFB Feedback Voltage Line Regulation ∆VFB(LINE) Feedback Bias Current IFB V %/V nA — — 3V ≤ VIN ≤ 40V — — Error Amplifier Transconductance ∆ICOMP/∆VFB Voltage Gain ∆VCOMP/∆VFB Output Current Output Swing Compensation Pin Threshold  2019 Microchip Technology Inc. ICOMP VCOMP_TH μA/mV ∆ICOMP = ±25 μA V/V 0.9V ≤ VCOMP ≤ 1.4V μA VCOMP = 1.5V V V High Clamp, VFB = 1V Low Clamp, VFB = 1.5V Duty Cycle = 0 DS20006208A-page 5 MIC2172/3172 ELECTRICAL CHARACTERISTICS (MIC3172) (CONTINUED) Electrical Characteristics: VIN = 5V; TA = 25°C, unless otherwise specified. Bold values indicate –40°C ≤ TA ≤ 85°C. Note 1, Note 2 Parameter Symbol Min. Typ. Max. — 0.76 1 — — 1.1 Units Conditions Output Switch ON Resistance RSW(ON) 1.25 — 3 Current Limit ICL 1.25 — 3.5 1 — 2.5 Breakdown Voltage VBR 65 75 — 88 100 112 Ω ISW = 1A, VFB = 0.8V Duty Cycle = 50%, TJ ≥ 25°C A Duty Cycle = 50%, TJ < 25°C Duty Cycle = 80%, Note 3 V 3V ≤ VIN ≤ 40V, ISW = 5 mA Oscillator Frequency fO Maximum Duty Cycle kHz — 85 — 115 δmax 80 89 95 % — — VIN(MIN) — 2.7 3.0 V — IQ — 7 9 mA 3V ≤ VIN ≤ 40V, VCOMP = 0.6V, ISW = 0 ∆ISW = 1A, VCOMP = 1.5V Input Supply Voltage Minimum Operating Voltage Quiescent Current Supply Current Increase ∆IIN — 9 20 mA Enable Input Threshold VEN_TH 0.4 1.2 2.4 V –1 0 1 — 2 10 Enable Input Current Note 1: 2: 3: IEN μA — VEN = 0V VEN = 2.4V Devices are ESD sensitive. Handling precautions required. Specification for packaged product only. For duty cycles (δ) between 50% and 95%, minimum guaranteed switch current is given by ICL = 0.833 (2 - δ) for the MIC3172. DS20006208A-page 6  2019 Microchip Technology Inc. MIC2172/3172 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Symbol Min. Typ. Max. Units Conditions TA –40 — +85 °C — Temperature Ranges Operating Ambient Temperature Range TJ –40 — +125 °C — TJ(ABSMAX) — — +150 °C — Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +300 °C Soldering, 10 sec. Thermal Resistance 8-Lead PDIP JA — 130 — Thermal Resistance 8-Lead SOIC JA — 120 — Operating Junction Temperature Range Maximum Junction Temperature Package Thermal Resistances Note 1: °C/W — — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2019 Microchip Technology Inc. DS20006208A-page 7 MIC2172/3172 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0A FIGURE 2-1: Minimum Operating Voltage (MIC2172) vs. Temperature. FIGURE 2-4: Supply Current vs. Operating Voltage. FIGURE 2-2: Temperature. Feedback Bias Current vs. FIGURE 2-5: Supply Current (Shutdown Mode) vs. Temperature. FIGURE 2-3: Regulation. Feedback Voltage Line FIGURE 2-6: vs. Temperature. DS20006208A-page 8 Enable Threshold Voltage  2019 Microchip Technology Inc. MIC2172/3172 FIGURE 2-7: Switch Current. Average Supply Current vs. FIGURE 2-10: Temperature. Supply Current vs. FIGURE 2-8: Switch Current. Switch ON Voltage vs. FIGURE 2-11: Temperature. Oscillator Frequency vs. FIGURE 2-9: Duty Cycle. Switch Current Limit vs. FIGURE 2-12: Oscillator Frequency vs. Adjusting Resistance.  2019 Microchip Technology Inc. DS20006208A-page 9 MIC2172/3172 FIGURE 2-13: Temperature. Error Amplifier Gain vs. FIGURE 2-14: Frequency. Error Amplifier Gain vs. FIGURE 2-15: Frequency. Error Amplifier Phase vs. DS20006208A-page 10  2019 Microchip Technology Inc. MIC2172/3172 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name Description 1 SGND Signal Ground: Internal analog circuit ground. Connect directly to the input filter capacitor for proper operation (see Section 5.0, Applications Information). Keep separate from power grounds. 2 COMP Frequency Compensation: Output of transconductance type error amplifier. Primary function is for loop stabilization. Can also be used for output voltage, soft-start, and current limit tailoring. 3 FB Feedback: Inverting input of error amplifier. Connect to external resistive divider to set switching regulator output voltage. Synchronization/Frequency Adjust: Capacitively coupled input signal greater than device’s free running frequency (up to 135 kHz) will lock device’s oscillator on falling edge. Oscillator frequency can be trimmed up to 135 kHz by adding a resistor to ground. If unused, pin must float (no connection). 4 (MIC2172) SYNC 4 (MIC3172) EN Enable: Apply TTL high or connect to VIN to enable the regulator. Apply TTL low or connect to ground to disable the regulator. Device draws only leakage current ( 2" This junction temperature is below the rated maximum of 150°C. FIGURE 5-12: 5.7 The first step in designing a boost converter is determining whether inductor L1 will cause the converter to operate in either continuous or Grounding Refer to Figure 5-11. Heavy lines indicate high-current ground paths. DS20006208A-page 16 5V to 12V Boost Converter.  2019 Microchip Technology Inc. MIC2172/3172 discontinuous mode. Discontinuous mode is preferred because the feedback control of the converter is simpler. Then: EQUATION 5-7: When L1 discharges its current completely during the MIC2172/3172’s off-time, it is operating in discontinuous mode. I OUT L1 is operating in continuous mode if it does not discharge completely before the MIC2172/3172 power switch is turned on again. 5.8.2 DISCONTINUOUS MODE DESIGN Given the maximum output current, solve Equation 5-6 to determine whether the device can operate in discontinuous mode without initiating the internal device current limit. I OUT  0.227 A This value is greater than the 0.14A output current requirement so we can proceed to find the inductance value of L1. EQUATION 5-8: EQUATION 5-6: I OUT  1.147 -------------  4.75  2   -----------------------------------12 2 I CL  ------- V IN  2   ------------------------------V OUT V OUT + V F – V IN  = -------------------------------------------V OUT + V F V IN    V IN    -------------------------  L1  ---------------------------------------I CL  f SW 2  P OUT  f SW Where: POUT = 12 x 0.14 = 1.68W fSW = 1.105 kHz (100 kHz) For our practical example: Where: ICL = Internal switch current limit ICL = 1.25A when δ < 50% ICL = 0.833 (2 - δ) when δ ≥ 50% IOUT = Maximum output current VIN = Minimum input voltage δ= Duty cycle for boost converter in CRM VOUT = Required output voltage VF = Diode forward voltage drop For the example in Figure 5-12: EQUATION 5-9: 2  4.75   0.623 4.75  0.623 -  L1  -----------------------------------------------------------------------------5 5 1.147  1  10 2  1.68  1  10 25.80H  L1  41.83H (Use 27 μH) Equation 5-10 solves for L1’s maximum current value. EQUATION 5-10: IOUT = 0.14A V IN  t ON I L1  PEAK  = -----------------------L1 ICL = 1.147A VIN = 4.75V (minimum) δ = 0.623 VOUT = 12.0V Where: tON = δ / fSW = 6.23×10-6 sec. VF = 0.6V EQUATION 5-11: –6 4.75  6.23  10 I L1  PEAK  = -------------------------------------------- = 1.096 A –6 27  10 Use a 27 μH inductor with a peak current rating of at least 1.4A.  2019 Microchip Technology Inc. DS20006208A-page 17 MIC2172/3172 5.9 Flyback Conversion 5.9.6 DISCONTINUOUS MODE DESIGN Flyback converter topology may be used in low power applications where voltage isolation is required or whenever the input voltage can be less than or greater than the output voltage. As with the step-up converter the inductor (transformer primary) current can be continuous or discontinuous. Discontinuous operation is recommended. When designing a discontinuous flyback converter, first determine whether the device can safely handle the peak primary current demand placed on it by the output power. Equation 5-12 finds the maximum duty cycle required for a given input voltage and output power. If the duty cycle is greater than 0.8, discontinuous operation cannot be used. Figure 5-13 shows a practical flyback converter design using the MIC3172. EQUATION 5-12: 5.9.1 SWITCH OPERATION During Q1’s on time (Q1 is the internal NPN transistor see block diagrams), energy is stored in T1’s primary inductance. During Q1’s off time, stored energy is partially discharged into C4 (output filter capacitor). Careful selection of a low ESR capacitor for C4 may provide satisfactory output ripple voltage making additional filter stages unnecessary. C1 (input capacitor) may be reduced or eliminated if the MIC3172 is located near a low impedance voltage source 5.9.2 OUTPUT DIODE The output diode allows T1 to store energy in its primary inductance (D2 nonconducting) and release energy into C4 (D2 conducting). The low forward voltage drop of a Schottky diode minimizes power loss in D2. 5.9.3 Where: POUT = 5.0V × 0.25A = 1.25W VIN = 4.0V to 6.0V ICL = 1.25A when δ < 50% Then: EQUATION 5-13: 2  1.25   ------------------1.25  4   0.5 (Use 0.55) FREQUENCY COMPENSATION A simple frequency compensation network consisting of R3 and C2 prevents output oscillations. High impedance output stages (transconductance type) in the MIC2172/3172 often permit simplified loop stability solutions to be connected to circuit ground, although a more conventional technique of connecting the components from the error amplifier output to its inverting input is also possible. 5.9.4 2  P OUT   -------------------------------------I CL  V IN  MIN  The slightly higher duty cycle value is used to overcome circuit inefficiencies. A few iterations of Equation 5-12 may be required if the duty cycle is found to be greater than 50%. Calculate the maximum transformer turns ratio a, or NPRI/NSEC, that will guarantee safe operation of the MIC2172/3172 power switch. VOLTAGE CLIPPER Care must be taken to minimize T1’s leakage inductance, otherwise it may be necessary to incorporate the voltage clipper consisting of D1, R4, and C3 to avoid second breakdown (failure) of the MIC3172’s power NPN Q1. 5.9.5 ENABLE/SHUTDOWN The MIC3172 includes the enable/shutdown feature. When the device is shutdown, total supply current is less than 1 μA. This is ideal for battery applications where portions of a system are powered only when needed. If this feature is not required, simply connect EN to VIN or to a TTL high voltage. DS20006208A-page 18  2019 Microchip Technology Inc. MIC2172/3172 EQUATION 5-14: Then: EQUATION 5-17: V CE  F CE – V IN  MAX  a  ---------------------------------------------------------V SEC 5 a= Maximum transformer turn ratio VCE = Power switch collector to emitter maximum voltage FCE = Safety derating factor (0.8 for most commercial and industrial applications) VIN(MAX) = maximum input voltage VSEC = transformer secondary voltage (VOUT + VF) –6 2 2 0.5  1  10  4.0  5.5  10  L PRI  -------------------------------------------------------------------------------1.25 Where: L PRI  19.36H Use an 18 μH primary inductance to overcome circuit inefficiencies. To complete the design the inductance value of the secondary is found which will guarantee that the energy stored in the transformer during the power switch on time will be completed discharged into the output during the off time. This is necessary when operating in discontinuous mode. For the practical example: EQUATION 5-18: VCE = 65V max. for the MIC2172/3172 FCE = 0.8 2 2 0.5  f SW  V SEC  t OFF L SEC  ------------------------------------------------------------------P OUT VSEC = 5.6V Then: Where: EQUATION 5-15: LSEC = Maximum secondary inductance tOFF = Power switch off time 65  0.8 – 6.0 a  -----------------------------5.6 Then: a  8.2143 EQUATION 5-19: Next, calculate the maximum primary inductance required to store the needed output energy with the power switch duty cycle of 55%. 5 2 –6 2 0.5  1  10  5.6  4.5  10  L SEC  -------------------------------------------------------------------------------1.25 L SEC  25.4H EQUATION 5-16: 2 2 0.5  f SW  V IN  MIN   t ON L PRI  --------------------------------------------------------------------------P OUT Where: LPRI = Maximum primary inductance fSW = Device switching frequency (100 kHz) VIN(MIN) = Minimum input voltage tON = Power switch on time  2019 Microchip Technology Inc. DS20006208A-page 19 MIC2172/3172 VIN 4V to 6V R4* C1 22μF VSW EN MIC3172 R3 1k D2 1N5818 C3* C4 470μF D1* VIN Enable Shutdown VOUT 5V, 0.25A T1 R1 3.74k 1% 1:1.11 LPRI = 18μH COMP GND FB P1 P2 S R2 1.24k 1% C2 1μF * Optional voltage clipper (may be req’d if T1 leakage inductance too high) FIGURE 5-13: MIC3172 5V 0.25A Flyback Converter. Finally, recalculate the transformer turns ratio to ensure that it is less than the value earlier found in Equation 5-14. So: EQUATION 5-23: EQUATION 5-20: –6 a =  5.5  10 ------------------------------------I PEAK  PRI  = 4.0 –6 18  10 L PRI -----------L SEC IPEAK(PRI) = 1.22A Now find the minimum reverse voltage requirement for the output rectifier. This rectifier must have an average current rating greater than the maximum output current of 0.25A. Then: EQUATION 5-21: –5 a = EQUATION 5-24: 1.8  10 --------------------------–5 2.54  10 V IN  MAX  +  V OUT  a  V BR  -----------------------------------------------------------F BR  a a = 0.89 Use 0.9 (same as 1:1.11) Where: This ratio is less than the ratio calculated in Equation 5-14. When specifying the transformer it is necessary to know the primary peak current which must be withstood without saturating the transformer core. EQUATION 5-22: V IN  MIN   t ON I PEAK  PRI  = -------------------------------------L PRI VBR = Output rectifier maximum peak reverse voltage rating a= Transformer turns ratio (0.9) FBR = Reverse voltage safety derating factor (0.8) Then: EQUATION 5-25: 6.0 +  5.0  0.9  V BR  ---------------------------------------0.8  0.9 V BR  14.58V DS20006208A-page 20  2019 Microchip Technology Inc. MIC2172/3172 A 1N5817 will safely handle voltage and current requirements in this example. 5.10 Forward Converters The MIC2172/3172 can be used in several circuit configurations to generate an output voltage which is less than the input voltage (buck or step-down topology). Figure 5-14 shows the MIC3172 in a voltage step-down application. Because of the internal architecture of these devices, more external components are required to implement a step-down regulator than with other devices offered by Microchip (refer to the LM257x or LM457x family of buck switchers). However, for step-down conversion requiring a transformer (forward), the MIC2172/3172 is a good choice. A 12V to 5V step-down converter using transformer isolation (forward) is shown in Figure 5-15. Unlike the isolated flyback converter which stores energy in the primary inductance during the controller’s on-time and releases it to the load during the off-time, the forward converter transfers energy to the output during the ontime, using the off-time to reset the transformer core. In the application shown, the transformer core is reset by the tertiary winding discharging T1’s peak magnetizing current through D2. For most forward converters the duty cycle is limited to 50%, allowing the transformer flux to reset with only two times the input voltage appearing across the power switch. Although during normal operation this circuit’s duty cycle is well below 50%, the MIC2172 (and MIC3172) has a maximum duty cycle capability of 90%. If 90% was required during operation (start-up and high load currents), a complete reset of the transformer during the off-time would require the voltage across the power switch to be ten times the input voltage. This would limit the input voltage to 6V or less for forward converter applications. To prevent core saturation, the application given here uses a duty cycle limiter consisting of Q1, C4 and R3. Whenever the MIC3172 exceeds a duty cycle of 50%, T1’s reset winding current turns Q1 on. This action reduces the duty cycle of the MIC3172 until T1 is able to reset during each cycle. 5.11 absent, and the transistors’ emitters are grounded, circuit operation is described in Section 5.11.1 “Oscillator Operation” 5.11.1 OSCILLATOR OPERATION Resistor R2 provides initial base current that turns transistor Q1 on and impresses the input voltage across one half of T1’s primary winding (Pri 1). T1’s feedback winding provides additional base drive (positive feedback) to Q1 forcing it well into saturation for a period determined by the Pri 1/C2 time constant. Once the voltage across C2 has reached its maximum circuit value, Q1’s collector current will no longer increase. Since T1 is in series with Q1, this drop in primary current causes the flux in T1 to change and because of the mutual coupling to the feedback winding further reduces primary current eventually turning Q1 off. The primary windings now change state with the feedback winding forcing Q2 on repeating the alternate half cycle exactly as with Q1. This action produces a sinusoidal voltage wave form; whose amplitude is proportional to the input voltage, across T1’s primary winding which is stepped up and capacitively coupled to the lamp. 5.11.2 LAMP CURRENT REGULATION Initial ionization (lighting) of the fluorescent lamp requires several times the ac voltage across it than is required to sustain current through the device. The current through the lamp is sampled and regulated by the MIC3172 to achieve a given intensity. The MIC3172 uses L1 to maintain a constant average current through the transistor emitters. This current controls the voltage amplitude of the Royer oscillator and maintains the lamp current. During the negative half cycle, lamp current is rectified by D3. During the positive half cycle, lamp current is rectified by D2 through R4 and R5. R3 and C5 filter the voltage dropped across R4 and R5 to the MIC3172’s feedback pin. The MIC3172 maintains a constant lamp current by adjusting its duty cycle to keep the feedback voltage at 1.24V. The intensity of the lamp is adjusted using potentiometer R5. The MIC3172 adjusts its duty cycle accordingly to bring the average voltage across R4 and R5 back to 1.24V. Fluorescent Lamp Supply An extremely useful application of the MIC3172 is generating an ac voltage for fluorescent lamps used as liquid crystal display back lighting in portable computers. Figure 5-16 shows a complete power supply for lighting a fluorescent lamp. Transistors Q1 and Q2 together with capacitor C2 form a Royer oscillator. The Royer oscillator generates a sine wave whose frequency is determined by the series L/C circuit comprised of T1 and C2. Assuming that the MIC3172 and L1 are  2019 Microchip Technology Inc. DS20006208A-page 21 MIC2172/3172 5.11.3 ON/OFF CONTROL Especially important for battery powered applications, the lamp can be remotely or automatically turned off using the MIC3172’s EN pin. The entire circuit draws less than 1 μA while shutdown. 5.11.4 EFFICIENCY To obtain maximum circuit efficiency careful selection of Q1 and Q2 for low collector to emitter saturation voltage is a must. Inductor L1 should be chosen for minimal core and copper losses at the switching frequency of the MIC3172, and T1 should be carefully constructed from magnetic materials optimized for the output power required at the Royer oscillator frequency. Suitable inductors may be obtained from Coiltronics, Inc. 5.12 Output Voltage Setting The MIC2172/3172 requires a resistor divider connected from the output to ground with the middle point connected to the FB pin to set the desired output voltage. The output voltage is set by Equation 5-26. EQUATION 5-26: R1 V OUT = V REF  ------- + 1  R2  Where: VREF = 1.24V internal reference voltage R1 = Upper feedback resistor R2 = Lower feedback resistor A typical value of R1 can be in the range of 3 kΩ to 15 kΩ. If R1 is too large, it may allow noise to be introduced into the voltage feedback loop. If R1 is too small in value, it will decrease the efficiency of the switching regulator, especially at light loads. Once R1 is selected, R2 can be calculated using Equation 5-27. EQUATION 5-27: V REF  R1 R2 = ---------------------------------V OUT – V REF DS20006208A-page 22  2019 Microchip Technology Inc. MIC2172/3172 VIN D1 1N4148 VIN VSW EN C2 2.2μF C1* 100μF MIC3172 R3 470 D3 1N4148 R3† COMP GND FB P1 P2 S 3.7k R2† 1.2k C3 1μF R4 10Ÿ C4 1μF L1 100μH C5 330μF D2 5V, 0.1A to 1A (ILOAD > 100mA) * Locate near MIC2172/3172 when supply leads > 2" † R3/R2 sets output voltage FIGURE 5-14: Step-Down or Buck Regulator. T1 1:1:1 D3 1N5819 L1 100μH VOUT 5V, 1A R4 C5 3.74k 470μF 1% VIN 12V R1* D1* VIN Enable Shutdown EN C1 22μF D4 1N5819 C2* VSW MIC3172 GND P1 P2 S FB COMP D2 1N5819 R2 1k C3 1μF Q1† R5 1.24k 1% R3 † C4 † * Voltage clipper † Duty cycle limiter FIGURE 5-15: 12V to 5V Forward Converter. Cold Cathode Fluorescent Lamp FB T1 EN GND P1 P2 S Q2 FB COMP C1 FIGURE 5-16: C3 300μH R1 D2 1N4148 D3 1N4148 L1 VSW MIC3172 C2 Sec D1 VIN Pri 1 Q1 Pri 2 Enable (On) Shutdown (Off) C4 R2 VIN 4.5V to 20V R3 C5 L1: T1: C2: C4: R4 R5 Intensity Control Coiltronics CTX300-4P Coiltronics CTX110602 Polyfilm, WIMA FKP2 0.1μF to 0.68μF 15pF to 30pF, 3kV min. LCD Backlight Fluorescent Lamp Supply.  2019 Microchip Technology Inc. DS20006208A-page 23 MIC2172/3172 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC* Example XXX XXXXXX WNNN MIC 2172YM 1947 8-Lead PDIP* Example XXX XXXXXX WNNN MIC 3172YN 2000 Legend: XX...X Y YY WW NNN e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. DS20006208A-page 24  2019 Microchip Technology Inc. MIC2172/3172 8-Lead PDIP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2019 Microchip Technology Inc. DS20006208A-page 25 MIC2172/3172 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006208A-page 26  2019 Microchip Technology Inc. MIC2172/3172 APPENDIX A: REVISION HISTORY Revision A (July 2019) • Converted Micrel document MIC2172/3172 to Microchip data sheet DS20006208A. • Minor text changes throughout. • Updated Section 1.0 “Electrical Characteristics” tables for both MIC2172/3172. • Updated Equation 5-1 through Equation 5-25 and also added a new Section 5.12 “Output Voltage Setting” in the Section 5.0 “Applications Information”.  2018 Microchip Technology Inc. DS20006208A-page 27 MIC2172/3172 NOTES: DS20006208A-page 28  2018 Microchip Technology Inc. MIC2172/3172 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. X XX –XX Device Junction Temperature Range Package Option Media Type Device: MIC2172: 100 kHz, 1.25A Switching Regulator (External frequency synchronization or frequency adjustment) MIC3172: 100 kHz, 1.25A Switching Regulator (Enable/shutdown control input) Junction Temperature Range: Y = –40°C to +125°C Package: M N = = 8-Lead SOIC (Pb-Free) 8-Lead PDIP (Pb-Free) Media Type: Blank Blank TR = 95/Tube (SOIC Package) = 50/Tube (PDIP Package) = 2,500/Reel  2019 Microchip Technology Inc. Examples: a) MIC2172YM: 100 kHz, 1.25A Switching Regulator, –40°C to +125°C Junction Temperature Range, Pb-Free, 8Lead SOIC Package, 95/Tube b) MIC3172YN: 100 kHz, 1.25A Switching Regulator, –40°C to +125°C Junction Temperature Range, Pb-Free, 8Lead PDIP Package, 50/Tube c) MIC2172YM-TR: 100 kHz, 1.25A Switching Regulator, –40°C to +125°C Junction Temperature Range, Pb-Free, 8Lead SOIC Package, 2,500/Reel d) MIC3172YM-TR: 100 kHz, 1.25A Switching Regulator, –40°C to +125°C Junction Temperature Range, Pb-Free, 8Lead SOIC Package, 2,500/Reel Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006208A-page 29 MIC2172/3172 NOTES: DS20006208A-page 30  2019 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2019 Microchip Technology Inc. ISBN: 978-1-5224-4723-8 DS20006208A-page 31 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 Germany - Rosenheim Tel: 49-8031-354-560 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra’anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20006208A-page 32 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2019 Microchip Technology Inc. 05/14/19
MIC3172BM 价格&库存

很抱歉,暂时无法提供与“MIC3172BM”相匹配的价格&库存,您可以联系我们找货

免费人工找货