MIC5200-5.0BSTR

MIC5200 100 mA Low-Dropout Regulator Features General Description • • • • • • • • • • • The MIC5200 is an efficient linear voltage regulator with very low dropout voltage (typically 17 mV at light loads and 200 mV at 100 mA), and very low ground current (1 mA at 100 mA output), offering better than 1% initial accuracy with a logic-compatible ON/OFF switching input. Designed especially for hand-held battery-powered devices, the MIC5200 is switched by a CMOS- or TTL-compatible logic signal. The ENABLE control may be tied directly to VIN if unneeded. When disabled, power consumption drops nearly to zero. The ground current of the MIC5200 increases only slightly in dropout, further prolonging battery life. Key MIC5200 features include protection against reversed battery, current limiting, and overtemperature shutdown. High Output Voltage Accuracy Variety of Output Voltages Guaranteed 100 mA Output Low Quiescent Current Low Dropout Voltage Extremely Tight Load and Line Regulation Very Low Temperature Coefficient Current and Thermal Limiting Zero OFF Mode Current Logic-Controlled Electronic Shutdown Available in 8-Lead SOIC, 8-Lead MSOP, and 3-Lead SOT-223 Packages Applications • • • • • • • The MIC5200 is available in several fixed voltages and accuracy configurations. Other options are available; contact Microchip for details. Cellular Telephones Laptop, Notebook, and Palmtop Computers Battery-Powered Equipment PCMCIA VCC and VPP Regulation/Switching Barcode Scanners SMPS Post-Regulator/DC-to-DC Modules High Efficiency Linear Power Supplies Typical Application Schematic MIC5200-3.3 OUTPUT 1μF ENABLE  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 1 MIC5200 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Supply Voltage ................................................................................................................................... –20V to +60V Enable Input Voltage ................................................................................................................................... –20V to +60V Power Dissipation...................................................................................................................................Internally Limited Operating Ratings ‡ Input Voltage .............................................................................................................................................. +2.5V to +26V Enable Input Voltage ...................................................................................................................................... –20V to VIN † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. DS20005578B-page 2  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 ELECTRICAL CHARACTERISTICS Electrical Characteristics: Limits in standard typeface are for TJ = +25°C and limits in boldface apply over the junction temperature range of –40°C to +125°C. Unless otherwise specified, VIN = VOUT + 1V, IL = 1 mA, CL = 3.3 μF, and VENABLE = VDD. (Note 1). Parameters Output Voltage Accuracy Sym. VO Output Voltage Temperature Coefficient ΔVO/ΔT Line Regulation ΔVO/VIN Load Regulation ΔVO/VOUT Dropout Voltage (Note 4) Quiescent Current Ground Pin Current VIN – VO IGND IGND Min. Typ. Max. Units –1 — 1 –2 — 2 — 40 150 — 0.004 0.10 — — 0.40 — 0.04 0.16 — — 0.30 — 17 — IL = 100 µA — 130 — IL = 20 mA — 150 — — 190 — IL = 50 mA — 230 350 IL = 100 mA — 0.01 10 — 130 — — 270 350 — 330 — — 500 — IL = 50 mA — 1000 1500 IL = 100 mA % Conditions Variation from specified VOUT ppm/°C Note 2 % VIN = VOUT + 1V to 26V % IL = 0.1 mA to 100 mA (Note 3) mV µA IL = 30 mA VENABLE ≤ 0.7V (shutdown) VENABLE = VDD, IL = 100 µA IL = 20 mA µA IL = 30 mA Ripple Rejection PSRR — 70 — dB — Ground Pin Current at Dropout IGNDDO — 270 330 µA VIN = 0.5V less than specified VOUT, IL = 100 µA (Note 5) ILIMIT 100 250 — mA VOUT = 0V ΔVO/ΔPD — 0.05 — %/W en — 100 — µV Current Limit Thermal Regulation Output Noise Note 1: 2: 3: 4: 5: 6: Note 6 — Specification for packaged product only. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time (t) after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN = 26V for t = 10 ms.  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 3 MIC5200 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: Limits in standard typeface are for TJ = +25°C and limits in boldface apply over the junction temperature range of –40°C to +125°C. Unless otherwise specified, VIN = VOUT + 1V, IL = 1 mA, CL = 3.3 μF, and VENABLE = VDD. (Note 1). Parameters Sym. Min. Typ. Max. Input Voltage Level, Logic Low VIL — — 0.7 Input Voltage Level, Logic High VIH 2.0 — — IIL — 0.01 1 IIH — 15 50 Units Conditions ENABLE Input Enable Input Current Note 1: 2: 3: 4: 5: 6: V µA OFF ON VIL ≤ 0.7V VIH ≥ 2.0V Specification for packaged product only. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1 mA to 100 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time (t) after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 100 mA load pulse at VIN = 26V for t = 10 ms. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C Note 1 Lead Temperature — — — +260 °C Soldering, 5s Thermal Resistance, SOT-223 JC — 15 — °C/W — Thermal Resistance, SOIC-8 JA — 160 — °C/W Note 2 Temperature Ranges Package Thermal Resistances Note 1: 2: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. The maximum allowable power dissipation at any ambient temperature is calculated using: P(MAX) = (TJ(MAX) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The θJC of the MIC5200-x.xYS is 15°C/W and θJA for the MIC5200YM is 160°C/W mounted on a PC board (see Thermal Considerations for further details). DS20005578B-page 4  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 10 GROUND CURRENT (mA) DROPOUT VOLTAGE (mV) 250 200 150 100 50 0 0.01 FIGURE 2-1: Current. 0.1 0.01 0.1 1 10 100 1000 OUTPUT CURRENT (mA) Dropout Voltage vs. Output FIGURE 2-4: Current. 0.3 IL = 100mA 0.2 0.1 IL = 1mA 0.0 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-2: Temperature. Dropout Voltage vs. 1.2 IL = 100mA 1.0 0.8 0.6 0.4 IL = 1mA 0.2 0 FIGURE 2-5: Voltage. 2 4 6 8 SUPPLY VOLTAGE (V) 10 Ground Current vs. Supply 3.5 3.0 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) Ground Current vs. Output 1.4 0.0 3.5 IL = 100mA 2.5 2.0 1.5 1.0 IL = 100μA, 1mA 0.5 FIGURE 2-3: 0.1 1 10 100 OUTPUT CURRENT (mA) 1.6 GROUND CURRENT (mA) DROPOUT VOLTAGE (V) 0.4 0.0 1 0 2 4 6 8 INPUT VOLTAGE (V) 10 Dropout Characteristics.  2016 - 2022 Microchip Technology Inc. and its subsidiaries 3.0 2.5 2.0 CIN = 2.2μF COUT = 4.7μF 1.5 1.0 0.5 0.0 0.0 FIGURE 2-6: Current. 0.1 0.2 OUTPUT CURRENT (A) 0.3 Output Voltage vs. Output DS20005578B-page 5 MIC5200 3.6 ILOAD = 100μA CIN = 2.2μF COUT = 4.7μF 0.25 OUTPUT VOLTAGE (V) GROUND CURRENT (mA) 0.30 0.20 0.15 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-7: Temperature. Ground Current vs. 1.2 1.1 1.0 -50 0 50 100 TEMPERATURE (°C) Δ OUTPUT (mV) FIGURE 2-8: Temperature. LOAD (mA) OUTPUT CURRENT (mA) 1.3 0 CL = 4.7 μF -50 200 100 0 -100 -5 0 FIGURE 2-9: Version). DS20005578B-page 6 5 10 15 20 25 30 35 TIME (ms) Thermal Regulation (3.3V 3.2 3 DEVICES: HI / AVG / LO 3.1 CURVES APPLICABLE AT 100μA AND 100mA 300 280 260 240 220 200 180 160 140 120 FIGURE 2-11: Temperature. 100 50 3.3 VOUT = 3.3V VOUT = 0V (SHORT CIRCUIT) 100 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) 150 Ground Current vs. 3.4 FIGURE 2-10: Output Voltage vs. Temperature (3.3V Version). MIN. INPUT VOLTAGE (V) GROUND CURRENT (mA) ILOAD = 100mA CIN = 2.2μF COUT = 4.7μF CIN = 2.2μF COUT = 4.7μF 3.0 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) 1.5 1.4 3.5 Output Current vs. 3.30 3.29 3.28 3.27 3.26 3.25 CIN = 2.2μF COUT = 4.7μF ILOAD = 1mA 3.24 3.23 3.22 3.21 3.20 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-12: Temperature. Minimum Input Voltage vs.  2016 - 2022 Microchip Technology Inc. and its subsidiaries 120 250 200 150 CIN = 2.2μF COUT = 4.7μF VOUT = 3.3V 100 50 0 1 2 3 4 5 6 INPUT VOLTAGE (V) Short Circuit Current vs. 0 CL = 4.7μF -30 300 200 100 0 -2 0 FIGURE 2-14: 2 4 6 TIME (ms) 8 0 CL = 47μF 200 100 FIGURE 2-15: 10 20 TIME (ms) 30 RL = 33Ω 20 0 1 2 3 4 5 6 7 8 9 10 SUPPLY VOLTAGE (V) 10 CL = 1 μF IL = 1mA 5 0 -5 -10 8 6 4 2 -0.2 INPUT (V) -30 300 0 40 0 FIGURE 2-17: 20 10 0 -10 60 FIGURE 2-16: Supply Current vs. Supply Voltage (3.3V Version). 10 Load Transient. -10 -20 80 0 Δ OUTPUT (mV) 20 10 -10 -20 100 7 INPUT (V) OUTPUT (mA) Δ OUTPUT (mV) FIGURE 2-13: Input Voltage. OUTPUT (mA) Δ OUTPUT (mV) SUPPLY CURRENT (mA) 300 Δ OUTPUT (mV) SHORT CIRCUIT CURRENT (mA) MIC5200 40 Load Transient.  2016 - 2022 Microchip Technology Inc. and its subsidiaries 0.2 0.4 TIME (ms) 0.6 0.8 Line Transient. 15 10 CL = 10 μF IL = 1mA 5 0 -5 8 6 4 2 -0.1 FIGURE 2-18: 0 0.1 0.2 0.3 0.4 0.5 0.6 TIME (ms) Line Transient. DS20005578B-page 7 MIC5200 1000 7 OUTPUT (V) ENABLE (V) CL = 4.7 μF IL = 1mA 2 0 0 OUTPUT (V) FIGURE 2-20: Version). Output Impedance. 30 25 CIN = 2.2μF COUT = 4.7μF 20 15 VEN = 5V 10 5 0 VEN = 2V -5 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) 50 100 150 200 250 300 TIME (μs) Enable Transient (3.3V 5 4 3 2 1 0 -1 4 FIGURE 2-23: vs. Temperature. Enable Current Threshold 1.6 CL = 4.7 μF IL = 100mA 2 0 -2 -50 FREQUENCY (Hz) FIGURE 2-22: 35 5 4 3 2 1 0 -1 4 -2 -50 IL = 100mA 1x106 1 2 3 4 5 6 SUPPLY VOLTAGE (V) 1x100 0 FIGURE 2-19: Supply Current vs. Supply Voltage (3.3V Version). ENABLE (V) 0.01 0.001 ENABLE CURRENT (μA) 0 0.1 100x103 10 IL = 1mA 1 10x103 RL = 66Ω 20 10 1x103 30 IL = 100μA 100x100 40 100 10x100 OUTPUT IMPEDANCE (Ω) 50 0 FIGURE 2-21: Version). DS20005578B-page 8 50 100 150 200 250 300 TIME (μs) Enable Transient (3.3V ENABLE VOLTAGE (V) SUPPLY CURRENT (mA) 60 1.4 1.2 CIN = 2.2μF COUT = 4.7μF 1 0.8 ON OFF 0.6 0.4 -60 -30 0 30 60 90 120 150 TEMPERATURE (°C) FIGURE 2-24: vs. Temperature. Enable Voltage Threshold  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 80 IL = 100μA 60 40 1x106 100x103 10x103 10x100 0 1x103 20 100x100 RIPPLE VOLTAGE (dB) 100 FREQUENCY (Hz) FIGURE 2-25: Ripple vs. Frequency. 80 IL = 1mA 60 40 1x106 100x103 10x103 10x100 0 1x103 20 100x100 RIPPLE VOLTAGE (dB) 100 FREQUENCY (Hz) FIGURE 2-26: Ripple vs. Frequency. 80 IL = 100mA 60 40 1x106 100x103 10x103 10x100 0 1x103 20 100x100 RIPPLE VOLTAGE (dB) 100 FREQUENCY (Hz) FIGURE 2-27: Ripple vs. Frequency.  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 9 MIC5200 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. Package Types MIC5200-x.xYS SOT-223 (S) (Top View) 1 IN TABLE 3-1: MIC5200-x.xYM SOIC-8 (M) MIC5200-x.xYMM MSOP-8 (MM) (Top View) OUT OUT NC GND 2 3 GND OUT IN IN NC EN PIN FUNCTION TABLE Pin Number SOT-223 Pin Number SOIC-8, MSOP-8 Pin Name 3 1, 2 OUT Output: Pins 1 and 2 (SOIC-8, MSOP-8 packages) must be externally connected together. — 3, 6 NC Not internally connected. Connect to ground place for lowest thermal resistance. 2, TAB 4 GND — 5 EN Enable/Shutdown (Input): TTL-compatible. High = enabled; low = shutdown. 1 7, 8 IN Supply Input: Pins 7 and 8 (SOIC-8, MSOP-8 packages) must be externally connected together. DS20005578B-page 10 Description Ground: Ground pin and TAB (SOT-223 package) are internally connected.  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 4.0 APPLICATION INFORMATION 4.1 External Capacitors A 1 μF capacitor is recommended between the MIC5200 output and ground to prevent oscillations due to instability. Larger values serve to improve the regulator's transient response. Most types of tantalum or aluminum electrolytics will be adequate; film types will work, but are costly and therefore not recommended. Many aluminum electrolytics have electrolytes that freeze at about –30°C, so solid tantalum capacitors are recommended for operation below –25°C. The important parameters of the capacitor are an effective series resistance of about 5Ω or less and a resonant frequency above 500 kHz. The value of this capacitor may be increased without limit. At lower values of output current, less output capacitance is required for output stability. The capacitor can be reduced to 0.47 μF for current below 10 mA or 0.33 μF for currents below 1 mA. A 1 μF capacitor should be placed from the MIC5200 input to ground if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. The MIC5200 will remain stable and in regulation with no load in addition to the internal voltage divider, unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. When used in dual supply systems where the regulator load is returned to a negative supply, the output voltage must be diode clamped to ground. 4.2 ENABLE Input The MIC5200 features nearly zero OFF mode current. When the ENABLE input is held below 0.7V, all internal circuitry is powered off. Pulling this pin high (over 2.0V) re-enables the device and allows operation. The ENABLE pin requires a small amount of current, typically 15 μA. While the logic threshold is TTL/CMOS compatible, ENABLE may be pulled as high as 30V, independent of the voltage on VIN.  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 11 MIC5200 5.0 THERMAL CONSIDERATIONS 5.1 Layout The MIC5200-x.xYM (8-lead surface mount package) has the following thermal characteristics when mounted on a single-layer copper-clad printed circuit board. PC Board Dielectric JA FR4 160°C/W Ceramic 120°C/W Multi-layer boards having a ground plane, wide traces near the pads, and large supply bus lines provide better thermal conductivity. The "worst case" value of 160°C/W assumes no ground plane, minimum trace widths, and a FR4 material board. 5.2 Nominal Power Dissipation and Die Temperature The MIC5200-x.xYM at a 25°C ambient temperature will operate reliably at up to 625 mW power dissipation when mounted in the "worst case" manner described above. At an ambient temperature of 55°C, the device may safely dissipate 440 mW. These power levels are equivalent to a die temperature of 125°C, the recommended maximum temperature for non-military grade silicon integrated circuits. For MIC5200-x.xYS (SOT-223 package) heat sink characteristics, please refer to Application Hint 17, “Calculating P.C. Board Heat Sink Area for Surface Mount Packages”. DS20005578B-page 12  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead SOIC* Example XXXX XXXX WNNNC 3-Lead SOT-223* 5200 33YM 3CM1C XXXX X.XXXNNNP Example 5200 4.8YS23KP 8-Lead MSOP* (Front) Example 8-Lead MSOP* (Back) Example XXXX X.XY 5200 5.0Y WNNN 745G Legend: XX...X Y YY WW NNN e3 * Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) symbol may not be to scale. Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 13 MIC5200 3-Lead SOT-223 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005578B-page 14  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 8-Lead MSOP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 15 MIC5200 8-Lead SOIC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20005578B-page 16  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 APPENDIX A: REVISION HISTORY Revision A (July 2016) • Converted Micrel document MIC5200 to Microchip data sheet DS20005578A. • Minor text changes throughout. Revision B (February 2022) • Updated the Package Marking Information with the most current marking information. • Updated the Product Identification System with current Media Type values. • Minor grammar and stylistic changes throughout.  2016 - 2022 Microchip Technology Inc. and its subsidiaries DS20005578B-page 17 MIC5200 NOTES: DS20005578B-page 18  2016 - 2022 Microchip Technology Inc. and its subsidiaries MIC5200 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Part Number -X.X X XX -XX Device Voltage Temperature Range Package Media Type Device: MIC5200: Voltage: (Note 1) 3.0 3.3 4.8 5.0 = = = = 100 mA Low-Dropout Regulator 3.0V 3.3V 4.8V 5.0V Temperature Range: Y = –40°C to +125°C Package: M = MM = S = 8-Lead SOIC 8-Lead MSOP 3-Lead SOT-223 Media Type: TR = = = = 2,500/Reel 100/Tube (MSOP option) 95/Tube (SOIC option) 78/Tube (SOT-223 option) Note 1: The 8-Lead MSOP package (MM) is only available in 3.3V and 5.0V options. Examples: a) MIC5200-3.3YMM-TR: MIC5200, 3.3V Voltage, –40°C to +125°C Temp. Range, 8-Lead MSOP, 2500/Reel b) MIC5200-3.0YM: MIC5200, 3.0V Voltage, –40°C to +125°C Temp. Range, 8-Lead SOIC, 95/Tube c) MIC5200-4.8YS: MIC5200, 4.8V Voltage, –40°C to +125°C Temp. Range, 3-Lead SOT-223, 78/Tube d) MIC5200-5.0YMM: MIC5200, 5.0V Voltage, –40°C to +125°C Temp. Range, 8-Lead MSOP, 100/Tube e) MIC5200-4.8YM-TR: MIC5200, 4.8V Voltage, –40°C to +125°C Temp. Range, 8-Lead SOIC, 2500/Reel f) MIC5200-3.3YS-TR: MIC5200, 3.3V Voltage, –40°C to +125°C Temp. Range, 3-Lead SOT-223, 2500/Reel Note 1:  2016 - 2022 Microchip Technology Inc. and its subsidiaries Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005578B-page 19 MIC5200 NOTES: DS20005578B-page 20  2016 - 2022 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. 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