MIC5239
Low Quiescent Current 500 mA µCap LDO Regulator
Features
General Description
• Ultra-Low Quiescent Current
(IQ = 23 µA @ IO = 100 µA)
• Continuous 500 mA Output Current
• Wide Input Range: 2.3V to 30V
• Low Dropout Voltage: 350 mV @ 500 mA
• ±1.0% Initial Output Accuracy
• Stable with Ceramic or Tantalum Output Capacitor
• Logic Compatible Enable Input
• Low Output Voltage Error Flag Indicator
• Overcurrent Protection
• Thermal Shutdown
• Reverse-Leakage Protection
• Reverse-Battery Protection
• High-Power SOIC-8, MSOP-8, and SOT-223
Packages
The MIC5239 is a low quiescent current, µCap
low-dropout regulator. With a maximum operating input
voltage of 30V and a quiescent current of 23 µA, it is
ideal for supplying keep-alive power in systems with
high voltage batteries.
Applications
Available in the thermally enhanced SOIC-8, MSOP-8,
and SOT-223, the MIC5239 comes in fixed 1.5V, 1.8V,
2.5V, 3.0V, 3.3V, and 5.0V, and adjustable voltages. For
other output voltages, contact Microchip.
• USB Power Supply
• Keep-Alive Supply in Notebook and Portable
Personal Computers
• Logic Supply from High Voltage Batteries
• Automotive Electronics
• Battery-Powered Systems
Capable of 500 mA output, the MIC5239 has a dropout
voltage of only 350 mV. It can provide high output
current for applications such as USB.
As a µCap LDO, the MIC5239 is stable with either a
ceramic or a tantalum output capacitor. It only requires
a 3.3 µF output capacitor for stability.
The MIC5239 includes a logic compatible enable input
and an undervoltage error flag indicator. Other features
of the MIC5239 include thermal shutdown, current limit,
overvoltage shutdown, reverse-leakage protection,
and reverse-battery protection.
Package Types
MIC5239, Fixed
8-Lead SOIC (M)
8-Lead MSOP (MM)
(Top View)
2021 Microchip Technology Inc.
MIC5239
3-Lead SOT-223 (S)
(Top View)
MIC5239, Adj.
8-Lead SOIC (M)
8-Lead MSOP (MM)
(Top View)
DS20006544A-page 1
MIC5239
Typical Application Circuit
VIN
30V
MIC5239
IN
OUT
EN
FLG
GND
VOUT
3.0V/100μA
IGND = 23μA
Functional Block Diagram
MIC5239, Fixed
MIC5239, Adj.
DS20006544A-page 2
2021 Microchip Technology Inc.
MIC5239
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) ................................................................................................................................... –20V to +32V
Enable Input Voltage (VEN) ........................................................................................................................ –0.3V to +32V
Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited
ESD Rating (Note 2) (SOT-223)................................................................................................................................. 2 kV
ESD Rating (Note 2) (8-Lead MSOP) ..................................................................................................................... 1.5 kV
Operating Ratings ‡
Supply Voltage (VIN) .................................................................................................................................. +2.3V to +30V
Enable Input Voltage (VEN) ............................................................................................................................. 0V to +30V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA) ÷
θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the
regulator will go into thermal shutdown. The θJA of the MIC5239-x.xYMM (all versions) is 80°C/W, the
MIC5239-x.xYM (all versions) is 63°C/W, and the MIC5239-x.xYS (all versions) is 50°C/W mounted on a
PC board, see “Thermal Characteristics” for further details.
2: Devices are inherently ESD sensitive. Handling precautions required. Human body model: 1.5 kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1V; VEN ≥ 2.0V; IOUT = 100 µA; TJ = +25°C, bold values valid for –40°C ≤
TJ ≤ +125°C; unless noted. (Note 1)
Parameter
Symbol
Output Voltage Accuracy
VOUT
Min.
Typ.
Max.
–1
—
1
–2
—
2
Units
%
Variation from nominal VOUT
VIN = VOUT + 1V to 30V
Line Regulation
ΔVOUT/
VOUT
—
0.06
0.5
%
Load Regulation
ΔVOUT/
VOUT
—
15
30
mV
50
—
—
260
350
—
—
400
—
350
—
—
23
40
—
—
45
—
1.3
5
—
8.5
15
IGND(SHDN)
—
0.1
1
µA
ISC
—
850
1200
mA
ΔV
Ground Pin Current
Ground Pin Shutdown
Current
IGND
Short-Circuit Current
Output Noise
2021 Microchip Technology Inc.
en
—
160
—
IOUT = 100 µA to 500 mA, Note 2
IOUT = 100 µA
—
Dropout Voltage, Note 3
Conditions
mV
IOUT = 150 mA
IOUT = 500 mA
µA
mA
µVRMS
VEN ≥ 2.0V, IOUT = 100 µA
VEN ≥ 2.0V, IOUT = 150 mA
VEN ≥ 2.0V, IOUT = 500 mA
VEN ≤ 0.6V, VIN = 30V
VOUT = 0V
10 Hz to 100 kHz, VOUT = 3.0V,
CL = 3.3 µF
DS20006544A-page 3
MIC5239
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1V; VEN ≥ 2.0V; IOUT = 100 µA; TJ = +25°C, bold values valid for –40°C ≤
TJ ≤ +125°C; unless noted. (Note 1)
Parameter
Symbol
Min.
Typ.
Max.
—
94
—
—
95
—
Units
Conditions
FLAG Output
Low Threshold
High Threshold
VFLG
%
% of VOUT
FLAG Output Low
Voltage
VOL
—
150
—
mV
VIN = VOUT(NOM) – 0.12VOUT,
IOL = 200 µA
FLAG Output Leakage
Current
ILEAK
—
0.1
—
µA
VOH = 30V
Enable Input
Input Low Voltage
VIL
—
—
0.6
V
Regulator off
Input High Voltage
VIH
2.0
—
—
V
Regulator on
–1.0
Enable Input Current
Note 1:
2:
3:
IIN
1.0
–2.0
0.01
2.0
—
0.15
1.0
—
—
2.0
—
0.5
2.5
—
—
5.0
VEN = 0.6V, regulator off
µA
VEN = 2.0V, regulator on
VEN = 30V, regulator on
Specification for packaged product only.
Regulation is measured at constant junction temperature using pulse testing with a low duty-cycle.
Changes in output voltage due to heating effects are covered by the specification for thermal regulation.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1.0V differential.
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Junction Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 5 sec.
Thermal Resistance, MSOP 8-Ld
θJA
—
80
—
°C/W
—
Thermal Resistance, SOT-223 3-Ld
θJA
—
50
—
°C/W
—
Package Thermal Resistance
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006544A-page 4
2021 Microchip Technology Inc.
MIC5239
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
VOUT = 3V
FIGURE 2-1:
Ratio.
Power Supply Rejection
FIGURE 2-4:
Dropout Characteristics.
FIGURE 2-2:
Current.
Dropout Voltage vs. Output
FIGURE 2-5:
Output Current.
Ground Pin Current vs.
FIGURE 2-3:
Temperature.
Dropout Voltage vs.
FIGURE 2-6:
Output Current.
Ground Pin Current vs.
2021 Microchip Technology Inc.
DS20006544A-page 5
MIC5239
FIGURE 2-7:
Temperature.
Ground Pin Current vs.
FIGURE 2-10:
Input Voltage.
Ground Pin Current vs.
FIGURE 2-8:
Temperature.
Ground Pin Current vs.
FIGURE 2-11:
Input Voltage.
Ground Pin Current vs.
FIGURE 2-9:
Temperature.
Ground Pin Current vs.
FIGURE 2-12:
Input Voltage.
Ground Pin Current vs.
DS20006544A-page 6
2021 Microchip Technology Inc.
MIC5239
FIGURE 2-13:
Input Current.
FIGURE 2-16:
Load Transient Response.
FIGURE 2-14:
Temperature.
Output Voltage vs.
FIGURE 2-17:
Enable Turn-On.
FIGURE 2-15:
Short-Circuit Current.
2021 Microchip Technology Inc.
DS20006544A-page 7
MIC5239
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
MSOP/SOIC
Pin Number
SOT-223
Pin Name
Description
2 (Fixed)
—
FLG
Error FLAG (Output): Open-collector output is active low when
the output is out of regulation due to insufficient input voltage or
excessive load. An external pull-up resistor is required.
2 (Adj.)
—
ADJ
Adjustable Feedback Input: Connect to voltage divider network.
3
1
IN
4
3
OUT
1
—
EN
5, 6, 7, 8
2
GND
DS20006544A-page 8
Power Supply Input.
Regulated Output.
Enable (input): Logic low = shutdown; logic high = enabled.
Ground: Pins 5, 6, 7, and 8 are internally connected in common
via the leadframe.
2021 Microchip Technology Inc.
MIC5239
4.0
APPLICATIONS INFORMATION
The MIC5239 provides all of the advantages of the
MIC2950:
wide
input
voltage
range,
and
reversed-battery
protection,
with
the
added
advantages of reduced quiescent current and smaller
package. Additionally, when disabled, quiescent
current is reduced to 0.1 µA.
4.1
Enable
A low on the enable pin disables the part, forcing the
quiescent current to less than 0.1 µA. Thermal
shutdown and the error flag are not functional while the
device is disabled. The maximum enable bias current
is 2 µA for a 2.0V input. An open-collector pull-up
resistor tied to the input voltage should be set low
enough to maintain 2V on the enable input. Figure 4-1
shows an open-collector output driving the enable pin
through a 200 kΩ pull-up resistor tied to the input
voltage.
In order to avoid output oscillations, slow transitions
from low-to-high should be avoided.
FIGURE 4-1:
4.2
Remote Enable.
Input Capacitor
FIGURE 4-2:
4.4
Output Capacitor ESR.
Error Detection Comparator
Output
The FLAG pin is an open-collector output which goes
low when the output voltage drops 5% below its
internally programmed level. It senses conditions such
as excessive load (current limit), low input voltage, and
overtemperature conditions. Once the part is disabled
via the enable input, the error flag output is not valid.
Overvoltage conditions are not reflected in the error
flag output. The error flag output is also not valid for
input voltages less than 2.3V.
The error output has a low voltage of 400 mV at a
current of 200 µA. In order to minimize the drain on the
source used for the pull-up, a value of 200 kΩ to 1 MΩ
is suggested for the error flag pull-up. This will
guarantee a maximum low voltage of 0.4V for a 30V
pull-up potential. An unused error flag can be left
unconnected.
An input capacitor may be required when the device is
not near the source power supply or when supplied by
a battery. Small, surface mount ceramic capacitors can
be used for bypassing. Larger values may be required
if the source supply has high ripple.
4.3
Output Capacitor
The MIC5239 has been designed to minimize the effect
of the output capacitor ESR on the closed loop stability.
As a result, ceramic or film capacitors can be used at
the output. Figure 4-2 displays a range of ESR values
for a 10 µF capacitor. Virtually any 10 µF capacitor with
an ESR less than 3.4Ω is sufficient for stability over the
entire input voltage range. Stability can also be
maintained throughout the specified load and line
conditions with 4.7 µF film or ceramic capacitors.
2021 Microchip Technology Inc.
FIGURE 4-3:
4.5
Error FLAG Output Timing.
Thermal Shutdown
The MIC5239 has integrated thermal protection. This
feature is only for protection purposes. The device
should never be intentionally operated near this
temperature as this may have detrimental effects on
the life of the device. The thermal shutdown may
become inactive while the enable input is transitioning
DS20006544A-page 9
MIC5239
from a high to a low. When disabling the device via the
enable pin, transition from a high to low quickly. This
will insure that the output remains disabled in the event
of a thermal shutdown.
4.6
ambient air and it includes θCS (case-to-sink thermal
resistance) and θSA (sink-to-ambient thermal
resistance).
Current Limit
Figure 4-4 displays a method for reducing the steady
state short-circuit current. The duration that the supply
delivers current is set by the time required for the error
flag output to discharge the 4.7 µF capacitor tied to the
enable pin. The off time is set by the 200 kΩ resistor as
it recharges the 4.7 µF capacitor, enabling the
regulator. This circuit reduces the short-circuit current
from 800 mA to 40 mA while allowing for regulator
restart once the short is removed.
FIGURE 4-5:
FIGURE 4-4:
Remote Enable with
Short-Circuit Current Foldback.
4.7
Thermal Characteristics
The MIC5239 is a high input voltage device, intended
to provide 500 mA of continuous output current in two
very small profile packages. The power MSOP-8 allows
the device to dissipate about 50% more power than
their standard equivalents.
4.7.1
POWER MSOP-8 THERMAL
CHARACTERISTICS
Thermal Resistance.
Using the power MSOP-8 reduces the θJC dramatically
and allows the user to reduce θCA. The total thermal
(junction-to-ambient
thermal
resistance,
θJA
resistance) is the limiting factor in calculating the
maximum power dissipation capability of the device.
Typically, the power MSOP-8 has a θJC of 80°C/W. This
is significantly lower than the standard MSOP-8, which
is typically 200°C/W. θCA is reduced because pins 5
through 8 can now be soldered directly to a ground
plane that significantly reduces the case-to-sink
thermal resistance and sink to ambient thermal
resistance.
Low-dropout linear regulators from Microchip are rated
to a maximum junction temperature of 125°C. It is
important not to exceed this maximum junction
temperature during operation of the device. To prevent
this maximum junction temperature from being
exceeded, the appropriate ground plane heatsink must
be used.
One of the secrets of the MIC5239’s performance is its
power MSOP-8 package featuring half the thermal
resistance of a standard MSOP-8 package. Lower
thermal resistance means more output current or
higher input voltage for a given package size.
Lower thermal resistance is achieved by joining the
four ground leads with the die attach paddle to create a
single piece electrical and thermal conductor. This
concept has been used by MOSFET manufacturers for
years, proving very reliable and cost effective for the
user.
Thermal resistance consists of two main elements, θJC
(junction-to-case thermal resistance) and θCA
(case-to-ambient thermal resistance). See Figure 4-5.
θJC is the resistance from the die to the leads of the
package. θCA is the resistance from the leads to the
DS20006544A-page 10
FIGURE 4-6:
Copper Area vs.
Power-MSOP Power Dissipation (ΔθJA).
2021 Microchip Technology Inc.
MIC5239
Figure 4-6 shows copper area versus power
dissipation with each trace corresponding to a different
temperature rise above ambient.
From these curves, the minimum area of copper
necessary for the part to operate safely can be
determined. The maximum allowable temperature rise
must be calculated to determine operation along which
curve.
EQUATION 4-1:
T = T J MAX – T A MAX
Where:
TJ(MAX) = 125°C
TA(MAX) = Maximum ambient operating temperature.
4.7.2
QUICK METHOD
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-7, which shows safe operating curves for
three different ambient temperatures: 25°C, 50°C, and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C and the power dissipation is
632 mW, the curve in Figure 4-7 shows that the
required area of copper is 110 mm2.
The θJA of this package is ideally 80°C/W, but it will
vary depending upon the availability of copper ground
plane to which it is attached.
For example, the maximum ambient temperature is
50°C, the ΔT is determined as follows:
EQUATION 4-2:
T = 125C – 50C = 75C
Using Figure 4-6, the minimum amount of required
copper can be determined based on the required
power dissipation. Power dissipation in a linear
regulator is calculated as follows:
FIGURE 4-7:
Copper Area vs.
Power-MSOP Power Dissipation (TA).
EQUATION 4-3:
P D = V IN – V OUT I OUT + V IN I GND
If we use a 3V output device and a 28V input at
moderate output current of 25 mA, then the power
dissipation is as follows:
EQUATION 4-4:
FIGURE 4-8:
Copper Area vs.
Power-SOIC Power Dissipation (ΔθJA).
P D = 28V – 3V 25mA + 28V 250A
P D = 625mW + 7mW = 632mW
From Figure 4-6, the minimum amount of copper
required to operate this application at a ∆T of 75°C is
110 mm2.
2021 Microchip Technology Inc.
DS20006544A-page 11
MIC5239
4.9
Adjustable Regulator Application
The MIC5239YM can be adjusted from 1.24V to 20V by
using two external resistors (Figure 4-10). The
resistors set the output voltage based on the following
equation:
EQUATION 4-5:
R1
V OUT = V REF 1 + -------
R2
Where:
VREF = 1.23V
FIGURE 4-9:
Copper Area vs.
Power-SOIC Power Dissipation (TA).
Feedback resistor R2 should be no larger than 300 kΩ.
The same method of determining the heatsink area
used for the power MSOP-8 can be applied directly to
the power SOIC-8. The same two curves showing
power dissipation versus copper area are reproduced
for the power SOIC-8 and they can be applied
identically.
4.8
Power SOIC-8 Thermal
Characteristics
The power SOIC-8 package follows the same idea as
the power MSOP-8 package, using four ground leads
with the die attach paddle to create a single-piece
electrical and thermal conductor, reducing thermal
resistance and increasing power dissipation capability.
4.8.1
FIGURE 4-10:
Application.
Adjustable Voltage
QUICK METHOD
Determine the power dissipation requirements for the
design along with the maximum ambient temperature
at which the device will be operated. Refer to
Figure 4-9, which shows safe operating curves for
three different ambient temperatures, 25°C, 50°C, and
85°C. From these curves, the minimum amount of
copper can be determined by knowing the maximum
power dissipation required. If the maximum ambient
temperature is 50°C, and the power dissipation is
632 mW, the curve in Figure 4-9 shows that the
required area of copper is less than 100 mm2, when
using the power SOIC-8.
DS20006544A-page 12
2021 Microchip Technology Inc.
MIC5239
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead SOIC, Adj.*
Example
MIC
5239YM
3516
XXX
XXXXXX
WNNN
8-Lead SOIC, Fixed*
Example
5239
-1.8YM
9327
XXXX
-X.XXX
WNNN
8-Lead MSOP, Adj.*
Example
8-Lead MSOP, Fixed*
Example
XXXX
YXX
5239
YMM
XXXX
-X.XY
5239
-2.5Y
3-Lead SOT-223*
XXXX
XXXXNNNP
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
5239
30YS088P
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2021 Microchip Technology Inc.
DS20006544A-page 13
MIC5239
8-Lead SOIC Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006544A-page 14
2021 Microchip Technology Inc.
MIC5239
8-Lead MSOP Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2021 Microchip Technology Inc.
DS20006544A-page 15
MIC5239
3-Lead SOT-223 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006544A-page 16
2021 Microchip Technology Inc.
MIC5239
APPENDIX A:
REVISION HISTORY
Revision A (June 2021)
• Converted Micrel document MIC5239 to Microchip data sheet DS20006544A.
• Minor text changes throughout.
2021 Microchip Technology Inc.
DS20006544A-page 17
MIC5239
NOTES:
DS20006544A-page 18
2021 Microchip Technology Inc.
MIC5239
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART No.
-X.X
X
X
-XX
Device
Output Voltage
Junction Temp.
Range
Package
Media Type
Device:
MIC5239:
Low Quiescent Current 500 mA µCap LDO
Regulator
1.5 =
1.8 =
2.5 =
3.0 =
3.3 =
5.0 =
=
1.5V
1.8V
2.5V
3.0V
3.3V
5.0V
Adjustable (Not applicable to SOT-223 option)
Junction
Temperature
Range:
Y
–40°C to +125°C
Package:
M
=
MM =
S
=
Output Voltage:
Media Type:
=
TR
=
8-Lead SOIC
8-Lead MSOP
3-Lead SOT-223
= 78/Tube (SOT-223 Only)
= 95/Tube (SOIC Only)
= 100/Tube (MSOP Only)
2,500/Reel (All package options)
2021 Microchip Technology Inc.
Examples:
a) MIC5239-5.0YMM-TR: MIC5239, 5.0V Output Voltage,
–40°C to +125°C Temperature
Range, 8-Lead MSOP,
2,500/Reel
b) MIC5239YM:
MIC5239, Adj. Output Voltage,
–40°C to +125°C Temperature
Range, 8-Lead SOIC,
95/Tube
c) MIC5239-1.8YS:
MIC5239, 1.8V Output Voltage,
–40°C to +125°C Temperature
Range, 3-Lead SOT-223,
78/Tube
d) MIC5239YMM-TR:
MIC5239, Adj. Output Voltage,
–40°C to +125°C Temperature
Range, 8-Lead MSOP,
100/Tube
e) MIC5239-3.0YM-TR:
MIC5239, 3.0V Output Voltage,
–40°C to +125°C Temperature
Range, 8-Lead SOIC,
2,500/Reel
f)
MIC5239, 2.5V Output Voltage,
–40°C to +125°C Temperature
Range, 3-Lead SOT-223,
2,500/Reel
MIC5239-2.5YS-TR:
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006544A-page 19
MIC5239
NOTES:
DS20006544A-page 20
2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
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ISBN: 978-1-5224-8316-8
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