MIC5397-GPYMT-TR

MIC5396/7/8/9 Low-Power Dual 300 mA LDO Features General Description • • • • • • • • • • • • • • The MIC5396, MIC5397, MIC5398, and MIC5399 are advanced dual LDOs ideal for powering general purpose portable devices. The MIC5396/7/8/9 provide two high performance, independent 300 mA LDOs in a single package. This makes it possible to improve system efficiency by providing two independent supply inputs that can be optimized for each individual LDO. The MIC5396/7/8/9 also feature a wide output voltage range down to 1.0V. 2.5V to 5.5V Input Voltage Range Independent Power Inputs Output Voltage Range from 1V to 3.3V Two 300 mA Outputs High Output Accuracy (±2%) Low Quiescent Current (37 µA typ. per LDO) Stable with 1 µF Ceramic Output Capacitors Low Dropout Voltage (160 mV at 300 mA) Independent Enable Pins Internal Enable Pull-Down (MIC5398, MIC5399) Output Discharge Circuit (MIC5397, MIC5399) Thermal Shutdown Protection Current Limit Protection 8-Lead 1.6 mm × 1.2 mm Extra Thin DFN Package Applications • • • • Smartphones DSC, GPS, PMP and PDAs Medical Devices Portable Electronics Its full feature set and low dropout voltage make it ideal for battery-powered applications. The MIC5396/7/8/9 offer 2% accuracy, low dropout voltage (160 mV at 300 mA), and low ground current (typically 42 µA per LDO at full load). The MIC5396/7/8/9 can also be put into a zero off mode current state, drawing virtually no current when disabled. When the MIC5397 or MIC5399 are disabled, an internal resistive load is automatically applied to the output to discharge the output capacitor. In addition, the MIC5398 and MIC5399 offer an internal enable pull-down resistor to ensure that the output is disabled when the enable is in tri-state mode. These LDOs also offer fast transient response and high PSRR while consuming a minimum operating current. The family is available in a tiny 8-lead, 1.6 mm x 1.2 mm leadless Extra Thin DFN package. Package Type MIC5396/7/8/9 UDFN 8L, X2DFN 8L (Top View)  2019-2022 Microchip Technology Inc. and its subsidiaries DS20006264C-page 1 MIC5396/7/8/9 Typical Application Schematic Functional Block Diagram DS20006264C-page 2  2019-2022 Microchip Technology Inc. and its subsidiaries MIC5396/7/8/9 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) Supply Voltage (VIN1, VIN2) .......................................................................................................................... –0.3V to +6V Enable Voltage (VEN1, VEN2) .........................................................................................................................–0.3V to VIN Power Dissipation (PD) Note 1............................................................................................................... Internally Limited ESD Rating Note 2..................................................................................................................................................... 3 kV Operating Ratings(‡) Supply Voltage (VIN1, VIN2) ....................................................................................................................... +2.5V to +5.5V Enable Voltage (VEN1, VEN2) ..............................................................................................................................0V to VIN Note 1: The maximum allowable power dissipation of any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series with 100 pF. † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN1 = VEN1 = VOUT1 + 1V, VIN2 = VEN2 = VOUT2 + 1V, IOUT1 = IOUT2 = 100 µA; CIN1 = CIN2 = COUT1 = COUT2 = 1 µF; TA = +25°C. Bold values are valid for –40°C to +125°C, unless noted. (Note 1). Parameters Output Voltage Accuracy Symbol VOUT Min. Typ. Max. –2.0 — +2.0 –3.0 — +3.0 Units % Conditions Variation from nominal VOUT Line Regulation — — 0.02 0.3 %/V VIN = VOUT +1V to 5.5V, IOUT = 100 µA Load Regulation — — 8 40 mV IOUT = 100 µA to 300 mA Dropout Voltage VDO — 80 190 — 160 380 — 37 55 — 37 55 — 74 110 VEN1 = VEN2 = High; IOUT1 = IOUT2 = 0 mA — 42 65 VEN1 = High; VEN2 = Low; IOUT1 = 300 mA — 42 65 — 84 130 Ground Pin Current Ground Pin Current Note 1: IGND IGND mV IOUT = 150 mA IOUT = 300 mA VEN1 = High; VEN2 = Low; IOUT2 = 0 mA µA µA VEN1 = Low; VEN2 = High; IOUT1 = 0 mA VEN1 = Low; VEN2 = High; IOUT2 = 300 mA VEN1 = VEN2 = High; IOUT1 = IOUT2 = 300 mA Specification for packaged product only.  2019-2022 Microchip Technology Inc. and its subsidiaries DS20006264C-page 3 MIC5396/7/8/9 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN1 = VEN1 = VOUT1 + 1V, VIN2 = VEN2 = VOUT2 + 1V, IOUT1 = IOUT2 = 100 µA; CIN1 = CIN2 = COUT1 = COUT2 = 1 µF; TA = +25°C. Bold values are valid for –40°C to +125°C, unless noted. (Note 1). Parameters Symbol Min. Typ. Max. Units Shutdown Current ISHDN — 0.05 1 µA VEN1 = VEN2 = 0V Ripple Rejection PSRR — 60 — dB f = 1 kHz; COUT = 1 µF Current Limit ILIM 400 630 900 mA VOUT = 0V Output Voltage Noise eN — 93 — RDS(ON) — 25 — Ω RPULL-DN — 4 — MΩ VEN-LOW — — 0.2 VEN-HIGH 1.2 — — — 0.01 1 — 0.01 1 — 0.01 1 — 1.4 2 — 50 125 Auto-Discharge NFET Resistance Conditions µVRMS COUT = 1µF, 10 Hz to 100 kHz MIC5397, MIC5399 Only; VEN1 = VEN2 = 0V; VIN = 3.6V; IOUT = –3 mA Enable Inputs (EN1/EN2) Enable Pull-Down Resistor Enable Input Voltage Enable Input Current MIC5396, MIC5397 IEN Enable Input Current MIC5398, MIC5399 IEN Turn-On Time tON Note 1: V µA µA µs MIC5398, MIC5399 Logic Low Logic High VEN = 0V VEN = 5.5V VEN = 0V VEN = 5.5V COUT = 1 µF Specification for packaged product only. TEMPERATURE SPECIFICATIONS Parameters Symbol Min. Typ. Max. Units Conditions Temperature Ranges Junction Temperature Range TJ –40 — +125 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — 260 °C Soldering, 10 sec. JA — 172.6 — °C/W Package Thermal Resistances Thermal Resistance, UDFN-8 Thermal Resistance, Extra Thin DFN-8 Note 1: — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006264C-page 4  2019-2022 Microchip Technology Inc. and its subsidiaries MIC5396/7/8/9 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -100 60 -90 PSRR (dB) -70 GROUND CURRENT (A) 150 mA -80 100 μA -60 -50 -40 300 mA VIN = 2.8V VOUT = 1.8V COUT = 1 μF -30 -20 -10 0 10 100 1K 10K 20 VOUT = 2.8V CIN = COUT = 1 μF 10 2.5 Power Supply Rejection 3.0 3.5 4.0 4.5 5.0 5.5 INPUT VOLTAGE (V) FIGURE 2-4: Voltage. Ground Current vs. Input 100 90 2.0 GROUND CURRENT ( A) LDO2 – 300 μA LDO2 – 100 μA 2.5 LDO1 – 100 μA 1.5 VOUT1 = 1.8V VOUT2 = 2.8V CIN = COUT = 1 μF 1.0 0.5 80 2.5 3.0 3.5 4.0 4.5 5.0 60 40 20 0 5.5 Output Voltage vs. Input 80 GROUND CURRENT (A) 90 2.8 2.7 2.6 2.5 2.4 VIN1 = VEN2 = VOUT2 + 1V VOUT2 = 2.8V CIN = COUT = 1 μF 2.1 2.0 0 FIGURE 2-3: Current. 50 100 150 200 250 0 50 100 70 Output Voltage vs. Output  2019-2022 Microchip Technology Inc. and its subsidiaries 300 250 60 DUAL OUTPUT 50 SINGLE OUTPUT 40 30 VIN = VEN = 3.8V VOUT = 2.8V CIN = COUT = 1 μF 20 0 OUTPUT CURRENT (mA) 200 Ground Current vs. Output 10 300 150 OUTPUT CURRENT (mA) FIGURE 2-5: Current. 2.9 2.2 VEN = 3.8V VIN = 3.8V VOUT = 2.8V CIN = COUT = 1 μF 30 3.0 2.3 SINGLE OUTPUT 50 10 INPUT VOLTAGE (V) FIGURE 2-2: Voltage. DUAL OUTPUT 70 0.0 OUTPUT VOLTAGE (V) 100 μA 30 1M 3.0 OUTPUT VOLTAGE (V) 40 0 100K FREQUENCY (Hz) FIGURE 2-1: Ratio. 300 mA 150 mA 50 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-6: Temperature. Ground Current vs. DS20006264C-page 5 MIC5396/7/8/9 180 10 1 140 NOISE (V/
Hz) DROPOUT VOLTAGE (mV) 160 120 100 80 60 VOUT = 2.8V CIN = COUT = 1 μF 40 20 0 0 50 100 150 200 250 0.01 VIN = VEN = 4.5V VOUT = 1.8V COUT = 1 μF 0.001 300 OUTPUT CURRENT (mA) FIGURE 2-7: Current. 0.1 Dropout Voltage vs. Output 0.0001 10 10 FIGURE 2-10: Density. 10 100 1,0 K 10K 100K 000 10M ,01M FREQUENCY (Hz) Output Noise Spectral 240 DROPOUT VOLTAGE (mV) 220 300 mA 200 180 160 140 120 150 mA 100 80 60 40 10 mA 20 0 -40 -20 VIN = 3.8V VOUT1 = 1.8V VOUT2 = 2.8V CIN = COUT = 1 μF 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 2-8: Temperature. Dropout Voltage vs. 20 μs/div FIGURE 2-11: Turn-On Time. 900 CURRENT LIMIT (mA) 850 800 LDO2 750 CIN = COUT = 1 μF IOUT = 3300 mA VOUT1 = 2.8V VOUT2 = OFF 700 650 LDO1 600 VOUT1 = 1.8V VOUT2 = 2.8V CIN = COUT = 1 μF 550 500 450 400 2.5 3.0 FIGURE 2-9: Voltage. DS20006264C-page 6 3.5 4.0 4.5 INPUT VOLTAGE (V) 5.0 100 μs/div 5.5 Current Limit vs. Input FIGURE 2-12: Line Transient VIN1.  2019-2022 Microchip Technology Inc. and its subsidiaries MIC5396/7/8/9 VIN = 3.8V VOUT1 = 1.8V VOUT2 = 2.8V CIN = COUT1 = COUT2 = 1 μF CIN = COUT = 1 μF IOUT = 300mA 300 mA VOUT1 = OFF VOUT2 = 2.8V 100 μs/div FIGURE 2-13: Line Transient VIN2. 20 μs/div FIGURE 2-16: Turn-Off Time. VIN = 3.8V VOUT1 = 2.8V VOUT2 = OFF CIN1 = COUT1 = 1 μF 40 μs/div FIGURE 2-14: Load Transient VOUT1. VIN = 3.8V VOUT1 = OFF VOUT2 = 2.8V CIN2 = COUT2 = 1 μF 40 μs/div FIGURE 2-15: Load Transient VOUT2.  2019-2022 Microchip Technology Inc. and its subsidiaries DS20006264C-page 7 MIC5396/7/8/9 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name 1, 4 GND 2 VOUT1 3 VOUT2 Description Ground. Output regulator 1. Connect a capacitor to ground. Output regulator 2. Connect a capacitor to ground. 5 EN2 Enable input for regulator 2: Active-high input. Logic high = On; Logic low = Off. MIC5396/7 Do not leave floating. MIC5398/9 internal pull-down resistor, tri-state = Off. 6 VIN2 Input voltage supply for regulator 2. Connect a capacitor to ground. 7 VIN1 Input voltage supply for regulator 1. Connect a capacitor to ground. 8 EN1 Enable input for regulator 1: Active-high input. Logic high = On; Logic low = Off. MIC5396/7 Do not leave floating. MIC5398/9 internal pull-down resistor, tri-state = Off. EP ePad Exposed heat sink pad. Connect to ground. DS20006264C-page 8  2019-2022 Microchip Technology Inc. and its subsidiaries MIC5396/7/8/9 4.0 APPLICATION INFORMATION MIC5396/7/8/9 are dual 300 mA LDOs in a tiny 8-lead 1.2 mm x 1.6 mm Extra Thin DFN package. The MIC5397 and MIC5399 include an auto-discharge circuit for each LDO output, which is activated when the output is disabled. The MIC5398 and MIC5399 have an internal pull-down resistor on the enable pin to ensure that the output is disabled if the control signal is tri-stated. The MIC5396/7/8/9 regulators are fully protected from damage due to fault conditions using linear current limiting and thermal shutdown. These devices are not suitable for RF transmitter systems. 4.1 Input Capacitor 4.4 Enable/Shutdown The MIC5396/7/8/9 come with two active-high enable pins that allow each regulator to be disabled independently. Forcing the enable pin low disables the regulator and sends it into an off mode current state drawing virtually zero current. When disabled, the MIC5397 and MIC5399 switch an internal 25Ω load on the regulator output to discharge the external capacitor. Forcing the enable pin high enables the output voltage. The MIC5396 and MIC5397 active-high enable pin uses CMOS technology and cannot be left floating. A floating enable pin may cause an indeterminate state on the output. The MIC5398 and MIC5399 have an internal pull-down resistor on the enable pin to disable the output when the enable pin is floating. The MIC5396/7/8/9 are high-performance, high-bandwidth devices. An input capacitor of 1 µF capacitor is required from the input to ground to provide stability. Low-ESR ceramic capacitors provide optimal performance at a minimum of space. Additional high-frequency capacitors, such as small valued NPO dielectric type capacitors, help filter out high-frequency noise and are good practice in any RF-based circuit. X5R or X7R dielectrics are recommended for the input capacitor. Y5V dielectrics lose most of their capacitance over temperature and are therefore, not recommended. The MIC5396/7/8/9 are designed to provide two 300 mA continuous current outputs in a very small package. Maximum operating temperature can be calculated based on the output currents and the voltage drop across the part. For example, if the input voltage is 3.6V, VOUT1 = 3.3V, VOUT2 = 2.8V, each with an output current of 300 mA. The actual power dissipation of the regulator circuit can be determined using Equation 4-1: 4.2 EQUATION 4-1: Output Capacitor The MIC5396/7/8/9 require an output capacitor of 1 µF or greater to maintain stability. The design is optimized for use with low-ESR ceramic chip capacitors. High-ESR capacitors may cause high frequency oscillation. The output capacitor can be increased, but performance has been optimized for a 1 µF ceramic output capacitor and does not improve significantly with larger capacitance. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic capacitor to ensure the same minimum capacitance over the equivalent operating temperature range. 4.3 No-Load Stability 4.5 Thermal Considerations P D =  V IN – V OUT1 I OUT1 +  V IN – V OUT2 I OUT2 + V IN  I GND Because this device is CMOS and the ground current is typically