MIC5801BVTR

MIC5800/1 4/8-Bit Parallel-Input Latched Drivers Features General Description • • • • The MIC5800 and MIC5801 latched drivers are high-voltage, high-current integrated circuits comprised of four or eight CMOS data latches, a bipolar Darlington transistor driver for each latch, and CMOS control circuitry for the common CLEAR, STROBE, and OUTPUT ENABLE functions. 4.4 MHz Minimum Data Input Rate High-Voltage, High-Current Sink Outputs Output Transient Protection CMOS, PMOS, NMOS, and TTL Compatible Inputs • Internal Pull-Down Resistors • Low-Power CMOS Latches The bipolar/MOS combination provides an extremely low-power latch with maximum interface flexibility. MIC5800 contains four latched drivers; MIC5801 contains eight latched drivers. Data input rates are greatly improved in these devices. With a 5V supply, they will typically operate at better than 5 MHz. With a 12V supply, significantly higher speeds are obtained. The CMOS inputs are compatible with standard CMOS, PMOS, and NMOS circuits. TTL or DTL circuits may require the use of appropriate pull-up resistors. The bipolar outputs are suitable for use with relays, solenoids, stepping motors, LED or incandescent displays, and other high-power loads. Both units have open-collector outputs and integral diodes for inductive load transient suppression. The output transistors are capable of sinking 500 mA and will sustain at least 50V in the OFF state. Because of limitations on package power dissipation, the simultaneous operation of all drivers at maximum rated current can only be accomplished by a reduction in duty cycle. Outputs may be connected in parallel for higher load current capability. Package Types NC 24 VDD 23 NC STROBE 3 22 OUT1 4 3 2 1 28 27 26 NC OE 1 CLEAR 2 OE OE VDD 14 CLEAR 1 STROBE CLEAR MIC5801YV 28-Lead PLCC (V) (Top View) NC MIC5801YWM 24-Lead SOIC (WM) (Top View) MIC5800YM 14-Lead SOIC (M) (Top View) VDD IN1 3 12 OUT1 IN1 4 21 OUT2 IN1 5 25 OUT1 IN2 4 11 OUT2 IN2 5 20 OUT3 IN2 6 24 OUT2 IN3 5 10 OUT3 IN3 6 19 OUT4 COM IN5 8 17 OUT6 IN6 10 20 OUT6 IN6 9 16 OUT7 IN7 11 19 OUT7 IN7 10 15 OUT8 12 13 14 15 16 17 18 IN8 11 14 NC GND 12  2019 - 2022 Microchip Technology Inc. 21 OUT5 OUT8 8 IN5 9 COM 7 18 OUT5 NC GND 22 OUT4 IN4 7 GND OUT4 23 OUT3 NC 9 IN4 8 IN8 6 IN3 7 NC IN4 LATCHES 13 LATCHES 2 STROBE 13 COM DS20006184B-page 1 MIC5800/1 Typical Application Circuit +30V OUTPUT ENABLE 0.1μF STROBE IN1 μP IN2 IN3 IN4 1 14 2 13 3 12 VDD OUT1 4 5 LATCHES CLEAR OUT2 11 OUT3 STEPPER MOTOR 10 OUT4 6 9 7 8 0.1μF +30V Functional Block Diagram VDD INn COMMON OUTn STROBE GND CLEAR OUT P U T ENABLE DS20006184B-page 2 COMMON MOS CONTROL TYPICAL MOS LATCH TYPICAL BIPOLAR DRIVER  2019 - 2022 Microchip Technology Inc. MIC5800/1 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Output Voltage (VCE) ................................................................................................................................................+50V Supply Voltage (VDD) ................................................................................................................................................+15V Input Voltage Range (VIN).................................................................................................................–0.3V to VDD + 0.3V Continuous Collector Current (IC) .........................................................................................................................500 mA ESD Rating (Note 1) .................................................................................................................................. ESD Sensitive Operating Ratings †† Package Power Dissipation (PD) MIC5800 SOIC..........................................................................................................................................................1.0W Derate above TA = +25°C ................................................................................................................................8.5 mW/°C MIC5801 PLCC .......................................................................................................................................................2.25W Derate above TA = +25°C ..............................................................................................................................18.2 mW/°C MIC5801 Wide SOIC ................................................................................................................................................1.4W Derate above TA = +25°C ................................................................................................................................. 11 mW/°C † Notice: Exceeding the absolute maximum ratings may damage the device. †† Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Microchip CMOS devices have input-static protection, but are susceptible to damage when exposed to extremely high static electrical charges. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1 Parameter Output Leakage Current Sym. ICEX Collector-Emitter Saturation Voltage VCE(SAT) Input Voltage (Low) VIN(0) Input Voltage (High) Input Resistance VIN(1) RIN Supply Current ON (Each Stage) IDD(ON) Supply Current OFF (Total) IDD(OFF) Note 1: 2: Min. Typ. Max. Units — — 50 — — 100 — 0.9 1.1 — 1.1 1.3 — 1.3 1.6 — — 1.0 10.5 — — 8.5 — — 3.5 — — VDD = 5V, Note 2 50 200 — VDD = 12V 50 300 — 50 600 — VDD = 5V — 1.0 2.0 VDD = 12V, Outputs Open — 0.9 1.7 — 0.7 1.0 — — 200 — 50 100 µA Conditions VCE = 50V, TA = +25°C VCE = 50V, TA = +70°C IC = 100 mA V IC = 200 mA IC = 350 mA, VDD = 7.0V V — VDD = 12V V kΩ mA VDD = 10V VDD = 10V VDD = 10V, Outputs Open VDD = 5V, Outputs Open µA VDD = 12V, Outputs Open, Inputs = 0V VDD = 5V, Outputs Open, Inputs = 0V Specification for packaged product only. Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors to ensure a minimum logic “1”.  2019 - 2022 Microchip Technology Inc. DS20006184B-page 3 MIC5800/1 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1 Parameter Sym. Clamp Diode Leakage Current IR Clamp Diode Forward Voltage VF Note 1: 2: Min. Typ. Max. — — 50 — — 100 — 1.7 2.0 Units µA V Conditions VR = 50V, TA = +25°C VR = 50V, TA = +70°C IF = 350 mA Specification for packaged product only. Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors to ensure a minimum logic “1”. TRUTH TABLE INN Strobe Clear /OE 0 1 0 OUTN t–1 t 0 X OFF 1 1 0 0 X ON X X 1 X X OFF X X X 1 X OFF X 0 0 0 ON ON X 0 0 0 OFF OFF Legend: X = Irrelevant; t – 1 = Previous output state; t = Present output state. Information present at an input is transferred to its latch when the STROBE is high. A high CLEAR input will set all latches to the output OFF condition regardless of the data or STROBE input levels. A high /OE will set all outputs to the off condition, regardless of any other input conditions. When the /OE is low, the outputs depend on the state of their respective latches. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Storage Temperature Range TS –65 — +125 °C — Operating Temperature Range TA –40 — +85 °C — Temperature Ranges Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006184B-page 4  2019 - 2022 Microchip Technology Inc. MIC5800/1 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1 and Table 2-2. TABLE 2-1: MIC5800 PIN FUNCTION TABLE Pin Number Pin Name 1 CLEAR 2 STROBE 3, 4, 5, 6 INN Description Resets all latches and turns all outputs OFF (open). Input strobe pin. Loads output latches when high. Parallel inputs, 1 through 4. 7 GND Logic and Output Ground pin. 8 COM Transient suppression diode common cathode pin. 9, 10, 11, 12 OUTN Parallel outputs, 4 through 1. 13 VDD Logic Supply Voltage. 14 /OE Output Enable. When low, outputs are active. When high, outputs are inactive and device is reset from a fault condition. An undervoltage condition emulates a high OE input. TABLE 2-2: MIC5801 PIN FUNCTION TABLE Pin Number SOIC Pin Number PLCC Pin Name Description 1 28 /OE Output Enable. When low, outputs are active. When high, outputs are inactive and device is reset from a fault condition. An undervoltage condition emulates a high OE input. 2 1 CLEAR Resets all latches and turns all outputs OFF (open). 3 3 STROBE 4, 5, 6, 7, 8, 9, 10, 11 5, 6, 7, 8, 9, 10, 11, 12 Input strobe pin. Loads output latches when high. INN 12 15 GND Logic and Output Ground pin. 13 17 COM Transient suppression diode common cathode pin. 14, 23 2, 4, 13, 14, 16, 26 NC 15, 16, 17, 18, 19, 20, 21, 22 18, 19, 20, 21, 22, 23, 24, 25 OUTN Parallel outputs, 8 through 1. 24 27 VDD Logic Supply Voltage. Parallel inputs, 1 through 8. No Connection. Leave floating. VDD IN FIGURE 2-1: Typical Input.  2019 - 2022 Microchip Technology Inc. DS20006184B-page 5 MIC5800/1 3.0 TIMING CLEAR F STROBE C A OUTPUT ENABLE INN C B B C A G B G D E E OUTN FIGURE 3-1: TABLE 3-1: Timing Diagram. TIMING CONDITIONS Characteristics: TA = +25°C; Logic levels are VDD and Ground; VDD = 5V. Condition A. Minimum data active time before strobe enabled (data set-up time) Min. Typ. Max. 50 ns — — B. Minimum data active time after strobe disabled (data hold time) 50 ns — — C. Minimum strobe pulse width 125 ns — — D. Typical time between strobe activation and output on to off transition — 500 ns — E. Typical time between strobe activation and output off to on transition — 500 ns — F. Minimum clear pulse width 300 ns — — G. Minimum data pulse width 225 ns — — DS20006184B-page 6  2019 - 2022 Microchip Technology Inc. MIC5800/1 4.0 TYPICAL APPLICATIONS +30V OUTPUT ENABLE 0.1μF STROBE IN1 μP IN2 IN3 IN4 1 14 2 13 3 12 VDD OUT1 4 5 LATCHES CLEAR OUT2 11 OUT3 STEPPER MOTOR 10 OUT4 6 9 7 8 0.1μF +30V FIGURE 4-1: MIC5800 Unipolar Stepper-Motor Drive. STROBE STROBE IN1 IN1 IN2 IN2 IN3 IN3 IN4 IN4 OUT1 OUT1 OUT2 OUT2 OUT3 OUT3 OUT4 OUT4 FIGURE 4-2: Unipolar Wave Drive.  2019 - 2022 Microchip Technology Inc. FIGURE 4-3: Unipolar 2-Phase Drive. DS20006184B-page 7 MIC5800/1 +12V +5V 0.1μF 22μF + 1 24 2 23 STROBE 3 22 INPUT 1 4 21 INPUT 2 5 20 INPUT 3 6 INPUT 4 7 INPUT 5 8 17 INPUT 6 9 16 INPUT 7 10 15 11 14 12 13 CLEAR K1 K2 K3 LATCHES K4 19 K5 18 K6 K7 K8 INPUT 8 Relays: Guardian Electric 1725-1C-12D FIGURE 4-4: MIC5801 Relay Driver. +5V 0.1μF 14 2 13 INPUT 1 3 12 INPUT 2 4 INPUT 3 5 INPUT 4 6 9 7 8 LATCHES 1 +24V 22μF + 11 10 Note: Lamp inrush current is approximately 10× lamp operating current. FIGURE 4-5: DS20006184B-page 8 MIC5800 Incandescent/Halogen Lamp Driver.  2019 - 2022 Microchip Technology Inc. MIC5800/1 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 14-Lead SOIC* Example XXXXXX XXXXXXXXX WNNN MICREL MIC5800YM 2923 24-Lead SOICW* 28-Lead PLCC* Example XXXXXX XXXXXXXXX WNNN MICREL MIC5801YV 3122 Example XXXXXX XXXXXXXXXX WNNN MICREL MIC5801YWM 4624 Legend: XX...X Y YY WW NNN e3 * 14-Lead PDIP* XXXXXX XXXXXXXXX WNNN Example MICREL MIC5801YN 1622 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N  2019 - 2022 Microchip Technology Inc. DS20006184B-page 9 MIC5800/1 14-Lead Plastic Small Outline SOIC Package Outline and Recommended Land Pattern 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A NOTE 5 D N E 2 E2 2 E1 E 2X 0.10 C D NOTE 1 1 2 2X N/2 TIPS 0.20 C 3 e NX b B 0.25 NOTE 5 C A–B D TOP VIEW 0.10 C C A A2 SEATING PLANE 14X h 0.10 C SIDE VIEW A1 h R0.13 H R0.13 c SEE VIEW C L VIEW A–A (L1) VIEW C Microchip Technology Drawing No. C04-065-D3X Rev D DS20006184B-page 10  2019 - 2022 Microchip Technology Inc. MIC5800/1 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L Footprint L1 Lead Angle Foot Angle c Lead Thickness Lead Width b Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0° 0° 0.10 0.31 5° 5° MILLIMETERS NOM 14 1.27 BSC 6.00 BSC 3.90 BSC 8.65 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8° 0.25 0.51 15° 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimension D does not include mold flash, protrusions or gate burrs, which shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion, which shall not exceed 0.25 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2  2019 - 2022 Microchip Technology Inc. DS20006184B-page 11 MIC5800/1 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 14 SILK SCREEN C Y 1 2 X E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (X14) X Contact Pad Length (X14) Y MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2065-D3X Rev D DS20006184B-page 12  2019 - 2022 Microchip Technology Inc. MIC5800/1 14-Lead PDIP Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2019 - 2022 Microchip Technology Inc. DS20006184B-page 13 MIC5800/1 28-Lead PLCC Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006184B-page 14  2019 - 2022 Microchip Technology Inc. MIC5800/1 24-Lead SOICW Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2019 - 2022 Microchip Technology Inc. DS20006184B-page 15 MIC5800/1 NOTES: DS20006184B-page 16  2019 - 2022 Microchip Technology Inc. MIC5800/1 APPENDIX A: REVISION HISTORY Revision A (April 2019) • Converted Micrel document MIC5800/1 to Microchip data sheet template DS20006184A. • Minor grammatical text changes throughout. Revision B (February 2022) • Corrected the device marking specification in section 5.1 “Package Marking Information”.  2019 - 2022 Microchip Technology Inc. DS20006184B-page 17 MIC5800/1 NOTES: DS20006184B-page 18  2019 - 2022 Microchip Technology Inc. MIC5800/1 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Device X XX -XX Part No. Junction Temp. Range Package Media Type MIC5800: Device: MIC5801: 4-Bit Parallel-Input, High-Voltage, HighCurrent Latched Driver 8-Bit Parallel-Input, High-Voltage, HighCurrent Latched Driver Examples: a) MIC5800YM: MIC5800, –40°C to +85°C Temperature Range, 14-Lead SOIC, 54/Tube b) MIC5800YM-TR: MIC5800, –40°C to +85°C Temperature Range, 14-Lead SOIC, 2,500/Reel c) MIC5800YN: MIC5800, –40°C to +85°C Temperature Range, 14-Lead PDIP, 25/Tube Junction Temperature Range: Y = –40°C to +85°C, Industrial d) MIC5801YV: MIC5801, –40°C to +85°C Temperature Range, 28-Lead PLCC, 38/Tube M N V WM = = = = 14-Lead SOIC (MIC5800) 14-Lead PDIP (MIC5800) 28-Lead PLCC (MIC5801) 24-Lead Wide SOIC (MIC5801) e) MIC5801YV-TR: Package: MIC5801, –40°C to +85°C Temperature Range, 28-Lead PLCC, 750/Reel f) MIC5801YWM: MIC5801, –40°C to +85°C Temperature Range, 24-Lead Wide SOIC, 31/Tube g) MIC5801YWM-TR: MIC5801, –40°C to +85°C Temperature Range, 24-Lead Wide SOIC, 1,000/Reel Media Type: = = = = TR = TR = TR = 54/Tube (M, MIC5800) 25/Tube (N, MIC5800) 38/Tube (V, MIC5801) 31/Tube (WM, MIC5801) 750/Reel (V, MIC5801) 1,000/Reel (WM, MIC5801) 2,500/Reel (M, MIC5800)  2019 - 2022 Microchip Technology Inc. Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006184B-page 19 MIC5800/1 NOTES: DS20006184B-page 20  2019 - 2022 Microchip Technology Inc. Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. 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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 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