MIC863
Dual Ultra-Low Power Op Amp in SOT-23-8
Features
General Description
•
•
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•
•
•
The MIC863 is a dual low-power operational amplifier
in a SOT-23-8 package. It is designed to operate in the
2V to 5V range, rail-to-rail output, with input
common-mode to ground. The MIC863 provides
450 kHz gain-bandwidth product while consuming only
a 4.2 μA supply current
8-Pin SOT-23 Package
450 kHz Gain-Bandwidth Product
800 kHz, –3 dB Bandwidth
4.2 μA Supply Current/Channel
Rail-to-Rail Output
Ground Sensing at Input
(Common-Mode-to-GND)
• Drives Large Capacitive Loads (0.02 μF)
• Unity Gain Stable
Applications
•
•
•
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Portable Equipment
Medical Instrument
PDAs
Pagers
Cordless Phones
Consumer Electronics
With low supply voltage and 8-pin SOT-23 packaging,
MIC863 provides two channels as general-purpose
amplifiers
for
portable
and
battery-powered
applications. Its package provides the maximum
performance available while maintaining an extremely
slim form factor. The minimal power consumption of
this IC maximizes the battery life potential.
Package Type
MIC863
8-Lead SOT-23 (M8)
OUTA 1
2020 Microchip Technology Inc.
8 V+
INA– 2
7 OUTB
INA+ 3
6 INB–
V– 4
5 INB+
DS20006308A-page 1
MIC863
Typical Application Schematic
Peak Detector Circuit
V+
0.1μF
10μF
510
½ MIC863
VOUT
½ MIC863
RF
50
DS20006308A-page 2
100pF
2020 Microchip Technology Inc.
MIC863
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VV+ – VV–)..................................................................................................................................... +6.0V
Differential Input Voltage (|VIN+ – VIN–|) (Note 1) .................................................................................................... +6.0V
Input Voltage (VIN+ – VIN–) ........................................................................................................... VV+ + 0.3V, VV– – 0.3V
Output Short-Circuit Current Duration................................................................................................................ Indefinite
ESD Rating (Note 2) .................................................................................................................................. ESD Sensitive
Operating Ratings ‡
Supply Voltage ........................................................................................................................................ +2.0V to +5.25V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside the operating ratings.
Note 1: Exceeding the maximum differential input voltage will damage the input stage and degrade performance (in
particular, input bias current is likely to increase).
2: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2020 Microchip Technology Inc.
DS20006308A-page 3
MIC863
ELECTRICAL CHARACTERISTICS (2.0V)
Electrical Characteristics: V+ = +2V, V– = 0V, VCM = V+/2; RL = 500 kΩ to V+/2; TA = 25°C, unless otherwise
noted.
Parameters
Symbol
Input Offset Voltage
Differential Offset
Voltage
VOS
Min.
Typ.
Max.
Units
–5
0.1
5
–6
0.1
6
—
0.5
—
mV
—
mV
Conditions
—
–40°C ≤ TA ≤ +85°C
Input Offset Voltage
Temperature
Coefficient
ΔVOS/
ΔTA
—
6
—
μV/°C
—
Input Bias Current
IB
—
10
—
pA
—
Input Offset Current
IOS
—
5
—
pA
—
Input Voltage
Range
VCM
0.5
1
—
V
CMRR > 50 dB, –40°C ≤ TA ≤
+85°C
Common-Mode
Rejection Ratio
CMRR
45
75
—
dB
0V < VCM < 1V, –40°C ≤ TA ≤
+85°C
Power Supply
Rejection Ratio
PSRR
50
85
—
dB
Supply voltage change of 2V to
2.7V, –40°C ≤ TA ≤ +85°C
66
81
—
73
90
—
V+ – 3 mV
V+ –
1.4 mV
—
—
V– +
0.5 mV
V– + 3 mV
GBWP
—
320
—
kHz
RL = 200 kΩ, CL = 2 pF, AV = 11
Phase Margin
PM
—
69
—
°
RL = 200 kΩ, CL = 2 pF, AV = 11
–3 dB Bandwidth
BW
—
600
—
kHz
AV = 1, CL = 2 pF, RL = 1 MΩ
Slew Rate
SR
—
0.33
—
V/μs
AV = 1, CL = 2 pF, RL = 1 MΩ,
Positive Slew Rate = 0.17 V/μs
Short-Circuit Output
Current
ISC
1.8
2.6
—
1.5
2.2
—
Supply Current (per
Op Amp)
IS
—
3.5
7
μA
No Load, –40°C ≤ TA ≤ +85°C
Channel-toChannel Crosstalk
—
—
–100
—
dB
Note 1
Large-Signal
Voltage Gain
Maximum Output
Voltage Swing
Minimum Output
Voltage Swing
Gain-Bandwidth
Product
Note 1:
AVOL
dB
VOUT
V
mA
RL = 100 kΩ, VOUT = 1.4 VPP,
–40°C ≤ TA ≤ +85°C
RL = 500 kΩ, VOUT = 1.4 VPP,
–40°C ≤ TA ≤ +85°C
RL = 500 kΩ, –40°C ≤ TA ≤ +85°C
Source, –40°C ≤ TA ≤ +85°C
Sink, –40°C ≤ TA ≤ +85°C
DC signal referenced to input. Refer to the AC Performance Characteristics section.
DS20006308A-page 4
2020 Microchip Technology Inc.
MIC863
ELECTRICAL CHARACTERISTICS (2.7V)
Electrical Characteristics: V+ = +2.7V, V– = 0V, VCM = V+/2; RL = 500 kΩ to V+/2; TA = 25°C, unless otherwise
noted.
Parameters
Symbol
Input Offset Voltage
Differential Offset
Voltage
VOS
Min.
Typ.
Max.
Units
–5
0.1
5
–6
0.1
6
—
0.5
—
mV
—
mV
Conditions
—
–40°C ≤ TA ≤ +85°C
Input Offset Voltage
Temperature
Coefficient
ΔVOS/
ΔTA
—
6
—
μV/°C
—
Input Bias Current
IB
—
10
—
pA
—
Input Offset Current
IOS
—
5
—
pA
—
Input Voltage
Range
VCM
1
1.8
—
V
CMRR > 60 dB, –40°C ≤ TA ≤
+85°C
Common-Mode
Rejection Ratio
CMRR
60
83
—
dB
0V < VCM < 1.35V, –40°C ≤ TA ≤
+85°C
Power Supply
Rejection Ratio
PSRR
55
85
—
dB
Supply voltage change of 2.7V to
3V, –40°C ≤ TA ≤ +85°C
70
83
—
78
91
—
GBWP
—
350
—
Phase Margin
PM
—
65
—
°
–3 dB Bandwidth
BW
—
600
—
kHz
AV = 1, CL = 2 pF, RL = 1 MΩ
Slew Rate
SR
—
0.35
—
V/μs
AV = 1, CL = 2 pF, RL = 1 MΩ,
Positive Slew Rate = 0.17 V/μs
Short-Circuit Output
Current
ISC
4.5
6.3
—
4.5
6.2
—
Supply Current (per
Op Amp)
IS
—
3.6
7
μA
No Load, –40°C ≤ TA ≤ +85°C
Channel-toChannel Crosstalk
—
—
–120
—
dB
Note 1
Large-Signal
Voltage Gain
Gain-Bandwidth
Product
Note 1:
AVOL
dB
kHz
mA
RL = 100 kΩ, VOUT = 2 VPP,
–40°C ≤ TA ≤ +85°C
RL = 500 kΩ, VOUT = 2 VPP,
–40°C ≤ TA ≤ +85°C
RL = 200 kΩ, CL = 2 pF, AV = 11
RL = 200 kΩ, CL = 2 pF, AV = 11
Source, –40°C ≤ TA ≤ +85°C
Sink, –40°C ≤ TA ≤ +85°C
DC signal referenced to input. Refer to the AC Performance Characteristics section.
2020 Microchip Technology Inc.
DS20006308A-page 5
MIC863
ELECTRICAL CHARACTERISTICS (5.0V)
Electrical Characteristics: V+ = +5V, V– = 0V, VCM = V+/2; RL = 500 kΩ to V+/2; TA = 25°C, unless otherwise
noted.
Parameters
Symbol
Input Offset Voltage
Differential Offset
Voltage
VOS
Min.
Typ.
Max.
Units
–5
0.1
5
–6
0.1
6
—
0.5
—
mV
—
mV
Conditions
—
–40°C ≤ TA ≤ +85°C
Input Offset Voltage
Temperature
Coefficient
ΔVOS/
ΔTA
—
6
—
μV/°C
—
Input Bias Current
IB
—
10
—
pA
—
IOS
—
5
—
pA
—
Input Offset Current
VCM
3.5
4.1
—
V
CMRR > 60 dB, –40°C ≤ TA ≤
+85°C
Common-Mode
Rejection Ratio
CMRR
60
85
—
dB
0V < VCM < 3.5V, –40°C ≤ TA ≤
+85°C
Power Supply
Rejection Ratio
PSRR
60
86
—
dB
Supply voltage change of
3V to 5V, –40°C ≤ TA ≤ +85°C
73
81
—
78
88
—
V+ – 3 mV
V+ –
1.3 mV
—
—
V– +
0.7 mV
V– + 3 mV
GBWP
—
450
—
kHz
Phase Margin
PM
—
63
—
°
–3 dB Bandwidth
BW
—
800
—
kHz
AV = 1, CL = 2 pF, RL = 1 MΩ
V/μs
AV = 1, CL = 2 pF, RL = 1 MΩ,
Positive Slew Rate = 0.2 V/μs
Input Voltage
Range
Large-Signal
Voltage Range
Maximum Output
Voltage Swing
Minimum Output
Voltage Swing
Gain-Bandwidth
Product
AVOL
VOUT
Slew Rate
SR
Short-Circuit Output
Current
ISC
Supply Current (per
Op Amp)
Channel-toChannel Crosstalk
Note 1:
dB
V
RL = 100 kΩ, VOUT = 4.0 VPP,
–40°C ≤ TA ≤ +85°C
RL = 500 kΩ, VOUT = 4.0 VPP,
–40°C ≤ TA ≤ +85°C
RL = 500 kΩ, –40°C ≤ TA ≤ +85°C
RL = 200 kΩ, CL = 2 pF, AV = 11
—
—
0.35
—
17
23
—
18
27
—
IS
—
4.2
8
μA
No Load, –40°C ≤ TA ≤ +85°C
—
—
–120
—
dB
Note 1
mA
Source, –40°C ≤ TA ≤ +85°C
Sink, –40°C ≤ TA ≤ +85°C
DC signal referenced to input. Refer to the AC Performance Characteristics section.
DS20006308A-page 6
2020 Microchip Technology Inc.
MIC863
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Ambient Temperature Range
TA
–40
—
+85
°C
Storage Temperature Range
TS
—
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
JA
—
100
—
°C/W
Using 4-Layer PCB
CA
—
70
—
°C/W
Using 4-Layer PCB
Temperature Ranges
—
Package Thermal Resistance
Thermal Resistance SOT-23-8
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.
2020 Microchip Technology Inc.
DS20006308A-page 7
MIC863
2.0
Note:
2.1
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
DC Performance Characteristics
FIGURE 2-1:
Voltage.
FIGURE 2-4:
Supply Voltage.
Short-Circuit Current vs.
FIGURE 2-2:
Offset Voltage vs.
Common-Mode Voltage.
FIGURE 2-5:
Supply Voltage.
Short-Circuit Current vs.
FIGURE 2-3:
Offset Voltage vs.
Common-Mode Voltage.
FIGURE 2-6:
Current.
Output Voltage vs. Output
DS20006308A-page 8
Supply Current vs. Supply
2020 Microchip Technology Inc.
MIC863
FIGURE 2-7:
Current.
Output Voltage vs. Output
FIGURE 2-10:
Temperature.
Short-Circuit Current vs.
FIGURE 2-8:
Current.
Output Voltage vs. Output
FIGURE 2-11:
Temperature.
Short-Circuit Current. vs.
FIGURE 2-9:
Current.
Output Voltage vs. Output
FIGURE 2-12:
vs. Temperature.
Supply Current per Channel
2020 Microchip Technology Inc.
DS20006308A-page 9
MIC863
FIGURE 2-13:
Temperature.
2.2
Offset Voltage vs.
FIGURE 2-16:
Margin.
Gain Bandwidth and Phase
AC Performance Characteristics
FIGURE 2-14:
Margin.
Gain Bandwidth and Phase
FIGURE 2-17:
Response.
Gain Bandwidth Frequency
FIGURE 2-15:
Margin.
Gain Bandwidth and Phase
FIGURE 2-18:
Response.
Gain Bandwidth Frequency
DS20006308A-page 10
2020 Microchip Technology Inc.
MIC863
FIGURE 2-19:
Response.
Unity Gain Frequency
FIGURE 2-22:
Closed Loop Unity Gain
Frequency Response.
FIGURE 2-20:
Response.
Unity Gain Frequency
FIGURE 2-23:
Closed Loop Unity Gain
Frequency Response.
FIGURE 2-21:
Response.
Unity Gain Frequency
FIGURE 2-24:
Gain Bandwidth and Phase
Margin vs. Capacitive Load.
2020 Microchip Technology Inc.
DS20006308A-page 11
MIC863
FIGURE 2-25:
Gain Bandwidth and Phase
Margin vs. Capacitive Load.
FIGURE 2-28:
vs. Frequency.
MIC863 Input Voltage Noise
FIGURE 2-26:
PSRR vs. Frequency.
FIGURE 2-29:
vs. Frequency.
MIC863 Input Voltage Noise
FIGURE 2-27:
PSRR vs. Frequency.
FIGURE 2-30:
Crosstalk.
Channel-to-Channel
DS20006308A-page 12
2020 Microchip Technology Inc.
AV = 1
V+ = +2.5V
V- = -2.5V
CL = 2pF
RL = 1M
OUTPUT
50mV/div
INPUT
50mV/div
MIC863
TIME 10μs/div
Test Circuit A.
FIGURE 2-34:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
AV = 1
V+ = +1.35V
V- = -1.35V
CL = 50pF
RL = 1M
OUTPUT
50mV/div
INPUT
50mV/div
FIGURE 2-31:
TIME 10μs/div
AV = 1
V+ = +2.5V
V- = -2.5V
CL = 50pF
RL = 1M
OUTPUT
50mV/div
AV = 1
V+ = +1.35V
V- = -1.35V
CL = 2pF
RL = 1M
FIGURE 2-35:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 50 pF).
INPUT
50mV/div
Test Circuit B.
OUTPUT
50mV/div
INPUT
50mV/div
FIGURE 2-32:
TIME 10μs/div
FIGURE 2-33:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
2020 Microchip Technology Inc.
TIME 10μs/div
FIGURE 2-36:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 50 pF).
DS20006308A-page 13
INPUT
50mV/div
TIME 10μs/div
TIME 10μs/div
INPUT
50mV/div
FIGURE 2-40:
Small Signal Pulse
Response (Test Circuit B: AV = –1, CL = 2 pF).
AV = -1
V+ = +2.5V
V- = -2.5V
CL = 2pF
RF = 20k
RL = 1M
OUTPUT
50mV/div
AV = 1
V+ = +2.5V
V- = -2.5V
CL = 100pF
RL = 1M
OUTPUT
50mV/div
INPUT
50mV/div
FIGURE 2-37:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 100 pF).
TIME 10μs/div
OUTPUT
50mV/div
TIME 10μs/div
FIGURE 2-39:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
DS20006308A-page 14
FIGURE 2-41:
Small Signal Pulse
Response (Test Circuit B: AV = –1, CL = 2 pF).
AV = -1
V+ = +1.35V
V- = -1.35V
CL = 50pF
RF = 20k
RL = 1M
OUTPUT
50mV/div
AV = 1
V+ = +1.5V
V- = -0.5V
CL = 2pF
RL = 1M
TIME 10μs/div
INPUT
50mV/div
FIGURE 2-38:
Small Signal Pulse
Response (Test Circuit A: AV = 1, CL = 100 pF).
INPUT
50mV/div
AV = -1
V+ = +1.35V
V- = -1.35V
CL = 2pF
RF = 20k
RL = 1M
OUTPUT
50mV/div
AV = 1
V+ = +1.35V
V- = -1.35V
CL = 100pF
RL = 1M
OUTPUT
50mV/div
INPUT
50mV/div
MIC863
TIME 10μs/div
FIGURE 2-42:
Small Signal Pulse
Response (Test Circuit B: AV = –1, CL = 50 pF).
2020 Microchip Technology Inc.
AV = -1
V+ = +2.5V
V- = -2.5V
CL = 50pF
RF = 20k
RL = 1M
OUTPUT
50mV/div
OUTPUT
1V/div
INPUT
50mV/div
MIC863
TIME 10μs/div
AV = -1
V+ = +1.5V
V- = -0.5V
CL = 2pF
RL = 1M
POSITIVE SLEW RATE = 0.17V/μs
NEGATIVE SLEW RATE = 0.33V/μs
TIME 10μs/div
FIGURE 2-46:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
OUTPUT
500mV/div
OUTPUT
200mV/div
FIGURE 2-43:
Small Signal Pulse
Response (Test Circuit B: AV = –1, CL = 50 pF).
TIME 10μs/div
AV = 1
V+ = 1.35V
V- = -1.35V
CL = 2pF
RL = 1M
POSITIVE SLEW RATE = 0.17V/μs
NEGATIVE SLEW RATE = 0.354V/μs
TIME 10μs/div
FIGURE 2-45:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
2020 Microchip Technology Inc.
AV = 1
V+ = 1.35V
V- = -1.35V
CL = 50pF
RL = 1M
POSITIVE SLEW RATE = 0.117V/μs
NEGATIVE SLEW RATE = 0.34V/μs
TIME 10μs/div
FIGURE 2-47:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 50 pF).
OUTPUT
1V/div
OUTPUT
500mV/div
FIGURE 2-44:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 2 pF).
AV = 1
V+ = 2.5V
V- = -2.5V
CL = 2pF
RL = 1M
POSITIVE SLEW RATE = 0.197V/μs
NEGATIVE SLEW RATE = 0.359V/μs
AV = 1
V+ = 2.5V
V- = -2.5V
CL = 50pF
RL = 1M
POSITIVE SLEW RATE = 0.20V/μs
NEGATIVE SLEW RATE = 0.355V/μs
TIME 10μs/div
FIGURE 2-48:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 50 pF).
DS20006308A-page 15
AV = 1
V+ = 1.35V
V- = -1.35V
CL = 100pF
RL = 1M
POSITIVE SLEW RATE = 0.175V/μs
NEGATIVE SLEW RATE = 0.383V/μs
AV = 2
V+ = 2.5V
V- = -2.5V
CL = 2pF
RL = 1M5F N
TIME 10μs/div
TIME 250μs/div
FIGURE 2-52:
Operation.
AV = 1
V+ = 2.5V
V- = -2.5V
CL = 100pF
RL = 1M
POSITIVE SLEW RATE = 0.197V/μs
NEGATIVE SLEW RATE = 0.343V/μs
AV = 2
V+ = 1.35V
V- = -1.35V
CL = 2pF
RL = 5M5F N
TIME 10μs/div
TIME 250μs/div
INPUT
2V/div
FIGURE 2-53:
Operation.
¨9PP = 2.62V
DS20006308A-page 16
Rail-to-Rail Output
AV = 2
V+ = 2.5V
V- = -2.5V
CL = 2pF
RL = 5M5F N
TIME 250μs/div
FIGURE 2-51:
Operation.
¨9PP = 2.7V
¨9PP = 5V
OUTPUT
2V/div
AV = 2
V+ = 1.35V
V- = -1.35V
CL = 2pF
RL = 1M5F N
OUTPUT
1V/div
INPUT
1V/div
FIGURE 2-50:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 100 pF).
Rail-to-Rail Output
OUTPUT
1V/div
OUTPUT
1V/div
INPUT
1V/div
FIGURE 2-49:
Large Signal Pulse
Response (Test Circuit A: AV = 1, CL = 100 pF).
¨9PP = 5V
OUTPUT
1V/div
OUTPUT
500mV/div
INPUT
1V/div
MIC863
Rail-to-Rail Output
TIME 250μs/div
FIGURE 2-54:
Operation.
Rail-to-Rail Output
2020 Microchip Technology Inc.
MIC863
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Symbol
Description
1
OUTA
Amplifier A Output.
2
INA–
Amplifier A Inverting Input.
3
INA+
Amplifier A Non-Inverting Input
4
V–
5
INB+
Negative Supply.
Amplifier B Non-Inverting Input.
6
INB–
Amplifier B Inverting Input.
7
OUTB
Amplifier B Output.
8
V+
Positive Supply.
2020 Microchip Technology Inc.
DS20006308A-page 17
MIC863
4.0
APPLICATION INFORMATION
Regular
supply
bypassing
techniques
are
recommended. A 10 μF capacitor in parallel with a
0.1 μF capacitor on both the positive and negative
supplies are ideal. For best performance all bypassing
capacitors should be located as close to the op amp as
possible and all capacitors should be low equivalent
series inductance (ESL), equivalent series resistance
(ESR). Surface-mount ceramic capacitors are ideal.
The MIC863 is intended for single-supply applications
configured with a grounded load. It is not advisable to
operate the MIC863 under either of the following
conditions when the load is less than 20 kΩ and the
output swing is greater than 1V (peak-to-peak):
• A grounded load and split supplies (±V)
• A single supply where the load is terminated
above ground.
Under the conditions listed above, there may be some
instability when the output is sinking current.
DS20006308A-page 18
2020 Microchip Technology Inc.
MIC863
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead SOT-23*
(Front)
XXX
e3
*
A35
8-Lead SOT-23*
Example
NNN
831
(Back)
Legend: XX...X
Y
YY
WW
NNN
Example
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2020 Microchip Technology Inc.
DS20006308A-page 19
MIC863
8-Lead SOT-23 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006308A-page 20
2020 Microchip Technology Inc.
MIC863
APPENDIX A:
REVISION HISTORY
Revision A (March 2020)
• Converted Micrel document MIC863 to Microchip
data sheet template DS20006308A.
• Minor text changes throughout.
2020 Microchip Technology Inc.
DS20006308A-page 21
MIC863
NOTES:
DS20006308A-page 22
2020 Microchip Technology Inc.
MIC863
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
X
XX
-XX
Device
Temperature
Package
Media Type
Device:
MIC863:
Temperature:
Y
=
–40°C to +85°C
Package:
M8
=
8-Lead SOT-23
Media Type:
TR
=
3,000/Reel
Examples:
a)
MIC863YM8-TR:
Dual Ultra-Low Power Op Amp
2020 Microchip Technology Inc.
Note 1:
Dual Ultra-Low Power Op
Amp –40°C to +85°C
Junction Temperature
Range, 8-Lead SOT-23
Package, 3,000/Reel
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006308A-page 23
MIC863
NOTES:
DS20006308A-page 24
2020 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 Microchip Technology Inc.
ISBN: 978-1-5224-5719-0
DS20006308A-page 25
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DS20006308A-page 26
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2020 Microchip Technology Inc.
05/14/19
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