MM7150
Motion Module
Product Features
Hardware Features
•
•
•
•
•
•
•
•
The hardware features in the MM7150 module include
the following:
High Performance 32-bit Embedded Controller
Cost effective solution
Small form factor ideal for embedded applications
Low power; 13.25mA in active mode
System in deep sleep consumes 70µA
Host interface via I2C
3.3-Volt I/O
Package
- 17mm x 17mm, 16-pin module
Sensor Firmware
• Sensor fusion firmware features include:
- Self-contained 9-axis sensor fusion
- Sensor data pass-through
- Fast in-use background calibration of all sensors and calibration monitor
- Magnetic immunity: Enhanced magnetic distortion, detection and suppression
- Gyroscope drift cancellation
- Fully calibrated
• Easy to implement complete turnkey sensor
fusion solution
• Sensor power management
• Sensors Supported
- Bosch BMC150 Geomagnetic Sensor/Accelerometer
- Bosch BMG160 Gyroscope
2015 - 2016 Microchip Technology Inc.
• I2C Controller
- Supports I2C bus speeds to 400kHz
- Host Interface Supports Slave Operation
• Low Power Modes
Target Markets
•
•
•
•
Internet of Things Applications
Remote Controls, Gaming
Fitness Monitoring
Applications requiring data from an accelerometer, magnetometer and gyroscope
Temperature Ranges Available
• Industrial (-40°C to +85°C)
• Commercial (0°C to +70°C)
Description
The MM7150 Motion Module is a simple, cost-effective
solution for integrating motion and positioning data into
a wide range of applications. The module contains the
SSC7150 motion coprocessor with integrated 9-axis
sensor fusion as well as high performance MEMS technology including a 3-axis accelerometer, gyroscope
and magnetometer. All components are integrated, calibrated and available on the module for PCB mounting.
DS00001888B-page 1
MM7150
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http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner
of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of
document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may
exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The
errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature
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DS00001888B-page 2
2015 - 2016 Microchip Technology Inc.
MM7150
Table of Contents
1.0 MM7150 Pinout ............................................................................................................................................................................... 4
2.0 MM7150 Module ............................................................................................................................................................................. 7
3.0 MM7150 HID Functions .................................................................................................................................................................. 8
4.0 MM7150 Host Interface ................................................................................................................................................................. 12
5.0 MM7150 Firmware Update ........................................................................................................................................................... 13
6.0 MM7150 References ..................................................................................................................................................................... 14
7.0 MM7150 Performance .................................................................................................................................................................. 15
8.0 Electrical Characteristics ............................................................................................................................................................... 16
Appendix A: Revision History .............................................................................................................................................................. 24
The Microchip Web Site ...................................................................................................................................................................... 25
Customer Change Notification Service ............................................................................................................................................... 25
Customer Support ............................................................................................................................................................................... 25
Product Identification System ............................................................................................................................................................. 26
2015 - 2016 Microchip Technology Inc.
DS00001888B-page 3
MM7150
1.0
MM7150 PINOUT
The pinout of the MM7150 Motion Module is shown in the assembly drawing.
1.1
Assembly Drawing
The assembly drawing is shown in Figure 1-1.
FIGURE 1-1:
DS00001888B-page 4
ASSEMBLY DRAWING
2015 - 2016 Microchip Technology Inc.
MM7150
1.2
Recommended Land Pattern
17.84mm
15.04mm
13.70mm
11.62mm
11.16mm
9.08mm
8.61mm
6.53mm
16
6.08mm
4.00mm
2.80mm
0.00mm
2015 - 2016 Microchip Technology Inc.
17.84mm
15.04mm
13.70mm
11.16mm
11.62mm
8.61mm
9.08mm
6.53mm
6.08mm
4.00mm
2.80mm
0.00mm
1
DS00001888B-page 5
MM7150
1.3
Pin Descriptions
The pin descriptions are provided in Table 1-1.
TABLE 1-1:
PIN DESCRIPTIONS
Pin
Number
1
Name
HOST_TO_SH_WAKE
Type
I
Description
Used to wake Motion Module from a Sleep state. This signal must
be driven high at least 11ms prior to sending any I2C traffic to the
Motion Module. Active high input.
This pin should be connected to VDD through a 100KΩ resistor.
11
HOST_TO_SH_RESET
I
Reset input. Used to reset the host I2C interface.
This pin should be connected to VDD through a 100KΩ resistor.
4
HIDI2C_HOST_INT
O
Alert Interrupt signal from Motion Module to Host. Used to tell
Host data from Motion Module is ready to be sent out. Active low
output.
15
HIDI2C_HOST_CLK
IOD
I2C Controller Clock to Host Interface
16
HIDI2C_HOST_DAT
IOD
I2C Controller Data to Host Interface
10
NC1
-
This pin should be left unconnected
2
NC2
-
This pin should be left unconnected
9
NC3
-
This pin should be left unconnected
12
NC4
-
This pin should be left unconnected
13
NC5
-
This pin should be left unconnected
14
NC6
-
This pin should be left unconnected
3
NC7
-
This pin should be left unconnected
5
NC8
-
This pin should be left unconnected
6
NC9
-
This pin should be left unconnected
7
VDD
PWR
VDD supply
8
VSS
GND
VDD associated ground
DS00001888B-page 6
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MM7150
2.0
MM7150 MODULE
The MM7150 Motion Module provides 9-axis sensor fusion that includes a 3-axis accelerometer, a 3-axis gyroscope
and a 3-axis magnetometer. The module has an I2C interface to the host, and supports HID over I2C. The module
includes the Bosch BMC150 Geomagnetic Sensor/Accelerometer and Bosch BMG160 Gyroscope.
2.1
Module Block Diagram
The block diagram of the module is shown in Figure 2-1.
MM7150 MODULE BLOCK DIAGRAM
GND
+3.3V
FIGURE 2-1:
VDD
VSS (x2)
AVSS
VSENSOR
TPS22929
Power Load
D2_WAKE_UP
HIDI2C_HOST_DAT
HIDI2C_HOST_CLK
HIDI2C_HOST_INT
HOST_TO_SH_WAKE
HOST_TO_SH_RESET
Bosch
BMG160
(Gyro)
Microchip
SSC7150
Motion Coprocessor
HIDI2C_DEVICE_CLK
HIDI2C_DEVICE_DAT
Bosch
BMC150
(A+M)
NC1
NC2
NC3
NC4
NC5
NC6
2.2
Module Features
The MM7150 Motion Module provides self-contained 9-axis sensor fusion. It supports fast in-use background calibration
of all sensors and calibration monitor. Magnetic immunity features provide enhanced magnetic distortion detection and
suppression. The module also provides gyroscope drift cancellation.
2.3
Calibration Requirements
User calibration is not required. The MM7150 Motion Module supports fast in-use background calibration of all sensors
and calibration monitor.
2.4
Other Information
To obtain the most recent and complete documentation for this module, including:
-
User's Guide
Board Description
Board Schematics
Source Code
Application Examples
Links to Web Seminars
Please refer to the web site: www.microchip.com/motion.
2015 - 2016 Microchip Technology Inc.
DS00001888B-page 7
MM7150
3.0
MM7150 HID FUNCTIONS
The MM7150 responds to the standard HID protocol for sensors when used over I2C, defined in References [1] and [2].
The hierarchy of descriptors used in the HID protocol is as follows:
The following sections described the descriptors required for communicating with the MM7150:
3.1
HID Descriptor
TABLE 3-1:
HID DESCRIPTOR FORMAT (I2C)
Field
Description
Size
Value
0x001E
wHIDDescLength
Length of HID Descriptor
UINT 16
bcdVersion
Version compliance. Compliant with Version 1.00
UINT 16
0x0100
wReportDescLength
Report Descriptor Length (3213 bytes)
UINT 16
0x0C8D
wReportDescRegister
Identifier to read Report Descriptor
UINT 16
0x0002
wInputRegister
Identifier to read Input Report
UINT 16
0x0003
wMaxInputLength
Input Report is 13 Bytes + 2 Bytes length field
UINT 16
0x000D
wOutputRegistert
Identifier to read Output Report
UINT 16
0x0000
wMaxOutputLength
No Output Report
UINT 16
0x0000
wCommandRegister
Identifier for Command Register
UINT 16
0x0005
wDataRegister
Identifier for Data Register
UINT 16
0x0006
wVendorID
Vendor ID
UINT 16
0x04D8
wProductID
Product ID
UINT 16
0x0F01
wVersionID
Version
UINT 16
0x7150
RESERVED
Reserved
UINT 32
0x0
3.2
Report Descriptors
Report descriptors are composed of pieces of information. Each piece of information is called an Item.
The HID class driver contains a parser used to analyze items found in the Report descriptor. The parser extracts information from the descriptor in a linear fashion.
The parser collects the state of each known item as it walks through the descriptor, and stores them in an item state
table. The item state table contains the state of individual items. From the parser's point of view, a HID class device looks
like the following.
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MM7150
The Report descriptor is unlike other descriptors in that it is not simply a table of values. The length and content of a
Report descriptor vary depending on the number of data fields required for the device’s report or reports. The Report
descriptor is made up of items that provide information about the device.
The HID report for each sensor has two sections Feature Report and Input Report. The feature report for all the sensors is same. The following sections describe the Feature Report and all Input Reports returned by the Motion Module.
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DS00001888B-page 9
MM7150
3.2.1
FEATURE REPORT
TABLE 3-2:
FEATURE REPORT FORMAT
Field
ucReportID
Description
Size
Report ID
UINT 8
ucConnectionType
Connection Type
UINT 8
ucReportingState
Reporting State
UINT 8
ucPowerState
Power On State
UINT 8
ucSensorState
Sensor State
UINT 8
uIReportInterval
Reporting Interval
UINT 16
usAccuracy
Accuracy
UINT 16
usResolution
Resolution
UINT 16
usChangeSensitivity
Change Sensitivity
UINT 16
sMaximum
Maximum range
INT 16
sMinimum
Minimum range
INT 16
minimumReportInterval
Minimum report interval supported
UINT16
sensorDesc[6]
Sensor description, initialized “MCHPSF”
3.2.2
INT16
3D ACCELEROMETER INPUT REPORT
TABLE 3-3:
3D ACCELEROMETER REPORT FORMAT
Field
Description
Size
ucReportID
Report ID
UINT 8
ucSensorState
Sensor State
UINT 8
ucEventType
Event Type
UINT 8
sAccelXValue
Accelerometer X axis value
INT 16
sAccelYValue
Accelerometer Y axis value
INT 16
sAccelZValue
Accelerometer Z axis value
INT 16
ucShakeDetectState
Shake event detection
UINT 8
3.2.3
COMPASS INPUT REPORT
TABLE 3-4:
COMPASS REPORT FORMAT
Field
Description
Size
ucReportID
Report ID
UINT 8
ucSensorState
Sensor State
UINT 8
ucEventType
Event Type
UINT 8
sHeadingCompensatedMagneticNorthValue
Magnetic north value
INT 16
sFluxXValue
Magnetic field strength, X axis value
INT16
sFluxYValue
Magnetic field strength, Y axis value
INT16
sFluxZValue
Magnetic field strength, Z axis value
INT16
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MM7150
3.2.4
3D GYROSCOPE INPUT REPORT
TABLE 3-5:
3D GYROSCOPE REPORT FORMAT
Field
Description
Size
ucReportID
Report ID
UINT 8
ucSensorState
Sensor State
UINT 8
ucEventType
Event Type
UINT 8
sGyroXValue
Gyroscope X axis value
INT 16
sGyroYValue
Gyroscope Y axis value
INT 16
sGyroZValue
Gyroscope Z axis value
INT 16
ucShakeDetectState
Shake event detection
UINT 8
3.2.5
INCLINOMETER INPUT REPORT
TABLE 3-6:
INCLINOMETER REPORT FORMAT
Field
Description
Size
ucReportID
Report ID
UINT 8
ucSensorState
Sensor State
UINT 8
ucEventType
Event Type
UINT 8
sIncXValue
Inclinometer X axis values
INT 16
sIncYValue
Inclinometer Y axis value
INT 16
sIncZValue
Inclinometer Z axis value
INT 16
3.2.6
ORIENTATION INPUT REPORT
TABLE 3-7:
ORIENTATION REPORT FORMAT
Field
Description
Size
ucReportID
Report ID
UINT 8
ucSensorState
Sensor State
UINT 8
ucEventType
Event Type
UINT 8
sOriXValue
Orientation X axis value
INT 16
sOriYValue
Orientation Y axis value
INT 16
sOriZValue
Orientation Z axis value
INT 16
sOriWValue
Orientation W axis value
INT 16
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DS00001888B-page 11
MM7150
4.0
MM7150 HOST INTERFACE
4.1
I2C
The MM7150 can be connected to a host via the I2C interface. The I2C interface is compliant with the I2C standard
described in [4], at speeds up to 400KHz. Above the transport layer, the protocol used by the MM7150 is the same HID
protocol used when communicating over USB. The mapping of HID over I2C is defined in Reference [3]. The protocol
and the interface, taken together, are compliant with Windows 8/8.1 certification.
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MM7150
5.0
MM7150 FIRMWARE UPDATE
The firmware in the MM7150 Module may be updated at run time. See Reference [5.] for details.
2015 - 2016 Microchip Technology Inc.
DS00001888B-page 13
MM7150
6.0
1.
2.
3.
4.
5.
MM7150 REFERENCES
USB-Sig, “Device Class Definition for Human Interface Devices (HID). Firmware Specification”, Version 1.11,
6/27/01
USB-Sig, “HID Usage Table Sensor Page”, Request HUTRR39, http://www.usb.org/developers/hidpage/HUTRR39b.pdf
Microsoft Corporation, “HID Over I2C Protocol Specification: Device Side”, version 1.00, 04/24/2012
NXP Corporation, “I2C-bus Specification and User Manual”, Rev. 6, 04/04/2014
Microchip Technology Inc., “MM7150 Motion Module User's Guide”, 2014
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MM7150
7.0
MM7150 PERFORMANCE
TABLE 7-1:
PERFORMANCE PARAMETERS
Parameter
Typical
Accelerometer
Range
±2G
Resolution
0.98mG
Accuracy
±40mG
Magnetometer
Range
X,Y: ±1300μT
Z: ±2500μT
Resolution
0.3μT
Heading Accuracy
±3°
Compass
Range
0° to 360°
Resolution
1°
Accuracy
±10°
Gyroscope
Range
±2000°/s
Resolution
0.061°/s
Accuracy
±5°/s
Inclinometer
Range: Pitch
-180° to +180°
Range: Roll
-90° to +90°
Range: Yaw
0° to +360°
Resolution
1°
Accuracy
±5°
Orientation - Quaternion
Range
±1.0
Resolution
0.001
Accuracy
2015 - 2016 Microchip Technology Inc.
±5°
DS00001888B-page 15
MM7150
8.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the MM7150 electrical characteristics. Additional information will be provided in
future revisions of this document as it becomes available.
Absolute maximum ratings for the MM7150 devices are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
(See Note 1)
Ambient temperature under bias (Commercial temperature range)............................................................ .0°C to +70°C
Ambient temperature under bias (Industrial temperature range) ..............................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +4.0V
Voltage on any pin that is not 5V tolerant, with respect to VSS (Note 3) ......................................... -0.3V to (VDD + 0.3V)
Voltage on any 5V tolerant pin with respect to VSS when VDD 2.3V (Note 3) ........................................ -0.3V to +5.5V
Voltage on any 5V tolerant pin with respect to VSS when VDD < 2.3V (Note 3) ........................................ -0.3V to +3.6V
Maximum current out of VSS pin(s) .......................................................................................................................300 mA
Maximum current into VDD pin(s) (Note 2)............................................................................................................300 mA
Maximum output current sunk by any I/O pin..........................................................................................................15 mA
Maximum output current sourced by any I/O pin.....................................................................................................15 mA
Maximum current sunk by all ports........................................................................................................................200 mA
Maximum current sourced by all ports (Note 2) ....................................................................................................200 mA
Note 1: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2: Maximum allowable current is a function of device maximum power dissipation (see Table 8-2).
3: See the “Pin List” section for the 5V tolerant pins.
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MM7150
8.1
DC Characteristics
TABLE 8-1:
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Param.
Symbol
No.
Characteristics
Min.
Typ.
Max.
Units
Conditions
Operating Voltage
DC10
VDD
Supply Voltage (Note 2)
2.3
—
3.6
V
DC12
VDR
RAM Data Retention Voltage
(Note 1)
1.75
—
—
V
DC16
VPOR
VDD Start Voltage
to Ensure Internal Power-on Reset
Signal
1.75
—
2.1
V
DC17
SVDD
VDD Rise Rate
to Ensure Internal Power-on Reset
Signal
0.00005
—
0.115
Note 1:
2:
—
—
—
V/s —
This is the limit to which VDD can be lowered without losing RAM data.
Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized. Refer to
parameter BO10 in Table 8-5 for BOR values.
TABLE 8-2:
DC CHARACTERISTICS: OPERATING/POWER-DOWN CURRENT
DC CHARACTERISTICS
Parameter
Symbol
No.
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Typical
Max.
Units
Conditions
Operating/Power-Down Current (Note 1, 2)
DC20
IDD
26.5
mA
—
DC30
IAVG
13.65
mA
—
DC40
IIDLE
2.5
mA
—
DC50
IPD
70
150
μA
0°C TA +70°C
DC50
IPD
120
180
μA
-40°C TA +85°C
Note 1:
2:
A device’s supply current is mainly a function of the operating voltage and frequency, as well as temperature.
The current measurements are as follows:
• Operating current (IDD):
This is the peak active current value.
• Average current (IAVG):
This value represents an average current measurement of active and low power mode time intervals during operation
measured over 1 second period.
• Idle current (IIDLE)
This is the average idle current value when no sensor is actively providing environmental changes (and the device is
not in power-down mode).
• Power-Down current (IPD):
This value is the current measured in power-down mode. This is the sleep state entered when the Host issues the
SET_POWER (Sleep) Command if the I2C host interface is used.
Wakeup from power-down mode requires the HOST_TO_SH_WAKE pin if the I2C host interface is used.
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DS00001888B-page 17
MM7150
TABLE 8-3:
DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Param.
Symbol
No.
VIL
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Characteristics
Min.
Typical(1)
Max.
Units
Conditions
Input Low Voltage
DI10
I/O Pins
VSS
—
0.2 VDD
V
DI18
SDAx, SCLx
VSS
—
0.3 VDD
V
I2C disabled
(Note 4)
DI19
SDAx, SCLx
VSS
—
0.8
V
I2C enabled
(Note 4)
0.65 VDD
—
VDD
V
(Note 4,6)
VIH
Input High Voltage
I/O Pins not 5V-tolerant(5)
DI20
I/O Pins
5V-tolerant(5)
0.65 VDD
—
5.5
V
DI28
SDAx, SCLx
0.65 VDD
—
5.5
V
I2C disabled
(Note 4,6)
DI29
SDAx, SCLx
2.1
—
5.5
V
I2C enabled,
2.3V VPIN 5.5
(Note 4,6)
IIL
Input Leakage Current
(Note 3)
DI50
I/O Ports
—
—
+1
A
VSS VPIN VDD,
Pin at high-impedance
DI55
MCLR#(2)
—
—
+1
A
VSS VPIN VDD
Note 1:
2:
3:
4:
5:
6:
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
The leakage current on the MCLR# pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current may be measured at different input
voltages.
Negative current is defined as current sourced by the pin.
This parameter is characterized, but not tested in manufacturing.
See the “Pin List” section for the 5V-tolerant pins.
The VIH specifications are only in relation to externally applied inputs, and not with respect to the userselectable internal pull-ups. External open drain input signals utilizing the internal pull-ups of the device are
ensured to be recognized only as a logic “high” internally to the device. For External “input” logic inputs that
require a pull-up source, to ensure the minimum VIH of those components, it is recommended to use an
external pull-up resistor rather than the internal pull-ups of the device.
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MM7150
TABLE 8-4:
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Param. Symbol
DO10
Vol
Characteristic
Output Low Voltage
Min.
Typ.
Max.
Units
Conditions
—
—
0.4
V
IOL 10 mA, VDD = 3.3V
1.5(1)
—
—
V
IOH -14 mA, VDD = 3.3V
(1)
—
—
IOH -12 mA, VDD = 3.3V
—
—
IOH -10 mA, VDD = 3.3V
—
—
IOH -7 mA, VDD = 3.3V
I/O Pins
DO20
VOH
Output High Voltage
2.0
I/O Pins
2.4
(1)
3.0
Note 1:
Parameters are characterized, but not tested.
TABLE 8-5:
ELECTRICAL CHARACTERISTICS: BROWN-OUT RESET (BOR)
DC CHARACTERISTICS
Param.
Symbol
No.
BO10
Note 1:
2:
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Characteristics
BOR Event on VDD transition
high-to-low(2)
Vbor
Min.(1) Typical
2.0
—
Max.
Units
Conditions
2.3
V
—
Parameters are for design guidance only and are not tested in manufacturing.
Overall functional device operation at VBORMIN < VDD < VDDMIN is tested, but not characterized.
TABLE 8-6:
INTERNAL VOLTAGE REGULATOR SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Commercial Operating temperature 0°C TA +70°C
Industrial Operating temperature -40°C TA +85°C
Param.
No.
Symbol
Characteristics
Min.
Typical
Max.
Units
Comments
D321
Cefc
External Filter Capacitor Value
8
10
—
F
Capacitor must be low
series resistance (1 ohm).
Typical voltage on the VCAP
pin is 1.8V.
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DS00001888B-page 19
MM7150
8.2
AC Characteristics and Timing Parameters
The information contained in this section defines MM7150 AC characteristics and timing parameters.
FIGURE 8-1:
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
Load Condition 1 – for all pins except OSC2
Load Condition 2 – for OSC2
VDD/2
CL
Pin
RL
VSS
CL
Pin
RL = 464
CL = 50 pF for all pins
VSS
TABLE 8-7:
CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Param.
Symbol
No.
Characteristics
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Min.
Typical(1)
Max.
Units
DO56
CIO
All I/O pins
—
—
50
pF
DO58
CB
SCLx, SDAx
—
—
400
pF
Note 1:
Conditions
In I2C™ mode
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
DS00001888B-page 20
2015 - 2016 Microchip Technology Inc.
MM7150
FIGURE 8-2:
POWER-ON RESET TIMING CHARACTERISTICS
Internal Voltage Regulator Enabled
Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
VDD
VPOR
(TSYSDLY)
SY02
Power-up Sequence
(Note 2)
CPU Starts Fetching Code
SY00
(TPU)
(Note 1)
Internal Voltage Regulator Enabled
Note 1: The power-up period will be extended if the power-up sequence completes before the device exits from
BOR (VDD < VDDMIN).
2: Includes interval voltage regulator stabilization delay.
FIGURE 8-3:
EXTERNAL RESET TIMING CHARACTERISTICS
Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
MCLR#
TMCLR
(SY20)
BOR
TBOR
(SY30)
(TSYSDLY)
SY02
Reset Sequence
CPU Starts Fetching Code
Clock Sources = (HS, HSPLL, XT, XTPLL and SOSC)
2015 - 2016 Microchip Technology Inc.
(TSYSDLY)
SY02
DS00001888B-page 21
MM7150
TABLE 8-8:
RESETS TIMING
AC CHARACTERISTICS
Param.
Symbol
No.
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Characteristics(1)
Min.
Typical(2)
Max.
Units
Conditions
SY00
TPU
Power-up Period
Internal Voltage Regulator
Enabled
—
400
600
s
—
SY02
Tsysdly
System Delay Period:
Time Required to Reload Device
Configuration Fuses plus
SYSCLK(3) Delay before First
instruction is Fetched.
—
s +
8 SYSCLK
cycles
—
—
—
SY20
Tmclr
MCLR# Pulse Width (low)
2
—
—
s
—
SY30
TBOR
BOR Pulse Width (low)
—
1
—
s
—
Note 1:
2:
3:
These parameters are characterized, but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Characterized by design but not tested.
SYSCLK is 48MHz
I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 8-4:
SCLx
IS34
IS31
IS30
IS33
SDAx
Stop
Condition
Start
Condition
Note: Refer to Figure 8-1 for load conditions.
FIGURE 8-5:
I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
IS20
IS21
IS11
IS10
SCLx
IS30
IS26
IS31
IS25
IS33
SDAx
In
IS40
IS40
IS45
SDAx
Out
Note: Refer to Figure 8-1 for load conditions.
DS00001888B-page 22
2015 - 2016 Microchip Technology Inc.
MM7150
I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
TABLE 8-9:
AC CHARACTERISTICS
Param.
No.
Symbol
IS10
TLO:SCL
IS11
THI:SCL
Characteristics
Clock Low Time
Clock High Time
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Min.
Max.
Units
100 kHz mode
4.7
—
s
—
400 kHz mode
1.3
—
s
—
100 kHz mode
4.0
—
s
—
400 kHz mode
0.6
—
s
—
300
ns
CB is specified to be from
10 to 400 pF
IS20
TF:SCL
SDAx and SCLx
Fall Time
100 kHz mode
—
400 kHz mode
20 + 0.1 CB
300
ns
IS21
TR:SCL
SDAx and SCLx
Rise Time
100 kHz mode
—
1000
ns
400 kHz mode
20 + 0.1 CB
300
ns
IS25
TSU:DAT
Data Input
Setup Time
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
IS26
THD:DAT
Data Input
Hold Time
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
s
100 kHz mode
4700
—
ns
400 kHz mode
600
—
ns
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
0
3500
ns
400 kHz mode
0
1000
ns
100 kHz mode
4.7
—
s
400 kHz mode
1.3
—
s
—
400
pF
IS30
TSU:STA
Start Condition
Setup Time
IS31
THD:STA
Start Condition
Hold Time
IS33
TSU:STO
Stop Condition
Setup Time
IS34
THD:STO
Stop Condition
Hold Time
IS40
TAA:SCL
Output Valid from 100 kHz mode
Clock
IS45
TBF:SDA
Bus Free Time
IS50
CB
Bus Capacitive
Loading
2015 - 2016 Microchip Technology Inc.
Conditions
CB is specified to be from
10 to 400 pF
—
—
Only relevant for Repeated
Start condition
After this period, the first
clock pulse is generated
—
—
—
The amount of time the bus
must be free before a new
transmission can start
—
DS00001888B-page 23
MM7150
APPENDIX A:
TABLE A-1:
REVISION HISTORY
REVISION HISTORY
Revision
DS00001888B (01-26-16)
Section/Figure/Entry
Industrial Temp Range
Correction
Added Industrial Temp Range to Data Sheet
Updated IPD for Industrial Temp Range
DS00001888A (02-05-15)
DS00001888B-page 24
Initial Release
2015 - 2016 Microchip Technology Inc.
MM7150
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://microchip.com/support
2015 - 2016 Microchip Technology Inc.
DS00001888B-page 25
MM7150
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.(1)
X
Device
Series
-
Temperature
Range
XXX
Sensor
Fusion
Firmware
Device:
MM7150(1)
Temperature
Range:
Blank = Commercial (0°C to +70°C)
I
= Industrial (-40°C to +85°C)
Sensor Fusion
Firmware:
AB1
Example:
a)
b)
MM7150-AB1, Bosch 9-axis sensor fusion,
Commercial Temperature
MM7150I-AB1, Bosch 9-axis sensor fusion.,
Industrial Temperature
Note 1:
DS00001888B-page 26
=
Bosch 9-axis Sensor Fusion
These products meet the halogen maximum
concentration values per IEC61249-2-21.
All package options are lead-free and RoHS
compliant. For RoHS compliance and environmental information, please visit
http://www.microchip.com/pagehandler/enus/aboutus/ehs.html.
2015 - 2016 Microchip Technology Inc.
MM7150
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer,
LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST
Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch,
Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial
Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless
DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2015 - 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781522402169
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015 - 2016 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00001888B-page 27
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DS00001888B-page 28
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