MPF300TL-FCG484E

PolarFire® FPGA Overview This datasheet covers the electrical AC and DC specifications for four temperature grades of devices. AC and DC electrical characteristics and parametric values, unless otherwise noted, apply to all temperature grade devices. For example, worst-case STD speed grade applies to all temperature grade devices and –1 speed grade applies to all temperature grade devices except Military. In addition, Low-Power (L) devices are equivalent in performance to STD speed grade devices where offered. Users are expected to close timing using SmartTime for the speed and temperate grade of the device chosen. Table 1. PolarFire Minimum and Maximum Junction Temperatures by Temperature Grade Temperature Grade Minimum Junction Temperature Maximum Junction Temperature Extended Commercial (E) 0 °C 100 °C Industrial (I) –40 °C 100 °C Automotive AECQ-100 (T2) –40 °C 125 °C Military (M) –55 °C 125 °C Table 2. PolarFire Speed Grade Options by Temperature Grade Temperature Grade Standard Speed Grade –1 Speed Grade Extended Commercial (E) Available Available Industrial (I) Available Available Automotive T2 (T2) Available Available Military (M) Available Not Available Table 3. PolarFire Package Ball Composition by Temperature Grade Temperature Grade Ball Material Composition Package Decoupling Capacitor Solder Paste (FC484, FC784, FC1152) Extended Commercial (E) RoHS RoHS Industrial (I) RoHS RoHS Automotive T2 (T2) RoHS RoHS Military (M) Pb Pb PolarFire device programming functions (programming, verify, and digest check) are only allowed over the Industrial temperature range regardless of the temperature grade of the device selected. Retention characteristics for each temperature range explicitly describe the retention characteristics for that temperature-grade device. You cannot, for example, use the retention characteristics at 110 °C and apply them to the Extended Commercial or Industrial devices with a maximum TJ of 100 °C. Retention characteristics for Military-grade devices and Automotive-grade devices at the absolute maximum junction temperature of 125 °C can be profiled using the PolarFire Retention Calculator, which can be obtained by contacting technical support at www.microchip.com/support. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 1 Table of Contents Overview........................................................................................................................................................ 1 1. References..............................................................................................................................................3 2. Device Offering........................................................................................................................................4 3. Silicon and Libero Tool Status.................................................................................................................5 4. DC Characteristics.................................................................................................................................. 7 4.1. 4.2. 4.3. 5. AC Switching Characteristics................................................................................................................ 27 5.1. 5.2. 5.3. 5.4. 5.5. 5.6. 5.7. 5.8. 5.9. 5.10. 5.11. 6. Absolute Maximum Rating........................................................................................................... 7 Recommended Operating Conditions.......................................................................................... 8 Input and Output.........................................................................................................................17 I/O Standards Specifications...................................................................................................... 27 Clocking Specifications.............................................................................................................. 44 Fabric Specifications.................................................................................................................. 50 Transceiver Switching Characteristics........................................................................................53 Transceiver Protocol Characteristics..........................................................................................67 Non-Volatile Characteristics....................................................................................................... 75 System Services.........................................................................................................................84 Fabric Macros.............................................................................................................................85 Power-Up to Functional Timing.................................................................................................. 89 Dedicated Pins........................................................................................................................... 93 User Crypto................................................................................................................................ 96 Revision History.................................................................................................................................. 102 The Microchip Website...............................................................................................................................106 Product Change Notification Service..........................................................................................................106 Customer Support...................................................................................................................................... 106 Microchip Devices Code Protection Feature.............................................................................................. 106 Legal Notice............................................................................................................................................... 106 Trademarks................................................................................................................................................ 107 Quality Management System..................................................................................................................... 108 Worldwide Sales and Service.....................................................................................................................109 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 2 References 1. References The following documents are recommended references. For more information about PolarFire static and dynamic power data, see the PolarFire Power Estimator Spreadsheet. • • • • • • • • • • • • • • • • • • PolarFire FPGA Product Overview ER0217: PolarFire FPGA Pre-Production Device Errata UG0722: PolarFire FPGA Packaging and Pin Descriptions User Guide UG0726: PolarFire FPGA Board Design User Guide PolarFire FPGA and PolarFire SoC FPGA User I/O User Guide PolarFire FPGA and PolarFire SoC FPGA Fabric User Guide PolarFire FPGA and PolarFire SoC FPGA Programming User Guide PolarFire FPGA and PolarFire SoC FPGA Clocking Resources User Guide UG0687: PolarFire FPGA 1G Ethernet Solutions User Guide UG0727: PolarFire FPGA 10G Ethernet Solutions User Guide UG0748: PolarFire FPGA Low Power User Guide PolarFire FPGA and PolarFire SoC FPGA Memory Controller User Guide UG0743: PolarFire FPGA Debugging User Guide PolarFire FPGA and PolarFire SoC FPGA Power-Up and Resets User Guide PolarFire FPGA and PolarFire SoC FPGA Transceiver User Guide PolarFire FPGA and PolarFire SoC FPGA PCI Express User Guide PolarFire FPGA and PolarFire SoC FPGA Security User Guide UG0897: PolarFire and PolarFire SoC FPGA Power Estimator User Guide © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 3 Device Offering 2. Device Offering The following table lists the PolarFire FPGA device options using the MPF300T as an example. The MPF050T, MPF100T, MPF200T, and MPF500T device densities have identical offerings. Table 2-1. PolarFire FPGA Device Options Device Extended Industrial Options Commercial –40 °C–100 °C STD –1 Transceivers Lower Static Data (T) Power Security (L) (S) 0 °C–100 °C MPF300T Yes Yes Yes Yes Yes — — MPF300TL Yes Yes Yes — Yes Yes — MPF300TS — Yes Yes Yes Yes — Yes MPF300TLS — Yes Yes — Yes Yes Yes Table 2-2. Orderable Military (–55 °C TJ to 125 °C TJ) Device Part Numbers STD Speed Grade –1 Speed Grade MPF200TS-FCS325M N/A MPF300TS-FC484M N/A MPF300TS-FCV484M N/A MPF300TS-FCS536M N/A MPF300TS-FC784M N/A MPF500TS-FC784M N/A MPF500TS-FC1152M N/A Table 2-3. Orderable Automotive (–40 °C TJ to 125 °C TJ) Device Part Numbers STD Speed Grade –1 Speed Grade MPF100T-FCG484T2 MPF100T-1FCG484T2 MPF100T-FCVG484T2 MPF100T-1FCVG484T2 MPF100T-FCSG325T2 MPF100T-1FCSG325T2 MPF200T-FCG484T2 MPF200T-1FCG484T2 MPF200T-FCVG484T2 MPF200T-1FCVG484T2 MPF200T-FCSG325T2 MPF200T-1FCSG325T2 MPF200T-FCSG536T2 MPF200T-1FCSG536T2 MPF300T-FCVG484T2 MPF300T-1FCVG484T2 MPF300T-FCSG536T2 MPF300T-1FCSG536T2 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 4 Silicon and Libero Tool Status 3. Silicon and Libero Tool Status There are three status levels: • • • Advanced – Initial estimated information based on simulations. Preliminary – Information based on simulation and/or initial characterization. Production – Final production data. The following tables list the status of the PolarFire FPGA silicon and Libero Timing and Power tool. Table 3-1. PolarFire FPGA Silicon Status Product Silicon MPF100T, TS, TL, TLS Production – all temperature grades MPF200T, TS, TL, TLS Production – all temperature grades MPF300T, TS, TL, TLS Production – all temperature grades MPF500T, TS, TL, TLS Production – all temperature grades Table 3-2. PolarFire FPGA Tool Status Device Status Libero Version Timing Power Extended Commercial Industrial Extended Commercial Industrial STD –1 STD –1 STD –1 STD –1 MPF050T, TS, TL, TLS Preliminary VDD = 1.0V, 1.05V 2021.2 2021.2 2021.2 2021.2 2021.2 2021.2 2021.2 2021.2 MPF100T, TS, TL, TLS Production VDD = 1.0V 12.1 12.1 12.1 12.1 12.1 12.1 12.1 12.1 Production VDD = 1.05V 12.2 12.2 12.2 12.2 12.2 12.2 12.2 12.2 MPF200T, TS, TL, TLS Production VDD = 1.0V 12.1 12.1 12.1 12.1 12.1 12.1 12.1 12.1 Production VDD = 1.05V 12.2 12.2 12.2 12.2 12.2 12.2 12.2 12.2 MPF300T, TS, TL, TLS Production VDD = 1.0V 12.1 12.0 12.1 12.1 12.1 12.1 12.1 12.1 Production VDD = 1.05V 12.2 12.2 12.2 12.2 12.2 12.2 12.2 12.2 MPF500T, TS, TL, TLS Production VDD = 1.0V 12.2 12.2 12.2 12.2 12.2 12.2 12.2 12.2 Production VDD = 1.05V 12.2 12.2 12.2 12.2 12.2 12.2 12.2 12.2 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 5 Silicon and Libero Tool Status Table 3-3. Military Device Status MPF200TS MPF300TS MPF500TS Libero Version Timing Power Military Military STD STD Production VDD = 1.0V 12.5 12.5 Production VDD = 1.05V 12.5 12.5 Production VDD = 1.0V 12.3 12.3 Production VDD = 1.05V 12.5 12.5 Production VDD = 1.0V 12.5 12.5 Production VDD = 1.05V 12.5 12.5 Table 3-4. Automotive T2 Device MPF100T MPF200T MPF300T Status Timing Power Automotive T2 Automotive T2 STD –1 STD –1 Production VDD = 1.0V 12.6 12.6 12.6 12.6 Production VDD = 1.05V 12.6 12.6 12.6 12.6 Production VDD = 1.0V 12.6 12.6 12.6 12.6 Production VDD = 1.05V 12.6 12.6 12.6 12.6 Production VDD = 1.0V 12.6 12.6 12.6 12.6 Production VDD = 1.05V 12.6 12.6 12.6 12.6 © 2021 Microchip Technology Inc. and its subsidiaries Libero Version Datasheet DS00003831B-page 6 DC Characteristics 4. DC Characteristics This section lists the DC characteristics of the PolarFire FPGA device. 4.1 Absolute Maximum Rating The following table lists the absolute maximum ratings for PolarFire devices. Table 4-1. Absolute Maximum Rating Parameter Symbol Min Max Unit FPGA core power supply VDD –0.5 1.13 V Transceiver Tx and Rx lanes supply VDDA –0.5 1.13 V Programming and HSIO receiver supply VDD18 –0.5 2.0 V FPGA core and FPGA PLL high-voltage supply VDD25 –0.5 2.7 V Transceiver PLL high-voltage supply VDDA25 –0.5 2.7 V Transceiver reference clock supply VDD_XCVR_CLK –0.5 3.6 V Global VREF for transceiver reference clocks XCVRVREF –0.5 3.6 V HSIO DC I/O supply2 VDDIx –0.5 2.0 V GPIO DC I/O supply2 VDDIx –0.5 3.6 V Dedicated I/O DC supply for JTAG and SPI VDDI3 –0.5 3.6 V GPIO auxiliary power supply for I/O bank x2 VDDAUXx –0.5 3.6 V Maximum DC input voltage on GPIO VIN –0.5 3.8 V Maximum DC input voltage on HSIO VIN –0.5 2.2 V Transceiver receiver absolute input voltage Transceiver VIN –0.5 1.26 V Transceiver reference clock absolute input voltage Transceiver REFCLK VIN –0.5 3.6 V Storage temperature (ambient)1 TSTG –65 150 °C Junction temperature1 TJ –55 135 °C Maximum soldering temperature RoHS TSOLROHS — 260 °C 1. 2. 3. See Table 5-61. FPGA and μPROM Programming Cycles vs. Retention Characteristics for retention time vs. temperature. The total time used in calculating the device retention includes the device operating temperature time and temperature during storage time. The power supplies for a given I/O bank x are shown as VDDIx and VDDAUXx. Absolute maximum ratings are stress ratings only; functional operation of the device at these or any other conditions beyond those listed under the recommended operating conditions specified in Table 4-2. Recommended Operating Conditions is not implied. Stresses beyond those listed in the following table might cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 7 DC Characteristics 4.2 Recommended Operating Conditions The following table lists the recommended operating conditions. Table 4-2. Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Condition FPGA core supply at 1.0V mode1, 6 VDD 0.97 1.00 1.03 V — FPGA core supply at 1.05V mode1, 6 VDD 1.02 1.05 1.08 V — Transceiver Tx and Rx lanes supply (1.0V mode)6, 7 VDDA 0.97 1.00 1.03 V When all lane rates are 10.3125 Gbps or less.1 Transceiver Tx and Rx lanes supply (1.05V mode)6 VDDA 1.02 1.05 1.08 V Must when any lane rate is greater than 10.3125 Gbps. Lane rates 10.3125 Gbps or less may also be powered in 1.05V mode.1 Programming and HSIO receiver supply6 VDD18 1.71 1.80 1.89 V — FPGA core and FPGA PLL high-voltage supply6 VDD25 2.425 2.50 2.575 V — Transceiver PLL high-voltage supply6 VDDA25 2.425 2.50 2.575 V — Transceiver reference clock supply6, 7 VDD_XCVR_CLK 3.135 3.3 3.465 V 3.3V nominal 2.375 2.5 2.625 V 2.5V nominal Global VREF for transceiver reference clocks3 XCVRVREF Ground — HSIO DC I/O supply6 VDDIx 1.14 Various 1.89 V Allowed nominal options: 1.2V, 1.35V, 1.5V, and 1.8V4, 5 GPIO DC I/O supply6 VDDIx 1.14 Various 3.465 V Allowed nominal options: 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V2, 4, 5 Dedicated I/O DC supply for JTAG and SPI (GPIO Bank 3)6 VDDI3 1.71 Various 3.465 V Allowed nominal options: 1.8V, 2.5V, and 3.3V GPIO auxiliary supply6 VDDAUXx 3.135 3.3 3.465 V For I/O bank x with VDDIx = 3.3V nominal2, 4, 5 2.375 2.5 2.625 V For I/O bank x with VDDIx = 2.5V nominal or lower2, VDD_XCVR_ CLK V — 4, 5 Extended commercial temperature range © 2021 Microchip Technology Inc. and its subsidiaries TJ 0 — Datasheet 100 °C — DS00003831B-page 8 DC Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition Industrial temperature range TJ –40 — 100 °C — Automotive T2 temperature range TJ –40 — 125 °C — Military temperature range TJ –55 — 125 °C — Extended commercial programming temperature range TPRG 0 — 100 °C — Industrial programming temperature range TPRG –40 — 100 °C — 1. 2. 3. 4. 5. 6. 7. 4.2.1 VDD and VDDA can independently operate at 1.0V or 1.05V nominal. These supplies are not dynamically adjustable. For GPIO buffers where I/O bank is designated as bank number, if VDDIx is 2.5V nominal or 3.3V nominal, VDDAUXx must be connected to the VDDIx supply for that bank. If VDDIx for a given GPIO bank is 50K — Ω 1. Measured at VCM = 1.2V and VID = 350 mV. Note: All pull-ups are disabled at power-up to allow hot plug capability. The following tables describe the PolarFire transceiver user interface clocks. Note: Until specified, all modes are non-deterministic. For more information, see UG0677: PolarFire FPGA Transceiver User Guide. –STD speed grade is offered for Extended Commercial (E), Industrial (I), Military (M), and Automotive (T2) temperature grades. –1 speed grade is offered for Extended Commercial (E), Industrial (I), and Automotive (T2) temperature grades only. Table 5-32. Transceiver TX_CLK Range (Nondeterministic PCS Mode with Global or Regional Fabric Clocks) Mode STD Min STD Max –1 Min –1 Max Unit 8-bit, max data rate = 1.6 Gbps — 200 — 200 MHz 10-bit, max data rate = 1.6 Gbps — 160 — 160 MHz 16-bit, max data rate = 4.8 Gbps — 300 — 300 MHz 20-bit, max data rate = 6.0 Gbps — 300 — 300 MHz 32-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 325 — 325 MHz 40-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 260 — 320 MHz 64-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 165 — 200 MHz 80-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 130 — 160 MHz Fabric pipe mode 32-bit, max data rate = 6.0 Gbps — 150 — 150 MHz 1. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. –STD speed grade is offered for Extended Commercial (E), Industrial (I), Military (M), and Automotive (T2) temperature grades. –1 speed grade is offered for Extended Commercial (E), Industrial (I), and Automotive (T2) temperature grades only. Table 5-33. Transceiver RX_CLK Range (Non-Deterministic PCS Mode with Global or Regional Fabric Clocks) Mode STD Min STD Max –1 Min –1 Max Unit 8-bit, max data rate = 1.6 Gbps — 200 — 200 MHz 10-bit, max data rate = 1.6 Gbps — 160 — 160 MHz © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 57 AC Switching Characteristics ...........continued Mode STD Min STD Max –1 Min –1 Max Unit 16-bit, max data rate = 4.8 Gbps — 300 — 300 MHz 20-bit, max data rate = 6.0 Gbps — 300 — 300 MHz 32-bit, max data rate = 10.3125 Gbps — 325 — 325 MHz 40-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 260 — 320 MHz 64-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 165 — 200 MHz 80-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 130 — 160 MHz Fabric pipe mode 32-bit, max data rate = 6.0 Gbps — 150 — 150 MHz 1. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. –STD speed grade is offered for Extended Commercial (E), Industrial (I), Military (M), and Automotive (T2) temperature grades. –1 speed grade is offered for Extended Commercial (E), Industrial (I), and Automotive (T2) temperature grades only. Table 5-34. Transceiver TX_CLK Range (Deterministic PCS Mode with Regional Fabric Clocks) Mode STD Min STD Max –1 Min –1 Max Unit 8-bit, max data rate = 1.6 Gbps — 200 — 200 MHz 10-bit, max data rate = 1.6 Gbps — 160 — 160 MHz 16-bit, max data rate = 3.6 Gbps (–STD) / 4.25 Gbps (–1) — 225 — 266 MHz 20-bit, max data rate = 4.5 Gbps (–STD) / 5.32 Gbps (–1) — 225 — 266 MHz 32-bit, max data rate = 7.2 Gbps (–STD) / 8.5 Gbps (–1) — 225 — 266 MHz 40-bit, max data rate = 9.0 Gbps (–STD) / 10.6 Gbps (–1)1 — 225 — 266 Mhz 64-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 165 — 200 MHz 80-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 130 — 160 MHz 1. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. –STD speed grade is offered for Extended Commercial (E), Industrial (I), Military (M), and Automotive (T2) temperature grades. –1 speed grade is offered for Extended Commercial (E), Industrial (I), and Automotive (T2) temperature grades only. Table 5-35. Transceiver RX_CLK Range (Deterministic PCS Mode with Regional Fabric Clocks) Mode STD Min STD Max –1 Min –1 Max Unit 8-bit, max data rate = 1.6 Gbps — 200 — 200 MHz 10-bit, max data rate = 1.6 Gbps — 160 — 160 MHz 16-bit, max data rate = 3.6 Gbps (–STD) / 4.25 Gbps (–1) — 225 — 266 MHz 20-bit, max data rate = 4.5 Gbps (–STD) / 5.32 Gbps (–1) — 225 — 266 MHz © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 58 AC Switching Characteristics ...........continued Mode STD Min STD Max –1 Min –1 Max Unit 32-bit, max data rate = 7.2 Gbps (–STD) / 8.5 Gbps (–1) — 225 — 266 MHz 40-bit, max data rate = 9.0 Gbps (–STD) / 10.6 Gbps (–1)1 — 225 — 266 MHz 64-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 165 — 200 MHz 80-bit, max data rate = 10.3125 Gbps (–STD) / 12.7 Gbps (–1)1 — 130 — 160 MHz 1. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. Table 5-36. PolarFire Transceiver Transmitter Characteristics Parameter Symbol Min Typ Max Unit Condition Differential termination VOTERM 68 85 102 Ω 85Ω setting VOTERM 80 100 120 Ω 100Ω setting VOTERM 120 150 180 Ω 150Ω setting VOCM 0.44 × VDDA 0.525 × VDDA 0.59 × VDDA V DC coupled 50% setting VOCM 0.52 × VDDA 0.6 × VDDA 0.66 × VDDA V DC coupled 60% setting VOCM 0.61 × VDDA 0.7 × VDDA 0.75 × VDDA V DC coupled 70% setting VOCM 0.63 × VDDA 0.8 × VDDA 0.83 × VDDA V DC coupled 80% setting TTxRF 40 — 61 ps 20% to 80% 39 — 58 ps 80% to 20% VODPP 1080 1140 1320 mV 1000 mV setting VODPP 1010 1060 1220 mV 800 mV setting VODPP 550 580 670 mV 500 mV setting VODPP 465 490 560 mV 400 mV setting VODPP 350 370 425 mV 300 mV setting VODPP 250 260 300 mV 200 mV setting VODPP 150 160 185 mV 100 mV setting TOSKEW — 8 15 ps — Common mode voltage1 Rise time2 Fall time2 Differential peak-topeak amplitude Transmit lane P to N skew3 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 59 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition Lane to lane transmit skew4 TLLSKEW — — 75 ps Single PLL, 2–4 bonded lanes, 8–40-bit fabric width10 — — 8 UI Single PLL, 2–4 bonded lanes, 64–80-bit fabric width11 — — 8 + Refclk skew UI Multiple PLL, 2–4 bonded lanes, 8–40-bit fabric width11, 12 — — 32 + Refclk skew UI Multiple PLL, 2–4 bonded lanes, 64–80-bit fabric width11, 12 Electrical idle transition TTxEITrEntry — entry time7 — 20 ns — Electrical idle transition TTxEITrExit exit time7 — — 19 ns — Electrical idle amplitude VTxEIpp — — 7 mV — TXPLL lock time TTXLock — — 1600 PFD cycles — Digital PLL lock time8 TDPLLLock — — 75,000 REFCLK UIs Frequency lock — — 150,000 REFCLK UIs Phase lock — — 0.22 UI 0.1 UI Data rate ≥10.3125 Gbps to 12.7 Gbps9 (Tx VCO rate 5.16 GHz to 6.35 GHz) Total jitter5, 6, 13 Deterministic jitter5, 6 TJ TDJ TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.28 UI 0.1 UI Data rate ≥10.3125 to 12.7 Gbps9 (Tx VCO rate 5.16 GHz to 6.35 GHz) TxPLL in fractional mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.22 UI 0.09 UI Data rate ≥8.5 Gbps to 10.3125 Gbps (Tx VCO rate 4.25 GHz to 5.16 GHz) TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ TDJ — — 0.28 UI 0.09 UI Data rate ≥8.5 Gbps to 10.3125 Gbps (Tx VCO rate 4.25 GHz to 5.16 GHz) TxPLL in fractional mode © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 60 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition Total jitter5, 6, 13 Deterministic jitter5,6 TJ — — 0.21 UI 0.09 UI Data rate ≥5.0 Gbps to 8.5 Gbps (Tx VCO rate 2.5 GHz to 4.25 GHz) TDJ TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.25 UI 0.09 UI Data rate ≥5.0 Gbps to 8.5 Gbps (Tx VCO rate 2.5 GHz to 4.25 GHz) TxPLL in fractional mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.17 UI 0.03 UI Data rate ≥1.6 Gbps to 5.0 Gbps (Tx VCO rate 1.6 GHz to 2.5 GHz) TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.2 UI 0.03 UI Data rate ≥1.6 Gbps to 5.0 Gbps (Tx VCO rate 1.6 GHz to 2.5 GHz) TxPLL in fractional mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.08 UI 0.02 UI Data rate ≥ 800 Mbps to 1.6 Gbps (Tx VCO rate 1.6 GHz) TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.11 UI 0.02 UI Data rate ≥ 800 Mbps to 1.6 Gbps (Tx VCO rate 1.6 GHz) TxPLL in fractional mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ — — TDJ 0.05 UI 0.01 UI Data rate = 250 Mbps to 800 Mbps (Tx VCO rate 1.48 GHz to 1.6 GHz) TxPLL in integer mode Total jitter5, 6, 13 Deterministic jitter5, 6 TJ TDJ — — 0.06 UI 0.01 UI Data rate = 250 Mbps to 800 Mbps (Tx VCO rate 1.48 GHz to 1.6 GHz) TxPLL in fractional mode 1. 2. 3. 4. 5. 6. 7. 8. Increased DC Common mode settings above 50% reduce allowed VOD output swing capabilities. Adjustable through transmit emphasis. With estimated package differences. Single PLL applies to all four lanes in the same quad location with the same TxPLL. Multiple PLL applies to N lanes using multiple TxPLLs from different quad locations. Improved jitter characteristics for a specific industry standard are possible in many cases due to improved reference clock or higher VCO rate used. Tx jitter is specified with all transmitters on the device enabled, a 10–12-bit error rate (BER) and Tx data pattern of PRBS7. From the PMA mode, the TX_ELEC_IDLE port to the XVCR TXP/N pins. FTxRefClk = 75 MHz with typical settings. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 61 AC Switching Characteristics 9. 10. 11. 12. 13. 14. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. Transmit alignment in this case will automatically align upon the Tx PLL obtaining lock. For details on transmit alignment, see UG0677: PolarFire FPGA Transceiver User Guide. In order to obtain the required alignment for these configurations, an FPGA fabric Tx alignment circuit must be implemented. For details on transmit alignment, see UG0677: PolarFire FPGA Transceiver User Guide. Refclk skew is the amount of skew between the reference clocks of the two PLL. Jitter decomposition can be found in the protocol characterization reports. Tx total jitter (Tj) is quoted for reference clock rise and fall times as specified in Table 5-30. PolarFire Transceiver Reference Clock AC Requirements. If increased Tj is acceptable, the maximum reference clock input rise/fall times may be increased beyond the maximum specification shown in Table 5-30. PolarFire Transceiver Reference Clock AC Requirements when using single-ended configurations (LVCMOS and LVTTL) a. b. c. 5.4.5 Tj increases by 8% for 0.5 ns < TRISE/TFALL ≤ 2.0 ns Tj increases by 25% for 2.0 ns < TRISE/TFALL ≤ 5.0 ns Tj increases by 35% for 0.5 ns < TRISE/TFALL ≤ 5.0 ns Receiver Performance The following table describes performance of the receiver. Table 5-37. PolarFire Transceiver Receiver Characteristics Parameter Symbol Min Typ Max Unit Condition Input voltage range VIN 0 — VDDA + 0.3 V — Differential peak-to-peak amplitude VIDPP 140 — 1250 mV — Differential termination VITERM 68 85 102 Ω 85Ω setting 80 100 120 Ω 100Ω setting 120 150 180 Ω 150Ω setting Common mode voltage VICMDC 1 0.7 × VDDA — 0.9 × VDDA V DC coupled Exit electrical idle detection time TEIDET — 50 100 ns — Run length of consecutive identical digits (CID) CID — — 200 UI — CDR PPM tolerance2 CDRPPM — — 1.17 %UI — © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 62 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition CDR lock-todata time13 TLTD 512 * CDRREFDIV — 1024 * CDRREFDIV CDRREFCLK cycles Disabled: Enhanced Receiver Management 14 (1900/TCDRREF — + (512 + (1020 * (WXCVRFABRX/ CDRFBDIV)) * CDRREFDIV) (5200/TCDRREF — + (1024 + (6380 * (WXCVRFABRX/ CDRFBDIV)) * CDRREFDIV) Enabled: Enhanced Receiver Management 14 CDR lock-toref time13 TLTF (1000/ TCDRREF) + (1024 * CDRREFDIV) — (13000/ TCDRREF) + (1536 * CDRREFDIV) CDRREFCLK cycles — High-gain lock time THGLT 10.8 — — ns For Burst Mode Receiver (BMR) High-gain state time12 THGSTATE — — 3264 ns For Burst Mode Receiver (BMR) Loss-of-signal detect (peak detect range setting= high)9,10 VDETHIGH 145 — 295 mV Setting = 3 155 — 340 mV Setting = 4 180 — 365 mV Setting = 5 195 — 375 mV Setting = 6 210 — 385 mV Setting = 7 65 — 175 mV Setting = PCIe3, 7 95 — 190 mV Setting = SATA4, 8 75 — 170 mV Setting = 1 95 — 185 mV Setting = 2 100 — 190 mV Setting = 3 140 — 210 mV Setting = 4 155 — 240 mV Setting = 5 165 — 245 mV Setting = 6 170 — 250 mV Setting = 7 Loss-of-signal detect (peak detect range setting= VDETLOW low)9,10 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 63 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition Sinusoidal jitter tolerance TSJTOL 0.34 — — UI >8.5 Gbps – 12.7 Gbps5, 11 0.43 — — UI >8.0–8.5 Gbps5 0.45 — — UI >3.2–8.0 Gbps5 0.45 — — UI >1.6 to 3.2 Gbps5 0.42 — — UI >0.8 to 1.6 Gbps5 0.41 — — UI 250 to 800 Mbps5 0.65 — — UI 3.125 Gbps5 0.65 — — UI 6.25 Gbps6 0.7 — — UI 10.3125 Gbps6 0.7 — — UI 12.7 Gbps6, 11 0.1 — — UI 3.125 Gbps5 0.05 — — UI 6.25 Gbps6 0.05 — — UI 10.3125 Gbps6 0.05 — — UI 12.7 Gbps6, 11 CTLE DC gain — (all stages, max settings) 0.1 — 10 dB — CTLE AC gain — (all stages, max settings) 0.05 — 16 dB — DFE AC gain (per 5 stages, max settings) — 0.05 — 7.5 dB — Auto adaptive calibration time (CTLE) TCTLE 12 — 45 ms — Auto adaptive calibration time (CTLE+DFE) TCTLE+DFE — 1.4 — s — Total jitter tolerance with stressed eye Sinusoidal jitter tolerance with stressed eye TTJTOLSE TSJTOLSE © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 64 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Condition Enhanced receiver management control clock input (CTRL_CLK) FERMCTRLCLK 38.4 40 41.6 MHz — 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. Valid at 3.2 Gbps and below. Data vs Rx reference clock frequency. Achieves compliance with PCIe electrical idle detection. Achieves compliance with SATA OOB specification. Rx jitter values based on bit error ratio (BER) of 10–12, AC-coupled input with 400 mV VID, all stages of Rx CTLE enabled, DFE disabled, 80 MHz sinusoidal jitter injected to Rx data. Rx jitter values based on bit error ratio (BER) of 10–12, AC-coupled input with 400 mV VID, all stages of Rx CTLE enabled, DFE enabled, 80 MHz sinusoidal jitter injected to Rx data. For PCIe: Low Threshold Setting = 0, High Threshold Setting = 2. For SATA: Low Threshold Setting = 2, High Threshold Setting = 3. Loss of signal is valid for data rates of 1 Gbps to 5 Gbps for PRBS7 (8B/10B) or PRBS31 (64b/6xb) data formats. It is also valid for detection of SATA out-of-band signals at data rates up to 6 Gbps. If the default settings for the low threshold (0x0) and high threshold (0x2) using the low range option for the peak detector are used, then the Rx VAmplitude pk-pk (outside of data eye) at the receiver input package pins must be a minimum of 300 mV for short reach (6.5 dB insertion loss at 5 GHz) applications, 350 mV for medium reach (17.0 dB insertion loss at 5 GHz) applications, and 450 mV for long reach (25.0 dB insertion loss at 5 GHz) applications—generally the settings are less limiting than what is required for good BER operation of the SerDes. Note that if the option to force CDR Lock2Ref upon Rx Idle is set (default at data rates of 5 Gbps and below), this minimum VAmplitude pk-pk must be enforced for proper CDR operation. Detect values measured at 1.5 Gbps with PRBS7 data pattern. For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. THGSTATE is based on the condition where the CDR was in lock (to reference or data) for at least 5.2 μs before moving to the high-gain state. At this point, if the receive data is outside the ppm tolerance of the CDR, the CDR will unlock after the time specified by the parameter. The following definitions apply: a. TCDRREF is the transceiver CDR reference clock period in nanoseconds. b. WXCVRFABRX is the parallel interface width of the transceiver receive fabric interface. c. CDRFBDIV is the feedback divider of the transceiver. d. CDRCDRREFDIV is the reference divider of the transceiver CDR. 14. For details on the Enhanced Receiver Management feature, refer to the PolarFire FPGA and PolarFire SoC FPGA Transceiver User Guide. 5.4.6 Transceiver and Receiver Return Loss Characteristics This section describes transmitter and receiver return loss characteristics compliant with OIF-CEI-03.1. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 65 AC Switching Characteristics Figure 5-4. Differential Return Loss Table 5-38. Differential Return Loss Parameter Value Unit A0 –8 dB f0 100 MHz f1 (3/4) * T_Baud Hz f2 T_Baud Hz Slope 16.6 dB/dec Figure 5-5. Common Mode Return Loss © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 66 AC Switching Characteristics Table 5-39. Common Mode Return Loss 5.5 Parameter Value Unit A0 –6 dB f0 100 MHz f1 (3/4) * T_Baud Hz Transceiver Protocol Characteristics The following section describes transceiver protocol characteristics. 5.5.1 PCI Express The following tables describe the PCI express. Table 5-40. PCI Express Gen1 Parameter Data Rate Min Max Unit Total transmit jitter 2.5 Gbps — 0.25 UI Receiver jitter tolerance 2.5 Gbps 0.4 — UI Note: With add-in card, as specified in PCI Express CEM Rev 2.0. Table 5-41. PCI Express Gen2 Parameter Data Rate Min Max Unit Total transmit jitter 5.0 Gbps — 0.35 UI Receiver jitter tolerance 5.0 Gbps 0.4 — UI Note: With add-in card as specified in PCI Express CEM Rev 2.0. 5.5.2 Interlaken The following table describes Interlaken. Table 5-42. Interlaken Parameter Data Rate Min Max Unit Total transmit jitter 6.375 Gbps — 0.3 UI 10.3125 Gbps — 0.3 UI 12.7 Gbps1, 2 — 0.3 UI 6.375 Gbps 0.6 — UI 10.3125 Gbps 0.65 — UI 12.7 Gbps1, 2 0.65 — UI Receiver jitter tolerance © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 67 AC Switching Characteristics 1. 2. 5.5.3 For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. Supported on –1 speed grade only. 10GbE (10GBASE-R and 10GBASE-KR) The following table describes 10GbE (10GBASE-R). Table 5-43. 10GbE (10GBASE-R) Parameter Data Rate Min Max Unit Total transmit jitter 10.3125 Gbps — 0.28 UI Receiver jitter tolerance 10.3125 Gbps 0.7 — UI The following table describes 10GbE (10GBASE-KR). Table 5-44. 10GbE (10GBASE-KR) Parameter Data Rate Min Max Unit Total transmit jitter 10.3125 Gbps — 0.28 UI Receiver jitter tolerance (SJ) 10.3125 Gbps 0.115 — UI Receiver jitter tolerance (RJ) 10.3125 Gbps 0.13 — UI Receiver jitter tolerance (DCD) 10.3125 Gbps 0.035 — UI The following table describes 10GbE (XAUI). Table 5-45. 10GbE (XAUI) Parameter Data Rate Min Max Unit Total transmit jitter (near end) 3.125 Gbps — 0.35 UI Total transmit jitter (far end) — — 0.55 UI Receiver jitter tolerance 3.125 Gbps 0.65 — UI The following table describes 10GbE (RXAUI). Table 5-46. 10GbE (RXAUI) 5.5.4 Parameter Data Rate Min Max Unit Total transmit jitter (near-end) 6.25 Gbps — 0.35 UI Total transmit jitter (far-end) 6.25 Gbps — 0.55 UI Receiver jitter tolerance 6.25 Gbps 0.65 — UI 1GbE (1000BASE-X) The following table describes 1GbE (1000BASE-X). Table 5-47. 1GbE (1000BASE-X) Parameter Data Rate Min Max Unit Total transmit jitter 1.25 Gbps — 0.24 UI © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 68 AC Switching Characteristics ...........continued 5.5.5 Parameter Data Rate Min Max Unit Receiver jitter tolerance 1.25 Gbps 0.749 — UI Parameter Data Rate Min Max Unit Total transmit jitter 1.25 Gbps — 0.24 UI Receiver jitter tolerance 1.25 Gbps 0.749 — UI SGMII and QSGMII The following table describes SGMII. Table 5-48. SGMII The following table describes QSGMII. Table 5-49. QSGMII 5.5.6 Parameter Data Rate Min Max Unit Total transmit jitter 5.0 Gbps — 0.3 UI Receiver jitter tolerance 5.0 Gbps 0.65 — UI CPRI The following table describes CPRI. Table 5-50. CPRI Parameter Data Rate Min Max Unit Total transmit jitter 0.6144 Gbps — 0.35 UI 1.2288 Gbps — 0.35 UI 2.4576 Gbps — 0.35 UI 3.0720 Gbps — 0.35 UI 4.9152 Gbps — 0.3 UI 6.1440 Gbps — 0.3 UI 8.11008 Gbps — 0.335 UI 9.8304 Gbps — 0.335 UI © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 69 AC Switching Characteristics ...........continued 5.5.7 Parameter Data Rate Min Max Unit Receive jitter tolerance 0.6144 Gbps 0.75 — UI 1.2288 Gbps 0.75 — UI 2.4576 Gbps 0.75 — UI 3.0720 Gbps 0.75 — UI 4.9152 Gbps 0.7 — UI 6.1440 Gbps 0.7 — UI 8.11008 Gbps 0.7 — UI 9.8304 Gbps 0.7 — UI JESD204B The following table describes JESD204B. Table 5-51. JESD204B Parameter Data Rate Min Max Unit Total transmit jitter 3.125 Gbps — 0.35 UI 6.25 Gbps — 0.3 UI 12.5 Gbps1, 2 — 0.3 UI 3.125 Gbps 0.56 — UI 6.25 Gbps 0.6 — UI 12.5 Gbps1, 2 0.7 — UI Receive jitter tolerance 1. 2. 5.5.8 For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. Supported on –1 speed grade only. Display Port The following table describes Display Port. Table 5-52. Display Port Parameter Data Rate Condition Min Max Unit Total transmit jitter 1.62 Gbps Test point: TP2 — 0.27 UI 2.7 Gbps Test point: TP2 — 0.42 UI 5.4 Gbps Test point: TP3_EQ — 0.621 UI 8.1 Gbps Test point: TP3_CTLE — 0.47 UI © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 70 AC Switching Characteristics ...........continued Parameter Data Rate Condition Min Max Unit Total receive jitter tolerance 1.62 Gbps SJ at 20 MHz 0.747 — UI 2.7 Gbps SJ at 100 MHz 0.491 — UI 5.4 Gbps SJ at 10 MHz 0.636 — UI SJ at 100 MHz 0.62 — UI SJ at 15 MHz 0.62 — UI 8.1 Gbps 1. 5.5.9 Total transmit jitter includes 0.04 UI from cable crosstalk effect. Serial RapidIO The following table describes Serial RapidIO. Table 5-53. Serial RapidIO Parameter Data Rate Condition Min Max Unit Total transmit jitter 1.25 Gbps — — 0.35 UI 2.5 Gbps — — 0.35 UI 3.125 Gbps — — 0.35 UI 5.0 Gbps — — 0.3 UI 6.25 Gbps — — 0.3 UI 10.3125 Gbps — — 0.28 UI 1.25 Gbps — 0.65 — UI 2.5 Gbps — 0.65 — UI 3.125 Gbps — 0.65 — UI 5.0 Gbps Short reach 0.6 — UI Long reach 0.95 — UI Short reach 0.6 — UI Long reach 0.95 — UI Short reach 0.62 — UI Receive jitter tolerance 6.25 Gbps 10.3125 Gbps 5.5.10 SDI The following table describes SDI. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 71 AC Switching Characteristics Table 5-54. SDI Parameter Data Rate Condition Min Max Unit Total transmit jitter 270 Mbps Timing jitter (10 Hz–27 MHz) — 0.2 UI Alignment jitter (1 — KHz–27 MHz) 0.2 UI Timing jitter (10 Hz–148.5 MHz) — 1.0 UI Alignment jitter (100 KHz–148.5 MHz) — 0.2 UI Timing jitter (10 Hz–297 MHz) — 2.0 UI Alignment jitter (100 KHz–297 MHz) — 0.3 UI Timing jitter (10 Hz–594 MHz) — 2.0 UI Alignment jitter (100 KHz–594 MHz) — 0.3 UI Timing jitter (10 Hz–1188 MHz) — 2.0 UI Alignment jitter (100 KHz–1188 MHz) — 0.3 UI 270 Mbps Alignment jitter 0.2 — UI 1.485 Gbps Alignment jitter 0.2 — UI 2.97 Gbps Alignment jitter 0.3 — UI 5.94 Gbps Alignment jitter 0.3 — UI 11.88 Gbps Alignment jitter 0.3 — UI 1.485 Gbps 2.97 Gbps 5.94 Gbps 11.88 Gbps Receive jitter tolerance 5.5.11 OTN The following table describes OTN. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 72 AC Switching Characteristics Table 5-55. OTN Parameter Data Rate Condition Min Max Unit Total transmit jitter 2.66 Gbps 3 dB BW: 5 KHz to 20 MHz — 0.3 UI 3 dB BW: 1 MHz to 20 MHz — 0.1 UI 3 dB BW: 20 KHz to 80 MHz — 0.3 UI 3 dB BW: 4 MHz to 80 MHz — 0.1 UI 3 dB BW: 20 KHz to 80 MHz — 0.3 UI 3 dB BW: 4 MHz to 80 MHz — 0.1 UI SJ at 5 KHz 1.5 — UI SJ at 20 MHz 0.15 — UI SJ at 20 KHz 1.5 — UI SJ at 80 MHz 0.15 — UI SJ at 20 KHz 1.5 — UI SJ at 80 MHz 0.15 — UI 10.70 Gbps2 11.09 Gbps1 Receive jitter tolerance 2.66 Mbps 10.70 Gbps2 11.09 Gbps1, 2 1. 2. 5.5.12 For data rates greater than 10.3125 Gbps, VDDA must be set to 1.05V mode. See supply tolerance in the section Recommended Operating Conditions. Supported on –1 speed grade only. Fiber Channel The following table describes Fiber Channel. Table 5-56. Fiber Channel Parameter Data Rate Condition Min Max Unit Total transmit jitter 1.0625 Gbps — — 0.23 UI 2.125 Gbps — — 0.33 UI 4.25 Gbps — — 0.52 UI 8.5 Gbps — — 0.31 UI 1.0625 Gbps 0.68 — — UI 2.125 Gbps 0.62 — — UI 4.24 Gbps 0.62 — — UI 8.5 Gbps 0.71 — — UI Receive jitter tolerance 5.5.13 HiGig and HiGig+ The following table describes HiGig and HiGig+. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 73 AC Switching Characteristics Table 5-57. HiGig and HiGig+ Parameter Data Rate Condition Min Max Unit Total transmit jitter 3.75 Gbps Near-end — 0.35 UI 3.75 Gbps Far-end — 0.55 UI 3.75 Gbps — 0.65 — UI Receive jitter tolerance 5.5.14 HiGig II The following table describes HiGig II. Table 5-58. HiGig II Parameter Data Rate Condition Min Max Unit Total transmit jitter 6.875 Gbps Near-end — 0.35 UI 6.875 Gbps Far-end — 0.55 UI 6.875 Gbps — 0.65 — UI Receive jitter tolerance 5.5.15 Firewire IEEE 1394 The following table describes FireWire IEEE 1394. Table 5-59. FireWire IEEE 1394 Parameter Data Rate Condition Min Max Unit Total transmit jitter 196.608 Mbps S200 Near-end1 — 200 ps 393.22 Mbps S400 Near-end2 — 516 ps 786.43 Mbps S800 Near-end2, 3 — 200 ps 196.608 Mbps S2001 500 — ps 393.22 Mbps S4002 1025 — ps 786.43 Mbps S8002 375 — ps Receive jitter tolerance 1. 2. 3. 5.5.16 DS mode. Beta mode. PolarFire complies with 1394 S800 electrical requirements with the exception of Tx eye requirement. Refer to the FireWire characterization report on the PolarFire documentation page for more details. SLVS-EC The following table describes SLVS-EC. Table 5-60. SLVS-EC Parameter Data Rate Condition Total transmit jitter 2.376 Gbps — © 2021 Microchip Technology Inc. and its subsidiaries Datasheet Min Max Unit 0.4 ps DS00003831B-page 74 AC Switching Characteristics ...........continued 5.6 Parameter Data Rate Condition Min Max Unit Receive jitter tolerance 2.376 Gbps 0.15 SJ at 2 MHz 0.5 — ps 5.0 Gbps 0.15 SJ at 4 MHz 0.5 — ps Non-Volatile Characteristics The following section describes non-volatile characteristics. 5.6.1 FPGA and μPROM Programming Cycle and Retention The following table describes FPGA and μPROM programming cycle and retention characteristics. Programming, zeroization, and verify operations all count as a programming cycle. Retention characteristics for Military-grade devices and Automotive-grade devices at the absolute maximum junction temperature of 125 °C can be profiled using the PolarFire Retention Calculator, which can be obtained through technical support at www.microchip.com/support. Table 5-61. FPGA and μPROM Programming Cycles vs. Retention Characteristics Programming TJ Programming Cycles, Max Retention Years Retention Years at TJ 0 °C to 85 °C 1000 20 85 °C 0 °C to 100 °C 500 20 100 °C –20 °C to 100 °C 500 20 100 °C –40 °C to 100 °C 500 20 100 °C –40 °C to 85 °C 1000 16 100 °C –40 °C to 55 °C 2000 12 100 °C –40 °C to 100 °C 500 20 100 °C –40 °C to 100 °C 500 10 110 °C –40 °C to 100 °C 500 Note 2 125 °C Notes: 1. 2. 5.6.2 Power supplied to the device must be valid during programming operations such as programming and verify. Programming recovery mode is available only for in-application programming mode and requires an external SPI Flash. Contact technical support at www.microchip.com/support. FPGA Programming Time The following tables describe FPGA programming time. For allowable programming junction temperature (TJ), see previous table FPGA and μPROM Programming Cycles vs. Retention Characteristics. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 75 AC Switching Characteristics Table 5-62. SPI Initiator and Auto-Update Programming Time (IAP) Parameter Symbol Devices Typ Max Unit Programming time TPROG MPF100T, TL, TS, TLS 17 25 s MPF200T, TL, TS, TLS 17 25 s MPF300T, TL, TS, TLS 26 32 s MPF500T, TL, TS, TLS 31 37 s Table 5-63. SPI Target Programming Time Parameter Symbol Devices Typ Max Unit Programming time TPROG MPF100T, TL, TS, TLS1 27 33 s MPF200T, TL, TS, TLS1 41 50 s MPF300T, TL, TS, TLS1 50 60 s MPF500T, TL, TS, TLS1 90 108 s 1. 2. SmartFusion2 as SPI Initiator with MSS running at 100 MHz, MSS_SPI_0 port running at 6.67 MHz. Bitstream stored in DDR. DirectC version 4.1. Programmer: FlashPro5 with TCK 10 MHz. PC Configuration: Intel i7 at 3.6 GHz, 32 GB RAM, Windows 10. Table 5-64. JTAG Programming Time Parameter Symbol Devices Typ Max Unit Programming time TPROG MPF100T, TL, TS, TLS1 35 42 s MPF200T, TL, TS, TLS1 56 68 s MPF300T, TL, TS, TLS1 95 114 s MPF500T, TL, TS, TLS1 122 147 s 1. 5.6.3 Programmer: FlashPro5 with TCK 10 MHz. PC Configuration: Intel i7 at 3.6 GHz, 32 GB RAM, Windows 10. FPGA Bitstream Sizes The following table describes FPGA bitstream sizes. Table 5-65. Initialization Client Sizes Device Plaintext Ciphertext MPF100T, TL, TS, TLS 1580 KB 1630 KB MPF200T, TL, TS, TLS 2916 KB 3006 KB MPF300T, TL, TS, TLS 4265 KB 4403 KB MPF500T, TL, TS, TLS 6835 KB 7045 KB Note: Worst case initializing all fabric LSRAM, USRAM, and UPROM. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 76 AC Switching Characteristics Table 5-66. Bitstream Sizes 5.6.4 File Devices FPGA Security SNVM (all pages) FPGA+ SNVM FPGA+ Sec SNVM+ Sec FPGA+ SNVM+ Sec SPI MPF100T, TL, TS, TLS 3.4 MB 3.5 KB 59.7 KB 3.5 MB 3.5 MB 62.2 KB 3.5 MB DAT MPF100T, TL, TS, TLS 3.4 MB 7.6 KB 61.2 KB 3.5 MB 3.4 MB 66.3 KB 3.5 MB SPI MPF200T, TL, TS, TLS 5.9 MB 3.5 KB 59.7 KB 5.9 MB 5.9 MB 62.2 KB 6.0 MB DAT MPF200T, TL, TS, TLS 5.9 MB 7.6 KB 61.2 KB 6.0 MB 5.9 MB 66.3 KB 6.0 MB SPI MPF300T, TL, TS, TLS 9.3 MB 3.5 KB 59.7 KB 9.6 MB 9.5 MB 62.2 KB 9.6 MB DAT MPF300T, TL, TS, TLS 9.3 MB 7.6 KB 61.2 KB 9.6 MB 9.5 MB 66.3 KB 9.6 MB SPI MPF500T, TL, TS, TLS 14.3 MB 3.5 KB 59.7 KB 14.4 MB 14.3 MB 62.2 KB 14.4 MB DAT MPF500T, TL, TS, TLS 14.3 MB 7.6 KB 61.2 KB 14.4 MB 14.3 MB 66.3 KB 14.4 MB Digest Cycles Digests verify the integrity of the programmed non-volatile data. Digests are a cryptographic hash of various data areas. Any digest that reports back an error raises the digest tamper flag. Digests are operational only from –40 °C to 100 °C. Table 5-67. Maximum Number of Digest Cycles Retention Since Programmed (N = Number Digests During that Time)1 Storage and N ≤300 N = 500 Operating TJ N = 1000 N = 1500 N = 2000 N = 4000 N = 6000 Unit Retention –40 to 100 20 × LF 17 × LF 12 × LF 10 × LF 8 × LF 4 × LF 2 × LF °C Years 0 to 100 20 × LF 17 × LF 12 × LF 10 × LF 8 × LF 4 × LF 2 × LF °C Years –40 to 85 20 × LF 20 × LF 20 × LF 20 × LF 16 × LF 8 × LF 4 × LF °C Years –40 to 55 20 × LF 20 × LF 20 × LF 20 × LF 20 × LF 20 × LF 20 × LF °C Years –40 to 110 10 × LF 8.5 × LF 6 × LF 5 × LF 4 × LF 2 × LF 1 × LF °C Years –40 to 125 Note 2 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 77 AC Switching Characteristics ...........continued Retention Since Programmed (N = Number Digests During that Time)1 Storage and N ≤300 N = 500 Operating TJ N = 1000 N = 1500 N = 2000 N = 4000 N = 6000 Unit Retention –55 to 110 10 × LF 6 × LF 5 × LF 4 × LF 2 × LF 1 × LF °C Years –55 to 125 Note 2 1. 2. 8.5 × LF LF = Lifetime Factor as defined by the number of programming cycles the device has seen under the conditions listed in the following table. Contact technical support at www.microchip.com/support. Table 5-68. FPGA Programming Cycles Lifetime Factor Programming TJ Programming Cycles LF –40 °C to 100 °C 500 1 –40 °C to 85 °C 1000 0.8 –40 °C to 55 °C 2000 0.6 Notes: • • • • • • • 5.6.5 The maximum number of accumulated device digest cycles is 100K. The maximum number of digests is 10K cycles between programming non-volatile data (fabric sNVM, user keys, user locks, and so on). Digests are operational only over the –40 °C to 100 °C temperature range. After a program cycle, an additional N digests cycles are allowed with the resultant retention characteristics for the total operating and storage temperature shown. Retention is specified for total device storage and operating temperature. All temperatures are junction temperatures (TJ). Example 1: 500 digests cycles are performed between programming cycles. N = 500. The operating conditions are –40 °C to 85 °C TJ. 501 programming cycles have occurred. The retention under these operating conditions is 20 × LF = 20 × .8 = 16 years. Example 2: One programming cycle has occurred, N = 1500 digest cycles have occurred. Temperature range is –40 °C to 100 °C. The resultant retention is 10 × LF or 10 years over the industrial temperature range. Digest Time The following table describes digest time. Table 5-69. Digest Times Parameter Devices Typ Max Unit Setup time All 2 — μs Fabric digest run time MPF100T, TL, TS, TLS 880 910 ms MPF200T, TL, TS, TLS 1005 1072 ms MPF300T, TL, TS, TLS 1503.9 1582 ms MPF500T, TL, TS, TLS 2085 2150 ms © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 78 AC Switching Characteristics ...........continued Parameter Devices Typ Max Unit UFS CC digest run time MPF100T, TL, TS, TLS 33.5 35 μs MPF200T, TL, TS, TLS 33.5 35 μs MPF300T, TL, TS, TLS 33.5 35 μs MPF500T, TL, TS, TLS 33.5 35 μs MPF100T, TL, TS, TLS 4.5 5 ms MPF200T, TL, TS, TLS 4.5 5 ms MPF300T, TL, TS, TLS 4.5 5 ms MPF500T, TL, TS, TLS 4.5 5 ms MPF100T, TL, TS, TLS 47 49 μs MPF200T, TL, TS, TLS 47 49 μs MPF300T, TL, TS, TLS 47 49 μs MPF500T, TL, TS, TLS 47 49 μs MPF100T, TL, TS, TLS 526 544 μs MPF200T, TL, TS, TLS 526 544 μs MPF300T, TL, TS, TLS 526 544 μs MPF500T, TL, TS, TLS 526 544 μs MPF100T, TL, TS, TLS 33.2 35 μs MPF200T, TL, TS, TLS 33.2 35 μs MPF300T, TL, TS, TLS 33.2 35 μs MPF500T, TL, TS, TLS 33.2 35 μs MPF100T, TL, TS, TLS 494 511 μs MPF200T, TL, TS, TLS 494 511 μs MPF300T, TL, TS, TLS 494 511 μs MPF500T, TL, TS, TLS 494 511 μs sNVM digest run time1 UFS UL digest run time User key digest run time2 UFS UPERM digest run time Factory digest run time 1. 2. The entire sNVM is used as ROM. Valid for user key 0 through 6. Note: These times do not include the power-up to functional timing overhead when using digest checks on power-up. 5.6.6 Zeroization Time This section describes zeroization time. A zeroization operation counts as one programming cycle. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 79 AC Switching Characteristics Table 5-70. Zeroization Times for MPF100T, TL, TS, and TLS Devices Parameter Typ Max Unit Conditions Time to enter zeroization 8 Time to destroy the fabric data1 ms Zip flag set 248 253 ms Data erased Time to destroy data in non-volatile memory (like new)1, 2 507 522 ms One iteration of scrubbing Time to destroy data in non-volatile memory (non-recoverable)1, 3 520 536 ms One iteration of scrubbing Time to scrub the fabric data1 0.8 0.9 s Full scrubbing Time to scrub the pNVM data (like new)1, 2 1.5 1.6 s Full scrubbing Time to scrub the fabric data pNVM data (non-recoverable)1, 3 1.7 1.8 s Full scrubbing Time to verify5 1.1 1.2 s — Total time to zeroize (like new)1, 2 2.8 2.9 s — Total time to zeroize (non-recoverable)1, 3 3.1 3.2 s — 1. 2. 3. 4. 9 Total completion time after entering zeroization. Like new mode—zeroizes user design security setting and sNVM content. Non-recoverable mode—zeroizes user design security setting, sNVM and factory keys, and factory data required for programming. Time to verify after scrubbing completes. Table 5-71. Zeroization Times for MPF200T, TL, TS, and TLS Devices Parameter Typ Max Unit Conditions Time to enter zeroization 8 Time to destroy the fabric data1 ms Zip flag set 250 255 ms Data erased Time to destroy data in non-volatile memory (like new)1, 2 507 522 ms One iteration of scrubbing Time to destroy data in non-volatile memory (non-recoverable)1, 3 520 536 ms One iteration of scrubbing Time to scrub the fabric data1 0.9 1.0 s Full scrubbing Time to scrub the pNVM data (like new)1, 2 1.5 1.6 s Full scrubbing Time to scrub the fabric data PNVM data (non-recoverable)1, 3 1.7 1.8 s Full scrubbing Time to verify5 1.4 1.5 s — Total time to zeroize (like new)1, 2 2.9 3.0 s — Total time to zeroize (non-recoverable)1, 3 3.1 3.2 s — 1. 2. 3. 4. 9 Total completion time after interning zeroization. Like new mode—zeroizes user design security setting and sNVM content. Non-recoverable mode—zeroizes user design security setting, sNVM and factory keys, and factory data required for programming. Time to verify after scrubbing completes. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 80 AC Switching Characteristics Table 5-72. Zeroization Times for MPF300T, TL, TS, and TLS Devices Parameter Typ Max Unit Conditions Time to enter zeroization 8 Time to destroy the fabric data1 ms Zip flag set 390 420 ms One iteration of scrubbing Time to destroy data in non-volatile memory (like new)1, 2 507 522 ms One iteration of scrubbing Time to destroy data in non-volatile memory (non- recoverable)1, 3 520 536 ms One iteration of scrubbing Time to scrub the fabric data1 1.3 1.4 s Full scrubbing Time to scrub the pNVM data (like new)1, 2 1.5 1.6 s Full scrubbing Time to scrub the fabric data pNVM data (non-recoverable)1, 3 1.7 1.8 s Full scrubbing Time to verify5 1.8 1.9 s — Total time to zeroize (like new)1, 2 3.7 3.8 s — Total time to zeroize (non-recoverable)1, 3 3.9 4 s — 1. 2. 3. 4. 9 Total completion time after interning zeroization. Like new mode—zeroizes user design security setting and sNVM content. Non-recoverable mode—zeroizes user design security setting, sNVM and factory keys, and factory data required for programming. Time to verify after scrubbing completes. Table 5-73. Zeroization Times for MPF500T, TL, TS, and TLS Devices Parameter Typ Max Unit Conditions Time to enter zeroization 8 Time to destroy the fabric data1 ms Zip flag set 392 422 ms One iteration of scrubbing Time to destroy data in non-volatile memory (like new)1, 2 507 522 ms One iteration of scrubbing Time to destroy data in non-volatile memory (non-recoverable)1, 3 520 536 ms One iteration of scrubbing Time to scrub the fabric data1 1.4 1.5 s Full scrubbing Time to scrub the pNVM data (like new)1, 2 1.5 1.6 s Full scrubbing Time to scrub the fabric data pNVM data (non-recoverable)1, 3 1.7 1.8 s Full scrubbing Time to verify5 1.9 2.0 s — Total time to zeroize (like new)1, 2 3.8 3.9 s — Total time to zeroize (non-recoverable)1, 3 4.0 4.1 s — 1. 2. 3. 4. 9 Total completion time after entering zeroization. Like new mode—zeroizes user design security setting and sNVM content. Non-recoverable mode—zeroizes user design security setting, sNVM and factory keys, and factory data required for programming. Time to verify after scrubbing completes. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 81 AC Switching Characteristics 5.6.7 Verify Time The following tables describe verify time. Table 5-74. Standalone Fabric Verify Times Parameter Devices Max Unit Standalone verification over JTAG MPF100T, TL, TS, TLS1 33 s MPF200T, TL, TS, TLS1 53 s MPF300T, TL, TS, TLS1 90 s MPF500T, TL, TS, TLS1 114 s MPF100T, TL, TS, TLS2 24 s MPF200T, TL, TS, TLS2 37 s MPF300T, TL, TS, TLS2 55 s MPF500T, TL, TS, TLS2 89 s Standalone verification over SPI 1. 2. Programmer: FlashPro5, TCK 10 MHz; PC configuration: Intel i7 at 3.6 GHz, 32 GB RAM, Windows 10. SmartFusion2 with MSS running at 100 MHz, MSS_SPI_0 port running at 6.67 MHz. Bitstream stored in DDR. DirectC version 4.1. Notes: • • • • Standalone verify is limited to 2,000 total verify hours over the industrial –40 °C to 100 °C temperature. For example, 2000 hours = 7.2M seconds. The MPF300T device has a 90-second verify time over JTAG. This equates to 80,000 verify operations for the life of the MPF300T device. Use the digest system service for verify times greater than 2,000 hours. Standalone verify checks the programming margin on both the P and N gates of the push-pull cell. Digest checks only the P side of the push-pull gate. However, the push-pull gates work in tandem. Digest check is recommended if users believe they will exceed the 2,000-hour verify time specification. Table 5-75. Verify Time by Programming Hardware Devices IAP FlashPro4 FlashPro5 BP Silicon Sculptor Units MPF100T, TL, TS, TLS 6 42 33 — — s MPF200T, TL, TS, TLS 9 67 53 — — s MPF300T, TL, TS, TLS 14 95 90 — — s MPF500T, TL, TS, TLS 15 169 114 — — s Notes: • • • FlashPro4 4 MHz TCK. FlashPro5 10 MHz TCK. PC configuration: Intel i7 at 3.6 GHz, 32 GB RAM, Windows 10. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 82 AC Switching Characteristics Table 5-76. Verify System Services Parameter Symbol ServiceID Devices Typ Max Unit In application verify by index TIAP_Ver_Index 44H MPF100T, TL, TS, TLS 5.9 6.2 s MPF200T, TL, TS, TLS 8.2 9 s MPF300T, TL, TS, TLS 12.4 13 s MPF500T, TL, TS, TLS 13.4 14 s MPF100T, TL, TS, TLS 5.9 6.2 s MPF200T, TL, TS, TLS 8.2 9 s MPF300T, TL, TS, TLS 12.4 13 s MPF500T, TL, TS, TLS 13.4 14 s In application verify by SPI address 5.6.8 TIAP_Ver_Addr 45H Authentication Time The following tables describe authentication system service time. Table 5-77. Authentication Services Parameter Symbol ServiceID Devices Typ Max Unit Bitstream Authentication TBIT_AUTH 22H MPF100T, TL, TS, TLS 2.1 2.4 s MPF200T, TL, TS, TLS 3.3 3.7 s MPF300T, TL, TS, TLS 4.9 5.4 s MPF500T, TL, TS, TLS 7.6 7.8 s MPF100T, TL, TS, TLS 2.1 2.4 s MPF200T, TL, TS, TLS 3.3 3.7 s MPF300T, TL, TS, TLS 4.9 5.4 s MPF500T, TL, TS, TLS 7.6 7.8 s IAP Image Authentication 5.6.9 TIAP_AUTH 23H Secure NVM Performance The following table describes secure NVM performance. Table 5-78. sNVM Read/Write Characteristics Parameter Symbol Min Typ Max Unit Conditions Plain text programming — 7.0 7.2 7.9 ms — Authenticated text programming — 7.2 7.4 9.4 ms — Authenticated and encrypted text programming — 7.2 7.4 9.4 ms — Authentication R/W 1st access from power-up overhead TPUF_OVHD 10 13 111 ms From TFAB_READY Plain text read — 8 8.5 9 μs — Authenticated text read — 113 114.5 119 μs — © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 83 AC Switching Characteristics ...........continued Parameter Symbol Min Typ Max Unit Conditions Authenticated and decrypted text read — 159 161 167 μs — Notes: • • • 5.6.10 Page size = 256 bytes (non-authenticated), 236 bytes (authenticated). Only page reads and writes allowed. TPUF_OVHD is an additional time that occurs on the first R/W, after cold or warm boot, to sNVM using authenticated or authenticated and encrypted text. Secure NVM Programming Cycles The following table describes secure NVM programming cycles. Table 5-79. sNVM Programming Cycles vs. Retention Characteristics Programming Temperature Programming Cycles per Page, Max Programming Cycles per Block, Max Retention Years –40 °C to 100 °C 10,000 100,000 20 –40 °C to 85 °C 10,000 100,000 20 –40 °C to 55 °C 10,000 100,000 20 –40 °C to 125 °C 10,000 100,000 Note 2 –55 °C to 125 °C 10,000 100,000 Note 2 Notes: 1. 2. 5.7 Page size = 256 bytes. Block size = 56 KBytes. Contact technical support at www.microchip.com/support. System Services This section describes system switching and throughput characteristics. 5.7.1 System Services Throughput Characteristics The following table describes system services throughput characteristics. Table 5-80. System Services Throughput Characteristics Parameter Symbol Service ID Typ Max Unit Conditions Serial number TSerial 00H 65 67 μs — User code TUser 01H 0.8 1.2 μs — Design information TDesign 02H 2.5 3 μs — Device certificate TCert 03H 255 271 ms — Read digests Tdigest_read 04H 201 215 μs — Query security locks Tsec_Query 05H 15 17 μs — Read debug information TRd_debug 06H 34 38 μs — © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 84 AC Switching Characteristics ...........continued Parameter Symbol Service ID Typ Max Unit Conditions Reserved — 07H–0FH — — — — Secure NVM write plain text TSNVM_Wr_Plain 10H — — — Note 1 Secure NVM write authenticated plain text TSNVM_Wr_Auth 11H — — — Note 1 Secure NVM write authenticated cipher text TSNVM_Wr_Cipher 12H — — — Note 1 Reserved — 13H–17H — — — — Secure NVM read TSNVM_Rd 18H — — — Note 1 Digital signature service raw TSIG_RAW 19H 174 187 ms — Digital signature service DER TSIG_DER 1AH 174 187 ms — Reserved — 1BH–1FH — — — — PUF emulation TChallenge 20H 1.8 2.0 ms — Nonce service TNonce 21H 1.2 1.5 ms — Bitstream authentication TBIT_AUTH 22H — — — Note 4 IAP Image authentication TIAP_AUTH 23H — — — Note 4 Reserved — 26H–3FH In-application programming by index TIAP_Prg_Index 42H — — — Note 2 In-application programming by SPI address TIAP_Prg_Addr 43H — — — Note 2 In-application verify by index TIAP_Ver_Index 44H — — — Note 5 In-application verify by SPI address TIAP_Ver_Addr 45H — — — Note 5 Auto update TAutoUpdate 46H — — — Note 2 Digest check Tdigest_chk 47H — — — Note 3 1. 2. 3. 4. 5. 6. 5.8 — See Table 5-78. sNVM Read/Write Characteristics. See Table 5-62. SPI Initiator and Auto-Update Programming Time (IAP). See Table 5-69. Digest Times. See Table 5-77. Authentication Services. See Table 5-76. Verify System Services. Throughputs described are measured from SS_REQ assertion to BUSY de-assertion. Fabric Macros This section describes switching characteristics of UJTAG, UJTAG_SEC, PF_SPI, system controller, and temper detectors and dynamic reconfiguration. 5.8.1 UJTAG Switching Characteristics The following section describes characteristics of UJTAG switching. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 85 AC Switching Characteristics Table 5-81. UJTAG Performance Characteristics Parameter Symbol Min Typ Max Unit Condition TCK frequency FTCK — — 25 MHz — Figure 5-6. UJTAG Timing Diagram 5.8.2 UJTAG_SEC Switching Characteristics The following table describes characteristics of UJTAG_SEC switching. Table 5-82. UJTAG Security Performance Characteristics 5.8.3 Parameter Symbol Min Typ Max Unit Condition TCK frequency FTCK — — — MHz — PF_SPI Initiator Programming Switching Characteristics The following section describes characteristics of PF_SPI initiator programming switching. Table 5-83. SPI Initiator Programming Performance Characteristics 5.8.4 Parameter Symbol Min Typ Max Unit Condition SCK frequency FSCK — — 20 MHz — Tamper Detectors The following section describes tamper detectors. Table 5-84. ADC Conversion Rate Min Typ1 Parameter Description Max Unit TCONV1 Time from enable changing from zero to non-zero value to first conversion 350 — completes. Minimum value applies when POWEROFF = 0. 470 μs TCONVN Time between subsequent channel conversions. — © 2021 Microchip Technology Inc. and its subsidiaries Datasheet — 480 μs DS00003831B-page 86 AC Switching Characteristics ...........continued Parameter Description Min Typ1 Max Unit TSETUP Data channel and output to valid asserted. Data is held until next conversion completes, that is >480 μs. 0 — — ns TVALID 2 Width of the valid pulse. 1.5 — 2.5 μs TRATE Time from start of first set of conversions to the start of the next set. Can be considered as the conversion rate. Is set by the conversion rate parameter. — Rate × 32 — 1. 2. μs Min, Typ, and Max refer to variation due to functional configuration and the raw TVS value. The actual internal correction time will vary based on the raw TVS value. The pulse width varies depending on the time taken to complete the internal calibration multiplication, this can be up to 375 ns. Note: Once the TVS block is active, the enable signal is sampled 25 ns before the falling edge of valid. The next enabled channel in the sequence 0-1-2-3 is started; that is, if channel 0 has just completed and only channels 0 and 3 are enabled, the next channel will be 3. When all the enabled channels in the sequence 0-1-2-3 are completed, the TVS waits for the conversion rate timer to expire. The enable signal may be changed at any time if it changes to 4’b0000 while valid is asserted (and 25 ns before valid is de-asserted), then no further conversions will be started. Table 5-85. Temperature and Voltage Sensor Electrical Characteristics Parameter Min Typ Max Unit Condition Temperature sensing range –55 — 125 °C — Temperature sensing accuracy –10 — 10 °C — Voltage sensing range 0.9 — 2.8 V — Voltage sensing accuracy –3.0 — 3.0 % — Table 5-86. Tamper Macro Timing Characteristics—Flags and Clearing Parameter Symbol Typ Max Unit From event detection to flag generation TJTAG_ACTIVE 1 28 35 ns TMESH_ERR 1 1.8 2.5 μs TCLK_GLITCH 1 — 50 ns TCLK_FREQ 1 — 4 μs TLOW_VDD 1, 3 70 1000 μs THIGH_VDD18 1, 3 85 1000 μs THIGH_VDD25 1, 3 130 1000 μs TSECDEC 1 — 5 ns TDRI_ERR 1 14 18 μs TWDOG 1 — 5 ns TLOCK_ERR 1 — 5 ns © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 87 AC Switching Characteristics ...........continued Parameter Symbol Typ Max Unit Time from system controller instruction execution to flag generation TINST_BUF_ACCESS 1, 2 4 5 μs TINST_DEBUG 1, 2 3.3 4 μs TINST_CHK_DIGEST 1, 2 1.8 3 μs TINST_EC_SETUP 1, 2 1.8 2 μs TINST_FACT_PRIV 1, 2 3.8 5 μs TINST_KEY_VAL 1, 2 2.5 3.5 μs TINST_MISC 1, 2 1.5 2 μs TINST_PASSCODE_MATCH 1, 2 2.5 3 μs TINST_PASSCODE_SETUP 1, 2 4.2 5 μs TINST_PROG 1, 2 3.8 4.5 μs TINST_PUB_INFO 1, 2 4 4.5 μs TINST_ZERO_RECO 1, 2 2.5 3 μs TINST_PASSCODE_FAIL 1, 2 170 180 μs TINST_KEY_VAL_FAIL 1, 2 92 110 μs TINST_UNUSED 1, 2 4 5 μs TCLEAR_FLAG 17 23 ns Time from sending the CLEAR to deassertion on FLAG 1. 2. 3. The timing does not impact the user design, but it is useful for security analysis. System service requests from the fabric will interrupt the system controller delaying the generation of the flag. Timing of these depends highly on supply ramp rate. Table 5-87. Tamper Macro Response Timing Characteristics 5.8.5 Parameter Symbol Typ Max Unit Time from triggering the response to all I/Os disabled TIO_DISABLE 45 63 ns Time from negation of RESPONSE to all I/Os re-enabled TCLR_IO_DISABLE 34 51 ns Time from triggering the response to security locked TLOCKDOWN — 20 ns Time from negation of RESPONSE to earlier security unlock condition TCLR_LOCKDOWN — 20 ns Time from triggering the response to device enters RESET Ttr_RESET 11.7 14 μs Time from triggering the response to start of zeroization Ttr_ZEROLISE 7.4 ms 8.2 System Controller Suspend Switching Characteristics The following table describes the characteristics of system controller suspend switching. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 88 AC Switching Characteristics Table 5-88. System Controller Suspend Entry and Exit Characteristics Parameter Symbol Time from TRSTb falling edge to SUSPEND_EN signal assertion Tsuspend_Tr 1, 2 Suspend entry time from TRST_N assertion Time from TRSTb rising edge to ACTIVE signal Tsuspend_exit assertion 1. 2. 5.8.6 Definition Typ Max Unit 42 Suspend exit time from TRST_N negation 44 ns 361 372 ns ACTIVE indicates that the system controller is inactive or active regardless of the state of SUSPEND_EN. ACTIVE signal must never be asserted with SUSPEND_EN is asserted. Dynamic Reconfiguration Interface The following table provides interface timing information for the DRI, which is an embedded APB target interface within the FPGA fabric that does not use FPGA resources. Table 5-89. Dynamic Reconfiguration Interface Timing Characteristics 5.8.7 Parameter Symbol Max Unit PCLK frequency FPD _PCLK 200 MHz User Voltage Detector Characteristics The following table provides the electrical characteristics of the VDD (1.0V), VDD18, and VDD25 voltage detectors. For proper operation of the voltage detectors, VDD must be set to 1.0V. Table 5-90. User Voltage Detector Electrical Characteristics 5.9 Parameter Min Typ Max Unit Condition VDD_HIGH_DET 1.04 — 1.07 V Temp= –40 ºC to 100 ºC; VDD18 = 1.8V ±5%; VDD25= 2.5V ±5% VDD18_HIGH_DET 1.9 — 1.96 V Temp= –40 ºC to 100 ºC; VDD = 1.0V ±3%; VDD25= 2.5V ±5% VDD25_HIGH_DET 2.66 — 2.74 V Temp= –40 ºC to 100 ºC; VDD = 1.0V ±3%; VDD18= 1.8V ±5% VDD_LOW_DET 0.945 — 0.915 V Temp= –40 ºC to 100 ºC; VDD18 = 1.8 ±5%; VDD25= 2.5V ±5% VDD18_LOW_DET 1.62 — 1.57 V Temp= –40 ºC to 100 ºC; VDD = 1.0 ±3%; VDD25= 2.5 V ±5% VDD25_LOW_DET 2.31 — 2.21 V Temp= –40 ºC to 100 ºC; VDD = 1.0 ±3%; VDD18= 1.8V ±5% Power-Up to Functional Timing Microchip non-volatile FPGA technology offers the fastest boot-time of any mid-range FPGA in the market. The following tables describes both cold-boot (from power-on) and warm-boot (assertion of DEVRST_N pin or assertion of reset from the tamper macro) timing. The power-up diagrams assume all power supplies to the device are stable. 5.9.1 Power-On (Cold) Reset Initialization Sequence The following cold reset timing diagram shows the initialization sequencing of the device. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 89 AC Switching Characteristics Figure 5-7. Cold Reset Timing Notes: • • • • 5.9.2 Figure 5-7. Cold Reset Timing shows the case where VDDI/VDDAUX of I/O banks are powered either before or sufficiently soon after VDD/VDD18/VDD25 that the I/O bank enable time is measured from the assertion time of VDD/VDD18/VDD25 (that is, the PUFT specification). If VDDI/VDDAUX of I/O banks are powered sufficiently after VDD/VDD18/VDD25, then the I/O bank enable time is measured from the assertion of VDDI/VDDAUX and is not specified by the PUFT specification. In this case, I/O operation is indicated by the assertion of BANK_i_VDDI_STATUS, rather than being measured relative to FABRIC_POR_N negation. AUTOCALIB_DONE assertion indicates the completion of calibration for any I/O banks specified by the user for auto-calibration. AUTOCALIB_DONE asserts independently of DEVICE_INIT_DONE. It may assert before or after DEVICE_INIT_DONE and is determined by the following: – How long after VDD/VDD18/VDD25 that VDDI/VDDAUX are powered ON. Note that if any of the user-specified I/O banks are not powered ON within the auto-calibration timeout window, then AUTOCALIB_DONE doesn't assert until after this timeout. – The specified ramp times of VDDI of each I/O bank designated for auto-calibration. – How much auto-initialization is to be performed for the PCIe, SERDES transceivers, and fabric LSRAMs. If any of the I/O banks specified for auto-calibration do not have their VDDI/VDDAUX powered ON within the auto-calibration timeout window, then it will be approximately auto-calibrated whenever VDDI/VDDAUX is subsequently powered ON. To obtain an accurate calibration however, on such I/O banks, it is necessary to initiate a re-calibration (using CALIB_START from fabric). AVM_ACTIVE only asserts if avionics mode is being used. It is asserted when the later of DEVICE_INIT_DONE or AUTOCALIB_DONE assert. Warm Reset Initialization Sequence The following warm reset timing diagram shows the initialization sequencing of the device when either DEVRST_N or TAMPER_RESET_DEVICE signals are asserted. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 90 AC Switching Characteristics Figure 5-8. Warm Reset Timing 5.9.3 Power-On Reset Voltages The following sections describe the power-on reset voltages. 5.9.3.1 Main Supplies The start of power-up to functional time (TPUFT) is defined as the point at which the latest of the main supplies (VDD, VDD18, VDD25) reach the reference voltage levels specified in the following table. This starts the process of releasing the reset of the device and powering ON the FPGA fabric and I/Os. Table 5-91. POR Ref Voltages 5.9.3.2 Supply Power-On Reset Start Point (V) Note VDD 0.95 Applies to both 1.0V and 1.05V operation. VDD18 1.71 — VDD25 2.25 — I/O-Related Supplies For the I/Os to become functional (for low speed, sub-400 MHz operation), the (per-bank) I/O supplies (VDDI, VDDAUX) must reach the trip point voltage levels specified in the following table and the main supplies above must also be powered ON. Table 5-92. I/O-Related Supplies Supply I/O Power-Up Start Point (V) VDDI 0.85 VDDAUX 1.6 There are no sequencing requirements for the power supplies. There are few sequences that can create temporary glitches on GPIO during initialization. Refer to UG0726: PolarFire FPGA Board Design User Guide for more details. In order for the device to start initialization, VDDI3 must be valid at the same time as the other main supplies (VDD, VDD18, VDD25). The other I/O supplies (VDDI, VDDAUX) have no effect on power-up of FPGA fabric (that is, the fabric still powers up even if the I/O supplies of I/O banks remain powered OFF, with the exception of VDDI3). © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 91 AC Switching Characteristics 5.9.4 User Design Dependence of Power-Up Times Some phases of the device initialization are user design dependent, as the device automatically initializes certain resources to user-specified configurations if those resources are used in the design. It is necessary to compute the overall power-up to functional time by referencing the following tables and adding the relevant phases, according to the design configuration. The following equation refers to timing parameters specified in the above timing diagrams. Please note TPCIE , TXCVR, TLSRAM, and TUSRAM can be found in UG0725: PolarFire FPGA Device Power-Up and Resets User Guide. TPUFT = TFAB_READY(cold) + max((TPCIE + TXCVR + TLSRAM + TUSRAM), TCALIB) TWRFT = TFAB_READY(warm) + max((TPCIE + TXCVR + TLSRAM + TUSRAM), TCALIB) Note: TPCIE, TXCVR, TLSRAM, TUSRAM, and TCALIB are common to both cold and warm reset scenarios. Auto-initialization of FPGA (if required) occurs in parallel with I/O calibration. The device may be considered fully functional only when the later of these two activities has finished, which may be either one, depending on the configuration, as may be calculated from the following tables. Note that I/O calibration may extend beyond TPUFT (as I/O calibration process is independent of main device power-on and is instead dependent on I/O bank supply relative power-on time and ramp times). The previous timing diagram for power-on initialization shows the earliest that I/Os could be enabled, if the I/O power supplies are powered on before or at the same time as the main supplies. 5.9.5 Cold Reset to Fabric and I/Os (Low Speed) Functional The following table specifies the minimum, typical, and maximum times from the power supplies reaching the above trip point levels until the FPGA fabric is operational and the FPGA IOs are functional for low-speed (sub-400 MHz) operation. Table 5-93. Cold Boot 5.9.6 Power-On (Cold) Reset to Fabric and I/O Operational Min Typ Max Unit Time when input pins start working – TIN_ACTIVE(cold) 0.92 4.38 7.84 ms Time when weak pull-ups are enabled – TPU_PD_ACTIVE(cold) 0.92 4.38 7.84 ms Time when fabric is operational – TFAB_READY(cold) 0.95 4.41 7.87 ms Time when output pins start driving – TOUT_ACTIVE(cold) 0.97 4.43 7.89 ms Warm Reset to Fabric and I/Os (Low Speed) Functional The following table specifies the minimum, typical, and maximum times from the negation of the warm reset event until the FPGA fabric is operational and the FPGA IOs are functional for low-speed (sub-400 MHz) operation. Table 5-94. Warm Boot 5.9.7 Warm Reset to Fabric and I/O Operational Min Typ Max Unit Time when input pins start working – TIN_ACTIVE(warm) 0.65 1.63 2.62 ms Time when weak pull-ups/pull-downs are enabled – TPU_PD_ACTIVE(warm) 0.65 1.63 2.62 ms Time when fabric is operational – TFAB_READY(warm) 0.68 1.66 2.65 ms Time when output pins start driving – TOUT_ACTIVE(warm) 0.70 1.68 2.67 ms Miscellaneous Initialization Parameters In the following table, TFAB_READY refers to either TFAB_READY(cold) or TFAB_READY(warm) as specified in the previous tables, depending on whether the initialization is occurring as a result of a cold or warm reset, respectively. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 92 AC Switching Characteristics Table 5-95. Cold and Warm Boot Parameter Symbol Min Typ Max Unit Condition The time from TFAB_READY to ready to program through JTAG/SPI-Target — 0 0 0 ms — The time from TFAB_READY to auto-update start — — TPUF_OVHD 1 TPUF_OVHD 1 ms — The time from TFAB_READY to programming recovery start — — TPUF_OVHD 1 TPUF_OVHD 1 ms — The time from TFAB_READY to the tamper flags being available TTAMPER_READY 0 0 0 ms — The time from TFAB_READY to the Athena Crypto TCRYPTO_READY 0 co-processor being available (for S devices only) 0 0 ms — 1. 5.9.8 Programming depends on the PUF to power-up. Refer to TPUF_OVHD at section Secure NVM Performance. I/O Calibration The following tables specify the initial I/O calibration time for the fastest and slowest supported VDDI ramp times of 0.2 ms to 50 ms, respectively. This only applies to I/O banks specified by the user to be auto-calibrated. Table 5-96. I/O Initial Calibration Time (TCALIB) Ramp Time Min (ms) Max (ms) Condition 0.2 ms 0.98 2.63 Applies to HSIO and GPIO banks 50 ms 41.62 62.19 Applies to HSIO and GPIO banks Notes: • • The user may specify any VDDI ramp time in the range specified above. The nominal initial calibration time is given by the specified VDDI ramp time plus 2 ms. In order for I/O calibration to start, VDDI and VDDAUX of the I/O bank must be higher than the trip point levels specified in section I/O-Related Supplies. Table 5-97. I/O Fast Recalibration Time (TRECALIB) I/O Type Min (ms) Typ (ms) Max (ms) Condition GPIO bank 0.04 0.14 0.24 GPIO configured for 3.3V operation HSIO bank 0.11 0.20 0.30 HSIO configured for 1.8V operation Note: In order to obtain fast re-calibration, the user must assert the relevant clock request signal from the FPGA fabric to the I/O bank controller. 5.10 Dedicated Pins The following section describes the dedicated pins. 5.10.1 JTAG Switching Characteristics The following table describes characteristics of JTAG switching. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 93 AC Switching Characteristics Table 5-98. JTAG Electrical Characteristics 5.10.2 Symbol Description Min Typ Max Unit Condition TDISU TDI input setup time 0.0 — — ns — TDIHD TDI input hold time 2.0 — — ns — TTMSSU TMS input setup time 1.5 — — ns — TTMSHD TMS input hold time 1.5 — — ns — FTCK TCK frequency — — 25 MHz — TTCKDC TCK duty cycle 40 — 60 % — TTDOCQ TDO clock to Q out — — 8.4 ns CLOAD = 40 pf TRSTBCQ TRSTB clock to Q out — — 23.5 ns CLOAD = 40 pf TRSTBPW TRSTB min pulse width 50 — — ns — TRSTBREM TRSTB removal time 0.0 — — ns — TRSTBREC TRSTB recovery time 12.0 — — ns — CINTDI TDI input pin capacitance — — 5.3 pf — CINTMS TMS input pin capacitance — — 5.3 pf — CINTCK TCK input pin capacitance — — 5.3 pf — CINTRSTB TRSTB input pin capacitance — — 5.3 pf — SPI Switching Characteristics The following tables describe characteristics of SPI switching. Table 5-99. SPI Initiator Mode (PolarFire Initiator) Parameter Symbol Min Typ Max Unit Condition SCK frequency sp1 — — 20 MHz During Programming 40 Mhz During Initialization SCK minimum pulse width high sp2 SCK_period/2 — — ns — SCK minimum pulse width low sp3 SCK_period/2 — — ns — Rise and fall time sp4 — — — ns Refer to PolarFire IBIS models3 sp5 SDO setup time sp6m (SCK_period/2) – 3.0 — — ns — SDO hold time sp7m (SCK_period/2) – 2.0 — — ns — SDI setup time sp8m 10.0 — — ns — SDI hold time sp9m –1.0 — — ns — Notes: © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 94 AC Switching Characteristics 1. 2. 3. Parameters are referenced to the active edge of SCK, which depends on the configured SPI protocol (for example, Motorola SPI mode uses rising edge as active edge if SPO = 0). SDI is clocked into SPI on active edge and clocked out on inactive edge. Therefore, SDO delay parameters are dependent on SCK frequency (nominally SCK_period/2). For specific rise/fall times, board design considerations, and detailed output buffer resistances, use the corresponding IBIS models located online at IBIS Models: PolarFire. Table 5-100. SPI Target Mode (PolarFire Target) Parameter Symbol Min Typ Max Unit Condition SCK frequency sp1 — — 80 MHz — SCK minimum pulse width high sp2 SCK_period/2 — — ns — SCK minimum pulse width low sp3 SCK_period/2 — — ns — Rise and fall time sp4 — — — ns Refer to PolarFire IBIS models3 sp5 SDO setup time sp6s (SCK_period/2) – 8.0 — — ns — SDO hold time sp7s SCK_period/2 — — ns — SDI setup time sp8s 4.0 — — ns — SDI hold time sp9s 2.0 — — ns — Notes: 1. 2. 3. Parameters are referenced to the active edge of SCK, which depends on the configured SPI protocol (for example, Motorola SPI mode uses rising edge as active edge if SPO = 0). SDI is clocked into SPI on active edge and clocked out on inactive edge. Therefore, SDO delay parameters are dependent on SCK frequency (nominally SCK_period/2). For specific rise/fall times, board design considerations, and detailed output buffer resistances, use the corresponding IBIS models located online at IBIS Models: PolarFire. Figure 5-9. SPI Timing for a Single Frame Transfer in Motorola Mode (SPH = 1) 5.10.3 SmartDebug Probe Switching Characteristics The following table describes characteristics of SmartDebug probe switching. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 95 AC Switching Characteristics Table 5-101. SmartDebug Probe Performance Characteristics Parameter 5.10.4 Symbol VDD = 1.0V VDD = 1.0V VDD = 1.05V VDD = 1.05V STD –1 STD –1 Unit Maximum frequency of probe signal FMAX 100 100 100 100 MHz Minimum delay of probe signal TMin_delay — — — — ns Maximum delay of probe signal TMax_delay — — — — ns DEVRST_N Switching Characteristics The following table describes characteristics of DEVRST_N switching. Table 5-102. DEVRST_N Electrical Characteristics 5.11 Parameter Symbol Min Typ Max Unit Condition DEVRST_N ramp time DRRAMP — 10 — μs It must be a normal clean digital signal, with typical rise and fall times. DEVRST_N assert time DRASSERT 1 — — μs The minimum time for DEVRST_N assertion to be recognized. DEVRST_N de-assert time DRDEASSERT 2.75 — — ms The minimum time DEVRST_N needs to be deasserted before assertion. User Crypto The following section describes user crypto. 5.11.1 TeraFire 5200B Switching Characteristics The following table describes TeraFire 5200B switching characteristics. Table 5-103. TeraFire F5200B Switching Characteristics Parameter 5.11.2 Symbol VDD = VDD = VDD = VDD = 1.0V 1.0V 1.05V 1.05V STD –1 STD –1 Unit Condition FMAX with DLL FMAX_DLL 189 189 189 189 MHz –40 °C to 100 °C FMIN with DLL FMIN_DLL 125 125 125 125 MHz –40 °C to 100 °C FMAX with DLL in bypass mode FMAX_DLL_BYPASS 70 70 70 70 MHz –40 °C to 100 °C FMIN with DLL in bypass mode FMIN_DLL_BYPASS 0 0 0 0 MHz –40 °C to 100 °C TeraFire 5200B Throughput Characteristics The following tables for each algorithm describe the TeraFire 5200B throughput characteristics. Adding the 2 columns clock counts on any given row will yield the expected performance for that algorithm and message size. Note: Throughput cycle count collected with Athena TeraFire Core and a soft RISC-V CPU running at 70 MHz. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 96 AC Switching Characteristics Table 5-104. AES Modes Message Size (Bits) Athena TeraFire Crypto Core ClockCycles RISC-V CPU Clock-Cycles AES-ECB-128 encrypt1 128 511 1011 64K 48109 927 128 557 1328 64K 48385 1282 128 527 1333 64K 56301 1303 128 589 1356 64K 56673 1410 128 588 1316 64K 58691 1286 128 617 1676 64K 56853 1730 AES-GCM-128 encrypt1, 128-bit tag, (full message encrypted/authenticated) 128 1921 1701 64K 58022 1640 AES-GCM-256 encrypt1, 128-bit tag, (full message encrypted/authenticated) 128 1969 1718 64K 58054 1803 AES-ECB-128 decrypt1 AES-ECB-256 encrypt1 AES-ECB-256 decrypt1 AES-CBC-256 encrypt1 AES-CBC-256 decrypt1 1. With DPA counter measures. Table 5-105. GMAC Modes Message Size (Bits) Athena TeraFire Crypto Core ClockCycles RISC-V CPU ClockCycles AES-GCM-2561, 128-bit tag, (message is only authenticated) 128 1859 1752 64K 47659 1854 1. With DPA counter measures. Table 5-106. HMAC Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles HMAC-SHA-2561, 256-bit key 512 64K © 2021 Microchip Technology Inc. and its subsidiaries RISC-V CPU Clock-Cycles 7461 1616 86319 1350 Datasheet DS00003831B-page 97 AC Switching Characteristics ...........continued Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles HMAC-SHA-3841, 384-bit key 1024 64K 1. RISC-V CPU Clock-Cycles 13017 1438 104055 1438 With DPA counter measures. Table 5-107. CMAC Modes Message Size (Bits) Athena TeraFire Crypto RISC-V CPU ClockCore Clock-Cycles Cycles AES-CMAC-2561 (message is only authenticated) 128 446 8434 64K 45494 110209 1. With DPA counter measures. Table 5-108. KEY TREE Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU Clock-Cycles 128-bit nonce + 8-bit optype — 102457 2173 256-bit nonce + 8-bit optype — 103218 2359 Table 5-109. SHA Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU Clock-Cycles SHA-11 512 2370 816 64K 75528 709 512 2500 656 64K 82704 656 1024 4122 712 64K 98174 656 1024 4122 652 64K 98174 653 SHA-2561 SHA-3841 SHA-5121 1. With DPA counter measures. Table 5-110. ECC Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles ECDSA SigGen, P-384/SHA-3841 1024 8K © 2021 Microchip Technology Inc. and its subsidiaries RISC-V CPU ClockCycles 12525647 5072 12540387 5072 Datasheet DS00003831B-page 98 AC Switching Characteristics ...........continued Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU ClockCycles ECDSA SigGen, P-384/SHA-384 1024 5502896 5071 8K 5513718 5071 1024 6243821 4683 8K 6321110 4422 1024 6243821 4422 8K 6321110 4422 Key Agreement (KAS), P-384 — 5039125 10318 Point Multiply, P-2561 — 5177474 4434 Point Multiply, P-3841 — 12055519 5086 Point Multiply, P-5211 — 26889271 6470 Point Addition, P-384 — 3018067 5303 KeyGen (PKG), P-384 — 12052230 7909 Point Verification, P-384 — 5091 3354 ECDSA SigVer, P-384/SHA-3841 ECDSA SigVer, P-384/SHA-384 1. With DPA counter measures. Table 5-111. IFC (RSA) Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU ClockCycles Encrypt, RSA-2048, e=65537 2048 436972 8287 Encrypt, RSA-3072, e=65537 3072 962162 12063 Decrypt, RSA-20481, CRT 2048 26847616 15261 Decrypt, RSA-30721, CRT 3072 75168689 22488 Decrypt, RSA-4096, CRT 4096 88789629 23585 Decrypt, RSA-3072, CRT 3072 38202717 18838 SigGen, RSA-3072/SHA-3841 ,CRT, PKCS #1 V 1 1.5 1024 75156973 19562 8K 75222026 18880 SigGen, RSA-3072/SHA-384, PKCS #1, V 1.5 1024 148092303 13622 8K 148102319 13622 SigVer, RSA-3072/SHA-384, e = 65537, PKCS #1 V 1.5 1024 970959 11769 8K 981755 11769 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 99 AC Switching Characteristics ...........continued Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU ClockCycles SigVer, RSA-2048/SHA-256, e = 65537, PKCS #1 V 1.5 1024 443593 8490 8K 452751 8443 SigGen, RSA-3072/SHA-384, ANSI X9.31 1024 147143879 13624 8K 147153109 13417 1024 972788 11268 8K 983643 11215 SigVer, RSA-3072/SHA-384, e = 65537, ANSI X9.31 1. With DPA counter measures. Table 5-112. FFC (DH) Modes Message Size (Bits) Athena TeraFire Crypto Core ClockCycles RISC-V CPU Clock-Cycles SigGen, DSA-3072/SHA-3841 1024 27932434 13271 8K 27946636 13166 1024 12086324 13028 8K 12097138 12862 1024 24711796 14689 8K 24418930 14689 1024 9673222 10717 8K 9803028 10717 Key Agreement (KAS), DH-3072 (p=3072,security=256) — 4920705 9519 Key Agreement (KAS), DH-3072 (p=3072,security=256)1 — 78871914 9495 SigGen, DSA-3072/SHA-384 SigVer, DSA-3072/SHA-384 SigVer, DSA-2048/SHA-256 1. With DPA counter measures. Table 5-113. NRBG Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU Clock-Cycles Instantiate: strength, s=256, 384-bit nonce, 384-bit personalization string — 18221 3076 Reseed: no additional input, s=256 — 13585 1056 Reseed: 384-bit additional input, s=256 — 15922 995 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 100 AC Switching Characteristics ...........continued Modes Message Size (Bits) Athena TeraFire Crypto Core Clock-Cycles RISC-V CPU Clock-Cycles Generate: (no additional input), prediction resistance enabled, s=256 128 15262 1672 8K 27169 7837 Generate: (no additional input), prediction resistance disabled, s=256 128 2138 781 8K 14045 7837 Generate: (384-bit additional input), prediction resistance enabled, s=256 128 21299 1620 8K 33206 8563 Generate: (384-bit additional input), prediction resistance disabled, s=256 128 11657 1507 8K 23564 8563 Un-instantiate — 761 502 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 101 Revision History 6. Revision History Revision Date B 10/2021 Description • • • • • • • • • • • • • • • • • A 02/2021 • • • • • • © 2021 Microchip Technology Inc. and its subsidiaries Added AECQ-100 to Table 1. PolarFire Minimum and Maximum Junction Temperatures by Temperature Grade. Added the MPF050 to Table 3-2. PolarFire FPGA Tool Status. Added note 3 under Table 4-1. Absolute Maximum Rating. Changed the name LVDS18 for GPIO to LVDS18G in Table 4-17. Differential DC Input Levels. Added a row for LVDS18G in Table 4-18. Differnetial DC Ouptut Level. Added a LVDS18G row to Table 5-4. GPIO Maximum Input Buffer Speed. Added a LVDS18G row to Table 5-6. GPIO Maximum Output Buffer Speed. Removed DDR3L from the footnote under Table 5-7. Maximum PHY Rate for Memory Interfaces IP for HSIO Banks. Added a LVDS18G row to Table 5-14. I/O CDR Switching Characteristics. Added footnote 8 under Table 5-30. PolarFire Transceiver Reference Clock AC Requirements that relaxes the reference clock requirements if additional jitter is acceptable. Changed references from VDDSREF to XCVRVREF in section Transceiver Reference Clock I/O Standards to align with Table 4-2. Recommended Operating Conditions. Added footnote 14 under Table 5-36. PolarFire Transcevier Transmitter Characteristics that relaxes the reference clock requirements if additional jitter is acceptable Clarified that programming, verify, and zeroization operations all count as a programming cycle. For more information, see section FPGA and μPROM Programming Cycle and Retention. Table 5-62. SPI Initiator and Auto-Update Programming Time (IAP) was updated to now reference auto-update programming times. Clarified Notes section under Table 5-74. Standalone Fabric Verify Times. Clarified table headers and notes in section User Crypto. Clarified that μPROM NVM characteristics are the same as the FPGA fabric as the μPROM is constructed from the same NVM switch. For more information, see section FPGA and μPROM Programming Cycle and Retention. Updated document to Microchip template. Updated document number from DS51700141 to DS00003831. Added automotive and military temperature-grade specifications. Increased MIPI TX speeds from 800 Mbps to 1000 Mbps for STD speed grade. Removed digest junction temperature from the table Maximum Number of Digest Cycles as it has no effect on device retention. Added SDI 6G and 12G rates. Datasheet DS00003831B-page 102 Revision History ...........continued Revision Date 1.8 11/2020 Description • • • • • • • – I/O Digital Receive Single-Data Rate Switching Characteristics 1 – I/O Digital Receive Double Data Rate Switching Characteristics 4 – I/O Digital Transmit Single Data Rate Switching Characteristics 2 – I/O Digital Transmit Double Data Rate Switching Characteristics Included a +/- maximum specification in addition to the absolute maximum specification for "PLL ouput period jitter" in PLL Electrical Characteristics. Added footnote 11 to PLL Electrical Characteristics to direct customers to contact technical support for protocol-specific jitter characteristics. Updated values in LSRAM Performance Industrial Temperature Range (–55 °C to 125 °C) . Added transceiver loopback rates and two footnotes to PolarFire Transceiver and TXPLL Performance. Updated transceiver refclk inputs from 156 MHz to 156.3 MHz in PolarFire Transceiver Reference Clock AC Requirements. Added min/max specifications to "Differential termination" in PolarFire Transceiver Transmitter Characteristics and PolarFire Transceiver Receiver Characteristics. Made the following updates to Display Port: • – Added 8.1 Gbps data rates. – Clarified total receive jitter tolerance for 5.4 Gbps data rate. – Added footnote to total transmit jitter for 5.4 Gbps data rate max. Made the following updates to FireWire IEEE 1394: • • • • • • • • • • © 2021 Microchip Technology Inc. and its subsidiaries Added footnote 3 to clarify mixed I/O receiver capability for DC Input Levels. Clarified GPIO VICM and HSIO VICM rules in footnote 3 in Differential DC Input Levels. Added Input Hysteresis Characteristics over Recommended Operating Conditions. Added minimum DDR memory data rates to Maximum PHY Rate for Memory Interfaces IP for HSIO Banks and Maximum PHY Rate for Memory Interfaces IP for GPIO Banks. Corrected FMAX values for QDR memories from 113 MHz to 112.5 MHz in Maximum PHY Rate for Memory Interfaces IP for GPIO Banks. Added note to indicate which IOD delay setting was used to achieve the specifications for the following tables: – Added FireWire S200 specifications. – Lowered FireWire S400 Tx jitter from 557 ps to 516 ps. – Clarified FireWire S800 amplitude specification. Added SLVS-EC. Deleted Table 103 SPI Macro Interface Timing Characteristics and replaced with PF_SPI Master Programming Switching Characteristics. To determine timing of the user SPI macro from the fabric, please use SmartTime. Updated the signal name AVM_ACTIVE to SUSPEND_EN in Cold Reset Timing and Warm Reset Timing. Clarified device behavior in description underneath I/O-Related Supplies. Datasheet DS00003831B-page 103 Revision History ...........continued Revision Date 1.7 12/2019 Description • • • • • • • • • 1.6 06/2019 • • • • • • • • • • • © 2021 Microchip Technology Inc. and its subsidiaries Updated table PolarFire FPGA Silicon Status. Libero 12.2 now contains production timing and power for all devices. Corrected footnote 5 in the table PolarFire Transceiver Reference Clock AC Requirements. Corrected footnote in the table sNVM Programming Cycles vs. Retention Characteristics. Added timing parameters to the table Master SPI Programming Time (IAP) and table Slave SPI Programming Time. Added 270 mbps rates to the section SDI. Added FireWire section. Added footnotes to the following tables: – Recommended Operating Conditions – I/O Digital Receive Double Data Rate Switching Characteristics – I/O Digital Transmit Single Data Rate Switching Characteristics – I/O Digital Transmit Double Data Rate Switching Characteristics – HSIO Maximum Input Buffer Speed – HSIO Maximum Output Buffer Speed – GPIO Maximum Output Buffer Speed – Programmable Delay Added MIPI data rates to the following tables: – GPIO Maximum Input Buffer Speed – GPIO Maximum Output Buffer Speed Updated MIPIE25 output DC specifications. The parameter RX_DDRX_B_G_FA (for Video7 applications) was added. For more information, see table I/O Digital Receive Double-Data Rate Switching Characteristics. I/O CDR switching characteristics were added. For more information, see table I/O CDR Switching Characteristics. High-speed I/O clock skew with bridging was added. For more information, see table High-Speed I/O Clock Characteristics (–40 °C to 100 °C). PCS and PMA minimum reset pulse widths were added. For more information, see table PolarFire Transceiver and TXPLL Performance. Auto adaptive calibration was added to CDR lock times, Burst Mode Receiver (BMR) high-gain lock time, and BMR high-gain state time. For more information, see table PolarFire Transceiver Receiver Characteristics. Fiber channel rates were corrected. For more information, see table Fiber Channel. HiGig and HiGig+ specifications were updated. For more information, see table HiGig and HiGig+. HiGig II specifications were updated. For more information, see table HiGigII. The DEVRST_N parameter was correctly classified as ramp time. For more information, see section Dedicated Pins. Transmitter and receiver return loss characteristics were added. For more information, see section Transceiver Switching Characteristics. Voltage detector specifications were added and the voltage glitch detector was removed. For more information, see section User Voltage Detector Characteristics. Datasheet DS00003831B-page 104 Revision History ...........continued Revision Date 1.5 Description • • All tables have been reviewed and updated to reflect production silicon characteristics for the 200T, 200TL, 200TS, 200TLS, 100T, 100TL, 100TS, and 100TLS devices in all packages, speed grades, and temperature grades. The maximum transceiver reference clock input rate was changed from 800 MHz to 400 MHz due to a typo in version 1.4. For more information, see table PolarFire Transceiver Reference Clock AC Requirements. 1.4 09/2018 • All tables have been reviewed and updated to reflect production silicon characteristics for the 300T, 300TL, 300TS, and 300TLS devices in all packages, speed grades, and temperature grades. 1.3 06/2018 • • • • The System Services section was updated. The Non-Volatile Characteristics section was updated. The Fabric Macros section was updated. The Transceiver Switching Characteristics section was updated. 1.2 06/2018 • The datasheet has moved to preliminary status. Every table has been updated. 1.1 08/2017 • • • • LVDS specifications changed to 1.25G. LVDS18, LVDS25/LVDS33, and LVDS25 specifications changed to 800 Mbps. A note was added indicting a zeroization cycle counts as a programming cycle. A note was added defining power down conditions for programming recovery conditions. 1.0 Initial Revision © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 105 The Microchip Website Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. 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ISBN: 978-1-5224-8384-7 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 107 Quality Management System For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 108 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: www.microchip.com/support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS00003831B-page 109