MSC010SDA070K

MSC010SDA070K Zero Recovery Silicon Carbide Schottky Diode Product Overview The silicon carbide (SiC) power Schottky barrier diode (SBD) product line from Microchip increases the performance over silicon diode solutions while lowering the total cost of ownership for high-voltage applications. The MSC010SDA070K device is a 700 V, 10 A SiC SBD in a two-lead TO-220 package. Features The following are key features of the MSC010SDA070K device: • • • • • No reverse recovery Low forward voltage Low leakage current Avalanche-energy rated RoHS compliant Benefits The following are benefits of the MSC010SDA070K device: • • • • • High switching frequency Low switching losses Low noise (EMI) switching Higher reliability systems Increased system power density Applications The MSC010SDA070K device is designed for the following applications: • • • • Power factor correction (PFC) Anti-parallel diode – Switch-mode power supply – Inverters/converters – Motor controllers Freewheeling diode – Switch-mode power supply – Inverters/converters Snubber/clamp diode © 2021 Microchip Technology Inc. Datasheet DS-00003907A-page 1 MSC010SDA070K Device Specifications 1. Device Specifications This section shows the specifications of the MSC010SDA070K device. 1.1 Absolute Maximum Ratings The following table shows the absolute maximum ratings of the MSC010SDA070K device. TC = 25 °C unless otherwise specified. Table 1-1. Absolute Maximum Ratings Symbol Parameter Ratings Unit VR Maximum DC reverse voltage 700 V VRRM Maximum peak repetitive reverse voltage VRWM Maximum working peak reverse voltage IF Maximum DC forward current TC = 25 °C 24 A TC = 135 °C 10 TC = 145 °C 8 IFRM Repetitive peak forward surge current (TC = 25 °C, tp = 8.3 ms, half sine wave) 34 IFSM Non-repetitive forward surge current (TC = 25 °C, tp = 8.3 ms, half sine wave) 58 PTOT Total power dissipation TC = 25 °C 83 TC = 110 °C 36 EAS Single-pulse avalanche energy (starting TJ = 25 °C, peak IL = 10 A) 100 W mJ The following table shows the thermal and mechanical characteristics of the MSC010SDA070K device. Table 1-2. Thermal and Mechanical Characteristics Symbol Characteristic/Test Conditions Min RθJC Junction-to-case thermal resistance TJ, TSTG Operating junction and storage temperature range TL Lead temperature for 10 seconds Wt Package weight Max Unit 1.30 1.80 °C/W 175 °C –55 300 Mounting torque, 6-32 or M3 screw © 2021 Microchip Technology Inc. Typ Datasheet 0.07 oz 1.9 g 10 lbf-in 1.1 N-m DS-00003907A-page 2 MSC010SDA070K Device Specifications 1.2 Electrical Performance The following table shows the static characteristics of the MSC010SDA070K device. TJ = 25 °C unless otherwise specified. Table 1-3. Static Characteristics Symbol Characteristic Test Conditions VF Forward voltage IRM 1.3 Reverse leakage current Min Typ Max Unit IF = 10 A, TJ = 25 °C 1.5 1.8 V IF = 10 A, TJ = 175 °C 1.8 VR = 700 V, TJ = 25 °C 3 200 µA VR = 700 V, TJ = 175 °C 15 QC Total capacitive charge VR = 400 V 27 nC CJ Junction capacitance VR = 1 V, f = 1 MHz 353 pF VR = 200 V, f = 1 MHz 54 VR = 400 V, f = 1 MHz 46 Typical Performance Curves This section shows the typical performance curves of the MSC010SDA070K device. Figure 1-1. Maximum Transient Thermal Impedance © 2021 Microchip Technology Inc. Datasheet DS-00003907A-page 3 MSC010SDA070K Device Specifications Figure 1-2. Forward Current vs. Forward Voltage Figure 1-3. Max. Forward Current vs. Case Temp. Figure 1-4. Max. Power Dissipation vs. Case Temp. Figure 1-5. Reverse Current vs. Reverse Voltage © 2021 Microchip Technology Inc. Datasheet DS-00003907A-page 4 MSC010SDA070K Device Specifications Figure 1-6. Total Charge vs. Reverse Voltage © 2021 Microchip Technology Inc. Figure 1-7. Capacitance vs. Reverse Voltage Datasheet DS-00003907A-page 5 MSC010SDA070K Package Specification 2. Package Specification This section shows the package specification of the MSC010SDA070K device. 2.1 Package Outline Drawing The following figure illustrates the TO-220 package outline of the MSC010SDA070K device. Figure 2-1. Package Outline Drawing The following table shows the TO-220 dimensions and should be used in conjunction with the package outline drawing. © 2021 Microchip Technology Inc. Datasheet DS-00003907A-page 6 MSC010SDA070K Package Specification Table 2-1. TO-220 Dimensions Symbol Min (mm) Max (mm) Min (in.) Max (in.) A 4.32 4.57 0.170 0.180 B 1.14 1.40 0.045 0.055 C 2.50 2.74 0.098 0.108 D 0.36 0.53 0.014 0.021 E 2.65 3.05 0.104 0.120 F 3.60 3.96 0.142 0.156 G 14.50 15.60 0.571 0.614 H 2.39 3.65 0.094 0.144 I 6.00 6.80 0.236 0.268 J 8.40 9.00 0.331 0.354 K 13.00 14.00 0.512 0.051 L 1.23 1.39 0.048 0.055 M 0.69 0.88 0.027 0.035 N 10.00 10.36 0.394 0.408 O 7.57 7.90 0.298 0.311 P 12.20 13.10 0.480 0.516 Q 2.54 BSC (nom.) Terminal 1 Cathode Terminal 2 Anode Terminal 3 Cathode © 2021 Microchip Technology Inc. 0.100 BSC (nom.) Datasheet DS-00003907A-page 7 MSC010SDA070K Revision History 3. Revision History Table 3-1. Revision History Revision Date Description A 03/2021 Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00003907A,which replaces the previous Microsemi literature number 053-4083. Initial release (Microsemi Revision A) 12/2017 © 2021 Microchip Technology Inc. Document created. 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Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip’s intellectual property rights. Microchip is willing to work with any customer who is concerned about the integrity of its code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. © 2021 Microchip Technology Inc. Datasheet DS-00003907A-page 9 MSC010SDA070K Legal Notice Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”. 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