MTCH102/5/8
2, 5 and 8-Channel Proximity/Touch Controller Data Sheet
Description
The Microchip mTouch® MTCH102/5/8 Proximity/Touch Controller with simple digital output provides an easy way to
add proximity or touch detection to any application. This device family implements capacitive sensors with active
guarding capability. The sensitivity and power mode can be configured through the MTSA and MTPM pins. The
MTCH102/5/8 devices also use an advanced optimization algorithm to actively suppress noise from the signal to
achieve reliable proximity/touch detection.
• Flexible Low-Power mode
• Brown-Out Protection
• Operating Voltage Range:
- 2.05V to 3.6V
• Operating Temperature:
- 40°C to +85°C
Features
• Capacitive Proximity and Touch Detection
System:
- High Signal to Noise Ratio (SNR)
- Adjustable sensitivity with compensation for
different sensor sizes
- Multi-stage active noise suppression filters
- Automatic environmental compensation
- Support wide range of sensor shapes and
sizes
• Simple I/O Interface with Existing System
• Smart Scan Scheduling
• Threshold Hysteresis
TABLE 1:
Typical Application
•
•
•
•
•
Light Switch
Portable Device Enabler
White Goods and Appliance
Office Equipment and Toys
Display and Keypad Back-lighting Activation
MTCH10X FAMILY TYPES
Device
Data Sheet Index
Sensor Input
Active Guard
Digital Output
MTCH101
(A)
1
N
1
MTCH102
(B)
2(1)
Y(1)
2
MTCH105
(B)
5(1)
Y(1)
5
(B)
8(1)
Y(1)
8
MTCH108
Note 1:
One of the sensor inputs can be configured as active guard output.
Data Sheet Index: (Unshaded devices are described in this document.)
A:
B:
DS-40001664
DS-40001793
MTCH101 Single-Channel Proximity Detector
MTCH102/105/108 Dual-Channel Proximity/Touch Controller
For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
Note:
TABLE 2:
PACKAGES
Packages
MSOP
TSSOP
SSOP
UDFN
QFN
UQFN
MTCH102
X
—
—
X
—
—
MTCH105
—
X
—
—
X
—
MTCH108
—
—
X
—
—
X
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 1
MTCH102/5/8
8-LEAD MSOP, UDFN
MTI0
MTCH102
VDD 1
2
MTI1/Guard 3
4
MTPM
8 VSS
7 MTO0
6 MTO1/GC
20-LEAD SSOP
VDD
1
20
VSS
MTI0
2
19
MTO0
18
MTO1
17
MTSA
16
MTO2/GC
15
MTO3
7
14
MTO4
8
13
MTO5
9
12
MTO6
10
11
MTO7
MTI1
3
MTPM
4
MTI2/Guard
5
MTI3
MTI4
5 MTSA
MTI5
MTI6
MTI7
VSS
2
13
MTO0
MTI1 3
12
MTO1
11
MTSA
MTO2/GC
MTPM 4
MTCH105
MTI0
MTI2/ Guard
5
10
MTI3
6
9
MTO3
MTI4
7
8
MTO4
Note: See Table 4 for the pin allocation table.
MTPM
MTI2/Guard
MTI3
MTI4
MTI5
1
2
3
4
5
MTCH108
15
14
13
12
11
MTO1
MTSA
MTO2/GC
MTO3
MTO4
Note: See Table 5 for the pin allocation table.
16
15
14
13
NC
VSS
16-LEAD QFN
VDD
NC
FIGURE 3:
20-LEAD UQFN
MTI1
14
1
VDD
FIGURE 5:
20
19
18
17
16
14-LEAD TSSOP
Note: See Table 5 for the pin allocation table.
6
7
8
9
10
FIGURE 2:
6
MTI6
MTI7
MTO7
MTO6
MTO5
Note: See Table 3 for the pin allocation table.
MTCH108
FIGURE 1:
FIGURE 4:
MTI0
VDD
VSS
MTO0
PIN DIAGRAMS
1
2
3
4
MTCH105
12
11
10
9
MTO0
MTO1
MTSA
MTO2/GC
MTI3
MTI4
MTO4
MTO3
5
6
7
8
MTI0
MTI1
MTPM
MTI2/Guard
Note: See Table 4 for the pin allocation table.
DS40001793C-page 2
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
PIN ALLOCATION TABLES
TABLE 3:
Name
8-PIN DESCRIPTION (MTCH102)
8-Lead
MSOP and
UDFN
Description
VDD
1
Power Supply Input
MTI0
2
Proximity/Touch Sensor 0 Input
MTI1/Guard
3
Proximity/Touch Sensor 1 Input/Active Guard
MTPM
4
Low-Power Mode Select
MTSA
5
Sensitivity Adjust Input
MTO1/GC
6
MTI1 Detect Output (Active-Low)/Guard Control
MTO0
7
MTI0 Detect Output (Active-Low)
VSS
8
Ground
TABLE 4:
14-/16-PIN DESCRIPTION (MTCH105)
14-Lead
TSSOP
16-Lead
QFN
VDD
1
16
Power Supply Input
MTI0
2
1
Proximity/Touch Sensor 0 Input
MTI1
3
2
Proximity/Touch Sensor 1 Input
MTPM
4
3
Low-Power Mode Select
MTI2/Guard
5
4
Proximity/Touch Sensor 2 Input/Active Guard
MTI3
6
5
Proximity/Touch Sensor 3 Input
MTI4
7
6
Proximity/Touch Sensor 4 Input
MTO4
8
7
MTI4 Detect Output (Active-Low)
MTO3
9
8
MTI3 Detect Output (Active-Low)
MTO2/GC
10
9
MTI2 Detect Output (Active-Low) /Guard Control
MTSA
11
10
Sensitivity Adjust Input
MTO1
12
11
MTI1 Detect Output (Active-Low)
MTO0
13
12
MTI0 Detect Output (Active-Low)
VSS
14
13
Ground
Name
2015-2016 Microchip Technology Inc.
Description
Preliminary
DS40001793C-page 3
MTCH102/5/8
TABLE 5:
20-PIN DESCRIPTION (MTCH108)
20-Lead
SSOP
20-Lead
UQFN
VDD
1
18
Power Supply Input
MTI0
2
19
Proximity/Touch Sensor 0 Input
MTI1
3
20
Proximity/Touch Sensor 1 Input
Name
Description
MTPM
4
1
Low-Power Mode Select
MTI2/Guard
5
2
Proximity/Touch Sensor 2 Input/Active Guard
MTI3
6
3
Proximity/Touch Sensor 3 Input
MTI4
7
4
Proximity/Touch Sensor 4 Input
MTI5
8
5
Proximity/Touch Sensor 5 Input
MTI6
9
6
Proximity/Touch Sensor 6 Input
MTI7
10
7
Proximity/Touch Sensor 7 Input
MTO7
11
8
MTI7 Detect Output (Active-Low)
MTO6
12
9
MTI6 Detect Output (Active-Low)
MTO5
13
10
MTI5 Detect Output (Active-Low)
MTO4
14
11
MTI4 Detect Output (Active-Low)
MTO3
15
12
MTI3 Detect Output (Active-Low)
MTO2/GC
16
13
MTI2 Detect Output (Active-Low)/Guard Control
MTSA
17
14
Sensitivity Adjust Input
MTO1
18
15
MTI1 Detect Output (Active-Low)
MTO0
19
16
MTI0 Detect Output (Active-Low)
VSS
20
17
Ground
DS40001793C-page 4
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Typical Circuit............................................................................................................................................................................... 8
3.0 Sensitivity Adjustment .................................................................................................................................................................. 9
4.0 Power Mode and Timeout Reset................................................................................................................................................ 10
5.0 Electrical Specifications.............................................................................................................................................................. 11
6.0 Packaging Information................................................................................................................................................................ 15
Appendix .............................................................................................................................................................................................. 33
The Microchip Website......................................................................................................................................................................... 34
Product Identification System .............................................................................................................................................................. 35
Customer Change Notification Service ................................................................................................................................................ 34
Customer Support ................................................................................................................................................................................ 34
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2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 5
MTCH102/5/8
1.0
DEVICE OVERVIEW
The MTCH102/5/8 provides an easy way to add
proximity or touch detection to any application with
human machine interface. These devices can integrate
up to two, five and eight capacitive touch/proximity
detection sensors which can work through plastic,
wood or even metal front panels with Microchip’s
proprietary Metal over Capacitive technology. It also
supports a wide range of conductive materials as
sensors, like copper pad on PCB, silver ink, PEDOT or
carbon printing on plastic film, Indium Tin Oxide (ITO)
pad, wire/cable, etc.
at run-time. An active-low output will communicate the
state of the sensors to a host/master MCU or drive an
indication LED.
The MTCH102/5/8 uses a sophisticated scan
optimization algorithm to actively attenuate noise from
the signal. The sensitivity adjustment and flexible
power mode allow users to easily configure the device
FIGURE 1-1:
1.1
MTCH102/5/8 BLOCK DIAGRAM
Pin Description
Guard
MTIx
Connect the sensor to this input. An additional resistor
of at least 4.7 kΩ is recommended for best noise
immunity. Sensors work best when the base
capacitance is minimized. This will maximize the
percentage change in capacitance when a finger is
added to the circuit. The recommended sensor
capacitance is 5pF to 50pF.
MTOx
The MTOx pin is an open-drain output which reports
the touch/proximity state of the corresponding MTIx
input. A pull-up resistor is required on each output. The
MTOx will pull the line low when a touch/proximity
event happens and release the line when the touch/
proximity is released.
DS40001793C-page 6
The Guard function is multiplexed with one of the MTIx
pins. If the GC pin is floating, the Guard pin will function
as a standard MTIx sensor. If the GC pin is grounded,
the Guard pin will output a signal in-phase with the
other sensors being scanned. This has several
advantages, such as providing a mutual capacitance
coupling to the sensors to increase sensitivity, and
providing a low-impedance trace near the sensor to
absorb noise. The active guard layout should encircle
the sensor and its traces so that it will shield the sensor.
For more information about guarding and layout
guidelines, see application notes “mTouch® Sensing
Solution Acquisition Methods Capacitive Voltage
Divider” (AN1478) and “Techniques for Robust Touch
Sensing Design” (AN1334).
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
GC
The GC (Guard Control) is multiplexed with one of the
MTOx pins. By grounding the GC pin, the active guard
signal will be enabled on the Guard pin.
MTSA
The MTSA pin is an input that determines the
sensitivity of touch/proximity sensors. Applying VDD will
give the lowest sensitivity while applying VSS will give
the highest.
MTPM
The MTPM pin is an input that determines the power
mode of MTCH10X devices. By connecting VSS to the
MTPM pin, the device will operate in Low-Power mode.
See Figure 5-1 for current consumption and response
time specifications. When applying VDD on the
MTCH10X MTPM pin, the device will scan the sensors
at the fastest possible sampling rate. Host-controlled
sampling rates are available using the Smart Scan
Scheduling feature described in Section 4.0, Power
Mode and Timeout Reset.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 7
MTCH102/5/8
2.0
TYPICAL CIRCUIT
The MTCH102 is used as an example to show two
typical circuits for MTCH10X devices in the following
figures. For more information about capacitive sensor
layout guidance, refer to “Techniques for Robust Touch
Sensing Design” (AN1334).
FIGURE 2-1:
TWO SENSORS AND NO ACTIVE GUARD CIRCUIT
VDD
U1
1
Sensor
R1
2
4.7K
3
0.1uF
VDD
VSS
MTI0
MTO0
MTI1/Guard
4
R2
VDD
C1
MTO1/GC
MTPM
MTSA
8
GND
Sensor
R7
10K
10K
7
MTO0
6
MTO1
R3
5
07&+
4.7K
R6
VDD
10K
R4
MTPM
R5
GND
FIGURE 2-2:
ONE SENSOR WITH ACTIVE GUARD CIRCUIT
VDD
U1
1
R1
2
4.7K
3
Sensor
Active Guard
R2
0
VDD
C1
4
R6
0.1uF
VDD
VSS
MTI0
MTO0
MTI1/Guard
MTPM
MTO1/GC
MTSA
07&+
8
10K
GND
7
MTO0
6
5
R3
VDD
GND
10K
R4
MTPM
R5
GND
DS40001793C-page 8
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
3.0
SENSITIVITY ADJUSTMENT
FIGURE 3-3:
The sensitivity of the sensor inputs determines how far
it can respond to proximity or how much capacitance is
required to activate a touch. The voltage on the
MTCH102/5/8 MTSA pin will determine the sensitivity.
VDD voltage will give the lowest sensitivity, while VSS
voltage will give the highest. The device will sample the
voltage on the MTSA pin after every 32nd scan, so it
does not only support setting a fixed sensitivity by a
resistor ladder, but it also allows adjusting the
sensitivity dynamically while the device is running. A
Digital-to-Analog Converter (DAC) controlled by the
host or a hardware potentiometer can be used to adjust
the sensitivity. Refer to the typical circuit in Figure 3-1
to Figure 3-4.
FIGURE 3-1:
SENSITIVITY
CONTROLLED BY HOST
USING DAC
Host
R2
DAC
FIGURE 3-4:
FIXED SENSITIVITY
USING RESISTOR
LADDER
MTSA
10k
SENSITIVITY
CONTROLLED BY HOST
USING PWM
VDD
R1
R3
Host
MTSA
R
10k
R2
PWM
MTSA
C
Note:
Both R1 and R2 are recommended
to be greater than 100K for lower
power consumption.
FIGURE 3-2:
Note:
HARDWARE SENSITIVITY
ADJUST USING
POTENTIOMETER
Refer to Application Note “Using PWM to
Generate Analog Output” (AN538) for
details about how to choose appropriate
R and C values.
VDD
R2
R1
MTSA
10k
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 9
MTCH102/5/8
4.0
POWER MODE AND TIMEOUT
RESET
FIGURE 4-2:
The MTCH102/5/8 has three power mode options to
meet the needs of various applications: Normal mode,
Low-Power mode and Smart-Scheduling mode. The
state of the MTPM pin determines the power mode.
4.1
Burst Scan
Normal Mode
SMART-SCHEDULING
MODE
Sleep
MTIx
The device will run in Normal mode if the MTPM pin is
connected to VDD. In this mode, the MTCH102/5/8 will
scan continuously; so it will achieve the shortest
response time among the three power modes, but also
the power consumption is the highest.
Scan Interval
MTPM
4.2
Low-Power Mode
The device will run in Low-Power mode if the MTPM pin
is connected to VSS. The device will go to Sleep for
256 ms after each round of sensor scans; so it will
achieve the lowest power consumption, but it will have
the longest response time among the three power
modes, as shown in Figure 4-1.
4.4
FIGURE 4-1:
For the Normal and Low-Power modes, the timeout
duration is 10 seconds. For the Smart-Scheduling
mode, the timeout duration is 400 multiplied by the
scan interval.
Burst Scan
LOW-POWER MODE
Sleep:256ms
Timeout Reset
The device keeps track of the activated state duration
for each MTIx input channel. The sensor state will be
reset once the activated state duration exceeds the
timeout duration, and the associated MTOx pin will
release the line.
MTIx
4.3
Smart-Scheduling Mode
The MTCH102/5/8 also implements a Smart-Scheduling
mode that allows a host to set the exact sampling rate by
pulsing the MTPM pin, as shown in Figure 4-2. The
minimum recognizable pulse width is 25 ns. If the MTPM
pin is toggled during a scan cycle, the device will skip the
next Sleep and immediately start a new set of scans.
DS40001793C-page 10
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
5.0
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin ................................................................................................................................ -0.3V to +4.0V
on all other pins ............................................................................................................. -0.3V to (VDD + 0.3V)
Total power dissipation(1) ............................................................................................................................... 800 mW
Maximum current
out of VSS pin
-40°C TA +85°C for industrial .......................................................................................................... 85 mA
into VDD pin
-40°C TA +85°C for industrial .......................................................................................................... 80 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current
sunk by any I/O pin................................................................................................................................ 25 mA
sourced by any I/O pin........................................................................................................................... 25 mA
Note 1:
Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
5.1
DC Characteristics: MTCH102/5/8
Standard Operating Conditions (unless otherwise
stated)
Operating temperature -40°C ≤ TA ≥ +85°C for industrial
MTCH102/5/8
Param.
No.
Sym.
Characteristic
Min.
Typ.† Max. Units
D001
VDD
Supply Voltage
2.05
—
3.6
V
D002*
VDR
RAM Data Retention Voltage (1)
1.5
—
—
V
VPOR*
Power-on Reset Release Voltage
—
1.6
—
V
VPORR*
Power-on Reset Rearm Voltage
—
0.8
—
V
SVDD
VDD Rise Rate to ensure internal
Power-on Reset signal
0.05
—
—
V/ms
D004*
Conditions
Device in Sleep mode
Device in Sleep mode
*
†
These parameters are characterized but not tested.
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 11
MTCH102/5/8
MTCH10X FAMILY – POWER
VS RESPONSE
TIME
FIGURE 5-1:
!%"
!" !"
FIGURE 5-2:
NPOR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
VSS
NPOR(1)
POR REARM
VSS
TVLOW(2)
TPOR(3)
Note 1:
2:
3:
When NPOR is low, the device is held in Reset.
TPOR 1 s typical.
TVLOW 2.7 s typical.
DS40001793C-page 12
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
5.2
DC Characteristics: MTCH102/5/8-I/E
Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C TA +85°C for industrial
DC CHARACTERISTICS
Param.
Sym.
No.
VIL
D030A
VIH
D040A
IIL
D060
VOL
D080
VOH
D090
Characteristic
Input Low Voltage
I/O PORT:
with TTL buffer
Input High Voltage
I/O ports:
with TTL buffer
Input Leakage Current(1)
I/O ports
Output Low
I/O ports
Min.
Typ.†
Max.
Units
—
—
0.15 VDD
V
1.8V VDD 4.5V
—
—
—
—
V
1.8V VDD 4.5V
—
±5
± 125
nA
—
±5
± 1000
nA
VSS VPIN VDD,
Pin at high-impedance at 85°C
to 125°C
—
—
0.6
V
IOL = 6 mA, VDD = 3.3V
IOL = 1.8 mA, VDD = 1.8V
VDD - 0.7
—
—
V
IOH = 3 mA, VDD = 3.3V
IOH = 1 mA, VDD = 1.8V
0.25 VDD +
0.8
Conditions
Voltage(2)
Output High Voltage(2)
I/O ports
Capacitive Loading Specs on Output Pins
D101A* CIO
All I/O pins
—
—
50
pF
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: Including OSC2 in CLKOUT mode.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 13
MTCH102/5/8
FIGURE 5-3:
BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
VBOR and VHYST
VBOR
(Device in Brown-out Reset)
(Device not in Brown-out Reset)
37
Reset
33
(due to BOR)
TABLE 5-1:
OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET
PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No.
Sym.
Characteristic
Min.
Typ.† Max. Units
Conditions
33*
TPWRT
Power-up Timer Period
40
65
140
ms
34*
TIOZ
I/O High-impedance from RESET
Low or Watchdog Timer Reset
—
—
2.0
s
35
VBOR
Brown-out Reset Voltage
1.80
1.9
2.05
V
37*
VHYST
Brown-out Reset Hysteresis
0
25
50
mV
-40°C to +85°C
38*
TBORDC Brown-out Reset DC Response
Time
0
1
40
s
VDD VBOR
*
†
BORV = 1.9V
These parameters are characterized but not tested.
Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
DS40001793C-page 14
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead UDFN (2x3x0.5 mm)
Example
102
517
17
8-Lead MSOP (3x3 mm)
Example
H102
517017
14-Lead TSSOP (4.4 mm)
Example
XXXXXXXX
YYWW
NNN
MTCH105
1517
017
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC® designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 15
MTCH102/5/8
Package Marking Information (Continued)
16-Lead QFN (4x4x0.9 mm)
PIN 1
Example
PIN 1
MTCH
105
ML
517017
e3
20-Lead SSOP (5.30 mm)
Example
MTCH108
\SS e3
1517017
20-Lead UQFN (4x4x0.9 mm)
PIN 1
Example
PIN 1
MTCH
108
\GZ
514017
e3
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS40001793C-page 16
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC® designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
6.2
Package Details
The following sections give the technical details of the packages.
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2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 17
MTCH102/5/8
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DS40001793C-page 18
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 19
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 20
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 21
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 22
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 23
MTCH102/5/8
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS40001793C-page 24
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
NOTE 1
1
2
E
(DATUM B)
(DATUM A)
2X
0.15 C
2X
TOP VIEW
0.15 C
0.10 C
C
A1
A
SEATING
PLANE
16X
(A3)
0.08 C
SIDE VIEW
0.10
C A B
D2
0.10
C A B
E2
2
e
2
1
NOTE 1
K
N
0.40
16X b
0.10
e
C A B
BOTTOM VIEW
Microchip Technology Drawing C04-127D Sheet 1 of 2
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 25
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Standoff
A1
A3
Contact Thickness
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
b
Contact Width
Contact Length
L
Contact-to-Exposed Pad
K
MIN
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
NOM
16
0.65 BSC
0.90
0.02
0.20 REF
4.00 BSC
2.65
4.00 BSC
2.65
0.30
0.40
-
MAX
1.00
0.05
2.80
2.80
0.35
0.50
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-127D Sheet 2 of 2
DS40001793C-page 26
Preliminary
2015-2016 Microchip Technology Inc.
MTCH102/5/8
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc.
Preliminary
DS40001793C-page 27
MTCH102/5/8
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