MTCH6301
MTCH6301 Projected Capacitive Touch Controller
Description:
Touch Features:
MTCH6301 is a turnkey projected capacitive controller
that allows easy integration of multi-touch and gestures
to create a rich user interface in your design. Through
a sophisticated combination of Self and Mutual
Capacitive scanning for both XY screens and touch
pads, the MTCH6301 allows designers to quickly and
easily integrate projected capacitive touch into their
application.
•
•
•
•
•
Applications:
• Human-Machine Interfaces with Configurable
Button, Keypad or Scrolling Functions
• Single-Finger Gesture-Based Interfaces to Swipe,
Scroll or Doubletap Controls
• Home Automation Control Panels
• Security Control Keypads
• Automotive Center Stack Controls
• Gaming Devices
• Remote Control Touch Pads
Touch Sensor Support:
• Up to 13RX x 18TX Channels
• Individual Channel Tuning for Optimal Sensitivity
• Works with Printed Circuit Board (PCB) Sensors,
Film, Glass and Flexible Printed Circuit (FPC)
Sensors
• Cover Layer Support:
- Plastic: up to 3 mm
- Glass: up to 5 mm
Multi-touch (up to ten touches)
Gesture Detection and Reporting
Single and Dual Touch Drawing
Self and Mutual Signal Acquisition
Built-in Noise Detection and Filtering
Power Management:
• Configurable Sleep mode
• Integrated Power-on Reset and Brown-out Reset
• 200 µA Sleep Current (typical)
Communication Interface:
• I2C™ (up to 400 kbps)
Operating Conditions:
• 2.4V to 3.6V, -40ºC to +105ºC
Package Types:
• 44-Lead TQFP
• 44-Lead QFN
Touch Performance:
• > 100 Reports per Second Single Touch
• > 60 Reports per Second Dual Touch
• Up to 12-Bit Resolution Coordinate Reporting
2012-2014 Microchip Technology Inc.
DS40001663B-page 1
MTCH6301
Table of Contents
1.0 System Block Diagram ................................................................................................................................................................. 3
2.0 Configuration and Setup............................................................................................................................................................... 3
3.0 Pin Diagram.................................................................................................................................................................................. 4
4.0 Pinout I/O Descriptions................................................................................................................................................................. 5
5.0 Layout........................................................................................................................................................................................... 6
6.0 Communication Protocol ............................................................................................................................................................ 12
7.0 Memory Map .............................................................................................................................................................................. 21
8.0 Special Features ........................................................................................................................................................................ 23
9.0 Electrical Characteristics ............................................................................................................................................................ 26
10.0 Ordering Information .................................................................................................................................................................. 30
11.0 Packaging Information................................................................................................................................................................ 31
The Microchip Web Site........................................................................................................................................................................ 38
Customer Change Notification Service................................................................................................................................................. 38
Customer Support................................................................................................................................................................................ 38
Worldwide Sales and Service............................................................................................................................................................... 40
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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DS40001663B-page 2
2012-2014 Microchip Technology Inc.
MTCH6301
1.0
SYSTEM BLOCK DIAGRAM
FIGURE 1-1:
SYSTEM BLOCK DIAGRAM
MTCH6301
Touch Sensor
Gesture Engine
I2CTM
Module
Signal Acquisition Controller
MultiTouch
Decode
Noise Reduction / Filtering Engine
Communications Engine
User Configuration Data
TX0..17
TX Drive
ADC
RX
Sense
RX0..12
[Master Controller]
Touch Data
MICROCHIP
PICkitTM Serial
Analyzer
USB
Connection only for initial tuning or configuration
2.0
CONFIGURATION AND SETUP
The
MTCH6301
is
preconfigured
for
a
12 Receiver (RX)/9 Transmitter (TX) touch sensor,
mapped as shown in Section 5.1 “Typical
Application Circuit”. While the device will work
out-of-the-box using this specific sensor configuration,
most applications will require additional configuration
and sensor tuning to determine the correct set of
parameters to be used in the final application.
Microchip provides a PC-based configuration tool for
this purpose, available in the mTouch™ Sensing
Solution Design Center (www.microchip.com/mtouch).
Use of this tool requires a PICkit™ Serial Analyzer
(updated with MTCH6301 support), as well as access
to the I2C communications bus of the MTCH6301
device.
Once the development process is complete, this
modified parameter set must either be written
permanently to the controller via NVRAM (see
Section 8.3 “Nonvolatile RAM (NVRAM)”), or
alternatively, it can be sent every time the system is
powered on. Both the PICkit Serial Analyzer and the
master I2C controller can be used for this purpose.
2012-2014 Microchip Technology Inc.
DS40001663B-page 3
MTCH6301
3.0
PIN DIAGRAM
44-PIN TQFP, QFN(1,2)
44
43
42
41
40
39
38
37
36
35
34
SCL
TX11
TX10
TX9
VDD
VSS
TX5
TX6
TX7
TX8
TX4
FIGURE 3-1:
1
2
3
4
5
6
7
8
9
10
11
MTCH6301
MTCH6301
33
32
31
30
29
28
27
26
25
24
23
TX0
TX1
TX2
TX3
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX13
TX12
RX10
RX9
VSS
VDD
RESET
RX8
RX7
RX6
RX5
12
13
14
15
16
17
18
19
20
21
22
SDA
TX17
TX16
TX15
TX14
VSS
VCAP
INT
N/C
RX12
RX11
Note 1: All RX/TX are remappable. Refer to Section 5.6 “Sensor Layout Configuration” for further
information.
2: The metal plate at the bottom of the device is not connected to any pins and it is recommended to
be connected to VSS externally.
DS40001663B-page 4
2012-2014 Microchip Technology Inc.
MTCH6301
4.0
PINOUT I/O DESCRIPTIONS
TABLE 4-1:
PINOUT I/O DESCRIPTIONS
Pin Name
Pin Number
Pin Type
RESET
18
I/P
SCL
44
I
Synchronous Serial Clock Input/Output for I2C™
SDA
1
I/O
Synchronous Serial Data Input/Output for I2C™
INT
8
O
Interrupt (from MTCH6301 to master) for I2C™
RX0
27*
I/O
RX1
26
I/O
RX2
25
I/O
RX3
24
I/O
RX4
23
I/O
RX5
22
I/O
RX6
21
I/O
RX7
20
I/O
RX8
19
I/O
RX9
15
I/O
RX10
14
I/O
RX11
11
I/O
RX12
10*
I/O
TX0
33
O
TX1
32
O
TX2
31
O
TX3
30
O
TX4
34
O
TX5
38
O
TX6
37
O
TX7
36
O
TX8
35
O
TX9
41
O
TX10
42
O
TX11
43
O
TX12
13
O
TX13
12
O
TX14
5
O
TX15
4
O
TX16
3
O
Description
Reset Device (active-low)
RX Sense (or TX Drive)
(*RX0/RX12 cannot be used for TX Drive)
TX Drive
TX17
2
O
N/C
9
N/C
VCAP
7
P
CPU Logic Filter Capacitor Connection
VDD
17, 28, 40
P
Positive Supply for Peripheral Logic and I/O Pins
VSS
6, 16, 29, 39
P
Ground Reference for Logic and I/O Pins;
This pin must be connected at all times.
2012-2014 Microchip Technology Inc.
No Connect
DS40001663B-page 5
MTCH6301
5.0
LAYOUT
5.1
Typical Application Circuit
The following schematic portrays a typical application
circuit, based on a 12RX/ 9TX touch sensor.
FIGURE 5-1:
TYPICAL APPLICATION CIRCUIT
VDD
MICROCHIP
PICkitTM Serial
Analyzer
Master I2CTM
Controller
MTCH6301
TX0
TX1
TX2
TX3
VSS
VDD
RX0
RX1
RX2
RX3
RX4
33
32
31
30
29
28
27
26
25
24
23
VDD
0.1 µF
RX0
RX11
12
13
14
15
16
17
18
19
20
21
22
SDA
TX17
TX16
TX15
TX14
VSS
VCAP
INT
N/C
RX12
RX11
TX8
10 µF
1
2
3
4
5
6
7
8
9
10
11
TX13
TX12
RX10
RX9
VSS
VDD
RESET
RX8
RX7
RX6
RX5
GPIO/INT
TX0
SCL
SDA
SCL
TX11
TX10
TX9
VDD
VSS
TX5
TX6
TX7
TX8
TX4
44
43
42
41
40
39
38
37
36
35
34
0.1 µF
20k O
VDD
0.1 µF
5.2
Decoupling Capacitors
The use of decoupling capacitors on power supply
pins, such as VDD and VSS, is required (see
Figure 5-1). Consider the following criteria when using
decoupling capacitors:
1.
Value and type of capacitor:
A value of 0.1 µF (100 nF), 10-20V is recommended.
The capacitor should be a low Equivalent Series
Resistance (low ESR) capacitor and have resonance
frequency in the range of 20 MHz and higher. It is
further recommended that ceramic capacitors be used.
2.
Placement on the Printed Circuit Board:
The decoupling capacitors should be placed as close to
the pins as possible. It is recommended that the
capacitors be placed on the same side of the board as
the device. If layout space is constrained, the capacitor
can be placed on another layer on the PCB and
connected using a via. Please ensure that the trace
length from the pin to the capacitor is less than
one-quarter inch (6 mm) in length.
DS40001663B-page 6
3.
Handling high-frequency noise:
If the board is experiencing high-frequency noise,
upward of tens of MHz, add a second ceramic-type
capacitor in parallel to the above-described decoupling
capacitor. The value of the second capacitor can be in
the range of 0.01 µF to 0.001 µF. Place this second
capacitor next to the primary decoupling capacitor. In
high-speed circuit designs, consider implementing a
decade pair of capacitances as close to the power and
ground pins as possible (for example, 0.1 µF in parallel
with 0.001 µF).
4.
Maximizing performance:
On the board layout from the power supply circuit, run
the power and return traces to the decoupling
capacitors first, and then to the device pins. This
ensures that the decoupling capacitors are first in the
power chain. It is equally important to keep the trace
length between the capacitor and the power pins to a
minimum, thereby reducing PCB track inductance.
2012-2014 Microchip Technology Inc.
MTCH6301
5.3
Bulk Capacitors
The use of a bulk capacitor is recommended to improve
power supply stability. Typical values range from 4.7 µF
to 47 µF. This capacitor should be located as close to
the device as possible.
5.4
Capacitor on Internal Voltage
Regulator (VCAP)
A low ESR (1 ohm) capacitor is required on the VCAP
pin, which is used to stabilize the internal voltage
regulator output. The VCAP pin must not be connected
to VDD and must have a CEFC capacitor with at least a
6V rating, connected to ground. The type can be
ceramic or tantalum.
5.5
5.5.1
Touch Sensor Design
Considerations
SENSOR PATTERNS AND PCB
LAYOUT
With regard to touch sensor patterns, please refer to
the
mTouch
Design
Center
(www.microchip.com/mtouch) for additional information on designing and laying out a touch sensor pattern, as well as
using the correct techniques for PCB trace routing.
5.5.2
PROTOTYPING DESIGNS
Due to their complexity, touch sensor designs typically
require a thorough debugging phase to ensure a
reliable product. If possible, it is suggested that flexible
prototyping hardware be created with this in mind. A
common example is providing external access to the
communication lines for quick test and tuning while
in-circuit.
Microchip’s
Projected
Capacitive
Configuration Utility (PCU) and a configured PICkit
Serial Analyzer can assist with early prototype
development. See the online Microchip MTCH6301
device page for these and other support materials.
5.5.3
5.5.4
OPERATION WITH AN LCD
MTCH6301 has integrated algorithms to detect and
minimize the effects of noise, but proper care should
always be taken in selecting an LCD and support
components with a focus on reducing noise as much as
possible. Since the interaction between the touch
sensor and display is highly dependent upon the
physical arrangement of the components, proper
testing should always be executed with a fully
integrated device. Please reference your projected
capacitive touch screen manufacturer’s integration
guide for additional design considerations.
5.6
Sensor Layout Configuration
To properly configure a sensor from a physical layout
standpoint, the following registers must be correctly
set:
• RX Pin Map/TX Pin Map
• RX Scaling Coefficient/TX Scaling Coefficient
• Flip State
5.6.1
RX/TX PIN MAP
By default, the RX and TX pins are set as shown in the
Typical Application Circuit (see Section 5.1 “Typical
Application Circuit”). It is recommended to keep this
layout if possible. If a different layout or a different
amount of sensor channels is required, the RX and TX
pins are configured via the Pin Map register arrays. To
access these arrays, please reference Section 6.0
“Communication Protocol” and Section 7.0
“Memory Map”.
The RX and TX lines are configurable for the purpose
of making trace routing and board layout more
convenient. Please note that while RX pins can be
used as TX pins instead, a single pin cannot be used
as both an RX and a TX channel concurrently. The pin
maps are comprised of Pin Map ID numbers, which are
shown in Table 5-1.
SENSOR OVERLAY MATERIAL
To prevent saturation of sensor levels, a minimum
0.5 mm plastic or glass overlay is required for proper
operation of the device, even during a prototyping
phase, even if this value is different than the final
design.
Note:
At no time should the device be expected
to respond correctly to a user touching a
bare PCB sensor.
2012-2014 Microchip Technology Inc.
DS40001663B-page 7
MTCH6301
5.6.2
TABLE 5-1:
PIN MAP ID CHART
Pin
Map ID
(RX)
Map ID
(TX)
RX0
8
—
RX1
7
26
RX2
6
25
RX3
5
12
RX4
4
11
RX5
3
10
RX6
2
9
RX7
1
1
RX8
0
0
RX9
9
24
RX10
10
23
RX11
11
22
RX12
12
—
TX0
—
13
TX1
—
6
TX2
—
3
TX3
—
2
TX4
—
4
TX5
—
30
TX6
—
29
TX7
—
28
TX8
—
7
TX9
—
14
TX10
—
15
TX11
—
16
TX12
—
5
TX13
—
8
TX14
—
34
TX15
—
33
TX16
—
32
TX17
—
31
DS40001663B-page 8
RX/ TX SCALING COEFFICIENT
Scaling coefficient registers exist in RAM for each axis
(RX/TX) and must be modified in accordance with the
number of channels that are in use (see Table 5-2).
See Section 7.0 “Memory Map” for the location of
these parameters.
TABLE 5-2:
Number of
Channels
RX/TX SCALING
COEFFICIENTS
RX/TX Scaling Coefficient
(Base 10)
(Base 16)
3
21845
0x5555
4
16384
0x4000
5
13107
0x3333
6
10922
0x2AAA
7
9362
0x2492
8
8192
0x2000
9
7281
0x1C71
10
6553
0x1999
11
5957
0x1745
12
5461
0x1555
13
5041
0x13B1
14
4681
0x1249
15
4369
0x1111
16
4096
0x1000
17
3855
0x0F0F
18
3640
0x0E38
2012-2014 Microchip Technology Inc.
MTCH6301
5.6.3
SENSOR ORIENTATION (FLIP
STATE)
Once the sensor layout is complete, the final output
orientation is configured using the Flip State register, as
shown in Register 5-1. The Flip State register can be
adjusted during operation to support applications
where rotation occurs during use. Possible flip state
configurations are detailed in Figure 5-2.
Figure 5-2 shows the flip state values for all possible
sensor orientations.
REGISTER 5-1:
FLIP STATE REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-1
—
—
—
—
—
SWAP
TXFLIP
RXFLIP
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
Unimplemented: Read as ‘0’
bit 2
SWAP:
1 = RX axis horizontal; TX axis vertical
0 = RX axis vertical; TX axis horizontal
bit 1
TXFLIP:
1 = Invert the TX axis
0 = Do not invert the TX axis
bit 0
RXFLIP:
1 = Invert the RX axis
0 = Do not invert the RX axis
2012-2014 Microchip Technology Inc.
x = Bit is unknown
DS40001663B-page 9
MTCH6301
FIGURE 5-2:
SENSOR ORIENTATION CHART
TXn
0, 0
4096, 0
SENSOR
0, 4096
0, 0
4096, 0
0, 4096
4096, 0
SENSOR
0, 4096
0
1
1
4096, 0
SENSOR
0, 4096
TXn
RXn
SENSOR
RXn
SWAP
TXFLIP
RXFLIP
0
0
0
0, 0
4096, 0
0, 0
4096, 0
SENSOR
4096, 4096
RX0
RX0
1
0
0
SWAP
TXFLIP
RXFLIP
1
0
1
TXn
4096, 0
SENSOR
0, 4096
SWAP
TXFLIP
RXFLIP
4096, 4096
0, 0
RXn
TXn
1
1
1
TX0
RXn
TX0
0
0
1
SWAP
TXFLIP
RXFLIP
4096, 4096
0, 4096
SWAP
TXFLIP
RXFLIP
1
1
0
TXn
SENSOR
RX0
SWAP
TXFLIP
RXFLIP
4096, 4096
0, 4096
RXn
0, 0
4096, 0
RX0
TXn
4096, 4096
TXn
RX0
TX0
SWAP
TXFLIP
RXFLIP
RX0
0, 0
0, 0
0, 4096
4096, 4096
TX0
RXn
RXn
RX0
TX0
RXn
SENSOR
TX0
0
1
0
4096, 4096
TX0
RX0
TXn
SWAP
TXFLIP
RXFLIP
4096, 4096
TX0
Default Configuration
5.6.4
UNUSED RX/TX PINS
Unused RX/TX pins are driven to VSS automatically
and should be left as no connects.
DS40001663B-page 10
2012-2014 Microchip Technology Inc.
MTCH6301
5.7
Example Custom Application
Layout
An example 4RX/11TX sensor is shown in Figure 5-3.
In addition to using a completely modified pin layout,
this example differs from the default configuration by
also having the TX axis along the bottom (X) and RX
axis along the side (Y). Note that some RX pins are
also used as TX lines in this example.
FIGURE 5-3:
CUSTOM APPLICATION LAYOUT
SCL
TX11
TX10
TX9
VDD
VSS
TX5
TX6
TX7
TX8
TX4
Sensor Line
MTCH6301
TX0
TX1
TX2
TX3
VSS
VDD
RX0
RX1
RX2
RX3
RX4
TX
TX13
TX12
RX10
RX9
VSS
VDD
RESET
RX8
RX7
RX6
RX5
SDA
TX17
TX16
TX15
TX14
VSS
VCAP
INT
N/C
RX12
RX11
RX3
RX
SENSOR
TX0
MTCH6301 Pin
Map ID
0
TX10
15
1
TX11
16
2
TX17
31
3
TX16
32
4
TX15
33
5
TX14
34
6
RX11
22
7
TX13
8
8
TX12
5
9
RX10
23
10
RX9
24
0
RX5
3
1
RX6
2
2
RX7
1
3
RX8
0
The Pin Map register array for this particular setup is set
as follows:
RX0
RX Pin Map: {3,2,1,0}
TX Pin Map: {15,16,31,32,33,34,22,8,5,23,24}
TX10
The resulting scaling coefficient for the custom
application example is shown in Table 5-3. The scaling
coefficients were derived using Table 5-2.
TABLE 5-3:
Axis
CUSTOM APPLICATION
SCALING VALUES
Channels
Scaling Coefficient
RX
4
16384
TX
11
5957
Using Figure 5-2, the Flip State register should be set
to ‘0b110’ or 0x6.
2012-2014 Microchip Technology Inc.
DS40001663B-page 11
MTCH6301
6.0
COMMUNICATION PROTOCOL
6.1
Overview
The MTCH6301 I2C protocol follows a serial streaming
format, not a register-based protocol. To achieve this,
the device will assert the INT pin whenever a new
packet of data is ready to be transmitted to the host.
This will happen under two conditions:
1.
2.
New touch or gesture data is available.
A command has been sent to the controller and
the response to this command is ready.
Note:
6.2
6.2.1
Note that initiating a read from the device
when INT is in a logic ‘0’ state will result in
an unpredictable response.
I2C™ Pin Specification
SERIAL DATA (SDA)
The Serial Data (SDA) signal is the data signal of the
device. The value on this pin is latched on the rising
edge of the SCL signal when the signal is an input. With
the exception of the Start (Restart) and Stop conditions,
the high or low state of the SDA pin can only change
when the clock signal on the SCL pin is low. During the
high period of the clock, the SDA pin’s value (high or
low) must be stable. Changes in the SDA pin’s value
while the SCL pin is HIGH will be interpreted as a Start
or a Stop condition.
6.2.2
SERIAL CLOCK (SCL)
The Serial Clock (SCL) signal is the clock input signal
of the device, generated by the host. The rising edge of
the SCL signal latches the value on the SDA pin.
MTCH6301 employs clock stretching and this should
be taken into account by the master controller. The
maximum speed at which MTCH6301 can operate is
400 kbps.
6.2.3
INTERRUPT (INT)
This pin is utilized by MTCH6301 to signal that data is
available and that the master controller should invoke
a master read. INT is an active-high pin and is held low
during all other activities.
Note:
6.2.4
If the device is not read within 25 ms of
asserting the INT pin, a timeout will occur
and data will no longer be available.
DEVICE ADDRESSING
The MTCH6301 7-bit base address is 0x25 and is not
configurable by the user. Every transmission must be
prefixed with this address, as well as a bit signifying
whether the transmission is a master write (‘0’) or
master read (‘1’). After appending this Read/Write bit to
the base address, this first byte becomes either 0x4A
(write) or 0x4B (read).
DS40001663B-page 12
2012-2014 Microchip Technology Inc.
MTCH6301
6.3
Generic Read/Write Protocol
6.3.1
MASTER READ WAVEFORM
FIGURE 6-1:
MASTER READ WAVEFORM
2
1
(DATA)
SDA
0x25
R
S
[NUM_BYTES]
1
ACK
D7 D6 D5 D4 D3 D2 D1 D0
[DATA0]
ACK
D7 D6 D5 D4 D3 D2 D1 D0
[DATAn]
ACK
D7 D6 D5 D4 D3 D2 D1 D0
NACK
P
SCL
INT
4
3
Start
Stop
Note 1: The first byte read from the device denotes the number of bytes to follow.
2: The last byte read from the device must be followed by a nACK (‘1’) from the host controller. All other bytes
should be followed with ACK (‘0’).
3: INT will be set low within 10 uS of a correct I2C™ address match.
4: All data (DATA0 – DATAn) must be read at once within a single I2C™ transaction, and Restart conditions
are not supported.
6.3.2
MASTER WRITE WAVEFORM
FIGURE 6-2:
MASTER WRITE WAVEFORM
2
(DATA)
SDA
0x25
S
[NUM_BYTES]
0
W
1
ACK
D7 D6 D5 D4 D3 D2 D1 D0
[DATA0]
ACK
D7 D6 D5 D4 D3 D2 D1 D0
[DATAn]
ACK
D7 D6 D5 D4 D3 D2 D1 D0
ACK
P
SCL
INT
Start
3
Stop
Note 1: If the device is sleeping, it will ACK the address byte, but will not ACK the first byte of the transmission
until it is awake. See Section 9. “Send Enable Touch command (0x00).” for details.
2: The first byte written to the controller denotes the number of bytes to follow.
3: Although it is not required all data be written in a single I2C™ transaction, it is recommended to reduce
the chance of a timeout occurring.
2012-2014 Microchip Technology Inc.
DS40001663B-page 13
MTCH6301
6.3.3
TOUCH PACKET PROTOCOL
Fully-processed touch coordinates will be sent out as
they are processed by MTCH6301. Since it is a slave
device, the INT pin will be asserted whenever one of
these packets is ready for transmission, requiring the
master to initiate a Read command. In other words, no
Write command is necessary before reading one of
these packets.
FIGURE 6-3:
EXAMPLE TOUCH PACKET WAVEFORM
INT
SCL
DATA
0x4B
0x05
0x81
0x7D
0x05
0x6A
0x01
Start
Stop
Touch ID0, Pen
Down
0x4B
Byte
Bit 7
D0
1
D1
0
D2
0
D3
0
D4
0
Bit 6
0x05
Bit 5
X: 765
[D1]
[D0]
Bit 4
[D2]
Bit 3
TOUCHID
Y: 234
[D3]
[D4]
Bit 2
Bit 1
Bit 0
TCH (0)
0
PEN
X
0
0
0
0
X
Y
TOUCHID:
Touch ID (0-9)
PEN:
Pen State
Y
0 = Pen Up
1 = Pen Down
X:
X Coordinate of touch
Y:
Y Coordinate of touch
TCH:
Always ‘0’; it denotes a touch packet (vs. gesture)
DS40001663B-page 14
2012-2014 Microchip Technology Inc.
MTCH6301
6.4
Gesture Protocol
Similar to touch packets, the following packet is
transmitted whenever a gesture is performed on the
sensor. This feature can be enabled via the Comm
Packet CFG register (see Section 7.0 “Memory
Map”).
Note 1: Gestures are not enabled by default.
2: For any hold gestures, packets are
continuously sent until the gesture is no
longer being held.
FIGURE 6-4:
GESTURE PACKET WAVEFORM
INT
SCL
DATA
0x4B
0x02
0x84
0x61
Start
Stop
Gesture from
ID1
0x4B
Byte
Bit 7
D0
1
D1
0
Bit 6
Bit 4
[D1]
[D0]
Bit 3
TOUCHID
Bit 2
Bit 1
Bit 0
GEST -1
0
0
GESTURE
TOUCHID:
Touch ID (0-9)
GESTURE:
Gesture ID
GEST:
Bit 5
0x02
Swipe Left
0x10
Single Tap
0x20
Double Tap
0x11
Single Tap (hold)
0x31
Up Swipe
0x32
Up Swipe (hold)
0x41
Right Swipe
0x42
Right Swipe (hold)
0x51
Down Swipe
0x52
Down Swipe (hold)
0x61
Left Swipe
0x62
Left Swipe (hold)
Always ‘1’; it denotes a gesture packet (vs. touch)
2012-2014 Microchip Technology Inc.
DS40001663B-page 15
MTCH6301
6.5
Command Protocol
Bidirectional
reading/writing
Figure 6-5.
communication
protocol
(for
configuration data) is shown in
FIGURE 6-5:
COMMAND PROTOCOL
I2CTM Data
Command
(I2C
TM
Write)
0x4A
0x4B NUM0
Response
TM
Read)
[D0]
...
[Dn]
RES
CMD
[D0]
INT
I2CTM Data
(I2C
0x55 NUM CMD
0x55 NUM1
...
[Dn]
INT
NUM:
Number of bytes to follow (true for NUM, NUM0, NUM1).
CMD:
Command sent/ responded to
RES:
Status result of command:
0x00 = Success
0x80 = Parameter out of range
0xFE = Timeout (not enough bytes received)
0xFF = Unrecognized command
0xFD = Invalid parameter
0xFC = Missing or extra parameter
D0 - Dn:
6.6
Data associated with command
Full Command Set
A complete listing of MTCH6301 commands is shown
in Table 6-1. Any commands which contain additional
data bytes, either sent or received, are shown
alongside an example data stream in the following
sections.
6.6.1
OVERVIEW
TABLE 6-1:
COMMAND SET
CMD ID
0x00
Name
Description
Enable Touch
Enable Touch functionality
0x01
Disable Touch
Disable Touch functionality
0x14
Scan Baseline
Instruct controller to scan for new sensor baseline immediately
0x15
Write Register
Write data to specified register
0x16
Read Register
Read data from specified register
0x17
Write NVRAM
Write all current register values to NVRAM
0x18
Software Sleep
Instruct controller to enter Sleep mode
0x19
Erase NVRAM
Erase the contents of the nonvolatile RAM section
0x1A
Manufacturing Test
Perform manufacturing tests on all sensor I/O channels
0x83
Device ID
Retrieve device ID/version
DS40001663B-page 16
2012-2014 Microchip Technology Inc.
MTCH6301
6.6.2
WRITE REGISTER/ READ
REGISTER
It writes or reads to a single register. Please note that
all registers are volatile, and any modified data will be
lost on power-down. To store the current register
configuration permanently, the Write NVRAM
command should be used.
FIGURE 6-6:
WRITE REGISTER COMMAND
Command
(I2CTM Write)
0x4A
0x55
0x04
0x15
[D0]
[D1]
0x4B
0x04
0x55
0x02
0x00
0x15
[D2]
INT
Response
(I2CTM Read)
INT
D0 = Index Location
D1 = Offset Location
D2 = Value to Write to Specified Register
FIGURE 6-7:
READ REGISTER COMMAND
Command
(I2CTM Write)
0x4A
0x55
0x03
0x15
[D0]
[D1]
0x4B
0x05
0x55
0x03
0x00
0x16
INT
Response
(I2CTM Read)
[D2]
INT
D0 = Index Location
D1 = Offset Location
D2 = Read Value at Specified Register
2012-2014 Microchip Technology Inc.
DS40001663B-page 17
MTCH6301
6.6.3
MANUFACTURING TEST
This test performs the following checks on all mapped
sensor pins:
1.
2.
3.
Short to VDD
Short to GND
Pin-to-pin short.
If an I/O error is discovered, bits for the pins in question
will be set in the TX Short Status and RX Short Status
registers.
Please note that:
1.
2.
The RX7/RX8 pins will always report an error.
If the sensor has more than 16 TX channels,
then channels 17 and 18 will never report an
error.
FIGURE 6-8:
MANUFACTURING TEST
Command
(I 2 C TM Write)
0x4A
0x55
0x01
0x1A
0x4B
0x05
0x55
0x03
INT
Response
(I 2 C TM Read)
0x00
0x1A
[D0]
INT
D0 = Result; 0 = success, 1 = I/O error
6.6.4
DEVICE ID
It allows the host to read the device ID.
FIGURE 6-9:
Command
(I2CTM Write)
DEVICE ID
0x4A
0x55
0x01
0x83
0x4B
0x05
0x55
0x03
INT
Response
(I2CTM Read)
0x00
0x83
0X00 0X10 0X02 0X05
INT
DS40001663B-page 18
2012-2014 Microchip Technology Inc.
MTCH6301
6.6.5
TYPICAL I2C COMMAND
TRANSMISSION
Figure 6-10 depicts the master controller reading from
RAM location 0x01, to determine the number of RX
channels the controller is configured to use (0x0C or
12).
FIGURE 6-10:
I2C™ COMMAND READ AND WRITE
Master Write
INT
SDA
SCL
DATA
4A
55
03
16
00
01
Master Read
(Controller Response)
Start
Stop
INT
SDA
SCL
DATA
4B
05
55
03
00
16
0C
Start
6.7
Wake on I2C
The MTCH6301 is capable of waking up upon receiving
an I2C command from the host. Please note that since
wake-up time can take up to 350 µs, the controller must
resend any I2C bytes that were not acknowledged
(ACK) before continuing the transmission.
Since the controller will wake up upon a correct I2C
address match, it does not matter which command is
sent. For simplicity, the Enable Touch command is
recommended.
Stop
6.8
RESET Pin Behavior
The MTCH6301 can be reset by driving the RESET pin
low. When released, the device will assert the INT pin
until it has finished initialization routines. During this
time, any communication to the I2C address (0x25) will
result in a nACK.
FIGURE 6-11:
INT BEHAVIOR AFTER
RESET
tRST
RESET
INT
80 ms < tRST < 100 ms
2012-2014 Microchip Technology Inc.
DS40001663B-page 19
MTCH6301
6.9
Recommended Start-up Sequence
For ease of use, it is recommended that all custom
parameters be stored in NVRAM at the time of
production (or on first power-on) for the lifetime of the
chip. Once this has been completed, the start-up
procedure for the rest of the product’s life should be as
follows:
1.
2.
3.
4.
5.
Prepare I2C master/host controller; initialize any
components of the system that depend upon the
MTCH6301 output.
Set RESET low for > 5 µs.
Set RESET high.
Wait for low state on INT.
If desired, check for correct device operation by
using the Device ID command.
Note:
If the application is designed to use the
default parameters, the above start-up
procedure should be used.
If the application is such that using the NVRAM to store
custom parameters isn’t possible, the following start-up
procedure is recommended:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Prepare I2C master/host controller; initialize any
components of the system that depend upon the
MTCH6301 output.
Set RESET low for > 5 µs.
Set RESET high.
Wait for low state on INT.
If desired, check for correct device operation by
using the Device ID command.
Send Disable Touch command (0x01).
Write all desired parameters to the device.
Send Scan Baseline command (0x14).
Send Enable Touch command (0x00).
DS40001663B-page 20
2012-2014 Microchip Technology Inc.
2012-2014 Microchip Technology Inc.
7.0
MEMORY MAP
TABLE 7-1:
Group
General
Sensor Map
Self
Mutual
Decoding
MTCH6301 MEMORY MAP
Index
Byte
0x00
Offset
Byte
Register Name
Size
(Bytes)
Description
Data Range
Default Value
0x01
RX Channels
1
Number of RX Sensor Channels
3-13
12
0x02
TX Channels
1
Number of TX Sensor Channels
3-18
9
0x04
RX Scaling
2
RX Scaling Coefficient
3640-21845
5461
0x05
RX Scaling
0x06
TX Scaling
2
TX Scaling Coefficient
3640-21845
7281
0x07
TX Scaling
0x01
0x00-0x0C RX Pin Map
13
RX Pin Map Array
0-12
Section 5.6.1
“RX/TX Pin
Map”
0x02
0x00-0x12 TX Pin Map
18
TX Pin Map Array
0-34
Section 5.6.1
“RX/TX Pin
Map”
0x10
0x20
0x30
0x00
Self Scan Time
1
Number of self readings to sum per electrode
0x01
Self Threshold
1
Threshold at which a touch may be present
1-30
5
10-150
40
Mutual Scan Time
1
Number of mutual readings to sum per node
1-30
9
Mutual Threshold
1
Threshold at which a touch may be present
10-150
40
0x00
Flip State
1
This determines the orientation of the sensor with respect to the
coordinate output
0b000-0b111
0b001
0x01
Number of Averages
1
Number of previous touch coordinates to average with current position
coordinate (smoothing filter)
1-16
8
0x04
Minimum Touch Distance
1
Minimum distance (interpolated coordinates) allowed between two touch
locations before suppressing the weaker touch.
0-255
150
0x05
Pen Down Timer
1
Number of successive sensor scans identifying a touch required prior to
transmitting touch data
0-10
3
0x06
Pen Up Timer
1
Number of successive sensor scans without detecting a touch prior to a
touch up packet being sent
0-10
3
0x07
Touch Suppression Value
1
The maximum number of touch points to transmit. Note that ten touch IDs
are still analyzed and tracked, just not reported; 0 = Disabled
0-10
0
MTCH6301
DS40001663B-page 21
0x00
0x01
Group
Gestures
Configuration
2012-2014 Microchip Technology Inc.
I/O Status
MTCH6301 MEMORY MAP (CONTINUED)
Index
Byte
0x50
0xF0
0xF1
Offset
Byte
Register Name
Size
(Bytes)
Description
Data Range
Default Value
0x00
RX Swipe Length
1
Minimum swipe distance in the RX direction before gesture is recognized
10-255
160
0x01
TX Swipe Length
1
Minimum swipe distance in the TX direction before gesture is recognized
10-255
150
0x02
Swipe Boundary
1
The distance (in interpolated positions) a swipe can move, in the direction
opposite to the direction being swiped, before the gesture is canceled.
0-255
150
0x03
Swipe Hold Threshold
1
The maximum distance (in interpolated positions) a swipe-and-hold
gesture can move before the gesture is canceled
0-255
70
0x04
Swipe Time
2
200
Swipe Time
The maximum amount of time (in ms) the user has to perform a swipe
after initial pen down
0-65535
0x05
0x06
Tap Time
2
500
Tap Time
The maximum amount of time (in ms) the user has to perform a click after
initial pen down
0-65535
0x07
0x08
Tap Threshold
1
The maximum distance (in interpolated positions) a tap gesture can move
before it is no longer recognized as a tap
1-255
120
0x09
Minimum Swipe Velocity
1
The minimum velocity a swipe must maintain to be a swipe gesture.
Values below this will either cancel the gesture (if touch removed) or
move to the swipe-and-hold state (if touch is still present)
1-50
3
2
The maximum amount of time allowed between the two taps of a double
tap (in ms)
50-1000
350
0x0A
Double Tap Time
0x0B
Double Tap Time
0x0C
Gesture Edge Keep-out
1
This value determines the width of a keep-out barrier around the edge of
the active touch area. This helps remove edge-effect issues.
0-255
128
0x00
SLP
4
Duration (in ms) without touch activity before the controller enters Sleep
state
0-4,294,967,295
8000
1
Touch Packet Configuration – Enabled: 0x81, Disabled: 0x01
0x81, 0x01
0x81
0x01
SLP
0x02
SLP
0x03
SLP
0x07
Touch Packet CFG
0x09
Gesture Packet CFG
1
Gesture Packet Configuration – Enabled: 0x81, Disabled: 0x01
0x81, 0x01
0x01
0x0A
Status Packet CFG
1
Status Packet Configuration – Enabled: 0x81, Disabled: 0x01
0x81, 0x01
0x01
2
Identifies which TX pins are shorted after using Manufacturing Test
command - read only
0x00-0xFF
0x00
2
Identifies which RX pins are shorted after using Manufacturing Test
command - read only
0x00-0xFF
0x00
0x02
TX Short Status
0x03
TX Short Status
0x06
RX Short Status
0x07
RX Short Status
MTCH6301
DS40001663B-page 22
TABLE 7-1:
MTCH6301
8.0
SPECIAL FEATURES
8.1
Gestures
Single-finger gestures are a fast and intuitive way to
navigate a feature-rich human-machine interface.
MTCH6301 supports 11 single finger gestures natively,
without requiring interaction from the master processor.
Tuning may be required depending on the layout of the
sensor, the time duration and length of activation
required for your gesture-supported application. The
most common defaults are already preloaded and
should serve most applications. These parameters and
their descriptions are available in the “Gestures”
section of the memory map (see Section 7.0 “Memory
Map”).
Note:
Gestures are not enabled by default, and
must be enabled via the gesture packet
configuration byte in RAM (see
Section 7.0 “Memory Map”).
If your application requires only gesture functionality,
and does not require touch coordinates, the touch
packet configuration byte (see Section 7.0 “Memory
Map”) can be used to turn off all touch coordinate data.
TABLE 8-1:
Icon
GESTURE TYPES
Gesture Type
Tap (Click)
Icon
Gesture Type
Tap and Hold
Double Tap (Double Click)
Swipe Down
Swipe Down and Hold
Swipe Up
Swipe Up and Hold
Swipe Right
Swipe Right and Hold
Swipe Left
Swipe Left and Hold
2012-2014 Microchip Technology Inc.
DS40001663B-page 23
MTCH6301
8.2
Sleep
Sleep functionality is enabled by default, and follows
the behavior shown in Figure 8-1. This functionality can
be modified via the SLP register (see Section 7.0
“Memory Map”).
The SLP register is the time (in ms) without touch
activity before controller enters Sleep mode.
FIGURE 8-1:
SLEEP FUNCTIONALITY
[Normal Full Decode
of Sensor]
Touch?
Yes
No
Transmit
Touch
No touch for No
[SLP] ms?
Yes
Sleep for
ms
No
Wake up;
Touch exists?
8.3
Yes
Nonvolatile RAM (NVRAM)
Permanent storage of parameters that have been
modified can be achieved using the internal NVRAM.
This NVRAM is not meant for continuous writing, as it
has a low write-cycle limit of 20,000.
Upon start-up, the NVRAM’s data (if present) is loaded
into the controller. If no data is available in the NVRAM,
the device defaults are loaded instead.
Please note that RAM parameters cannot be
individually written to the NVRAM. They are all written
with only one command. See the applicable command
within the command set for more details. (Section 6.6
“Full Command Set”)
DS40001663B-page 24
2012-2014 Microchip Technology Inc.
MTCH6301
8.4
Touch Performance
Using default acquisition parameters, Figure 8-2
shows the relationship of single-touch report rate with
regard to sensor size.
FIGURE 8-2:
REPORT RATE VS SENSOR SIZE
Report Rate (PPS) vs Sensor Size (Channels)
400
300
200
100
0
2x2
2012-2014 Microchip Technology Inc.
4x4
6x6
8x8
12x9
13x15
DS40001663B-page 25
MTCH6301
9.0
ELECTRICAL
CHARACTERISTICS
This section provides an overview of the MTCH6301
electrical characteristics. Additional information will be
provided in future revisions of this document as it
becomes available.
Absolute Maximum Ratings(†)
9.1
Ambient temperature under bias ........................................................................................................ -40°C to +85°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin ................................................................................................................................. -0.3V to +4.0V
on all other pins ............................................................................................................... 0.3V to (VDD + 0.3V)
Maximum current
out of VSS pin .......................................................................................................................................300 mA
into VDD pin(s) ..................................................................................................................................... 300 mA
sunk by all ports .................................................................................................................................. 200 mA
sourced by all ports .............................................................................................................................200 mA
Maximum output current
sunk by any I/O pin ................................................................................................................................ 15 mA
sourced by any I/O pin .......................................................................................................................... 15 mA
Note:
This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and
protect the device in an application may cause partial to complete failure of the device.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
9.2
Standard Operating Conditions
The standard operating conditions for any device are defined as:
Operating Voltage:
Operating Temperature:
VDDMIN VDD VDDMAX
TA_MIN TA TA_MAX
VDD — Operating Supply Voltage(1)
MTCH6301
VDDMIN .................................................................................................................................... +2.4V
VDDMAX .................................................................................................................................... +3.6V
TA — Operating Ambient Temperature Range
Industrial Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................. +105°C
Note 1:
Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations. See Table 9-1 to calculate device
specifications.
DS40001663B-page 26
2012-2014 Microchip Technology Inc.
MTCH6301
9.3
DC Characteristics
TABLE 9-1:
THERMAL OPERATING CONDITIONS
Symbol
Rating
Min.
Typ.
Max.
Units
TJ
Operating Junction Temperature Range
-40
—
+125
⁰C
TA
Operating Ambient Temperature Range
-40
—
+85
⁰C
PD
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD-? IOH)
I/O Pin Power Dissipation:
PI/O = ? (({VDD - VOH} x IOH) + ? (VOLx IOL))
PINT + PI/O
W
Maximum Allowed Power Dissipation
(TJ-TA)/θJA
W
PDMAX
TABLE 9-2:
THERMAL PACKAGING CHARACTERISTICS
Symbol
Characteristics
Typ.
Max.
Units
θJA
Package Thermal Resistance, 44-pin QFN
32
—
⁰C/W
θJA
Package Thermal Resistance, 44-pin TQFP
45
—
⁰C/W
TABLE 9-3:
OPERATING VOLTAGE AND CURRENT
Symbol
Min.
Typ.
Max.
Units
VDD
Supply Voltage
2.3
—
3.6
V
—
VBOR
BOR Event on VDD transition high-to-low
2.0
—
2.3
V
—
IDD
Operating Current
—
19
25
mA
Note 1
ISLP
Sleep Current
—
200
245
µA
Note 1, 2
Note 1:
2:
Symbol
VIH
VOL
VOH
VBOR
Note 1:
2:
Conditions
Parameter is characterized, but not tested.
Device configured with default parameters.
TABLE 9-4:
VIL
Characteristics
PIN INPUT AND OUTPUT SPECIFICATIONS
Characteristic / Pins
Min.
Max.
Units
Conditions
RX, TX
VSS
0.15 VDD
V
—
SDA, SCL
VSS
0.3 VDD
V
Note 1
RX, TX
0.65 VDD
VDD
V
Note 1
SDA, SCL
0.65 VDD
VDD
V
Note 1
INT, RX, TX
VSS
0.4
V
IOL 10 mA, VDD = 3.3V
SDA, SCL
VSS
0.4
V
IOL 10 mA, VDD = 3.3V(1,2)
INT, RX, TX
2.4
VDD
V
IOH 10 mA, VDD = 3.3V
SDA, SCL
—
—
V
Note 2
Brown-out Event on VDD
Transition high-to-low
2.0
2.3
V
Min. not tested
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Parameter is characterized, but not tested.
Open drain structure.
2012-2014 Microchip Technology Inc.
DS40001663B-page 27
MTCH6301
9.4
AC Characteristics and Timing Parameters
TABLE 9-5:
RESET TIMING
Symbol
TPU
TBOR
Note 1:
2:
Characteristic
Min.
Typ.
Max.
Units
Conditions
Power-up Period
—
400
—
µs
Notes 1, 2
Brown-out Pulse Width (Low)
—
1
—
µs
Note 1
Parameter is characterized, but not tested.
Power-up period is for core operation to begin and it does not reflect response time to a touch.
FIGURE 9-1:
I2C™ BUS START/STOP BIT TIMING CHARACTERISTICS
FIGURE 9-2:
I2C™ BUS DATA TIMING CHARACTERISTICS
DS40001663B-page 28
2012-2014 Microchip Technology Inc.
MTCH6301
TABLE 9-6:
I2C™ BUS DATA TIMING REQUIREMENTS
Parameter
Symbol
Number
Characteristic
Min.
TLO:SCL Clock Low Time
100 kHz mode
400 kHz mode
1.3
—
µs
IS2
THI:SCL
Clock High Time
100 kHz mode
4.0
—
µs
400 kHz mode
0.6
—
µs
IS3
TF:SCL
SDA and SCL
Fall Time
100 kHz mode
—
300
ns
400 kHz mode 20+0.1 CB
300
ns
IS4
TR:SCL
SDA and SCL
Rise Time
100 kHz mode
1000
ns
300
ns
IS5
TSU:DAT Data Input Setup
Time
100 kHz mode
250
—
ns
400 kHz mode
100
—
ns
IS6
THD:DAT Data Input Hold
Time
100 kHz mode
0
—
ns
400 kHz mode
0
0.9
µs
IS7
TSU:STA Start Condition
Setup Time
100 kHz mode
4700
—
ns
400 kHz mode
600
—
ns
IS8
THD:STA Start Condition
Hold Time
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
After this period, the first
clock pulse is generated
IS9
TSU:STO Stop Condition
Setup Time
100 kHz mode
4000
—
ns
—
400 kHz mode
600
—
ns
IS10
THD:STO Stop Condition
Hold Time
100 kHz mode
4000
—
ns
400 kHz mode
600
—
ns
IS11
TAA:SCL Output Valid from 100 kHz mode
Clock
400 kHz mode
0
3500
ns
IS12
TBF:SDA Bus Free Time
Note 1:
CB
—
400 kHz mode 20+0.1 CB
—
µs
Conditions
IS1
—
4.7
Max. Units
—
—
—
—
—
—
Only relevant for repeated
Start condition
—
—
0
1000
ns
100 kHz mode
4.7
—
µs
400 kHz mode
1.3
—
µs
Time bus must be free before
new transmission can start
—
400
pF
Note 1
SCL, SDC Capacitive Loading
Parameter is characterized, but not tested.
2012-2014 Microchip Technology Inc.
DS40001663B-page 29
MTCH6301
10.0
ORDERING INFORMATION
TABLE 10-1:
ORDERING INFORMATION
Part Number
Pin Package
Packing
MTCH6301-I/PT
44 TQFP 10x10x1mm
Tray
MTCH6301-I/ML
44 QFN 8x8x0.9mm
Tube
MTCH6301T-I/PT
44 TQFP 10x10x1mm
T/R
MTCH6301T-I/ML
44 QFN 8x8x0.9mm
T/R
DS40001663B-page 30
2012-2014 Microchip Technology Inc.
MTCH6301
11.0
PACKAGING INFORMATION
11.1
Package Marking Information
44-Lead QFN (8x8x0.9 mm)
PIN 1
Example
PIN 1
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
MTCH6301
-I/ML
1403017
44-Lead TQFP (10x10x1 mm)
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
MTCH6301
e3
-I/PT
1403017
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
e3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2012-2014 Microchip Technology Inc.
DS40001663B-page 31
MTCH6301
11.2
Package Details
DS40001663B-page 32
2012-2014 Microchip Technology Inc.
MTCH6301
2012-2014 Microchip Technology Inc.
DS40001663B-page 33
MTCH6301
DS40001663B-page 34
2012-2014 Microchip Technology Inc.
MTCH6301
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