TC1264
800 mA Fixed-Output CMOS LDO with Shutdown
Features:
Description:
•
•
•
•
•
The TC1264 is a fixed-output, high-accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1264’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
Very Low Dropout Voltage
800 mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Overcurrent and Overtemperature Protection
Applications:
•
•
•
•
•
•
•
TC1264 key features include ultra low noise operation,
very low dropout voltage (typically 450 mV at full load),
and fast response to step changes in load.
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
The TC1264 incorporates both over temperature and
over current protection. The TC1264 is stable with an
output capacitor of only 1 µF and has a maximum
output current of 800 mA. It is available in 3-pin
SOT-223, 3-pin TO-220 and 3-pin DDPAK packages.
Package Type
Typical Application
3-Pin DDPAK
3-Pin TO-220
VIN
VIN
VOUT
TC1264
+
FRONT VIEW
VOUT
TAB IS GND
C1
1 µF
TC1264
TC1264
1 2
1 2
3
GND
VOUT
FRONT VIEW
3 VOUT
2 GND
TC1264
2010 Microchip Technology Inc.
VIN
3-Pin SOT-223
TAB IS GND
GND
3
VOUT
VIN
GND
1 VIN
DS21375D-page 1
TC1264
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 8)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Input Operating Voltage
Maximum Output Current
Output Voltage
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
IOUTMAX
800
—
—
mA
VOUT
VR – 2.5%
VR ± 0.5% VR + 2.5%
Conditions
Note 2
VR 2.5V
V
VR – 2%
VR ± 0.5%
VR + 3%
VR = 1.8V
VR – 7%
—
VR + 3%
IL = 0.1 mA to 800 mA
(Note 3)
VOUT/T
—
40
—
ppm/°C
Line Regulation
VOUT/VIN
—
0.007
0.35
%
Load Regulation (Note 5)
VOUT/VOUT
-0.01
0.002
0
%/mA
IL = 0.1 mA to IOUTMAX
Dropout Voltage (Note 6)
VIN–VOUT
—
20
30
mV
VR 2.5V, IL = 100 µA
—
50
160
VR 2.5V, IL = 100 mA
—
150
480
VR 2.5V, IL = 300 mA
—
260
800
VR 2.5V, IL = 500 mA
—
450
1300
VR 2.5V, IL = 800 mA
VR = 1.8V, IL = 500 mA
VOUT Temperature Coefficient
Supply Current
—
1000
1200
—
1200
1400
Note 4
(VR + 1V) VIN6V
IL = 800 mA
IDD
—
80
130
µA
SHDN = VIH, IL = 0
Power Supply Rejection Ratio
PSRR
—
64
—
db
F 1 kHz
Output Short Circuit Current
IOUTSC
—
1200
—
mA
VOUT = 0V
Note 1:
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
5:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
6:
7:
8:
6
V OUTMAX – V OUTMIN – 10
TCV OUT = ------------------------------------------------------------------------V OUT T
DS21375D-page 2
2010 Microchip Technology Inc.
TC1264
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH,
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Sym
Thermal Regulation
Output Noise
Note 1:
Min
Typ
Max
Units
VOUT/PD
—
0.04
—
V/W
eN
—
260
—
nV/Hz
Conditions
Note 7
IL = IOUTMAX, F = 10 kHZ
VR is the regulator output voltage setting.
2:
The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
3:
4:
This accuracy represents the worst-case over the entire output current and temperature range.
6
TCV OUT
5:
6:
7:
8:
V OUTMAX – V OUTMIN – 10
= ------------------------------------------------------------------------V OUT T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 3L-SOT-223
JA
—
59
—
°C/W
Thermal Resistance, 3L-DDPAK
JA
—
71
—
°C/W
Thermal Resistance, 3L-TO-220
JA
—
71
—
°C/W
Conditions
Temperature Ranges
(Note 1)
Thermal Package Resistances
Note 1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
2010 Microchip Technology Inc.
DS21375D-page 3
TC1264
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
LINE REGULATION (%)
Note:
0.020
150
0.018
135
0.016
120
0.014
105
0.012
90
IDD (A)
2.0
0.010
0.008
60
0.006
45
0.004
30
0.002
15
0.000
-40°C
0°C
25°C
70°C
VOUT = 3V
75
0
-40°C
85°C 125°C
0°C
TEMPERATURE (°C)
FIGURE 2-1:
Temperature.
Line Regulation vs.
RLOAD = 50Ω
COUT = 1 μF
FIGURE 2-4:
DROPOUT VOLTAGE (V)
NOISE (μV/√Hz)
10.0
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
1.0
0.1
IDD vs. Temperature.
0.600
0.550
0.500
0.450
0.400
0.350
125°C
85°C
70°C
25°C
0.300
0°C
0.250
0.200
-40°C
0.150
0.100
0.050
0.000
0.0
0.01
0.01
1
10
100
1000
0 100 200 300 400 500 600 700 800
ILOAD (mA)
FREQUENCY (kHz)
FIGURE 2-2:
Output Noise vs. Frequency.
FIGURE 2-5:
ILOAD.
0.0100
3.030
3.020
ILOAD = 0.1 mA
3.010
3.000
0.0080
0.0070
0.0060
VOUT = 3V
1 mA to 800 mA
0.0040
0.0030
VOUT (V)
LOAD REGULATION (%/mA)
0.0090
0.0050
3.0V Dropout Voltage vs.
2.980
2.960
2.950
2.940
0.0010
2.930
0°C
25°C
70°C
85°C
125°C
2.920
-40°C
DS21375D-page 4
Load Regulation vs.
ILOAD = 800 mA
0°C
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
ILOAD = 500 mA
2.970
0.0020
0.0100
-40°C
ILOAD = 300 mA
2.990
FIGURE 2-6:
3.0V VOUT vs.Temperature.
2010 Microchip Technology Inc.
TC1264
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
3-Pin SOT-223
3-Pin TO-220
3-Pin DDPAK
Symbol
1
VIN
2
GND
Ground terminal
3
VOUT
Regulated voltage output
3.1
Description
Unregulated supply input
Unregulated Supply (VIN)
Unregulated supply input.
3.2
Ground (GND)
Ground terminal.
3.3
Regulated Output Voltage (VOUT)
Regulated voltage output.
2010 Microchip Technology Inc.
DS21375D-page 5
TC1264
4.0
DETAILED DESCRIPTION
The TC1264 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1264’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOADMAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 4-1 shows a typical application circuit.
VIN
VIN
VOUT
TC1264
GND
FIGURE 4-1:
DS21375D-page 6
+
VOUT
C1
1 µF
4.1
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1 and less than 5. A 1 µF
capacitor should be connected from VIN to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
SHDN
Typical Application Circuit.
2010 Microchip Technology Inc.
TC1264
5.0
THERMAL CONSIDERATIONS
5.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
EQUATION 5-1:
P D = V INMAX – VOUTMIN ILOADMAX
Where:
The
maximum
allowable
power
dissipation
(Equation 5-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
EQUATION 5-2:
Copper
Area
(Backside)
Thermal
Resistance
JA)
Board
Area
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
* Tab of device attached to topside copper
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 3.3V ± 10%
TJMAX = 125°C
TAMAX = 95°C
JA = 59°C/W (SOT-223)
Find:
1. Actual power dissipation.
2. Maximum allowable dissipation.
Actual power dissipation:
P D VINMAX – V OUTMIN I LOADMAX
Table 5-1 and Table 5-2 show various values of JA for
the TC1264 packages.
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
SOT-223 PACKAGE
Copper
Area
(Backside)
Board
Area
–3
P D = 260 mW
Where all terms are previously defined.
Thermal
Resistance
JA)
2500 sq mm 2500 sq mm 2500 sq mm
45°C/W
1000 sq mm 2500 sq mm 2500 sq mm
45°C/W
225 sq mm
2500 sq mm 2500 sq mm
53°C/W
100 sq mm
2500 sq mm 2500 sq mm
59°C/W
1000 sq mm 1000 sq mm 1000 sq mm
52°C/W
1000 sq mm
55°C/W
0 sq mm
ILOADMAX = 275 mA
P D = 3.3 1.1 – 2.7 .995 275 10
PDMAX = (TJMAX – TAMAX)
JA
Copper
Area
(Topside)*
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1264 IN
3-PIN DDPAK/TO-220
PACKAGE
VOUTMIN = 2.7V ± 0.5%
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
TABLE 5-1:
TABLE 5-2:
1000 sq mm
Maximum allowable power dissipation:
T JMAX – T AMAX
P DMAX = -------------------------------------- JA
125 – 95
P DMAX = ------------------------59
P DMAX = 508 mW
In this example, the TC1264 dissipates a maximum of
260 mW, which is below the allowable limit of 508 mW.
In a similar manner, Equation 5-1 and Equation 5-2 can
be used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by substituting the maximum allowable
power dissipation of 508 mW into Equation 5-1, from
which VINMAX = 4.6V.
* Tab of device attached to topside copper
2010 Microchip Technology Inc.
DS21375D-page 7
TC1264
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Lead DDPAK
Example
XXXXXXXXX
XXXXXXXXX
YYWWNNN
3-Lead SOT-223
XXXXXXX
XXXYYWW
NNN
3-Lead TO-220
XXXXXXXXX
XXXXXXXXX
YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21375D-page 8
TC1264
e3
1.8VEB^^
1030256
Example
1264-25
VDB1030
256
Example
TC1264
e3
3.0VAB^^
1030256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2010 Microchip Technology Inc.
TC1264
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