Obsolete Device
TC1266
200mA PCI LDO
Features:
General Description:
•
•
•
•
•
•
•
•
•
The TC1266 is an application-specific, low dropout
regulator (LDO), specifically intended for use in PCI
peripheral card applications complying with PCI Power
Management (PCI 2.0). It provides an uninterrupted,
3.3V, 200mA (max) output voltage when the main (5V)
or auxiliary (3.3V) input voltage supplies are present.
Glitch Free Transition Between Input Sources
Automatic Input Source Selection
External PMOS Bypass Switch Control
Built-in 5V Detector
1% Regulated Output Voltage Accuracy
200mA Load Current Capability
Kelvin Sense Input
Low Dropout Voltage (240mV @ Full Load)
Low Ground Current, Independent of Load
Applications:
•
•
•
•
PCMCIA
PCI
Network Interface Cards (NICs)
CardbusTM Technology
Device Selection Table
Part Number
Junction
Temp. Range
Package
TC1266VOA 8-Pin SOIC (Narrow) -5°C to +125°C
TC1266VUA
8-Pin MSOP
The TC1266 consists of an LDO, a voltage threshold
detector, external switchover logic and gate drive
circuitry. It functions as a conventional LDO as long as
the voltage on the main supply input (VIN) is above the
lower threshold (3.90V typical). Should the voltage on
VIN fall below the lower threshold, the LDO is disabled
and an external P-channel MOSFET is automatically
turned on, connecting the auxiliary supply input to
VOUT, and ensuring an uninterrupted 3.3V output. The
main supply is automatically selected, if both the main
and auxiliary input supplies are present, and transition
from one input supply to the other is ensured glitchfree. High integration, automatic secondary supply switchover, Kelvin sensing, and small size make the
TC1266 the optimum LDO for PCI 2.0 applications.
Functional Block Diagram
-5°C to +125°C
VIN
VAUX
Package Type
8-Pin SOIC
Detect
DR
Bandgap
Reference
VIN
1
8
DR
NC
2
7
VOUT
TC1266
VAUX
3
6
SENSE
GND
4
5
NC
–
E/A
+
GND
VOUT
SENSE
8-Pin MSOP
VIN
1
NC
2
VAUX
3
GND
4
TC1266
8
DR
7
VOUT
6
SENSE
5
NC
2001-2014 Microchip Technology Inc.
DS20001377D-page 1
TC1266
1.0
ELECTRICAL
CHARACTERISTICS
*Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Supply Voltage (VIN).............. -0.5V to +7V (Max)
Auxiliary Supply Voltage (VAUX) ..... -0.5V to +7V (Max)
LDO Output Current (IOUT)................................200mA
Thermal Impedance,
Junction-to-Ambient (JA)............130°C/W for SOIC
ESD Rating .......................................................... 2 KV
Operating Temperature Range (TA)........-5°C to +70°C
Storage Temperature Range (TSTG) ...-65°C to +150°C
TC1266 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: TA = +25°C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7F, unless otherwise noted. Boldface
type specifications apply over full operating temperature range.
Min.
Typ.
Max.
Units
VIN
Symbol
Supply Voltage
Parameter
4.3
5.0
5.5
V
Test Conditions
IGND
Ground Current
—
—
230
260
450
500
A
VAUX = 0V (Note 6)
VAUX = 3.3V (Note 6)
IVIN
Reverse Leakage from VAUX
—
-0.1
-1.0
A
VAUX = 3.6V, VIN = 0V, IOUT = 0mA
VAUX
Supply Voltage
3.0
3.3
3.6
V
IQ(AUX)
Quiescent Current
—
—
50
—
70
100
A
VIN = 0V, IOUT = 0mA
—
—
60
—
80
120
A
VIN = 5V, IOUT= 0mA
VIN = 5,5V, VAUX = 0V, IOUT = 0mA
VAUX = 0V
IVAUX
Reverse Leakage from VIN
—
-0.1
-1.0
A
VTH(LO)
5V Detector
Low Threshold Voltage
—
3.75
3.90
—
—
4.05
V
VHYST
5V Detector
Hysteresis Voltage
—
200
260
—
—
300
mV
VTH(HI)
5V Detector
High Threshold Voltage
—
4.0
4.15
—
—
4.30
V
VIN Rising (Notes 2, 3)
VOUT
LDO Output Voltage
V
IOUT = 20mA
—
3.300
—
3.234
—
3.366
3.000
—
—
VIN Falling (Notes 2, 3)
(Notes 2, 3)
4.3V VIN 5.5V, 0mA IOUT 200mA
3.75V VIN V,
0mA IOUT200mA (Note 4)
IOUT
Output Current
200
—
—
mA
REG(LINE)
Line Regulation
—
-0.5
0.05
—
—
0.5
%
VIN = 4.3V to 5.5V
REG(LOAD)
Load Regulation
—
-0.5
0.05
—
—
0.5
%
IOUT= 0.1mA to 200mA
Note
1:
2:
3:
4:
5:
6:
Ensured by design.
See 5V Detect Thresholds, Figure 4-1.
Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during
5V detect threshold transitions.
In Application Circuit, Figure 3-1.
See Timing Diagram, Figure 4-2.
Ground Current is independent of ILOAD.
DS20001377D-page 2
2001-2014 Microchip Technology Inc.
TC1266
TC1266 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: TA = +25°C, VIN = 5V, VAUX = 3.3V, IOUT = 0.1mA, COUT = 4.7F, unless otherwise noted. Boldface
type specifications apply over full operating temperature range.
Symbol
VDR
Parameter
Drive Voltage
Min.
Typ.
Max.
Units
Test Conditions
VIN - 0.2
VIN - 0.3
VIN - 0.1
—
—
—
V
—
—
35
—
150
200
mV
VIN < VTH(LO), IDR = 200A
Sinking: VIN = 3.75V, VDR = 1V;
Sourcing: VIN = 4.3V, VIN – VDR = 2V
4.3V VIN 5.5V, IDR = 200A
IDR(PK)
Peak Drive Current
7
6
—
—
—
—
mA
tDH
Drive High Delay
(Notes 1, 5)
—
—
4
—
—
8
sec
CDR = 1.2nF, VIN ramping up,
measured from VIN = VTH(HI) to VDR = 2V
tDL
Drive Low Delay
(Notes 1, 5)
—
—
0.6
—
1.5
3.0
sec
CDR = 1.2nF, VIN ramping down,
measured from VIN = VTH(LO) to VDR = 2V
Note
1:
2:
3:
4:
5:
6:
Ensured by design.
See 5V Detect Thresholds, Figure 4-1.
Recommended source impedance for 5V supply: 0.25. This will ensure that IOUT x RSOURCE < VHYST, thus avoiding DR toggling during
5V detect threshold transitions.
In Application Circuit, Figure 3-1.
See Timing Diagram, Figure 4-2.
Ground Current is independent of ILOAD.
2001-2014 Microchip Technology Inc.
DS20001377D-page 3
TC1266
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
3.0
Symbol
Description
1
VIN
Main input supply for the TC1266, nominally 5V.
2
NC
Not connected.
3
VAUX
Auxiliary input supply, nominally 3.3V.
4
GND
Logic and power ground.
5
NC
6
SENSE
7
VOUT
8
DR
Not connected.
Sense pin for VOUT. Connect to VOUT at the load to minimize voltage drop across PCB traces.
LDO 3.3V output.
Driver output for external P-channel MOSFET pass element.
DETAILED DESCRIPTION
FIGURE 3-1:
APPLICATION CIRCUIT
Q1
U1
1
5V
2 NC
3 V
AUX
3.3V
C2
4.7μF
C3
0.1μF
4
DR 8
VIN
GND
TC1266
VOUT 7
SENSE
3.3V
6
NC 5
C4
4.7μF
C5
0.1μF
C1
0.1μF
NOTE: External switch (Q1): use Motorola MGSF1P02ELT1 or equivalent
(PMOS, typical Gate Threshold Voltage = 1V, typical RDS(ON) = 0.4Ω at VGS = 2.5V)
DS20001377D-page 4
2001-2014 Microchip Technology Inc.
TC1266
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
EQUATION 4-1:
PD (VINMAX – VOUTMIN)ILOADMAX
Where:
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX
= 5V ± 5%
VOUTMIN = 3.217V
ILOADMAX = 200mA
TJMAX
= 125°C
TAMAX
= 70°C
JA
= 130°C/W (SOIC)
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= (5.25V - 3.217V) 200mA
= 407mW
PD = Worst case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (TJMAX) and the thermal resistance from
junction-to-air (JA).
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX)
JA
= (125 – 70)
130
= 423mW
In this example, the TC1266 dissipates a maximum of
407mW; below the allowable limit of 423mW.
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX)
JA
Where all terms are previously defined.
2001-2014 Microchip Technology Inc.
DS20001377D-page 5
TC1266
FIGURE 4-1:
5V DETECT THRESHOLD
4.4V
VHYST
VTH(HI)
VIN
VTH(LO)
3.65V
2.0V
DR
2.0V
NOTE: VIN rise and fall times (10% to 90%) to be ≥ 100μsec.
FIGURE 4-2:
TIMING DIAGRAM
4.4V
VIN
3.65V
tDH
tDL
DR
2.0V
2.0V
NOTE: VIN rise and fall times (10% to 90%) to be ≤ 0.1μsec.
DS20001377D-page 6
2001-2014 Microchip Technology Inc.
TC1266
5.0
TYPICAL CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
IQ vs. VIN vs. Junction Temperature
0.45
+125°C
IO = 0.1mA
VAUX = 0V
0.40
0.35
IQ vs. VIN vs. Junction Temperature
0.45
0.35
+125°C
0.30
IQ (mA)
IQ (mA)
0.30
0.25
0.20
0.15
0.25
+25°C
0.20
0.15
-5°C
0.10
0.05
0.00
0
1
2
3
VIN (V)
4
0.00
5
6
0
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35
IQ (Aux) (mA)
+125°C
-5°C
0.15
0.10
+25°C
0.05
2
3
VIN (V)
4
5
6
IO = 0mA
VAUX = 5V
0.30
0.25
0.20
1
IQ (Aux) vs. VAUX vs. Junction Temperature
0.35
IO = 0mA
VAUX = 0V
0.30
-5°C
0.10
+25°C
0.05
IQ (Aux) (mA)
IO = 0.1mA
VAUX = 3.3V
0.40
0.25
0.20
-5°C
+125°C
+25°C
0.15
0.10
0.05
0.00
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3 3.6
VAUX (V)
0.00
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3 3.6
VAUX (V)
LDO Output Voltage vs. Junction Temperature
3.34
3.33
IO = 200mA
VIN = 5V
VOUT (V)
3.32
3.31
3.30
3.29
3.28
3.27
3.26
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE °C
2001-2014 Microchip Technology Inc.
DS20001377D-page 7
TC1266
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Drive High Delay
Drive Low Delay
VIN steps from 0.8V to 5V
See application circuit on Page 54
ILOAD = 200mA
Trace 1: VIN stepping for 0.8V to 5V
Trace 2: DR going high at VTH(HI)
TDH = < 4 PS
VO (min) with VIN Rising
Trace 1: VIN stepping for 5.5V to 0V
Trace 2: DR going low
TDL = < 600nS
VO (min) with VIN Falling
Notice no voltage spikes during transition
from VAUX to LDO output
VOUT voltage difference is IOUT x RDS(ON) and variations
between VAUX supply and LDO output voltage
Trace 1: VIN – 3A charging a 1500µF capacitor
Trace 2: DR going high at VTH(HI)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.24V
ILOAD = 200µA
DS20001377D-page 8
VOUT voltage difference is IOUT x RDS(ON) + voltage
difference from LDO to VAUX supply
Trace 1: VIN – discharging a 1500µF capacitor
Trace 2: DR going low at VTH(LO)
Trace 3: VOUT, offset 3.3V. VOUT(min) = 3.14V
ILOAD = 200µA
2001-2014 Microchip Technology Inc.
TC1266
5.0
TYPICAL CHARACTERISTICS (CONTINUED)
Load Response Rising Edge
ILOAD = 200mA
Load Response Falling Edge
ILOAD = 200mA
ILOAD = 3mA
ILOAD = 3mA
VOUT AC 60mV/div
See application circuit on Page 5
2001-2014 Microchip Technology Inc.
See application circuit on Page4 5
DS20001377D-page 9
TC1266
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin MSOP
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
DS20001377D-page 10
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
2001-2014 Microchip Technology Inc.
TC1266
6.3
Package Dimensions
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin MSOP
PIN 1
.122 (3.10)
.114 (2.90)
.197 (5.00)
.189 (4.80)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.008 (0.20)
.005 (0.13)
6° MAX.
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
2001-2014 Microchip Technology Inc.
DS20001377D-page 11
TC1266
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.010 (0.25)
.007 (0.18)
8° MAX..
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS20001377D-page 12
2001-2014 Microchip Technology Inc.
TC1266
7.0
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
Revision D (December 2014)
Added “Obsolete” note box to header.
2001-2014 Microchip Technology Inc.
DS20001377D-page 13
TC1266
NOTES:
DS20001377D-page 14
2001-2014 Microchip Technology Inc.
TC1266
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2001-2014 Microchip Technology Inc.
DS20001377D-page 15
TC1266
NOTES:
DS20001377D-page 16
2001-2014 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-849-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2001-2014 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20001377D-page 17
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Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20001377D-page 18
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/25/14
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