3 MSPS,10-/12-Bit
ADCs in 8-Lead TSOT
AD7273/AD7274
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Throughput rate: 3 MSPS
Specified for VDD of 2.35 V to 3.6 V
Power consumption
11.4 mW at 3 MSPS with 3 V supplies
Wide input bandwidth
70 dB SNR at 1 MHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
Temperature range: −40°C to +125°C
Power-down mode: 0.1 μA typ
8-lead TSOT package
8-lead MSOP package
VDD
VIN
T/H
AGND
10-/12-BIT
SUCCESSIVE
APPROXIMATION
ADC
VREF
SCLK
CONTROL
LOGIC
SDATA
AD7273/AD7274
DGND
04973-001
CS
Figure 1.
GENERAL DESCRIPTION
The AD7273/AD7274 are 10-/12-bit, high speed, low power,
successive approximation ADCs, respectively. The parts operate
from a single 2.35 V to 3.6 V power supply and feature
throughput rates of up to 3 MSPS. Each part contains a low
noise, wide bandwidth track-and-hold amplifier that can handle
input frequencies in excess of 55 MHz.
The conversion process and data acquisition are controlled
using CS and the serial clock, allowing the devices to interface
with microprocessors or DSPs. The input signal is sampled on
the falling edge of CS, and the conversion is also initiated at this
point. The conversion rate is determined by the SCLK. There
are no pipeline delays associated with these parts.
The AD7273/AD7274 use advanced design techniques to
achieve very low power dissipation at high throughput rates.
The reference for the parts is applied externally and can be in
the range of 1.4 V to VDD. This allows the widest dynamic input
range to the ADC.
Table 1.
Part Number
AD72731
AD72741
AD7276
AD7277
AD7278
1
Resolution
10
12
12
10
8
Package
8-lead MSOP
8-Lead TSOT
8-lead MSOP
8-Lead TSOT
8-lead MSOP
6-Lead TSOT
8-lead MSOP
6-Lead TSOT
8-lead MSOP
6-Lead TSOT
Parts contain external reference pin.
PRODUCT HIGHLIGHTS
1. 3 MSPS ADCs in an 8-lead TSOT package.
2. High throughput with low power consumption.
3. Flexible power/serial clock speed management.
Allows maximum power efficiency at low throughput rates.
4. Reference can be driven up to the power supply.
5. No pipeline delay.
6. The parts feature a standard successive approximation ADC
with accurate control of the sampling instant via a CS input
and once-off conversion control.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.
AD7273/AD7274
TABLE OF CONTENTS
Features .............................................................................................. 1
ADC Transfer Function............................................................. 15
General Description ......................................................................... 1
Typical Connection Diagram ....................................................... 16
Functional Block Diagram .............................................................. 1
Analog Input ............................................................................... 16
Product Highlights ........................................................................... 1
Digital Inputs .............................................................................. 16
Revision History ............................................................................... 2
Modes of Operation ....................................................................... 17
Specifications..................................................................................... 3
Normal Mode.............................................................................. 17
AD7274 Specifications................................................................. 3
Partial Power-Down Mode ....................................................... 17
AD7273 Specifications................................................................. 5
Full Power-Down Mode ............................................................ 17
Timing Specifications .................................................................. 7
Power-Up Times......................................................................... 18
Timing Examples.......................................................................... 8
Power vs. Throughput Rate....................................................... 20
Absolute Maximum Ratings............................................................ 9
Serial Interface ................................................................................ 21
ESD Caution.................................................................................. 9
Microprocessor Interfacing....................................................... 23
Pin Configurations and Function Descriptions ......................... 10
Application Hints ........................................................................... 24
Typical Performance Characteristics ........................................... 11
Grounding and Layout .............................................................. 24
Terminology .................................................................................... 14
Evaluating the AD7273/AD7274 Performance......................... 24
Circuit Information ........................................................................ 15
Outline Dimensions ....................................................................... 25
Converter Operation.................................................................. 15
Ordering Guide .......................................................................... 25
REVISION HISTORY
9/05—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
AD7273/AD7274
SPECIFICATIONS
AD7274 SPECIFICATIONS
VDD = 2.35 V to 3.6 V, VREF = 2.35 V to VDD, fSCLK = 48 MHz, fSAMPLE = 3 MSPS, TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
DYNAMIC PERFORMANCE
Signal-to-Noise + Distortion (SINAD) 3
Signal-to-Noise Ratio (SNR)
Total Harmonic Distortion (THD)3
Peak Harmonic or Spurious Noise (SFDR)3
Intermodulation Distortion (IMD)
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Jitter
Full Power Bandwidth
Power Supply Rejection Ratio (PSRR)
DC ACCURACY
Resolution
Integral Nonlinearity3
Differential Nonlinearity3
Offset Error3
Gain Error3
Total Unadjusted Error (TUE)3
ANALOG INPUT
Input Voltage Range
DC Leakage Current
Input Capacitance
REFERENCE INPUT
VREF Input Voltage Range
DC leakage Current
Input Capacitance
Input Impedance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IIN
Input Capacitance, CIN 4
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance4
Output Coding
B Grade 1
Unit 2
68
69.5
−73
−78
−80
dB min
dB min
dB max
dB typ
dB typ
−82
−82
5
18
55
8
82
dB typ
dB typ
ns typ
ps typ
MHz typ
MHz typ
dB typ
12
±1
±1
±3
±3.5
±3.5
Bits
LSB max
LSB max
LSB max
LSB max
LSB max
0 to VREF
±1
±5.5
42
10
V
μA max
μA max
pF typ
pF typ
1.4 to VDD
±1
20
32
V min/V max
μA max
pF typ
Ω typ
1.7
2
0.7
0.8
±1
2
V min
V min
V max
V max
μA max
pF max
VDD − 0.2
V min
0.2
V max
±2.5
μA max
4.5
pF max
Straight (natural) binary
Rev. 0 | Page 3 of 28
Test Conditions/Comments
fIN = 1 MHz sine wave
fa = 1 MHz, fb = 0.97 MHz
fa = 1 MHz, fb = 0.97 MHz
@ 3 dB
@ 0.1 dB
Guaranteed no missed codes to 12 bits
−40°C to +85°C
85°C to 125°C
When in track
When in hold
2.35 V ≤ VDD ≤ 2.7 V
2.7 V < VDD ≤ 3.6 V
2.35 V ≤ VDD < 2.7 V
2.7 V ≤ VDD ≤ 3.6 V
Typically 10 nA, VIN = 0 V or VDD
ISOURCE = 200 μA, VDD = 2.35 V to 3.6 V
ISINK = 200 μA
AD7273/AD7274
Parameter
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time3
Throughput Rate
POWER RQUIREMENTS
VDD
IDD
Normal Mode (Static)
Normal Mode (Operational)
Partial Power-Down Mode (Static)
Full Power-Down Mode (Static)
Power Dissipation 5
Normal Mode (Operational)
Partial Power-Down
Full Power-Down
B Grade 1
Unit 2
Test Conditions/Comments
291
60
3
ns max
ns max
MSPS max
14 SCLK cycles with SCLK at 48 MHz
2.35/3.6
V min/V max
1
5
3.8
34
2
10
mA typ
mA max
mA typ
μA typ
μA max
μA max
−40°C to +85°C, typically 0.1 μA
85°C to 125°C
18
11.4
102
7.2
mW max
mW typ
μW max
μW max
VDD = 3.6 V , fSAMPLE = 3 MSPS
VDD = 3 V
VDD = 3 V
VDD = 3.6 V, −40°C to +85°C
1
Temperature range from −40°C to +125°C.
Typical specifications are tested with VDD = 3 V and VREF = 3 V at 25°C.
3
See the Terminology section.
4
Guaranteed by characterization.
5
See the Power vs. Throughput Rate section.
2
Rev. 0 | Page 4 of 28
See the Serial Interface section
Digital I/Ps = 0 V or VDD
VDD = 3 V, SCLK on or off
VDD = 2.35 V to 3.6 V, fSAMPLE = 3 MSPS
VDD = 3 V
AD7273/AD7274
AD7273 SPECIFICATIONS
VDD = 2.35 V to 3.6 V, VREF = 2.35 V to VDD, fSCLK = 48 MHz, fSAMPLE = 3 MSPS, TA = TMIN to TMAX, unless otherwise noted.
Table 3.
Parameter
DYNAMIC PERFORMANCE
Signal-to-Noise + Distortion (SINAD) 3
Total Harmonic Distortion (THD)3
Peak Harmonic or Spurious Noise (SFDR)3
Intermodulation Distortion (IMD)
Second-Order Terms
Third-Order Terms
Aperture Delay
Aperture Jitter
Full Power Bandwidth
Power Supply Rejection Ratio (PSRR)
DC ACCURACY
Resolution
Integral Nonlinearity3
Differential Nonlinearity3
Offset Error3
Gain Error3
Total Unadjusted Error (TUE)3
ANALOG INPUT
Input Voltage Range
DC Leakage Current
Input Capacitance
REFERENCE INPUT
VREF Input Voltage Range
DC leakage Current
Input Capacitance
Input Impedance
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VIN
Input Current, IIN
Input Capacitance, CIN 4
LOGIC OUTPUTS
Output High Voltage, VOH
Output Low Voltage, VOL
Floating-State Leakage Current
Floating-State Output Capacitance4
Output Coding
CONVERSION RATE
Conversion Time
Track-and-Hold Acquisition Time3
Throughput Rate
B Grade 1
Unit 2
61
−72
−77
−80
dB min
dB max
dB typ
dB typ
−81
−81
5
18
74
10
82
dB typ
dB typ
ns typ
ps typ
MHz typ
MHz typ
dB typ
10
±0.5
±0.5
±1
±1.5
±2.5
Bits
LSB max
LSB max
LSB max
LSB max
LSB max
0 to VREF
±1
±5.5
42
10
V
μA max
μA max
pF typ
pF typ
1.4 to VDD
±1
20
32
V min/V max
μA max
pF typ
Ω typ
1.7
2
0.7
0.8
±1
2
V min
V min
V max
V max
μA max
pF max
Test Conditions/Comments
fIN = 1 MHz sine wave
fa = 1 MHz, fb = 0.97 MHz
fa = 1 MHz, fb = 0.97 MHz
@ 3 dB
@ 0.1 dB
Guaranteed no missed codes to 10 bits
−40°C to +85°C
85°C to 125°C
When in track
When in hold
2.35 V ≤ VDD ≤ 2.7 V
2.7 V < VDD ≤ 3.6 V
2.35 V ≤ VDD< 2.7 V
2.7 V ≤ VDD ≤ 3.6 V
Typically 10 nA, VIN = 0 V or VDD
VDD − 0.2
V min
0.2
V max
±2.5
μA max
4.5
pF max
Straight (natural) binary
ISOURCE = 200 μA; VDD = 2.35 V to 3.6 V
ISINK = 200 μA
250
60
3.45
12 SCLK cycles with SCLK at 48 MHz
ns max
ns max
MSPS max
Rev. 0 | Page 5 of 28
See the Serial Interface section
AD7273/AD7274
Parameter
POWER RQUIREMENTS
VDD
IDD
Normal Mode (Static)
Normal Mode (Operational)
Partial Power-Down Mode (Static)
Full Power-Down Mode (Static)
Power Dissipation 5
Normal Mode (Operational)
Partial Power-Down
Full Power-Down
B Grade 1
Unit 2
2.35/3.6
V min/V max
0.6
5
3.2
34
2
10
mA typ
mA max
mA typ
μA typ
μA max
μA max
−40°C to +85°C, typically 0.1 μA
85°C to 125°C
18
9.6
102
7.2
mW max
mW typ
μW max
μW max
VDD = 3.6 V , fSAMPLE = 3 MSPS
VDD = 3 V
VDD = 3 V
VDD = 3.6 V, −40°C to +85°C
1
Temperature range from −40°C to +125°C.
Typical specifications are tested with VDD = 3 V and VREF = 3 V at 25°C.
3
See the Terminology section.
4
Guaranteed by characterization.
5
See the Power vs. Throughput Rate section.
2
Rev. 0 | Page 6 of 28
Test Conditions/Comments
Digital I/Ps = 0 V or VDD
VDD = 3 V, SCLK on or off
VDD = 2.35 V to 3.6 V, fSAMPLE = 3 MSPS
VDD = 3 V
AD7273/AD7274
TIMING SPECIFICATIONS
VDD = 2.35 V to 3.6 V; VREF = 2.35 to VDD; TA = TMIN to TMAX, unless otherwise noted. 1 Guaranteed by characterization. All input signals
are specified with tr = tf = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
Table 4.
Parameter
fSCLK 2
tCONVERT
tQUIET
t1
t2
t3 4
t44
t5
t6
t74
t8
Limit at TMIN, TMAX
AD7273/AD7274
500
48
14 × tSCLK
12 × tSCLK
4
3
6
4
15
0.4 tSCLK
0.4 tSCLK
5
14
5
4.2
1
t9
tPOWER-UP 5
Unit
kHz min 3
MHz max
Description
AD7274
AD7273
Minimum quiet time required between bus relinquish and start of
next conversion
Minimum CS pulse width
CS to SCLK setup time
Delay from CS until SDATA three-state disabled
Data access time after SCLK falling edge
SCLK low pulse width
SCLK high pulse width
SCLK to data valid hold time
SCLK falling edge to SDATA three-state
SCLK falling edge to SDATA three-state
CS rising edge to SDATA three-state
Power-up time from full power-down
ns min
ns min
ns min
ns max
ns max
ns min
ns min
ns min
ns max
ns min
ns max
μs max
1
Sample tested during initial release to ensure compliance. All timing specifications given are with a 10 pF load capacitance. With a load capacitance greater than this
value, a digital buffer or latch must be used.
2
Mark/space ratio for the SCLK input is 40/60 to 60/40.
3
Minimum fSCLK at which specifications are guaranteed.
4
The time required for the output to cross the VIH or VIL voltage.
5
See the Power-Up Times section
t4
t8
SCLK
SCLK
Figure 4. SCLK Falling Edge SDATA Three-State
Figure 2. Access Time After SCLK Falling Edge
t7
SCLK
VIH
04973-003
SDATA
VIL
1.4V
SDATA
Figure 3. Hold Time After SCLK Falling Edge
Rev. 0 | Page 7 of 28
04973-004
VIL
04973-002
VIH
SDATA
AD7273/AD7274
Timing Example 2
TIMING EXAMPLES
The example in Figure 7 uses a 16 SCLK cycle, fSCLK = 48 MHz,
and the throughput is 2.97 MSPS. This produces a cycle time
of t2 + 12.5(1/fSCLK) + tACQ = 336 ns, where t2 = 6 ns min and
tACQ = 70 ns. Figure 7 shows that tACQ comprises 2.5(1/fSCLK) +
t8 + tQUIET, where t8 = 14 ns max. This satisfies the minimum
requirement of 4 ns for tQUIET.
th
For the AD7274, if CS is brought high during the 14 SCLK
rising edge after the two leading zeros and 12 bits of the
conversion are provided, the part can achieve the fastest
throughput rate, 3 MSPS. If CS is brought high during the 16th
SCLK rising edge after the two leading zeros, 12 bits of the
conversion, and two trailing zeros are provided, a throughput
rate of 2.97 MSPS is achievable. This is illustrated in the
following two timing examples.
Timing Example 1
In Figure 6, using a 14 SCLK cycle, fSCLK = 48 MHz, and
the throughput is 3 MSPS. This produces a cycle time of
t2 + 12.5(1/fSCLK) + tACQ = 333 ns, where t2 = 6 ns min and
tACQ = 67 ns. This satisfies the requirement of 60 ns for tACQ.
Figure 6 also shows that tACQ comprises 0.5(1/fSCLK) + t9 + tQUIET,
where t9 = 4.2 ns max. This allows a value of 52.8 ns for tQUIET,
satisfying the minimum requirement of 4 ns.
t1
CS
tCONVERT
SCLK
t6
1
2
3
4
t3
Z
SDATA
B
5
13
DB11
DB10
DB9
15
t5
t7
t4
ZERO
14
16
t8
tQUIET
DB1
DB0
ZERO
THREESTATE TWO LEADING
ZEROS
ZERO
TWO TRAILING
ZEROS
THREE-STATE
04973-005
t2
1/THROUGHPUT
Figure 5. AD7274 Serial Interface Timing 16 SCLK Cycle
t1
CS
tCONVERT
t2
SCLK
t6
1
2
3
4
t3
Z
SDATA
B
5
13
t7
t4
ZERO
DB11
DB10
DB9
14
t5
DB1
t9
tQUIET
DB0
THREE-STATE
04973-006
THREESTATE TWO LEADING
ZEROS
1/THROUGHPUT
Figure 6.AD7274 Serial Interface Timing 14 SCLK Cycle
t1
CS
tCONVERT
t2
B
1
2
3
4
5
12
13
14
15
16
t8
tQUIET
tACQUISITION
12.5(1/fSCLK)
1/THROUGHPUT
Figure 7. Serial Interface Timing 16 SCLK Cycle
Rev. 0 | Page 8 of 28
04973-007
SCLK
AD7273/AD7274
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameters
VDD to AGND/DGND
Analog Input Voltage to AGND
Digital Input Voltage to DGND
Digital Output Voltage to DGND
Input Current to Any Pin Except Supplies 1
Operating Temperature Range
Commercial (B Grade)
Storage Temperature Range
Junction Temperature
6-Lead TSOT Package
θJA Thermal Impedance
θJC Thermal Impedance
8-Lead MSOP Package
θJA Thermal Impedance
θJC Thermal Impedance
Lead Temperature Soldering
Reflow (10 to 30 sec)
Lead Temperature Soldering
Reflow (10 to 30 sec)
ESD
1
Ratings
−0.3 V to +6 V
−0.3 V to VDD + 0.3 V
−0.3 V to +6 V
−0.3 V to VDD + 0.3 V
±10 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
−40°C to +125°C
−65°C to +150°C
150°C
230°C/W
92°C/W
205.9°C/W
43.74°C/W
255°C
260°C
1.5 kV
Transient currents of up to 100 mA cause SCR latch-up.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 9 of 28
AD7273/AD7274
SDATA 2
CS 3
AGND 4
8
AD7273/
AD7274
TOP VIEW
(Not to Scale)
7
VDD 1
VIN
SDATA 2
DGND
6
SCLK
5
VREF
DGND 3
AD7273/
AD7274
8
AGND
7
CS
SCLK
TOP VIEW
VIN 4 (Not to Scale) 5 VREF
04973-008
VDD 1
Figure 8. 8-Lead MSOP Pin Configuration
6
04973-009
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 9. 8-Lead TSOT Pin Configuration
Table 6. Pin Function Descriptions
Pin No.
MSOP
TSOT
1
1
2
2
Mnemonic
VDD
SDATA
3
7
CS
4
8
AGND
5
5
VREF
6
6
SCLK
7
3
DGND
8
4
VIN
Description
Power Supply Input. The VDD range for the AD7273/AD7274 is from 2.35 V to 3.6 V.
Data Out. Logic output. The conversion result from the AD7273/AD7274 is provided on this output as a
serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from
the AD7274 consists of two leading zeros followed by the 12 bits of conversion data and two trailing
zeros, provided MSB first. The data stream from the AD7273 consists of two leading zeros followed
by the 10 bits of conversion data and four trailing zeros, provided MSB first.
Chip Select. Active low logic input. This input provides the dual function of initiating conversion on
the AD7273/AD7274 and framing the serial data transfer.
Analog Ground. Ground reference point for all circuitry on the AD7273/AD7274. All analog signals
and any external reference signal should be referred to this AGND voltage.
Voltage Reference Input. This pin becomes the reference voltage input. An external reference should
be applied at this pin. The external reference input range is 1.4 V to VDD. A 10 μF capacitor should be
tied between this pin and AGND.
Serial Clock. Logic input. SCLK provides the serial clock for accessing data from the part. This clock
input is also used as the clock source for the conversion process of AD7273/AD7274.
Digital Ground. Ground reference point for all digital circuitry on the AD7273/AD7274. The DGND and
AGND voltages ideally should be at the same potential and must not be more than 0.3 V apart, even
on a transient basis.
Analog Input. Single-ended analog input channel. The input range is 0 to VREF.
Rev. 0 | Page 10 of 28
AD7273/AD7274
TYPICAL PERFORMANCE CHARACTERISTICS
72.2
SNR (dB)
–40
VDD = 3V
16384 POINT FFT
FSAMPLE = 3MSPS
FIN = 1MHz
SINAD = 71.05
THD = –80.9
SFDR = –82.2
FSAMPLE = 3MSPS
72.0
VDD = 2.5V
71.8
VDD = 3.6V
71.6
SNR (dB)
–20
–60
–80
71.4
71.2
71.0
70.8
–100
70.6
1500
04973-010
1400
1300
1200
1100
900
1000
800
700
600
500
400
300
200
0
100
FREQUENCY (kHz)
70.2
100
1000
1500
INPUT FREQUENCY (kHz)
04973-013
70.4
–120
Figure 13. AD7274 SNR vs. Analog Input Frequency at 3 MSPS
for Various Supply Voltages, SCLK Frequency = 48 MHz
Figure 10. AD7274 Dynamic Performance at 3 MSPS, Input Tone = 1 MHz
–72
SNR (dB)
–40
16384 POINT FFT
FSAMPLE = 3MSPS
FIN = 1MHz
SINAD = 66.56
THD = –77.4
SFDR = –78.2
–74
–76
VDD = 3V
–78
THD (dB)
–20
–60
–80
VDD = 2.5V
–82
–80
–84
VDD = 3.6V
–86
–100
04973-011
1500
1400
1300
1200
1100
1000
900
800
700
600
500
–40
FSAMPLE = 3MSPS
–50
71.4
71.2
71.0
VDD = 3.6V
THD (dB)
RIN = 100Ω
70.8
–60
–70
VDD = 2.5V
RIN = 10Ω
–80
VDD = 3V
69.4
69.2
69.0
100
1000
RIN = 0Ω
1500
INPUT FREQUENCY (kHz)
Figure 12. AD7274 SINAD vs. Analog Input Frequency at 3 MSPS
for Various Supply Voltages, SCLK Frequency = 48 MHz
–90
100
04973-012
SINAD (dB)
71.6
70.6
70.4
70.2
70.0
69.8
69.6
1500
Figure 14. THD vs. Analog Input Frequency at 3 MSPS
for Various Supply Voltages, SCLK Frequency = 48 MHz
Figure 11. AD7273 Dynamic Performance at 3 MSP, Input Tone = 1 MHz
72.2
72.0
71.8
1000
INPUT FREQUENCY (kHz)
1000
INPUT FREQUENCY (kHz)
1500
04973-015
400
300
200
0
100
FREQUENCY (kHz)
–90
100
04973-014
–88
–120
Figure 15. THD vs. Analog Input Frequency at 3 MSPS for Various Source
Impedance, SCLK Frequency = 48 MHz, Supply Voltage = 3 V
Rev. 0 | Page 11 of 28
AD7273/AD7274
–70
1.0
0.8
0.6
–80
INL ERROR (LSB)
PSRR (dB)
0.4
–90
POSITIVE INL
0.2
0
–0.2
–0.4
NEGATIVE INL
–100
–0.6
100mV p-p SINE WAVE ON AVDD
NO DECOUPLING
500
1000
1500
2000
2500
3000
SUPPLY RIPPLE FREQUENCY (MHz)
–1.0
1.4
04973-016
0
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
REFERENCE VOLTAGE (V)
Figure 16. Power Supply Rejection Ratio (PSRR) vs. Supply Ripple
Frequency Without Decoupling
04973-019
–0.8
–110
Figure 19. Change in INL vs. Reference Voltage, 3 V Supply
1.0
1.0
VDD = 3V
0.8
0.8
0.6
0.6
0.4
0.4
DNL ERROR (LSB)
INL ERROR (LSB)
POSITIVE DNL
0.2
0
–0.2
0.2
0
–0.2
–0.4
–0.4
–0.6
–0.6
–0.8
–0.8
0
500
1000
1500
2000
2500
3000
3500
4000
CODES
–1.0
1.4
04973-017
–1.0
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
REFERENCE VOLTAGE (V)
Figure 17. AD7274 INL Performance
Figure 20. Change in DNL vs. Reference Voltage, 3 V Supply
1.0
3.60
VDD = 3V
0.8
3.40
3.20
0.6
3.00
VDD = 3V
2.80
MAX CURRENT (mA)
0.4
0.2
0
–0.2
–0.4
2.60
VDD = 3.6V
2.40
2.20
2.00
1.80
1.60
VDD = 2.5V
1.40
1.20
–0.6
–1.0
0
500
1000
1500
2000
2500
3000
CODES
3500
4000
0.80
0.60
0
10
20
30
40
SCLK FREQUENCY (MHz)
Figure 21. Maximum Current vs. Supply Voltage
for Different SCLK Frequencies
Figure 18. AD7274 DNL Performance
Rev. 0 | Page 12 of 28
50
04973-021
1.00
–0.8
04973-018
DNL ERROR (LSB)
1.6
04973-020
NEGATIVE DNL
AD7273/AD7274
18000
12.0
30,000 CODES
EFFECTIVE NUMBERS OF BITS
16000
12000
10000
8000
6000
4000
11.5
11.0
10.5
0
2045
2046
2047
2048
2049
CODE
2050
Figure 22. Histogram of Codes for 30,000 Samples
10.0
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
VREF (V)
Figure 23. ENOB/SINAD vs. Reference Voltage
Rev. 0 | Page 13 of 28
3.4
3.6
04973-023
2000
04973-022
NUMBER OF CODES
14000
AD7273/AD7274
TERMINOLOGY
Integral Nonlinearity (INL)
The maximum deviation from a straight line passing through
the endpoints of the ADC transfer function. For the AD7273/
AD7274, the endpoints of the transfer function are zero scale at
0.5 LSB below the first code transition and full scale at 0.5 LSB
above the last code transition.
Differential Nonlinearity (DNL)
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
The deviation of the first code transition (00 . . . 000) to (00 . . .
001) from the ideal, that is, AGND + 0.5 LSB.
Gain Error
The deviation of the last code transition (111 . . . 110) to
(111 . . . 111) from the ideal, that is, VREF – 1.5 LSB, after
adjusting for the offset error.
Total Unadjusted Error (TUE)
A comprehensive specification that includes gain, linearity, and
offset errors.
Track-and-Hold Acquisition Time
The time required for the output of the track-and-hold amplifier
to reach its final value, within ±0.5 LSB, after the end of the
conversion. See the Serial Interface section for more details.
Signal-to-Noise + Distortion Ratio (SINAD)
The measured ratio of signal to noise plus distortion at the
output of the ADC. The signal is the rms amplitude of the
fundamental, and noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), including
harmonics but excluding dc. The ratio is dependent on the
number of quantization levels in the digitization process: the
more levels, the smaller the quantization noise. For an ideal N-bit
converter, the SINAD is
SINAD = 6.02 N + 1.76 dB
According to this equation, the SINAD is 74 dB for a 12-bit
converter and 62 dB for a 10-bit converter. However, various
error sources in the ADC, including integral and differential
nonlinearities and internal ac noise sources, cause the measured
SINAD to be less than its theoretical value.
Total Harmonic Distortion (THD)
The ratio of the rms sum of harmonics to the fundamental. It is
defined as:
THD (dB ) = 20 log
where V1 is the rms amplitude of the fundamental, and V2, V3,
V4, V5, and V6 are the rms amplitudes of the second through the
sixth harmonics.
Peak Harmonic or Spurious Noise (SFDR)
The ratio of the rms value of the next largest component in the
ADC output spectrum (up to fS/2, excluding dc) to the rms value
of the fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum; however,
for ADCs with harmonics buried in the noise floor, it is determined by a noise peak.
Intermodulation Distortion (IMD)
With inputs consisting of sine waves at two frequencies, fa and fb,
any active device with nonlinearities creates distortion products
at sum and difference frequencies of mfa ± nfb, where m and
n = 0, 1, 2, 3, …. Intermodulation distortion terms are those for
which neither m nor n are equal to zero. For example, the secondorder terms include (fa + fb) and (fa − fb), and the third-order
terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The AD7273/AD7274 are tested using the CCIF standard in
which two input frequencies are used (see fa and fb in the
Specifications section). In this case, the second-order terms are
usually distanced in frequency from the original sine waves, and
the third-order terms are usually at a frequency close to the input
frequencies. As a result, the second- and third-order terms are
specified separately. The calculation of the intermodulation
distortion is as per the THD specification, where it is the ratio
of the rms sum of the individual distortion products to the rms
amplitude of the sum of the fundamentals expressed in decibels.
Power Supply Rejection Ratio (PSRR)
The ratio of the power in the ADC output at full-scale
frequency, f, to the power of a 100 mV p-p sine wave applied to
the ADC VDD supply of frequency fS.
PSRR (dB ) = 10 log (Pf Pf S )
where Pf is the power at frequency f in the ADC output; PfS is
the power at frequency fS coupled onto the ADC VDD supply.
Aperture Delay
The measured interval between the leading edge of the sampling
clock and the point at which the ADC actually takes the sample.
Aperture Jitter
The sample-to-sample variation in the effective point in time at
which the sample is taken.
V2 2 + V3 2 + V 4 2 + V5 2 + V6 2
V1
Rev. 0 | Page 14 of 28
AD7273/AD7274
CIRCUIT INFORMATION
The AD7273/AD7274 provide the user with an on-chip trackand-hold ADC and a serial interface housed in an 8-lead TSOT
or an 8-lead MSOP package, which offers the user considerable
space-saving advantages over alternative solutions. The serial
clock input accesses data from the part and provides the clock
source for the successive approximation ADC. The analog input
range is 0 to VREF. An external reference in the range of 1.4 V to
VDD is required by the ADC.
When the ADC starts a conversion, SW2 opens and SW1 moves
to Position B, causing the comparator to become unbalanced
(see Figure 25). The control logic and the charge redistribution
DAC are used to add and subtract fixed amounts of charge from
the sampling capacitor to bring the comparator back into a
balanced condition. When the comparator is rebalanced, the
conversion is complete. The control logic generates the ADC
output code. Figure 26 shows the ADC transfer function.
CHARGE
REDISTRIBUTION
DAC
SAMPLING
CAPACITOR
A
VIN
SW1
ACQUISITION
PHASE
B
The AD7273/AD7274 also feature a power-down option to save
power between conversions. The power-down feature is
implemented across the standard serial interface as described in
the Modes of Operation section.
CONTROL
LOGIC
SW2
COMPARATOR
VDD/2
04973-025
The AD7273/AD7274 are high speed, low power, 10-/12-bit,
single supply ADCs, respectively. The parts can be operated
from a 2.35 V to 3.6 V supply. When operated from any supply
voltage within this range, the AD7273/AD7274 are capable of
throughput rates of 3 MSPS when provided with a 48 MHz clock.
AGND
Figure 25. ADC Conversion Phase
CONVERTER OPERATION
ADC TRANSFER FUNCTION
The AD7273/AD7274 are successive approximation ADCs
based on a charge redistribution DAC. Figure 24 and Figure 25
show simplified schematics of the ADC. Figure 24 shows the
ADC during its acquisition phase, where SW2 is closed, SW1 is
in Position A, the comparator is held in a balanced condition,
and the sampling capacitor acquires the signal on VIN.
The output coding of the AD7273/AD7274 is straight binary.
The designed code transitions occur midway between
successive integer LSB values, such as 0.5 LSB and 1.5 LSB. The
LSB size is VREF/4,096 for the AD7274 and VREF/1,024 for the
AD7273. The ideal transfer characteristic for the
AD7273/AD7274 is shown in Figure 26.
CHARGE
REDISTRIBUTION
DAC
SW1
B
ACQUISITION
PHASE
VDD/2
SW2
COMPARATOR
AGND
CONTROL
LOGIC
111...000
011...111
1LSB = VREF/4096 (AD7274)
1LSB = VREF/1024 (AD7273)
000...010
000...001
000...000
0V 0.5LSB
Figure 24. ADC Acquisition Phase
+VREF – 1.5LSB
ANALOG INPUT
Figure 26. AD7273/AD7274 Transfer Characteristic
Rev. 0 | Page 15 of 28
04973-026
ADC CODE
SAMPLING
CAPACITOR
A
04973-024
VIN
111...111
111...110
AD7273/AD7274
TYPICAL CONNECTION DIAGRAM
The conversion result is output in a 16-bit word with two leading
zeros followed by the 12-bit or 10-bit result. The 12-bit result from
the AD7274 is followed by two trailing zeros, and the 10-bit result
from the AD7273 is followed by four trailing zeros.
Table 7 provides some typical performance data with various
references under the same setup conditions for the AD7274.
on resistance of a switch. This resistor is typically about 75 Ω.
Capacitor C2 is the ADC sampling capacitor and has a capacitance
of 32 pF typically. For ac applications, removing high frequency
components from the analog input signal is recommended by
using a band-pass filter on the relevant analog input pin. In
applications where harmonic distortion and signal-to-noise
ratio are critical, the analog input should be driven from a low
impedance source. Large source impedances significantly affect
the ac performance of the ADCs. This may necessitate the use
of an input buffer amplifier. The AD8021 op amp is compatible
with this device; however, the choice of the op amp is a function
of the particular application.
VDD
Table 7. AD7274 Performance (Various Voltage Reference IC)
AD7274 SNR Performance
1 MHz Input
71.3 dB
70.1 dB
70.9 dB
Voltage Reference
AD780 @ 2.5 V
AD780 @ 3 V
REF195
D1
R1
VIN
C1
4pF
C2
D2
CONVERSION PHASE–SWITCH OPEN
TRACK PHASE–SWITCH CLOSED
04973-028
Figure 27 shows a typical connection diagram for the AD7273/
AD7274. An external reference must be applied to the ADC.
This reference can be in the range of 1.4 V to VDD. A precision
reference, such as the REF19x family or the ADR421, can be
used to supply the reference voltage to the AD7273/AD7274.
Figure 28. Equivalent Analog Input Circuit
3.6V
SUPPLY
4.6 mA
0V TO VREF
INPUT
REF195
2.5V
10pF
When no amplifier is used to drive the analog input, the source
impedance should be limited to a low value. The maximum source
impedance depends on the amount of THD that can be tolerated.
The THD increases as the source impedance increases and performance degrades. Figure 14 shows a graph of the THD vs. the
analog input frequency for different source impedances when
using a supply voltage of 3 V and sampling at a rate of 3 MSPS.
10μF
VDD
VIN
VREF
0.1μF
AD7273/
AD7274
0.1μF
SCLK
SDATA
CS
DSP/
μC/μP
SERIAL
INTERFACE
04973-027
AGND/DGND
Figure 27. AD7273/AD7274 Typical Connection Diagram
ANALOG INPUT
Figure 28 shows an equivalent circuit of the analog input
structure of the AD7273/AD7274. The two diodes, D1 and D2,
provide ESD protection for the analog inputs. Care must be
taken to ensure that the analog input signal never exceeds the
supply rails by more than 300 mV. Signals exceeding this value
cause these diodes to become forward biased and to start
conducting current into the substrate. These diodes can
conduct a maximum current of 10 mA without causing
irreversible damage to the part. Capacitor C1 in Figure 28 is
typically about 4 pF and can primarily be attributed to pin
capacitance. Resistor R1 is a lumped component made up of the
DIGITAL INPUTS
The digital inputs applied to the AD7273/AD7274 are not
limited by the maximum ratings that limit the analog inputs.
Instead, the digital inputs can be applied at up to 6 V and are
not restricted by the VDD + 0.3 V limit of the analog inputs. For
example, if the AD7273/AD7274 were operated with a VDD of
3 V, then 5 V logic levels could be used on the digital inputs.
However, it is important to note that the data output on SDATA
still has 3 V logic levels when VDD = 3 V. Another advantage of
SCLK and CS not being restricted by the VDD + 0.3 V limit is
that power supply sequencing issues are avoided. For example,
unlike with the analog inputs, with the digital inputs, if CS or
SCLK are applied before VDD, there is no risk of latch-up.
Rev. 0 | Page 16 of 28
AD7273/AD7274
MODES OF OPERATION
The mode of operation of the AD7273/AD7274 is selected by
controlling the logic state of the CS signal during a conversion.
There are three possible modes of operation: normal mode,
partial power-down mode, and full power-down mode. The
point at which CS is pulled high after the conversion is initiated
determines which power-down mode, if any, the device enters.
Similarly, if the device is already in power-down mode, CS can
control whether the device returns to normal operation or
remains in power-down mode. These modes of operation are
designed to provide flexible power management options, which
can be chosen to optimize the power dissipation/throughput
rate ratio for different application requirements.
NORMAL MODE
This mode is intended for fastest throughput rate performance
because the AD7273/AD7274 remain fully powered at all times,
eliminating worry about power-up times. Figure 29 shows the
general diagram of the operation of the AD7273/AD7274 in
this mode.
The conversion is initiated on the falling edge of CS as described
in the Serial Interface section. To ensure that the part remains
fully powered up at all times, CS must remain low until at least
10 SCLK falling edges elapse after the falling edge of CS. If CS is
brought high any time after the 10th SCLK falling, but before the
16th SCLK falling edge, the part remains powered up, but the
conversion is terminated, and SDATA goes back into three-state.
For the AD7274, a minimum of 14 serial clock cycles are
required to complete the conversion and access the complete
conversion result. For the AD7273, a minimum of 12 serial
clock cycles are required to complete the conversion and access
the complete conversion result.
CS can idle high until the next conversion or low until CS
returns high before the next conversion (effectively idling CS
low). Once a data transfer is complete (SDATA has returned to
three-state), another conversion can be initiated after the quiet
time, tQUIET, has elapsed by bringing CS low again.
PARTIAL POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required. An example of this is when either
the ADC is powered down between each conversion or a series
of conversions is performed at a high throughput rate and then
the ADC is powered down for a relatively long duration between
these bursts of several conversions.
When the AD7273/AD7274 are in partial power-down mode,
all analog circuitry is powered down except the bias generation
circuit.
To enter partial power-down mode, interrupt the conversion
process by bringing CS high between the second and 10th falling
edges of SCLK, as shown in Figure 30. Once CS is brought high
in this window of SCLKs, the part enters partial power-down
mode, the conversion that was initiated by the falling edge of
CS is terminated, and SDATA goes back into three-state. If CS
is brought high before the second SCLK falling edge, the part
remains in normal mode and does not power down. This prevents
accidental power-down due to glitches on the CS line.
To exit this mode of operation and power up the AD7274/
AD7273, perform a dummy conversion. On the falling edge of
CS, the device begins to power up and continues to power up as
long as CS is held low until after the falling edge of the 10th SCLK.
The device is fully powered up once 16 SCLKs elapse; valid data
results from the next conversion, as shown in Figure 31. If CS is
brought high before the 10th falling edge of SCLK, the AD7274/
AD7273 goes into full power-down mode. Therefore, although
the device may begin to power up on the falling edge of CS, it
powers down on the rising edge of CS as long as this occurs
before the 10th SCLK falling edge.
If the AD7273/AD7274 is already in partial power-down mode
and CS is brought high before the 10th falling edges of SCLK, the
device enters full power-down mode. For more information on
the power-up times associated with partial power-down mode
in various configurations, see the Power-Up Times section.
FULL POWER-DOWN MODE
This mode is intended for use in applications where throughput
rates slower than those in the partial power-down mode are
required, because power-up from a full power-down takes
substantially longer than that from a partial power-down. This
mode is suited to applications where a series of conversions
performed at a relatively high throughput rate are followed by
a long period of inactivity and thus power-down.
When the AD7273/AD7274 are in full power-down mode, all
analog circuitry is powered down. To enter full power-down
mode put the device into partial power-down mode by bringing
CS high between the second and 10th falling edges of SCLK. In
the next conversion cycle, interrupt the conversion process in
the way shown in Figure 32 by bringing CS high before the 10th
SCLK falling edge. Once CS is brought high in this window of
SCLKs, the part powers down completely. Note that it is not
necessary to complete 16 SCLKs once CS is brought high to enter
either of the power-down modes. Glitch protection is not
available when entering full power-down mode.
To exit full power-down mode and power up the AD7273/
AD7274 again, perform a dummy conversion, similar to when
powering up from partial power-down mode. On the falling
Rev. 0 | Page 17 of 28
AD7273/AD7274
edge of CS, the device begins to power up and continues to
power up until after the falling edge of the 10th SCLK as long as
CS is held low. The power-up time required must elapse before
a conversion can be initiated, as shown in Figure 33. See the
Power-Up Times section for the power-up times associated with
the AD7273/AD7274.
POWER-UP TIMES
The AD7273/AD7274 has two power-down modes, partial
power-down and full power-down, which are described in
detail in the Modes of Operation section. This section deals
with the power-up time required when coming out of either of
these modes.
To power up from partial power-down mode, one cycle is
required. Therefore, with a SCLK frequency of up to 48 MHz,
one dummy cycle is sufficient to allow the device to power up
from partial power-down mode. Once the dummy cycle is
complete, the ADC is fully powered up and the input signal is
acquired properly. The quiet time, tQUIET, must be allowed from
the point where the bus goes back into three-state after the
dummy conversion to the next falling edge of CS.
mode, the track-and-hold, which is in hold mode while the part
is powered down, returns to track mode after the first SCLK
edge is received after the falling edge of CS. This is shown as
Point A in Figure 31.
When power supplies are first applied to the AD7273/AD7274,
the ADC can power up in either of the power-down modes or
in normal mode. Because of this, it is best to allow a dummy
cycle to elapse to ensure that the part is fully powered up before
attempting a valid conversion. Likewise, if the part is to be kept
in partial power-down mode immediately after the supplies are
applied, two dummy cycles must be initiated. The first dummy
cycle must hold CS low until after the 10th SCLK falling edge
(see Figure 29). In the second cycle, CS must be brought high
between the second and 10th SCLK falling edges (see Figure 30).
Alternatively, if the part is to be placed into full power-down
mode after the supplies are applied, three dummy cycles must
be initiated. The first dummy cycle must hold CS low until after
the 10th SCLK falling edge (see Figure 29); the second and third
dummy cycles place the part into full power-down mode (see
Figure 32). See also the Modes of Operation section.
To power up from full power-down, approximately 1 μs should
be allowed from the falling edge of CS, shown in Figure 33 as
tPOWER-UP. Note that during power-up from partial power-down
AD7273/AD7674
CS
1
10
12
14
16
SDATA
VALID DATA
Figure 29. Normal Mode Operation
Rev. 0 | Page 18 of 28
04973-029
SCLK
AD7273/AD7274
CS
1
2
10
16
04973-030
SCLK
THREE-STATE
SDATA
Figure 30. Entering Partial Power-Down Mode
THE PART IS FULLY
POWERED UP, SEE POWERUP TIMES SECTION
THE PART BEGINS
TO POWER UP
CS
1
10
16
1
16
SCLK
INVALID DATA
04973-031
A
SDATA
VALID DATA
Figure 31. Exiting Partial Power-Down Mode
THE PART ENTERS
PARTIAL POWER DOWN
THE PART BEGINS
TO POWER UP
THE PART ENTERS
FULL POWER DOWN
CS
1
2
10
16
1
10
16
THREE-STATE
INVALID DATA
SDATA
04973-032
SCLK
THREE-STATE
VALID DATA
Figure 32. Entering Full Power-Down Mode
THE PART BEGINS
TO POWER UP
THE PART IS
FULLY POWERED UP
tPOWER-UP
CS
1
10
16
1
16
SDATA
INVALID DATA
VALID DATA
Figure 33. Exiting Full Power-Down Mode
Rev. 0 | Page 19 of 28
04973-033
SCLK
AD7273/AD7274
7.00
POWER VS. THROUGHPUT RATE
VDD = 3V
5.80
POWER (mW)
48MHz SCLK
5.40
5.00
4.60
VARIABLE SCLK
04973-034
4.20
3.80
3.40
200
400
600
800
1000
1200
1400
1600
1800
2000
THROUGHPUT (kSPS)
Figure 34. Power vs. Throughput, Normal Mode
7.2
6.8
6.4
6.0
5.6
5.2
4.8
4.4
4.0
3.6
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
VDD = 3V
04973-035
Figure 35 shows that as the throughput rate is reduced, the
device remains in its power-down state longer and the average
power consumption over time drops accordingly. For example,
if the AD7273/AD7274 are operated in continuous sampling
mode with a throughput rate of 200 kSPS and a SCLK of 48 MHz
(VDD = 3 V) and the devices are placed into power-down mode
between conversions, the power consumption is calculated as
follows. The power dissipation during normal operation is
11.6 mW (VDD = 3 V). If the power-up time is one dummy
cycle, that is, 333 ns, and the remaining conversion time is
290 ns, the AD7273/AD7274 can be said to dissipate 11.6 mW
for 623 ns during each conversion cycle. If the throughput rate
is 200 kSPS, the cycle time is 5 μs and the average power dissipated
during each cycle is 623/5,000 × 9.6 mW = 1.42 mW. Figure 35
shows the power vs. throughput rate when using the partial
power-down mode between conversions at 3 V. The powerdown mode is intended for use with throughput rates of less
than 600 kSPS, because at higher sampling rates there is no
power saving achieved by using the power-down mode.
6.20
POWER (mW)
Figure 34 shows the power consumption of the device in
normal mode, in which the part is never powered down. By
using the power-down mode of the AD7273/AD7274 when not
performing a conversion, the average power consumption of the
ADC decreases as the throughput rate decreases.
6.60
0
200
400
600
800
1000
THROUGHPUT (kSPS)
Figure 35. Power vs. Throughput, Partial Power-Down Mode
Rev. 0 | Page 20 of 28
AD7273/AD7274
SERIAL INTERFACE
Figure 36 through Figure 38 show the detailed timing diagrams
for serial interfacing to the AD7274 and AD7273, respectively.
The serial clock provides the conversion clock and controls the
transfer of information from the AD7273/AD7274 during
conversion.
If the user considers a 14-SCLK cycle serial interface for the
AD7273/AD7274, CS must be brought high after the 14th SCLK
falling edge. Then the last two trailing zeros are ignored, and
SDATA goes back into three-state. In this case, the 3 MSPS
throughput can be achieved by using a 48 MHz clock frequency.
The CS signal initiates the data transfer and conversion process.
The falling edge of CS puts the track-and-hold into hold mode
and takes the bus out of three-state. The analog input is sampled
and the conversion is initiated at this point.
CS going low clocks out the first leading zero to be read by the
microcontroller or DSP. The remaining data is then clocked out
by subsequent SCLK falling edges, beginning with the second
leading zero. Therefore, the first falling clock edge on the serial
clock provides the first leading zero and clocks out the second
leading zero. The final bit in the data transfer is valid on the 16th
falling edge, because it is clocked out on the previous (15th)
falling edge.
For the AD7274, the conversion requires completing 14 SCLK
cycles. Once 13 SCLK falling edges have elapsed, the track-andhold goes back into track mode on the next SCLK rising edge,
as shown in Figure 36 at Point B. If the rising edge of CS occurs
before 14 SCLKs have elapsed, the conversion is terminated and
the SDATA line goes back into three-state. If 16 SCLKs are
considered in the cycle, the last two bits are zeros and SDATA
returns to three-state on the 16th SCLK falling edge, as shown in
Figure 37.
For the AD7273, the conversion requires completing 12 SCLK
cycles. Once 11 SCLK falling edges elapse, the track-and-hold
goes back into track mode on the next SCLK rising edge, as
shown in Figure 38 at Point B. If the rising edge of CS occurs
before 12 SCLKs elapse, the conversion is terminated and the
SDATA line goes back into three-state. If 16 SCLKs are
considered in the cycle, the AD7273 clocks out four trailing
zeros for the last four bits and SDATA returns to three-state on
the 16th SCLK falling edge, as shown in Figure 38.
In applications with a slower SCLK, it is possible to read data on
each SCLK rising edge. In such cases, the first falling edge of
SCLK clocks out the second leading zero and can be read on the
first rising edge. However, the first leading zero clocked out
when CS goes low is missed if read within the first falling edge.
The 15th falling edge of SCLK clocks out the last bit and can be
read on the 15th rising SCLK edge.
If CS goes low just after one SCLK falling edge elapses, CS
clocks out the first leading zero and can be read on the SCLK
rising edge. The next SCLK falling edge clocks out the second
leading zero and can be read on the following rising edge.
t1
CS
tCONVERT
t6
1
SCLK
2
3
4
t3
SDATA
THREESTATE
Z
B
5
13
t7
t4
ZERO
DB11
DB10
14
t5
t9
tQUIET
DB9
DB1
DB0
TWO LEADING
ZEROS
1/THROUGHPUT
Figure 36. AD7274 Serial Interface Timing Diagram 14 SCLK Cycle
Rev. 0 | Page 21 of 28
THREE-STATE
04973-036
t2
AD7273/AD7274
t1
CS
tCONVERT
t2
t6
1
SCLK
2
3
4
t3
THREESTATE
Z
13
DB11
DB10
DB9
15
16
t5
t7
t4
ZERO
14
t8
tQUIET
DB1
DB0
ZERO
ZERO
THREE-STATE
TWO LEADING
ZEROS
TWO TRAILING
ZEROS
04973-037
SDATA
B
5
1/THROUGHPUT
Figure 37. AD7274 Serial Interface Timing Diagram 16 SCLK Cycle
t1
CS
tCONVERT
t2
2
t3
THREESTATE
Z
ZERO
3
4
11
12
13
t5
t4
DB9
10
DB8
14
15
16
t8
t7
DB1
DB0
ZERO
ZERO
tQUIET
ZERO
ZERO
THREE-STATE
TWO LEADING
ZEROS
FOUR TRAILING
ZEROS
1/THROUGHPUT
Figure 38. AD7273 Serial Interface Timing Diagram
Rev. 0 | Page 22 of 28
04973-038
SDATA
t6
B
1
SCLK
AD7273/AD7274
Table 8. The SPORT0 Receive Configuration 1 Register
(SPORT0_RCR1)
MICROPROCESSOR INTERFACING
AD7273/AD7274 to ADSP-BF53x
The ADSP-BF53x family of DSPs interfaces directly to the
AD7273/AD7274 without requiring glue logic. The SPORT0
Receive Configuration 1 register should be set up as outlined in
Table 8.
AD7273/
AD72741
ADSP-BF53x1
SPORT0
SCLK
RCLK0
DOUT
DR0PRI
1ADDITIONAL
RFS0
TFSR = RFSR = 1
DT0
PINS OMITTED FOR CLARITY
Figure 39. Interfacing to the ADSP-BF53x
Description
Sample data with falling edge of RSCLK
Active low frame signal
Frame every word
Internal RFS used
Receive MSB first
Zero fill
Internal receive clock
Receive enabled
16-bit data-word (or can be set to 1101 for a
14-bit data-word)
04973-039
CS
DIN
Setting
RCKFE = 1
LRFS = 1
RFSR = 1
IRFS = 1
RLSBIT = 0
RDTYPE = 00
IRCLK = 1
RSPEN = 1
SLEN = 1111
To implement the power-down modes, set SLEN to 1001 to
issue an 8-bit SCLK burst.
Rev. 0 | Page 23 of 28
AD7273/AD7274
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7273/AD7274
should be designed so that the analog and digital sections are
separated and confined to certain areas of the board. This design
facilitates using ground planes that can be easily separated.
To provide optimum shielding for ground planes, a minimum
etch technique is generally best. All AGND pins of the AD7273/
AD7274 should be sunk into the AGND plane. Digital and
analog ground planes should be joined in only one place. If the
AD7273/AD7274 are in a system where multiple devices require
an AGND-to-DGND connection, the connection should be
made at only one point, a star ground point, established as close
as possible to the ground pin on the AD7273/AD7274.
Avoid running digital lines under the device, because this
couples noise onto the die. However, the analog ground plane
should be allowed to run under the AD7273/AD7274 to avoid
noise coupling. The power supply lines to the AD7273/AD7274
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
To avoid radiating noise to other sections of the board,
components with fast-switching signals, such as clocks, should
be shielded with digital ground, and they should never be run
near the analog inputs. Avoid crossover of digital and analog
signals. To reduce the effects of feedthrough within the board,
traces on opposite sides of the board should run at right angles
to each other. A microstrip technique is by far the best method,
but it is not always possible to use this approach with a doublesided board. In this technique, the component side of the board
is dedicated to ground planes, and signals are placed on the
solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 μF ceramic capacitors in parallel with
0.1 μF capacitors to AGND/DGND. To achieve the best results
from these decoupling components, they must be placed as close
as possible to the device, ideally right up against the device. The
0.1 μF capacitors should have low effective series resistance
(ESR) and low effective series inductance (ESI), such as is typical
of common ceramic or surface-mount types of capacitors.
Capacitors with low ESR and low ESI provide a low impedance
path to ground at high frequencies, which allows them to
handle transient currents due to internal logic switching.
EVALUATING THE AD7273/AD7274 PERFORMANCE
The recommended layout for the AD7273/AD7274 is outlined
in the evaluation board documentation. The evaluation board
package includes a fully assembled and tested evaluation board,
documentation, and software for controlling the board from a
PC via the evaluation board controller. The evaluation board
controller can be used in conjunction with the AD7273/AD7274
evaluation board, as well as many other Analog Devices evaluation
boards ending in the CB designator, to demonstrate/evaluate the
ac and dc performance of the AD7273/AD7274.
The software allows the user to perform ac (fast Fourier transform) and dc (histogram of codes) tests on the AD7273/AD7274.
The software and documentation are on a CD shipped with the
evaluation board.
Rev. 0 | Page 24 of 28
AD7273/AD7274
OUTLINE DIMENSIONS
2.90 BSC
8
7
6
5
1
2
3
4
1.60 BSC
3.00
BSC
2.80 BSC
8
3.00
BSC
PIN 1
INDICATOR
1
5
4.90
BSC
4
0.65 BSC
*0.90
0.87
0.84
1.95
BSC
PIN 1
0.65 BSC
*1.00 MAX
0.10 MAX
0.38
0.22
0.20
0.08
SEATING
PLANE
0.60
0.45
0.30
8°
4°
0°
*COMPLIANT TO JEDEC STANDARDS MO-193-BA WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.23
0.08
0.80
0.60
0.40
8°
0°
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 40. 8-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-8)
Dimensions shown in millimeters
Figure 41. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD7274BRM
AD7274BRMZ 2
AD7274BRMZ-REEL2
AD7274BUJ-500RL7
AD7274BUJZ-500RL72
AD7274BUJZ-REEL72
AD7273BRMZ2
AD7273BRMZ-REEL2
AD7273BUJ-REEL7
AD7273BUJZ-500RL72
EVAL-AD7274CB 3
EVAL-AD7273CB3
EVAL-CONTROL BRD2 4
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Linearity
Error (LSB) 1
±1 max
±1 max
±1 max
±1 max
±1 max
±1 max
±0.5 max
±0.5 max
±0.5 max
±0.5 max
Package Description
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Thin Small Outline Transistor Package (TSOT)
8-Lead Thin Small Outline Transistor Package (TSOT)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Mini Small Outline Package (MSOP)
8-Lead Thin Small Outline Transistor Package (TSOT)
8-Lead Thin Small Outline Transistor Package (TSOT)
Evaluation Board
Evaluation Board
Control Board
1
Package
Option
RM-8
RM-8
RM-8
UJ-8
UJ-8
UJ-8
RM-8
RM-8
UJ-8
UJ-8
Branding
C1V
C34
C34
C1V
C34
C34
C33
C33
C1U
C33
Linearity error refers to integral nonlinearity.
Z = Pb-free part.
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL board for evaluation/demonstration purposes.
4
This board is a complete unit that allows a PC to control and communicate with all Analog Devices evaluation boards that end in a CB designator. To order a complete
evaluation kit, the particular ADC evaluation board (such as EVAL-AD7273CB/AD7274CB), the EVAL-CONTROL BRD2, and a 12 V transformer must be ordered. See the
relevant evaluation board technical note for more information.
2
3
Rev. 0 | Page 25 of 28
AD7273/AD7274
NOTES
Rev. 0 | Page 26 of 28
AD7273/AD7274
NOTES
Rev. 0 | Page 27 of 28
AD7273/AD7274
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04973–0–9/05(0)
T
T
Rev. 0 | Page 28 of 28
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