AD7938BCPZ

FEATURES FUNCTIONAL BLOCK DIAGRAM Throughput rate: 1.5 MSPS Specified for VDD of 2.7 V to 5.25 V Power consumption 6 mW maximum at 1.5 MSPS with 3 V supplies 13.5 mW maximum at 1.5 MSPS with 5 V supplies 8 analog input channels with a sequencer Software-configurable analog inputs 8-channel single-ended inputs 4-channel fully differential inputs 4-channel pseudo differential inputs 7-channel pseudo differential inputs Accurate on-chip 2.5 V reference ±0.2% maximum @ 25°C, 25 ppm/°C maximum 69 dB SINAD at 50 kHz input frequency No pipeline delays High speed parallel interface—word/byte modes Full shutdown mode: 2 µA maximum 32-lead LFCSP and TQFP packages VDD AGND AD7938/AD7939 VREFIN/ VREFOUT 2.5V VREF VIN0 I/P MUX CLKIN 12-/10-BIT SAR ADC AND CONTROL T/H VIN7 CONVST BUSY SEQUENCER VDRIVE PARALLEL INTERFACE/CONTROL REGISTER DB0 DB11 CS RD WR W/B 03715-001 Data Sheet 8-Channel, 1.5 MSPS, 12-Bit and 10-Bit Parallel ADCs with a Sequencer AD7938/AD7939 DGND Figure 1. GENERAL DESCRIPTION The AD7938/AD7939 are 12-bit and 10-bit, high speed, low power, successive approximation (SAR) analog-to-digital converters (ADCs). The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS. The parts contain a low noise, wide bandwidth, differential track-and-hold amplifier that can handle input frequencies up to 50 MHz. These parts use advanced design techniques to achieve very low power dissipation at high throughput rates. They also feature flexible power management options. An on-chip control register allows the user to set up different operating conditions, including analog input range and configuration, output coding, power management, and channel sequencing. The AD7938/AD7939 feature eight analog input channels with a channel sequencer that allows a preprogrammed selection of channels to be converted sequentially. These parts can operate with either single-ended, fully differential, or pseudo differential analog inputs. 1. 2. 3. 4. The conversion process and data acquisition are controlled using standard control inputs that allow easy interfacing with microprocessors and DSPs. The input signal is sampled on the falling edge of CONVST and the conversion is also initiated at this point. The AD7938/AD7939 have an accurate on-chip 2.5 V reference that can be used as the reference source for the analog-todigital conversion. Alternatively, this pin can be overdriven to provide an external reference. Rev. F PRODUCT HIGHLIGHTS 5. 6. 7. High throughput with low power consumption. Eight analog inputs with a channel sequencer. Accurate on-chip 2.5 V reference. Single-ended, pseudo differential, or fully differential analog inputs that are software selectable. Single-supply operation with VDRIVE function. The VDRIVE function allows the parallel interface to connect directly to 3 V or 5 V processor systems independent of VDD. No pipeline delay. Accurate control of the sampling instant via a CONVST input and once-off conversion control. Table 1. Related Devices Device AD7933/AD7934 AD7938-6 AD7934-6 No. of Bits 12/10 12 12 No. of Channels 4 8 4 Speed 1.5 MSPS 625 kSPS 625 kSPS Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2004–2020 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com AD7938/AD7939 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Circuit Information ....................................................................... 19 Functional Block Diagram .............................................................. 1 Converter Operation ................................................................. 19 General Description ......................................................................... 1 ADC Transfer Function ............................................................ 19 Product Highlights ........................................................................... 1 Typical Connection Diagram ................................................... 20 Revision History ............................................................................... 2 Analog Input Structure ............................................................. 20 Specifications .................................................................................... 4 Analog Inputs ............................................................................. 21 AD7938 Specifications................................................................. 4 Analog Input Selection .............................................................. 23 AD7939 Specifications................................................................. 6 Reference ..................................................................................... 24 Timing Specifications .................................................................. 8 Parallel Interface......................................................................... 26 Absolute Maximum Ratings ........................................................... 9 Power Modes of Operation....................................................... 29 ESD Caution.................................................................................. 9 Power vs. Throughput Rate ...................................................... 30 Pin Configuration and Function Descriptions .......................... 10 Microprocessor Interfacing ...................................................... 30 Typical Performance Characteristics ........................................... 12 Application Hints ........................................................................... 32 Terminology .................................................................................... 14 Grounding and Layout .............................................................. 32 On-Chip Registers .......................................................................... 16 PCB Design Guidelines for Chip Scale Package .................... 32 Control Register ......................................................................... 16 Evaluating AD7938/AD7939 Performance ............................ 32 Sequencer Operation ................................................................. 17 Outline Dimensions ....................................................................... 33 Shadow Register ......................................................................... 18 Ordering Guide .......................................................................... 34 REVISION HISTORY 11/2020—Rev. E to Rev. F Changed CP-32-2 to CP-32-7 ...................................... Throughout Changes to Figure 2........................................................................ 10 Updated Outline Dimensions ....................................................... 32 Changes to Ordering Guide .......................................................... 33 10/2011—Rev. B to Rev. C Changes to SINAD Specification in Features Section..................1 Changes to AD7938 Specifications Section ...................................3 Updated Outline Dimensions ...................................................... 32 Changes to Ordering Guide .......................................................... 33 1/2018—Rev. D to Rev. E Changed CP-32-7 to CP-32-2 ...................................... Throughout Updated Outline Dimensions ....................................................... 32 Changes to Ordering Guide .......................................................... 33 2/2007—Rev. A to Rev. B Updated Format .................................................................Universal Changes to Sequencer Operation Section................................... 16 Updated Outline Dimensions ...................................................... 32 10/2016—Rev. C to Rev. D Changed to CP-32-7...................................................... Throughout Changes to Figure 2.......................................................................... 9 Updated Outline Dimensions ....................................................... 32 Changes to Ordering Guide .......................................................... 33 7/2005—Rev. 0 to Rev. A Changes to Specifications.................................................................3 Added Figure 3 ..................................................................................9 Changes to Table 5 ......................................................................... 10 Updated Typical Performance Characteristics .......................... 13 Changes to Table 11 ....................................................................... 16 Rev. F | Page 2 of 37 Data Sheet AD7938/AD7939 Changes to Analog Input Structure Section ................................18 Changes to Analog Inputs Section................................................19 Changes to Figure 17 ......................................................................17 Changes to Figure 20 ......................................................................18 Changes to Figure 21 ......................................................................19 Changes to Figure 22 ......................................................................19 Changes to Figure 24 ......................................................................19 Changes to Figure 28 ......................................................................21 Changes to Figure 29 ......................................................................21 Changes to Figure 41 ...................................................................... 28 Changes to Figure 43 ...................................................................... 28 Changes to Figure 44 ...................................................................... 29 Changes to Figure 45 ...................................................................... 29 Changes to Figure 46 ...................................................................... 29 Updated Outline Dimensions ....................................................... 31 Changes to Ordering Guide .......................................................... 32 10/2004—Revision 0: Initial Version Rev. F | Page 3 of 37 Data Sheet AD7938/AD7939 SPECIFICATIONS AD7938 SPECIFICATIONS VDD = VDRIVE = 2.7 V to 5.25 V, internal/external VREF = 2.5 V, unless otherwise noted, fCLKIN= 25.5 MHz, fSAMPLE = 1.5 MSPS; TA = TMIN to TMAX, unless otherwise noted. Table 2. Parameter DYNAMIC PERFORMANCE Signal-to-Noise and Distortion (SINAD) 2 Value 1 Unit Signal-to-Noise Ratio (SNR)2 69 67 71 dB min dB min dB min Test Conditions/Comments fIN = 50 kHz sine wave Differential mode Single-ended mode Differential mode Total Harmonic Distortion (THD)2 69 −73 dB min dB max Single-ended mode −85 dB typ, differential mode Peak Harmonic or Spurious Noise (SFDR)2 −69.5 −72 dB max dB max −80 dB typ, single-ended mode −82 dB typ Intermodulation Distortion (IMD)2 Second-Order Terms Third-Order Terms Channel-to-Channel Isolation Aperture Delay2 −6 −90 −85 5 dB typ dB typ dB typ ns typ fa = 30 kHz, fb = 50 kHz fIN = 50 kHz, fNOISE = 300 kHz Aperture Jitter2 72 ps typ Full Power Bandwidth2 50 MHz typ @ 3 dB 10 MHz typ @ 0.1 dB 12 ±1 Bits LSB max Differential mode ±1.5 LSB max Single-ended mode ±0.95 −0.95/+1.5 LSB max LSB max Guaranteed no missed codes to 12 bits Guaranteed no missed codes to 12 bits Straight binary output coding ±12 LSB max DC ACCURACY Resolution Integral Nonlinearity2 Differential Nonlinearity2 Differential Mode Single-Ended Mode Single-Ended and Pseudo Differential Input Offset Error2 ±3 LSB max ±3 LSB max Gain Error Match2 Fully Differential Input ±2 LSB max Positive Gain Error2 ±3 LSB max Positive Gain Error Match2 ±1.5 LSB typ Offset Error Match 2 2 Gain Error Twos complement output coding 2 Zero-Code Error Zero-Code Error Match 2 Negative Gain Error2 Negative Gain Error Match ANALOG INPUT Single-Ended Input Range 2 Pseudo Differential Input Range VIN+ VIN− Fully Differential Input Range VIN+ and VIN− VIN+ and VIN− DC Leakage Current 4 Input Capacitance ±9.5 LSB max ±1 LSB typ ±3 LSB max ±1.5 LSB typ 0 to VREF 0 to 2 × VREF V V RANGE bit = 0 RANGE bit = 1 0 to VREF 0 to 2 × VREF −0.3 to +0.7 −0.3 to +1.8 V V V typ V typ RANGE bit = 0 RANGE bit = 1 VDD = 3 V VDD = 5 V VCM ± VREF/2 VCM ± VREF ±1 45 10 V V µA max pF typ pF typ VCM = common-mode voltage 3 = VREF/2 VCM = VREF, VIN+ or VIN− must remain within GND/VDD Rev. F | Page 4 of 37 When in track When in hold Data Sheet Parameter REFERENCE INPUT/OUTPUT VREF Input Voltage 5 DC Leakage Current VREFOUT Output Voltage VREFOUT Temperature Coefficient VREF Noise VREF Output Impedance VREF Input Capacitance LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IIN Input Capacitance, CIN4 LOGIC OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance4 Output Coding CONVERSION RATE Conversion Time Track-and-Hold Acquisition Time Throughput Rate POWER REQUIREMENTS VDD VDRIVE IDD 6 Normal Mode (Static) Normal Mode (Operational) Autostandby Mode Full/Autoshutdown Mode (Static) Power Dissipation Normal Mode (Operational) Autostandby Mode (Static) Full/Autoshutdown Mode (Static) AD7938/AD7939 Value 1 Unit Test Conditions/Comments 2.5 ±1 2.5 25 5 10 130 10 15 25 V µA max V ppm/°C max ppm/°C typ µV typ µV typ Ω typ pF typ pF typ ±1% for specified performance 2.4 0.8 ±5 10 V min V max µA max pF typ 2.4 0.4 ±3 10 V min V max µA max pF typ Straight (natural) binary Twos complement ±0.2% max @ 25°C 0.1 Hz to 10 Hz bandwidth 0.1 Hz to 1 MHz bandwidth When in track When in hold Typically 10 nA, VIN = 0 V or VDRIVE ISOURCE = 200 µA ISINK = 200 µA CODING bit = 0 CODING bit = 1 t2 + 13 tCLKIN 125 80 1.5 ns ns max ns typ MSPS max 2.7/5.25 2.7/5.25 V min/max V min/max 0.8 2.7 2.0 0.3 160 2 mA typ mA max mA max mA typ µA typ µA max Digital inputs = 0 V or VDRIVE VDD = 2.7 V to 5.25 V, SCLK on or off VDD = 4.75 V to 5.25 V VDD = 2.7 V to 3.6 V fSAMPLE = 100 kSPS, VDD = 5 V Static SCLK on or off 13.5 6 800 480 10 6 mW max mW max µW typ µW typ µW max µW max VDD = 5 V VDD = 3 V VDD = 5 V VDD = 3 V VDD = 5 V VDD = 3 V Full-scale step input Sine wave input Temperature range is −40°C to +85°C. See the Terminology section. For full common-mode range, see Figure 26 and Figure 27. 4 Sample tested during initial release to ensure compliance. 5 This device is operational with an external reference in the range of 0.1 V to VDD. See the Reference section for more information. 6 Measured with a midscale dc analog input. 1 2 3 Rev. F | Page 5 of 37 AD7938/AD7939 Data Sheet AD7939 SPECIFICATIONS VDD = VDRIVE = 2.7 V to 5.25 V, internal/external VREF = 2.5 V, unless otherwise noted, fCLKIN = 25.5 MHz, fSAMPLE= 1.5 MSPS; TA = TMIN to TMAX, unless otherwise noted. Table 3. Parameter DYNAMIC PERFORMANCE Signal-to-Noise and Distortion (SINAD) 2 Total Harmonic Distortion (THD)2 Peak Harmonic or Spurious Noise (SFDR)2 Intermodulation Distortion (IMD)2 Second-Order Terms Third-Order Terms Channel-to-Channel Isolation Aperture Delay2 Aperture Jitter2 Full Power Bandwidth2 DC ACCURACY Resolution Integral Nonlinearity2 Differential Nonlinearity2 Single-Ended and Pseudo Differential Input Offset Error2 Offset Error Match2 Gain Error2 Gain Error Match2 Fully Differential Input Positive Gain Error2 Positive Gain Error Match2 Zero-Code Error2 Zero-Code Error Match2 Negative Gain Error2 Negative Gain Error Match2 ANALOG INPUT Single-Ended Input Range Pseudo Differential Input Range VIN+ VIN− Fully Differential Input Range VIN+ and VIN− VIN+ and VIN− DC Leakage Current 4 Input Capacitance Value 1 Unit 61 60 −70 −72 dB min dB min dB max dB max −86 −90 −75 5 72 50 10 dB typ dB typ dB typ ns typ ps typ MHz typ MHz typ 10 ±0.5 ±0.5 Bits LSB max LSB max ±2 ±0.5 ±1.5 ±0.5 LSB max LSB max LSB max LSB max Test Conditions/Comments fIN = 50 kHz sine wave Differential mode Single-ended mode fa = 30 kHz, fb = 50 kHz fIN = 50 kHz, fNOISe = 300 kHz @ 3 dB @ 0.1 dB Guaranteed no missed codes to 10 bits Straight binary output coding Twos complement output coding ±1.5 ±0.5 ±2 ±0.5 ±1.5 ±0.5 LSB max LSB max LSB max LSB max LSB max LSB max 0 to VREF 0 to 2 × VREF V V RANGE bit = 0 RANGE bit = 1 0 to VREF 0 to 2 × VREF −0.3 to +0.7 −0.3 to +1.8 V V V typ V typ RANGE bit = 0 RANGE bit =1 VDD = 3 V VDD = 5 V VCM ± VREF/2 VCM ± VREF V V VCM = common-mode voltage 3 = VREF/2 VCM = VREF, VIN+ or VIN− must remain within GND/VDD ±1 45 10 µA max pF typ pF typ Rev. F | Page 6 of 37 When in track When in hold Data Sheet Parameter REFERENCE INPUT/OUTPUT VREF Input Voltage 5 DC Leakage Current4 VREFOUT Output Voltage VREFOUT Temperature Coefficient VREF Noise VREF Output Impedance VREF Input Capacitance LOGIC INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IIN Input Capacitance, CIN4 LOGIC OUTPUTS Output High Voltage, VOH Output Low Voltage, VOL Floating-State Leakage Current Floating-State Output Capacitance4 Output Coding CONVERSION RATE Conversion Time Track-and-Hold Acquisition Time Throughput Rate POWER REQUIREMENTS VDD VDRIVE IDD 6 Normal Mode (Static) Normal Mode (Operational) Autostandby Mode Full/Autoshutdown Mode (Static) Power Dissipation Normal Mode (Operational) Autostandby Mode (Static) Full/Autoshutdown Mode (Static) AD7938/AD7939 Value 1 Unit Test Conditions/Comments 2.5 ±1 2.5 25 5 10 130 10 15 25 V µA max V ppm/°C max ppm/°C typ µV typ µV typ Ω typ pF typ pF typ ±1% for specified performance External reference applied to pin ±0.2% max @ 25°C 2.4 0.8 ±5 10 V min V max µA max pF typ 2.4 0.4 ±3 10 Straight (natural) binary Twos complement V min V max µA max pF typ t2 + 13 tCLKIN 125 80 1.5 ns ns max ns typ MSPS max 2.7/5.25 2.7/5.25 V min/max V min/max 0.8 2.7 2.0 0.3 160 2 mA typ mA max mA max mA typ µA typ µA max Digital inputs = 0 V or VDRIVE VDD = 2.7 V to 5.25 V, SCLK on or off VDD = 4.75 V to 5.25 V VDD = 2.7 V to 3.6 V fSAMPLE = 100 kSPS, VDD = 5 V Static SCLK on or off 13.5 6 800 480 10 mW max mW max µW typ µW typ µW max VDD = 5 V VDD = 3 V VDD = 5 V VDD = 3 V VDD = 5 V 6 µW max VDD = 3 V 0.1 Hz to 10 Hz bandwidth 0.1 Hz to 1 MHz bandwidth When in track When in hold Typically 10 nA, VIN = 0 V or VDRIVE ISOURCE = 200 µA ISINK = 200 µA CODING bit = 0 CODING bit =1 Full-scale step input Sine wave input Temperature range is −40°C to +85°C. See the Terminology section. 3 For full common-mode range, see Figure 26 and Figure 27. 4 Sample tested during initial release to ensure compliance. 5 This device is operational with an external reference in the range of 0.1 V to VDD. See the Reference section for more details. 6 Measured with a midscale dc analog input. 1 2 Rev. F | Page 7 of 37 AD7938/AD7939 Data Sheet TIMING SPECIFICATIONS VDD = VDRIVE = 2.7 V to 5.25 V, internal/external VREF = 2.5 V, unless otherwise noted; fCLKIN = 25.5 MHz, fSAMPLE = 1.5 MSPS; TA = TMIN to TMAX, unless otherwise noted. Table 4. Parameter 1 fCLKIN 2 tQUIET t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 3 t14 4 t15 t16 t17 t18 t19 t20 t21 t22 Limit at TMIN, TMAX AD7938 AD7939 700 700 25.5 25.5 30 30 Unit kHz min MHz max ns min 10 15 50 0 0 10 10 10 10 0 0 30 30 3 50 0 0 10 0 10 40 15.7 7.8 ns min ns min ns max ns min ns min ns min ns min ns min ns min ns min ns min ns min ns max ns min ns max ns min ns min ns min ns min ns min ns max ns min ns min 10 15 50 0 0 10 10 10 10 0 0 30 30 3 50 0 0 10 0 10 40 15.7 7.8 Description CLKIN frequency. Minimum time between end of read and start of next conversion; in other words, time from when the data bus goes into three-state until the next falling edge of CONVST. CONVST pulse width. CONVST falling edge to CLKIN falling edge setup time. CLKIN falling edge to BUSY rising edge. CS to WR setup time. CS to WR hold time. WR pulse width. Data setup time before WR. Data hold after WR. New data valid before falling edge of BUSY. CS to RD setup time. CS to RD hold time. RD pulse width. Data access time after RD. Bus relinquish time after RD. Bus relinquish time after RD. HBEN to RD setup time. HBEN to RD hold time. Minimum time between reads/writes. HBEN to WR setup time. HBEN to WR hold time. CLKIN falling edge to BUSY falling edge. CLKIN low pulse width. CLKIN high pulse width. Sample tested during initial release to ensure compliance. All input signals are specified with tRISE = tFALL = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. All timing specifications given above are with a 25 pF load capacitance (see Figure 36, Figure 37, Figure 38, and Figure 39). Minimum CLKIN for specified performance, with slower SCLK frequencies performance specifications apply typically. 3 The time required for the output to cross 0.4 V or 2.4 V. 4 t14 is derived from the measured time taken by the data outputs to change 0.5 V. The measured number is then extrapolated back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t14, quoted in the timing characteristics is the true bus relinquish time of the part and is independent of the bus loading. 1 2 Rev. F | Page 8 of 37 Data Sheet AD7938/AD7939 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 5. Parameter VDD to AGND/DGND VDRIVE to AGND/DGND Analog Input Voltage to AGND Digital Input Voltage to DGND VDRIVE to VDD Digital Output Voltage to DGND VREFIN to AGND AGND to DGND Input Current to Any Pin Except Supplies 1 Operating Temperature Range Commercial (B Version) Storage Temperature Range Junction Temperature θJA Thermal Impedance θJC Thermal Impedance Lead Temperature, Soldering Reflow Temperature (10 sec to 30 sec) ESD 1 Rating −0.3 V to +7 V −0.3 V to VDD + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to +7 V −0.3 V to VDD + 0.3 V −0.3 V to VDRIVE + 0.3 V −0.3 V to VDD + 0.3 V −0.3 V to +0.3 V ±10 mA Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION −40°C to +85°C −65°C to +150°C 150°C 108.2°C/W (LFCSP) 121°C/W (TQFP) 32.71°C/W (LFCSP) 45°C/W (TQFP) 255°C 1.5 kV Transient currents of up to 100 mA do not cause SCR latch-up. Rev. F | Page 9 of 37 Data Sheet AD7938/AD7939 1 2 VIN3 VIN5 VIN4 VIN2 24 VIN1 23 VIN0 22 VREFIN/VREFOUT 21 AGND 20 CS 19 RD 7 18 WR 8 17 CONVST DB6 DB7 TOP VIEW (Not to Scale) 10 11 12 13 14 15 16 03715-050 DB5 6 BUSY 5 CLKIN DB4 AD7938/AD7939 DB10 4 DB11 3 DB9 DB2 DB3 VDRIVE 03715-006 VIN7 PIN 1 9 VDRIVE DGND DB8/HBEN DB9 DB10 DB11 BUSY CLKIN NOTES 1. THE EXPOSED PAD IS LOCATED ON THE UNDERSIDE OF THE PACKAGE. CONNECT THE EPAD TO THE GROUND PLANE OF THE PCB USING MULTIPLE VIAS. DB0 DB1 DB8/HBEN TOP VIEW (Not to Scale) VIN1 VIN0 VREFIN/VREFOUT AGND CS RD WR CONVST VIN6 W/B AD7938/ AD7939 24 23 22 21 20 19 18 17 DGND 1 2 3 4 5 6 7 8 VDD W/B VDD VIN7 VIN6 VIN5 VIN4 VIN3 VIN2 32 31 30 29 28 27 26 25 9 10 11 12 13 14 15 16 DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 32 31 30 29 28 27 26 25 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. TQFP Pin Configuration Figure 2. LFCSP Pin Configuration Table 6. Pin Function Descriptions Pin No. 1 to 8 Mnemonic DB0 to DB7 9 VDRIVE 10 DGND 11 DB8/HBEN 12 to 14 DB9 to DB11 15 BUSY 16 CLKIN 17 CONVST 18 19 WR RD 20 CS Description Data Bit 0 to Data Bit 7. Three-state parallel digital I/O pins that provide the conversion result and allow the control and shadow registers to be programmed. These pins are controlled by CS, RD, and WR. The logic high/low voltage levels for these pins are determined by the VDRIVE input. When reading from the AD7939, the two LSBs (DB0 and DB1) are always 0 and the LSB of the conversion result is available on DB2. Logic Power Supply Input. The voltage supplied at this pin determines at what voltage the parallel interface of the AD7938/AD7939 operates. This pin should be decoupled to DGND. The voltage at this pin can be different to that at VDD but should never exceed VDD by more than 0.3 V. Digital Ground. This is the ground reference point for all digital circuitry on the AD7938/AD7939. This pin should connect to the DGND plane of a system. The DGND and AGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis. Data Bit 8/High Byte Enable. When W/B is high, this pin acts as Data Bit 8, a three-state I/O pin that is controlled by CS, RD, and WR. When W/B is low, this pin acts as the high byte enable pin. When HBEN is low, the low byte of data being written to or read from the AD7938/AD7939 is on DB0 to DB7. When HBEN is high, the top four bits of the data being written to or read from the AD7938/AD7939 are on DB0 to DB3. When reading from the device, DB4 to DB6 of the high byte contains the ID of the channel to which the conversion result corresponds (see the channel address bits in Table 10). When writing to the device, DB4 to DB7 of the high byte must be all 0s. Note that when reading from the AD7939, the two LSBs of the low byte are 0s, and the remaining six bits are conversion data. Data Bit 9 to Data Bit 11. Three-state parallel digital I/O pins that provide the conversion result and allow the control and shadow registers to be programmed in word mode. These pins are controlled by CS, RD, and WR. The logic high/low voltage levels for these pins are determined by the VDRIVE input. Busy Output. Logic output that indicates the status of the conversion. The BUSY output goes high following the falling edge of CONVST and stays high for the duration of the conversion. Once the conversion is complete and the result is available in the output register, the BUSY output goes low. The track-and-hold returns to track mode just prior to the falling edge of BUSY on the 13th rising edge of CLKIN. See Figure 36. Master Clock Input. The clock source for the conversion process is applied to this pin. Conversion time for the AD7938/AD7939 takes 13 clock cycles + t2. The frequency of the master clock input therefore determines the conversion time and achievable throughput rate. The CLKIN signal may be a continuous or burst clock. Conversion Start Input. A falling edge on CONVST is used to initiate a conversion. The track-and-hold goes from track mode to hold mode on the falling edge of CONVST and the conversion process is initiated at this point. Following power-down, when operating in autoshutdown or autostandby modes, a rising edge on CONVST is used to power up the device. Write Input. Active low logic input used in conjunction with CS to write data to the internal registers. Read Input. Active low logic input used in conjunction with CS to access the conversion result. The conversion result is placed on the data bus following the falling edge of RD read while CS is low. Chip Select. Active low logic input used in conjunction with RD and WR to read conversion data or to write data to the internal registers. Rev. F | Page 10 of 37 Data Sheet Pin No. 21 Mnemonic AGND 22 VREFIN/VREFOUT 23 to 30 VIN0 to VIN7 31 VDD 32 W/B EPAD AD7938/AD7939 Description Analog Ground. This is the ground reference point for all analog circuitry on the AD7938/AD7939. All analog input signals and any external reference signal should be referred to this AGND voltage. The AGND and DGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis. Reference Input/Output. This pin is connected to the internal reference and is the reference source for the ADC. The nominal internal reference voltage is 2.5 V, which appears at this pin. It is recommended that this pin is decoupled to AGND with a 470 nF capacitor. This pin can be overdriven by an external reference. The input voltage range for the external reference is 0.1 V to VDD; however, care must be taken to ensure that the analog input range does not exceed VDD + 0.3 V. See the Reference section. Analog Input 0 to Analog Input 7. Eight analog input channels that are multiplexed into the on-chip track-andhold. The analog inputs can be programmed to be eight single-ended inputs, four fully differential pairs, four pseudo differential pairs, or seven pseudo differential inputs by setting the MODE bits in the control register appropriately (see Table 10). The analog input channel to be converted can either be selected by writing to the address bits (ADD2 to ADD0) in the control register prior to the conversion or the on-chip sequencer can be used. The SEQ and SHDW bits in conjunction with the address bits in the control register allow the shadow register to be programmed. The input range for all input channels can either be 0 V to VREF or 0 V to 2 × VREF, and the coding can be binary or twos complement, depending on the states of the RANGE and CODING bits in the control register. Any unused input channels should be connected to AGND to avoid noise pickup. Power Supply Input. The VDD range for the AD7938/AD7939 is 2.7 V to 5.25 V. The supply should be decoupled to AGND with a 0.1 µF capacitor and a 10 µF tantalum capacitor. Word/Byte Input. When this input is logic high, data is transferred to and from the AD7938/AD7939 in 12-bit/10bit words on the DB0/DB2 to DB11 pins. When this pin is logic low, byte transfer mode is enabled. Data and the channel ID are transferred on Pin DB0 to Pin DB7, and Pin DB8/HBEN assumes its HBEN functionality. Unused data lines when operating in byte transfer mode should be tied off to DGND. Exposed Pad. The exposed pad is located on the underside of the package. Connect the EPAD to the ground plane of the PCB using multiple vias. Rev. F | Page 11 of 37 Data Sheet AD7938/AD7939 TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, unless otherwise noted. –60 –70 4096 POINT FFT VDD = 5V FSAMPLE = 1.5MSPS FIN = 49.62kHz SINAD = 70.94dB THD = –90.09dB DIFFERENTIAL MODE –10 –20 AMPLITUDE (dB) INT REF –80 PSRR (dB) 0 100mV p-p SINE WAVE ON VDD AND/OR VDRIVE NO DECOUPLING DIFFERENTIAL/SINGLE-ENDED MODE –90 EXT REF –100 –30 –40 –50 –60 –70 –80 03715-007 700 600 0.6 DNL ERROR (LSB) –85 0.4 0.2 0 –0.2 –0.4 03715-021 –0.6 0 100 200 500 600 300 400 NOISE FREQUENCY (kHz) 700 03715-010 ISOLATION (dB) VDD = 5V DIFFERENTIAL MODE 0.8 –90 –0.8 –1.0 800 0 Figure 5. AD7938 Channel-to-Channel Isolation 500 1000 1500 2000 2500 CODE 3000 3500 4000 Figure 8. AD7938 Typical DNL @ VDD = 5 V 1.0 80 VDD = 5V VDD = 5V DIFFERENTIAL MODE 0.8 70 0.6 VDD = 3V INL ERROR (LSB) 50 40 30 100 200 300 400 500 600 700 FREQUENCY (kHz) 0.2 0 –0.2 –0.4 –0.6 03715-008 FSAMPLE = 1.5MSPS RANGE = 0 TO VREF DIFFERENTIAL MODE 0 0.4 800 900 03715-011 60 SINAD (dB) 500 1.0 INTERNAL/EXTERNAL REFERENCE VDD = 5V –80 20 400 Figure 7. AD7938 FFT @ VDD = 5 V –75 –95 300 FREQUENCY (kHz) Figure 4. PSRR vs. Supply Ripple Frequency Without Supply Decoupling –70 200 –110 1010 810 410 610 210 SUPPLY RIPPLE FREQUENCY (kHz) 100 –100 0 –120 10 03715-009 –90 –110 –0.8 –1.0 1000 Figure 6. AD7938 SINAD vs. Analog Input Frequency for Various Supply Voltages 0 500 1000 1500 2000 2500 CODE 3000 Figure 9. AD7938 Typical INL @ VDD = 5 V Rev. F | Page 12 of 37 3500 4000 Data Sheet AD7938/AD7939 10000 4 SINGLE-ENDED MODE DIFFERENTIAL MODE 9000 9997 CODES INTERNAL REF 8000 3 6000 ??? DNL (LSB) 7000 2 1 5000 4000 POSITIVE DNL 3000 03715-012 –1 0.25 NEGATIVE DNL 0.50 0.75 1.00 1.25 1.50 1.75 VREF (V) 2.00 2.50 2.25 1000 0 2046 2.75 11 2050 110 VDD = 5V DIFFERENTIAL MODE 10 100 VDD = 5V SINGLE-ENDED MODE 9 CMRR (dB) VDD = 3V SINGLE-ENDED MODE 8 90 80 VDD = 3V DIFFERENTIAL MODE 70 03715-013 0 0.5 1.0 1.5 2.0 VREF (V) 2.5 3.0 3.5 60 4.0 0 VDD = 5V –1.0 VDD = 3V –1.5 –2.0 –2.5 –3.0 –3.5 SINGLE-ENDED MODE 0 0.5 1.0 1.5 2.0 VREF (V) 2.5 3.0 03715-014 –4.0 –4.5 0 200 400 600 800 RIPPLE FREQUENCY (kHz) 1000 1200 Figure 14. CMRR vs. Ripple Frequency with VDD = 5 V and 3 V Figure 11. AD7938 ENOB vs. VREF –0.5 03715-017 EFFECTIVE NUMBER OF BITS CODE 2049 DIFFERENTIAL MODE 7 OFFSET (LSB) 2048 120 12 –5.0 3 CODES 2047 Figure 13. AD7938 Histogram of Codes for 10k Samples @ VDD = 5 V with the Internal Reference Figure 10. AD7938 DNL vs. VREF for VDD = 3 V 6 03715-015 2000 0 3.5 Figure 12. AD7938 Offset vs. VREF Rev. F | Page 13 of 37 Data Sheet AD7938/AD7939 TERMINOLOGY Integral Nonlinearity This is the maximum deviation from a straight line passing through the endpoints of the ADC transfer function. The endpoints of the transfer function are zero scale, 1 LSB below the first code transition, and full scale, 1 LSB above the last code transition. Differential Nonlinearity This is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC. Offset Error This is the deviation of the first code transition (00…000) to (00…001) from the ideal (that is, AGND + 1 LSB). Offset Error Match This is the difference in offset error between any two channels. Gain Error This is the deviation of the last code transition (111…110) to (111…111) from the ideal (that is, VREF − 1 LSB) after the offset error has been adjusted out. Gain Error Match This is the difference in gain error between any two channels. Zero-Code Error This applies when using the twos complement output coding option, in particular to the 2 × VREF input range with −VREF to +VREF biased about the VREFIN point. It is the deviation of the midscale transition (all 0s to all 1s) from the ideal VIN voltage (that is, VREF). Zero-Code Error Match Negative Gain Error Match This is the difference in negative gain error between any two channels. Channel-to-Channel Isolation Channel-to-channel isolation is a measure of the level of crosstalk between channels. It is measured by applying a fullscale sine wave signal to all seven nonselected input channels and applying a 50 kHz signal to the selected channel. The channel-to-channel isolation is defined as the ratio of the power of the 50 kHz signal on the selected channel to the power of the noise signal on the unselected channels that appears in the FFT of this channel. The noise frequency on the unselected channels varies from 40 kHz to 740 kHz. The noise amplitude is at 2 × VREF, while the signal amplitude is at 1 × VREF. See Figure 5. Power Supply Rejection Ratio (PSRR) PSRR is defined as the ratio of the power in the ADC output at full-scale frequency, f, to the power of a 100 mV p-p sine wave applied to the ADC VDD supply of frequency, fS. The frequency of the noise varies from 1 kHz to 1 MHz. PSRR (dB) = 10 log(Pf/PfS) where: Pf is the power at frequency f in the ADC output. PfS is the power at frequency fS in the ADC output. This is the difference in zero-code error between any two channels. Positive Gain Error This applies when using the twos complement output coding option, in particular to the 2 × VREF input range with −VREF to +VREF biased about the VREFIN point. It is the deviation of the last code transition (011…110) to (011…111) from the ideal (that is, VREF − 1 LSB) after the zero-code error has been adjusted out. Positive Gain Error Match This is the difference in positive gain error between any two channels. Negative Gain Error This applies when using the twos complement output coding option, in particular to the 2 × VREF input range with −VREF to +VREF biased about the VREF point. It is the deviation of the first code transition (100…000) to (100…001) from the ideal (that is, −VREFIN + 1 LSB) after the zero-code error has been adjusted out. Common-Mode Rejection Ratio (CMRR) CMRR is defined as the ratio of the power in the ADC output at full-scale frequency, f, to the power of a 100 mV p-p sine wave applied to the common-mode voltage of VIN+ and VIN− of frequency, fS. CMRR (dB) = 10 log(Pf/PfS) where: Pf is the power at frequency f in the ADC output. PfS is the power at frequency fS in the ADC output. Rev. F | Page 14 of 37 Data Sheet AD7938/AD7939 Track-and-Hold Acquisition Time The track-and-hold amplifier returns to track mode at the end of conversion. The track-and-hold acquisition time is the time required for the output of the track-and-hold amplifier to reach its final value, within ±½ LSB, after the end of conversion. Signal-to-Noise and Distortion Ratio (SINAD) This is the measured ratio of signal-to-noise and distortion at the output of the ADC. The signal is the rms amplitude of the fundamental. Noise is the sum of all nonfundamental signals up to half the sampling frequency (fSAMPLE/2), excluding dc. The ratio is dependent on the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal-to-noise and distortion ratio for an ideal N-bit converter with a sine wave input is given by SINAD = (6.02 N + 1.76) dB Thus, for a 12-bit converter, SINAD is 74 dB, and for a 10-bit converter, it is 62 dB. Total Harmonic Distortion (THD) THD is the ratio of the rms sum of harmonics to the fundamental. For the AD7938/AD7939, it is defined as  V 2 2 + V 3 2 + V 4 2 + V 5 2 + V6 2 THD (dB ) = −20 log   V1      where: Peak Harmonic or Spurious Noise Peak harmonic or spurious noise is defined as the ratio of the rms value of the next largest component in the ADC output spectrum (up to fSAMPLE/2 and excluding dc) to the rms value of the fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for ADCs where the harmonics are buried in the noise floor, it is a noise peak. Intermodulation Distortion With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities creates distortion products at sum and difference frequencies of mfa ± nfb where m, n = 0, 1, 2, 3, and so on. Intermodulation distortion terms are those for which neither m nor n are equal to 0. For example, the second-order terms include (fa + fb) and (fa − fb), while the third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb). The AD7938/AD7939 are tested using the CCIF standard where two input frequencies near the top end of the input bandwidth are used. In this case, the second-order terms are usually distanced in frequency from the original sine waves while the third-order terms are usually at a frequency close to the input frequencies. As a result, the second- and third-order terms are specified separately. The intermodulation distortion is calculated per the THD specification, as the ratio of the rms sum of the individual distortion products to the rms amplitude of the sum of the fundamentals, expressed in dB. V1 is the rms amplitude of the fundamental. V2, V3, V4, V5, and V6 are the rms amplitudes of the second through the sixth harmonics. Rev. F | Page 15 of 37 Data Sheet AD7938/AD7939 ON-CHIP REGISTERS CONTROL REGISTER The AD7938/AD7939 have two on-chip registers that are necessary for the operation of the device. These are the control register, which is used to set up different operating conditions, and the shadow register, which is used to program the analog input channels to be converted. The control register on the AD7938/AD7939 is a 12-bit, writeonly register. Data is written to this register using the CS and WR pins. The control register is shown in Table 7 and the functions of the bits are described in Table 8. At power up, the default bit settings in the control register are all 0s. Table 7. Control Register Bits MSB DB11 PM1 DB10 PM0 DB9 CODING DB8 REF DB7 ADD2 DB6 ADD1 DB5 ADD0 DB4 MODE1 DB3 MODE0 DB2 SHDW DB1 SEQ LSB DB0 RANGE Table 8. Control Register Bit Function Description Bit No. 11, 10 Mnemonic PM1, PM0 9 CODING 8 REF 7 to 5 ADD2 to ADD0 4, 3 MODE1, MODE0 2 SHDW 1 SEQ 0 RANGE Description Power Management Bits. These two bits are used to select the power mode of operation. The user can choose between either normal mode or various power-down modes of operation, as shown in Table 9. This bit selects the output coding of the conversion result. If this bit is set to 0, the output coding is straight (natural) binary. If this bit is set to 1, the output coding is twos complement. This bit selects whether the internal or external reference is used to perform the conversion. If this bit is Logic 0, an external reference should be applied to the VREF pin. If this bit is Logic 1, the internal reference is selected. See the Reference section. These three address bits are used to either select which analog input channel is converted in the next conversion if the sequencer is not used, or to select the final channel in a consecutive sequence when the sequencer is used, as described in Table 11. The selected input channel is decoded as shown in Table 10. The two mode pins select the type of analog input on the eight VIN pins. The AD7938/AD7939 can have either eight single-ended inputs, four fully differential inputs, four pseudo differential inputs, or seven pseudo differential inputs. See Table 10. The SHDW bit in the control register is used in conjunction with the SEQ bit to control the sequencer function and access the SHDW register. See Table 11. The SEQ bit in the control register is used in conjunction with the SHDW bit to control the sequencer function and access the SHDW register. See Table 11. This bit selects the analog input range of the AD7938/AD7939. If it is set to 0, the analog input range extends from 0 V to VREF. If it is set to 1, the analog input range extends from 0 V to 2 × VREF. When this range is selected, VDD must be 4.75 V to 5.25 V if a 2.5 V reference is used; otherwise, care must be taken to ensure that the analog input remains within the supply rails. See the Analog Inputs section for more information. Table 9. Power Mode Selection Using the Power Management Bits in the Control Register PM1 0 0 PM0 0 1 Mode Normal Mode Autoshutdown 1 0 Autostandby 1 1 Full Shutdown Description When operating in normal mode, all circuitry is fully powered up at all times. When operating in autoshutdown mode, the AD7938/AD7939 enter full shutdown mode at the end of each conversion. In this mode, all circuitry is powered down. When the AD7938/AD7939 enter this mode, all circuitry is powered down except for the reference and reference buffer. This mode is similar to autoshutdown mode, but it allows the part to power up in 7 µs (or 600 ns if an external reference is used). See the Power Modes of Operation section for more information. When the AD7938/AD7939 enter this mode, all circuitry is powered down. The information in the control register is retained. Rev. F | Page 16 of 37 Data Sheet AD7938/AD7939 SEQUENCER OPERATION The configuration of the SEQ and SHDW bits in the control register allows the user to select a particular mode of operation of the sequencer function. Table 11 outlines the four modes of operation of the sequencer. Writing to the Control Register to Program the Sequencer The AD7938/AD7939 need 13 full CLKIN periods to perform a conversion. If the ADC does not receive the full 13 CLKIN periods, the conversion aborts. If a conversion is aborted after applying 12.5 CLKIN periods to the ADC, ensure that a rising edge of CONVST or a falling edge of CLKIN is applied to the part before writing to the control register to program the sequencer. If these conditions are not met, the sequencer will not be in the correct state to handle being reprogrammed for another sequence of conversions and the performance of the converter is not guaranteed. Table 10. Analog Input Type Selection Channel Address ADD2 ADD1 0 0 0 0 0 1 0 1 1 0 1 0 1 1 1 1 ADD0 0 1 0 1 0 1 0 1 MODE0 = 0, MODE1 = 0 Eight Single-Ended Input Channels VIN+ VIN− VIN0 AGND VIN1 AGND VIN2 AGND VIN3 AGND VIN4 AGND VIN5 AGND VIN6 AGND VIN7 AGND MODE0 = 0, MODE1 = 1 Four Fully Differential Input Channels VIN+ VIN− VIN0 VIN1 VIN1 VIN0 VIN2 VIN3 VIN3 VIN2 VIN4 VIN5 VIN5 VIN4 VIN6 VIN7 VIN7 VIN6 MODE0 = 1, MODE1 = 0 Four Pseudo Differential Input Channels (Pseudo Mode 1) VIN+ VIN− VIN0 VIN1 VIN1 VIN0 VIN2 VIN3 VIN3 VIN2 VIN4 VIN5 VIN5 VIN4 VIN6 VIN7 VIN7 VIN6 MODE0 = 1, MODE1 = 1 Seven Pseudo Differential Input Channels (Pseudo Mode 2) VIN+ VIN− VIN0 VIN7 VIN1 VIN7 VIN2 VIN7 VIN3 VIN7 VIN4 VIN7 VIN5 VIN7 VIN6 VIN7 Not Allowed Table 11. Sequence Selection SEQ 0 SHDW 0 0 1 1 0 1 1 Sequence Type This configuration is selected when the sequence function is not used. The analog input channel selected on each individual conversion is determined by the contents of the channel address bits, ADD2 to ADD0, in each prior write operation. This mode of operation reflects the traditional operation of a multichannel ADC, without the sequencer function being used, where each write to the AD7938/AD7939 selects the next channel for conversion. This configuration selects the shadow register for programming. The following write operation loads the data on DB0 to DB7 to the shadow register. This programs the sequence of channels to be converted continuously after each CONVST falling edge. See the Shadow Register section and Table 12. If the SEQ and SHADOW bits are set in this way, the sequence function is not interrupted upon completion of the write operation. This allows other bits in the control register to be altered between conversions while in a sequence without terminating the cycle. This configuration is used in conjunction with the channel address bits (ADD2 to ADD0) to program continuous conversions on a consecutive sequence of channels from Channel 0 through to a selected final channel as determined by the channel address bits in the control register. Rev. F | Page 17 of 37 AD7938/AD7939 Data Sheet SHADOW REGISTER When operating in fully differential mode or Pseudo Mode 1, the associated pair of channel bits must be set for each pair of analog inputs required in the sequence. With each consecutive CONVST pulse after the sequencer has been set up, the AD7938/AD7939 progress through the selected channels in ascending order, beginning with the lowest channel. This continues until a write operation occurs with the SEQ and SHDW bits configured in any way except 1, 0 (see Table 11). When a sequence is set up in fully differential mode or Pseudo Mode 1, the ADC does not convert on the inverse pairs (that is, VIN1, VIN0). The bit functions of the shadow register are outlined in Table 12. See the Analog Input Selection section for further information on using the sequencer. The shadow register on the AD7938/AD7939 is an 8-bit, writeonly register. Data is loaded from DB0 to DB7 on the rising edge of WR. The eight LSBs load into the shadow register. The information is written into the shadow register provided that the SEQ and SHDW bits in the control register were set to 0 and 1, respectively, in the previous write to the control register. Each bit represents an analog input from Channel 0 through Channel 7. A sequence of channels can be selected through which the AD7938/AD7939 cycles with each consecutive conversion after the write to the shadow register. To select a sequence of channels to be converted, if operating in singleended mode or Pseudo Mode 2, the associated channel bit in the shadow register must be set for each required analog input. Table 12. Shadow Register Bit Functions MSB DB7 VIN7 DB6 VIN6 DB5 VIN5 DB4 VIN4 DB3 VIN3 Rev. F | Page 18 of 37 DB2 VIN2 DB1 VIN1 LSB DB0 VIN0 AD7938/AD7939 Data Sheet CIRCUIT INFORMATION The AD7938/AD7939 have eight analog input channels that can be configured to be eight single-ended inputs, four fully differential pairs, four pseudo differential pairs, or seven pseudo differential inputs with respect to one common input. There is an on-chip user-programmable channel sequencer that allows the user to select a sequence of channels through which the ADC can progress and cycle with each consecutive falling edge of CONVST. The analog input range for the AD7938/AD7939 is 0 V to VREF or 0 V to 2 × VREF, depending on the status of the RANGE bit in the control register. The output coding of the ADC can be either binary or twos complement, depending on the status of the CODING bit in the control register. The AD7938/AD7939 provide flexible power management options to allow the user to achieve the best power performance for a given throughput rate. These options are selected by programming the power management bits, PM1 and PM0, in the control register. CONVERTER OPERATION The AD7938/AD7939 are successive approximation ADCs based around two capacitive digital-to-analog converters (DACs). Figure 15 and Figure 16 show simplified schematics of the ADC in acquisition and conversion phase, respectively. The ADC comprises control logic, an SAR, and two capacitive DACs. Both figures show the operation of the ADC in differential/pseudo differential mode. Single-ended mode operation is similar but VIN− is internally tied to AGND. In acquisition phase, SW3 is closed, SW1 and SW2 are in Position A, the comparator is held in a balanced condition, and the sampling capacitor arrays acquire the differential signal on the input. CAPACITIVE DAC VIN+ VIN– VIN– A B SW2 VREF CS SW2 CAPACITIVE DAC CAPACITIVE DAC 111...111 111...110 111...000 011...111 1 LSB = VREF /4096 (AD7938) 1 LSB = VREF /1024 (AD7939) 000...010 000...001 000...000 CONTROL LOGIC COMPARATOR COMPARATOR The output coding for the AD7938/AD7939 is either straight binary or twos complement, depending on the status of the CODING bit in the control register. The designed code transitions occur at successive LSB values (1 LSB, 2 LSBs, and so on) and the LSB size is VREF/4,096 for the AD7938 and VREF/1,024 for the AD7939. The ideal transfer characteristics of the AD7938/AD7939 for both straight binary and twos complement output coding are shown in Figure 17 and Figure 18, respectively. 0V SW3 CS CONTROL LOGIC SW3 1 LSB +VREF – 1 LSB ANALOG INPUT NOTES 1. VREF IS EITHER VREF OR 2 × VREF . Figure 15. ADC Acquisition Phase Rev. F | Page 19 of 37 Figure 17. AD7938/AD7939 Ideal Transfer Characteristic with Straight Binary Output Coding 03715-025 SW1 A B ADC TRANSFER FUNCTION CS A SW1 Figure 16. ADC Conversion Phase 03715-023 VIN+ A VREF CAPACITIVE DAC B CS B 03715-024 The AD7938/AD7939 provide the user with an on-chip trackand-hold, an accurate internal reference, an analog-to-digital converter, and a parallel interface housed in a 32-lead LFCSP or TQFP package. When the ADC starts a conversion (Figure 16), SW3 opens and SW1 and SW2 move to Position B, causing the comparator to become unbalanced. Both inputs are disconnected once the conversion begins. The control logic and the charge redistribution DACs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the output code of the ADC. The output impedances of the sources driving the VIN+ and the VIN− pins must match; otherwise, the two inputs have different settling times, resulting in errors. ADC CODE The AD7938/AD7939 are fast, 8-channel, 12-bit and 10-bit, single-supply, successive approximation analog-to-digital converters. The parts can operate from a 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS. AD7938/AD7939 Data Sheet ANALOG INPUT STRUCTURE 1 LSB = 2 × VREF /4096 (AD7938) 1 LSB = 2 × VREF /1024 (AD7939) ADC CODE 011...110 000...001 000...000 111...111 100...010 –VREF + 1 LSB VREF +VREF – 1 LSB 03715-026 100...001 100...000 Figure 18. AD7938/AD7939 Ideal Transfer Characteristic with Twos Complement Output Coding and 2 × VREF Range TYPICAL CONNECTION DIAGRAM Figure 19 shows a typical connection diagram for the AD7938/AD7939. The AGND and DGND pins are connected together at the device for good noise suppression. The VREFIN/VREFOUT pin is decoupled to AGND with a 0.47 µF capacitor to avoid noise pickup if the internal reference is used. Alternatively, VREFIN/VREFOUT can be connected to an external reference source. In this case, the reference pin should be decoupled with a 0.1 µF capacitor. In both cases, the analog input range can either be 0 V to VREF (RANGE bit = 0) or 0 V to 2 × VREF (RANGE bit = 1). The analog input configuration can be either eight single-ended inputs, four differential pairs, four pseudo differential pairs, or seven pseudo differential inputs (see Table 10). The VDD pin is connected to either a 3 V or 5 V supply. The voltage applied to the VDRIVE input controls the voltage of the digital interface. Here, it is connected to the same 3 V supply of the microprocessor to allow a 3 V logic interface (see the Digital Inputs section). 0.1µF + 10µF + Figure 20 shows the equivalent circuit of the analog input structure of the AD7938/AD7939 in differential/pseudo differential mode. In single-ended mode, VIN− is internally tied to AGND. The four diodes provide ESD protection for the analog inputs. Care must be taken to ensure that the analog input signals never exceed the supply rails by more than 300 mV. Doing so causes these diodes to become forwardbiased and start conducting into the substrate. These diodes can conduct up to 10 mA without causing irreversible damage to the part. The C1 capacitors in Figure 20 are typically 4 pF and can primarily be attributed to pin capacitance. The resistors are lumped components made up of the on resistance of the switches. The value of these resistors is typically about 100 Ω. The C2 capacitors are the sampling capacitors of the ADC and typically have a capacitance of 45 pF. For ac applications, removing high frequency components from the analog input signal is recommended by the use of an RC low-pass filter on the relevant analog input pins. In applications where harmonic distortion and signal-to-noise ratio are critical, the analog input should be driven from a low impedance source. Large source impedances significantly affect the ac performance of the ADC. This may necessitate the use of an input buffer amplifier. The choice of the op amp is a function of the particular application. VDD D VIN+ C1 3V/5V SUPPLY C1 MICROCONTROLLER/ MICROPROCESSOR CLKIN CS RD WR VIN7 BUSY CONVST DB0 AGND DGND 0.1µF + + 0.1µF EXTERNAL VREF 0.47µF INTERNAL VREF + 10µF 3V SUPPLY 03715-027 VDRIVE C2 D Figure 20. Equivalent Analog Input Circuit, Conversion Phase: Switches Open, Track Phase: Switches Closed DB11/DB9 VREFIN/VREFOUT 2.5V VREF VIN– W/B 0 TO VREF / 0 TO 2 × VREF R1 VDD AD7938/AD7939 VIN0 C2 D D VDD R1 03715-028 011...111 When no amplifier is used to drive the analog input, the source impedance should be limited to low values. The maximum source impedance depends on the amount of THD that can be tolerated. The THD increases as the source impedance increases and performance degrades. Figure 21 and Figure 22 show a graph of the THD vs. source impedance with a 50 kHz input tone for both VDD = 5 V and 3 V in single-ended mode and fully differential mode, respectively. Figure 19. Typical Connection Diagram Rev. F | Page 20 of 37 Data Sheet ANALOG INPUTS FIN = 50kHz –45 The AD7938/AD7939 have software-selectable analog input configurations. The user can choose eight single-ended inputs, four fully differential pairs, four pseudo differential pairs, or seven pseudo differential inputs. The analog input configuration is chosen by setting the MODE0/MODE1 bits in the internal control register (see Table 10). –50 VDD = 3V THD (dB) –55 –60 –65 –70 –75 Single-Ended Mode VDD = 5V The AD7938/AD7939 can have eight single-ended analog input channels by setting the MODE0 and MODE1 bits in the control register to 0. In applications where the signal source has a high impedance, it is recommended to buffer the analog input before applying it to the ADC. An op amp suitable for this function is the AD8021. The analog input range of the AD7938/AD7939 can be programmed to be either 0 V to VREF or 0 V to 2 × VREF. 03715-018 –80 –85 –90 10 100 RSOURCE (Ω) 1k Figure 21. THD vs. Source Impedance in Single-Ended Mode –60 If the analog input signal to be sampled is bipolar, the internal reference of the ADC can be used to externally bias up this signal to make it the correct format for the ADC. FIN = 50kHz –65 –70 Figure 24 shows a typical connection diagram when operating the ADC in single-ended mode. This diagram shows a bipolar signal of amplitude ±1.25 V being preconditioned before it is applied to the AD7938/AD7939. In cases where the analog input amplitude is ±2.5 V, the 3R resistor can be replaced with a resistor of value R. The resultant voltage on the analog input of the AD7938/AD7939 is a signal ranging from 0 V to 5 V. In this case, the 2 × VREF mode can be used. THD (dB) –75 –80 –85 VDD = 3V –90 VDD = 5V 03715-019 –95 –100 10 100 RSOURCE (Ω) 1k R Figure 22. THD vs. Source Impedance in Fully Differential Mode Figure 23 shows a graph of the THD vs. the analog input frequency for various supplies while sampling at 1.5 MHz with an SCLK of 25.5 MHz. In this case, the source impedance is 10 Ω. +1.25V 0V –1.25V VIN 0V R 3R AD7938/ AD7939* VIN7 VREFOUT R 0.47µF VDD = 3V SINGLE-ENDED MODE –60 *ADDITIONAL PINS OMITTED FOR CLARITY. VDD = 5V SINGLE-ENDED MODE –70 THD (dB) VIN0 R –50 Figure 24. Single-Ended Mode Connection Diagram –80 Differential Mode VDD = 5V/3V DIFFERENTIAL MODE –90 The AD7938/AD7939 can have four differential analog input pairs by setting the MODE0 and MODE1 bits in the control register to 0 and 1, respectively. –110 03715-020 –100 –120 +2.5V FSAMPLE = 1.5MSPS RANGE = 0 TO VREF 0 100 300 500 200 400 INPUT FREQUENCY (kHz) 600 700 Figure 23. THD vs. Analog Input Frequency for Various Supply Voltages Differential signals have some benefits over single-ended signals, including noise immunity based on the device’s common-mode rejection and improvements in distortion performance. Figure 25 defines the fully differential analog input of the AD7938/AD7939. Rev. F | Page 21 of 37 03715-031 –40 AD7938/AD7939 AD7938/AD7939 Data Sheet 4.5 VIN– AD7938/ AD7939* *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 25. Differential Input Definition The amplitude of the differential signal is the difference between the signals applied to the VIN+ and VIN− pins in each differential pair (that is, VIN+ − VIN−). VIN+ and VIN− should be simultaneously driven by two signals each of amplitude VREF (or 2 × VREF depending on the range chosen) that are 180° out of phase. The amplitude of the differential signal is therefore −VREF to +VREF peak-to-peak (that is, 2 × VREF). This is regardless of the common mode (CM). The common mode is the average of the two signals (that is, (VIN+ + VIN−)/2) and is therefore the voltage on which the two inputs are centered. This results in the span of each input being CM ± VREF/2. This voltage has to be set up externally and its range varies with the reference value VREF. As the value of VREF increases, the common-mode range decreases. When driving the inputs with an amplifier, the actual common-mode range is determined by the amplifier’s output voltage swing. Figure 26 and Figure 27 show how the common-mode range typically varies with VREF for a 5 V power supply using the 0 V to VREF range or 2 × VREF range, respectively. The common mode must be in this range to guarantee the functionality of the AD7938/AD7939. When a conversion takes place, the common mode is rejected, resulting in a virtually noise-free signal of amplitude −VREF to +VREF, corresponding to the digital codes of 0 to 4096 for the AD7938 and 0 to 1024 for the AD7939. If the 2 × VREF range is used, the input signal amplitude extends from −2 VREF to +2 VREF after conversion. 3.5 TA = 25°C COMMON-MODE RANGE (V) 3.0 2.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 0.6 1.1 VREF (V) 1.6 2.1 2.6 Figure 27. Input Common-Mode Range vs. VREF (2 × VREF Range, VDD = 5 V) Driving Differential Inputs Differential operation requires that VIN+ and VIN− be simultaneously driven with two equal signals that are 180° out of phase. The common mode must be set up externally and has a range that is determined by VREF, the power supply, and the particular amplifier used to drive the analog inputs. Differential modes of operation with either an ac or dc input provide the best THD performance over a wide frequency range. Since not all applications have a signal preconditioned for differential operation, there is often a need to perform single-ended-todifferential conversion. Using an Op Amp Pair An op amp pair can be used to directly couple a differential signal to one of the analog input pairs of the AD7938/AD7939. The circuit configurations shown in Figure 28 and Figure 29 show how a dual op amp can be used to convert a single-ended signal into a differential signal for both a bipolar and unipolar input signal, respectively. The voltage applied to Point A sets up the common-mode voltage. In both diagrams, it is connected in some way to the reference, but any value in the common-mode range can be input here to set up the common mode. A suitable dual op amp that can be used in this configuration to provide differential drive to the AD7938/AD7939 is the AD8022. Take care when choosing the op amp; the selection depends on the required power supply and system performance objectives. The driver circuits in Figure 28 and Figure 29 are optimized for dc coupling applications requiring best distortion performance. 2.0 1.5 1.0 The differential op amp driver circuit in Figure 28 is configured to convert and level shift a single-ended, ground-referenced (bipolar) signal to a differential signal centered at the VREF level of the ADC. 03715-033 0.5 0 TA = 25°C 03715-034 VREF p-p 4.0 COMMON-MODE RANGE (V) VIN+ 03715-032 COMMON-MODE VOLTAGE VREF p-p 0 0.5 1.0 1.5 VREF (V) 2.0 2.5 3.0 Figure 26. Input Common-Mode Range vs. VREF (0 V to VREF Range, VDD = 5 V) The circuit configuration shown in Figure 29 converts a unipolar, single-ended signal into a differential signal. Rev. F | Page 22 of 37 Data Sheet AD7938/AD7939 220Ω The benefit of pseudo differential inputs is that they separate the analog input signal ground from the ADC ground, allowing dc common-mode voltages to be cancelled. Typically, this range can extend from −0.3 V to +0.7 V when VDD = 3 V or −0.3 V to +1.8 V when VDD = 5 V. Figure 30 shows a connection diagram for pseudo differential mode. 2 × VREF p-p 27Ω V– 220Ω 3.75V 2.5V 1.25V 220Ω AD7938/ AD7939 220Ω V+ A 20kΩ VIN+ V– 27Ω 3.75V 2.5V 1.25V VIN– VREF VIN+ AD7938/ AD7939* 0.47µF + 10kΩ VREF p-p VIN– DC INPUT VOLTAGE Figure 28. Dual Op Amp Circuit to Convert a Single-Ended Bipolar Signal into a Differential Unipolar Signal VREF + 0.47µF 03715-037 GND V+ 03715-035 440Ω *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 30. Pseudo Differential Mode Connection Diagram 220Ω V+ GND 27Ω V– 3.75V 2.5V 1.25V 220Ω V+ 20kΩ V– + 10kΩ As shown in Table 10, users can set up their analog input configuration by setting the values in the MODE0 and MODE1 bits in the control register. Assuming the configuration has been chosen, there are different ways of selecting the analog input to be converted depending on the state of the SEQ and SHDW bits in the control register. VIN+ AD7938/ AD7939 220Ω A ANALOG INPUT SELECTION 27Ω 3.75V 2.5V 1.25V VIN– VREF Traditional Multichannel Operation (SEQ = SHDW = 0) 0.47µF Figure 29. Dual Op Amp Circuit to Convert a Single-Ended Unipolar Signal into a Differential Signal Another method of driving the AD7938/AD7939 is to use the AD8138 differential amplifier. The AD8138 can be used as a single-ended-to-differential amplifier or as a differential-todifferential amplifier. The device is as easy to use as an op amp and greatly simplifies differential signal amplification and driving. Any one of eight analog input channels or four pairs of channels can be selected for conversion in any order by setting the SEQ and SHDW bits in the control register to 0. The channel to be converted is selected by writing to the address bits, ADD2 to ADD0, in the control register to program the multiplexer prior to the conversion. This mode of operation is that of a traditional multichannel ADC where each data write selects the next channel for conversion. Figure 31 shows a flowchart of this mode of operation. The channel configurations are shown in Table 10. POWER ON Pseudo Differential Mode The AD7938/AD7939 can have four pseudo differential pairs (Pseudo Mode 1) or seven pseudo differential inputs (Pseudo Mode 2) by setting the MODE0 and MODE1 bits in the control register to 1, 0 and 1, 1, respectively. In the case of the four pseudo differential pairs, VIN+ is connected to the signal source, which must have an amplitude of VREF (or 2 × VREF depending on the range chosen) to make use of the full dynamic range of the part. A dc input is applied to the VIN− pin. The voltage applied to this input provides an offset from ground or a pseudo ground for the VIN+ input. In the case of the seven pseudo differential inputs, the seven analog input signals inputs are referred to a dc voltage applied to VIN7. Rev. F | Page 23 of 37 WRITE TO THE CONTROL REGISTER TO SET UP OPERATING MODE, ANALOG INPUT AND OUTPUT CONFIGURATION. SET SEQ = SHDW = 0. SELECT THE DESIRED CHANNEL TO CONVERT (ADD2 TO ADD0). ISSUE CONVST PULSE TO INITIATE A CONVERSION ON THE SELECTED CHANNEL. INITIATE A READ CYCLE TO READ THE DATA FROM THE SELECTED CHANNEL. INITIATE A WRITE CYCLE TO SELECT THE NEXT CHANNEL TO BE CONVERTED BY CHANGING THE VALUES OF BITS ADD2 TO ADD0 IN THE CONTROL REGISTER. SEQ = SHDW = 0. 03715-038 440Ω 03715-036 VREF VREF p-p Figure 31. Traditional Multichannel Operation Flow Chart AD7938/AD7939 Data Sheet Using the Sequencer: Programmable Sequence (SEQ = 0, SHDW = 1) Consecutive Sequence (SEQ = 1, SHDW = 1) The AD7938/AD7939 can be configured to automatically cycle through a number of selected channels using the on-chip programmable sequencer by setting SEQ = 0 and SHDW = 1 in the control register. The analog input channels to be converted are selected by setting the relevant bits in the shadow register to 1 (see Table 12). Once the shadow register has been programmed with the required sequence, the next conversion executed is on the lowest channel programmed in the SHDW register. The next conversion executed is on the next highest channel in the sequence and so on. When the last channel in the sequence is converted, the internal multiplexer returns to the first channel selected in the shadow register and commences the sequence again. A sequence of consecutive channels can be converted beginning with Channel 0 and ending with a final channel selected by writing to the ADD2 to ADD0 bits in the control register. This is done by setting the SEQ and SHDW bits in the control register to 1. In this mode, the sequencer can be used without having to write to the shadow register. To set this mode up, the next conversion, once the control register is written to, is on Channel 0, then Channel 1, and so on, until the channel selected by the address bits (ADD2 to ADD0) is reached. The cycle begins again provided the WR input is tied high. If low, the SEQ and SHDW bits must be set to 1, 0 to allow the ADC to continue its preprogrammed sequence uninterrupted. Figure 33 shows the flowchart of the consecutive sequence mode. POWER ON WRITE TO THE CONTROL REGISTER TO SET UP OPERATING MODE, ANALOG INPUT AND OUTPUT CONFIGURATION SELECT FINAL CHANNEL (ADD2 TO ADD0) IN CONSECUTIVE SEQUENCE. SET SEQ = 1 SHDW = 1. It is not necessary to write to the control register again once a sequencer operation has been initiated. The WR input must be kept high to ensure that the control register is not accidentally overwritten or that a sequence operation is not interrupted. If the control register is written to at any time during the sequence, ensure that the SEQ and SHDW bits are set to 1, 0 to avoid interrupting the conversion sequence. The sequence program remains in force until such time as the AD7938/AD7939 is written to and the SEQ and SHDW bits are configured with any bit combination except 1, 0. Figure 32 shows a flow chart of the programmable sequence operation. CONTINUOUSLY CONVERT A CONSECUTIVE SEQUENCE OF CHANNELS FROM CHANNEL 0 UP TO AND INCLUDING THE PREVIOUSLY SELECTED FINAL CHANNEL ON ADD2 TO ADD0 WITH EACH CONVST PULSE. SEQ BIT = 1 SHDW BIT = 0 POWER ON WRITE TO THE CONTROL REGISTER TO SET UP OPERATING MODE, ANALOG INPUT AND OUTPUT CONFIGURATION SET SEQ = 0 SHDW = 1. Figure 33. Consecutive Sequence Mode Flow Chart REFERENCE INITIATE A WRITE CYCLE. THIS WRITE CYCLE IS TO PROGRAM THE SHADOW REGISTER. SET RELEVANT BITS TO SELECT THE CHANNELS TO BE INCLUDED IN THE SEQUENCE. CONTINUOUSLY CONVERT CONSECUTIVE CHANNELS SELECTED WITH EACH CONVST PULSE BUT ALLOWS THE RANGE, CODING, ANALOG INPUT TYPE, ETC BITS IN THE CONTROL REGISTER TO BE CHANGED WITHOUT INTERRUPTING THE SEQUENCE. Figure 32. Programmable Sequence Flow Chart The AD7938/AD7939 can operate with either the on-chip reference or external reference. The internal reference is selected by setting the REF bit in the internal control register to 1. A block diagram of the internal reference circuitry is shown in Figure 34. The internal reference circuitry includes an on-chip 2.5 V band gap reference and a reference buffer. When using the internal reference, the VREFIN/VREFOUT pin should be decoupled to AGND with a 0.47 µF capacitor. This internal reference not only provides the reference for the analog-todigital conversion, but it can also be used externally in the system. It is recommended that the reference output is buffered using an external precision op amp before applying it anywhere in the system. BUFFER REFERENCE VREFIN/ VREFOUT ADC AD7938/ AD7939 03715-041 CONTINUOUSLY CONVERT CONSECUTIVE CHANNELS SELECTED IN THE SHADOW REGISTER WITH EACH CONVST PULSE. SEQ BIT = 1 SHDW BIT = 0 04751-039 WR = HIGH SEQ BIT = 0 SHDW BIT = 1 03715-040 CONTINUOUSLY CONVERT CONSECUTIVE CHANNELS SELECTED WITH EACH CONVST PULSE BUT ALLOWS THE RANGE, CODING, ANALOG INPUT TYPE, ETC. BITS IN THE CONTROL REGISTER TO BE CHANGED WITHOUT INTERRUPTING THE SEQUENCE. Figure 34. Internal Reference Circuit Block Diagram Rev. F | Page 24 of 37 Data Sheet AD7938/AD7939 Alternatively, an external reference can be applied to the VREFIN/ VREFOUT pin of the AD7938/AD7939. An external reference input is selected by setting the REF bit in the internal control register to 0. The external reference input range is 0.1 V to VDD. It is important to ensure that, when choosing the reference value, the maximum analog input range (VIN MAX) is never greater than VDD + 0.3 V, to comply with the maximum ratings of the device. For example, if operating in differential mode and the reference is sourced from VDD, the 0 V to 2 × VREF range cannot be used. This is because the analog input signal range now extends to 2 × VDD, which exceeds the maximum rating conditions. In the pseudo differential modes, the user must ensure that VREF + (VIN−) ≤ VDD when using the 0 V to VREF range, or when using the 2 × VREF range that 2 × VREF + (VIN−) ≤ VDD. In all cases, the specified reference is 2.5 V. The performance of the part with different reference values is shown in Figure 10 to Figure 12. The value of the reference sets the analog input span and the common-mode voltage range. Errors in the reference source result in gain errors in the AD7938/AD7939 transfer function and add to specified fullscale errors on the part. Table 13 lists examples of suitable voltage references available from Analog Devices that can be used. Figure 35 shows a typical connection diagram for an external reference. Digital Inputs The digital inputs applied to the AD7938/AD7939 are not limited by the maximum ratings that limit the analog inputs. Instead, the digital inputs applied can go to 7 V and are not restricted by the VDD + 0.3 V limit as on the analog inputs. Another advantage of the digital inputs not being restricted by the VDD + 0.3 V limit is the fact that power supply sequencing issues are avoided. If any of these inputs are applied before VDD, there is no risk of latch-up as there would be on the analog inputs if a signal greater than 0.3 V was applied prior to VDD. VDRIVE Input The AD7938/AD7939 have a VDRIVE feature. VDRIVE controls the voltage at which the parallel interface operates. VDRIVE allows the ADC to easily interface to 3 V and 5 V processors. For example, if the AD7938/AD7939 are operated with an VDD of 5 V and the VDRIVE pin is powered from a 3 V supply, the AD7938/AD7939 have better dynamic performance with an VDD of 5 V while still being able to interface directly to 3 V processors. Care should be taken to ensure VDRIVE does not exceed VDD by more than 0.3 V (see the Absolute Maximum Ratings section). Table 13. Examples of Suitable Voltage References Output Voltage (V) 2.5/3 2.5 2.048 Initial Accuracy (% Max) 0.04 0.04 0.05 Operating Current (µA) 1000 500 500 AD7938/ AD7939* AD780 NC VDD 0.1µF 10nF 0.1µF 1 O/P SELECT 8 2 +VIN 3 TEMP VOUT 6 4 GND TRIM 5 7 NC VREF NC 2.5V NC NC = NO CONNECT *ADDITIONAL PINS OMITTED FOR CLARITY. 0.1µF 03715-029 Reference AD780 ADR421 ADR420 Figure 35. Typical VREF Connection Diagram Rev. F | Page 25 of 37 AD7938/AD7939 Data Sheet PARALLEL INTERFACE At the end of the conversion, BUSY goes low and can be used to activate an interrupt service routine. The CS and RD lines are then activated in parallel to read the 12- or 10-bits of conversion data. When power supplies are first applied to the device, a rising edge on CONVST is necessary to put the trackand-hold into track. The acquisition time of 125 ns minimum must be allowed before CONVST is brought low to initiate a conversion. The ADC then goes into hold on the falling edge of CONVST and back into track on the 13th rising edge of CLKIN after this (see Figure 36). When operating the device in autoshutdown or autostandby mode, where the ADC powers down at the end of each conversion, a rising edge on the CONVST signal is used to power up the device. The AD7938/AD7939 have a flexible, high speed, parallel interface. This interface is 12-bits (AD7938) or 10-bits (AD7939) wide and is capable of operating in either word (W/B tied high) or byte (W/B tied low) mode. The CONVST signal is used to initiate conversions; when operating in autoshutdown or autostandby mode, it is used to initiate power-up. A falling edge on the CONVST signal is used to initiate conversions and it puts the ADC track-and-hold into track. Once the CONVST signal goes low, the BUSY signal goes high for the duration of the conversion. In between conversions, CONVST must be brought high for a minimum time of t1. This must happen after the 14th falling edge of CLKIN; otherwise, the conversion is aborted and the track-and-hold goes back into track. B A t1 CONVST 1 CLKIN BUSY 2 3 4 tCONVERT 5 12 13 14 t2 t20 t3 t9 INTERNAL TRACK/HOLD tACQUISITION CS t10 RD t12 t13 DB0 TO DB11 t14 DATA THREE-STATE t11 THREE-STATE tQUIET DB0 TO DB11 OLD DATA DATA Figure 36. AD7938/AD7939 Parallel Interface—Conversion and Read Cycle Timing in Word Mode (W/B = 1) Rev. F | Page 26 of 37 03715-004 WITH CS AND RD TIED LOW Data Sheet AD7938/AD7939 Reading Data from the AD7938/AD7939 The CS and RD signals are gated internally and the level is triggered active low. In either word mode or byte mode, CS and RD can be tied together because the timing specifications for t10 and t11 are 0 ns minimum. This means the bus is constantly driven by the AD7938/AD7939. With the W/B pin tied logic high, the AD7938/AD7939 interface operates in word mode. In this case, a single read operation from the device accesses the conversion data-word on Pins DB0/DB2 to Pin DB11. The DB8/HBEN pin assumes its DB8 function. With the W/B pin tied to logic low, the AD7938/AD7939 interface operates in byte mode. In this case, the DB8/HBEN pin assumes its HBEN function. Conversion data from the AD7938/AD7939 must be accessed in two read operations with eight bits of data provided on DB0 to DB7 for each of the read operations. The HBEN pin determines whether the read operation accesses the high byte or the low byte of the 12-bit or 10-bit word. For a low byte read, DB0 to DB7 provide the eight LSBs of the 12-bit word. For 10-bit operation, the two LSBs of the low byte are 0s, followed by six bits of conversion data. For a high byte read, DB0 to DB3 provide the four MSBs of the 12-bit or10-bit word. DB5 to DB7 of the high byte provide the channel ID. Figure 36 shows the read cycle timing diagram for a 12-bit or 10-bit transfer. When operating in word mode, the HBEN input does not exist, and only the first read operation is required to access data from the device. When operating in byte mode, the two read cycles shown in Figure 37 are required to access the full data-word from the device. The data is placed onto the data bus a time t13 after both CS and RD go low. The RD rising edge can be used to latch data out of the device. After a time, t14, the data lines become three-stated. Alternatively, CS and RD can be tied permanently low and the conversion data is valid and placed onto the data bus a time, t9, before the falling edge of BUSY. Note that if RD is pulsed during the conversion time, this causes a degradation in linearity performance of approximately 0.25 LSB. Reading during conversion by way of tying CS and RD low does not cause any degradation. HBEN/DB8 t15 t16 t15 t16 CS t11 RD t13 DB0 TO DB7 t17 t12 t14 LOW BYTE HIGH BYTE 03715-005 t10 Figure 37. AD7938/AD7939 Parallel Interface—Read Cycle Timing for Byte Mode Operation (W/B = 0) Rev. F | Page 27 of 37 AD7938/AD7939 Data Sheet Writing Data to the AD7938/AD7939 Figure 38 shows the write cycle timing diagram of the AD7938/AD7939 in word mode. When operating in word mode, the HBEN input does not exist and only one write operation is required to write the word of data to the device. Data should be provided on DB0 to DB11. When operating in byte mode, the two write cycles shown in Figure 39 are required to write the full data-word to the AD7938/AD7939. In Figure 39, the first write transfers the lower eight bits of the data-word from DB0 to DB7, and the second write transfers the upper four bits of the data-word. When writing to the AD7938/AD7939, the top four bits in the high byte must be 0s. With W/B tied logic high, a single write operation transfers the full data-word on DB0 to DB11 to the control register on the AD7938/AD7939. The DB8/HBEN pin assumes its DB8 function. Data written to the AD7938/AD7939 should be provided on the DB0 to DB11 inputs, with DB0 being the LSB of the data-word. With W/B tied logic low, the AD7938/AD7939 requires two write operations to transfer a full 12-bit word. DB8/HBEN assumes its HBEN function. Data written to the AD7938/AD7939 should be provided on the DB0 to DB7 inputs. HBEN determines whether the byte written is high byte or low byte data. The low byte of the data-word should be written first with DB0 being the LSB of the full dataword. For the high byte write, HBEN should be high and the data on the DB0 input should be data Bit 8 of the 12-bit word. In both word and byte mode, a single write operation to the shadow register is always sufficient since it is only eight bits wide. The data is latched into the device on the rising edge of WR. The data needs to be setup a time, t7, before the WR rising edge and held for a time, t8, after the WR rising edge. The CS and WR signals are gated internally. CS and WR can be tied together as the timing specifications for t4 and t5 are 0 ns minimum (assuming CS and RD have not already been tied together). CS t5 t6 t8 t7 DB0 TO DB11 03715-002 t4 WR DATA Figure 38. AD7938/AD7939 Parallel Interface—Write Cycle Timing for Word Mode Operation (W/B = 1) HBEN/DB8 t18 t19 t18 t19 CS t5 WR t7 DB0 TO DB11 t17 t6 t8 LOW BYTE HIGH BYTE 03715-003 t4 Figure 39. AD7938/AD7939 Parallel Interface—Write Cycle Timing for Byte Mode Operation (W/B = 0) Rev. F | Page 28 of 37 Data Sheet AD7938/AD7939 POWER MODES OF OPERATION Autostandby (PM1 = 1; PM0 = 0) The AD7938/AD7939 have four different power modes of operation. These modes are designed to provide flexible power management options. Different options can be chosen to optimize the power dissipation/throughput rate ratio for differing applications. The mode of operation is selected by the power management bits, PM1 and PM0, in the control register, as detailed in Table 9. When power is first applied to the AD7938/AD7939, an on-chip, power-on reset circuit ensures that the default power-up condition is normal mode. In this mode of operation, the AD7938/AD7939 automatically enter standby mode at the end of each conversion, which is shown as Point A in Figure 36. When this mode is entered, all circuitry on the AD7938/AD7939 is powered down except for the reference and reference buffer. The track-and-hold goes into hold at this point also and remains in hold as long as the device is in standby. The parts remain in standby until the next rising edge of CONVST powers up the device. The power-up time required depends on whether the internal or external reference is used. With an external reference, the power-up time required is a minimum of 600 ns, while when using the internal reference, the power-up time required is a minimum of 7 µs. The user should ensure this power-up time has elapsed before initiating another conversion as shown in Figure 40. This rising edge of CONVST also places the track-and-hold back into track mode. Note that, after power-on, the track-and-hold is in hold mode and the first rising edge of CONVST places the track-and-hold into track mode. Normal Mode (PM1 = PM0 = 0) This mode is intended for the fastest throughput rate performance because the user does not have to worry about any power-up times associated with the AD7938/AD7939. It remains fully powered up at all times. At power-on reset, this mode is the default setting in the control register. Autoshutdown (PM1 = 0; PM0 = 1) In this mode of operation, the AD7938/AD7939 automatically enter full shutdown at the end of each conversion, which is shown at Point A in Figure 36 and Figure 40. In shutdown mode, all internal circuitry on the device is powered down. The parts retain information in the control register during shutdown. The track-and-hold also goes into hold at this point and remains in hold as long as the device is in shutdown. The AD7938/AD7939 remains in shutdown mode until the next rising edge of CONVST (see Point B in Figure 36 or Figure 40). In order to keep the device in shutdown for as long as possible, CONVST should idle low between conversions, as shown in Figure 40. On this rising edge, the part begins to power-up and the track-and-hold returns to track mode. The power-up time required is 10 ms minimum regardless of whether the user is operating with the internal or external reference. The user should ensure that the power-up time has elapsed before initiating a conversion. Full Shutdown Mode (PM1 =1; PM0 = 1) When this mode is programmed, all circuitry on the AD7938/AD7939 is powered down upon completion of the write operation, that is, on the rising edge of WR. The trackand-hold enters hold mode at this point. The parts retain the information in the control register while the part is in shutdown. The AD7938/AD7939 remain in full shutdown mode, with the track-and-hold in hold mode, until the power management bits (PM1 and PM0) in the control register are changed. If a write to the control register occurs while the part is in full shutdown mode, and the power management bits are changed to PM0 = PM1 = 0 (normal mode), the part begins to power up on the WR rising edge and the track-and-hold returns to track. To ensure the part is fully powered up before a conversion is initiated, the power-up time of 10 ms minimum should be allowed before the next CONVST falling edge; otherwise, invalid data is read. Note that all power-up times quoted apply with a 470 nF capacitor on the VREFIN pin. B A tPOWER-UP CONVST 1 14 1 14 03715-049 CLKIN BUSY Figure 40. Autoshutdown/Autostandby Mode Rev. F | Page 29 of 37 AD7938/AD7939 Data Sheet 10 POWER vs. THROUGHPUT RATE Figure 42 shows a plot of the power vs. throughput rate when operating in normal mode for both VDD = 5 V and VDD = 3 V. In both plots, the figures apply when using the internal reference. If an external reference is used, the power-up time reduces to 600 ns; therefore, the AD7938/AD7939 remain in standby for a greater time in every cycle. Additionally, the current consumption, when converting, should be lower than the specified maximum of 2.7 mA with VDD = 5 V, or 2.0 mA with VDD = 3 V. 1.8 TA = 25°C 1.6 VDD = 5V 7 6 5 4 VDD = 3V 3 2 0 03715-043 1 200 0 400 800 600 1000 THROUGHPUT (kSPS) VDD = 5V 1400 1600 Figure 42. Power vs. Throughput in Normal Mode Using Internal Reference MICROPROCESSOR INTERFACING AD7938/AD7939 to ADSP-21xx Interface Figure 43 shows the AD7938/AD7939 interfaced to the ADSP21xx series of DSPs as a memory-mapped device. A single wait state may be necessary to interface the AD7938/AD7939 to the ADSP-21xx depending on the clock speed of the DSP. The wait state can be programmed via the data memory wait state control register of the ADSP-21xx (see the ADSP-21xx family User’s Manual for details). The following instruction reads from the AD7938/AD7939: where ADC is the address of the AD7938/AD7939. 1.2 DSP/USER SYSTEM 1.0 0.8 A0 TO A15 ADSP-21xx* DMS 0.4 0 20 40 60 80 100 THROUGHPUT (kSPS) 120 ADDRESS DECODER IRQ2 03715-042 0.2 CONVST ADDRESS BUS 140 CS AD7938/ AD7939* BUSY WR WR RD RD DB0 TO DB11 Figure 41. Power vs. Throughput in Autostandby Mode Using Internal Reference D0 TO D23 DATA BUS *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 43. Interfacing to the ADSP-21xx Rev. F | Page 30 of 37 03715-045 VDD = 3V 0.6 0 1200 MR = DM (ADC) 1.4 POWER (mW) 8 POWER (mW) A considerable advantage of powering the ADC down after a conversion is that the power consumption of the part is significantly reduced at lower throughput rates. When using the different power modes, the AD7938/AD7939 are only powered up for the duration of the conversion. Therefore, the average power consumption per cycle is significantly reduced. Figure 41 shows a plot of the power vs. throughput rate when operating in autostandby mode for both VDD = 5 V and 3 V. For example, if the maximum CLKIN frequency of 25.5 MHz is used to minimize the conversion time, this accounts for only 0.525 µs of the overall cycle time while the AD7938/AD7939 remains in standby mode for the remainder of the cycle. If the devices run at a throughput rate of 10 kSPS, for example, the overall cycle time is 100 µs. TA = 25°C 9 Data Sheet AD7938/AD7939 DSP/USER SYSTEM AD7938/AD7939 to ADSP-21065L Interface A0 TO A15 TMS32020/ TMS320C25/ TMS320C50* IS CONVST ADDRESS BUS AD7938/ AD7939* ADDRESS EN DECODER READY CS TMS320C25 ONLY MSC STRB WR R/W RD DSP/USER SYSTEM INTX ADDRESS BUS CONVST ADDRESS LATCH AD7938/ AD7939* DB11 TO DB0 DATA BUS *ADDITIONAL PINS OMITTED FOR CLARITY. MSX Figure 45. Interfacing to the TMS32020/TMS320C25/TMS320C5x ADDRESS BUS ADSP-21065L* ADDRESS DECODER DMAR1 AD7938/AD7939 to 80C186 Interface CS BUSY RD RD WR WR D0 TO D31 DATA BUS *ADDITIONAL PINS OMITTED FOR CLARITY. 03715-046 DB0 TO DB11 Figure 44. Interfacing to the ADSP-21065L AD7938/AD7939 to TMS32020, TMS320C25, and TMS320C5x Interface Parallel interfaces between the AD7938/AD7939 and the TMS32020, TMS320C25, and TMS320C5x family of DSPs are shown in Figure 45. The memory mapped address chosen for the AD7938/AD7939 should be chosen to fall in the I/O memory space of the DSPs. The parallel interface on the AD7938/AD7939 is fast enough to interface to the TMS32020 with no extra wait states. If high speed glue logic, such as 74AS devices, is used to drive the RD and the WR lines when interfacing to the TMS320C25, no wait states are necessary. However, if slower logic is used, data accesses can be slowed sufficiently when reading from, and writing to, the part to require the insertion of one wait state. Extra wait states are necessary when using the TMS320C5x at their fastest clock speeds (see the TMS320C5x User’s Guide for details). Figure 46 shows the AD7938/AD7939 interfaced to the 80C186 microprocessor. The 80C186 DMA controller provides two independent high speed DMA channels where data transfer can occur between memory and I/O spaces. Each data transfer consumes two bus cycles, one cycle to fetch data and the other to store data. After the AD7938/AD7939 finish a conversion, the BUSY line generates a DMA request to Channel 1 (DRQ1). Because of the interrupt, the processor performs a DMA read operation that also resets the interrupt latch. Sufficient priority must be assigned to the DMA channel to ensure that the DMA request is serviced before the completion of the next conversion. MICROPROCESSOR/ USER SYSTEM AD0 TO AD15 A16 TO A19 ALE ADDRESS/DATA BUS CONVST ADDRESS LATCH AD7938/ AD7939* ADDRESS BUS 80C186* ADDRESS DECODER DRQ1 Q CS R S BUSY RD RD WR WR DATA BUS DB0 TO DB11 *ADDITIONAL PINS OMITTED FOR CLARITY. Figure 46. Interfacing to the 80C186 Data is read from the ADC using the following instruction IN D, ADC where: D is the data memory address. ADC is the AD7938/AD7939 address. Rev. F | Page 31 of 37 03715-048 ADDR 0 TO ADDR 23 BUSY DMD0 TO DMD15 03715-047 Figure 44 shows a typical interface between the AD7938/AD7939 and the ADSP-21065L SHARC® processor. This interface is an example of one of three DMA handshake modes. The MSX control line is actually three memory select lines. Internal ADDR25-24 are decoded into MS3 to 0, and these lines are then asserted as chip selects. The DMAR1 (DMA request 1) is used in this setup as the interrupt to signal the end of conversion. The rest of the interface is a standard handshaking operation. AD7938/AD7939 Data Sheet APPLICATION HINTS GROUNDING AND LAYOUT The printed circuit board that houses the AD7938/AD7939 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. This facilitates the use of ground planes that can be easily separated. Generally, a minimum etch technique is best for ground planes since it gives the best shielding. Digital and analog ground planes should be joined in only one place, and the connection should be a star ground point established as close to the ground pins on the AD7938/AD7939 as possible. Avoid running digital lines under the device as this couples noise onto the die. The analog ground plane should be allowed to run under the AD7938/AD7939 to avoid noise coupling. The power supply lines to the AD7938/AD7939 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals, such as clocks, should be shielded with digital ground to avoid radiating noise to other sections of the board, and clock signals should never run near the analog inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feedthrough through the board. A microstrip technique is by far the best but is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, while signals are placed on the solder side. Good decoupling is also important. All analog supplies should be decoupled with 10 µF tantalum capacitors in parallel with 0.1 µF capacitors to GND. To achieve the best performance from these decoupling components, they must be placed as close as possible to the device, ideally right up against the device. The 0.1 µF capacitors should have low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types or surface-mount types, which provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching. PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE The lands on the chip scale package (CP-32-7) are rectangular. The printed circuit board pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. The land should be centered on the pad. This ensures that the solder joint size is maximized. The bottom of the chip scale package has a thermal pad. The thermal pad on the printed circuit board should be at least as large as this exposed pad. On the printed circuit board, there should be a clearance of at least 0.25 mm between the thermal pad and the inner edges of the pad pattern. This ensures that shorting is avoided. Thermal vias can be used on the printed circuit board thermal pad to improve thermal performance of the package. If vias are used, they should be incorporated in the thermal pad at 1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm, and the via barrel should be plated with 1 oz copper to plug the via. The user should connect the printed circuit board thermal pad to AGND. EVALUATING AD7938/AD7939 PERFORMANCE The recommended layout for the AD7938/AD7939 is outlined in the evaluation board documentation. The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from the PC via the evaluation board controller. The evaluation board controller can be used in conjunction with the AD7938/AD7939 evaluation board, as well as many other Analog Devices evaluation boards ending in the CB designator, to demonstrate and evaluate the ac and dc performance of the AD7938/AD7939. The software allows the user to perform ac (fast Fourier transform) and dc (histogram of codes) tests on the AD7938/AD7939. The software and documentation are on the CD that ships with the evaluation board. Rev. F | Page 32 of 37 Data Sheet AD7938/AD7939 OUTLINE DIMENSIONS 5.10 5.00 SQ 4.90 PIN 1 INDICATOR AREA DETAIL A (JEDEC 95) 0.30 0.25 0.18 25 P IN 1 IN D IC ATO R AR E A OP T IO N S (SEE DETAIL A) 32 24 1 0.50 BSC 3.25 3.10 SQ 2.95 EXPOSED PAD 17 SIDE VIEW PKG-003898 BOTTOM VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 0.20 MIN 9 16 09-12-2018-A TOP VIEW 0.80 0.75 0.70 8 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-220-WHHD Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.75 mm Package Height (CP-32-7) Dimensions shown in millimeters 0.75 0.60 0.45 1.20 MAX 9.00 BSC SQ 25 32 24 1 PIN 1 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE VIEW A 17 8 16 9 VIEW A 0.80 BSC LEAD PITCH ROTATED 90° CCW 0.45 0.37 0.30 COMPLIANT TO JEDEC STANDARDS MS-026-AB A Figure 48. 32-Lead Thin Plastic Quad Flat Package [TQFP] (SU-32-2) Dimensions shown in millimeters Rev. F | Page 33 of 37 020607-A 0.15 0.05 7.00 BSC SQ TOP VIEW (PINS DOWN) 0° MIN 1.05 1.00 0.95 AD7938/AD7939 Data Sheet ORDERING GUIDE Model 1 AD7938BCPZ AD7938BCPZ-REEL7 AD7938BSUZ AD7938BSUZ-REEL7 AD7939BCPZ AD7939BCPZ-REEL7 AD7939BSUZ AD7939BSUZ-REEL7 1 2 Temperature Range –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C –40°C to +85°C Linearity Error (LSB) 2 ±1 ±1 ±1 ±1 ±1 ±1 ±1 ±1 Z = RoHS Compliant Part. Linearity error here refers to integral linearity error. Rev. F | Page 34 of 37 Package Description 32-Lead LFCSP 32-Lead LFCSP 32-Lead TQFP 32-Lead TQFP 32-Lead LFCSP 32-Lead LFCSP 32-Lead TQFP 32-Lead TQFP Package Option CP-32-7 CP-32-7 SU-32-2 SU-32-2 CP-32-7 CP-32-7 SU-32-2 SU-32-2 Data Sheet AD7938/AD7939 NOTES Rev. F | Page 35 of 37 AD7938/AD7939 Data Sheet NOTES Rev. F | Page 36 of 37 Data Sheet AD7938/AD7939 NOTES ©2004–2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03715-11/20(F) Rev. F | Page 37 of 37