FEATURES
FUNCTIONAL BLOCK DIAGRAM
VCC
Low cost
Low power: 2.5 V (outputs disabled)
34 × 34, fully differential, nonblocking array
3.2 Gbps per port NRZ data rate
Wide power supply range: 2.5 V to 3.3 V
LVTTL or LVCMOS level control inputs at
2.5 V to 3.3 V
Low channel jitter: 45 ps p-p
Drives a backplane directly
Programmable output swing
100 mV to 1600 mV p-p differential
50 Ω on-chip input/output termination
User controlled voltage at the load
Minimizes power dissipation
Dual rank latches
Available in 256-ball BGA_ED package
IN33P TO
IN00P
34
34
34 × 34
DIFFERENTIAL
SWITCH MATRIX
VTTI
IN33N TO
IN00N
D0 TO D5
34
MATRIX
CONNECTION
LATCHES
OUTPUT
LEVEL
DACs
OUT33P TO
OUT00P
VTTO
34
OUT33N TO
OUT00N
CONNECTION
DECODE
OUTPUT
LEVEL
LATCHES
RESET
CS
A0 TO A6
RE
CONTROL
LOGIC
WE
AD8152
UPDATE
VEE
APPLICATIONS
Fiber optic network switching
High speed serial backplane routing to OC-48 with FEC
Gigabit ethernet
Digital video (HDTV)
Data storage networks
02984-001
Data Sheet
34 × 34, 3.2 Gbps
Asynchronous Digital Crosspoint Switch
AD8152
Figure 1.
GENERAL DESCRIPTION
The AD8152 is a breakthrough cross point switch offering a
large switch array (34 × 34) on very little power, typically 2.0 W.
Additionally, the device operates at data rates up to 3.2 Gbps per
port, making it suitable for Sonet/SDH OC-48 with forward
error correction (FEC).
The fully differential signal path of the AD8152 reduces jitter
and crosstalk and allows the use of smaller single-ended voltage
swings. The device is offered in a 256-ball BGA_ED package
that operates over the industrial temperature range of 0°C to
85°C.
The useful supply voltage range of the AD8152 allows the user
to operate at LVPECL/CML data levels down to 2.5 V. The control
interface is low voltage transistor transistor logic (LVTTL) or
low voltage complementary metal-oxide (LVCMOS) compatible on
2.5 V to 3.3 V.
Rev. B
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AD8152
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................9
Applications ....................................................................................... 1
Typical Performance Characteristics ........................................... 14
General Description ......................................................................... 1
Test Circuits..................................................................................... 18
Functional Block Diagram .............................................................. 1
Theory of Operation ...................................................................... 19
Revision History ............................................................................... 2
Control Pin Description ............................................................ 19
Specifications..................................................................................... 3
AD8152 Power Consumption .................................................. 22
Timing Specifications .................................................................. 4
Outputs ........................................................................................ 24
Absolute Maximum Ratings ............................................................ 8
Outline Dimensions ....................................................................... 25
Maximum Power Dissipation ..................................................... 8
Ordering Guide .......................................................................... 25
Thermal Resistance ...................................................................... 8
ESD Caution .................................................................................. 8
REVISION HISTORY
9/2019—Rev. A to Rev. B
Updated Format .................................................................. Universal
Removed Xstream ......................................................... Throughout
Deleted Figure 2; Renumbered Sequentially ................................. 1
Changes to Features Section, General Description, and Figure 1.... 1
Deleted Thermal Characteristics Parameters, Table 1................. 2
Changed Electrical Characteristics Section to Specifications
Section ................................................................................................ 3
Added Timing Specifications Section, Table 3; Renumbered
Sequentially, and Endnote 1, Table 4.............................................. 4
Moved Table 2 and Table 4 to Table 6 ............................................... 4
Changes to Timing Specifications Section, Table 2, Table 4, and
Table 5 ................................................................................................ 4
Moved Table 7 to Table 11 ............................................................... 5
Added Endnote 1 to Table 10 .......................................................... 5
Changes to Endnote 1, Table 9, and Table 7 to Table 11 ............. 5
Added Timing Diagrams Section ................................................... 6
Moved Figure 2 to Figure 4 ............................................................. 6
Moved Figure 5 and Figure 6 .......................................................... 7
Added Thermal Resistance Section and Table 13 ........................ 8
Changes to Table 12 and Figure 7 ................................................... 8
Changes to Figure 8 .......................................................................... 9
Changes to Table 14 ........................................................................ 10
Changes to Figure 16 and Figure 18............................................. 15
Changes to Figure 21 Caption, Figure 22, Figure 23 Caption,
Figure 25 Caption, and Figure 26 ................................................. 16
Added Test Circuits Section .......................................................... 18
Changes to Figure 31 to Figure 33 ................................................ 18
Changed Control Interface Section to Theory of Operation
Section, A[6:0] Inputs Section to A0 to A6 Inputs Section,
D[5:0] Inputs Section to D5 to D0 Inputs Section ..................... 19
Changes to Output Addressing Section, Connection and Output
Current Programming Section, Using the Data Bus Section, and
Register Control Signals Section .................................................. 20
Deleted Evaluation Board and PCB Layout Hints Section,
Figure 10, and Figure 11 ................................................................ 21
Changed Input/Output Coupling Section to Internal
Input/Output Termination Section .............................................. 21
Changes to Internal Input/Output Termination Section, Input
Coupling Section, and Output Coupling Section ...................... 21
Deleted Figure 12 to Figure 14, Board Construction or Stack-Up
Section, and Bypass Capacitor Layout Section ........................... 22
Changes to AD8152 Power Consumption Section .................... 22
Deleted Figure 15, Figure 16, and Connections for Testing
Section .............................................................................................. 23
Changes to Input Termination Resistors Section and Input Stage
Section .............................................................................................. 23
Deleted Evaluation Board Control Software Section and
Figure 14 .......................................................................................... 24
Changes to Power Saving Consideration Section .......................... 24
Deleted Figure 18............................................................................ 25
Moved Ordering Guide Section ...................................................... 25
Updated Outline Dimensions ....................................................... 25
Changes to Ordering Guide .......................................................... 25
Deleted Figure 19............................................................................ 26
Deleted Figure 20............................................................................ 27
Deleted Figure 21............................................................................ 28
Deleted Figure 22............................................................................ 29
Deleted Figure 23............................................................................ 30
1/2003—Rev. 0 to Rev. A
Edits to Specifications .......................................................................2
9/2002—Revision 0: Initial Version
Rev. B | Page 2 of 25
Data Sheet
AD8152
SPECIFICATIONS
At 25°C, VCC = 2.5 V to 3.3 V, VEE = 0 V, load resistor (RL) = 50 Ω, and differential output swing = 800 mV p-p, unless otherwise noted.
Table 1.
Parameter
DYNAMIC PERFORMANCE
Maximum Data Rate/Channel
Nonreturn to Zero (NRZ)
Channel Jitter
Root Mean Square (RMS) Channel Jitter
Propagation Delay
Propagation Delay Match
Output Rise and Fall Time
INPUT CHARACTERISTICS
Input Voltage Swing
Input Voltage Range
Input Bias Current
Input Capacitance
OUTPUT CHARACTERISTICS
Output Voltage Swing
Output Voltage Range
Output Current (IOUT)
Output Capacitance
TERMINATION CHARACTERISTICS
Resistance
Temperature Coefficient
POWER SUPPLY
Operating Range
VCC
Quiescent Current
VCC
VEE
LOGIC INPUT CHARACTERISTICS
Input High (VIH)
Input Low (VIL)
Input High (VIH)
Input Low (VIL)
LOGIC OUTPUT CHARACTERISTICS
Output High (VOH)
Output Low (VOL)
Output High (VOH)
Output Low (VOL)
Test Conditions/Comments
Min
Typ
Max
3.2
Data rate ≤ 3.2 Gbps; PRBS 223 − 1
20% to 80%
Single-ended (see Figure 22)
Common-mode (see Figure 23)
Gbps
45