16-Bit, 400 MSPS
Digital-to-Analog Converter
AD9726
FEATURES
FUNCTIONAL BLOCK DIAGRAM
CLK+
CLK–
CLOCK DISTRIBUTION
AND CONTROL
SCLK
DCLK_OUT–
DB[0]–
DCLK_IN+
IOUTA
IOUTB
REFIO
FSADJ
Figure 1.
.
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The AD9726 is a 16-bit digital-to-analog converter (DAC)
that offers leading edge performance at conversion rates of up
to 400 MSPS. The device uses low voltage differential signaling
(LVDS) inputs and includes internal 100 Ω terminations. The
analog output can be single-ended or differential current. An
internal precision reference is included.
1.
All device operation is fully programmable using the flexible
serial port interface (SPI). The AD9726 is also fully functional
in its default state for applications without a controller.
16-BIT
DAC
INTERNAL
REFERENCE
DCLK_IN–
Instrumentation
Test equipment
Waveform synthesis
Communications systems
RESET
CALIBRATION
MEMORY
DATA SYNCHRONIZATION
DB[0]+
SDO
LVDS OUTPUT
DRIVER
DB[15]+
DB[15]–
SDIO
04540-001
DCLK_OUT+
APPLICATIONS
The AD9726 also features synchronization logic to monitor and
optimize the timing between incoming data and the sample clock.
This reduces system complexity and simplifies timing requirements. An LVDS clock output is also available to drive an external
data pump in either single data rate (SDR) or double data rate
(DDR) mode.
CSB
SPI
LVDS INPUT DATA CAPTURE
Dynamic performance
SFDR ≥ 78 dBc at fOUT = 20 MHz
IMD ≥ 82 dBc at fOUT = 70 MHz
ACLR ≥ 76 dBc at fOUT = 70 MHz
NSD ≤ −160 dB/Hz at fOUT = 70 MHz
Precision calibrated linearity
DNL ≤ ±0.5 LSB at +25°C
INL ≤ ±1.0 LSB at +25°C
THD ≤ −95 dB at fOUT = 1 MHz
LVDS inputs with internal 100 Ω terminations
Automatic data/clock timing synchronization
Single data rate or double data rate capable
Differential current outputs
Internal precision reference
Operates on 2.5 V and 3.3 V supplies
Extended industrial temperature range
Thermally enhanced, 80-lead, RoHS-compliant
TQFP_EP package
2.
3.
4.
5.
A unique combination of precision and performance
makes the AD9726 equally suited to applications with
demanding frequency domain or demanding time domain
requirements.
Nonvolatile factory calibration assures a highly linear
transfer function. Internal logic offers on demand selfcalibration for linearity even at extended operating
temperatures.
Proprietary architecture minimizes data dependent,
discrete mixing spurs and offers enhanced dynamic
performance over a wide range of output frequencies.
High input data rates create a very high frequency
synthesis bandwidth.
The fully automatic, transparent synchronizer maintains
optimized timing between clock and data in real time and
offers programmable control options for added flexibility.
Full-scale output current is external resistor programmable.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 © 2005-2010 Analog Devices, Inc. All rights reserved.
AD9726
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ........................................... 12
Applications ....................................................................................... 1
Serial Port Interface ........................................................................ 15
Functional Block Diagram .............................................................. 1
Theory of Operation ...................................................................... 17
General Description ......................................................................... 1
DAC Clock and Data Clock Output ........................................ 17
Product Highlights ........................................................................... 1
Data Clock Input ........................................................................ 17
Revision History ............................................................................... 2
Data Synchronization Circuitry ............................................... 18
Specifications..................................................................................... 3
Analog Output ............................................................................ 18
DC Specifications ......................................................................... 3
Internal Reference and Full-Scale Output .............................. 19
AC Specifications.......................................................................... 4
Reset ............................................................................................. 19
Digital Signal Specifications ........................................................ 5
Serial Port Interface ................................................................... 19
Timing Specifications .................................................................. 5
SPI Pin Description .................................................................... 20
Timing Diagrams.......................................................................... 6
Calibration................................................................................... 20
Absolute Maximum Ratings............................................................ 8
Sync Logic Operation and Programming ............................... 22
Thermal Resistance ...................................................................... 8
Outline Dimensions ....................................................................... 24
ESD Caution .................................................................................. 8
Ordering Guide .......................................................................... 24
Pin Configuration and Function Descriptions ............................. 9
Terminology .................................................................................... 11
REVISION HISTORY
2/10—Rev. A to Rev. B
Changes to Table 4 ............................................................................ 5
Added Figure 4 and Figure 5, Renumbered Sequentially ........... 6
Changes to Figure 5 and Table 7 ..................................................... 9
Changes to Table 9 .......................................................................... 16
Added Data Synchronization Circuitry Bypass Section ............ 18
Changes to Ordering Guide .......................................................... 24
11/05—Rev. 0 to Rev. A
Changes to Features ..........................................................................1
Changes to Table 3 and Table 4 .......................................................5
Changes to the Terminology Section ........................................... 10
Changes to the Driving the DAC Clock Inputs Section ............ 15
Changes to the Reset and Serial Port Interface Sections ........... 17
Updated Outline Dimensions ....................................................... 22
Changes to the Ordering Guide ................................................... 22
7/05—Revision 0: Initial Version
Rev. B | Page 2 of 24
AD9726
SPECIFICATIONS
DC SPECIFICATIONS
DBVDD = AVDD1 = AVDD2 = 3.3 V, DVDD = CLKVDD = ADVDD = ACVDD = 2.5 V, IOUT-FS = 20 mA, internal reference,
TMIN to TMAX, unless otherwise specified.
Table 1.
Parameter
ACCURACY 1
DNL
INL
Offset Error
Gain Error
ANALOG OUTPUT
Full-Scale Current
Compliance Voltage
Output Impedance
INTERNAL REFERENCE
Output Voltage
Output Current 2
EXTERNAL REFERENCE
Input Voltage
Input Resistance
Small Signal Bandwidth
TEMPERATURE COEFFICIENTS
Gain Drift
Offset Drift
Reference Drift
POWER SUPPLIES 3
AVDD1, AVDD2
Voltage Range
Supply Current (IAVDD1 + IAVDD2)
ADVDD, ACVDD
Voltage Range
Supply Current (IACVDD + IADVDD)
CLKVDD
Voltage Range
Supply Current (ICLKVDD)
DVDD
Voltage Range
Supply Current (IDVDD)
DBVDD
Voltage Range
Supply Current (IDBVDD)
POWER DISSIPATION (PDISS)
Sleep Mode
Power-Down Mode
OPERATING TEMPERATURE RANGE
Min
Typ
Max
Unit
±0.5
±1.0
0.003
0.003
±1.0
±2.5
LSB
LSB
% FS
% FS
20
±1
10
1.18
1.22
1
±10
±10
±30
ppm of FS/ºC
ppm of FS/ºC
ppm/ºC
52
3.47
60
V
mA
16
2.63
18
V
mA
45
2.63
50
V
mA
80
2.63
90
V
mA
3.47
18
V
mA
mW
mW
mW
°C
2.37
2.37
3.13
16
575
465
≤10
TAMB = 25°C.
Use buffer amplifier to drive external load.
3
Supply currents and power dissipation measured in SDR with fDAC = 400 MHz and fOUT = 1 MHz.
2
Rev. B | Page 3 of 24
V
μA
V
MΩ
kHz
2.37
1
1.27
1.2
10
200
3.13
−40
mA
V
MΩ
+85
AD9726
AC SPECIFICATIONS
DBVDD = AVDD1 = AVDD2 = 3.3 V, DVDD = CLKVDD = ADVDD = ACVDD = 2.5 V, IOUT-FS = 20 mA, internal reference,
TMIN to TMAX, unless otherwise specified.
Table 2.
Parameter
DYNAMIC PERFORMANCE
Output Settling Time (tST) to 0.1%
Output Rise Time (10% to 90%)
Output Fall Time (90% to 10%)
Output Noise (IOUTFS = 20 mA)
TOTAL HARMONIC DISTORTION (THD)
fDAC = 400 MHz, fOUT = 1 MHz, 0 dBFS
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 400 MHz, 0 dBFS
fOUT = 20 MHz
fOUT = 70 MHz
fOUT = 140 MHz
fDAC = 400 MHz, –3 dBFS
fOUT = 20 MHz
fOUT = 70 MHz
fOUT = 140 MHz
fDAC = 200 MHz, 0 dBFS
fOUT = 20 MHz
fOUT = 70 MHz
fDAC = 200 MHz, –3 dBFS
fOUT = 20 MHz
fOUT = 70 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD)
fDAC = 400 MHz, 0 dBFS
fOUT1 = 20 MHz, fOUT2 = 21 MHz
fOUT1 = 70 MHz, fOUT2 = 71 MHz
fOUT1 = 140 MHz, fOUT2 = 141 MHz
ADJACENT CHANNEL LEAKAGE RATIO (ACLR)
fDATA = 245.76 MSPS, fCARRIER = 70 MHz, One-Carrier WCDMA
fDATA = 245.76 MSPS, fCARRIER = 70 MHz, Two-Carrier WCDMA
fDATA = 245.76 MSPS, fCARRIER1 = 70 MHz, Four-Carrier WCDMA
fDATA = 245.76 MSPS, fCARRIER1 = 70 MHz, Eight-Carrier WCDMA
NOISE SPECTRAL DENSITY (NSD)
fDAC = 400 MHz, fOUT = 70 MHz, 0 dBFS
fDAC = 400 MHz, fOUT = 70 MHz, –3 dBFS
fDAC = 400 MHz, fOUT = 70 MHz, –6 dBFS
UPDATE RATE
Rev. B | Page 4 of 24
Min
Typ
Max
10.5
500
500
45
ns
ns
ns
pA/√Hz
−95
dB
78
68
62
dBc
dBc
dBc
80
70
62
dBc
dBc
dBc
84
62
dBc
dBc
82
68
dBc
dBc
86
82
74
dBc
dBc
dBc
76
70
66
62
dBc
dBc
dBc
dBc
−160
−163
−165
0
Unit
400
dBm/Hz
dBm/Hz
dBm/Hz
MSPS
AD9726
DIGITAL SIGNAL SPECIFICATIONS
DBVDD = AVDD1 = AVDD2 = 3.3 V, DVDD = CLKVDD = ADVDD = ACVDD = 2.5 V, IOUT-FS = 20 mA, internal reference,
TMIN to TMAX, unless otherwise specified.
Table 3.
Parameter
DAC CLOCK INPUTS (CLK±)
Differential Voltage
Common-Mode Voltage
LVDS INPUTS (DB[15:0]±, DCLK_IN±)
Input Voltage Range
Differential Threshold Voltage
Differential Input Impedance
LVDS OUTPUT (DCLK_OUT±)
Differential Output Voltage 1
Offset Voltage
Short-Circuit Output Current
CMOS INPUTS (CSB, SCLK, SDIO, RESET)
Logic 0 Voltage
Logic 1 Voltage
Input Current
CMOS OUTPUTS (SDO, SDIO)
Logic 0 Voltage
Logic 1 Voltage
Short-Circuit Output Current
CONTROL INPUTS (SPI_DIS, SDR_EN)
Logic 0 Voltage
Logic 1 Voltage
Input Current
1
Min
Typ
0.5
1.0
1.0
1.25
825
250
1.0
Max
Unit
V
V
1575
100
100
mV
mV
Ω
400
1.2
20
mV
V
mA
0.5
V
V
nA
0.5
V
V
mA
0.5
V
V
nA
2.5
1
3.0
10
2.0
1
With 100 Ω external load.
TIMING SPECIFICATIONS
DBVDD = AVDD1 = AVDD2 = 3.3 V, DVDD = CLKVDD = ADVDD = ACVDD = 2.5 V, IOUT-FS = 20 mA, internal reference,
TMIN to TMAX, unless otherwise specified.
Table 4.
Parameter
LVDS DATA BUS
Data Synchronization Enabled (Default)
DDR DCLK_OUT± Propagation Delay (tDCPD-DDR)
DDR DB[15:0]± Setup Time (tDSU-DDR)
DDR DB[15:0]± Hold Time (tDH-DDR)
SDR DCLK_OUT± Propagation Delay (tDCPD-SDR)
SDR DB[15:0]± Setup Time (tDSU-SDR)
SDR DB[15:0]± Hold Time (tDH-SDR)
Data Synchronization Bypassed
DB[15:0]± Setup Time (tDSU-BYPASS)
DB[15:0]± Hold Time (tDH-BYPASS)
CLK± to IOUT Propagation Delay (tPD-BYPASS)
DB[15:0]± to IOUT Pipeline Delay (tPIPE-BYPASS)
Min
Typ
Max
Unit
2000
ps
ps
ps
ps
ps
ps
−100
500
300
−100
500
800
50
0.85
4
Rev. B | Page 5 of 24
ps
ps
ns
DAC clock cycles
AD9726
Parameter
SERIAL PORT INTERFACE
SCLK Frequency (fSCLK)
SCLK Rise/Fall Time
SCLK Pulse Width High (tCPWH)
SCLK Pulse Width Low (tCPWL)
SCLK Setup Time (tCSU)
SDIO Setup Time (tDSU)
SDIO Hold Time (tDH)
SDIO/SDO Valid Time (tDV)
RESET PULSE WIDTH
Min
Typ
Max
Unit
15
1
MHz
ms
ns
ns
ns
ns
ns
ns
ns
30
30
30
30
0
30
1.5
TIMING DIAGRAMS
DAC CLOCK
tDCPD-DDR
DATACLOCK OUTPUT
DATA BUS
tDH-DDR
04540-002
tDSU-DDR
DATACLOCK INPUT
Figure 2. DDR Timing Diagram
DAC CLOCK
tDCPD-SDR
DATACLOCK OUTPUT
DATA BUS
tDH-SDR
04540-003
tDSU-SDR
DATACLOCK INPUT
Figure 3. SDR Timing Diagram
DB0 TO DB15
tDSU-BYPASS
tDH-BYPASS
CLK+/CLK–
04540-100
tPD-BYPASS
IOUTA OR IOUTB
Figure 4. Data Synchronization Bypass Timing Diagram
Rev. B | Page 6 of 24
AD9726
DB0 TO DB15
CLK+/CLK–
04540-101
tPIPE-BYPASS + tPD-BYPASS
IOUTA OR IOUTB
Figure 5. Data Synchronization Bypass Pipeline Delay
CSB
SCLK SET-UP TIME
tCSU
SCLK PULSE WIDTH HIGH/LOW TIME
tCPWH
tCPWL
SCLK
tDSU
SDIO HOLD TIME
tDH
SDIO (SD0) VALID TIME
tDV
04540-004
SDIO SET-UP TIME
SDIO (SD0)
Figure 6. SPI Timing Diagram
Rev. B | Page 7 of 24
AD9726
ABSOLUTE MAXIMUM RATINGS
Table 5.
THERMAL RESISTANCE
Parameter
With Respect to
Rating
DBVDD, AVDD1,
AVDD2
DVDD, CLKVDD,
ACVDD, ADVDD
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
REFIO, FSDAJ
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
DBGND, AGND1,
AGND2
DGND, CLKGND,
ACGND, ADGND
AGND1
−0.3 V to 3.6 V
IOUTA, IOUTB
AGND1
CLK±
CLKGND
DB[15:0]±,
DCLK_IN±,
DCLK_OUT±
CSB, SCLK, SDIO,
SDO, RESET, REXT
SDR_EN, SPI_DIS
DBGND
DBGND
ADGND
−0.3 V to +0.3 V
Thermal impedance can be lowered to 23°C/W by soldering the
exposed package pad to an external heat sink (for example, the
internal PCB copper ground plane). However, this is not necessary
for the power dissipation and operating temperature range of
the AD9726.
−0.3 V to +0.3 V
Table 6. Thermal Resistance
−0.3 V to 2.8 V
−0.3 V to AVDD1
+ 0.3 V
−1.0 V to AVDD1
+ 0.3 V
−0.3 V to CLKVDD
+ 0.3 V
−0.3 V to DBVDD
+ 0.3 V
Package Type
80-Lead TQFP_EP Package, Thermally Enhanced
ESD CAUTION
−0.3 V to DBVDD
+ 0.3 V
−0.3 V to ADVDD
+ 0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. B | Page 8 of 24
θJA
32
Unit
°C/W
AD9726
SDR_EN
ADVDD
ADGND
ACVDD
ACGND
AVDD2
AGND2
AVDD1
AGND1
IOUTB
IOUTA
AGND1
AVDD1
AGND2
AVDD2
ACGND
ACVDD
ADGND
ADVDD
SPI_DIS
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
CLKVDD
1
REXT
2
60
FSADJ
59
CLKVDD
REFIO
3
58
RESET
CLKGND
4
57
CSB
CLK+
5
56
SCLK (SYNCUPD)
CLK–
6
55
SDIO
CLKGND
7
54
SDO (SYNCALRM)
DGND
8
53
DGND
DVDD
9
52
DVDD
DB15+ 10
51
DB0–
DB15– 11
50
DB0+
DB14+ 12
49
DB1–
DB14– 13
48
DB1+
DB13+ 14
47
DB2–
DB13– 15
46
DB2+
DB12+ 16
45
DB3–
DB12– 17
44
DB3+
DB11+ 18
43
DB4–
DB11– 19
42
DB4+
DBVDD 20
41
DBGND
PIN 1
AD9726
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD SHOULD BE CONNECTED TO GROUND FOR ELECTRICAL AND THERMAL PURPOSES.
04540-005
DBVDD
DB5–
DB5+
DB6–
DB6+
DB7–
DB7+
DCLK_IN–
DCLK_IN+
DBGND
DBVDD
DCLK_OUT–
DCLK_OUT+
DB8–
DB8+
DB9–
DB9+
DB10–
DB10+
DBGND
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Figure 7. Pin Configuration
Table 7. Pin Function Descriptions
Pin
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Mnemonic
CLKVDD
REXT
CLKVDD
CLKGND
CLK+
CLK−
CLKGND
DGND
DVDD
DB15+
DB15−
DB14+
DB14−
DB13+
DB13−
DB12+
DB12−
DB11+
DB11−
DBVDD
DBGND
Description
Clock Supply Voltage
Sets Data Clock Output Drive 1
Clock Supply Voltage
Clock Supply Common
DAC Clock Input True
DAC Clock Input Complement
Clock Supply Common
Digital Supply Common
Digital Supply Voltage
Data Bit 15 True
Data Bit 15 Complement
Data Bit 14 True
Data Bit 14 Complement
Data Bit 13 True
Data Bit 13 Complement
Data Bit 12 True
Data Bit 12 Complement
Data Bit 11 True
Data Bit 11 Complement
Data Bus Supply Voltage
Data Bus Supply Common
Pin
No.
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
Rev. B | Page 9 of 24
Mnemonic
DB10+
DB10−
DB9+
DB9−
DB8+
DB8−
DCLK_OUT+
DCLK_OUT−
DBVDD
DBGND
DCLK_IN+
DCLK_IN−
DB7+
DB7−
DB6+
DB6−
DB5+
DB5−
DBVDD
DBGND
DB4+
Description
Data Bit 10 True
Data Bit 10 Complement
Data Bit 9 True
Data Bit 9 Complement
Data Bit 8 True
Data Bit 8 Complement
Data Clock Output True
Data Clock Output Complement
Data Bus Supply Voltage
Data Bus Supply Common
Data Clock Input True
Data Clock Input Complement
Data Bit 7 True
Data Bit 7 Complement
Data Bit 6 True
Data Bit 6 Complement
Data Bit 5 True
Data Bit 5 Complement
Data Bus Supply Voltage
Data Bus Supply Common
Data Bit 4 True
AD9726
Pin
No.
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
Mnemonic
DB4−
DB3+
DB3−
DB2+
DB2−
DB1+
DB1−
DB0+
DB0−
DVDD
DGND
SDO (SYNCALRM)
SDIO
SCLK (SYNCUPD)
CSB
RESET
REFIO
FSADJ
SDR_EN
ADVDD
ADGND
ACVDD
ACGND
AVDD2
AGND2
AVDD1
Description
Data Bit 4 Complement
Data Bit 3 True
Data Bit 3 Complement
Data Bit 2 True
Data Bit 2 Complement
Data Bit 1 True
Data Bit 1 Complement
Data Bit 0 True
Data Bit 0 Complement
Digital Supply Voltage
Digital Supply Common
SPI Data Output (SYNCALRM)2
SPI Data Input/Output3
SPI Clock Input (SYNCUPD)4
SPI Chip Select Bar (Active Low)
Hardware Reset (Active High)
Internal Reference Input/Output5
Output Current Full-Scale Adjust6
Single Data Rate Mode Enable7
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Pin
No.
69
70
71
72
73
74
75
76
77
78
79
80
1
Mnemonic
AGND1
IOUTB
IOUTA
AGND1
AVDD1
AGND2
AVDD2
ACGND
ACVDD
ADGND
ADVDD
SPI_DIS
EPAD
Description
Analog Supply Common
Analog Current Output Complement
Analog Current Output True
Analog Supply Common
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Analog Supply Common
Analog Supply Voltage
Serial Port Interface Disable8
Analog Ground. Serves as an
electrical connection to the
substrate of the die and should be
connected to ground for electrical
and thermal purposes.
Nominally 1 kΩ to DBGND (may be omitted if data clock output is unused).
SDO is output in 4-wire SPI mode and three-state in 3-wire SPI mode. If SPI is
disabled (SPI_DIS = ADVDD), the alternate pin function is SYNCALRM output.
3
SDIO is input only in 4-wire SPI mode and bidirectional in 3-wire SPI mode.
4
If SPI is disabled (SPI_DIS = ADVDD), the alternate pin function is SYNCUPD.
5
Bypass with 0.1 μF to AGND1. Use the buffer amp to drive external circuitry.
Limit the output current to 1 μA. Apply an external reference to this pin.
6
Nominally 2 kΩ to AGND1 for 20 mA full-scale output (internal reference).
7
If SPI is disabled, tie the pin to ADVDD to enable SDR. Otherwise, tie to
ADGND.
8
Tie the pin to ADVDD to disable SPI; otherwise, tie to ADGND.
2
Rev. B | Page 10 of 24
AD9726
TERMINOLOGY
Integral Nonlinearity (INL)
The maximum deviation of the actual analog output from the
ideal output, as determined by a straight line drawn from zero
scale to full scale.
Temperature Drift
Temperature drift is specified as the maximum change in a
parameter from ambient temperature (25°C) to either TMIN
or TMAX and is typically reported as ppm/°C.
Differential Nonlinearity (DNL)
A measure of the maximum deviation in analog output associated
with any single value change in the digital input code relative to
an ideal LSB.
Power Supply Rejection
The maximum change in the full-scale output as all power
supplies are varied over their respective operating voltage range.
Offset Error
The deviation of the output current from the ideal zero-scale
current. For differential outputs, 0 mA is expected at IOUTA when
all inputs are low, and 0 mA is expected at IOUTB when all inputs
are high.
Monotonicity
A DAC is monotonic if the analog output increases or remains
constant in response to an increase in the digital input.
Gain Error
The deviation of the output current from the ideal full-scale
current. Actual full-scale output current is determined by
subtracting the output when all inputs are low from the output
when all inputs are high.
Output Compliance Range
The range of allowable voltage seen by the analog output of a
current output DAC. Operation beyond the compliance limits
may cause output stage saturation and/or breakdown resulting
in nonlinear performance.
Spurious-Free Dynamic Range (SFDR)
The difference in decibels between the peak amplitude of a test
tone and the peak amplitude of the largest spurious signal over
the specified bandwidth.
Intermodulation Distortion (IMD)
The difference in decibels between the maximum peak
amplitude of two test tones and the maximum peak amplitude
of the distortion products created from the sum or difference
of integer multiples of the test tones.
Adjacent Channel Leakage Ratio (ACLR)
The ratio between the measured power of a wideband signal
within a channel relative to the measured power in an empty
adjacent channel.
Noise Spectral Density (NSD)
The measured noise power over a 1 Hz bandwidth seen at the
analog output.
Total Harmonic Distortion (THD)
The ratio in decibels of the rms power sum of the first six
harmonic components to the rms power of the output signal.
Rev. B | Page 11 of 24
AD9726
TYPICAL PERFORMANCE CHARACTERISTICS
100
630
620
POWER CONSUMPTION (mW)
90
80
–3dB
70
0dB
60
0
12
24
36
48
60
72
84
96
600
SDR
590
DDR
580
570
560
04540-007
50
610
04540-006
SFDR (dBc)
–6dB
550
0
108 120 132 144
50
100
150
200
fOUT (MHz)
fOUT (MHz)
Figure 11. Power Consumption vs. fOUT at 400 MSPS
Figure 8. SFDR vs. fOUT at 400 MSPS
100
0
90
REF LVL
0dBm
RBW
VBW
SWT
1kHz
1kHz
17s
RF ATT 40dB
UNIT
dBm
A
–10
–6dB
SFDR (dBc)
–20
80
–30
–3dB
–40
0dB
1AVG
1AP
–50
70
EXT
–60
–70
60
04540-008
–80
0
12
24
36
48
60
–90
–100
72
04540-018
50
–110
fOUT (MHz)
–120
START 750kHz
675kHz
STOP 7.5MHz
Figure 12. THD at 400 MSPS and fOUT = 1 MHz (Diplexer Low-Pass Output
Showing 0 dBm Fundamental (See the Performance Effects of Calibration
Section))
Figure 9. SFDR vs. fOUT at 200 MSPS
100
0
90
REF LVL
0dBm
RBW
VBW
SWT
1kHz
1kHz
17s
RF ATT 10dB
UNIT
dBm
A
–10
–20
–30
–40
1AVG
1AP
–50
70
EXT
–60
–70
60
–80
30
40
50
60
70
80
90
–90
–100
100 110 120 130 140
04540-019
50
20
04540-009
IMD (dBc)
f1 + f2 = 0dB
80
–110
fOUT (MHz)
–120
START 750kHz
Figure 10. Two-Tone IMD vs. fOUT at 400 MSPS
675kHz
STOP 7.5MHz
Figure 13. THD at 400 MSPS and fOUT = 1 MHz
(Diplexer High-Pass Output Showing Harmonics Before Calibration;
(See the Performance Effects of Calibration Section))
Rev. B | Page 12 of 24
AD9726
0
RBW
VBW
SWT
REF LVL
0dBm
1kHz
1kHz
17s
REF –40dBm
*AVG
Log
10dB/
RF ATT 10dB
UNIT
dBm
A
*ATTEN 6dB
–10
EXT REF
–20
–30
–40
1AVG
1AP
–50
EXT
–60
–70
–80
–90
PAVG
10
W1 S2
–110
–120
START 750kHz
675kHz
CENTER 70.00MHz
*RES BW 10kHz
STOP 7.5MHz
SPAN 47.38MHz
SWEEP 1.383s (601 pts)
TOTAL CARRIER POWER -17.61dBm/7.68000MHz
RRC FILTER: ON FILTER ALPHA 0.22
REF CARRIER POWER
-20.72dBm/3.84000MHz
UPPER
LOWER
dBm
dBc
dBm
OFFSET FREQ INTEG BW dBc
3.840MHz –70.61 –91.34 –70.74 –91.47
5.000MHz
1 –20.51dBm
3.840MHz –71.29 –92.01 –71.31 –92.03
10.00MHz
2 –20.72dBm
3.840MHz –71.36 –92.08 –71.06 –91.78
15.00MHz
Figure 16. Two-Carrier WCDMA at 400 MSPS fOUT = 70 MHz
Figure 14. THD at 400 MSPS and fOUT = 1 MHz (Diplexer High-Pass Output
Showing Harmonics After Calibration,
See the Performance Effects of Calibration Section)
REF –35dBm
*AVG
Log
10dB/
VBW 100kHz
*ATTEN 8dB
04540-015
04540-020
–100
REF –45dBm
*AVG
Log
10dB/
*ATTEN 4dB
EXT REF
EXT REF
PAVG
10
W1 S2
PAVG
10
W1 S2
RMS RESULTS FREQ OFFSET
CARRIER POWER 5.000MHz
10.00MHz
–14.58dBm/
15.00MHz
3.84000MHz
REF BW
3.840MHz
3.840MHz
3.840MHz
SPAN 34.68MHz
SWEEP 1.012s (601 pts)
LOWER
dBm
dBc
–76.72 –91.30
–76.96 –91.54
–77.07 –91.65
UPPER
dBm
dBc
–76.69 –91.27
–77.04 –91.62
–76.76 –91.34
CENTER 70.00MHz
*RES BW 10kHz
VBW 100kHz
SPAN 59.58MHz
SWEEP 1.739s (601 pts)
TOTAL CARRIER POWER -20.62dBm/15.3600MHz
RRC FILTER: ON FILTER ALPHA 0.22
REF CARRIER POWER
-26.43dBm/3.84000MHz
UPPER
LOWER
dBm
dBc
dBm
OFFSET FREQ INTEG BW dBc
3.840MHz –66.59 –93.00 –67.07 –93.48
5.000MHz
1 –26.43dBm
3.840MHz –67.63 –94.04 –67.54 –93.95
10.00MHz
2 –26.53dBm
3.840MHz –67.59 –94.00 –67.44 –93.86
15.00MHz
3 –26.74dBm
4 –26.88dBm
Figure 15. One-Carrier WCDMA at 400 MSPS fOUT = 70 MHz
Figure 17. Four-Carrier WCDMA at 400 MSPS fOUT = 70 MHz
Rev. B | Page 13 of 24
04540-016
VBW 100kHz
04540-014
CENTER 70.00MHz
*RES BW 10kHz
AD9726
REF –50dBm
*AVG
Log
10dB/
*ATTEN 2dB
EXT REF
PAVG
10
W1 S2
VBW 100kHz
SPAN 83.98MHz
SWEEP 2.451s (601 pts)
TOTAL CARRIER POWER -20.62dBm/15.3600MHz
RRC FILTER: ON FILTER ALPHA 0.22
REF CARRIER POWER
-26.43dBm/3.84000MHz
UPPER
LOWER
dBm
dBc
dBm
OFFSET FREQ INTEG BW dBc
3.840MHz –62.23 –94.82 –62.09 –94.68
5.000MHz
1 –32.21dBm
3.840MHz –62.87 –95.46 –62.36 –94.94
10.00MHz
2 –32.30dBm
3.840MHz –63.70 –96.28 –62.39 –94.98
15.00MHz
3 –32.44dBm
4 –32.59dBm
04540-017
CENTER 70.00MHz
*RES BW 10kHz
Figure 18. Eight-Carrier WCDMA at 400 MSPS fOUT = 70 MHz
Rev. B | Page 14 of 24
AD9726
SERIAL PORT INTERFACE
Table 8. SPI Register Map
Addr
0x00
0x02
0x0E
0x0F
0x10
0x11
0x15
0x16
Bit 7
SDIODIR
DATAFMT
Bit 6
DATADIR
DATARATE
SCALSTAT
MEMADR[7]
SELFCAL
MEMADR[6]
BYPASS
Bit 5
SWRESET
INVDCLKI
CALMEM[1]
XFERSTAT
MEMADR[5]
MEMDAT[5]
Bit 4
SLEEP
INVDCLKO
CALMEM[0]
MEMXFER
MEMADR[4]
MEMDAT[4]
Bit 3
PWRDWN
DISDCLKO
SYNCEXT
SYNCIN[1]
SYNCIN[0]
SMEMWR
MEMADR[3]
MEMDAT[3]
Bit 2
Bit 1
SYNCMAN
CALCLK[2]
SMEMRD
MEMADR[2]
MEMDAT[2]
SYNCUPD
CALCLK[1]
FMEMRD
MEMADR[1]
MEMDAT[1]
SYNCOUT[1]
Bit 0
EXTREF
SYNCALRM
CALCLK[0]
UNCAL
MEMADR[0]
MEMDAT[0]
SYNCOUT[0]
Table 9. SPI Register Bit Default and Descriptions Values
Addr
0x00
0x02
0x0E
0x0F
Name
SDIODIR
Bits
7
I/O
I
Default
0
DATADIR
6
I
0
SWRESET
SLEEP
PWRDWN
EXTREF
DATAFMT
5
4
3
0
7
I
I
I
I
I
0
0
0
0
0
DATARATE
6
I
0
INVDCLKI
INVDCLKO
DISDCLKO
SYNCMAN
SYNCUPD
SYNCALRM
CALMEM
5
4
3
2
1
0
[5:4]
I
I
I
I
I
O
O
0
0
0
0
0
0
00
CALCLK
[2:0]
I
000
SCALSTAT
SELFCAL
XFERSTAT
MEMXFER
SMEMWR
SMEMRD
FMEMRD
UNCAL
7
6
5
4
3
2
1
0
O
I
O
I
I
I
I
I
0
0
0
0
0
0
0
0
Description
0: SDIO is input only (4-wire SPI mode), and SDO is used for output.
1: SDIO is input/output (3-wire SPI mode), and SDO is unused.
0: SPI serial data byte is MSB first format.
1: SPI serial data byte is LSB first format.
1: software reset: SPI registers (except 0x00) to default values. 1
1: analog outputs temporarily disabled.
1: full device power-down; all circuits disabled except SPI.
1: power-down internal reference; use external reference source. 2
0: input data-word is twos complement binary format.
1: input data-word is unsigned binary format.
0: DDR mode.
1: SDR mode.
1: inverts the polarity of the data clock input.
1: inverts the polarity of the data clock output.
1: disables the data clock output.
1: enables sync manual mode; disables automatic update.
1: forces manual sync update.
1: indicates that sync logic requires update.
2-bit SMEM contents and calibration status indicator.
00: uncalibrated; SMEM contains default values (63).
01: self-calibrated; SMEM contains values from self-calibration.
10: factory-calibrated; SMEM values are transferred from FMEM.
11: user-calibrated; SMEM contains user-entered values.
3-bit self-calibration clock divider ratio. Affects time available for algorithm settling. Each
value increase reduces time by 50%. 3
000: self-calibration clock is DAC clock/4096 (maximum self-calibration settling time for
highest linearity accuracy).
001,010,011: self-calibration clock is DAC clock/2048,1024,512.
100,101,110: self-calibration clock is DAC clock/256,128,64.
111: self-calibration clock is DAC clock/32 (minimum self-calibration settling time for
fastest algorithm completion).
1: indicates completion of self-calibration cycle.
1: initiates self-calibration cycle. 4
1: indicates completion of memory transfer cycle.
1: initiates FMEM to SMEM transfer. 5
1: enables static memory (SMEM) write operation.
1: enable sstatic memory (SMEM) read operation.
1: enables factory memory (FMEM) read operation.
1: enables uncalibrated operation; all SMEM to default values. 6
Rev. B | Page 15 of 24
AD9726
Addr
0x10
0x11
0x15
0x16
Name
MEMADR
MEMDAT
SYNCOUT
BYPASS
SYNCEXT
SYNCIN
Bits
[7:0]
[5:0]
[1:0]
6
5
[4:3]
I/O
I
I/O
O
I
I
I
Default
00000000
000000
00
0
0
00
Description
8-bit memory address value for read/write operations.
6-bit memory data value for read/write operations.
2-bit output value indicates current sync quadrant.
1: bypasses data synchronization circuitry. Data is sampled using the DAC clock (CLK±)
1: enables sync external mode; disable auto quadrant select.
2-bit input value is used to specify the sync quadrant.
1
SWRESET also resets itself. SMEM contents are unaffected by SWRESET; however, CALMEM reports an uncalibrated state.
EXTREF is optional because the internal reference circuit is designed to be overdriven by an external source.
3
The self-calibration clock is also used for the memory transfer cycle; therefore, the CALCLK value affects the MEMXFER process time.
4
Register Bits 3:0 must all be 0 to assert SELFCAL. The time required for the self-calibration cycle is ~100 ms at 100 MHz with CALCLK = 0.
5
Register Bits 3:0 must all be 0 to assert MEMXFER. The time required for the memory transfer cycle is ~15 ms at 100 MHz with CALCLK = 0.
6
The UNCAL bit remains asserted after the cycle completes (SMEM contents held at default values) until the bit is cleared by the user.
2
Rev. B | Page 16 of 24
AD9726
THEORY OF OPERATION
The AD9726 uses LVDS for input data to enable high sample
rates and high performance. LVDS technology uses differential
signals for noise rejection and small signal amplitude for fast
speed with lower power. Each LVDS input on the AD9726 has
an internal 100 Ω active load for proper termination.
VCC = CLKVDD = 2.5V
1:1
25Ω
50Ω
AD9726
VCC – 2V
The AD9726 uses two clock inputs and offers one clock output.
All are differential signals.
Use of the data clock output is optional. It is meant to serve as
a convenient means of regulating the incoming data stream.
The driver can be loaded by a 100 Ω differential termination.
An external 1 kΩ resistor from the REXT pin to DBGND is also
required to set the drive strength. If unused, the data clock
output pins can be left unconnected, and the 1 kΩ resistor at
REXT can be omitted.
50Ω
04540-012
VBB = 1.0V
The DAC clock is then used to generate the data clock output.
The DCLK_OUT+ and DCLK_OUT– pins form an LVDS
signal that can be used to drive an external FPGA or another
data pump. In SDR mode, the data clock output always runs at
the same frequency as the DAC clock. In DDR mode, the data
clock output always runs at ½ the DAC clock frequency.
CLK–
MC100LVEP16
DAC CLOCK AND DATA CLOCK OUTPUT
The AD9726 is driven by a master input clock that initiates conversion and controls all on-chip activity. This signal is referred
to as the DAC clock. It is not LVDS, and the CLK+ and CLK–
pins are high impedance inputs.
CLK+
25Ω
Figure 19. Active DAC Clock Drive Circuit
The circuit option shown in Figure 19 uses a receiver/driver IC
from the 2.5 V LVPECL logic family to provide complementary
outputs that fall within these guidelines. A transformer helps
ensure a 50% duty cycle and provides a single-ended to differential conversion at the input.
The LVPECL device can be conveniently powered from the
same power supply as CLKVDD. The center tap of the transformer secondary must be held at 1 V, the switching threshold
of the receiver/driver inputs (use a resistive divider to generate
this voltage or use the internal VBB source with a buffer
amplifier). Based on a 1:1 impedance ratio, 25 Ω resistors across
the secondary provide a matched load to a 50 Ω source.
The driver outputs are terminated as close as possible to the
AD9726 with 50 Ω to VCC − 2 V (or use a Thevenin equivalent
circuit). Controlled impedance PCB traces should be used to
minimize reflections. Signal levels at the CLK+ and CLK– pins
transition between a high near 1500 mV to a low near 750 mV.
The data clock output can also be inverted by asserting the
INVDCLKO bit in SPI Register 0x02, or the driver can be
disabled by asserting the DISDCLKO bit in the same register.
0.1μF
CLK+
1:1
50Ω
DATA CLOCK INPUT
The remaining clock signal associated with the AD9726 is the
data clock input. This LVDS signal is not optional and must
accompany the 16-bit data bus. The data clock input is used to
latch incoming data into the synchronization (sync) logic.
The data clock input always runs at the same frequency as the
data clock output in both SDR and DDR modes. A logical
inversion can be accomplished by asserting the INVDCLKI bit.
Driving the DAC Clock Inputs
The DAC clock must be precise and spectrally pure to ensure
the highest ac performance. A symmetrical 50% duty cycle
should be maintained at all times.
The CLK+ and CLK– input pins should be driven by a signal
with a common-mode voltage near ½ of CLKVDD. From this
point, peak-to-peak signal amplitude should swing over a range
of at least several hundred millivolts.
VDC BIAS = 1.25V
AD9726
04540-013
CLK–
0.1μF
Figure 20. Passive DAC Clock Drive Circuit
An alternative circuit option for driving the DAC clock inputs
employs a transmission line transformer (balun) to accomplish
the single-ended to differential conversion. This all-passive
circuit is considerably simpler and less costly, and it provides
acceptable performance over a limited range of frequencies.
In this implementation, a sine wave (or other single-ended
source) is coupled directly to the differential DAC clock inputs
through a 50 Ω transformer. Capacitors are used for isolation,
and each DAC clock pin must be dc-biased to a level of 1.25 V
(a pair of simple resistive dividers can be used).
Rev. B | Page 17 of 24
AD9726
DATA SYNCHRONIZATION CIRCUITRY
The high performance of the AD9726 requires maintaining
synchronization between the incoming bits and the DAC clock
used to sample and convert the data. Despite the inherent difficulty in specifying the phase relationship of the DAC clock
and the LVDS data clock input and the challenge presented by
the high operating speed of the interface, the AD9726 contains
real-time logic to automatically monitor and align the data bus
with the DAC clock.
Whether in SDR or DDR mode, input data is always provided
at the same rate. Furthermore, the rate of incoming data always
equals the frequency period of the DAC clock. The data rate and
the DAC clock must also be frequency locked. To accomplish this,
the primary purpose of the data clock output is to provide a
time base for data that is derived directly from the DAC clock.
The function of the data clock input is to latch incoming data
into the sync block. From there, it is the function of the
synchronization logic to position the data with respect to the
DAC clock for optimal ac performance.
The data synchronization circuitry bypass is enabled by writing
0x40 to Address 0x16. The AD9726 should also be configured
in single data rate mode by writing 0x80 to Address 0x02. In this
mode, the sync logic is bypassed, making its configurations and
status reporting irrelevant.
ANALOG OUTPUT
The AD9726 is based around a high dynamic range CMOS
core. The analog output consists of differential current sources,
each capable of up to 20 mA full scale. Discrete output devices
are PMOS and capable of sourcing current into an output
termination within a compliance voltage range of ±1 V.
In a typical application, both outputs drive discrete resistors-toanalog ground. From there, especially for higher frequency
outputs, they feed the center-tap secondary of a 1:1 RF transformer. A differential-to-single-ended conversion is accomplished
that provides added gain and cancellation of even ordered
harmonics.
IOUTA
25Ω
IOUTB
Figure 21. Transformer Output Circuit
For maximum output power, resistor values can be increased to
50 Ω to provide up to 0 dBm into a 50 Ω load without loss of
performance for most transformers.
RGA
Individual data bits must maintain close alignment with one
another so that PCB traces have matched delays across the
width of the 16-bit bus. In addition, a fixed setup and hold
timing relationship between the data clock input and the data
bus is required.
Data Synchronization Circuitry Bypass
Due to internal design limitations, the data synchronization
circuitry does not assure a fixed or predictable pipeline delay
between the data input and the analog output after power-up.
For designs where multichip synchronization or fixed pipeline
delay is important, the AD9726 can be configured to bypass the
resynchronization circuitry and assure a fixed pipeline delay of
four DAC clock cycles. In this mode, the data is sampled into
RFA
IOUTA
50Ω
However, because of the sync logic, the phase relationship between
the data bus and the DAC clock is internally optimized.
Furthermore, if the phase between the data bus and the DAC
clock drifts over time or temperature, the sync logic automatically updates and adjusts for it. After synchronization is
reached, the phase between the data bus and the DAC clock can
vary by a full cycle without loss or corruption of data.
More detailed explanations of sync operation and optional
programmable modes are presented in the Sync Logic
Operation and Programming section, which also includes an
explanation of how to use the sync logic without the SPI.
–3dBm
25Ω
04540-021
Good ac performance can be expected from either the active or
passive DAC clock drive circuit. However, in a passive circuit,
the output slew rate is dependent on the frequency of the input;
whereas an active circuit provides consistently high output slew
rates over a wide range of input frequencies.
the DAC using the DAC clock (CLK±) and following the timing
presented in Figure 4, Figure 5, and Table 4.
RGB
RFB
IOUTB
50Ω
NOTES
1. USE RF AND RG TO SET GAIN
AND LIMIT BANDWIDTH
04540-011
The 50 Ω termination resistor should be placed as close as possible to the input pins, and controlled impedance PCB traces
should be used.
Figure 22. Op Amp Output Circuit
As an alternative, an active output stage can be used in the
classic instrumentation amplifier configuration. Here, each
DAC output feeds the noninverting input of one of the Analog
Devices, Inc., high speed transimpedance op amps.
Rev. B | Page 18 of 24
AD9726
INTERNAL REFERENCE AND FULL-SCALE OUTPUT
Communication Cycle
The AD9726 contains an internal 1.2 V precision reference
source; this reference voltage appears at the REFIO pin. It can
be used to drive external circuitry if properly buffered.
All communication cycles have two phases. The first phase is
concerned with writing an instruction byte into the SPI
controller and always coincides with the first eight rising edges
of SCLK. The instruction byte provides the controller with
information regarding the second phase of the cycle, namely the
data transfer phase. The instruction byte contains the number
of data bytes to be transferred (one to four), a register address,
and a bit initiating a read or write operation.
The reference voltage (either internal or external) is applied to
an external precision resistor at the FSADJ pin. The resulting
current is internally amplified to provide the full-scale current
at the DAC output according to the following equation:
INSTRUCTION CYCLE
SCLK
SDIO
R/W
N1
N0
A4
A3
A2
A1
SDO
IOUTFS = VREF/RFSADJ × 32
Taking into account the binary value appearing at the data bus
inputs, the output currents IOUTA and IOUTB can be determined
according to the following equations:
IOUTA = IOUTFS × DB[15:0]/65536
IOUTB = IOUTFS × (1 − DB[15:0])/65536
Note that the AD9726 features nonvolatile, factory-calibrated
gain using the internal reference source and a precision 2 kΩ
load. Gain accuracy in any application is, therefore, dependent
upon the accuracy of RFSADJ.
RESET
Following initial power-up and application of a valid DAC clock
signal, the AD9726 should always be initialized with an active
high pulse on the RESET pin. This defaults the programmable
registers, initializes volatile calibration memory, and prepares
the synchronization logic for data. The data bus should be static
prior to the reset pulse. After reset, LVDS data can flow.
The default state of the AD9726 is DDR and twos complement
binary input data. To use the AD9726 in this mode, it is not
necessary to program any device registers. However, the SPI is
enabled by default unless the SPI_DIS pin is connected high. If
not disabled, SPI input pins should not be left floating.
SERIAL PORT INTERFACE
The serial port interface is a flexible and synchronous serial
communications port allowing easy interface to many industry
standard microcontroller and microprocessor protocols
(including both Motorola SPI® and Intel® SSR). The interface
provides read/write access to registers that configure the
operation of the AD9726.
The AD9726 SPI supports single-byte and multibyte transfers as
well as MSB- or LSB-justified data formats. The interface can be
configured in 3-wire mode (in which SDIO is bidirectional) or
the default 4-wire mode (in which SDIO and SDO function as
unidirectional data input and data output, respectively).
DATA TRANSFER CYCLE
CSB
A0
D7n D6n
D20 D10
D00
D7n D6n
D20 D10
D00
04540-010
Apply an external reference voltage source to the REFIO pin if
desired. The internal source is designed to be easily overdriven
by an external source; however, the internal reference can also
be powered down using the EXTREF bit in SPI Register 0x00.
Figure 23. SPI Communication Cycle
Any communication cycle begins with CSB going low, which
also resets the SPI control logic. Similarly, any communication
cycle ends with CSB going high, which aborts any incomplete
data transfer. After a communication cycle begins, the next
eight SCLK rising edges interpret data on the SDIO pin as the
instruction byte.
Instruction Byte
The instruction byte bits are shown in the following bit map.
B7
R/W
B6
N1
B5
N0
B4
A4
B3
A3
B2
A2
B1
A1
B0
A0
R/W
Bit 7 of the instruction byte selects a read or write transfer. If
the bit is set high, a read operation is indicated. If the bit is low,
a write operation is indicated.
N1, N0
Bit 6 and Bit 5 of the instruction byte determine the number of
data bytes to be transferred, as shown in Table 10.
Table 10.
N1
0
0
1
1
N0
0
1
0
1
Description
Transfer one data byte
Transfer two data bytes
Transfer three data bytes
Transfer four data bytes
A4, A3, A2, A1, A0
Bit 4 through Bit 0 of the instruction byte specify a 5-bit binary
value corresponding to a valid register address. In the case of
multibyte transfers, the location specified is either an initial or
a concluding register address. The SPI controller increments
or decrements this value to generate successive address values
depending on whether LSB or MSB justification is active.
Rev. B | Page 19 of 24
AD9726
MSB/LSB Transfers
The SPI can support both MSB- and LSB-justified serial data
byte formats. This functionality is determined by Bit 6 in SPI
Register 0x00. This bit defaults low, which is MSB justification.
In this mode, serial data bits are written to and/or read from
registers sequentially from Bit 7 to Bit 0.
If Bit 6 of SPI Register 0x00 is set high, the controller switches
to LSB justification. In this mode, data bits are written to or
read from registers sequentially from Bit 0 to Bit 7. Writing to
the instruction bytes is also affected by the active justification.
For multibyte transfers with MSB justification, the address in
the instruction byte is interpreted as a final address, and its value
is decremented automatically by the controller. For multibyte
transfers with LSB justification, the address in the instruction
byte is interpreted as an initial address, and its value is incremented
automatically by the controller.
Care must be exercised when switching from MSB to LSB
justification. The controller switches modes immediately once
all eight bits of SPI Register 0x00 are written (even if in the
process of a multibyte transfer). For this reason, a single byte
command is recommended when changing justification.
3-Wire and 4-Wire Operation
Bit 7 of SPI Register 0x00 defaults low, enabling 4-wire SPI
operation. In this mode, serial data is input from the SDIO pin,
and serial data is output on the SDO pin. Setting Bit 7 of SPI
Register 0x00 high enables 3-wire operation. In this mode,
SDIO becomes bidirectional and switches automatically from
input to output when necessary. The SDO pin in this mode is
unused and assumes a high impedance state.
As with MSB or LSB justification, care must be exercised when
switching operational modes. The change occurs immediately
once all eight bits of SPI Register 0x00 are written.
Writing and Reading Register Data
Bringing CSB low initiates a new communication cycle. The
next eight rising edges of SCLK latch data from SDIO into the
instruction byte. If Bit 7 of the instruction byte is low, a write
operation is enabled. If Bit 7 is high, a read operation is enabled.
For a write operation, a data byte is latched from the SDIO pin
into a register on the next eight rising edges of SCLK. If the
instruction byte Bit 6 and Bit 5 are not both 0, a multibyte
transfer latches data bytes into adjacent registers after each
successive set of eight rising SCLK edges. Depending upon
MSB or LSB justification, the controller decrements or
increments the address value in the instruction byte during
the cycle as necessary.
If a read operation is enabled, data bits from the register being
addressed appear on SDO (or SDIO) with each falling edge of
SCLK. Note that for a read operation, the eighth bit of the
instruction byte is latched on the eighth rising edge of SCLK,
and the first output bit is enabled on the immediately following
falling SCLK edge.
For multibyte read sequences, the controller adjusts the register
address when necessary, and subsequent data bit values appear
at the output with each falling SCLK edge.
Disabling the SPI
Tie the SPI_DIS pin high to ADVDD to disable the serial port
inteface. In this state, the default DDR operational mode can be
changed to SDR by pulling the SDR_EN pin high to ADVDD.
In addition, with the SPI disabled, the sync logic no longer operates in a fully automatic mode. See the Sync Logic Operation
and Programming section for a full explanation of sync operational modes.
SPI PIN DESCRIPTION
The AD9726 SPI logic runs from the DBVDD supply rail, and
input/output thresholds are based upon a nominal 3.3 V level.
The maximum frequency of operation is 15 MHz.
Chip Select (CSB)
The CSB pin is an active low input. It begins and ends any
communication cycle and must remain low during the entire
cycle. An incomplete cycle is aborted if CSB is prematurely
returned high.
Serial Clock (SCLK)
The SCLK pin is used to synchronize data to and from the SPI
registers, and the controller state machine runs from this input.
It is, therefore, possible to read and write register data (but not
SMEM/FMEM) without a valid DAC clock. All input data is
registered on the rising edge of SCLK, and output data bits are
enabled on the falling edge of SCLK.
Serial Data Input/Output (SDIO)
Data is always written into the SPI on the SDIO pin. In 3-wire
mode, however, data is also driven out using this pin. The
switch from input to output occurs automatically between the
instruction and data transfer phases of a read operation. In the
default 4-wire mode, SDIO is unidirectional and input only.
Serial Data Output (SDO)
Serial data is driven out on the SDO pin when the SPI is in its
default 4-wire mode. In 3-wire mode (or whenever CSB is high),
SDO is set to a high impedance state.
CALIBRATION
To ensure linearity to the 16-bit level, the AD9726 incorporates
132 calibration DACs (CALDACs), which are used to linearize
the current output transfer function. Each CALDAC is a 6-bit
device and takes its input directly from static memory (SMEM).
There are 127 CALDACs associated with each major transition
of the 16-bit input data-word (that is, any transition involving
the upper 7 MSBs). A 128th CALDAC operates on the sum total
of the lower nine LSBs. The remaining four CALDACs (129 to
132) are used to adjust the DAC’s overall transfer function gain.
Rev. B | Page 20 of 24
AD9726
Linearity CALDACs operate inversely from their input; that is,
as their binary input value increases, the magnitude of their
current contribution seen at the AD9726 output decreases. Gain
CALDACs are an exception to this. Their contribution seen at
the AD9726 output is in direct proportion to their binary input.
Gain CALDACs are also half strength as compared to linearity
CALDACs, but they are intended to be used together as a unit
and thus, together, provide twice the current adjustment range.
Calibration Memory
During production testing, the linearity of the AD9726 is
measured and optimized. Values for all CALDACs are permanently stored in nonvolatile factory memory (FMEM). At
reset, all factory memory contents are transferred to static
memory. CALMEM, Bits[5:4] in Register 0x0E, indicates a
factory calibrated state (CALMEM = 10b).
It is also possible at any time to transfer the contents of FMEM
to SMEM by asserting the MEMXFER bit in Register 0x0F. The
XFERSTAT indicator bit (Bit 5 in Register 0x0F) then reports
the successful completion of the transfer cycle, and MEMXFER
is cleared.
Note that the MEMXFER bit (and SELFCAL, Bit 6, Register
0x0F) cannot be asserted if any other memory access function is
currently enabled (that is, if any one of Bits[3:0] in Register
0x0F is high). Attempting to assert MEMXFER (or SELFCAL)
in this case clears any asserted bits in Register 0x0F, but the
requested cycle does not commence.
The factory-to-static memory data transfer cycle requires a
number of DAC clock cycles. The total depends on the value of
CALCLK. This value sets a divider used to create a slow version
of the DAC clock, which is intended to extend the settling time
available to the self-calibration cycle. However, this divided
clock is also used to sequence a memory transfer cycle.
The divider is set to its maximum value with CALCLK at its
default value. A memory transfer cycle requires about 15 ms at a
DAC clock frequency of 100 MHz. This time can be reduced by
50% for every increase in the value of CALCLK.
(CALMEM = 00b). Note that UNCAL remains asserted (and
the contents of SMEM remains at default values) indefinitely.
UNCAL does not clear itself (like SWRESET) and must be
cleared by the user.
Note also that although SPI registers do not depend on the DAC
clock (they use SCLK to sequence the controller state machine),
SMEM and/or FMEM access does require a valid DAC clock.
SMEM/FMEM Read/Write Procedures
Static and factory memory is accessed through the SPI, but it is
not part of the SPI logic. For this reason, memory access requires
a valid DAC clock, while SPI register access does not.
Because the AD9726 SPI is so flexible, allowing single and
multiple byte reads and writes as well as MSB or LSB justified
data, there are a number of ways in which a user can access one
or more SMEM or FMEM locations.
To avoid potential errors, the following procedures for accessing
static or factory memory should be followed. These procedures
use only single-byte SPI commands to ensure the enabling of
addresses and the sequencing of memory access.
To read from SMEM or FMEM,
1.
2.
3.
4.
5.
To write to SMEM,
1.
2.
3.
4.
Accessing Calibration Memory
Ensure that Bits [3:0] of Register 0x0F are clear.
Begin the sequence by writing the memory address value
to Register 0x10 with a single-byte SPI write command.
Assert the SMEMRD or FMEMRD bit in Register 0x0F
with another single-byte SPI write command.
Import the contents of Register 0x11 using a single-byte
SPI read command.
Clear the SMEMRD or FMEMRD bit with another singlebyte command.
Ensure that Bits [3:0] of Register 0x0F are clear.
Begin the sequence by writing the data value to
Register 0x11 using a single-byte SPI write command.
Assert the SMEMWR bit using a single-byte SPI write
command.
Place the memory address value in Register 0x10 using a
single-byte SPI write command.
Clear the SMEMWR bit with a fourth single-byte SPI write
command.
SMEM or FMEM locations can be read at any time by setting
the SMEMRD or FMEMRD bit in SPI Register 0x0F. Address
and data information can be input and/or output through SPI
Register 0x10 and SPI Register 0x11, respectively.
5.
SMEM locations can also be written by setting the SMEMWR
bit in Register 0x0F. Register 0x10 and Register 0x11 are again
used for addresses and data. Any time after the SMEMWR bit
has been asserted, the device reports a user-calibrated state
(CALMEM = 11b) until another action changes the calibration
memory status.
The AD9726 features an internal self-calibration engine to
linearize the transfer function automatically. This can be very
useful at temperature extremes where factory calibration no
longer applies. The automated cycle can be initiated by asserting
the SELFCAL bit.
To reset static memory at any time, assert the UNCAL bit in
Register 0x0F. All SMEM locations are then reset to their
default values (63). CALMEM reports an uncalibrated state
Self-Calibration
The self-calibration process calibrates all linearity and gain
CALDACs based upon a fixed internal reference current. Values
for all CALDACs are stored in volatile static memory. The
CALSTAT bit indicates the successful completion of the cycle,
Rev. B | Page 21 of 24
AD9726
and the SELFCAL bit is cleared. Following the cycle, the device
reports a self-calibrated state (CALMEM = 01b).
As with MEMXFER, successful assertion of the SELFCAL bit
(Bit 6 in Register 0x0F)requires that Bits[3:0] in Register 0x0F
be clear. If any of these bits are asserted (such that an
SMEM/FMEM read/write/clear state is enabled), the selfcalibration cycle does not begin.
The time required to self-calibrate is dependent on both the
DAC clock frequency and the value of CALCLK (Bits[5:0] in
Register 0x0E). Because self-calibration requires more time
than ordinary operation, the DAC clock is divided into a slower
version and used to step through the process. Time made
available to the self-calibration algorithm directly impacts its
ability to provide accurate results.
A maximum fixed division ratio (4096) corresponds to the
minimum default value of CALCLK (0). The division ratio can
be decreased by increasing the value of CALCLK. Each increase
in the value of CALCLK reduces the DAC clock division factor
(and, therefore, the time made available to self-calibration) by
50%. With CALCLK at its maximum value (7), the divide ratio
declines to its minimum value (32).
With CALCLK at its default value, self-calibration requires
approximately 100 ms at a DAC clock frequency of 100 MHz.
This time can be reduced to under 0.8 ms if CALCLK = 7. Time
scales relative to DAC clock frequency.
Performance Effects of Calibration
Harmonic distortion for low frequency outputs is primarily a
function of DAC linearity. Figure 12 to Figure 14 show the
harmonic distortion performance of the AD9726.
Figure 12 shows a 1 MHz full-scale output tone. The output
drives a unique low-pass and high-pass filter called a diplexer.
This type of filter presents a uniform 50 Ω load to the DAC and
splits the output signal into low and high frequency paths. The
diplexer's low-pass output passes the 1 MHz fundamental but
attenuates higher frequencies, and the diplexer's high-pass output passes higher frequencies and attenuates the 1 MHz fundamental. Figure 12 also shows the diplexer's low-pass output.
Here the noise floor is higher than the harmonic distortion
because with a high power input signal, attenuation is required
by the spectrum analyzer.
Figure 13 shows the diplexer's high pass output where the
attenuated input signal can be seen. The spectrum analyzer
attenuation is also reduced, which lowers the noise floor.
Harmonic products at integer multiples of the fundamental
are thus revealed. This is the response using the AD9726 in
an uncalibrated state.
Figure 14 shows a response using the AD9726 in a calibrated
state. Harmonic distortion due to the nonlinearities of the
digital-to-analog conversion are virtually eliminated.
SYNC LOGIC OPERATION AND PROGRAMMING
Recall that a fixed setup and hold timing relationship between
the data clock input and the data bus must be established and
maintained. Recall also that the data bus and the DAC clock
must be frequency locked. Because of the sync logic, however,
the phase relationship between the data bus and the DAC clock
is internally optimized. Therefore, data arrival propagation
delays and concern about data transitions near the sampling
instant are eliminated.
Synchronization is automatically enabled upon reset. After data
arrives and synchronization is achieved, the sync logic continuously monitors itself so that automatic adjustments are made if
phase drifts occur over time and/or temperature.
Note that the sync function and operation of the sync logic
block are transparent, automatic, and ongoing. No programming
is required. For applications where it is useful, however, the
following programmable control is provided.
SYNC Operating States
The sync logic can operate in one of three possible modes. The
default mode is fully automatic.
Fully automatic synchronization is accomplished by demultiplexing the incoming data stream into four channels, each
containing every fourth data-word. Data-words are present for
four DAC clock cycles. Data is remultiplexed by sampling each
channel with the optimum DAC clock cycle.
Initial synchronization is first established through a hardware
reset. This also fully enables the synchronization logic to monitor and resynchronize, as necessary. The AD9726 resynchronizes only if conditions change enough to alter the phase
between the data bus and the DAC clock by more than one full
clock cycle. In this event, an internal alarm occurs and is
followed by an automatic update. During resynchronization,
two data-words are typically lost or repeated.
In addition to fully automatic mode, two semi-automatic modes
are available.
Sync Manual Mode
In fully automatic mode, the AD9726 both detects when a
resynchronization is necessary and initiates an update. In
manual mode, automatic updating is disabled. Enable manual
mode by setting the SYNCMAN bit in SPI Register 0x02.
In manual mode, the sync logic still monitors incoming data
and the DAC clock, but it indicates the need for an update by
asserting the SYNCALRM bit (Bit 0 in Register 0x02). In this
mode, the user is expected to regularly poll the SYNCALRM
bit. When this bit is read back high, the user can issue a manual
sync update also by asserting the SYNCUPD bit (Bit 1) in SPI
Register 0x02.
SYNCALRM does not indicate that data is being lost but that
conditions are close to the point where data may be lost. The
Rev. B | Page 22 of 24
AD9726
sync logic should be resynchronized by asserting SYNCUPD
at the next convenient time.
In manual mode, users can choose when to update the sync
logic. When operating with burst data, issuing a sync update
between active bursts updates the system without risking the
loss of any data. In fact, because SYNCUPD always forces a
resynchronization regardless of operational mode, even users in
fully automatic mode can reduce the possibility of data loss by
occasionally forcing a sync update during idle activity.
If either the data clock or the DAC clock is interrupted for any
reason, a SYNCUPD should always be executed to ensure that
data bus and DAC clock phase alignment remains optimized.
The four channels into which each incoming data-word is
multiplexed are called quadrants. In any mode, the current
quadrant value can always be read back via SYNCOUT (Bits
[1:0] of SPI Register 0x15). At sync update, the logic chooses the
optimal quadrant and refreshes the value of SYNCOUT.
It is also possible to enter a value into SYNCIN (Bits [4:3] of SPI
Register 0x16). When external mode is enabled, the logic operates as expected, except that the quadrant value in SYNCIN is
used following an update. This can be used to align delays
between multiple device outputs.
Operating With SPI Disabled
SYNC External Mode
If the SPI_DIS pin is connected high to ADVDD and the SPI is
disabled, the sync logic is placed into manual mode.
Going beyond manual mode, sync external mode offers a
greater level of control and can be useful if multiple DAC
channels are employed in an application. Enable sync external
mode by asserting the SYNCEXT bit (Bit 5) in SPI Register
0x16. Manual mode must also be enabled.
SYNCALRM status can then be monitored in hardware via the
unused SPI pin SDO (54), and SYNCUPD requests can be
entered in hardware via the unused SPI pin SCLK (56). If these
two pins are connected together, fully automatic sync operation
can be achieved.
Rev. B | Page 23 of 24
AD9726
OUTLINE DIMENSIONS
14.20
14.00 SQ
13.80
0.75
0.60
0.45
1.20
MAX
12.20
12.00 SQ
11.80
61
61
80
1
60
80
1
60
PIN 1
EXPOSED
PAD
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
0° MIN
1.05
1.00
0.95
0.15
0.05
SEATING
PLANE
6.00
BSC SQ
0.20
0.09
7°
3.5°
0°
0.08 MAX
COPLANARITY
(PINS UP)
20
41
21
40
VIEW A
20
41
21
40
0.50 BSC
LEAD PITCH
0.27
0.22
0.17
VIEW A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
060806-A
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-ADD-HD
Figure 24. 80-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-80-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9726BSVZ
AD9726BSVZRL
AD9726-EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
Package Description
80-Lead TQFP_EP
80-Lead TQFP_EP
Evaluation Board
Z = RoHS Compliant Part.
© 2005-2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04540-0-2/10(B)
Rev. B | Page 24 of 24
Package Option
SV-80-1
SV-80-1
工商网监
湘ICP备2023018690号
