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ADCMP563BCPZ-WP

ADCMP563BCPZ-WP

  • 厂商:

    AD(亚德诺)

  • 封装:

    WFQFN16

  • 描述:

    COMPARATOR, 2 FUNC, 10000UV OFFS

  • 数据手册
  • 价格&库存
ADCMP563BCPZ-WP 数据手册
Dual, High Speed ECL Comparators ADCMP563/ADCMP564 Data Sheet FUNCTIONAL BLOCK DIAGRAMS APPLICATIONS HYS* NONINVERTING INPUT Q OUTPUT ADCMP563/ ADCMP564 INVERTING INPUT Q OUTPUT LATCH ENABLE INPUT LATCH ENABLE INPUT *ADCMP564 ONLY Figure 1. QA 1 16 QB QA 2 15 QB 14 GND GND 3 Automatic test equipment High speed instrumentation Scope and logic analyzer front ends Window comparators High speed line receivers Threshold detection Peak detection High speed triggers Patient diagnostics Hand-held test instruments Zero crossing detectors Line receivers and signal restoration Clock drivers 04650-0-001 Differential ECL-compatible outputs 700 ps propagation delay input to output 75 ps propagation delay dispersion Input common-mode range: –2.0 V to +3.0 V Robust input protection Differential latch control Internal latch pull-up resistors Power supply rejection greater than 85 dB 700 ps minimum pulse width 1.5 GHz equivalent input rise time bandwidth Typical output rise/fall time of 500 ps ESD protection > 4kV HBM, >200V MM Programmable hysteresis LEA 4 LEA 5 ADCMP563 BRQ 13 LEB 12 LEB TOP VIEW (Not to Scale) VEE 6 11 VCC –INA 7 10 –INB +INA 8 9 +INB 04650-0-002 FEATURES GND 1 20 GND QA 2 19 QB 18 QB 17 GND QA 3 GND 4 LEA 5 LEB 15 LEB VEE 7 14 VCC 13 –INB +INA 9 12 +INB HYSA 10 11 HYSB 13 GND 14 LEA 16 VEE 15 LEA Figure 3. ADCMP564 20-Lead QSOP –INA 1 +INA 2 +INB 3 12 QA ADCMP563 BCP 11 QA 10 QB TOP VIEW 9 QB NOTES 1. THE EXPOSED PAD SHOULD BE EITHER CONNECTED TO VEE OR LEFT FLOATING. Figure 4. ADCMP563 16-Lead LFCSP The ADCMP563/ADCMP564 are specified over the industrial temperature range (−40°C to +85°C). Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2007–2016 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com 04650-0-026 (Not to Scale) LEB 7 –INB 4 GND 8 A differential input stage permits consistent propagation delay with a wide variety of signals in the common-mode range from −2.0 V to +3.0 V. Outputs are complementary digital signals that are fully compatible with ECL 10 K and 10 KH logic families. The outputs provide sufficient drive current to directly drive transmission lines terminated in 50 Ω to −2 V. A latch input, which is included, permits tracking, track-and-hold, or sampleand-hold modes of operation. The latch input pins contain internal pull-ups that set the latch in tracking mode when left open. 16 –INA 8 VCC 5 The ADCMP563/ADCMP564 are high speed comparators fabricated on Analog Devices’ proprietary XFCB process. The devices feature a 700 ps propagation delay with less than 75 ps overdrive dispersion. Dispersion, a measure of the difference in propagation delay under differing overdrive conditions, is a particularly important characteristic of high speed comparators. A separate programmable hysteresis pin is available on the ADCMP564. TOP VIEW (Not to Scale) LEB 6 GENERAL DESCRIPTION LEA 6 ADCMP564 BRQ 04650-0-012 Figure 2. ADCMP563 16-Lead QSOP ADCMP563/ADCMP564 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Timing Information ....................................................................... 10 Applications ....................................................................................... 1 Application Information ................................................................ 11 General Description ......................................................................... 1 Clock Timing Recovery ............................................................. 11 Functional Block Diagrams ............................................................. 1 Optimizing High Speed Performance ..................................... 11 Specifications..................................................................................... 3 Comparator Propagation Delay Dispersion ............................... 11 Absolute Maximum Ratings ............................................................ 5 Comparator Hysteresis .............................................................. 12 Thermal Considerations .............................................................. 5 Minimum Input Slew Rate Requirement ................................ 12 ESD Caution .................................................................................. 5 Typical Application Circuits ......................................................... 13 Pin Configurations and Function Descriptions ........................... 6 Outline Dimensions ....................................................................... 14 Typical Performance Characteristics ............................................. 8 Ordering Guide .......................................................................... 15 REVISION HISTORY 4/16—Rev. C to Rev. D Changes to Figure 4 .......................................................................... 1 Changes to Figure 7 .......................................................................... 6 Updates Outline Dimensions ........................................................ 15 Changes to Ordering Guide .......................................................... 15 Changes to Table 1.............................................................................3 Changes to Optimizing High Speed Performance Section ....... 11 Changes to Comparator Hysteresis Section ................................ 12 Changes to Minimum Input Slew Rate Requirement Section . 12 Changes to Ordering Guide .......................................................... 14 6/11—Rev. B to Rev. C Changes to Figure 4 .......................................................................... 1 Changes to Figure 7 and LFCSP Pin Numbers (Table 3) ............ 6 Updated Outline Dimensions ....................................................... 14 Changes to Ordering Guide .......................................................... 15 7/04—Rev. 0 to Rev. A Changes to Specification Table ........................................................4 Changes to Figure 14.........................................................................9 Changes to Figure 21...................................................................... 12 Changes to Figure 23...................................................................... 13 5/05—Rev. A to Rev. B Added 16-Lead LFCSP....................................................... Universal Changes to Applications .................................................................. 1 4/04—Revision 0: Initial Version Rev. D | Page 2 of 15 Data Sheet ADCMP563/ADCMP564 SPECIFICATIONS VCC = +5.0 V, VEE = −5.2 V, TA = −40°C to +85°C. Typical values are at TA = +25°C, unless otherwise noted. Table 1. Electrical Characteristics Parameter DC INPUT CHARACTERISTICS Input Voltage Range Input Differential Voltage Input Offset Voltage Input Offset Voltage Channel Matching Offset Voltage Temperature Coefficient Input Bias Current Input Bias Current Temperature Coefficient Input Offset Current Input Capacitance Input Resistance, Differential Mode Input Resistance, Common Mode Active Gain Common-Mode Rejection Ratio Hysteresis LATCH ENABLE CHARACTERISTICS Latch Enable Voltage Range Latch Enable Differential Input Voltage Latch Enable Input High Current Latch Enable Input Low Current LE Voltage, Open LE Voltage, Open Latch Setup Time Latch Hold Time Latch to Output Delay Latch Minimum Pulse Width DC OUTPUT CHARACTERISTICS Output Voltage—High Level Output Voltage—Low Level Rise Time Fall Time AC PERFORMANCE Propagation Delay Propagation Delay Temperature Coefficient Prop Delay Skew—Rising Transition to Falling Transition Within Device Propagation Delay Skew— Channel-to-Channel Overdrive Dispersion Slew Rate Dispersion Pulse Width Dispersion Duty Cycle Dispersion Common-Mode Voltage Dispersion Symbol Conditions Min VOS VCM = 0 V −2.0 −5 −10.0 ∆VOS/dT IBC @ −IN = −2 V, +IN = +3 V −10.0 CIN AV CMRR tS tH tPLOH, tPLOL tPL VCM = −2.0 V to +3.0 V RHYS = ∞ @ 0.0 V @ −2.0 V Latch inputs not connected Latch inputs not connected VOD = 250 mV VOD = 250 mV VOD = 250 mV VOD = 250 mV VOH VOL tR tF ECL 50 Ω to −2.0 V ECL 50 Ω to −2.0 V 10% to 90% 10% to 90% tPD ∆tPD /dT −2.0 0.4 −300 −300 −0.2 −2.8 Typ ±2.0 ±2.0 2.0 ±3 0.5 ±1.0 0.75 750 1800 63 80 ±1.0 0 −2.6 200 200 500 Max Unit 3.0 +5 +10.0 V V mV mV µV/°C µA nA/°C µA pF kΩ kΩ dB dB mV +10.0 0 2.0 +300 +300 +0.1 −2.4 500 ps 530 450 V V ps ps VOD = 1 V VOD = 20 mV VOD = 1 V VOD = 1 V 700 830 0.25 50 ps ps ps/°C ps VOD = 1 V 50 ps 20 mV ≤ VOD ≤ 100 mV 100 mV ≤ VOD ≤ 1.5 V 0.4 V/ns ≤ SR ≤ 1.33 V/ns 750ps ≤ PW ≤ 10 ns 33 MHz, 1 V/ns, 0.5 V 1 V swing, −1.5 V ≤ VCM ≤ +2.5 V 75 75 50 25 10 10 ps ps ps ps ps ps Rev. D | Page 3 of 15 −1.15 −1.95 V V µA µA V V ps ps ps −0.81 −1.54 ADCMP563/ADCMP564 Parameter AC PERFORMANCE (Continued) Equivalent Input Rise Time Bandwidth 1 Maximum Toggle Rate Minimum Pulse Width RMS Random Jitter Unit to Unit Propagation Delay Skew POWER SUPPLY Positive Supply Current Negative Supply Current Positive Supply Voltage Negative Supply Voltage Power Dissipation DC Power Supply Rejection Ratio—VCC DC Power Supply Rejection Ratio—VEE HYSTERESIS (ADCMP564 Only) Hysteresis Hysteresis Pin Bias Voltage Hysteresis Pin Series Resistance 1 Data Sheet Symbol Conditions BWEQ 0 V to 1 V swing, 2 V/ns >50% output swing, 50% duty cycle ΔtPD < 25 ps VOD = 400 mV, 1.3 V/ns, 312 MHz, 50% duty cycle PWMIN IVCC IVEE VCC VEE PD @ +5.0 V @ −5.2 V Dual Dual Dual, without load Dual, with load PSRRVCC PSRRVEE RHYS = 23.5 kΩ RHYS = 9.0 kΩ Referred to AGND Min 2 10 4.75 −4.96 90 150 Typ Max Unit 1500 800 700 1.0 MHz MHz ps ps 100 ps 3.2 19 5.0 −5.2 120 180 85 85 20 70 −1 3 5 25 5.25 −5.45 150 230 mA mA V V mW mW dB dB mV mV V kΩ Equivalent input rise time bandwidth assumes a first-order input response and is calculated by the following formula: BWEQ = 0.22/√(trCOMP2 – trIN2), where trIN is the 20/80 input transition time applied to the comparator and trCOMP is the effective transition time, as digitized by the comparator input. Rev. D | Page 4 of 15 Data Sheet ADCMP563/ADCMP564 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Supply Voltages Positive Supply Voltage (VCC to GND) Negative Supply Voltage (VEE to GND) Ground Voltage Differential Input Voltages Input Common-Mode Voltage Differential Input Voltage Input Voltage, Latch Controls Output Output Current Temperature Operating Temperature, Ambient Operating Temperature, Junction Storage Temperature Range Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rating −0.5 V to +6.0 V −6.0 V to +0.5 V −0.5 V to +0.5 V −3.0 V to +4.0 V −7.0 V to +7.0 V VEE to +0.5 V THERMAL CONSIDERATIONS The ADCMP563 QSOP 16-lead package option has a θJA (junction-to-ambient thermal resistance) of 104°C/W in still air. 30 mA −40°C to +85°C 125°C −65°C to +150°C The ADCMP563 LFCSP 16-lead package option has a θJA (junction-to-ambient thermal resistance) of 70°C/W in still air. The ADCMP564 QSOP 20-lead package option has a θJA (junction-to-ambient thermal resistance) of 80°C/W in still air. ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. D | Page 5 of 15 ADCMP563/ADCMP564 Data Sheet LEB 12 LEB VEE 6 11 VCC –INA 7 10 –INB +INA 8 9 +INB TOP VIEW (Not to Scale) +INB 3 12 QA ADCMP563 BCP 11 QA 10 QB TOP VIEW –INB 4 (Not to Scale) VCC 5 LEA 5 –INA 1 +INA 2 04650-0-002 ADCMP563 BRQ 13 GND GND LEA 4 14 LEA 14 13 GND 3 LEB 7 QB QA 9 QB GND 8 QB 15 16 VEE 16 2 LEB 6 QA 1 15 LEA PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS NOTES 1. THE EXPOSED PAD SHOULD BE EITHER CONNECTED TO VEE OR LEFT FLOATING. Figure 7. ADCMP563 16-Lead LFCSP Pin Configuration GND 1 20 GND QA 2 19 QB QA 3 18 QB 17 GND 16 LEB GND 4 LEA 5 ADCMP564 BRQ TOP VIEW (Not to Scale) 15 LEB VEE 7 14 VCC –INA 8 13 –INB +INA 9 12 +INB HYSA 10 11 HYSB LEA 6 04650-0-012 Figure 5. ADCMP563 16-Lead QSOP Pin Configuration Figure 6. ADCMP564 20-Lead QSOP Pin Configuration Table 3. Pin Function Descriptions ADCMP563 16-Lead QSOP Pin No. ADCMP563 16-Lead LFCSP 1 11 ADCMP564 20-Lead QSOP 1 2 Mnemonic GND QA 2 12 3 QA 3 4 13 14 4 5 GND LEA 5 15 6 LEA Function Analog Ground. One of Two Complementary Outputs for Channel A. QA is logic high if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEA pin for more information. One of Two Complementary Outputs for Channel A. QA is logic low if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEA pin for more information. Analog Ground. One of Two Complementary Inputs for Channel A Latch Enable. In compare mode (logic high), the output tracks change at the input of the comparator. In latch mode (logic low), the output reflects the input state just prior to the comparator being placed in the latch mode. LEA must be driven in conjunction with LEA. If left unconnected, the comparator defaults to compare mode. One of Two Complementary Inputs for Channel A Latch Enable. In compare mode (logic low), the output tracks change at the input of the comparator. In latch mode (logic high), the output reflects the input state just prior to the Rev. D | Page 6 of 15 Data Sheet ADCMP563/ADCMP564 ADCMP563 16-Lead QSOP Pin No. ADCMP563 16-Lead LFCSP ADCMP564 20-Lead QSOP Mnemonic 6 7 16 1 7 8 VEE −INA 8 2 9 +INA 9 3 10 11 12 HYSA HYSB +INB 10 4 13 −INB 11 12 5 6 14 15 VCC LEB 13 7 16 LEB 14 15 8 9 17 18 GND QB 16 10 19 QB 20 GND EPAD EPAD Function comparator being placed in the latch mode. LEA must be driven in conjunction with LEA. If left unconnected, the comparator defaults to compare mode. Negative Supply Terminal. Inverting Analog Input of the Differential Input Stage for Channel A. The Inverting A input must be driven in conjunction with the Noninverting A input. Noninverting Analog Input of the Differential Input Stage for Channel A. The Noninverting A input must be driven in conjunction with the Inverting A input. Programmable Hysteresis Input. Programmable Hysteresis Input. Noninverting Analog Input of the Differential Input Stage for Channel B. The Noninverting B input must be driven in conjunction with the Inverting B input. Inverting Analog Input of the Differential Input Stage for Channel B. The Inverting B input must be driven in conjunction with the Noninverting B input. Positive Supply Terminal. One of Two Complementary Inputs for Channel B Latch Enable. In compare mode (logic low), the output tracks change at the input of the comparator. In latch mode (logic high), the output reflects the input state just prior to the comparator being placed in the latch mode. LEB must be driven in conjunction with LEB. If left unconnected, the comparator defaults to compare mode. One of Two Complementary Inputs for Channel B Latch Enable. In compare mode (logic high), the output tracks change at the input of the comparator. In latch mode (logic low), the output reflects the input state just prior to the comparator being placed in the latch mode. LEB must be driven in conjunction with LEB. If left unconnected, the comparator defaults to compare mode. Analog Ground. One of Two Complementary Outputs for Channel B. QB is logic low if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEB pin for more information. One of Two Complementary Outputs for Channel B. QB is logic high if the analog voltage at the noninverting input is greater than the analog voltage at the inverting input (provided the comparator is in compare mode). See the description of the LEB pin for more information. Analog Ground. Exposed Pad. The exposed pad should be either connected to VEE or left floating. Rev. D | Page 7 of 15 ADCMP563/ADCMP564 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS VCC = 3.3 V, TA = 25°C, unless otherwise noted. 3.0 2.80 2.78 1.5 1.0 0.5 0 –0.5 –1.0 –2.5 –1.5 –0.5 0.5 1.5 2.5 2.76 2.74 2.72 2.70 2.68 2.66 2.64 04650-0-016 +IN INPUT BIAS CURRENT (µA) (+IN = 3V, –IN = 0V) 2.0 04650-0-013 INPUT BIAS CURRENT (µA) 2.5 2.62 2.60 –40 3.5 –20 0 NONINVERTING INPUT VOLTAGE (INVERTING VOLTAGE = 0V) 20 40 60 80 TEMPERATURE (°C) Figure 8. Input Bias Current vs. Input Voltage Figure 11. Input Bias Current vs. Temperature 2.00 –0.8 1.95 –1.0 OUTPUT RISE AND FALL (V) 1.85 1.80 1.75 1.70 1.65 1.60 1.50 –40 –20 20 0 60 40 –1.4 –1.6 –1.8 04650-0-014 1.55 –1.2 04650-0-017 OFFSET VOLTAGE (mV) 1.90 –2.0 0 80 0.25 0.50 0.75 475 545 470 540 465 535 460 530 455 525 520 510 435 505 30 40 2.00 445 440 20 1.75 450 515 10 1.50 50 60 70 80 04650-0-018 TIME (ps) 550 0 1.25 Figure 12. Rise and Fall of Outputs vs. Time 04650-0-015 TIME (ps) Figure 9. Input Offset Voltage vs. Temperature 500 –40 –30 –20 –10 1.00 TIME (ns) TEMPERATURE (°C) 430 425 –40 –30 –20 –10 90 TEMPERATURE (°C) 0 10 20 30 40 50 60 TEMPERATURE (°C) Figure 10. Rise Time vs. Temperature Figure 13. Fall Time vs. Temperature Rev. D | Page 8 of 15 70 80 90 ADCMP563/ADCMP564 705 715 704 710 705 700 695 690 685 680 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 703 702 701 700 699 04650-0-022 PROPAGATION DELAY (ps) 720 04650-0-019 PROPAGATION DELAY (ps) Data Sheet 698 697 –2 90 –1 TEMPERATURE (°C) Figure 14. Propagation Delay vs. Temperature 2 3 25 100 80 60 40 04650-0-020 20 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 20 15 10 5 0 –5 0.7 1.6 04650-0-023 PROPAGATION DELAY ERROR (ps) 120 0 1.7 2.7 3.7 OVERDRIVE VOLTAGE (V) 140 140 120 100 80 60 04650-0-021 40 20 30 20 6.7 7.7 8.7 9.7 10 120 100 80 60 40 04650-0-024 PROGRAMMED HYSTERESIS (mV) 160 40 5.7 Figure 18. Propagation Delay Error vs. Pulse Width 160 0 50 4.7 PULSE WIDTH (ns) Figure 15. Propagation Delay Error vs. Overdrive Voltage PROGRAMMED HYSTERESIS (mV) 1 Figure 17. Propagation Delay vs. Common-Mode Voltage 140 PROPAGATION DELAY ERROR (ps) 0 INPUT COMMON-MODE VOLTAGE (V) 20 0 0 0 50 100 IHYS (µA) RHYS (kΩ) Figure 19. Comparator Hysteresis vs. IHYS Figure 16. Comparator Hysteresis vs. RHYS Rev. D | Page 9 of 15 150 ADCMP563/ADCMP564 Data Sheet TIMING INFORMATION LATCH ENABLE 50% LATCH ENABLE tS tPL tH DIFFERENTIAL INPUT VOLTAGE VIN VREF ± VOS VOD tPDL tPLOH Q OUTPUT 50% tF tPDH Q OUTPUT tPLOL tR 04650-0-003 50% Figure 20. System Timing Diagram Figure 20 shows the compare and latch features of the ADCMP563. Table 4 describes the terms in the diagram. Table 4. Timing Descriptions Symbol tPDH Timing Input-to-Output High Delay tPDL Input-to-Output Low Delay tPLOH Latch Enable to Output High Delay tPLOL Latch Enable to Output Low Delay tH Minimum Hold Time tPL tS Minimum Latch Enable Pulse Width Minimum Setup Time tR Output Rise Time tF Output Fall Time VOD Voltage Overdrive Description Propagation delay measured from the time the input signal crosses the reference (± the input offset voltage) to the 50% point of an output low-to-high transition. Propagation delay measured from the time the input signal crosses the reference (± the input offset voltage) to the 50% point of an output high-to-low transition. Propagation delay measured from the 50% point of the latch enable signal low-to-high transition to the 50% point of an output low-to-high transition. Propagation delay measured from the 50% point of the latch enable signal low-to-high transition to the 50% point of an output high-to-low transition. Minimum time after the negative transition of the latch enable signal that the input signal must remain unchanged to be acquired and held at the outputs. Minimum time the latch enable signal must be high to acquire an input signal change. Minimum time before the negative transition of the latch enable signal that an input signal change must be present to be acquired and held at the outputs. Amount of time required to transition from a low to a high output as measured at the 20% and 80% points. Amount of time required to transition from a high to a low output as measured at the 20% and 80% points. Difference between the differential input and reference input voltages. Rev. D | Page 10 of 15 Data Sheet ADCMP563/ADCMP564 APPLICATION INFORMATION The ADCMP563/ADCMP564 comparators are very high speed devices. Consequently, high speed design techniques must be employed to achieve the best performance. The most critical aspect of any ADCMP563/ADCMP564 design is the use of a low impedance ground plane. A ground plane, as part of a multilayer board, is recommended for proper high speed performance. Using a continuous conductive plane over the surface of the circuit board can create this, allowing breaks in the plane only for necessary signal paths. The ground plane provides a low inductance ground, eliminating any potential differences at different ground points throughout the circuit board caused by ground bounce. A proper ground plane also minimizes the effects of stray capacitance on the circuit board. It is also important to provide bypass capacitors for the power supply in a high speed application. A 1 µF electrolytic bypass capacitor should be placed within 0.5 inches of each power supply pin to ground. These capacitors reduce any potential voltage ripples from the power supply. In addition, a 10 nF ceramic capacitor should be placed as close as possible from the power supply pins on the ADCMP563/ADCMP564 to ground. These capacitors act as a charge reservoir for the device during high frequency switching. The LATCH ENABLE input is active low (latched). If the latching function is not used, the LATCH ENABLE input can be left open or grounded (ground is an ECL logic high). The complementary input, LATCH ENABLE, can be left open or tied to −2.0 V. Leaving the latch inputs unconnected or providing the proper voltages disables the latching function. Occasionally, one of the two comparator stages within the ADCMP563/ADCMP564 is not used. The inputs of the unused comparator should not be allowed to float. The high internal gain can cause the output to oscillate (possibly affecting the comparator that is being used), unless the output is forced into a fixed state. This is easily accomplished by ensuring that the two inputs are at least one diode drop apart, while also appropriately connecting the LATCH ENABLE and LATCH ENABLE inputs as described previously. The best performance is achieved with the use of proper ECL terminations. The open emitter outputs of the ADCMP563/ ADCMP564 are designed to be terminated through 50 Ω resistors to −2.0 V, or any other equivalent ECL termination. If a −2.0 V supply is not available, an 82 Ω resistor to ground and a 130 Ω resistor to −5.2 V provide a suitable equivalent. If high speed ECL signals must be routed more than a centimeter, microstrip or stripline techniques may be required to ensure proper transition times and prevent output ringing. stray capacitance and inductance. Poor layout or improper termination can also cause reflections on the transmission line, further distorting the signal waveform. A high speed comparator can be used to recover the distorted waveform while maintaining a minimum of delay. OPTIMIZING HIGH SPEED PERFORMANCE As with any high speed comparator amplifier, proper design and layout techniques should be used to ensure optimal performance from the ADCMP563/ADCMP564. The performance limits of high speed circuitry all too often are the result of stray capacitance, improper ground impedance, or other layout issues. Minimizing resistance from source to the input is an important consideration in maximizing the high speed operation of the ADCMP563/ADCMP564. Source resistance, in combination with equivalent input capacitance, could cause a lagged response at the input, thus delaying the output. The input capacitance of the ADCMP563/ADCMP564, in combination with stray capacitance from an input pin to ground, could result in several picofarads of equivalent capacitance. A combination of 3 kΩ source resistance and 5 pF input capacitance yields a time constant of 15 ns, which is significantly slower than the 750 ps capability of the ADCMP563/ADCMP564. Source impedances should be significantly less than 100 Ω for best performance. Sockets should be avoided due to stray capacitance and inductance. If proper high speed techniques are used, the devices should be free from oscillation when the comparator input signal passes through the switching threshold. COMPARATOR PROPAGATION DELAY DISPERSION The ADCMP563/ADCMP564 have been specifically designed to reduce propagation delay dispersion over an input overdrive range of 100 mV to 1.5 V. Propagation delay overdrive dispersion is the change in propagation delay that results from a change in the degree of overdrive (how far the switching point is exceeded by the input). The overall result is a higher degree of timing accuracy because the ADCMP563/ADCMP564 are far less sensitive to input variations than most comparator designs. CLOCK TIMING RECOVERY Comparators are often used in digital systems to recover clock timing signals. High speed square waves transmitted over a distance, even tens of centimeters, can become distorted due to Rev. D | Page 11 of 15 ADCMP563/ADCMP564 Data Sheet Propagation delay dispersion is important in critical timing applications such as ATE, bench instruments, and nuclear instrumentation. Overdrive dispersion is defined as the variation in propagation delay as the input overdrive conditions are changed (Figure 21). For the ADCMP563/ADCMP564, overdrive dispersion is typically 75 ps as the overdrive is changed from 100 mV to 1.5 V. This specification applies for both positive and negative overdrive because the ADCMP563 and the ADCMP564 have equal delays for positive and negative going inputs. A current may be sourced into the HYS pin. The pin is biased approximately 1 V below AGND and has a 3 kΩ series resistance. The relationship between the current applied to the HYS pin and the resulting hysteresis is shown in Figure 19. –VH 2 +VH 2 0V INPUT 1 1.5V OVERDRIVE INPUT VOLTAGE 20mV OVERDRIVE 0 04650-0-005 VREF ± VOS Figure 22. Comparator Hysteresis Transfer Function 160 Figure 21. Propagation Delay Dispersion The addition of hysteresis to a comparator is often useful in a noisy environment, or where it is not desirable for the comparator to toggle between states when the input signal is at the switching threshold. The transfer function for a comparator with hysteresis is shown in Figure 22. If the input voltage approaches the threshold from the negative direction, the comparator switches from 0 to 1 when the input crosses +VH/2. The new switching threshold becomes −VH/2. The comparator remains in a 1 state until the threshold −VH/2 is crossed while coming from the positive direction. In this manner, noise centered on 0 V input does not cause the comparator to switch states unless it exceeds the region bounded by ±VH/2. The customary technique for introducing hysteresis into a comparator uses positive feedback from the output back to the input. A limitation of this approach is that the amount of hysteresis varies with the output logic levels, resulting in hysteresis that can be load dependent and is not symmetrical about the threshold. The external feedback network can also introduce significant parasitics, which reduce high speed performance and can induce oscillation in some cases. PROGRAMMED HYSTERESIS (mV) 140 COMPARATOR HYSTERESIS 120 100 80 60 40 04650-0-021 DISPERSION Q OUTPUT 04650-0-004 OUTPUT 20 0 50 40 30 20 10 0 RHYS (k) Figure 23. Comparator Hysteresis vs. RHYS MINIMUM INPUT SLEW RATE REQUIREMENT As for all high speed comparators, a minimum slew rate must be met to ensure that the device does not oscillate as the input crosses the threshold. This oscillation is due in part to the high input bandwidth of the comparator and the parasitics of the package. ADI recommends a slew rate of 1 V/μs or faster to ensure a clean output transition. If slew rates less than 1 V/μs are used, hysteresis can be added to prevent the oscillation. In the ADCMP564, hysteresis is generated through the programmable hysteresis pin. A resistor from the HYS pin to GND creates a current into the part that is used to generate hysteresis. Hysteresis generated in this manner is independent of output swing and is symmetrical around the trip point. The hysteresis vs. resistance curve is shown in Figure 23. Rev. D | Page 12 of 15 Data Sheet ADCMP563/ADCMP564 TYPICAL APPLICATION CIRCUITS VIN VREF VIN ADCMP563/ ADCMP564 ADCMP564 OUTPUTS VREF OUTPUTS HYS –2.0V 04650-0-007 –2.0V ALL RESISTORS 50Ω ALL RESISTORS 50Ω, UNLESS OTHERWISE NOTED Figure 24. High Speed Sampling Circuits +VREF VIN ADCMP563/ ADCMP564 04650-0-009 0Ω TO 80kΩ LATCH ENABLE INPUTS Figure 26. Adding Hysteresis Using the HYS Control Pin OUTPUTS –2V ADCMP563/ ADCMP564 OUTPUTS VIN 127Ω –2V ALL RESISTORS 50Ω UNLESS OTHERWISE NOTED 04650-0-008 LATCH ENABLE INPUTS ADCMP563/ ADCMP564 –5.2V Figure 25. High Speed Window Comparator 30Ω 50Ω 30Ω 50Ω 127Ω 04650-0-011 –VREF Figure 27. One Method to Interface an ECL Output to an Instrument with a 50 Ω to Ground Input Rev. D | Page 13 of 15 ADCMP563/ADCMP564 Data Sheet OUTLINE DIMENSIONS 0.197 (5.00) 0.193 (4.90) 0.189 (4.80) 16 9 0.158 (4.01) 0.154 (3.91) 0.150 (3.81) 1 8 0.010 (0.25) 0.006 (0.15) 0.069 (1.75) 0.053 (1.35) 0.065 (1.65) 0.049 (1.25) 0.010 (0.25) 0.004 (0.10) COPLANARITY 0.004 (0.10) 0.244 (6.20) 0.236 (5.99) 0.228 (5.79) 0.025 (0.64) BSC SEATING PLANE 0.012 (0.30) 0.008 (0.20) 8° 0° 0.020 (0.51) 0.010 (0.25) 0.050 (1.27) 0.016 (0.41) 0.041 (1.04) REF 09-12-2014-A COMPLIANT TO JEDEC STANDARDS MO-137-AB CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 28. 16-Lead Shrink Small Outline Package [QSOP] (RQ-16) Dimensions shown in inches and (millimeters) 0.345 (8.76) 0.341 (8.66) 0.337 (8.55) 20 11 10 0.010 (0.25) 0.004 (0.10) COPLANARITY 0.004 (0.10) 0.010 (0.25) 0.006 (0.15) 0.069 (1.75) 0.053 (1.35) 0.065 (1.65) 0.049 (1.25) 0.025 (0.64) BSC SEATING PLANE 0.012 (0.30) 0.008 (0.20) 8° 0° 0.050 (1.27) 0.016 (0.41) COMPLIANT TO JEDEC STANDARDS MO-137-AD CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 29. 20-Lead Shrink Small Outline Package [QSOP] (RQ-20) Dimensions shown in inches and (millimeters) Rev. D | Page 14 of 15 0.020 (0.51) 0.010 (0.25) 0.041 (1.04) REF 09-12-2014-A 1 0.158 (4.01) 0.154 (3.91) 0.150 (3.81) 0.244 (6.20) 0.236 (5.99) 0.228 (5.79) Data Sheet ADCMP563/ADCMP564 PIN 1 INDICATOR 0.30 0.23 0.18 0.50 BSC 13 PIN 1 INDICATOR 16 1 12 EXPOSED PAD 1.45 1.30 SQ 1.15 4 9 TOP VIEW 0.80 0.75 0.70 0.50 0.40 0.30 0.25 MIN BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF SEATING PLANE 5 8 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WEED. 111808-A 3.10 3.00 SQ 2.90 Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-16-21) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADCMP563BRQZ ADCMP563BCPZ-R2 ADCMP563BCPZ-RL7 ADCMP563BCPZ-WP ADCMP564BRQZ EVAL-ADCMP563BRQZ EVAL-ADCMP564BRQZ 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 16-Lead QSOP 16-Lead LFCSP 250 Unit Reel 16-Lead LFCSP 1,500 Unit Reel 16-Lead LFCSP 50 Unit Waffle Pack 20-Lead QSOP Evaluation Board Evaluation Board Z = RoHS Compliant Part. ©2007–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04650-0-4/16(D) Rev. D | Page 15 of 15 Package Option RQ-16 CP-16-21 CP-16-21 CP-16-21 RQ-20 Branding G01 G01 G01
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