Clock Generator PLL with Integrated VCO
ADF4360-9
Data Sheet
FEATURES
GENERAL DESCRIPTION
Primary output frequency range: 65 MHz to 400 MHz
Auxiliary divider from 2 to 31, output from 1.1 MHz to 200 MHz
3.0 V to 3.6 V power supply
1.8 V logic compatibility
Integer-N synthesizer
Programmable output power level
3-wire serial interface
Digital lock detect
Software power-down mode
The ADF4360-9 is an integrated integer-N synthesizer and
voltage-controlled oscillator (VCO). External inductors set the
ADF4360-9 center frequency. This allows a VCO frequency
range of between 65 MHz and 400 MHz.
An additional divider stage allows division of the VCO signal.
The CMOS level output is equivalent to the VCO signal divided
by the integer value between 2 and 31. This divided signal can
be further divided by 2, if desired.
Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging
from 3.0 V to 3.6 V and can be powered down when not in use.
APPLICATIONS
System clock generation
Test equipment
Wireless LANs
CATV equipment
FUNCTIONAL BLOCK DIAGRAM
AVDD
DVDD
RSET
ADF4360-9
REFIN
CLK
DATA
LE
LD
14-BIT R
COUNTER
24-BIT DATA
REGISTER
LOCK
DETECT
24-BIT
FUNCTION
LATCH
MUTE
PHASE
COMPARATOR
CHARGE
PUMP
CP
VVCO
VTUNE
L1
L2
CC
CN
VCO
CORE
13-BIT B
COUNTER
OUTPUT
STAGE
RFOUTA
RFOUTB
N=B
DIVIDE-BY-A
(2 TO 31)
DIVIDE-BY-2
AGND
DGND
CPGND
DIVOUT
07139-001
MULTIPLEXER
Figure 1.
Rev. D
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ADF4360-9
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Input Shift Register .................................................................... 10
Applications ....................................................................................... 1
VCO ............................................................................................. 11
General Description ......................................................................... 1
Output Stage................................................................................ 12
Functional Block Diagram .............................................................. 1
DIVOUT Stage............................................................................ 12
Revision History ............................................................................... 2
Latch Structure ........................................................................... 13
Specifications..................................................................................... 3
Power-Up ..................................................................................... 17
Timing Characteristics ................................................................ 5
Control Latch .............................................................................. 18
Absolute Maximum Ratings............................................................ 6
N Counter Latch ......................................................................... 19
Transistor Count ........................................................................... 6
R Counter Latch ......................................................................... 19
ESD Caution .................................................................................. 6
Applications Information .............................................................. 20
Pin Configuration and Function Descriptions ............................. 7
Choosing the Correct Inductance Value ................................. 20
Typical Performance Characteristics ............................................. 8
Encode Clock for ADC.............................................................. 20
Circuit Description ......................................................................... 10
GSM Test Clock .......................................................................... 21
Reference Input Section ............................................................. 10
Interfacing ................................................................................... 22
N Counter .................................................................................... 10
PCB Design Guidelines for Chip Scale Package .................... 22
R Counter .................................................................................... 10
Output Matching ........................................................................ 23
PFD and Charge Pump .............................................................. 10
Outline Dimensions ....................................................................... 24
Lock Detect ................................................................................. 10
Ordering Guide .......................................................................... 24
REVISION HISTORY
5/2016—Rev. C to Rev. D
Changed ADF4360 Family to ADF4360-9 and
ADSP-21xx to ADSP-2181 ........................................... Throughout
Changes to Figure 3 .......................................................................... 7
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 24
11/2012—Rev. B to Rev. C
Changes to Table 3 ............................................................................ 6
Updated Outline Dimensions ....................................................... 24
2/2012—Rev. A to Rev. B
Added EPAD Note ............................................................................ 7
Updated Outline Dimensions ....................................................... 24
Changes to Ordering Guide .......................................................... 24
3/2008—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................ 3
Changes to Figure 23 ...................................................................... 14
Changes to Output Matching Section .......................................... 23
1/2008—Revision 0: Initial Version
Rev. D | Page 2 of 24
Data Sheet
ADF4360-9
SPECIFICATIONS
AVDD = DVDD = VVCO = 3.3 V ± 10%; AGND = DGND = 0 V; TA = TMIN to TMAX, unless otherwise noted. 1
Table 1.
Parameter
REFIN CHARACTERISTICS
REFIN Input Frequency
B Version
Unit
Test Conditions/Comments
10/250
MHz min/MHz max
0.7/AVDD
0 to AVDD
5.0
±60
V p-p min/V p-p max
V max
pF max
µA max
For f < 10 MHz, use a dc-coupled, CMOS-compatible
square wave, slew rate > 21 V/µs
AC-coupled
CMOS-compatible
8
MHz max
2.5
0.312
2.7/10
0.2
2
1.5
2
mA typ
mA typ
kΩ min/kΩ max
nA typ
% typ
% typ
% typ
1.5
0.6
±1
3.0
V min
V max
µA max
pF max
DVDD − 0.4
500
0.4
V min
µA max
V max
3.0/3.6
AVDD
AVDD
5
2.5
12.0
3.5 to 11.0
7
V min/V max
400
MHz
Minimum VCO Output Frequency
VCO Output Frequency
65
90/108
MHz
MHz min/MHz max
VCO Frequency Range
VCO Sensitivity
1.2
2
Ratio
MHz/V typ
Lock Time 6
Frequency Pushing (Open Loop)
Frequency Pulling (Open Loop)
Harmonic Content (Second)
400
0.24
10
−16
µs typ
MHz/V typ
Hz typ
dBc typ
REFIN Input Sensitivity
REFIN Input Capacitance
REFIN Input Current
PHASE DETECTOR
Phase Detector Frequency 2
CHARGE PUMP
ICP Sink/Source 3
High Value
Low Value
RSET Range
ICP Three-State Leakage Current
Sink and Source Current Matching
ICP vs. VCP
ICP vs. Temperature
LOGIC INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current, IINH/IINL
Input Capacitance, CIN
LOGIC OUTPUTS
Output High Voltage, VOH
Output High Current, IOH
Output Low Voltage, VOL
POWER SUPPLIES
AVDD
DVDD
VVCO
AIDD 4
DIDD4
IVCO4, 5
IRFOUT4
Low Power Sleep Mode4
RF OUTPUT CHARACTERISTICS5
Maximum VCO Output Frequency
With RSET = 4.7 kΩ
mA typ
mA typ
mA typ
mA typ
µA typ
Rev. D | Page 3 of 24
1.25 V ≤ VCP ≤ 2.5 V
1.25 V ≤ VCP ≤ 2.5 V
VCP = 2.0 V
CMOS output chosen
IOL = 500 µA
ICORE = 5 mA
RF output stage is programmable
ICORE = 5 mA; depending on L1 and L2; see the
Choosing the Correct Inductance Value section
L1, L2 = 270 nH; see the Choosing the Correct
Inductance Value section for other frequency values
fMAX/fMIN
L1, L2 = 270 nH; see the Choosing the Correct
Inductance Value section for other sensitivity values
To within 10 Hz of final frequency
Into 2.00 VSWR load
ADF4360-9
Parameter
Harmonic Content (Third)
Output Power5, 7
Data Sheet
B Version
−21
−9/0
Unit
dBc typ
dBm typ
−14/−9
dBm typ
Output Power Variation
VCO Tuning Range
VCO NOISE CHARACTERISTICS
VCO Phase Noise Performance 9,10
±3
1.25/2.5
dB typ
V min/V max
−91
−117
−139
−140
−147
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
dBc/Hz typ
At 10 kHz offset from carrier
At 100 kHz offset from carrier
At 1 MHz offset from carrier
At 3 MHz offset from carrier
At 10 MHz offset from carrier
Normalized In-Band Phase Noise 10, 11
In-Band Phase Noise10, 11
RMS Integrated Jitter 12
Spurious Signals Due to PFD Frequency 13
DIVOUT CHARACTERISTICS12
Integrated Jitter Performance
(Integrated from 100 Hz to 1 GHz)
DIVOUT = 180 MHz
DIVOUT = 95 MHz
DIVOUT = 80 MHz
DIVOUT = 52 MHz
−218
−110
1.4
−75
dBc/Hz typ
dBc/Hz typ
ps typ
dBc typ
At 1 kHz offset from carrier
Measured at RFOUTA
Output Power5, 8
DIVOUT = 45 MHz
DIVOUT = 10 MHz
DIVOUT Duty Cycle
A Output
A/2 Output
Test Conditions/Comments
Using tuned load, programmable in 3 dB steps;
see Figure 35
Using 50 Ω resistors to VVCO, programmable in
3 dB steps; see Figure 33
VCO frequency = 320 MHz to 380 MHz
1.4
1.4
1.4
1.4
ps rms
ps rms
ps rms
ps rms
1.4
1.6
ps rms
ps rms
1/A × 100
50
% typ
% typ
A = 2, A output selected
A = 2, A/2 output selected
A = 2, A/2 output selected
A = 3, A/2 output selected (VCO = 312 MHz,
PFD = 1.6 MHz)
A = 4, A/2 output selected
A = 18, A/2 output selected (VCO = 360 MHz,
PFD = 1.6 MHz)
Divide-by-A selected
Divide-by-A/2 selected
Operating temperature range is −40°C to +85°C.
Guaranteed by design. Sample tested to ensure compliance.
ICP is internally modified to maintain constant loop gain over the frequency range.
4
TA = 25°C; AVDD = DVDD = VVCO = 3.3 V.
5
Unless otherwise stated, these characteristics are guaranteed for VCO core power = 5 mA. L1, L2 = 270 nH, 470 Ω resistors to GND in parallel with L1, L2.
6
Jumping from 90 MHz to 108 MHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz.
7
For more detail on using tuned loads, see the Output Matching section.
8
Using 50 Ω resistors to VVCO into a 50 Ω load.
9
The noise of the VCO is measured in open-loop conditions. L1, L2 = 56 nH.
10
The phase noise is measured with the EV-ADF4360-9EB1Z evaluation board and the Agilent E5052A signal source analyzer.
11
fREFIN = 10 MHz; fPFD = 1 MHz; N = 360; loop bandwidth = 40 kHz. The normalized phase noise floor is estimated by measuring the in-band phase noise at the output of
the VCO and subtracting 20logN (where N is the N divider value) and 10logfPFD. PNSYNTH = PNTOT − 10logfPFD − 20logN.
12
The jitter is measured with the EV-ADF4360-9EB1Z evaluation board and the Agilent E5052A signal source analyzer. A low noise TCXO provides the REFIN for the
synthesizer, and the jitter is measured over the instrument’s jitter measurement bandwidth. fREFIN = 10 MHz; fPFD = 1 MHz; N = 360; loop bandwidth = 40 kHz, unless
otherwise noted.
13
The spurious signals are measured with the EV-ADF4360-9EB1Z evaluation board and the Agilent E5052A signal source analyzer. The spectrum analyzer provides the
REFIN for the synthesizer; fREFIN = 10 MHz at 0 dBm. fREFIN = 10 MHz; fPFD = 1 MHz; N = 360; loop bandwidth = 40 kHz.
1
2
3
Rev. D | Page 4 of 24
Data Sheet
ADF4360-9
TIMING CHARACTERISTICS 1
AVDD = DVDD = VVCO = 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter
t1
t2
t3
t4
t5
t6
t7
Unit
ns min
ns min
ns min
ns min
ns min
ns min
ns min
Test Conditions/Comments
LE setup time
DATA to CLK setup time
DATA to CLK hold time
CLK high duration
CLK low duration
CLK to LE setup time
LE pulse width
Refer to the Power-Up section for the recommended power-up procedure for this device.
t4
t5
CLK
t2
DATA
DB23 (MSB)
t3
DB22
DB2
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t7
LE
t1
t6
07139-002
1
Limit at TMIN to TMAX (B Version)
20
10
10
25
25
10
20
LE
Figure 2. Timing Diagram
Rev. D | Page 5 of 24
ADF4360-9
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
AVDD to GND 1
AVDD to DVDD
VVCO to GND
VVCO to AVDD
Digital Input/Output Voltage to GND
Analog Input/Output Voltage to GND
REFIN to GND
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
LFCSP θJA Thermal Impedance
Paddle Soldered
Paddle Not Soldered
Lead Temperature, Soldering Reflow
1
Rating
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to + 85°C
−65°C to +150°C
150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
This device is a high performance RF integrated circuit with an
ESD rating of