ADM209AR

a FEATURES 0.1 F to 10 F Capacitors 120 kB/s Data Rate 2 Receivers Active in Shutdown (ADM213) On-Board DC-DC Converters 9 V Output Swing with +5 V Supply Low Power (15 mW) Low Power Shutdown ≤5 W 30 V Receiver Input Levels Latch-Up FREE Plug-In Upgrade for MAX205-211/213 APPLICATIONS Computers Peripherals Modems Printers Instruments 0.1 F, +5 V Powered CMOS RS-232 Drivers/Receivers ADM205–ADM211/ADM213 TYPICAL OPERATING CIRCUIT +5V INPUT 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER V CC 11 V+ 13 V– 17 0.1µF 16V 0.1µF 6.3V 0.1µF 16V 0.1µF 0.1µF 16V T1 IN T2 IN T3 IN T4 IN R1 OUT R2 OUT TTL/CMOS OUTPUTS R3 OUT R4 OUT R5 OUT EN 7 6 20 21 8 5 26 22 19 24 T1 T2 T3 T4 R1 R2 R3 R4 R5 GND 10 2 3 1 28 9 4 27 23 18 25 T1 OUT T2 OUT T3 OUT T4 OUT R1 IN R2 IN R3 IN R4 IN R5 IN SD RS-232 INPUTS** TTL/CMOS INPUTS* RS-232 OUTPUTS ADM211 *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT GENERAL DESCRIPTION The ADM2xx family of line drivers/receivers is intended for all EIA-232-E and V.28 communications interfaces, especially in applications where ± 12 V is not available. The ADM205, ADM206, ADM211 and ADM213 feature a low power shutdown mode which reduces power dissipation to less than 5 µW making them ideally suited for battery powered equipment. The ADM205 does not require any external components and is particularly useful in applications where printed circuit board space is critical. The ADM213 has an active-low shutdown and an active-high receiver enable control. Two receivers of the ADM213 remain active during shutdown. This feature is useful for ring indicator monitoring. All members of the ADM2xx family, except the ADM209, include two internal charge pump voltage converters which allow operation from a single +5 V supply. These converters convert the +5 V input power to the ± 10 V required for RS-232 output levels. The ADM209 is designed to operate from +5 V and +12 V supplies. An internal +12 V to –12 V charge pump voltage converter generates the –12 V supply. Table I. Selection Table Part Number ADM205 ADM206 ADM207 ADM208 ADM209 ADM211 ADM213 Power Supply Voltage +5 V +5 V +5 V +5 V +5 V & +9 V to +13.2 V +5 V +5 V No. of RS-232 Drivers 5 4 5 4 3 4 4 No. of RS-232 Receivers 5 3 3 4 5 5 5 External Capacitors None 4 4 4 2 4 4 Low Power Shutdown (SD) Yes Yes No No No Yes Yes (SD) TTL Three-State EN Yes Yes No No Yes Yes Yes (EN) No. of Receivers Active in Shutdown 0 0 0 0 0 0 2 REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. © Analog Devices, Inc., 1994 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703 ADM205–ADM211/ADM213–SPECIFICATIONS Parameter Output Voltage Swing VCC Power Supply Current V+ Power Supply Current Shutdown Supply Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Logic Pull-Up Current RS-232 Input Voltage Range RS-232 Input Threshold Low RS-232 Input Threshold High RS-232 Input Hysteresis RS-232 Input Resistance TTL/CMOS Output Voltage Low, VOL TTL/CMOS Output Voltage High, VOH TTL/CMOS Output Leakage Current Output Enable Time (TEN) Output Disable Time (TDIS) Propagation Delay Instantaneous Slew Ratel Transition Region Slew Rate Output Resistance RS-232 Output Short Circuit Current NOTE 1 Sample tested to ensure compliance. Specifications subject to change without notice. (VCC = +5 V 10% (206, 207, 208, 2O9, 211, 213); VCC = +5 V 5% (ADM205); V+ = +9 V to +13.2 V (ADM209); C1–C4 = 0.1 F Ceramic. All Specifications TMIN to TMAX unless otherwise noted.) Min ±5 Typ ±9 3 5 0.4 3.5 1 2.0 10 –30 0.8 0.2 3 3.5 0.05 115 165 0.5 25 6 ± 12 5 30 1.2 1.7 0.5 5 25 +30 2.4 1.0 7 0.4 ±5 7 9 1 5 5 0.8 Max Units Volts mA mA mA mA µA V V µA V V V V kΩ V V µA ns ns µs V/µs V/µs Ω mA Test Conditions/Comments All Transmitter Outputs Loaded with 3 kΩ to Ground No Load, ADM206, ADM211, ADM213 No Load, ADM205, ADM207, ADM208 No Load, ADM209 No Load, V+ = 12 V ADM209 Only TIN, EN, SD, EN, SD TIN, EN, SD, EN, SD TIN = 0 V 3 300 ± 60 IOUT = 1.6 mA IOUT = –1.0 mA EN = VCC, EN = 0 V, 0 V ≤ ROUT ≤ VCC ADM205, ADM206, ADM209, ADM211 (Figure 25. CL = 150 pF) ADM205, ADM206, ADM209, ADM211 (Figure 25. RL = 1 kΩ) RS-232 to TTL CL = 10 pF, RL = 3-7 kΩ, TA = +25°C RL = 3 kΩ, CL = 2500 pF Measured from +3 V to –3 V or –3 V to +3 V VCC = V+ = V– = 0 V, VOUT = ± 2 V (TA = +25°C unless otherwise noted) VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC – 0.3 V) to +14 V V– . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V–, –0.3 V) ROUT . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Power Dissipation N-24 DIP (Derate 13.5 mW/°C above +70°C) . . . 1000 mW N-24A DIP (Derate 13.5 mW/°C above +70°C) . . 500 mW R-24 SOIC (Derate 12 mW/°C above +70°C) . . . . . 850 mW R-28 SOIC (Derate 12.5 mW/°C above +70°C) . . 900 mW RS-28 SSOP (Derate 10 mW/°C above +70°C) . . . . 900 mW Q-24 Cerdip (Derate 12.5 mW/°C above +70°C) . 1000 mW D-24 Ceramic (Derate 20 mW/°C above +70°C) . . 1000 mW ABSOLUTE MAXIMUM RATINGS* Thermal Impedance, θJA N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C/W R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105°C/W Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55°C/W D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50°C/W Operating Temperature Range Industrial (A Version) . . . . . . . . . . . . . . . . . -40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . . +300°C Vapour Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . +215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . > 2000 V *This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. –2– REV. 0 ADM205–ADM211/ADM213 ORDERING GUIDE Temperature Range –40°C to +85°C Package Option* N-24A Temperature Range Package Option* Model N-24 R-24 RS-24 N-24 R-24 RS-24 Temperature Range Package Option* N-24 R-24 RS-24 R-28 RS-28 Model ADM205 ADM205AN Model ADM206 ADM206AN –40°C to +85°C ADM206AR –40°C to +85°C ADM206ARS –40°C to +85°C ADM209 ADM209AN –40°C to +85°C ADM209AR –40°C to +85°C ADM209ARS –40°C to +85°C ADM207 ADM207AN –40°C to +85°C ADM207AR –40°C to +85°C ADM207ARS –40°C to +85°C ADM211 ADM211AR –40°C to +85°C ADM211ARS –40°C to +85°C ADM208 ADM208AN –40°C to +85°C ADM208AR –40°C to +85°C ADM208ARS –40°C to +85°C ADM213 ADM213AR –40°C to +85°C ADM213ARS –40°C to +85°C N-24 R-24 RS-24 R-28 RS-28 *N = Plastic DIP; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP). +5V INPUT T4OUT T3OUT T1OUT T2OUT R2 IN R2 OUT T2IN T1IN R1 OUT 1 2 3 4 5 6 7 8 9 24 23 22 21 R3 IN R3 OUT T5 IN SD T1 IN T2 IN TTL/CMOS INPUTS * T3 IN T4 IN T5 IN R1 OUT R2 OUT TTL/CMOS OUTPUTS R3 OUT R4 OUT R5 OUT EN 8 T1 12 VCC 0.1µF 3 T1OUT T2OUT T3OUT T4OUT T5OUT R1 IN R2 IN R3 IN R4 IN R5 IN SD RS-232 INPUTS ** RS-232 OUTPUTS 20 EN 7 15 16 T2 4 2 1 ADM205 Top View (Not to Scale) 19 18 17 16 15 14 13 T5 OUT R4 IN R4 OUT T4 IN T3 IN R5 OUT R5 IN T3 T4 22 T5 R1 19 10 R1 IN 10 GND 11 VCC 12 9 6 R2 5 Figure 1. ADM205 DIP Pin Configuration 23 17 R3 R4 24 18 14 R5 13 20 GND 11 ADM205 21 * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 2. ADM205 Typical Operating Circuit REV. 0 –3– ADM205–ADM211/ADM213 T3OUT T1OUT T2OUT R1 IN R1 OUT T2IN T1IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T4OUT T3OUT T1OUT T2OUT R1 IN R1 OUT T2IN T1IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T4OUT 23 R2 IN 22 21 R2 OUT SD 23 R2IN 22 21 20 R2 OUT T5IN T5 OUT T4IN T3IN R3 OUT R3IN V– C2– C2+ 20 EN ADM206 Top View (Not to Scale) 19 18 17 16 15 14 13 T4IN T3IN R3 OUT R3IN V– C2– C2+ ADM207 Top View (Not to Scale) 19 18 17 16 15 14 13 V+ 11 C1– 12 V+ 11 C1– 12 Figure 3. ADM206 DIP/SOIC/SSOP Pin Configuration Figure 5. ADM207 DIP/SOIC/SSOP Pin Configuration +5V INPUT +5V INPUT 0.1µF 6.3V 10 C1+ 12 C1– 13 C2+ 14 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 9 V+ 11 0.1µF 6.3V 0.1µF 0.1µF 6.3V 10 C1+ 12 C1– 13 C2+ 14 C2– 7 +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 9 V+ 11 0.1µF 6.3V 0.1µF 0.1µF 16V V– 15 0.1µF 16V 0.1µF 16V T1IN T1OUT T2IN V– 15 0.1µF 16V T1OUT T2OUT T3OUT T4OUT T5OUT R1 IN R2 IN R3 IN RS-232 INPUTS ** RS-232 OUTPUTS 7 T1 T2 2 T1IN T2IN T3IN T4IN R1 OUT TTL/CMOS OUTPUTS R2 OUT R3 OUT EN T1 2 6 3 6 T2 3 TTL/CMOS INPUTS * T2OUT T3OUT RS-232 OUTPUTS TTL/CMOS INPUTS * T3IN T4IN 18 19 T3 1 24 18 19 5 22 T3 1 24 4 23 T4 T4 R1 T4OUT T5IN R1 IN R1 OUT 5 22 R1 4 23 R2 IN R3 IN R3 OUT 17 GND 8 R3 16 SD RS-232 INPUTS ** 21 T5 20 R2 TTL/CMOS OUTPUTS R2 OUT R2 17 20 GND 8 R3 16 21 ADM206 ADM207 * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 4. ADM206 Typical Operating Circuit Figure 6. ADM207 Typical Operating Circuit –4– REV. 0 ADM205–ADM211/ADM213 T2OUT T1OUT R2 IN R2OUT T1IN R1 OUT R1 IN GND VCC C1+ 1 2 3 4 5 6 7 8 9 10 24 T3OUT R1 OUT R1 IN GND VCC V+ C+ C– V– R5 IN R5 OUT R4 OUT R4 IN 1 2 3 4 5 6 7 8 9 10 11 12 NC = NO CONNECT 24 T1IN 23 R3IN 22 21 20 R3 OUT T4IN T4 OUT T3IN T2IN R4 OUT R4IN V– C2– C2+ 23 T2IN 22 21 20 R2OUT R2 IN T2OUT T1OUT R3 IN R3OUT T3IN NC EN T3OUT ADM208 Top View (Not to Scale) 19 18 17 16 15 14 13 ADM209 Top View (Not to Scale) 19 18 17 16 15 14 13 V+ 11 C1– 12 Figure 7. ADM208 DIP/SOIC/SSOP Pin Configuration Figure 9. ADM209 DIP/SOIC/SSOP Pin Configuration +5V INPUT +5V INPUT 0.1µF 0.1µF VCC 4 V+ 5 0.1µF 16V T1IN 24 T1 19 T1OUT T2OUT T3OUT R1 IN R2 IN RS-232 INPUTS ** RS-232 OUTPUTS +9V TO +13.2V INPUT 0.1µF 6.3V 10 C1+ 12 C1– 13 C2+ 14 C2– 5 +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER VCC 9 V+ 11 0.1µF 6.3V 0.1µF 16V 6 7 C1+ C1– +12V TO –12V VOLTAGE INVERTER V– 8 0.1µF 16V V– 15 0.1µF 16V T1OUT T2OUT T3OUT T4OUT R1 IN R2 IN RS-232 INPUTS ** R4 OUT R5 OUT 11 R4 12 T1IN T2IN T3IN T4IN R1 OUT R2 OUT R3 OUT R4 OUT T1 2 TTL/CMOS INPUTS * RS-232 OUTPUTS T2IN T3IN R1 OUT R2 OUT 23 T2 20 18 T2 1 TTL/CMOS INPUTS * 16 1 22 T3 R1 R2 13 2 21 19 21 6 4 T3 24 20 7 3 T4 R1 TTL/CMOS OUTPUTS R3 OUT 17 R3 18 R3 IN R4 IN R5 IN NC R2 TTL/CMOS OUTPUTS 22 17 GND 8 R3 R3 23 16 R3 IN 10 14 R5 9 15 R4 IN EN ADM208 GND 3 ADM209 *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT Figure 8. ADM208 Typical Operating Circuit Figure 10. ADM209 Typical Operating Circuit REV. 0 –5– ADM205–ADM211/ADM213 T3OUT T1OUT T2OUT R2 IN R2 OUT T2IN T1IN R1 OUT R1 IN 1 2 3 4 5 6 7 8 9 T3OUT 1 2 3 4 5 6 7 8 9 28 T4OUT 28 T4OUT T1OUT T2OUT R2 IN R2 OUT 27 R3 IN 26 R3 OUT 25 24 23 SD EN R4 IN * 27 R3IN 26 R3 OUT 25 24 23 SD EN T2IN R4IN T1IN R1 OUT R1 IN ADM211 Top View (Not to Scale) 22 R4 OUT 21 20 T4IN T3IN ADM213 Top View (Not to Scale) 22 R4 OUT * 21 20 T4IN T3IN GND 10 VCC 11 19 R5 OUT * 18 R5 IN * 17 16 15 V– C2– C2+ GND 10 VCC 11 19 R5 OUT 18 R5IN 17 16 15 V– C1+ 12 V+ 13 C1+ 12 V+ 13 C1– 14 C2– C1– 14 C2+ * ACTIVE IN SHUTDOWN Figure 11. ADM211 SOIC/SSOP Pin Configuration +5V INPUT 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER T1 T2 T3 T4 R1 R2 R3 R4 R5 GND 10 VCC 11 V+ 13 V– 17 Figure 13. ADM213 SOIC/SSOP Pin Configuration +5V INPUT 12 C1+ 14 C1– 15 C2+ 16 C2– +5V TO +10V VOLTAGE DOUBLER +10V TO –10V VOLTAGE INVERTER T1 T2 T3 T4 R1 R2 R3 R4 R5 GND 10 VCC 11 V+ 13 V– 17 0.1µF 16V 0.1µF 16V 0.1µF 6.3V 0.1µF 0.1µF 16V 0.1µF 16V 0.1µF 6.3V 0.1µF 0.1µF 16V T1OUT 0.1µF 16V T1OUT T2OUT T3OUT T4OUT R1 IN R2 IN R3 IN R4 IN *** RS-232 INPUTS ** R5 IN *** SD RS-232 OUTPUTS T1IN 7 6 20 21 8 5 26 22 19 24 2 3 1 28 9 4 27 23 18 25 T1IN T2IN TTL/CMOS INPUTS * T3IN T4IN R1 OUT R2 OUT R3 OUT TTL/CMOS OUTPUTS R4 OUT R5 OUT EN 7 6 20 21 8 5 26 22 19 24 2 3 1 28 9 4 27 23 18 25 T2IN T2OUT T3OUT T4OUT RS-232 OUTPUTS TTL/CMOS INPUTS * T3IN T4IN R1 OUT R1 IN R2 OUT R2 IN R3 OUT R3 IN R4 IN R5 IN EN RS-232 INPUTS ** TTL/CMOS OUTPUTS R4 OUT *** R5 OUT *** ADM213 ADM211 SD *INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT **INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT * INTERNAL 400kΩ PULL-UP RESISTOR ON EACH TTL/CMOS INPUT ** INTERNAL 5kΩ PULL-DOWN RESISTOR ON EACH RS-232 INPUT *** ACTIVE IN SHUTDOWN Figure 12. ADM211 Typical Operating Circuit Figure 14. ADM213 Typical Operating Circuit –6– REV. 0 ADM205–ADM211/ADM213 PIN FUNCTION DESCRIPTION Mnemonic VCC V+ Function Power Supply Input 5 V ± 10% (+5 V ± 5% ADM205). Internally generated positive supply (+10 V nominal) on all parts except ADM209. ADM209 requires external 9 V to 13.2 V supply. V– GND C+ C– C1+ C1– C2+ C2– TIN TOUT RIN ROUT EN/EN Internally generated negative supply (–10 V nominal). Ground pin. Must be connected to 0 V. (ADM209 only) External capacitor (+ terminal) is connected to this pin. (ADM209 only) External capacitor (– terminal) is connected to this pin. (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin. (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (– terminal) is connected to this pin. (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (+ terminal) is connected to this pin. (ADM206, ADM207, ADM208, ADM211, ADM213) External capacitor (– terminal) is connected to this pin. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to Vcc is connected on each input. Transmitter (Driver) Outputs. These are RS-232 levels (typically ± 10 V). Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected on each input. Receiver Outputs. These are TTL/CMOS levels. Enable Input. Active low on ADM205, ADM206, ADM209, ADM211. Active high on ADM213. This input is used to enable/disable the receiver outputs. With EN = Low (EN = High ADM213), the receiver outputs are enabled. With EN =High (EN = low ADM213), the outputs are placed in a high impedance state. This facility is useful for connecting to microprocessor systems. Shutdown Input. Active high on ADM205, ADM206, ADM211. Active low on ADM213. With SD = high on the ADM205, ADM206, ADM211, the charge pump is disabled, the receiver outputs are placed in a high impedance state and the driver outputs are turned off. With SD low on the ADM213, the charge pump is disabled, the driver outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power consumption reduces to 5 µW. No Connect. No connections are required to this pin. Table II. ADM205, ADM206, ADM211 Truth Table SD/SD NC SD 0 0 1 EN 0 1 0 Status Normal Operation Normal Operation Shutdown Transmitters T1–T5 Enabled Enabled Disabled Receivers R1–R5 Enabled Disabled Disabled Table III. ADM213 Truth Table SD 0 0 1 1 EN 0 1 0 1 Status Shutdown Shutdown Normal Operation Normal Operation Transmitters T1-T4 Disabled Disabled Enabled Enabled Receivers R1-R3 Disabled Disabled Disabled Enabled Receivers R4, R5 Disabled Enabled Disabled Enabled REV. 0 –7– ADM205–ADM211/ADM213–Typical Performance Characteristics 10 10 8 V+ | V– | 6 VOUT – V VOUT — Volts VOUT (1 O/P LOADED) 8 4 VOUT (ALL O/Ps LOADED) 6 2 0 0 10 20 IOUT — mA 30 40 4 3.0 4.0 VCC – V 5.0 Figure 15. Charge Pump V+, V– vs. Current Figure 17. Transmitter Output Voltage vs. VCC 18 12 16 10 T OUT HIGH 8 14 SLEW RATE – V/µs TOUT – V 12 10 6 T OUT LOW 4 8 6 2 4 0 500 1000 1500 CAPACITIVE LOAD – pF 2000 2500 0 0 2 4 IOUT – mA 6 8 Figure 16. Transmitter Slew Rate vs. Load Capacitance Figure 18. Transmitter Output Voltage vs. Current 300 V– (UNLOADED) V+, V– IMPEDANCE – Ω 200 V– (LOADED) V+ (UNLOADED) 100 V+ (LOADED) 0 3 4 VCC – V 5 Figure 19. Charge Pump Impedance vs. VCC –8– REV. 0 ADM205–ADM211/ADM213 A3 100 90 0.8 V The ADM205, ADM206, ADM211, and ADM213 are particularly useful in battery powered systems as they feature a low power shutdown mode which reduces power dissipation to less than 5 µW. The ADM205 is designed for applications where space saving is important as the charge pump capacitors are molded into the package. 10 0% The ADM209 includes only a negative charge pump converter and are intended for applications where a positive 12 V is available. 5V 5V B Lw 5 1Ms H O Figure 20. Charge Pump, V+, V– Exiting Shutdown A3 100 90 0.8 V To facilitate sharing a common line or for connection to a microprocessor data bus the ADM205, ADM206, ADM209, ADM211 and ADM213 feature an enable (EN) function. When disabled, the receiver outputs are placed in a high impedance state. CIRCUIT DESCRIPTION The internal circuitry in the ADM205-ADM211 and ADM213 consists of three main sections. These are: (a) A charge pump voltage converter (b) RS-232 to TTL/CMOS receivers (c) TTL/CMOS to RS-232 transmitters 5V B Lw 10 0% 5 5µs H O Charge Pump DC-DC Voltage Converter Figure 21. Transmitter Output Loaded Slew Rate A3 100 90 0.8 V The charge pump voltage converter consists of an oscillator and a switching matrix. The converter generates a ± 10 V supply from the input 5 V level. This is done in two stages using a switched capacitor technique as illustrated in Figures 23 and 24. First, the 5 V input supply is doubled to 10 V using capacitor C1 as the charge storage element. The 10 V level is then inverted to generate –10 V using C2 as the storage element. S1 VCC C1 C3 S4 VCC S3 V+ = 2V CC S2 GND 10 0% 5V B Lw 5 1µs H O Figure 22. Transmitter Output Unloaded Slew Rate GENERAL INFORMATION INTERNAL OSCILLATOR Figure 23. Charge-Pump Voltage Doubler S1 V+ FROM VOLTAGE DOUBLER GND C2 S2 S4 V– = – (V+) C4 S3 GND The ADM205-ADM211 and ADM213 family of RS-232 drivers/receivers are designed to solve interface problems by meeting the EIA-232-E specifications while using a single digital +5 V supply. The EIA-232-E standard requires transmitters which will deliver ± 5 V minimum on the transmission channel and receivers which can accept signal levels down to ± 3 V. The ADM205-ADM211 and ADM213 meet these requirements by integrating step up voltage converters and level shifting transmitters and receivers onto the same chip. CMOS technology is used to keep the power dissipation to an absolute minimum. A comprehensive range of transmitter/receiver combinations is available to cover most communications needs. The ADM205– ADM211 and ADM213 are modifications, enhancements and improvements to the AD230–AD241 family and derivatives thereof. They are essentially plug-in compatible and do not have materially different applications. INTERNAL OSCILLATOR Figure 24. Charge-Pump Voltage Inverter Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be reduced if higher levels of ripple are acceptable. The charge pump capacitors C1 and C2 may also be reduced at the expense of higher output impedance on the V+ and V– supplies. The V+ and V– supplies may also be used to power external circuitry if the current requirements are small. REV. 0 –9– ADM205–ADM211/ADM213 Transmitter (Driver) Section Enable Input The drivers convert TTL/CMOS input levels into EIA-232-E output levels. With VCC = +5 V and driving a typical EIA-232-E load, the output voltage swing is ± 9 V. Even under worst case conditions the drivers are guaranteed to meet the ± 5 V EIA-232-E minimum requirement. The input threshold levels are both TTL and CMOS compatible with the switching threshold set at VCC/4. With a nominal VCC = 5 V the switching threshold is 1.25 V typical. Unused inputs may be left unconnected, as an internal 400 kΩ pull-up resistor pulls them high forcing the outputs into a low state. As required by the EIA-232-E standard, the slew rate is limited to less than 30 V/µs without the need for an external slew limiting capacitor and the output impedance in the power-off state is greater than 300 Ω. Receiver Section The ADM205, ADM209, ADM211, and ADM213 feature an enable input used to enable or disable the receiver outputs. The enable input is active low on the ADM205, ADM209, ADM211 and active-high on the ADM213. Refer to Tables II and III. When disabled, all receiver outputs are placed in a high impedance state. This function allows the outputs to be connected directly to a microprocessor data bus. It can also be used to allow receivers from different devices to share a common data line. The timing diagram for the enable function is shown in Figure 25. 3V EN* 0V TEN 3.5V ROUT 0.8V * POLARITY OF EN IS REVERSED FOR ADM213 TDIS VOH – 0.1V VVOL + 0.1V The receivers are inverting level shifters which accept EIA-232-E input levels (± 5 V to ± 15 V) and translate them into 5 V TTL/ CMOS levels. The inputs have internal 5 kΩ pull-down resistors to ground and are also protected against overvoltages of up to ± 30 V. The guaranteed switching thresholds are 0.8 V minimum and 2.4 V maximum which are well within the ± 3 V EIA-232-E requirement. The low level threshold is deliberately positive as it ensures that an unconnected input will be interpreted as a low level. The receivers have Schmitt trigger inputs with a hysteresis level of 0.5 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times. Shutdown (SD) Figure 25. Enable Timing APPLICATION HINTS Driving Long Cables The ADM205, ADM206, ADM211 and ADM213 feature a control input which may be used to disable the part and reduce the power consumption to less than 5 µW. This is very useful in battery operated systems. During shutdown the charge pump is turned off, the transmitters are disabled and all receivers except R4 and R5 on the ADM213 are put into a high-impedance disabled state. Receivers R4 and R5 on the ADM213 remain enabled during shutdown. This feature allows monitoring external activity such as ring indicator monitoring while the device is in a low power shutdown mode. The shutdown control input is active high on all parts except the ADM213 where it is active low. Refer to Tables II and III. In accordance with the EIA-232-E standard, long cables are permissible provided that the total load capacitance does not exceed 2500 pF. For longer cables which do exceed this, then it is possible to trade off baud rate vs. cable length. Large load capacitances cause a reduction in slew rate, and hence the maximum transmission baud rate is decreased. The ADM205–ADM211 and ADM213 are designed so that the slew rate reduction with increasing load capacitance is minimized. For the receivers, it is important that a high level of noise immunity be inbuilt so that slow rise and fall times do not cause multiple output transitions as the signal passes slowly through the transition region. The ADM205–ADM211 and ADM213 have 0.5 V of hysteresis to guard against this. This ensures that, even in noisy environments, error-free reception can be achieved. High Baud Rate Operation The ADM205–ADM211 and ADM213 feature high slew rates permitting data transmission at rates well in excess of the EIA-232-E specification. The drivers maintain ± 5 V signal levels at data rates up to 120-kB/s under worst-case loading conditions. –10– REV. 0 ADM205–ADM211/ADM213 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 24-Lead Plastic DIP (N-24) 24 24-Lead Cerdip (Q-24) 13 0.295 (7.493) MAX 1 1.290 (32.77) MAX 12 0.320 (8.128) 0.290 (7.366) 0.180 (4.572) MAX SEATING PLANE 0.021 (0.533) 0.015 (0.381) TYP 0.110 (2.794) 0.090 (2.286) TYP 0.065 (1.651) 0.055 (1.397) TYP 0.070 (1.778) 0.020 (0.508) 15 ° 0° 0.012 (0.305) 0.008 (0.203) TYP PIN 1 24 PIN 1 1 13 0.260 ± 0.001 (6.61 ± 0.03) 12 1.228 (31.19) 1.226 (31.14) 0.130 (3.30) 0.128 (3.25) 0.32 (8.128) 0.30 (7.62) 0.225 (5.715) MAX 0.125 (3.175) MIN SEATING PLANE 0.02 (0.5) 0.016 (0.41) 0.11 (2.79) 0.09 (2.28) 0.07 (1.78) 0.05 (1.27) 15 ° 0 0.011 (0.28) 0.009 (0.23) NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 24-Lead Plastic DIP (N-24A) 24 13 0.55 (13.97) 0.53 (13.47) 1 1.25 (31.75) 1.24 (31.5) 0.2 (5.08) MAX 0.175 (4.45) 0.12 (3.05) 0.02 (0.508) 0.015 (0.381) 0.105 (2.67) 0.095 (2.42) 0.065 (1.66) 0.045 (1.15) SEATING PLANE 0.16 (4.07) 0.14 (3.56) 15 ° 0° 12 0.606 (15.4) 0.594 (15.09) 24 28-Lead SOIC (R-28) 13 0.299 (7.6) 0.291 (7.39) 0.414 (10.52) 0.398 (10.10) PIN 1 PIN 1 1 12 0.012 (0.305) 0.008 (0.203) 0.608 (15.45) 0.596 (15.13) 0.096 (2.44) 0.089 (2.26) 0.03 (0.76) 0.02 (0.51) 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 6° 0° 0.042 (1.067) 0.018 (0.447) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS 28-Lead SSOP (RS-28) 24 13 0.212 (5.38) 0.205 (5.207) 0.311 (7.9) 0.301 (7.64) 1 12 PIN 1 0.328 (8.33) 0.318 (8.08) 0.07 (1.78) 0.066 (1.67) 0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 0.009 (0.229) 0.005 (0.127) 8° 0° 0.037 (0.94) 0.022 (0.559) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS REV. 0 –11– ADM205–ADM211/ADM213 OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 28 15 0.299 (7.6) 0.291 (7.39) 28 15 0.212 (5.38) 0.205 (5.207) 0.311 (7.9) 0.301 (7.64) PIN 1 1 14 0.414 (10.52) 0.398 (10.10) PIN 1 1 0.708 (18.02) 0.696 (17.67) 0.096 (2.44) 0.089 (2.26) 14 0.03 (0.76) 0.02 (0.51) 0.407 (10.34) 0.397 (10.08) 0.07 (1.78) 0.066 (1.67) 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) BSC 0.019 (0.49) 0.014 (0.35) 0.013 (0.32) 0.009 (0.23) 6° 0° 0.042 (1.067) 0.018 (0.457) 1. LEAD NO. IDENTIFIED BY A DOT. 2. SOICLEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 0.008 (0.203) 0.002 (0.050) 0.0256 (0.65) BSC 0.009 (0.229) 0.005 (0.127) 8° 0° 0.037 (0.94) 0.022 (0.559) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS –12– REV. 0 PRINTED IN U.S.A. C1897–18–4/94 28-Lead SOIC (R-28) 28-Lead SSOP (RS-28)