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ADP5520ACPZ-R7

ADP5520ACPZ-R7

  • 厂商:

    AD(亚德诺)

  • 封装:

    VFQFN24

  • 描述:

    BACKLIGHT DRIVER W/I/O EXPANDER

  • 数据手册
  • 价格&库存
ADP5520ACPZ-R7 数据手册
Backlight Driver with I/O Expander ADP5520 Data Sheet FEATURES TYPICAL OPERATING CIRCUIT 1µF VBAT 1µF 4.7µH 1 PGND 2.2kΩ 2.2kΩ 10kΩ 2 22 23 SW BST BL_SNK CAP_OUT 20 21 VBAT I/O RAIL 10kΩ 1µF 16 VDDIO GND 19 GND 18 ADP5520 5 SCL GND 24 4 SDA 100nF 3 INT CMP_IN 17 15 RST 6 I/O 13 7 8 9 10 11 12 A B C D E F G H ILED VBAT 14 VBAT Figure 1. APPLICATIONS Display backlight driver for phones that require slider or flip keypad functions with single or multiple LED indicators GENERAL DESCRIPTION The ADP5520 is a versatile single-chip, white LED backlight driver with a user configurable I/O expander. This device fits handset applications where the flip or slider section of the phone requires backlighting, I/O signaling and detecting, auxiliary LED lighting, and keypad functions. By incorporating an I2Ccompatible serial interface and a single line interrupt, the ADP5520 significantly reduces the total number of lines required to interface with the baseband processor across the hinge flex. Rev. B The ADP5520 can detect ambient light levels and adjust the backlight brightness accordingly, resulting in extended battery operation. Once configured, the ADP5520 is capable of controlling the flip/slider backlight intensity, on/off timing, dimming, and fading without the intervention of the main processor, which results in valuable battery power saving. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2008–2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com 07445-001 R3 R2 R1 R0 C0 C1 C2 C3 I/O Efficient asynchronous boost converter for driving up to 6 white LEDs 2.7 V to 5.5 V input voltage range 128 programmable backlight LED current levels (30 mA maximum) Ambient light sensing with autonomous backlight adjustment Programmable backlight fade-in/fade-out times Programmable backlight dim and off times 8 configurable GPIO pins (input, output, up to 4 × 4 keypad) Up to 3 auxiliary LED current sinks (1 dedicated, 2 configurable) 64 programmable auxiliary LED current levels (14 mA maximum) Programmable auxiliary LED fade-in/fade-out times Programmable auxiliary LED on and off times (allows blinking) I2C-compatible serial interface Interrupt line for signaling an external processor (INT) Hard reset (RST) Current limit protection Thermal overload protection Available in small 4.0 mm × 4.0 mm, 24-lead LFCSP package ADP5520 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Advanced Fading (Square) ........................................................ 13 Applications ....................................................................................... 1 Advanced Fading (Cubic 1 and Cubic 2) ................................ 14 Typical Operating Circuit ................................................................ 1 Ambient Light Sensing .............................................................. 14 General Description ......................................................................... 1 Automatic Backlight Adjustment ............................................. 15 Revision History ............................................................................... 2 I/O Expansion Pins (GPIOs) .................................................... 15 Specifications..................................................................................... 3 I/O Expansion Pins (Keypad Matrix) ...................................... 15 I C Timing Specifications ............................................................ 4 Absolute Maximum Ratings............................................................ 5 I/O Expansion Pins and ILED Pin (Auxiliary LED Current Sinks)............................................................................................ 17 Thermal Resistance ...................................................................... 5 Interrupt Output (INT) ............................................................. 19 ESD Caution .................................................................................. 5 Reset Input (RST) ....................................................................... 19 Pin Configuration and Function Descriptions ............................. 6 Communication Interface ............................................................. 20 Typical Performance Characteristics ............................................. 6 Register Map ................................................................................... 21 Theory of Operation ........................................................................ 9 Detailed Register Descriptions ..................................................... 22 Backlight Drive and Control ....................................................... 9 Applications Information .............................................................. 34 Backlight Operating Levels ....................................................... 10 Converter Topology ................................................................... 34 Backlight Maximum and Dim Settings ................................... 10 PCB Layout ................................................................................. 35 Backlight Turn On/Off/Dim ..................................................... 11 Example Circuits ............................................................................ 36 Automatic Dim and Turn Off Timers ..................................... 11 Outline Dimensions ....................................................................... 38 Linear Backlight Fade In and Fade Out ................................... 12 Ordering Guide .......................................................................... 38 2 Fade Override ............................................................................. 13 REVISION HISTORY 10/2017—Rev. A to Rev. B Changed nINT, nRST, and nSTNBY to INT, RST, and STNBY ............................................................................ Throughout Change to Package Type Column, Table 4 .................................... 5 Changes to Figure 3 and Table 5 ..................................................... 6 Updated Outline Dimensions ....................................................... 38 Changes to Ordering Guide .......................................................... 38 1/2010—Rev. 0 to Rev. A Changes to Table 1.............................................................................3 Changes to Table 5.............................................................................6 Changes to Figure 32...................................................................... 14 Updated Outline Dimensions ....................................................... 38 Changes to Ordering Guide .......................................................... 38 7/2008—Revision 0: Initial Version Rev. B | Page 2 of 38 Data Sheet ADP5520 SPECIFICATIONS VBAT = 2.7 V to 4.8 V, TJ = −40°C to +125°C, unless otherwise noted. 1 Table 1. Parameter SUPPLY VOLTAGE VBAT Input Voltage Range VDDIO Input Voltage Range Undervoltage Lockout Threshold SW leakage SUPPLY CURRENT Shutdown Current 3 Standby Current 4 BACKLIGHT LED DRIVER (SW, BST) Current Limit (Peak Inductor Current) Switch On Resistance Overvoltage Limit Boost Startup Time BACKLIGHT LED CURRENT SINK (BL_SNK) Full-Scale Backlight Current Backlight Current Ramp Rate AMBIENT LIGHT SENSOR (CMP_IN) Full-Scale Current INPUT LOGIC LEVELS (SCL, SDA, RST, C0, C1, C2, C3, R0, R1, R2, R3) 5 Logic Low Input Voltage Logic High Input Voltage Input Leakage Current Symbol VBAT VVDDIO UVLOVBAT UVLOVBAT UVLOVDDIO UVLOVDDIO SWLEAKAGE ISD ISTNBY Conditions VBAT falling VBAT rising VDDIO falling VDDIO rising 2.7 1.7 1.7 1.7 V ≤ VDDIO ≤ 3.3 V2 1.7 V ≤ VDDIO ≤ 3.3 V2 1.7 V ≤ VDDIO ≤ 3.3 V2 INPUT LOGIC DEBOUNCE (RST, C0, C1, C2, C3, R0, R1, R2, R3) 6 PUSH-PULL OUTPUT LOGIC LEVELS (C0, C1, C2, C3, R0, R1, R2, R3) 7 Logic Low Output Voltage Logic High Output Voltage VOL VOH ISINK = 1 mA ISOURCE = 1 mA VOL VOH-LEAKAGE ISINK = 1 mA 1.7 V ≤ VDDIO ≤ 3.3 V2 LEDLEAKAGE LEDFULLSCALE Sink disabled Applied pin voltage = 1 V TS TSHYS TJ rising TJ falling Max Unit 5.5 3.3 2 2.1 2.4 1.3 1.4 0.1 1.62 1 0.1 25 1 45 μA μA 450 100 24.5 600 200 27 1 750 400 29.5 mA mΩ V ms 26 30 0.3 32 mA mA/ms 0.7 1 1.2 mA 0.3 × VDDIO V V µA µs 1.1 Fade timers disabled BLFULLSCALE Typ V V V V V V μA VDDIO = 0 V 1.7 V ≤ VDDIO ≤ 3.3 V2, STNBY = 0 VIL VIH VI-LEAKAGE VIL-DBNC OPEN-DRAIN OUTPUT LOGIC LEVELS (INT), SDA) Logic Low Output Voltage Logic High Leakage Current AUX LED CURRENT SINK (ILED, C3, R3) 8 Leakage Full-scale Current Sink GPIO PULL-UP RESISTANCE (C0, C1, C2, C3, R0, R1, R2, R3) 9 THERMAL SHUTDOWN Thermal Shutdown Threshold Thermal Shutdown Hysteresis Min 2.7 0.7 × VDDIO 50 0.1 75 1 100 0.4 V V 0.1 0.4 1 V µA 0.1 14 65 1 16.5 80 µA mA kΩ VDDIO − 0.2 10.5 50 150 10 All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC). Typical values are at TA = 25⁰C, VBAT = 3.6 V. 3.3 V or VBAT, whichever is smaller. 3 Internal LDO powered down, digital blocks inactive, I2C inactive, boost inactive. 4 Internal LDO powered up, digital blocks active, I2C active, boost inactive. 5 C0, C1, C2, C3, R0, R1, R2, and R3 are configured as digital inputs. 6 C0, C1, C2, C3, R0, R1, R2, and R3 are configured as digital inputs, with debounce enabled. 7 C0, C1, C2, C3, R0, R1, R2, and R3 are configured as digital outputs. 8 C3 and R3 are configured as digital inputs with pull-up. 9 C0, C1, C2, C3, R0, R1, R2, and R3 are configured as digital inputs with pull-up. 1 2 Rev. B | Page 3 of 38 °C °C ADP5520 Data Sheet I2C TIMING SPECIFICATIONS Table 2. Parameter Delay from Reset Deassertion to I2C Access fSCL tHIGH tLOW tSU, DAT tHD, DAT tSU, STA tHD, STA tBUF tSU, STO tR tF tSP CB 1 Min 60 SCL clock frequency SCL high time SCL low time Data setup time Data hold time Setup time for repeated start Hold time for start/repeated start Bus free time for stop and start condition Setup time for stop condition Rise time for SCL and SDA Fall time for SCL and SDA Pulse width of suppressed spike Capacitive load for each bus line Max Unit μs kHz μs μs ns μs μs μs μs μs ns ns μs pF 400 0.6 1.3 100 0 0.6 0.6 1.3 0.6 20 + 0.1 CB 20 + 0.1 CB 0 0.9 300 300 50 400 CB is the total capacitance of one bus line in picofarads. SDA tLOW tR tF tSU, DAT tF tHD, STA tSP tBUF tR SCL S tHD, DAT tHIGH tSU, STA Sr S = START CONDITION Sr = REPEATED START CONDITION P = STOP CONDITION tSU, STO P S 07445-002 1 Description Figure 2. I2C Interface Timing Diagram Rev. B | Page 4 of 38 Data Sheet ADP5520 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter VBAT to GND VDDIO to GND SW, BST to GND ILED, R0, R1, R2, R3, C0, C1, C2, C3, CMP_IN, SCL, SDA, INT, RST, CAP_OUT, BL_SNK to GND PGND to GND Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Soldering Conditions 1 Rating −0.3 V to +6 V −0.3 V to VBAT −0.3 V to +30 V −0.3 V to +6 V −0.3 V to +0.3 V −40°C to +85°C1 −40°C to +125°C −65°C to +150°C JEDEC J-STD-020 θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type 24-Lead LFCSP (CP-24-14) ESD CAUTION In applications where high power dissipation and poor thermal resistance are present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(MAX)) is dependent on the maximum operating junction temperature (TJ(MAXOP) = 125°C), the maximum power dissipation of the device (PD(MAX)), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), using the following equation: TA(MAX) = TJ(MAXOP) − (θJA × PD(MAX)). Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all other voltages are referenced to GND. Rev. B | Page 5 of 38 θJA 50 Unit °C/W ADP5520 Data Sheet 20 CAP_OUT 19 GND 22 BST 21 VBAT 24 GND 18 GND PGND 1 SW 2 17 CMP_IN INT 3 ADP5520 SDA 4 TOP VIEW (Not to Scale) SCL 5 16 VDDIO 15 RST 14 ILED R2 6 C2 11 C3 12 C0 9 C1 10 R1 7 R0 8 13 R3 NOTES 1. EXPOSED PAD MUST BE CONNECTED TO GROUND. 07445-003 PIN 1 INDICATOR 23 BL_SNK PIN CONFIGURATION AND FUNCTION DESCRIPTIONS Figure 3. Pin Configuration Table 5. Pin Function Descriptions Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Mnemonic PGND SW INT SDA SCL R2 R1 R0 C0 C1 C2 C3 R3 ILED RST 16 VDDIO 17 18 19 20 CMP_IN GND GND CAP_OUT 21 22 23 24 VBAT BST BL_SNK GND EPAD Description Power Switch Output to Ground. Power Switch Input. Processor Interrupt. This pin is active low, and open drain, Pull up to VDDIO. I2C-Compatible Serial Data Line. Open drain requires external pull-up to VDDIO. I2C-Compatible Serial Clock Line. Open drain requires external pull-up to VDDIO. Row 2 when configured in a keypad matrix, D2 when configured as an I/O. Row 1 when configured in a keypad matrix, D1 when configured as an I/O. Row 0 when configured in a keypad matrix, D0 when configured as an I/O. Column 0 when configured in a keypad matrix, D4 when configured as an I/O. Column 1 when configured in a keypad matrix, D5 when configured as an I/O. Column 2 when configured in a keypad matrix, D6 when configured as an I/O. Column 3 when configured in a keypad matrix, D7 when configured as an I/O, LED 2 when configured as a current sink. Row 3 when configured in a keypad matrix, D3 when configured as an I/O, LED 3 when configured as a current sink. LED 1 Current Sink. Reset Input, Active Low. This input signal resets the device to the power-up default conditions. Must be driven low for 75 µs (typical) to be valid. Supply Voltage for the I/O Pins. Voltage is 1.7 V to 3.3 V (or VBAT, whichever is smaller). If VDDIO = 0, the device goes into full shutdown mode. Input for Ambient Light Sensing. Ground. Ground. Capacitor for Internal 2.7 V LDO. A 1 μF capacitor must be connected between this pin and GND. Do not use this pin to supply external loads. Main Supply Voltage for the IC (2.7 V to 5.5 V). Overvoltage Monitor Input for the Boost Converter. Backlight Current Sink. Ground. Exposed Pad. Exposed pad must be connected to ground. Rev. B | Page 6 of 38 Data Sheet ADP5520 TYPICAL PERFORMANCE CHARACTERISTICS VBAT = 3.6 V, TA = 25°C, unless otherwise noted. Inductor = LPS4012-472MLB. Schottky rectifier = MBR140SFT1G. 48 90 STANDBY SUPPLY CURRENT (µA) 85 80 EFFICIENCY (%) 75 70 65 60 6 LEDs, 6 LEDs, 6 LEDs, 6 LEDs, 55 50 VBAT VBAT VBAT VBAT = 3.0V = 3.6V = 4.2V = 5.5V TEMP = –40°C 40 TEMP = +25°C 32 24 16 TEMP = +85°C 8 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 BACKLIGHT CURRENT (mA) 30 0 2.5 07445-047 40 Figure 4. Efficiency vs. Backlight Current (6 LEDS) 4.0 4.5 VBAT (V) 5.0 5.5 6.0 80 75 70 65 6 LEDs, VBAT = 3.6V 5 LEDs, VBAT = 3.6V 4 LEDs, VBAT = 3.6V 60 55 50 45 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 BACKLIGHT CURRENT (mA) 30 Figure 5. Efficiency vs. Backlight Current (4, 5, and 6 LEDS) 80 75 6 LEDs, VBAT = 4.2V 6 LEDs, VBAT = 4.2V, AUTOLOAD-ENABLED 60 55 50 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 BACKLIGHT CURRENT (mA) 30 07445-049 45 40 8 6 4 2 0.5 1.0 1.5 2.0 AUX LED PIN VOLTAGE (V) 2.5 3.0 Figure 8. Typical Auxiliary LED Pin (R3, C3, or ILED), Full-Scale Sink Current vs. Applied Pin Voltage 85 65 10 0 90 70 12 0 07445-048 40 14 07445-051 AUX LED FULL-SCALE SINK CURRENT (mA) 16 85 EFFICIENCY (%) 3.5 Figure 7. Standby Supply Current vs. VBAT 90 EFFICIENCY (%) 3.0 07445-050 45 Figure 6. Efficiency vs. Backlight Current (Autoload On/Off) Rev. B | Page 7 of 38 ADP5520 Data Sheet SW SW 1 1 INDUCTOR CURRENT INDUCTOR CURRENT 2 2 BST BST 3 4 CH1 20.0V CH3 10.0V CH2 500mA CH4 1.0V TIME (4µs/DIV) BL_SNK 4 CH1 20.0V CH3 10.0V Figure 9. Boost Operation (Backlight = 30 mA) CH2 500mA CH4 1.0V TIME (4µs/DIV) 07445-054 BL_SNK 07445-052 3 Figure 11. Boost Operation (Backlight = 2 mA) SW SW 1 1 INDUCTOR CURRENT INDUCTOR CURRENT 2 2 BST BST BL_SNK 3 3 CH2 500mA CH4 1.0V TIME (4µs/DIV) 4 07445-053 CH1 20.0V CH3 10.0V CH1 10.0V CH3 10.0V Figure 10. Boost Operation (Backlight = 15 mA) CH2 500mA CH4 1.0V TIME (1ms/DIV) Figure 12. Boost Startup Rev. B | Page 8 of 38 07445-055 BL_SNK 4 Data Sheet ADP5520 THEORY OF OPERATION 1µF VBAT 1µF 4.7µH SW BST 2 BL_SNK 22 23 27V I-LIMIT FB AUTO LOAD 0.65V OVP BACKLIGHT CURRENT CONTROL BOOST CONTROL PGND 1 VBAT THERMAL S/D IN 21 VDDIO 16 POR EN LDO VBAT OUT CAP_OUT STATE MACHINE LIGHT SENSOR 20 1µF 17 CMP_IN 2.7V REGISTER MAP BIAS/CLOCK 100nF INTERRUPT/RESET CONTROL SCL 5 SDA 4 LED CURRENT CONTROL INTERFACE INT 3 RST 15 18 19 24 6 7 8 9 10 11 GND GND GND R2 R1 R0 C0 C1 C2 13 12 14 C3 ILED R3 07445-004 I/O CONFIG GPIO/KEYPAD ADP5520 Figure 13. Internal Block Diagram The ADP5520 is a backlight white LED driver with an I/O port expander. It is ideal for cell phone designs and other portable devices, where keypad and/or extended I/O functionality is needed. Programmable fade-in, fade-out, dim, and off timers provide the backlight with flexible control features. Using an external photodiode, the ADP5520 can perform ambient light sensing, and adjust the backlight brightness according to varying lighting conditions. The I/O port expander has eight configurable GPIO pins. The I/Os can be configured as a keypad matrix, digital inputs, or digital outputs. Additionally, two of the I/Os (R3 and C3) can be configured as current sink lines and, paired with a dedicated sink line (ILED), can be used to drive up to three auxiliary LEDs. Programmable fading is also available for auxiliary LEDs. Once programmed through its I2C-compatible interface, the ADP5520 can run autonomously. An interrupt line (INT) is available to alert an external microprocessor of the status of its I/Os, keypad presses and releases, ambient light sensor comparator states, and overvoltage conditions. BACKLIGHT DRIVE AND CONTROL White LEDs are common in backlighting the displays of modern portable devices such as cell phones. White LEDs require a high forward voltage, VF, before they conduct current and emit light. Display panels, depending on their size, can be backlit with single or multiple white LEDs. In panels that require multiple LEDs, the LEDs are commonly connected in a series string to achieve uniform brightness in each LED by passing a common current through all of them. The LED string needs to be biased with a voltage greater than the sum of the VF of each LED before it conducts. The ADP5520 is an asynchronous boost converter capable of driving an LED string with 24.5 V (minimum). For detailed information about the boost device, see the Applications Information section. With sufficient forward voltage created, the ADP5520 controls the current (and thus the brightness) of the LED string via an adjustable internal current sink. An internal state machine, in conjunction with programmable timers, dynamically adjusts the current sink between 0 mA and 30 mA to achieve impressive backlight control features. Rev. B | Page 9 of 38 ADP5520 Data Sheet BACKLIGHT MAXIMUM AND DIM SETTINGS BST The backlight maximum and dim current settings are determined by a 7-bit code programmed by the user into the registers listed in the Backlight Operating Levels section. This 7-bit resolution allows the user to set the backlight to 1 of 128 different levels between 0 mA and 30 mA. The ADP5520 can implement two distinct algorithms to achieve a linear and a nonlinear relationship between input code and backlight current. The BL_LAW bits in Register 0x02 are used to swap between algorithms. BL_SNK DAYLIGHT_MAX DAYLIGHT_DIM BL_VALUE OFFICE_MAX MUX OFFICE_DIM BL_EN DARK_MAX DARK_DIM BL_OFFT BL_DIMT BL_LVL DIM_EN COUNTERS AND CONTROL LOGIC BL_LAW BL_FI CLOCK GENERATOR 07445-005 BL_FO By default, the ADP5520 uses a linear algorithm (BL_LAW = 00), where backlight current increases linearly for a corresponding increase of input code. Backlight current (in mA) is determined by the following equation: Backlight Current = Code × (Fullscale_Current/127) Figure 14. Backlight Brightness Control BACKLIGHT OPERATING LEVELS Backlight brightness control can operate in three distinct levels: daylight (L1), office (L2), and dark (L3). The BL_LVL bits in Register 0x02 control the level in which the backlight operates. The BL_LVL bits can be changed manually, or if in automatic mode, by the ambient light sensor (see the Ambient Light Sensing section). By default, the backlight operates at daylight level (BL_LVL = 00), where the maximum brightness is set using Register 0x05 (DAYLIGHT_MAX). A daylight dim setting can also be set using Register 0x06 (DAYLIGHT_DIM). When operating at office level (BL_LVL = 01), the backlight maximum and dim brightness settings are set by Register 0x07 (OFFICE_MAX) and Register 0x08 (OFFICE_DIM). When operating at dark level (BL_LVL = 10), the backlight maximum and dim brightness settings are set by Register 0x09 (DARK_MAX) and Register 0x0A (DARK_DIM). DAYLIGHT (L1) OFFICE (L2) where: Code is the input code programmed by the user. Fullscale_Current is the maximum sink current allowed (typically 30 mA). The ADP5520 can also implement a nonlinear (square approximation) relationship between input code and backlight current level. In this case (BL_LAW = 01), the backlight current (in mA) is determined by the following equation:  Fullscale _ Current Backlight Current =  Code × 127  DARK (L3) DAYLIGHT_MAX BACKLIGHT CURRENT     2 (2) Figure 16 shows the backlight current level vs. input code for both the linear and square law algorithms. 30 25 BACKLIGHT CURRENT (mA) 30mA (1) OFFICE_MAX DARK_MAX DAYLIGHT_DIM OFFICE_DIM 20 15 LINEAR 10 SQUARE 5 BACKLIGHT OPERATING LEVELS Figure 15. Backlight Operating Levels 0 0 32 64 SINK CODE 96 Figure 16. Backlight Current vs. Sink Code Rev. B | Page 10 of 38 128 07445-007 0 07445-006 DARK_DIM Data Sheet ADP5520 BACKLIGHT TURN ON/OFF/DIM AUTOMATIC DIM AND TURN OFF TIMERS With the device in operating mode (STNBY = 1), the backlight can be turned on using the BL_EN bit in Register 0x00. Before turning on the backlight, choose which level (daylight (L1), office (L2), or dark (L3)) to operate in, and ensure that maximum and dim settings are programmed for that level. The backlight turns on when BL_EN = 1. The backlight turns off when BL_EN = 0. The user can program the backlight to dim automatically by using the BL_DIMT timer in Register 0x03. The dim timer has 15 settings ranging from 10 sec to 2 min. Program the dim timer before turning on the backlight. If BL_EN = 1, the backlight turns on to its maximum setting, and the dim timer starts counting. When the dim timer expires, the internal state machine sets DIM_EN = 1, and the backlight goes to its dim setting. BACKLIGHT CURRENT BACKLIGHT CURRENT MAX DIM TIMER RUNNING DIM TIMER RUNNING MAX BL_EN = 1 07445-008 DIM BL_EN = 0 Figure 17. Backlight Turn On/Off DIM_EN = 0 DIM_EN = 1 OR BL_EN = 1 BL_EN = 0 07445-010 BL_EN = 1 DIM_EN = 1 While the backlight is on (BL_EN = 1), the user can make it change to a dim setting by programming DIM_EN = 1 in Register 0x00. If DIM_EN = 0, the backlight reverts to its maximum setting. SET BY USER SET BY INTERNAL STATEMACHINE Figure 19. Dim Timer If the user clears the DIM_EN bit (or reasserts the BL_EN bit), the backlight reverts to its maximum setting and the dim timer begins counting again. When the dim timer expires, the internal state machine again sets DIM_EN = 1, and the backlight goes to its dim setting. Reasserting BL_EN at any point during the dim timer countdown causes the timer to reset and begin counting again. The backlight can be turned off at any point during the dim timer countdown by clearing BL_EN. MAX BL_EN = 1 DIM_EN = 1 DIM_EN = 0 BL_EN = 0 07445-009 DIM Figure 18. Backlight Turn On/Dim/Off The maximum and dim settings can be set between 0 mA and 30 mA; therefore, it is possible to program a dim setting that is greater than a maximum setting. For normal expected operation, ensure that the dim setting is programmed to be less than the maximum setting. The user can also program the backlight to turn off automatically by using the BL_OFFT timer in Register 0x03. The off timer has 15 settings ranging from 10 sec to 2 min. Program the off timer before turning on the backlight. If BL_EN = 1, the backlight turns on to its maximum setting, and the off timer starts counting. When the off timer expires, the internal state machine clears the BL_EN bit, and the backlight turns off. It is also possible to activate the backlight automatically when a key press is detected. With the row and column pins configured as a keypad matrix, and the KP_BL_EN bit asserted in Register 0x02, the internal state machine asserts BL_EN and turns on the backlight if a key is pressed. See the I/O Expansion Pins (Keypad Matrix) section for more information on using keypad functionality. BACKLIGHT CURRENT OFF TIMER RUNNING MAX BL_EN = 1 BL_EN = 0 SET BY USER SET BY INTERNAL STATE MACHINE Figure 20. Off Timer Rev. B | Page 11 of 38 07445-011 BACKLIGHT CURRENT ADP5520 Data Sheet Reasserting BL_EN at any point during the off timer countdown causes the timer to reset and begin counting again. The backlight can be turned off at any point during the off timer countdown by clearing BL_EN. The dim timer and off timer can be used together for sequential maximum-to-dim-to-off functionality. With both the dim and off timers programmed, if BL_EN is asserted, the backlight turns on to its maximum setting. When the dim timer expires, the backlight changes to its dim setting. When the off timer expires, the backlight turns off. The time programmed in BL_FI represents the time it takes the backlight current to go from 0 mA to 30 mA. Fading between intermediate settings is shorter. The BL_FO timer in Register 0x04 can be used for smooth fadeout transitions from high to low backlight settings such as maximum-to-dim and dim-to-off. The BL_FO timer can be programmed to one of 15 settings ranging from 0.3 sec to 5.5 sec. Program the BL_FO timer before asserting BL_EN. 30.0 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 27.5 BACKLIGHT CURRENT (mA) 25.0 BACKLIGHT CURRENT DIM TIMER RUNNING MAX OFF TIMER RUNNING DIM 22.5 20.0 17.5 15.0 12.5 10.0 7.5 5.0 0 DIM_EN = 1 BL_EN = 0 0 0.5 1.0 07445-012 BL_EN = 1 SET BY USER SET BY INTERNAL STATE MACHINE 1.5 2.0 2.5 3.0 3.5 FADE-OUT TIME (s) 4.0 4.5 5.0 5.5 07445-014 2.5 Figure 23. Linear Fade-out Times LINEAR BACKLIGHT FADE IN AND FADE OUT The time programmed in BL_FO represents the time it takes the backlight current to go from 30 mA to 0 mA. Fading between intermediate settings is shorter. To counteract the abrupt visual effect of near instant turn-on and turn-off of the backlight, the ADP5520 contains timers to facilitate the smooth fading between off, on, and dim states. By default (BL_LAW = 00), the ADP5520 implements a fading scheme using the linear backlight code algorithm (see Equation 1). Figure 24 shows the fade timers in use. With BL_FI and BL_FO programmed, if BL_EN is asserted, then the backlight fades in to its maximum setting. If DIM_EN is asserted, then the backlight fades out to its dim setting. If BL_EN is cleared, the backlight fades out to off. Figure 21. Dim and Off Timers Used Together The BL_FI timer in Register 0x04 can be used for smooth fade-in transitions from low to high backlight settings, such as off-to-dim, off-to-maximum, and dim-to-maximum. The BL_FI timer can be programmed to one of 15 settings ranging from 0.3 sec to 5.5 sec. Program the BL_FI timer before asserting BL_EN. BACKLIGHT CURRENT FADE-IN OFF-TO-MAX FADE-OUT FADE-IN FADE-IN FADE-OUT MAX FADE-OUT DIM-TO-OFF 30.0 27.5 FADE-OUT MAX-TO-DIM DIM 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 20.0 17.5 15.0 12.5 10.0 7.5 5.0 2.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-IN TIME (s) 4.0 Figure 22. Linear Fade-In Times 4.5 5.0 5.5 BL_EN = 1 DIM_EN = 1 BL_EN = 0 BL_EN = 0 BL_EN = 1 BL_EN = 0 BL_EN = 1 SET BY USER 07445-015 22.5 Figure 24. Backlight Turn On/Off/Dim with Fade Timers 07445-013 BACKLIGHT CURRENT (mA) 25.0 During any point in a fade-out, if BL_EN is asserted, then the backlight stops at its current fade-out position and begins fading in. The fade-in and fade-out timers can be used independently of each other, that is, fade-in can be enabled while fade-out is disabled. The fade timers can also be used with the off and dim timers. Rev. B | Page 12 of 38 Data Sheet ADP5520 Figure 25 shows the fade timers used with the dim and off timers. Although the default linear fade algorithm gives a smooth increase and decrease in backlight current, the resulting increase and decrease in brightness still appears visually abrupt. For example, for a given fade-in time, the eye can notice an initial increase in brightness as backlight current is increased, but cannot perceive much more of an increase in brightness as backlight current is increased to maximum. DIM TIMER RUNNING FADE-OUT FADE-IN MAX OFF TIMER RUNNING BL_EN = 1 DIM_EN = 1 BL_EN = 0 DIM_EN = 0 SET BY USER SET BY INTERNAL STATE MACHINE 07445-016 FADE-OUT DIM ADVANCED FADING (SQUARE) The reason for this is that the eye, like all human senses, perceives changes in light when the brightness of the light source is changed logarithmically (Weber-Fechner law). To achieve a more natural fading experience to the user, the fade timers can be used in conjunction with the square law approximation backlight codes (see Equation 2) by setting BL_LAW = 01. Figure 25. Fade/Dim/Off Timers Used Together 30.0 27.5 FADE OVERRIDE BACKLIGHT CURRENT FADE-IN OVERRIDDEN FADE-OUT OVERRIDDEN BACKLIGHT CURRENT (mA) 25.0 A fade override feature allows the BL_FI and BL_FO timers to be overridden if the BL_EN bit is reasserted (either by the user or due to a key press) during a fade-in or fade-out period, and sets the backlight to its maximum setting. Fade override can be activated by setting the FOVR bit in Register 0x02. 22.5 20.0 17.5 15.0 10.0 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 7.5 5.0 2.5 MAX 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 12.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-IN TIME (s) 4.0 4.5 5.0 5.5 07445-018 BACKLIGHT CURRENT Figure 27. Square Law Fade-In Times 30.0 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 27.5 BL_EN = 1 (REASSERTED BY USER OR A KEY PRESS) BL_EN = 0 BL_EN = 1 (REASSERTED BY USER OR A KEY PRESS) SET BY USER Figure 26. Fade Override 22.5 20.0 17.5 15.0 12.5 10.0 7.5 5.0 2.5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-OUT TIME (s) 4.0 Figure 28. Square Law Fade-Out Times Rev. B | Page 13 of 38 4.5 5.0 5.5 07445-019 BL_EN = 0 07445-017 BL_EN = 1 BACKLIGHT CURRENT (mA) 25.0 ADP5520 Data Sheet ADVANCED FADING (CUBIC 1 AND CUBIC 2) AMBIENT LIGHT SENSING Two additional advanced techniques are available for fading the backlight brightness levels, Cubic 1 (BL_LAW = 10) and Cubic 2 (BL_LAW = 11). Referring to the backlight brightness control block diagram shown in Figure 14, linear and square fading is implemented by ramping the 128 linear/square algorithm codes at a fixed frequency over the duration of a given fade-in/fadeout time. The ADP5520 can be used in conjunction with an external photosensor to detect when ambient light conditions have dropped below programmable set points. An ADC samples the output of the external photosensor. The ADC result is fed into two programmable trip comparators. The ADC has an input range of 0 μA to 1000 μA (typical). L2_EN Cubic fading is implemented by reusing the square algorithm codes, but by ramping them with a clock source whose frequency output increases as the sink current code increases (see Figure 29). Cubic 1 and Cubic 2 differ by having separate frequency vs. code characteristics. BST L2_TRIP L2_HYS PHOTO SENSOR OUTPUT BL_SNK L2_OUT FILTER SETTINGS ADC L3_TRIP L3_HYS L3_OUT DAYLIGHT_DIM OFFICE_MAX OFFICE_DIM BL_VALUE L3_EN MUX Figure 31. Ambient Light Sensing and Trip Comparators BL_EN DARK_MAX DARK_DIM BL_OFFT BL_DIMT BL_LVL DIM_EN COUNTERS AND CONTROL LOGIC BL_LAW BL_FI CLOCK GENERATOR 07445-020 BL_FO Figure 29. Backlight Brightness Control (Cubic) Figure 30 shows a comparison of fade law techniques. Cubic fades complete faster than linear or square fades for a given fade time setting. Cubic 1 completes approximately 30% faster, and Cubic 2 completes approximately 10% faster than an equivalent linear or square fade time. With four fade laws and 15 fade time settings, users have tremendous flexibility to find the right fade experience for their application. 30 The Level 2 (office) light sensor comparator, L2_CMPR, is used to detect when the photosensor output has dropped below the programmable L2_TRIP point. If this event occurs, the L2_OUT status signal is set. L2_CMPR contains programmable hysteresis, meaning that the photosensor output must rise above L2_TRIP + L2_HYS before L2_OUT is cleared. L2_CMPR is enabled in Register 0x0C via the L2_EN bit. The L2_TRIP and L2_HYS values of L2_CMPR can be set between 0 μA and 1000 μA (typical) in steps of 4 μA (typical). L3_CMPR is used to detect when the photosensor output has dropped below the programmable L3_TRIP point. If this event occurs, the L3_OUT status signal is set. L3_CMPR contains programmable hysteresis, meaning that the photosensor output must rise above L3_TRIP + L3_HYS before L3_OUT is cleared. L3_CMPR is enabled in Register 0x0C via the L3_EN bit. The L3_TRIP and L3_HYS values of L3_CMPR can be set between 0 μA and 127 μA (typical) in steps of 0.5 μA (typical). L2_TRIP 25 CUBIC 1 L2_HYS 20 L3_TRIP 15 LINEAR L3_HYS 10 1 CUBIC 2 5 0 10 ADC RANGE (µA) 100 1000 07445-023 SQUARE Figure 32. Comparator Ranges 0 0.2 0.4 0.6 UNIT FADE TIME 0.8 Figure 30. Fade Law Comparison Over a Unit Fade Time 1.0 07445-021 BACKLIGHT CURRENT (mA) 07445-022 DAYLIGHT_MAX The L2_CMPR and L3_CMPR comparators can be enabled independently of each other. The ADC and comparators run continuously when L2_EN and/or L3_EN are set, during automatic backlight adjustment mode. A single conversion Rev. B | Page 14 of 38 Data Sheet ADP5520 takes 80 ms (typical). Filter times of between 80 ms and 10 sec can be programmed for the comparators before they change state. VDDIO It is also possible to use the light sensor comparators in a single shot mode. After the single shot measurement is completed, the internal state machine clears the FORCE_RD bit. The ambient light sensor comparators can be used to automatically transition the backlight between one of its three operating levels. To enable this mode, the BL_AUTO_ADJ bit is set in Register 0x02. Once enabled, the internal state machine takes control of the BL_LVL bits and changes them based on the L2_OUT and L3_OUT status bits. The L2_OUT status bit indicates that ambient light conditions have dropped below the L2_TRIP point and the backlight must be moved to its office (L2) level. The L3_OUT status bit indicates that ambient light conditions have dropped below the L3_TRIP point and the backlight must be moved to its dark (L3) level. Table 6 shows the relationship between backlight operation and the ambient light sensor comparator outputs. The L3_OUT status bit has greater priority, so the backlight operates at L3 (dark) even if L2_OUT is set. Table 6. Comparator Output Truth Table (X = Don’t Care) BL_AUTO_ADJ 0 L3_OUT X L2_OUT X 1 0 0 1 0 1 1 1 0 1 1 1 Backlight Operation BL_LVL can be manually set by the user BL_LVL = 00, backlight operates at L1 (daylight) BL_LVL = 01, backlight operates at L2 (office) BL_LVL = 10, backlight operates at L3 (dark) BL_LVL = 10, backlight operates at L3 (dark) I/O EXPANSION PINS (GPIOs) The eight I/O expansion pins (R0, R1, R2, R3, C0, C1, C2, and C3) can be configured as general-purpose digital inputs, digital inputs with pull-up, or digital outputs. Two of the I/O pins (R3 and C3) are LED current sinks by default. To use them as GPIOs, set Bit 4 and Bit 5 in Register 0x11. Register 0x17 to Register 0x1F are used to configure the I/O pins in GPIO mode. Figure 33 shows the typical makeup of a GPIO block, where Rx/Cx represents any one of the eight I/O lines. Dx_IN DEBOUNCE VDDIO GPIO (Rx/Cx) Dx_OUT Dx_DIR Figure 33. Typical GPIO Block When configured as an output, a digital buffer drives the GPIO Rx and Cx pins to 0 V for a Logic 0 and to the VDDIO rail for a Logic 1. Output data for each I/O is set using Register 0x1A. Each I/O has a pull-up resistor that can be enabled when used as an input. This can be useful for interfacing to an external signal that has only pull-down capabilities. Pull-ups can be enabled and disabled using Register 0x1F. Each I/O has a debounce circuit that effectively filters out glitches and pulses less than 75 µs (typical) to prevent false triggering when configured as an input. By default, debounce is enabled but can be disabled using Register 0x1E. I/Os configured as inputs store the digital state sensed at each pin in Register 0x19. Interrupts can be generated by digital inputs if enabled in Register 0x1B. The input interrupt level can be selected using Register 0x1D. Interrupts generated are stored in Register 0x1C. The master GPI_INT bit is set if any interrupt bits are set in Register 0x1C, and the INT pin is asserted. To deassert the INT pin and clear the GPI_INT bit, the 0x1C register must be cleared by reading it twice (assuming the interrupt condition has gone away), and then a 1 must be written to the GPI_INT bit in Register 0x00. Figure 34 shows the interrupt generation scheme, where Dx represents any one of the eight digital input lines. REG 0x19 Dx_IN REG Dx_ILVL 0x1D REG Dx_IN_IEN 0x1B INTERRUPT CONDITION DECODE AND REG 0x1C READ TWICE TO CLEAR REG 0x00 WRITE 1 TO CLEAR Dx_IN_ISTAT GPI_INT INT DRIVE Figure 34. GPIO Interrupt generation I/O EXPANSION PINS (KEYPAD MATRIX) The eight I/O expansion pins (R0, R1, R2, R3, C0, C1, C2, and C3) can be configured to decode a keypad matrix, consisting of up to 16 switches (4 × 4 matrix). See the Example Circuits section for other possible matrix configurations. Two of the I/O pins (R3 and C3) are LED current sinks by default. To use them as keypad decoders, set Bit 4 and Bit 5 in Register 0x11. The R0, R1, R2, and R3 I/O pins make up the rows of the keypad matrix. The C0, C1, C2, and C3 I/O pins make up the columns of the keypad matrix. Rev. B | Page 15 of 38 07445-025 AUTOMATIC BACKLIGHT ADJUSTMENT Dx_IN_DBNC 07445-024 The interrupt flag, CMPR_INT, is set in Register 0x00 if either of the L2_OUT or L3_OUT status bits change state, meaning interrupts can be generated if ambient light conditions transition between any of the programmed trip points. CMPR_INT can cause the INT pin to be asserted if the CMPR_IEN bit is set in Register 0x00. The CMPR_INT flag can be cleared only by writing a 1 to it. Dx_PULL ADP5520 Data Sheet To configure the device for key scanning and decoding, the R0, R1, R2, and R3 pull-ups must be enabled in Register 0x1F. Key scanning and decoding is then enabled by programming the row and column bits in Register 0x17. The row pull-ups must be enabled before enabling key scanning. If the A button is released, the switch opens the connection between R0 and C0, and R0 is pulled up high. The key scanner requires that the key be released for two scan cycles. Because the release of a key is not necessarily in sync with the key scanning sampling period, it may take between 25 ms and 50 ms for a key to register as being released. Once the key is registered as being released, the key scanner returns to idle mode. Figure 35 shows the row and column pins connected to a typical 4 × 4, 16-switch keypad matrix. When key scanning is idle, the row pins are pulled high and the column pins are pulled low. The key scanner operates by checking if the row pins are low. If the A button in the matrix is pressed, the switch connects R0 to C0. The key scan circuit senses that the R0 pin has been pulled low and begins a key scan cycle. To prevent glitches or narrow press times registering as valid key presses, the key scanner requires the key to be pressed for two scan cycles. The key scanner has a sampling period of 25 ms, so the key must be pressed and held for at least 25 ms to register as being pressed. If the key is continuously pressed, the key scanner continues to sample every 25 ms. C0 2 nINT CH1 2.0V CH3 2.0V KEYPAD SCAN AND DECODE C2 C3 R0 A B C D E F G H I J K L M N O P R1 R2 Key press/release status and interrupt information is recorded in Register 0x20 through Register 0x25. When a key is pressed, an interrupt is generated and stored. Key press interrupts for A through H are stored in Register 0x20, and key press interrupts for I through P are stored in Register 0x21. The master KP_INT flag is set if any interrupt bits are set in Register 0x20 or Register 0x21. The INT pin is asserted if KP_INT is set and if KP_IEN is enabled in Register 0x01. R3 4 × 4 KEYPAD MATRIX Figure 35. Keypad Decode Configuration R0 To deassert the INT pin and clear the KP_INT flag, Register 0x20 and Register 0x21 must be cleared by reading them once, and then a 1 must be written to the KP_INT bit in Register 0x00. Figure 38 shows the interrupt generation scheme, where KP_x_ISTAT represents any one of the 16 key press interrupt status bits. 1 READ ONCE TO CLEAR REGISTERS KP_x_ISTAT 0x20 AND 0x21 2 C0 REG 0x00 WRITE 1 TO CLEAR KP_INT AND REG 0x01 KP_IEN INT DRIVE 07445-027 C1 TIME (10ms/DIV) Figure 37. Key Press (R0, C0) 07445-026 C0 CH2 2.0V 07445-057 D3_PULL D2_PULL D1_PULL 3 D0_PULL VDDIO R0 1 Figure 38. Key Press Interrupt Generation INT It is possible to clear key press interrupts (KP_INT = 1) and deassert INT while a key is still pressed. CH1 2.0V CH3 2.0V CH2 2.0V TIME (10ms/DIV) Figure 36. Key Press(R0,C0) 07445-056 3 When a key is released, an interrupt is also generated and stored. Key release interrupts for A through H are stored in Register 0x22, and key release interrupts for I through P are stored in Register 0x23. The master KR_INT flag is set if any interrupt bits are set in Register 0x22 or Register 0x23. The INT pin is asserted if KR_INT is set and if KR_IEN is enabled in Register 0x01. Rev. B | Page 16 of 38 Data Sheet ADP5520 To deassert the INT pin and clear the KR_INT flag, Register 0x22 and Register 0x23 must be cleared by reading them once, and then a 1 must be written to the KR_INT bit in Register 0x00. Figure 39 shows the interrupt generation scheme, where KR_x_ISTAT represents any one of the 16-key release interrupt status bits. REGISTERS KP_x_ISTAT 0x22 AND 0x23 REG 0x00 WRITE 1 TO CLEAR KR_INT AND REG 0x01 KP_IEN INT DRIVE 07445-028 READ ONCE TO CLEAR Figure 39. Key Release Interrupt Generation The backlight can be programmed to turn on as a consequence of a key press, using the KP_BL_EN bit in Register 0x02. To enable this feature, observe the following sequence: 1. 2. 3. 4. Enable the row pull-ups using Register 0x1F. Enable key scanning on rows and columns using Register 0x17. Enable backlight turn-on due to key press by setting KP_BL_EN in Register 0x02. Set device to operating mode (STNBY = 1) in Register 0x00. When a key is pressed, the backlight turns on. If the off timer is programmed, the backlight turns off, or the user can turn off the backlight by clearing BL_EN. If the user wants the backlight to turn on again with a subsequent key press, the KP_INT and KR_INT bits in Register 0x00 must be cleared. I/O EXPANSION PINS AND ILED PIN (AUXILIARY LED CURRENT SINKS) The ILED pin and two of the I/O expansion pins (R3 and C3) can be used as auxiliary LED current sinks. Each LED current sink is programmable up to 14 mA (typical) and can be independently turned on and off. The ILED pin is the current sink for LED 1. Its sink current can be set using LED1_CURRENT in Register 0x14. The LED 1 sink can be enabled with LED1_EN in Register 0x11. The C3 pin is the current sink for LED 2. Its sink current can be set using LED2_CURRENT in Register 0x15. The LED 2 sink can be enabled with LED2_EN in Register 0x11. The R3 pin is the current sink for LED 3. Its sink current can be set using LED3_CURRENT in Register 0x16. The LED 3 sink can be enabled with LED3_EN in Register 0x11. The LEDx_CURRENT registers are six bits wide, allowing the user to set the LED sink current to one of 64 different levels between 0 mA and 14 mA. The ADP5520 can implement two distinct algorithms, to achieve a linear and a nonlinear relationship between input code and sink current. By default, the ADP5520 uses a linear algorithm (LED_LAW = 0), where the LED sink current increases linearly for a corresponding increase of input code. LED sink current (in milliamps) is determined by the following equation: LED Sink Current = Code × (Fullscale_Current/63) where: Code is the input code programmed by the user. Fullscale_Current is the maximum sink current allowed (typically 14 mA). LED1_EN LED1_OFFT LED 1 DIGITAL COUNTERS AND CONTROL R3 C3 ILED LED1_CURRENT VBAT VBAT VBAT LED2_EN LED2_CURRENT LED2_OFFT LED 2 DIGITAL COUNTERS AND CONTROL LED3_EN LED3_CURRENT LED3_OFFT LED 3 DIGITAL COUNTERS AND CONTROL LED_ONT LED_FI 07445-029 LED_FO LED_LAW Figure 40. LED Current Sinks Rev. B | Page 17 of 38 (3) ADP5520 Data Sheet The ADP5520 can also implement a nonlinear (square approximation) relationship between input code and LED sink current level. In this case (LED_LAW = 1), the LED sink current (in milliamps) is determined by the following equation:     2 (4) Figure 41 shows the auxiliary LED sink current levels vs. input code for both the linear and square law algorithms. 10 8 6 4 14 2 12 0 1.0 1.5 2.0 2.5 3.0 3.5 FADE-OUT TIME (s) 4.0 4.5 5.0 5.5 To achieve a more natural fading experience to the eye, the fade timers can be used in conjunction with the square law approximation codes (see Equation 4) by setting LED_LAW = 1. 6 SQUARE 14 2 12 32 CODE 48 64 Figure 41. LED Sink Current vs. Code Similar to the backlight current sink, the ADP5520 contains timers to facilitate the smooth fading between off and on states of the LED current sinks. All three LED sinks share a common fade-in (LED_FI) timer as well as a common fade-out (LED_FO) timer. The fade-in and fade-out timers are located in Register 0x13, and can be programmed to one of 15 settings ranging from 0.3 sec to 5.5 sec. Fade-in times represent the time it takes to fade from 0 mA to 14 mA. Fade-out times represent the time it takes to fade from 14 mA to 0 mA. Fading between intermediate settings is shorter. Program the fade timers before asserting LEDx_EN. By default (LED_LAW = 0), the ADP5520 implements a fading scheme using the linear algorithm (see Equation 3). 14 12 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 8 6 4 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-IN TIME (s) 4.0 4.5 5.0 6 4 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-IN TIME (s) 4.0 4.5 5.0 5.5 Figure 44. Square Law Fade-In Times 14 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 12 10 8 6 4 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FADE-OUT TIME (s) 4.0 4.5 Figure 45. Square Law Fade-Out Times 0 0 8 2 5.5 07445-031 10 10 Figure 42. Linear Fade-In Times Rev. B | Page 18 of 38 5.0 5.5 07445-034 16 LED SINK CURRENT (mA) 0 LED SINK CURRENT (mA) 4 07445-033 LINEAR 0 LED SINK CURRENT (mA) 0.5 Figure 43. Linear Fade-Out Times 8 07445-030 LED SINK CURRENT (mA) 0 10 07445-032  Fullscale _ Current 63 0.3 SEC 0.6 SEC 0.9 SEC 1.2 SEC 1.5 SEC 1.8 SEC 2.1 SEC 2.4 SEC 2.7 SEC 3.0 SEC 3.5 SEC 4.0 SEC 4.5 SEC 5.0 SEC 5.5 SEC 12 LED SINK CURRENT (mA)  LED Sink Current =  Code × 14 Data Sheet ADP5520 INTERRUPT OUTPUT (INT) The ADP5520 can generate interrupts to an external processor via its interrupt output, INT. INT is an active low open-drain pin that must be pulled up to VDDIO. INT can be asserted by one of several internal blocks, as shown in Figure 47. VDDIO ALS COMPARATOR INTERRUPTS GPIO INTERRUPTS KEY PRESS INTERRUPTS Program all fade, on, and off timers before enabling any of the LED current sinks. If LEDx is on during a blink cycle and LEDx_EN is cleared, it turns off (or fades to off if fade-out is enabled). If LEDx is off during a blink cycle and LEDx_EN is cleared, then it stays off. LEDx CURRENT OR INT KEY RELEASE INTERRUPTS OVERVOLTAGE INTERRUPT 07445-036 The LED current sinks have additional timers to facilitate blinking functions. A shared on timer (LED_ONT) used in conjunction with three off timers (LED1_OFFT, LED2_OFFT, and LED3_OFFT) allow the LED current sinks to be configured in various blinking modes. The on timer can be set to four different settings: 0.2 sec, 0.6 sec, 0.8 sec, and 1.2 sec. The off timers have four different settings: disabled, 0.6 sec, 0.8 sec, and 1.2 sec. Blink mode is activated by setting the off timers to any setting other than disabled. Figure 47. INT Pin Drive RESET INPUT (RST) ON TIME FADE-IN ON TIME FADE-OUT FADE-IN The ADP5520 can be restored to a power-on reset state if the RST pin is held low. RST contains a debounce circuit, so the pin must be held low for greater than 75 μs (typical) before a reset occurs. FADE-OUT MAX LEDx_EN = 1 SET BY USER OFF TIME 07445-035 OFF TIME Figure 46. LEDx Blink Mode with Fading Rev. B | Page 19 of 38 ADP5520 Data Sheet COMMUNICATION INTERFACE Figure 49 shows a typical read sequence for reading back an internal register. Communication to the ADP5520 is done via its I2C-compatible serial interface. Figure 48 shows a typical write sequence for programming an internal register. 5. 6. 7. 8. 0 = WRITE ST SP 1 1 0 0 1 CHIP ADDRESS 0 0 0 0 REGISTER ADDRESS 0 ADP5520 RECEIVES DATA 07445-037 0 ADP5520 ACK Figure 48. I2C Write Sequence 0 = WRITE 1 = READ ST 0 1 1 0 0 1 CHIP ADDRESS 0 0 0 0 REGISTER ADDRESS SP 0 1 1 0 0 1 CHIP ADDRESS Figure 49. I2C Read Sequence Rev. B | Page 20 of 38 0 0 1 ADP5520 SENDS DATA 07445-038 ST NO ACK 7. 4. ADP5520 ACK 5. 6. 3. ADP5520 ACK 4. The cycle begins with a start condition, followed by the chip write address (0x64). The ADP5520 acknowledges the chip write address byte by pulling the data line low. The address of the register from which data is to be read is sent next. The ADP5520 acknowledges the register address byte by pulling the data line low. The cycle continues with a repeat start, followed by the chip read address (0x65). The ADP5520 acknowledges the chip read address byte by pulling the data line low. The ADP5520 places the contents of the previously addressed register on the bus for readback. There is a no acknowledge following the readback data byte, and the cycle is completed with a stop condition. 2. ADP5520 ACK 3. ADP5520 ACK 2. 1. The cycle begins with a start condition, followed by the chip write address (0x64). The ADP5520 acknowledges the chip write address byte by pulling the data line low. The address of the register to which data is to be written is sent next. The ADP5520 acknowledges the register address byte by pulling the data line low. The data byte to be written is sent next. The ADP5520 acknowledges the data byte by pulling the data line low. A stop condition completes the sequence. ADP5520 ACK 1. Data Sheet ADP5520 REGISTER MAP All registers are 0 on reset. Unused bits are read as 0. Table 7. Register Address 0x00 Register Name MODE_STATUS 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x21 0x22 0x23 0x24 0x25 INTERRUPT_ENABLE BL_CONTROL BL_TIME BL_FADE DAYLIGHT_MAX DAYLIGHT_DIM OFFICE_MAX OFFICE_DIM DARK_MAX DARK_DIM BL_VALUE ALS_CMPR_CFG L2_TRIP L2_HYS L3_TRIP L3_HYS LED_CONTROL LED_TIME LED_FADE LED1_CURRENT LED2_CURRENT LED3_CURRENT GPIO_CFG_1 GPIO_CFG_2 GPIO_IN GPIO_OUT GPIO_INT_EN GPIO_INT_STAT GPIO_INT_LVL GPIO_DEBOUNCE GPIO_PULLUP KP_INT_STAT_1 KP_INT_STAT_2 KR_INT_STAT_1 KR_INT_STAT_2 KEY_STAT_1 KEY_STAT_2 Register Description Sets device operating mode. Contains enables for backlight on/dim. Contains top-level interrupt status bits. Contains enables for allowing interrupts to assert INT. Sets parameters relating to backlight control. Contains backlight off and dim timers. Contains backlight fade-in and fade-out timers. Sets daylight (L1) maximum current. Sets daylight (L1) dim current. Sets office (L2) maximum current. Sets office (L2) dim current. Sets dark (L3) maximum current. Sets dark (L3) dim current. Read-only register of what the backlight is presently set to. Sets enables and filters for ambient light sensor comparators. Contains comparator output status bits. Sets the light sensor comparator (L2_CMPR) threshold point. Sets the light sensor comparator (L2_CMPR hysteresis. Sets the light sensor comparator (L3_CMPR) threshold point. Sets the light sensor comparator (L3_CMPR) hysteresis. Contains enables and configuration for the three auxiliary LED current sinks. Contains the on and off timers for the three auxiliary LED current sinks. Contains the fade-in and fade-out timers for the three auxiliary LED current sinks. Sets the LED 1 (ILED) sink current. Sets the LED 2 (C3) sink current. Sets the LED 3 (R3) sink current. Configuration for I/O pins. (GPIOs or keypad matrix) Configuration for I/O pins. (GPIO direction, input or output) Read-only register. Reflects the logic state of GPIO inputs. Sets GPIO output logic drive level. GPIO input interrupt enable. GPIO input interrupt status. Configures the GPIO input interrupt level that causes an interrupt (active high or low). GPIO input debounce enable/disable. GPIO pull-up enable/disable. Read only register. Contains interrupt status information for key presses on Key A through Key H. Read-only register. Contains interrupt status information for key presses on Key I through Key P. Read-only register. Contains interrupt status information for key releases on Key A through Key H. Read-only register. Contains interrupt status information for key releases on Key I through Key P. Read-only register. Reflects the present state of Key A through Key H. Read-only register. Reflects the present state of Key I through Key P. Rev. B | Page 21 of 38 ADP5520 Data Sheet DETAILED REGISTER DESCRIPTIONS If one of the interrupt bits in Table 8 is cleared and there is a pending interrupt, INT deasserts for 50 μs and reasserts, but the status of the pending interrupt stays set. Table 8. Register 0x00, Device Mode and Status (MODE_STATUS) Bit 7 Mnemonic STNBY R/W R/W 6 BL_EN R/W 5 DIM_EN 4 OVP_INT 3 CMPR_INT 2 GPI_INT 1 KR_INT 0 KP_INT R/W Description 0 = device is in standby mode. If 1.8 V ≤ VDDIO ≤ 3.3 V, then I2C, GPIO, and key scanning functions are available. 1 = device is in operating mode. Additional functions, such as backlight driver, auxiliary LED sinks, and ambient light sensor functions, can be enabled. 0 = backlight driver is disabled. 1 = backlight driver is enabled. 0 = dim mode is disabled. 1 = dim mode is enabled. Dim mode can be enabled in two ways. One is by manually setting this bit, in which case the backlight stays at a dim level until this bit is manually cleared. The second method is by setting the BL_DIMT timer, in which case an internal state machine sets this bit when the timer expires. 0 = no overvoltage protection (OVP) condition. 1 = OVP condition detected. Once set, this bit can be cleared by writing a 1 to it. 0 = no ambient light sensor comparators have triggered. 1 = One of the ambient light sensor comparators has triggered. Once set, this bit can be cleared by writing a 1 to it. 0 = no GPIO input interrupt detected. 1 = GPIO input interrupt condition has occurred. To clear this interrupt bit, the GPIO interrupt status (Register 0x1C) must be cleared first. Then this bit can be cleared by writing a 1 to it. 0 = no key release interrupt present. 1 = key release detected. To clear this interrupt bit, Key Release Interrupt Status 1 (Register 0x22) and Key Release Interrupt Status 2 (Register 0x23) must be cleared first. Then this bit can be cleared by writing a 1 to it. 0 = no key press interrupt present. 1 = key press detected. To clear this interrupt bit, Key Press Interrupt Status 1 (Register 0x20) and Key Press Interrupt Status 2 (Register 0x21) must be cleared first. Then this bit can be cleared by writing a 1 to it. Table 9. Register 0x01, Interrupt Enable (INTERRUPT_ENABLE) Bit [7:5] 4 Mnemonic R/W AUTO_LD_EN R/W 3 CMPR_IEN R/W 2 OVP_IEN R/W 1 KR_IEN R/W 0 KP_IEN R/W Description Unused. 0 = autoload disabled. 1 = autoload enabled. A 1 mA dummy load turns on when the backlight code is less than 8 (linear law) or less than Code 32 (square law). 0 = ambient light sensor comparators interrupt disabled. 1 = ambient light sensor comparators interrupt enabled. 0 = OVP interrupt disabled. 1 = OVP interrupt enabled. 0 = key release interrupt disabled. 1 = key release interrupt enabled. 0 = key press interrupt disabled. 1 = key press interrupt enabled. Rev. B | Page 22 of 38 Data Sheet ADP5520 Table 10. Register 0x02, Backlight Control (BL_CONTROL) Bit [7:6] Mnemonic BL_LVL R/W R/W [5:4] BL_LAW R/W 3 BL_AUTO_ADJ R/W 2 OVP_EN R/W 1 FOVR R/W 0 KP_BL_EN R/W Description Brightness level control for the backlight. 00 = daylight (L1). 01 = office (L2). 10 = dark (L3). See the description for the BL_AUTO_ADJ bit. Backlight fade-on/fade-off transfer characteristic. 00 = linear. 01 = square. 10 = Cubic 1. 11 = Cubic 2. 0 = ambient light sensor comparators have no effect on the backlight operating level. The user can manually adjust backlight operating level using the BL_LVL bits. 1 = ambient light sensor comparators automatically adjust the backlight operating level. The internal state machine takes control of the BL_LVL bits. 0 = backlight ramp-down during OVP disabled. 1 = backlight ramp-down during OVP enabled. 0 = backlight fade override disabled. 1 = backlight fade override enabled. 0 = key press has no effect on the backlight. 1 = key press causes internal state machine to assert BL_EN and turn on the backlight. If this function is used, assert this bit before asserting STNBY = 1. Table 11. Register 0x03, Backlight Off and Dim Timers (BL_TIME) Bit [7:4] Mnemonic BL_OFFT R/W R/W [3:0] BL_DIMT R/W Description Backlight off timer (set this timer before BL_EN is set). 0000 = timer disabled. 0001 = 10 sec. 0010 = 15 sec. 0011 = 20 sec. 0100 = 25 sec. 0101 = 30 sec. 0110 = 35 sec. 0111 = 40 sec. 1000 = 50 sec. 1001 = 60 sec. 1010 = 70 sec. 1011 = 80 sec. 1100 = 90 sec. 1101 = 100 sec. 1110 = 110 sec. 1111 = 120 sec. Backlight dim timer (set this timer before BL_EN is set). 0000 = timer disabled. 0001 = 10 sec. 0010 = 15 sec. 0011 = 20 sec. 0100 = 25 sec. 0101 = 30 sec. 0110 = 35 sec. 0111 = 40 sec. 1000 = 50 sec. 1001 = 60 sec. Rev. B | Page 23 of 38 ADP5520 Bit Mnemonic Data Sheet R/W Description 1010 = 70 sec. 1011 = 80 sec. 1100 = 90 sec. 1101 = 100 sec. 1110 = 110 sec. 1111 = 120 sec. Table 12. Register 0x04, Backlight Fade-In and Fade-Out Timers (BL_FADE) Bit [7:4] Mnemonic BL_FO R/W R/W [3:0] BL_FI R/W Description Backlight fade-out timer (set this timer before BL_EN is set). 0000 = timer disabled. 0001 = 0.3 sec. 0010 = 0.6 sec. 0011 = 0.9 sec. 0100 = 1.2 sec. 0101 = 1.5 sec. 0110 = 1.8 sec. 0111 = 2.1 sec. 1000 = 2.4 sec. 1001 = 2.7 sec. 1010 = 3.0 sec. 1011 = 3.5 sec. 1100 = 4.0 sec. 1101 = 4.5 sec. 1110 = 5.0 sec. 1111 = 5.5 sec. Backlight fade-in timer (set this timer before BL_EN is set). 0000 = timer disabled. 0001 = 0.3 sec. 0010 = 0.6 sec. 0011 = 0.9 sec. 0100 = 1.2 sec. 0101 = 1.5 sec. 0110 = 1.8 sec. 0111 = 2.1 sec. 1000 = 2.4 sec. 1001 = 2.7 sec. 1010 = 3.0 sec. 1011 = 3.5 sec. 1100 = 4.0 sec. 1101 = 4.5 sec. 1110 = 5.0 sec. 1111 = 5.5 sec. Table 13. Register 0x05, Level 1 (Daylight) Maximum Current (DAYLIGHT_MAX) Bit 7 [6:0] Mnemonic R/W DAYLIGHT_MAX R/W Description Unused. Maximum current setting for the backlight when BL_LVL is at Level 1 (daylight). See Figure 16 for backlight current vs. sink code relationship. Rev. B | Page 24 of 38 Data Sheet ADP5520 Table 14. Register 0x06, Level 1 (Daylight) Dim Current (DAYLIGHT_DIM) Bit 7 [6:0] Mnemonic R/W DAYLIGHT_DIM R/W Description Unused. Dim current setting for the backlight when BL_LVL is at Level 1 (daylight). See Figure 16 for backlight current vs. sink code relationship. Table 15. Register 0x07, Level 2 (Office) Maximum Current (OFFICE_MAX) Bit 7 [6:0] Mnemonic R/W OFFICE_MAX R/W Description Unused. Maximum current setting for the backlight when BL_LVL is at Level 2 (office). See Figure 16 for backlight current vs. sink code relationship. Table 16. Register 0x08, Level 2 (Office) Dim Current (OFFICE_DIM) Bit 7 [6:0] Mnemonic R/W OFFICE_DIM R/W Description Unused. Dim current setting for the backlight when BL_LVL is at Level 2 (office). See Figure 16 for backlight current vs. sink code relationship. Table 17. Register 0x09, Level 3 (Dark) Maximum Current (DARK_MAX) Bit 7 6 to 0 Mnemonic R/W DARK_MAX R/W Description Unused. Maximum current setting for the backlight when BL_LVL is at Level 3 (dark). See Figure 16 for backlight current vs. sink code relationship. Table 18. Register 0x0A, Level 3 (Dark) Dim Current (DARK_DIM) Bit 7 [6:0] Mnemonic R/W DARK_DIM R/W Description Unused. Dim current setting for the backlight when BL_LVL is at Level 3 (dark). See Figure 16 for backlight current vs. sink code relationship. Table 19. Register 0x0B, Backlight Current Value (BL_VALUE) Bit 7 [6:0] Mnemonic R/W BL_VALUE R Description Unused. Read-only register. Contains the present value to which the backlight is programmed. Table 20. Register 0x0C, Light Sensor Comparator Configuration (ALS_CMPR_CFG) Bit [7:5] Mnemonic FILT R/W R/W 4 FORCE_RD R/W 3 L3_OUT R 2 L2_OUT R 1 L3_EN R/W Description Light sensor filter time. 000 = 0.08 sec. 001 = 0.16 sec. 010 = 0.32 sec. 011 = 0.64 sec. 100 = 1.28 sec. 101 = 2.56 sec. 110 = 5.12 sec. 111 = 10.24 sec. Forces the light sensor comparator to perform a single conversion. This bit is cleared by the internal state machine when the conversion is complete. 0 = ambient light is greater than Level 3 (dark). 1 = L3_CMPR comparator has detected a change in ambient light from Level 2 (office) to Level 3 (dark). 0 = ambient light is greater than Level 2 (office). 1 = L2_CMPR comparator has detected a change in ambient light from Level 1 (daylight) to Level 2 (office). 0 = disable Comparator L3_CMPR. 1 = enable Comparator L3_CMPR. If automatic backlight adjustment is required, BL_AUTO_ADJ must be set also. Rev. B | Page 25 of 38 ADP5520 Bit 0 Mnemonic L2_EN Data Sheet R/W R/W Description 0 = disable Comparator L2_CMPR. 1 = enable Comparator L2_CMPR. If automatic backlight adjustment is required, BL_AUTO_ADJ must be set also. Table 21. Register 0x0D, Level 2 (Office) Comparator Trip Point (L2_TRIP) Bit [7:0] Mnemonic L2_TRIP R/W R/W Description Sets the trip value for Comparator L2_CMPR. If ambient light levels fall below this trip point, L2_OUT is set. Each code is equal to 4 μA (typical). Full scale is 1000 μA (typical). Table 22. Register 0x0E, Level 2 (Office) Comparator Hysteresis (L2_HYS) Bit [7:0] Mnemonic L2_HYS R/W R/W Description Sets the hysteresis value for Comparator L2_CMPR. If ambient light levels increase above L2_TRIP + L2_HYS, then L2_OUT is cleared. Each code is equal to 4 μA (typical). Full scale is 1000 μA (typical). Table 23. Register 0x0F, Level 3 (Dark) Comparator Trip Point (L3_TRIP) Bit [7:0] Mnemonic L3_TRIP R/W R/W Description Sets the trip value for Comparator L3_CMPR. If ambient light levels fall below this trip point, L3_OUT is set. Each code is equal to 0.5 μA (typical). Full scale is 127 μA (typical). Table 24. Register 0x10, Level 3 (Dark) Comparator Hysteresis (L3_HYS) Bit [7:0] Mnemonic L3_HYS R/W R/W Description Sets the hysteresis value for Comparator L3_CMPR. If ambient light levels increase above L3_TRIP + L3_HYS, then L3_OUT is cleared. Each code is equal to 0.5 μA (typical). Full scale is 127 μA (typical). Table 25. Register 0x11, LED Control (LED_CONTROL) Bit [7:6] 5 Mnemonic R/W R3_MODE R/W 4 C3_MODE R/W 3 LED_LAW R/W 2 LED3_EN 1 LED2_EN 0 LED1_EN Description Unused. 0 = R3 is configured as a current sink (LED 3). 1 = R3 is configured as a GPIO (D3). 0 = C3 is configured as a current sink (LED 2). 1 = C3 is configured as a GPIO (D7). LED current sink fade-on/fade-off transfer characteristic. 0 = linear. 1 = square. 0 = LED 3 is disabled. 1 = LED 3 is enabled. 0 = LED 2 is disabled. 1 = LED 2 is enabled. 0 = LED 1 is disabled. 1 = LED 1 is enabled. Table 26. Register 0x12, Auxiliary LED On and Off Timers (LED_TIME) Bit [7:6] Mnemonic LED_ONT R/W R/W [5:4] LED3_OFFT R/W Description Sets the LED on time when used in conjunction with the LEDx_OFFT timer to perform LED blinking. All three LED sinks share this common timer. 00 = 0.2 sec. 01 = 0.6 sec. 10 = 0.8 sec. 11 = 1.2 sec. Sets the LED 3 off time when used in conjunction with the LED_ONT timer to perform LED blinking. LED 3 stays on continuously if the timer is disabled. 00 = LED 3 timer disabled. 01 = 0.6 sec. 10 = 0.8 sec. 11 = 1.2 sec. Rev. B | Page 26 of 38 Data Sheet ADP5520 Bit [3:2] Mnemonic LED2_OFFT R/W R/W [1:0] LED1_OFFT R/W Description Sets the LED 2 off time when used in conjunction with the LED_ONT timer to perform LED blinking. LED 2 stays on continuously if the timer is disabled. 00 = LED 2 timer disabled. 01 = 0.6 sec. 10 = 0.8 sec. 11 = 1.2 sec. Sets the LED 1 off time when used in conjunction with the LED _ONT timer to perform LED blinking. LED 1 stays on continuously if the timer is disabled. 00 = LED 1 timer disabled. 01 = 0.6 sec. 10 = 0.8 sec. 11 = 1.2 sec. Table 27. Register 0x13, LED Fade-In and Fade-Out Timers (LED_FADE) Bit [7:4] Mnemonic LED_FO R/W R/W [3:0] LED_FI R/W Description LED fade-out timer (set this timer before LED x_EN is enabled). 0000 = timer disabled. 0001 = 0.3 sec. 0010 = 0.6 sec. 0011 = 0.9 sec. 0100 = 1.2 sec. 0101 = 1.5 sec. 0110 = 1.8 sec. 0111 = 2.1 sec. 1000 = 2.4 sec. 1001 = 2.7 sec. 1010 = 3.0 sec. 1011 = 3.5 sec. 1100 = 4.0 sec. 1101 = 4.5 sec. 1110 = 5.0 sec. 1111 = 5.5 sec. LED fade-in timer (set this timer before LED x_EN is enabled). 0000 = timer disabled. 0001 = 0.3 sec. 0010 = 0.6 sec. 0011 = 0.9 sec. 0100 = 1.2 sec. 0101 = 1.5 sec. 0110 = 1.8 sec. 0111 = 2.1 sec. 1000 = 2.4 sec. 1001 = 2.7 sec. 1010 = 3.0 sec. 1011 = 3.5 sec. 1100 = 4.0 sec. 1101 = 4.5 sec. 1110 = 5.0 sec. 1111 = 5.5 sec. Rev. B | Page 27 of 38 ADP5520 Data Sheet Table 28. Register 0x14, LED 1 Sink Current (LED1_CURRENT) Bit [7:6] [5:0] Mnemonic R/W LED1_CURRENT R/W Description Unused. Sink current setting for LED 1. See Figure 41 for LED sink current vs. code relationship. Table 29. Register 0x15, LED 2 Sink Current (LED2_CURRENT) Bit [7:6] [5:0] Mnemonic R/W LED2_CURRENT R/W Description Unused. Sink current setting for LED 2. See Figure 41 for LED sink current vs. code relationship. Table 30. Register 0x16, LED 3 Sink Current (LED3_CURRENT) Bit [7:6] [5:0] Mnemonic R/W LED3_CURRENT R/W Description Unused. Sink current setting for LED 3. See Figure 41 for LED sink current vs. code relationship. Table 31. Register 0x17, GPIO Configuration 1 (Pin Configuration) (GPIO_CFG_1) Bit 7 Mnemonic C3_CONFIG R/W R/W 6 C2_CONFIG R/W 5 C1_CONFIG R/W 4 C0_CONFIG R/W 3 R3_CONFIG R/W 2 R2_CONFIG R/W 1 R1_CONFIG R/W 0 R0_CONFIG R/W Description 0 = C3 is configured as a GPIO (D7). 1 = C3 is configured as a keypad column (Column 3). Ensure that C3_MODE = 1 when C3 is to be used as a GPIO or a keypad column. 0 = C2 is configured as a GPIO (D6). 1 = C2 is configured as a keypad column (Column 2). 0 = C1 is configured as a GPIO (D5). 1 = C1 is configured as a keypad column (Column 1). 0 = C0 is configured as a GPIO (D4). 1 = C0 is configured as a keypad column (Column 0). 0 = R3 is configured as a GPIO (D3). 1 = R3 is configured as a keypad row (Row 3). Ensure that R3_MODE = 1 when R3 is to be used as a GPIO or a keypad row. 0 = R2 is configured as a GPIO (D2). 1 = R2 is configured as a keypad row (Row 2). 0 = R1 is configured as a GPIO (D1). 1 = R1 is configured as a keypad row (Row 1). 0 = R0 is configured as a GPIO (D0). 1 = R0 is configured as a keypad row (Row 0). Table 32. Register 0x18, GPIO Configuration 2 (GPIO Direction) (GPIO_CFG_2) Bit 7 Mnemonic D7_DIR R/W R/W 6 D6_DIR R/W 5 D5_DIR R/W 4 D4_DIR R/W 3 D3_DIR R/W 2 D2_DIR R/W 1 D1_DIR R/W 0 D0_DIR R/W Description 0 = D7 is configured as an input. 1 = D7 is configured as an output. 0 = D6 is configured as an input. 1 = D6 is configured as an output. 0 = D5 is configured as an input. 1 = D5 is configured as an output. 0 = D4 is configured as an input. 1 = D4 is configured as an output. 0 = D3 is configured as an input. 1 = D3 is configured as an output. 0 = D2 is configured as an input. 1 = D2 is configured as an output. 0 = D1 is configured as an input. 1 = D1 is configured as an output. 0 = D0 is configured as an input. 1 = D0 is configured as an output. Rev. B | Page 28 of 38 Data Sheet ADP5520 Table 33. Register 0x19, GPIO Input Status (GPIO_IN) Bit 7 Mnemonic D7_IN R/W R 6 D6_IN R 5 D5_IN R 4 D4_IN R 3 D3_IN R 2 D2_IN R 1 D1_IN R 0 D0_IN R Description 0 = D7 input is low. 1 = D7 input is high. 0 = D6 input is low. 1 = D6 input is high. 0 = D5 input is low. 1 = D5 input is high. 0 = D4 input is low. 1 = D4 input is high. 0 = D3 input is low. 1 = D3 input is high. 0 = D2 input is low. 1 = D2 input is high. 0 = D1 input is low. 1 = D1 input is high. 0 = D0 input is low. 1 = D0 input is high. Table 34. Register 0x1A, GPIO Output Drive (GPIO_OUT) Bit 7 Mnemonic D7_OUT R/W R/W 6 D6_OUT R/W 5 D5_OUT R/W 4 D4_OUT R/W 3 D3_OUT R/W 2 D2_OUT R/W 1 D1_OUT R/W 0 D0_OUT R/W Description 0 = D7 output is driven low. 1 = D7 output is driven high. 0 = D6 output is driven low. 1 = D6 output is driven high. 0 = D5 output is driven low. 1 = D5 output is driven high. 0 = D4 output is driven low. 1 = D4 output is driven high. 0 = D3 output is driven low. 1 = D3 output is driven high. 0 = D2 output is driven low. 1 = D2 output is driven high. 0 = D1 output is driven low. 1 = D1 output is driven high. 0 = D0 output is driven low. 1 = D0 output is driven high. Table 35. Register 0x1B, GPIO Interrupt Enable (GPIO_INT_EN) Bit 7 Mnemonic D7_IN_IEN R/W R/W 6 D6_IN_IEN R/W 5 D5_IN_IEN R/W 4 D4_IN_IEN R/W 3 D3_IN_IEN R/W 2 D2_IN_IEN R/W Description 0 = prevents D7 input from generating interrupts on INT. 1 = allows D7 input to generate interrupts on INT. 0 = prevents D6 input from generating interrupts on INT. 1 = allows D6 input to generate interrupts on INT. 0 = prevents D5 input from generating interrupts on INT. 1 = allows D5 input to generate interrupts on INT. 0 = prevents D4 input from generating interrupts on INT. 1 = allows D4 input to generate interrupts on INT. 0 = prevents D3 input from generating interrupts on INT. 1 = allows D3 input to generate interrupts on INT. 0 = prevents D2 input from generating interrupts on INT. 1 = allows D2 input to generate interrupts on INT. Rev. B | Page 29 of 38 ADP5520 Data Sheet Bit 1 Mnemonic D1_IN_IEN R/W R/W 0 D0_IN_IEN R/W Description 0 = prevents D1 input from generating interrupts on INT. 1 = allows D1 input to generate interrupts on INT. 0 = prevents D0 input from generating interrupts on INT. 1 = allows D0 input to generate interrupts on INT. Table 36. Register 0x1C, GPIO Interrupt Status (GPIO_INT_STAT) Bit 7 Mnemonic D7_IN_ISTAT R/W R 6 D6_IN_ISTAT R 5 D5_IN_ISTAT R 4 D4_IN_ISTAT R 3 D3_IN_ISTAT R 2 D2_IN_ISTAT R 1 D1_IN_ISTAT R 0 D0_IN_ISTAT R Description 0 = no interrupt detected. 1 = interrupt condition detected on D7_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D6_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D5_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D4_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D3_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D2_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D1_IN. Bit cleared when read twice. 0 = no interrupt detected. 1 = interrupt condition detected on D0_IN. Bit cleared when read twice. Table 37. Register 0x1D, GPIO Interrupt Level Configuration (GPIO_INT_LVL) Bit 7 Mnemonic D7_ILVL R/W R/W 6 D6_ILVL R/W 5 D5_ILVL R/W 4 D4_ILVL R/W 3 D3_ILVL R/W 2 D2_ILVL R/W 1 D1_ILVL R/W 0 D0_ILVL R/W Description 0 = interrupt generated when D7_IN is low. 1 = interrupt generated when D7_IN is high. 0 = interrupt generated when D6_IN is low. 1 = interrupt generated when D6_IN is high. 0 = interrupt generated when D5_IN is low. 1 = interrupt generated when D5_IN is high. 0 = interrupt generated when D4_IN is low. 1 = interrupt generated when D4_IN is high. 0 = interrupt generated when D3_IN is low. 1 = interrupt generated when D3_IN is high. 0 = interrupt generated when D2_IN is low. 1 = interrupt generated when D2_IN is high. 0 = interrupt generated when D1_IN is low. 1 = interrupt generated when D1_IN is high. 0 = interrupt generated when D0_IN is low. 1 = interrupt generated when D0_IN is high. Rev. B | Page 30 of 38 Data Sheet ADP5520 Table 38. Register 0x1E, GPIO Input Debounce Enable/Disable (GPIO_DEBOUNCE) Bit 7 Mnemonic D7_ IN_ DBNC R/W R/W 6 D6_ IN_ DBNC R/W 5 D5_ IN_ DBNC R/W 4 D4_ IN_ DBNC R/W 3 D3_ IN_ DBNC R/W 2 D2_ IN_ DBNC R/W 1 D1_ IN_ DBNC R/W 0 D0_ IN_ DBNC R/W Description 0 = D7_IN debounce enabled. 1 = D7_IN debounce disabled. 0 = D6_IN debounce enabled. 1 = D6_IN debounce disabled. 0 = D5_IN debounce enabled. 1 = D5_IN debounce disabled. 0 = D4_IN debounce enabled. 1 = D4_IN debounce disabled. 0 = D3_IN debounce enabled. 1 = D3_IN debounce disabled. 0 = D2_IN debounce enabled. 1 = D2_IN debounce disabled. 0 = D1_IN debounce enabled. 1 = D1_IN debounce disabled. 0 = D0_IN debounce enabled. 1 = D0_IN debounce disabled. Table 39. Register 0x1F, GPIO Pull-Up Enable/Disable (GPIO_PULLUP) Bit 7 Mnemonic D7_PULL R/W R/W 6 D6_PULL R/W 5 D5_PULL R/W 4 D4_PULL R/W 3 D3_PULL R/W 2 D2_PULL R/W 1 D1_PULL R/W 0 D0_PULL R/W Description 0 = D7_IN pull-up disabled. 1 = D7_IN pull-up enabled. 0 = D6_IN pull-up disabled. 1 = D6_IN pull-up enabled. 0 = D5_IN pull-up disabled. 1 = D5_IN pull-up enabled. 0 = D4_IN pull-up disabled. 1 = D4_IN pull-up enabled. 0 = D3_IN pull-up disabled. 1 = D3_IN pull-up enabled. 0 = D2_IN pull-up disabled. 1 = D2_IN pull-up enabled. 0 = D1_IN pull-up disabled. 1 = D1_IN pull-up enabled. 0 = D0_IN pull-up disabled. 1 = D0_IN pull-up enabled. Table 40. Register 0x20, Key Press Interrupt Status 1 (KP_INT_STAT_1) Bit 7 Mnemonic KP_A_ISTAT R/W R 6 KP_B_ISTAT R 5 KP_C_ISTAT R 4 KP_D_ISTAT R 3 KP_E_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key A press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key B press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key C press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key D press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key E press. Bit cleared on read. Rev. B | Page 31 of 38 ADP5520 Data Sheet Bit 2 Mnemonic KP_F_ISTAT R/W R 1 KP_G_ISTAT R 0 KP_H_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key F press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key G press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key H press. Bit cleared on read. Table 41. Register 0x21, Key Press Interrupt Status 2 (KP_INT_STAT_2) Bit 7 Mnemonic KP_I_ISTAT R/W R 6 KP_J_ISTAT R 5 KP_K_ISTAT R 4 KP_L_ISTAT R 3 KP_M_ISTAT R 2 KP_N_ISTAT R 1 KP_O_ISTAT R 0 KP_P_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key I press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key J press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key K press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key L press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key M press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key N press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key O press. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key P press. Bit cleared on read. Table 42. Register 0x22, Key Release Interrupt Status 1 (KR_INT_STAT_1) Bit 7 Mnemonic KR_A_ISTAT R/W R 6 KR_B_ISTAT R 5 KR_C_ISTAT R 4 KR_D_ISTAT R 3 KR_E_ISTAT R 2 KR_F_ISTAT R 1 KR_G_ISTAT R 0 KR_H_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key A release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key B release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key C release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key D release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key E release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key F release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key G release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key H release. Bit cleared on read. Table 43. Register 0x23, Key Release Interrupt Status 2 (KR_INT_STAT_2) Bit 7 Mnemonic KR_I_ISTAT R/W R 6 KR_J_ISTAT R 5 KR_K_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key I release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key J release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key K release. Bit cleared on read. Rev. B | Page 32 of 38 Data Sheet ADP5520 Bit 4 Mnemonic KR_L_ISTAT R/W R 3 KR_M_ISTAT R 2 KR_N_ISTAT R 1 KR_O_ISTAT R 0 KR_P_ISTAT R Description 0 = no interrupt detected. 1 = interrupt due to Key L release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key M release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key N release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key O release. Bit cleared on read. 0 = no interrupt detected. 1 = interrupt due to Key P release. Bit cleared on read. Table 44. Register 0x24, Key Status 1 (KEY_STAT_1) Bit 7 Mnemonic KEY_A_STAT R/W R 6 KEY_B_STAT R 5 KEY_C_STAT R 4 KEY_D_STAT R 3 KEY_E_STAT R 2 KEY_F_STAT R 1 KEY_G_STAT R 0 KEY_H_STAT R Description 0 = Key A is currently released. 1 = Key A is currently pressed. 0 = Key B is currently released. 1 = Key B is currently pressed. 0 = Key C is currently released. 1 = Key C is currently pressed. 0 = Key D is currently released. 1 = Key D is currently pressed. 0 = Key E is currently released. 1 = Key E is currently pressed. 0 = Key F is currently released. 1 = Key F is currently pressed. 0 = Key G is currently released. 1 = Key G is currently pressed. 0 = Key H is currently released. 1 = Key H is currently pressed. Table 45. Register 0x25, Key Status 2 (KEY_STAT_2) Bit 7 Mnemonic KEY_I_STAT R/W R 6 KEY_J_STAT R 5 KEY_K_STAT R 4 KEY_L_STAT R 3 KEY_M_STAT R 2 KEY_N_STAT R 1 KEY_O_STAT R 0 KEY_P_STAT R Description 0 = Key I is currently released. 1 = Key I is currently pressed. 0 = Key J is currently released. 1 = Key J is currently pressed. 0 = Key K is currently released. 1 = Key K is currently pressed. 0 = Key L is currently released. 1 = Key L is currently pressed. 0 = Key M is currently released. 1 = Key M is currently pressed. 0 = Key N is currently released. 1 = Key N is currently pressed. 0 = Key O is currently released. 1 = Key O is currently pressed. 0 = Key P is currently released. 1 = Key P is currently pressed. Rev. B | Page 33 of 38 ADP5520 Data Sheet APPLICATIONS INFORMATION CONVERTER TOPOLOGY The ADP5520 backlight driver utilizes a dc-to-dc step-up (boost) converter to achieve the high voltage levels required to drive up to six white LEDs in series. Figure 50 shows the basic asynchronous boost converter topology. 4.7µH SW 1µF BST 2 BL_SNK 22 27V I-LIMIT 23 AUTO LOAD FB 0.65V OVP VOUT PGND 07445-058 VBAT BACKLIGHT CURRENT CONTROL BOOST CONTROL 1 THERMAL S/D 21 07445-059 VIN 1µF VBAT Figure 51. Boost Configuration Figure 50. Basic Asynchronous Boost Converter Topology Assuming an initial steady state condition where the switch has been open for a long time, then the output voltage (VOUT) is equal to the input voltage (VIN), minus a diode drop. If the switch is closed, the output voltage maintains its value as the diode blocks its path to ground. The inductor, however, has a voltage differential across its terminals. Current in an inductor cannot change instantaneously, so it increases linearly at a rate of di/dt = VIN/L where L is the inductance value in Henrys. If the switch is kept closed, the current increases until the inductor reaches its saturation limit, at which point the inductor becomes a dc path to ground. Therefore, keep the switch closed only long enough to build some transient energy in the inductor, but not so long that the inductor becomes saturated. When the switch is opened, the current that has built up in the inductor continues to flow (as previously mentioned, the current in an inductor cannot change instantaneously), so the voltage at the top of the switch increases and forward biases the diode, allowing the inductor current to charge the capacitor, and, therefore, increase the overall output voltage level. If the switch is continuously opened and closed, the output voltage continues to increase. Figure 51 shows the boost configuration as used in the ADP5520. A Schottky diode is used due to its fast turn-on time and low forward voltage drop. An input capacitor is added to reduce ripple voltage that is generated on the input supply due to charging/ discharging of the inductor. An integrated power switch is used to control current levels in the inductor. A control loop consisting of a feedback signal, some safety limiting features, and a switch drive signal complete the boost converter topology. The ADP5520 uses a current-limiting PFM control scheme. For medium to large output currents, the converter operates in pseudo continuous conduction mode (CCM). It generates bursts of peak current limited pulses (600 mA typical) in the inductor, as shown in Figure 9. For light output currents, the converter operates in pseudo discontinuous conduction mode (DCM). It generates bursts of small (200 mA typical) and medium (400 mA typical) current pulses in the inductor, as shown in Figure 11. To maintain reasonable burst frequencies during very light load conditions, an automatic dummy load feature is available. When enabled, the 1 mA dummy load is activated if the backlight sink current code drops below 8 while in linear law mode, or if the backlight sink current code drops below 32 while in square law mode. Safety Features The ADP5520 utilizes an overvoltage protection (OVP) circuit that monitors the boosted voltage on the output capacitor. If the LED string becomes open (due to a broken LED), the control circuit continually commands the boost voltage to increase. If the boost level exceeds the maximum process rating for the ADP5520, damage to the device can occur. The ADP5520 boost converter has an OVP limit of 27 V (typical). The ADP5520 also has a feature that ramps down the backlight code when an OVP condition is detected. This may be useful in conditions where LEDs with marginally high forward voltages are used in low ambient conditions. The feature can be enabled by setting the OVP_EN bit in Register 0x02. The ADP5520 also features a thermal shutdown circuit. When the die junction temperature reaches 150°C (typical), the boost converter shuts down. It remains shut down until the die temperature falls by 10°C (typical). Rev. B | Page 34 of 38 Data Sheet ADP5520 Component Selection input capacitor with sufficient ripple current rating to handle the inductor ripple. A 1 μF X5R/X7R ceramic capacitor rated for 16 V dc bias is recommended for the input capacitance. The ADP5520 boost converter is designed for use with a 4.7 μH inductor. Choose an inductor with a sufficient current rating to prevent it from going into saturation. The peak current limit of the ADP5520 is 750 mA (maximum), so choose an inductor with a greater saturation rating. To maximize efficiency, choose an inductor with a low series resistance (DCR). The output capacitor maintains the output voltage when the Schottky diode is not conducting. Due to the high levels of boost voltage required, a 1 μF X5R/X7R ceramic capacitor rated for 50 V dc bias is recommended for output capacitance. The ADP5520 is an asynchronous boost and, as such, requires an external Schottky diode to conduct the inductor current to the output capacitor and LED string when the power switch is off. Ensure that the Schottky diode peak current rating is greater than the maximum inductor current. Choose a Schottky diode with an average current rating that is significantly larger than the maximum LED current. To prevent thermal runaway, derate the Schottky diode to ensure reliable operation at high junction temperatures. To maximize efficiency, select a Schottky diode with a low forward voltage. When the power switch is on, the Schottky diode blocks the dc path from the output capacitor to ground. Therefore, choose a Schottky diode with a reverse breakdown greater than the maximum boost voltage. A 40 V, 1 A Schottky diode is recommended. Note that dc bias characterization data is available from capacitor manufacturers and must be taken into account when selecting input and output capacitors. PCB LAYOUT Good PCB layout is important to maximize efficiency and to minimize noise and electromagnetic interference (EMI). To minimize large current loops, place the input capacitor, inductor, Schottky diode, and output capacitor as close as possible to each other and to the ADP5520 using wide tracks (use shapes where possible). For thermal relief, connect the exposed pad of the LFCSP package to ground (GND). Connect PGND and GND to each other at the bottom of the output capacitor. The input capacitor carries the input ripple current, allowing the input power source to supply only the dc current. Use an Figure 52 shows an example PCB layout with the main power components required for backlight driving. GND VBAT TOP OF LED STRING VBAT CAP_OUT SW BST GND PGND BL_SNK BOTTOM OF LED STRING GND GND CMP_IN VDDIO INT ADP5520 RST SCL ILED R2 CONNECT EXPOSED PAD TO GND Figure 52. Example PCB Layout Rev. B | Page 35 of 38 07445-061 C3 C2 C1 C0 R1 R3 R0 SOLUTION SIZE APPROXIMATELY 47mm2 SDA ADP5520 Data Sheet EXAMPLE CIRCUITS 1µF VBAT 4.7µH SW BST BL_SNK CAP_OUT 20 GND 18 ADP5520 5 SCL 11 A B C D E F G H I J K L M N O P R2 R1 R0 C0 C1 C2 14 12 6 VBAT 1µF 2 22 23 SW BST BL_SNK GND 18 GND 24 4 SDA 100nF CMP_IN 17 15 RST R3 C3 ILED 13 12 14 6 7 8 9 10 11 A B C E F G I J K VBAT VBAT 21 VBAT 16 VDDIO 5 SCL A B C E F G I J K R3 C3 13 12 ILED VBAT 14 VBAT 4 SDA 3 INT 15 RST Figure 54. I/O Configuration Example 2 22 23 BST BL_SNK CAP_OUT 20 1µF GND 19 GND 18 ADP5520 GND 24 100nF CMP_IN 17 R3 R2 R1 R0 C0 C1 C2 C3 13 07445-040 R2 R1 R0 C0 C1 C2 PGND SW I/O ADP5520 1 2.2kΩ 10kΩ GND 19 2.2kΩ 16 VDDIO 10kΩ I/O RAIL 1µF 3 INT 11 4.7µH 2 CAP_OUT 20 5 SCL 10 1µF VBAT 21 VBAT 9 Figure 55. I/O Configuration Example 3 4.7µH 1 PGND 8 7 07445-041 10 6 7 8 9 10 11 12 A B C D E F G H Figure 56. I/O Configuration Example 4 Rev. B | Page 36 of 38 ILED VBAT 14 VBAT 07445-042 9 I/O 8 I/O 7 1µF 2.2kΩ 100nF CMP_IN 17 I/O 6 VBAT 2.2kΩ GND 24 INT VBAT Figure 53. I/O Configuration Example 1 10kΩ GND 18 ADP5520 07445-039 13 10kΩ 1µF GND 19 15 RST ILED R3 R2 R1 R0 C0 C1 C2 C3 I/O RAIL CAP_OUT 20 16 VDDIO 3 CMP_IN 17 15 RST 1µF 23 BL_SNK 4 SDA 100nF INT 22 BST 5 SCL GND 24 4 SDA 3 2.2kΩ GND 19 2 SW 21 VBAT I/O RAIL 1µF 16 VDDIO 4.7µH 1 PGND 10kΩ 2.2kΩ 2.2kΩ 10kΩ 23 21 VBAT I/O RAIL 10kΩ 22 2.2kΩ 1 PGND 1µF 2 10kΩ 1µF 1µF VBAT Data Sheet ADP5520 1µF VBAT 4.7µH 2 PGND SW 21 VBAT 4 SDA 3 INT 15 RST CAP_OUT 20 GND 19 GND 18 2 22 23 SW BST BL_SNK CAP_OUT 20 21 VBAT I/O RAIL 1µF ADP5520 4.7µH 1 PGND 2.2kΩ SCL BL_SNK 10kΩ 5 BST 2.2kΩ VDDIO 23 10kΩ 16 1µF 16 VDDIO GND 19 GND 18 ADP5520 5 SCL GND 24 GND 24 4 SDA 100nF 100nF 3 INT CMP_IN 17 CMP_IN 17 15 RST 12 I/O I/O I/O I/O I/O I/O I/O R2 R1 R0 C0 C1 C2 14 VBAT 6 7 8 9 10 11 R3 C3 ILED 13 12 14 VBAT 07445-045 11 VBAT Figure 59. I/O Configuration Example 7 Figure 57. I/O Configuration Example 5 1µF VBAT 4.7µH 1µF 22 23 BST BL_SNK 2 PGND SW 21 VBAT SDA 3 INT 15 RST GND 19 GND 18 ADP5520 GND 24 100nF CMP_IN 17 R3 R2 R1 R0 C0 C1 C2 C3 ILED 9 10 11 12 14 A B E F I J M N 13 6 7 8 VBAT 1 PGND SW 21 VBAT 16 VDDIO 5 SCL 4 SDA 3 INT 15 RST 2.2kΩ 4 I/O RAIL 1µF 2.2kΩ SCL CAP_OUT 20 10kΩ 5 2 10kΩ VDDIO 4.7µH 22 23 BST BL_SNK CAP_OUT 20 1µF GND 19 GND 18 ADP5520 GND 24 100nF CMP_IN 17 R3 R2 R1 R0 C0 C1 C2 C3 13 6 7 8 9 10 11 12 ILED VBAT Figure 58. I/O Configuration Example 6 Figure 60. I/O Configuration Example 8 Rev. B | Page 37 of 38 VBAT 14 I/O PORT UNUSED 07445-044 16 2.2kΩ 2.2kΩ 10kΩ 10kΩ I/O RAIL 1 I/O 1µF 1µF VBAT 07445-046 10 I/O 9 I/O 8 I/O 7 VBAT I/O 6 ILED I/O 13 I/O R3 R2 R1 R0 C0 C1 C2 C3 I/O 2.2kΩ 10kΩ 2.2kΩ 10kΩ I/O RAIL 1 1µF 22 07445-043 1µF 1µF VBAT ADP5520 Data Sheet OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 0.30 0.25 0.20 1 0.50 BSC 2.44 2.30 SQ 2.16 EXPOSED PAD 13 TOP VIEW 0.80 0.75 0.70 6 12 7 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF SEATING PLANE PKG-003994/5111 0.50 0.40 0.30 PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 24 19 18 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8 03-09-2017-B PIN 1 INDICATOR 4.10 4.00 SQ 3.90 Figure 61. 24-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-24-14) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADP5520ACPZ-RL 1 Temperature Range −40°C to +85°C Package Description 24-Lead Lead Frame Chip Scale Package [LFCSP] Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). ©2008–2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07445-0-10/17(B) Rev. B | Page 38 of 38 Package Option CP-24-14
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