FEATURES
FUNCTIONAL BLOCK DIAGRAM
±0.5°C (typical) threshold accuracy
Factory-set trip points from
−45°C to +15°C in 10°C increments
+35°C to +115°C in 10°C increments
No external components required
Maximum temperature of 125°C
Open-drain output (ADT6501/ADT6503)
Push-pull output (ADT6502/ADT6504)
Pin-selectable hysteresis of 2°C and 10°C
Supply current of 30 µA (typical)
Space-saving, 5-lead SOT-23 package
VCC
4
ADT6501
Σ-Δ
TEMPERATURE-TODIGITAL CONVERTER
COMPARATOR
5
TOVER
FACTORY PRESET
TRIP POINT
REGISTER
2ºC/10ºC
APPLICATIONS
Medical equipment
Automotive
Cell phones
Hard disk drives
Personal computers
Electronic test equipment
Domestic appliances
Process control
1
2
3
GND
GND
HYST
06096-001
Data Sheet
Low Cost, 2.7 V to 5.5 V, Micropower
Temperature Switches in SOT-23
ADT6501/ADT6502/ADT6503/ADT6504
Figure 1.
GENERAL DESCRIPTION
The ADT6501/ADT6502/ADT6503/ADT6504 are trip point
temperature switches available in a 5-lead SOT-23 package.
Each part contains an internal band gap temperature sensor for
local temperature sensing. When the temperature crosses the
trip point setting, the logic output is activated. The ADT6501/
ADT6503 logic output is active low and open-drain. The
ADT6502/ADT6504 logic output is active high and push-pull.
The temperature is digitized to a resolution of 0.125°C (11-bit).
The factory trip point settings are 10°C apart starting from
−45°C to +15°C for the cold threshold models and from +35°C
to +115°C for the hot threshold models.
These devices require no external components and typically
consume 30 μA supply current. Hysteresis is pin-selectable at
2°C and 10°C. The temperature switch is specified to operate
over the supply range of 2.7 V to 5.5 V.
The ADT6501 and ADT6502 are used for monitoring
temperatures from +35°C to +115°C only. Therefore, the logic
output pin becomes active when the temperature goes higher
than the selected trip point temperature.
Rev. B
The ADT6503 and ADT6504 are used for monitoring temperatures from −45°C to +15°C only. Therefore, the logic output
pin becomes active when the temperature goes lower than the
selected trip point temperature.
PRODUCT HIGHLIGHTS
1.
Σ-Δ based temperature measurement gives high accuracy
and noise immunity.
2.
Wide operating temperature range from −55°C to +125°C.
3.
±0.5°C typical accuracy from −45°C to +115°C.
4.
Factory threshold settings from −45°C to +115°C in
10°C increments.
5.
Supply voltage is 2.7 V to 5.5 V.
6.
Supply current of 30 μA.
7.
Space-saving, 5-lead SOT-23 package.
8.
Pin-selectable temperature hysteresis of 2°C or 10°C.
9.
Temperature resolution of 0.125°C.
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Technical Support
www.analog.com
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Converter Details ..........................................................................8
Applications ....................................................................................... 1
Factory-Programmed Threshold Range ....................................8
Functional Block Diagram .............................................................. 1
Hysteresis Input .............................................................................8
General Description ......................................................................... 1
Temperature Conversion ..............................................................8
Product Highlights ........................................................................... 1
Application Information ................................................................ 10
Revision History ............................................................................... 2
Thermal Response Time ........................................................... 10
Specifications..................................................................................... 3
Self-Heating Effects .................................................................... 10
Absolute Maximum Ratings............................................................ 4
Supply Decoupling ..................................................................... 10
ESD Caution .................................................................................. 4
Temperature Monitoring ........................................................... 10
Pin Configurations and Function Descriptions ........................... 5
Typical Application Circuits ......................................................... 11
Typical Performance Characteristics ............................................. 6
Outline Dimensions ....................................................................... 13
Theory of Operation ........................................................................ 8
Ordering Guide .......................................................................... 13
Circuit Information ...................................................................... 8
REVISION HISTORY
9/12—Rev. A to Rev. B
Change to Supply Current Parameter, Table 1 .............................. 3
Updated Outline Dimensions ....................................................... 13
1/08—Rev. 0 to Rev. A
Added ADT6503 and ADT6504....................................... Universal
Changes to Features.......................................................................... 1
Changes to Product Highlights .......................................................1
Changes to Table 1.............................................................................3
Changes to Typical Performance Characteristics .........................6
Changes to Ordering Guide .......................................................... 13
9/07—Revision 0: Initial Version
Rev. B | Page 2 of 16
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
SPECIFICATIONS
TA = −55°C to +125°C, VCC = 2.7 V to 5.5 V, open-drain RPULL-UP = 10 kΩ, unless otherwise noted.
Table 1.
Parameter
TEMPERATURE SENSOR AND ADC
Threshold Accuracy
Min
ADC Resolution
Temperature Conversion Time
Update Rate
Temperature Threshold Hysteresis
DIGITAL INPUT (HYST)
Input Low Voltage, VIL
Input High Voltage, VIH
DIGITAL OUTPUT (OPEN-DRAIN)
Output High Current, IOH
Output Low Voltage, VOL
Typ
Max
Unit
Test Conditions/Comments
±0.5
±0.5
±0.5
±0.5
11
30
600
2
10
±6
±4
±4
±6
°C
°C
°C
°C
Bits
ms
ms
°C
°C
TA = −45°C to −25°C
TA = −15°C to +15°C
TA = 35°C to 65°C
TA = 75°C to 115°C
0.2 × VCC
0.8 × VCC
10
Output High Voltage, VOH
Output Capacitance, COUT1
POWER REQUIREMENTS
Supply Voltage
Supply Current
1
Leakage current, VCC = 2.7 V and VOH = 5.5 V
IOL = 1.2 mA, VCC = 2.7 V
IOL = 3.2 mA, VCC = 4.5 V
RPULL-UP = 10 kΩ
IOL = 1.2 mA, VCC = 2.7 V
IOL = 3.2 mA, VCC = 4.5 V
ISOURCE = 500 µA, VCC = 2.7 V
ISOURCE = 800 µA, VCC = 4.5 V
10
V
V
V
V
pF
5.5
55
V
µA
0.3
0.4
0.8 × VCC
VCC − 1.5
2.7
30
V
V
nA
V
V
pF
0.3
0.4
10
Output Capacitance, COUT 1
DIGITAL OUTPUT (PUSH-PULL)
Output Low Voltage, VOL
Time necessary to complete a conversion
Conversion started every 600 ms
HYST pin = 0 V
HYST pin = VCC
Guaranteed by design and characterization.
Rev. B | Page 3 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +7 V
−0.3 V to VCC + 0.3 V
−0.3 V to +7 V
−0.3 V to VCC + 0.3 V
20 mA
20 mA
−55°C to +125°C
−65°C to +160°C
150.7°C
0.9
MAXIMUM POWER DISSIPATION (W)
WMAX = (TJMAX − TA 2)/θJA
240°C/W
260°C (+0°C)
20 sec to 40 sec
3°C/sec maximum
−6°C/sec maximum
8 minute maximum
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
SOT-23 PD @ 125°C = 0.107W
0
–55 –40 –20
0
20
40
60
80
100 120
–50 –30 –10
10
30
50
70
90
110 125
TEMPERATURE (°C)
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
1
Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (TA).
2
TA = ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
ESD CAUTION
Rev. B | Page 4 of 16
06096-002
Parameter
VCC to GND
HYST Input Voltage to GND
Open-Drain Output Voltage to GND
Push-Pull Output Voltage to GND
Input Current on All Pins
Output Current on All Pins
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
5-Lead SOT-23 (RJ-5)
Power Dissipation 1
Thermal Impedance 3
θJA, Junction-to-Ambient (Still Air)
IR Reflow Soldering
(RoHS Compliant Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
5
TOP VIEW
(Not to Scale)
GND 2
HYST 3
4
GND 1
TOVER/
TOVER
VCC
GND 2
06096-003
GND 1
HYST 3
Figure 3. ADT6501/ADT6502 Pin Configuration
5
TUNDER/
TUNDER
4
VCC
TOP VIEW
(Not to Scale)
06096-004
ADT6503/
ADT6504
ADT6501/
ADT6502
Figure 4. ADT6503/ADT6504 Pin Configuration
Table 3. Pin Function Descriptions
Pin Number
ADT6501
1, 2
3
ADT6502
1, 2
3
ADT6503
1, 2
3
ADT6504
1, 2
3
Mnemonic
GND
HYST
4
5
4
—
4
—
4
—
VCC
TOVER
—
5
—
—
TOVER
—
—
5
—
TUNDER
—
—
—
5
TUNDER
Description
Ground.
Hysteresis Input. Connects HYST to GND for 2°C hysteresis or connects to
VCC for 10°C hysteresis.
Supply Input (2.7 V to 5.5 V).
Open-Drain, Active Low Output. TOVER goes low when the temperature of
the part exceeds the factory-programmed threshold; must use a pull-up
resistor.
Push-Pull, Active High Output. TOVER goes high when the temperature of
the part exceeds the factory-programmed threshold.
Open-Drain, Active Low Output. TUNDER goes low when the temperature
of the part exceeds the factory-programmed threshold; must use a pull-up
resistor.
Push-Pull, Active High Output. TUNDER goes high when the temperature
of the part exceeds the factory-programmed threshold.
Rev. B | Page 5 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
35
80
70
OUTPUT SINK RESISTANCE (Ω)
30
25
20
15
10
0
–0.5
–0.4
–0.3
–0.2
–0.1
0.1
0.2
0.3
0.4
60
2.7V
3.3V
50
40
5.5V
30
20
10
06096-018
5
06096-015
PERCENTAGE OF PARTS SAMPLED (%)
SAMPLE SIZE = 300
0
–55
0.5
–10
25
TEMPERATURE ACCURACY (°C)
70
100
125
TEMPERATURE (°C)
Figure 5. Trip Threshold Accuracy
Figure 8. Output Sink Resistance vs. Temperature
120
45
40
5V
100
35
TEMPERATURE (°C)
3.3V
ICC (µA)
30
25
20
15
80
60
40
10
0
–40
–10
25
75
06096-019
06096-016
20
5
0
120
0
0.8
1.6
TEMPERATURE (°C)
Figure 6. Operating Supply Current vs. Temperature
3.2
4.0
4.8
6.4
8.0
9.6
11.2
12.8
5.6
7.2
8.8
10.4
12.0
TIME (s)
Figure 9. Thermal Step Response in Perfluorinated Fluid
180
140
160
120
140
TEMPERATURE (°C)
2.7V
120
3.3V
100
5.5V
80
60
100
80
60
40
40
20
0
–55
–10
25
70
100
06096-020
20
06096-017
OUTPUT SOURCE RESISTANCE (Ω)
2.4
0
125
3.6
0
TEMPERATURE (°C)
Figure 7. ADT6502/ADT6504 Output Source Resistance vs. Temperature
Rev. B | Page 6 of 16
7.2
10.8 18.0 25.2 32.4 39.6 46.8 54.0 61.2
14.4 21.6 28.8 36.0 43.2 50.4 57.6
TIME (s)
Figure 10. Thermal Step Response in Still Air
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
12
10
10°C
VCC
HYSTERESIS (°C)
8
1
VCC = 3.3V
6
4
TOVER
2
2°C
0
–45
–25
–15
15
25
35
65
75
06096-023
06096-021
2
115
CH1 2.0V
TEMPERATURE (°C)
Figure 11. Hysteresis vs. Trip Temperature
CH2 2.0V
M 10.0ms
50.0kS/s
A CH1
1.68V
20.0µs/pt
Figure 13. ADT6501 Start-Up Delay
45
40
35
VCC
30
ICC (µA)
1
25
20
15
–40ºC
–10ºC
+25ºC
+75ºC
+120ºC
10
06096-022
5
CH1 2.0V
CH2 2.0V
M 10.0µs
50.0MS/s
A CH1
1.68V
0
2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6
20.0ns/pt
06096-024
TOVER
2
VCC (V)
Figure 12. ADT6501 Start-Up and Power-Down
Figure 14. Operating Supply Current vs. Voltage Over Temperature
Rev. B | Page 7 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
THEORY OF OPERATION
CIRCUIT INFORMATION
FACTORY-PROGRAMMED THRESHOLD RANGE
The ADT6501/ADT6502/ADT6503/ADT6504 are 11-bit digital
temperature sensors with a 12th bit acting as the sign bit. An
on-board temperature sensor generates a voltage precisely
proportional to absolute temperature, which is compared to
an internal voltage reference and input to a precision digital
modulator. The 12-bit output from the modulator is input into a
digital comparator where it is compared with a factory-set trip
level. The output trip pin is activated if the temperature measured
is greater than, in the case of the ADT6501/ADT6502, or less
than, in the case of the ADT6503/ADT6504, the factory-set trip
level. Overall accuracy for the ADT650x family is ±6°C
(maximum) from −45°C to +115°C.
The ADT6501/ADT6502/ADT6503/ADT6504 are available
with factory-set threshold levels ranging from −45°C to +115°C
in 10°C temperature steps. The ADT6501/ADT6503 outputs are
intended to interface to reset inputs of microprocessors. The
ADT6502/ADT6504 are intended for driving circuits of
applications such as fan control circuits. Table 4 lists the
available temperature threshold ranges.
The on-board temperature sensor has excellent accuracy and
linearity over the entire rated temperature range without needing
correction or calibration by the user. The ADT6501/ADT6503
have active low, open-drain output structures that can sink
current. The ADT6502/ADT6504 have active high, push-pull
output structures that can sink and source current. On powerup, the output becomes active when the first conversion is
completed, which typically takes 30 ms.
Table 4. Factory-Set Temperature Threshold Ranges
Device
ADT6501
ADT6502
ADT6503
ADT6504
Threshold (TTH) Range
+35°C < TTH < +115°C
+35°C < TTH < +115°C
−45°C < TTH < +15°C
−45°C < TTH < +15°C
HYSTERESIS INPUT
The sensor output is digitized by a first-order, ∑-∆ modulator,
also known as the charge balance type analog-to-digital
converter (ADC). This type of converter utilizes time domain
oversampling and a high accuracy comparator to deliver 11 bits
of effective accuracy in an extremely compact circuit.
The HYST pin is used to select a temperature hysteresis of 2°C or
10°C. The digital comparator ensures excellent accuracy for the
hysteresis value. If the HYST pin is connected to VCC, a hysteresis
of 10°C is selected. If the HYST pin is connected to GND, a
hysteresis of 2°C is selected. The HYST pin should not be left
floating. Hysteresis prevents oscillation on the output pin when
the temperature is approaching the trip point and after the
output pin is activated. For example, if the temperature trip is
45°C and the hysteresis selected is 10°C, the temperature would
have to go as low as 35°C before the output deactivates.
CONVERTER DETAILS
TEMPERATURE CONVERSION
The Σ-Δ modulator consists of an input sampler, a summing
network, an integrator, a comparator, and a 1-bit digital-toanalog converter (DAC). Similar to the voltage-to-frequency
converter, this architecture creates a negative feedback loop and
minimizes the integrator output by changing the duty cycle of
the comparator output in response to input voltage changes.
The comparator samples the output of the integrator at a much
higher rate than the input sampling frequency; this is called
oversampling. Oversampling spreads the quantization noise
over a much wider band than that of the input signal,
improving overall noise performance and increasing accuracy.
The conversion clock for the part is generated internally. No
external clock is required. The internal clock oscillator runs an
automatic conversion sequence. During this automatic conversion
sequence, a conversion is initiated every 600 ms. At this time, the
part powers up its analog circuitry and performs a temperature
conversion.
This temperature conversion typically takes 30 ms, after which
the analog circuitry of the part automatically shuts down. The
analog circuitry powers up again 570 ms later, when the 600 ms
timer times out and the next conversion begins. The result of
the most recent temperature conversion is compared with the
factory-set trip point value. If the temperature measured is
greater than the trip point value, the output is activated. The
output is deactivated once the temperature crosses back over
the trip point threshold plus whatever temperature hysteresis is
selected. Figure 15 to Figure 18 show the transfer function for
the output trip pin of each generic model.
Rev. B | Page 8 of 16
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
V
V
TUNDER
TOVER
COLD
HOT
HOT
COLD
10°C
HYST
TEMP
2°C
HYST
Figure 15. ADT6501 TOVER Transfer Function
10°C
HYST
06096-008
2°C
HYST
TEMP
TTH
06096-006
TTH
Figure 17. ADT6503 TUNDER Transfer Function
V
V
TOVER
TUNDER
TTH
10°C
HYST
HOT
COLD
TEMP
2°C
HYST
TEMP
TTH
2°C
HYST
Figure 16. ADT6502 TOVER Transfer Function
10°C
HYST
Figure 18. ADT6504 TUNDER Transfer Function
Rev. B | Page 9 of 16
06096-009
HOT
06096-007
COLD
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
APPLICATION INFORMATION
The time required for a temperature sensor to settle to a specified
accuracy is a function of the sensor’s thermal mass and the
thermal conductivity between the sensor and the object being
sensed. Thermal mass is often considered equivalent to
capacitance. Thermal conductivity is commonly specified using
the symbol Q and can be thought of as thermal resistance. It is
commonly specified in units of degrees per watt of power
transferred across the thermal joint. Thus, the time required for
the ADT650x to settle to the desired accuracy is dependent on
the characteristics of the SOT-23 package, the thermal contact
established in that particular application, and the equivalent
power of the heat source. In most applications, the settling time
is best determined empirically.
If possible, the ADT650x should be powered directly from the
system power supply. This arrangement, shown in Figure 19,
isolates the analog section from the logic switching transients.
Even if a separate power supply trace is not available, generous
supply bypassing reduces supply line induced errors. Local
supply bypassing consisting of a 0.1 µF ceramic capacitor is
advisable to achieve the temperature accuracy specifications.
This decoupling capacitor must be placed as close as possible to
the ADT650x VCC pin.
TTL/CMOS
LOGIC
CIRCUITS
SELF-HEATING EFFECTS
0.1µF
ADT650x
POWER
SUPPLY
The temperature measurement accuracy of the ADT6501/
ADT6502/ADT6503/ADT6504 can be degraded in some
applications due to self-heating. Errors can be introduced from
the quiescent dissipation and power dissipated when converting.
The magnitude of these temperature errors depends on the
thermal conductivity of the ADT650x package, the mounting
technique, and the effects of airflow. At 25°C, static dissipation
in the ADT650x is typically 99 µW operating at 3.3 V. In the
5-lead SOT-23 package mounted in free air, this accounts for a
temperature increase due to self-heating of
ΔT = PDISS × θJA = 99 µW × 240°C/W = 0.024°C
It is recommended that current dissipated through the device be
kept to a minimum because it has a proportional effect on the
temperature error.
SUPPLY DECOUPLING
The ADT6501/ADT6502/ADT6503/ADT6504 should be
decoupled with a 0.1 µF ceramic capacitor between VCC and
GND. This is particularly important when the ADT650x are
mounted remotely from the power supply. Precision analog
products such as the ADT650x require well filtered power
sources. Because the ADT650x operate from a single supply, it
may seem convenient to tap into the digital logic power supply.
Unfortunately, the logic supply is often a switch-mode design,
which generates noise in the 20 kHz to 1 MHz range. In addition,
fast logic gates can generate glitches that are hundreds of mV in
amplitude due to wiring resistance and inductance.
06096-010
THERMAL RESPONSE TIME
Figure 19. Separate Traces Used to Reduce Power Supply Noise
TEMPERATURE MONITORING
The ADT6501/ADT6502/ADT6503/ADT6504 are ideal for
monitoring the thermal environment within electronic equipment.
For example, the surface-mount package accurately reflects the
exact thermal conditions that affect nearby integrated circuits.
The ADT650x measure and convert the temperature at the
surface of its own semiconductor chip. When the ADT650x are
used to measure the temperature of a nearby heat source, the
thermal impedance between the heat source and the ADT650x
must be as low as possible.
As much as 60% of the heat transferred from the heat source to
the thermal sensor on the ADT650x die is discharged via the
copper tracks, package pins, and bond pads. Of the pins on the
ADT650x, the GND pins transfer most of the heat. Therefore,
to monitor the temperature of a heat source, it is recommended
that the thermal resistance between the ADT650x GND pins
and the GND of the heat source be reduced as much as possible.
For example, the unique properties of the ADT650x can be used
to monitor a high power dissipation microprocessor. The
ADT650x device in its SOT-23 package is mounted directly
beneath the microprocessor’s pin grid array (PGA) package.
The ADT650x requires no external characterization.
Rev. B | Page 10 of 16
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
TYPICAL APPLICATION CIRCUITS
3.3V
3.3V
12V
0.1µF
0.1µF
100kΩ
VCC
VCC
VCC
ADT6501
MICROPROCESSOR
ADT6502
TOVER
HYST
INT
TOVER
GND
GND
GND
06096-012
GND
Figure 20. Microprocessor Alarm
Figure 21. Overtemperature Fan Control
3.3V
0.1µF
VCC
ADT6502
... P075
TOVER
GND
HYST
OVER TEMPERATURE
GND
OUT OF RANGE
0.1µF
VCC
ADT6504
... N015
TUNDER
GND
HYST
UNDER TEMPERATURE
GND
06096-013
HYST
06096-011
GND
Figure 22. Temperature Window Alarms
Rev. B | Page 11 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
3.3V
0.1µF
100kΩ
VCC
VCC
ADT6501
... P075
MICROPROCESSOR
TOVER
GND
HYST
INT
GND
GND
12V
0.1µF
VCC
ADT6502
... P045
TOVER
HYST
GND
06096-014
GND
Figure 23. Fail-Safe Temperature Monitor
Rev. B | Page 12 of 16
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
OUTLINE DIMENSIONS
3.00
2.90
2.80
1.70
1.60
1.50
5
1
4
2
3.00
2.80
2.60
3
0.95 BSC
1.90
BSC
1.45 MAX
0.95 MIN
0.15 MAX
0.05 MIN
0.50 MAX
0.35 MIN
0.20 MAX
0.08 MIN
SEATING
PLANE
10°
5°
0°
0.60
BSC
COMPLIANT TO JEDEC STANDARDS MO-178-AA
0.55
0.45
0.35
11-01-2010-A
1.30
1.15
0.90
Figure 24. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADT6501SRJZP035RL7
ADT6501SRJZP045RL7
ADT6501SRJZP055RL7
ADT6501SRJZP065RL7
ADT6501SRJZP075RL7
ADT6501SRJZP085RL7
ADT6501SRJZP085-RL
ADT6501SRJZP095RL7
ADT6501SRJZP105RL7
ADT6501SRJZP105-RL
ADT6501SRJZP115RL7
ADT6502SRJZP035RL7
ADT6502SRJZP045RL7
ADT6502SRJZP055RL7
ADT6502SRJZP065RL7
ADT6502SRJZP075RL7
ADT6502SRJZP085RL7
ADT6502SRJZP095RL7
ADT6502SRJZP105RL7
ADT6502SRJZP115RL7
ADT6503SRJZN045RL7
ADT6503SRJZN035RL7
ADT6503SRJZN025RL7
ADT6503SRJZN015RL7
ADT6503SRJZN005RL7
Threshold
Temperature
35°C
45°C
55°C
65°C
75°C
85°C
85°C
95°C
105°C
105°C
115°C
35°C
45°C
55°C
65°C
75°C
85°C
95°C
105°C
115°C
−45°C
−35°C
−25°C
−15°C
−5°C
Accuracy @
Threshold
Temperature
±4°C
±4°C
±4°C
±4°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±4°C
±4°C
±4°C
±4°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±6°C
±4°C
±4°C
Temperature
Range
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
Rev. B | Page 13 of 16
Package
Description
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
Package
Option
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
Ordering
Quantity
3,000
3,000
3,000
3,000
3,000
3,000
10,000
3,000
3,000
10,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
Branding
T1U
T1V
T0B
T1W
T1X
T0W
T0W
T1Y
T15
T15
T1Z
T25
T26
T27
T28
T17
T29
T2B
T2C
T2D
T2E
T2F
T19
T2J
T2M
ADT6501/ADT6502/ADT6503/ADT6504
Model 1
ADT6503SRJZP005RL7
ADT6503SRJZP015RL7
ADT6504SRJZN045RL7
ADT6504SRJZN035RL7
ADT6504SRJZN025RL7
ADT6504SRJZN015RL7
ADT6504SRJZN005RL7
ADT6504SRJZP005RL7
ADT6504SRJZP015RL7
1
Threshold
Temperature
+5°C
+15°C
−45°C
−35°C
−25°C
−15°C
−5°C
+5°C
+15°C
Accuracy @
Threshold
Temperature
±4°C
±4°C
±6°C
±6°C
±6°C
±4°C
±4°C
±4°C
±4°C
Data Sheet
Temperature
Range
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
−55°C to +125°C
Z = RoHS Compliant Part.
Rev. B | Page 14 of 16
Package
Description
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
Package
Option
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
RJ-5
Ordering
Quantity
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
3,000
Branding
T2N
T2P
T2K
T2L
T2Q
T2R
T2T
T2H
T2U
Data Sheet
ADT6501/ADT6502/ADT6503/ADT6504
NOTES
Rev. B | Page 15 of 16
ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
NOTES
©2007–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06096-0-10/12(B)
Rev. B | Page 16 of 16