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EVAL-ADUM1241EBZ

EVAL-ADUM1241EBZ

  • 厂商:

    AD(亚德诺)

  • 封装:

    -

  • 描述:

    EVAL BOARD DGTL ISOLATOR

  • 数据手册
  • 价格&库存
EVAL-ADUM1241EBZ 数据手册
EVAL-ADuM1241EBZ User Guide UG-663 One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com Evaluating the iCoupler ADuM1240ARSZ/ADuM1241ARSZ/ ADuM1245ARSZ/ADuM1246ARSZ with the EVAL-ADuM1241EBZ Evaluation System FEATURES GENERAL DESCRIPTION Access to both data channels Multiple connection options Support for Tektronix active probes Provision for cable terminations Support for PCB edge-mounted coaxial connectors Easy configuration Installed iCoupler digital isolator: ADuM1241 in the 20-lead SSOP package The EVAL-ADuM1241EBZ supports the ADuM1240ARSZ, ADuM1241ARSZ, ADuM1245ARSZ, and ADuM1246ARSZ, which are ultralow power, dual-channel iCoupler® isolators. The evaluation board provides a JEDEC standard 20-lead SSOP pad layout, support for signal distribution, loopback, and loads referenced to VDDx or GNDx, as well as optimal bypass capacitance. Signal sources can be wired onto the board as well as brought onto the board through edge-mounted SMA connectors (sold separately) or terminal blocks for power connections. The board includes 200 mil header positions for compatibility with Tektronix active probes. SUPPORTED iCoupler MODELS ADuM1240ARSZ ADuM1241ARSZ ADuM1245ARSZ ADuM1246ARSZ The board follows best printed circuit board (PCB) design practices for 4-layer boards, including a full power and ground plane on each side of the isolation barrier. No other EMI or noise mitigation design features are included on this board. In cases of very high speed operation or when ultralow emissions are required, refer to the AN-1109 application note for additional board layout techniques. 12075-001 PHOTOGRAPH OF THE EVALUATION BOARD Figure 1. EVAL-ADuM1241EBZ Evaluation Board See the last page for an important warning and disclaimers. Rev. 0 | Page 1 of 8 UG-663 EVAL-ADuM1241EBZ User Guide TABLE OF CONTENTS Features .............................................................................................. 1 Connectors .....................................................................................3 Supported iCoupler Models ............................................................ 1 Power Input ....................................................................................3 General Description ......................................................................... 1 Data I/O Structures .......................................................................3 Photograph of the Evaluation Board .............................................. 1 Bypass on the PCB ........................................................................4 Revision History ............................................................................... 2 High Voltage Capability ...............................................................4 Evaluation Board Circuitry ............................................................. 3 Evaluation Board Schematics and Artwork ...................................5 PCB Evaluation Goals .................................................................. 3 Bill of Materials ..................................................................................7 REVISION HISTORY 3/14—Revision 0: Initial Version Rev. 0 | Page 2 of 8 EVAL-ADuM1241EBZ User Guide UG-663 EVALUATION BOARD CIRCUITRY PCB EVALUATION GOALS The EVAL-ADuM1241EBZ board is intended to achieve the following goals: • • • • Evaluate the full range of iCoupler data transfer functions Power each side of the iCoupler isolator independently Allow high differential voltage to be applied between the two sides of the iCoupler isolator Allow connecting easily to power and instrumentation Although the evaluation board comes with the ADuM1241ARSZ iCoupler digital isolator installed, the board is also compatible with the ADuM1240ARSZ, ADuM1245ARSZ, and ADuM1246ARSZ, and the user can substitute any of these components in place of the ADuM1241ARSZ. CONNECTORS The PCB provides support for three types of interconnections: • • • SMA edge-mounted connectors Through-hole signal ground pairs Terminal blocks for power connections With these three options, both temporary and permanent connections to the board can easily be made. When coaxial connections are desired, SMA connector positions are available for the VDD1 and VDD2 power supplies, as well as all digital inputs and outputs. These SMA connector positions are left unpopulated so that the user can customize the connectors for a given application. Figure 2 shows examples of installed SMA connectors; these connectors were chosen because they are not only low profile and provide excellent mechanical connections to the PCB but also support 50 Ω coaxial cabling. Because most lab equipment is compatible with BNC connectors, adaptors may be required to use some on-board connectors. Power can be connected through the P1 and P2 terminal blocks or can be wired directly to the PCB via the P13 and P14 throughhole connectors. Each through-hole pair provides a power ground pair with the power on the Pin 1 hole. The pin spacing of each through-hole connector is 200 mil between centers. This matches the pin spacing required for Tektronix active scope probes. If a scope probe connection is desired, the header shown in Figure 2 can be soldered into the through-hole positions, and the signal pin can be trimmed to match the height requirements of a Tektronix active scope probe. POWER INPUT Each side of the ADuM1240ARSZ/ADuM1241ARSZ/ ADuM1245ARSZ/ADuM1246ARSZ iCoupler isolator requires an off-board power source. Each power source must be independent if common-mode voltages are to be applied across the isolation barrier. Sharing a single supply for both sides of the part across the isolation barrier does not harm the isolator, and it is useful for functional testing of the ADuM1240ARSZ/ ADuM1241ARSZ/ADuM1245ARSZ/ADuM1246ARSZ iCoupler isolators when common-mode voltages are not present. If commonmode voltages are to be applied across the isolation barrier, independent power supplies must be provided for each side of the isolator. A ground plane and a power plane are present on Layer 2 and Layer 3 of the PCB on each side of the isolation barrier. Power connects to VDD1 for Side 1 and connects to VDD2 for Side 2. The A and B power pins on each side cannot be powered separately. DATA I/O STRUCTURES Each data channel has a variety of structures to help configure, load, and monitor both the input and output. Figure 3 shows one of the datapaths from an external connection to the DUT pin. Each channel has similar connections. Starting at the external connection, the signal path is 1. 1) SCOPE PROBE 2. 2) SMA CONNECTOR 3. 5) SCOPE PROBE HEADER 3) TERMINAL BLOCK 4. 5. 4) SHORTING JUMPER Figure 2. Optional Components 12075-002 6) PADS TO CONNECT SMA 6. Rev. 0 | Page 3 of 8 A pad layout for a PCB board edge-mounted SMA connector. Two 0805 pads are provided where 100 Ω resistors to ground can be installed. The combined resistance is 50 Ω to provide a termination for a standard coaxial cable. A standard 0805 pad layout that allows the coaxial and termination structures to be connected to the rest of the signal path. A 0603 pad layout between the signal path and VDD1 or VDD2 can be used for installing a pull-up resistor. A populated 2-pin header provides a signal ground pair that can be used for clip leads or for shorting a channel to ground temporarily. There are groupings of three open through holes, consisting of a signal and two ground connections. These holes can be used for hardwiring signal wires into the PCB, installing a header to accept a Tektronix active probe, or installing a UG-663 8. power supply. Parallel bypass capacitors are installed near the ADuM1241ARSZ and consist of a 0.1 µF capacitor for VDD1 on the top side and bottom side and a 0.1 µF capacitor for VDD2 on the bottom side of the board. It is best to use the top side bypass positions if possible. 2-pin header to allow adjacent channels to temporarily be shorted together. A 0805 pad layout between the signal and ground where a load capacitor or resistor can be installed. Pads to the adjacent channels are provided to allow permanent connection of adjacent channels. Inputs can be fanned out to several channels, or inputs and outputs can be connected together to allow signals to loopback. The PCB also implements a distributed capacitive bypass on the PCB. This consists of power and ground planes closely spaced on the inner layers of the PCB. This minimizes noise and the transmission of EMI without using complex design features. Figure 2 shows many of the optional components installed, as well as how jumpers can be used to temporarily connect channels. This figure shows a signal connected to the first channel SMA and then fanned out to the top three channels and monitored by an active scope probe. HIGH VOLTAGE CAPABILITY This PCB is designed in adherence with 2500 V basic insulation practices. High voltage testing beyond 2500 V is not recommended. Appropriate care must be taken when using this evaluation board at high voltages, and the PCB should not be relied on for safety functions because it has not been high potential tested (also known as hipot tested or dielectric withstanding voltage tested) or certified for safety. BYPASS ON THE PCB Several positions and structures are provided to allow optimum bypass of the evaluation board. Provision has been made for optional surface-mount bulk capacitors to be installed near the power connectors to compensate for long cables to the 1 SMA CONNECTOR PADS 6 OPEN HOLES FOR SOLDERED WIRES OR 200mil TEKTRONIX HEADER, GND/GND/SIGNAL 8 CONNECT TO NEXT CHANNEL UP 2 TERMINATION 2 × 100Ω 8 CONNECT TO NEXT CHANNEL DOWN 5 2-PIN HEADER GND/SIGNAL 4 PULL-UP PAD 7 PULL-DOWN PAD 3 CONNECT TO SMA NOTES 1. THE NUMBERED COMPONENTS IN THIS FIGURE CORRESPOND TO THE DESCRIPTIONS IN THE DATA I/O STRUCTURES SECTION. 12075-003 7. EVAL-ADuM1241EBZ User Guide Figure 3. Configuration and Monitoring Structures (Showing a Datapath from an External Connection to the DUT Pin) Rev. 0 | Page 4 of 8 EVAL-ADuM1241EBZ User Guide UG-663 EVALUATION BOARD SCHEMATICS AND ARTWORK DNI J13 DNI 1 VDD1 DNI 5432 P13 C3 10UF 1 2 1 VDD2 P15 P16 1 2 P14 1 2 1716020000 1 2 J14 DNI C8 10UF 5432 1716020000 AGND1 AGND2 DUT1 1 2 3 4 5 6 7 8 9 10 VDD1 VDD1 DNI DNI DNI J3 R31 VIC_1 1 5432 R33 0 0 DNI DNI R27 100 R29 100 VIC_2 DNI C6 15PF P3A 1 2 3 P3B 1 2 VDD2 GND1 GND2 NC VDD2 VDD2 NC DNI R43 0 R35 0 DNI GEN_SSOP20 DNI AGND1 P9A 1 2 P9B AGND2 J4 DNI 0 DNI R10 R20 100100 5432 R45 0 1 2 3 P4B 1 2 5432 0 DNI DNI R19 100 R21 100 1 2 P10B C17 15PF 1 2 3 R53 100 R57 100 J10 5432 DNI R48 EN2_1 DNI P5B DNI DNI DNI 1 2 3 1 DNI VDD2 R44 0 P5A DNI VOD_2 AGND2 EN1_2 C5 15PF 5432 1 2 3 P11A 1 2 3 P12B AGND1 C16 15PF 0 DNI EN2_2 1 DNI DNI R52 100 R56 100 J11 5432 AGND2 VDD1 VDD2 VDD1 VDD2 AGND2 AGND1 DNI C11 0.1UF ESD GUN TESTING HOLES DNI TP1 1502-2 DNI TP2 1502-2 DNI TP3 1502-2 DNI C19 0.1UF C23 0.1UF C13 C21 0.1UF0.1UF C28 0.1UF DNI TP4 1502-2 AGND1 AGND2 12075-004 J5 P10A R25 0 R23 EN1_1 1 1 2 3 AGND2 AGND1 DNI DNI 0 DNI P4A AGND1 DNI R55 100 DNI R49 DNI VDD1 R51 100 VDD2 VOD_1 VID_2 C4 15PF J9 1 DNI DNI R22 VID_1 1 C15 15PF DNI VOC_2 DNI AGND2 AGND1 R24 0 DNI 0 AGND2 R41 0 20 LEAD SSOP CLAMP 1 2 3 DNI DNI DNI R47 VOC_1 DNI AGND1 VDD1 20 19 18 NC NC 17 VXC1 VXC2 16 VXD1 VXD2 15 EN1 EN2/NC 14 NC NC 13 NC NC 12 GND1 GND2 11 VDD1 AGND2 AGND1 PADSTACKS MODIFIED TO C175D125 Figure 4. EVAL-ADuM1241EBZ Schematic Rev. 0 | Page 5 of 8 EVAL-ADuM1241EBZ User Guide 12075-005 UG-663 Figure 5. Top Side Layout Rev. 0 | Page 6 of 8 EVAL-ADuM1241EBZ User Guide UG-663 BILL OF MATERIALS Table 1. Bill of Materials Qty 1 2 2 17 9 Reference Designator U1 C23, C28 C3, C8 R19 to R21, R22 to R25, R31, R33, R35, R41, R43 to R45, R47 to R49 C4 to C6, C11, C13, C15, C17, C19, C21 2 6 2 7 8 P15, P16 P3A to P5A, P9A to P11A P5B, P12B P3B to P5B, P9B to P12B J3 to J5, J9 to J11, J13, J14 1 Description DUT 0.1 µF, 16 V, 10%, 0603 0805 bypass capacitor position 0805 pad for optional, application-specific connections 0603 pad for optional, application-specific connections Terminal block 2-pin header, 200 mil spacing (not installed) 3-pin header 100 mil spacing 2-pin header 100 mil spacing SMA edge connector (not installed) DNI = do not install. Rev. 0 | Page 7 of 8 Part Number 1 Analog Devices, Inc., ADuM1241ARSZ AVX 0603YC104KAT2A DNI DNI DNI On-Shore Technology, Inc., OSTTC022162 Samtec MTSW-202-12-G-S-730 FCI, 90726-403HLF Samtec HTSW-102-07-T-S Johnson/Emerson Network Power Connectivity Solutions, Inc., 142-0701-851 UG-663 EVAL-ADuM1241EBZ User Guide NOTES ESD Caution ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Legal Terms and Conditions By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc. (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term “Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board. Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICALLY DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby submits to the personal jurisdiction and venue of such courts. The United Nations Convention on Contracts for the International Sale of Goods shall not apply to this Agreement and is expressly disclaimed. ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. UG12075-0-3/14(0) Rev. 0 | Page 8 of 8
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