LTM8029
36VIN, 600mA Step-Down
µModule Converter with
5µA Quiescent Current
DESCRIPTION
FEATURES
Complete Switch Mode Power Supply
n Low Quiescent Current Burst Mode® Operation
5μA IQ at 12VIN to 3.3VOUT
n 600mA Output Current
n Wide Input Voltage Range: 4.5V to 36V (40V
MAX)
n Output Voltage: 1.2V to 18V
n Excellent Dropout Performance
n Can Be Used as an Inverter
n Adjustable Switching Frequency: 200kHz to 2.2MHz
n Current Mode Control
n SnPb or RoHS Compliant Finish
n Tiny, Low Profile (11.25mm × 6.25mm × 3.42mm)
Surface Mount BGA Package
n
APPLICATIONS
n
n
n
n
n
Automotive Battery Regulation
Power for Portable Products
Distributed Supply Regulation
Industrial Supplies
Wall Transformer Regulation
The LTM®8029 is a 36VIN, 600mA step-down µModule®
converter with 5µA quiescent current. It is an adjustable
frequency buck switching regulator that consumes only
5μA of quiescent current. The LTM8029 can accept an
input as high as 36VIN and operates at low input voltages
due to its off-time skipping capability. Burst Mode operation maintains high efficiency at low output currents while
keeping the output ripple low. The RUN pin features an
accurate threshold and the shutdown current is 0.9μA.
A power good flag signals when VOUT reaches 90% of the
programmed output voltage.
The LTM8029 is packaged in a thermally enhanced, compact (11.25mm × 6.25mm) and low profile (3.42mm)
overmolded ball grid array (BGA) package. The LTM8029
is available with SnPb (BGA) or RoHS compliant terminal
finish.
All registered trademarks and trademarks are the property of their respective owners. Protected
by U.S. patents, including XXXXX, XXXXX.
TYPICAL APPLICATION
Low Quiescent Current, 5VOUT, 600mA µModule Regulator
Minimum Input Voltage vs Output Current
5.8
VIN
5.6V TO 36V
1µF
VIN
VOUT
RUN
BIAS
PGOOD
RT
GND
158k
f = 800kHz
FB
309k
22µF
VOUT
5V
600mA
INPUT VOLTAGE (V)
LTM8029
5.7
5.6
5.5
8029 TA01a
5.4
0
100
400
300
500
200
OUTPUT CURRENT (mA)
600
8029 TA01b
Rev. E
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1
LTM8029
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
(Notes 1, 2)
TOP VIEW
VIN, RUN ...................................................................40V
VOUT, BIAS.................................................................20V
VIN + BIAS..................................................................55V
PGOOD , FB, RT...........................................................6V
Internal Operating Temperature Range (Note 2)
E and I Grades.................................... –40ºC to 125°C
MP Grade.............................................–55ºC to 125ºC
Storage Temperature Range....................–65ºC to 150ºC
Peak Solder Reflow Package Body Temperature.... 260°C
VIN
5
VOUT
BANK 1
4
BANK 3
3
BIAS
FB PGOOD
GND
2
RUN
RT
A
B
BANK 2
1
C
D
E
F
G
H
BGA PACKAGE
35-LEAD (11.25mm × 6.25mm × 3.42mm)
TJMAX = 125°C, θJA = 13.8°C/W, θJCtop = 17.2°C/W,
θJCbottom = 3.9°C/W, θJB = 9.0°C/W
WEIGHT = 0.6g
ORDER INFORMATION
PART MARKING*
PART NUMBER
PAD OR BALL
FINISH
DEVICE
CODE
PACKAGE TYPE
MSL RATING
LTM8029EY#PBF
SAC305 (RoHS)
LTM8029Y
e1
BGA
3
–40°C to 125°C
LTM8029IY#PBF
SAC305 (RoHS)
LTM8029Y
e1
BGA
3
–40°C to 125°C
LTM8029IY
SnPb (63/37)
LTM8029Y
e0
BGA
3
–40°C to 125°C
LTM8029MPY#PBF
SAC305 (RoHS)
LTM8029Y
e1
BGA
3
–55°C to 125°C
LTM8029MPY
SnPb (63/37)
LTM8029Y
e0
BGA
3
–55°C to 125°C
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
TEMPERATURE RANGE (Note 2)
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings
Rev. E
2
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LTM8029
ELECTRICAL
CHARACTERISTICS
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. VIN = 12V, RUN = 2V unless otherwise noted (Note 2).
PARAMETER
CONDITIONS
MIN
Minimum Input Voltage
TYP
4.5
l
Output DC Voltage
IOUT ≤ 0.6A, RFB Open
IOUT ≤ 0.6A, RFB = 576k
Output DC Current
3.3VOUT
Quiescent Current Into VIN
RUN = 0V
No Load
No Load
MAX
1.2
3.3
10
0.9
5
l
UNITS
V
V
V
600
mA
9
µA
µA
µA
BIAS Current
600mA Load
VIN = 32V, VOUT = 20V at 100mA Load
3.6
4.7
mA
mA
Line Regulation
5.5V < VIN < 36V, IOUT = 600mA
0.3
%
Load Regulation
10mA < IOUT < 600mA
0.4
%
Output RMS Voltage Ripple
IOUT = 600mA
10
mV
Switching Frequency
RT = 41.2k
RT = 124k
RT = 768k
2.2
1
200
MHz
MHz
kHz
Voltage at FB Pin
l
1.185
1.175
Internal Feedback Resistor
1.215
1.225
1
Minimum BIAS Voltage for Proper Operation
RUN Pin Current
1.20
1.20
l
RUN = 2.5V
RUN Threshold Voltage
l
RUN Voltage Hysteresis
MΩ
1.7
2.25
V
1
30
nA
0.95
1.3
30
PGOOD Threshold (at FB)
VOUT Rising
1.1
PGOOD Leakage Current
PGOOD = 6V
0.1
PGOOD Sink Current
PGOOD = 0.4V
100
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LTM8029E is guaranteed to meet performance specifications
from 0°C to 125°C internal. Specifications over the full –40°C to
125°C internal operating temperature range are assured by design,
characterization and correlation with statistical process controls.
V
V
V
mV
V
1
µA
µA
The LTM8029I is guaranteed to meet specifications over the full –40°C
to 125°C internal operating temperature range. The LTM8029MP is
guaranteed to meet specifications over the full –55°C to 125°C internal
operating temperature range. Note that the maximum internal temperature
is determined by specific operating conditions in conjunction with board
layout, the rated package thermal resistance and other environmental
factors.
Rev. E
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3
LTM8029
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. Configured per Table 1, where applicable.
3.3VOUT Efficiency vs Output
Current, BIAS = 5V
5VOUT Efficiency vs Output
Current, BIAS = 5V
90
90
85
85
85
80
80
80
75
70
65
60
50
10
0
100
75
70
65
60
5VIN
12VIN
24VIN
36VIN
55
EFFICIENCY (%)
90
EFFICIENCY (%)
EFFICIENCY (%)
2.5VOUT Efficiency vs Output
Current, BIAS = 5V
50
600
10
0
OUTPUT CURRENT (mA)
100
95
12VIN
24VIN
36VIN
100
80
75
1
10
100
60
1000
10
0
OUTPUT CURRENT (mA)
100
1
100
1000
OUTPUT CURRENT (mA)
10
0
100
8029 G06
100
5VIN
12VIN
24VIN
36VIN
100
10
1
0
0
10
100
1000
Input Current vs Output Current,
5VOUT, BIAS = 5V
12VIN
24VIN
36VIN
100
10
1
0.1
0
10
100
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8029 G07
1000
OUTPUT CURRENT (mA)
INPUT CURRENT (mA)
INPUT CURRENT (mA)
INPUT CURRENT (mA)
1000
10
70
1000
Input Current vs Output Current,
3.3VOUT, BIAS = 5V
5VIN
12VIN
24VIN
36VIN
0
80
8029 G05
Input Current vs Output Current,
2.5VOUT, BIAS = 5V
10
0.1
85
OUTPUT CURRENT (mA)
8029 G04
100
90
75
65
65
24VIN
36VIN
95
70
70
1000
18VOUT Efficiency vs Output
Current, BIAS = 5V
EFFICIENCY (%)
EFFICIENCY (%)
EFFICIENCY (%)
75
100
8029 G03
85
80
10
0
OUTPUT CURRENT (mA)
24VIN
36VIN
90
85
1000
50
1000
12VOUT Efficiency vs Output
Current, BIAS = 5V
90
60
12VIN
24VIN
36VIN
55
8029 G02
8VOUT Efficiency vs Output
Current, BIAS = 5V
95
65
OUTPUT CURRENT (mA)
8029 G01
100
70
60
5VIN
12VIN
24VIN
36VIN
55
75
8029 G08
8029 G09
Rev. E
4
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LTM8029
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. Configured per Table 1, where applicable.
1000
12VIN
24VIN
36VIN
INPUT CURRENT (mA)
INPUT CURRENT (mA)
100
10
1
0.1
10
1
100
10
1
10
1
OUTPUT CURRENT (mA)
100
1700
OUTPUT CURRENT (mA)
INPUT CURRENT (mA)
VIN (V)
1600
300
250
f = 800kHz
200
150
f = 400kHz
100
5
0
20
0
20
10
VOUT (V)
40
30
1300
IBIAS vs Output Current,
2.5VOUT, BIAS = 5V
1000
20
10
10
10
5VIN
12VIN
24VIN
36VIN
1000
OUTPUT CURRENT (mA)
IBIAS (mA)
0.1
0.01
1
10
100
1000
0.01
1
10
100
1000
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
8029 G16
12VIN
24VIN
36VIN
1
0.1
100
40
IBIAS vs Output Current,
5VOUT, BIAS = 5V
IBIAS (mA)
IBIAS (mA)
0.1
30
8029 G15
1
10
0
VIN (V)
IBIAS vs Output Current,
3.3VOUT, BIAS = 5V
5VIN
12VIN
24VIN
36VIN
1
f = 400kHz
1200
8029 G14
1
0.01
1400
VIN (V)
8029 G13
10
f = 800kHz
1500
1100
50
15
1000
Output Short-Circuit Current,
BIAS = 5V
450
10
100
8029 G12
Input Current vs VIN,
Output Short, BIAS = 5V
15
10
1
OUTPUT CURRENT (mA)
350
10
1
0.1
400
5
10
8029 G11
Minimum VIN vs VOUT,
IOUT = 600mA, BIAS = 5V
0
24VIN
36VIN
OUTPUT CURRENT (mA)
20
0
Input Current vs Output Current,
18VOUT, BIAS = 5V
100
1000
8029 G10
25
1000
24VIN
36VIN
100
0.1
1000
Input Current vs Output Current,
12VOUT, BIAS = 5V
INPUT CURRENT (mA)
1000
Input Current vs Output Current,
8VOUT, BIAS = 5V
8029 G17
8029 G18
Rev. E
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5
LTM8029
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. Configured per Table 1, where applicable.
10
IBIAS vs Output Current,
8VOUT, BIAS = 5V
10
12VIN
24VIN
36VIN
1
IBIAS vs Output Current,
12VOUT, BIAS = 5V
10
24VIN
36VIN
0.01
IBIAS (mA)
0.1
0.1
10
1
100
1000
0.01
0.1
10
1
OUTPUT CURRENT (mA)
100
1000
0.01
Minimum VIN vs Output Current,
–3.3VOUT, BIAS = GND
12
Minimum VIN vs Output Current,
–5VOUT, BIAS = GND
20
16
VIN (V)
VIN (V)
VIN (V)
4
6
TO START
4
RUNNING
2
14
8
TO START
3
12
10
8
6
RUNNING
TO START
4
2
1
RUNNING
2
0
100
200
300
400
500
600
0
700
0
100
OUTPUT CURRENT (mA)
200
300
400
500
20
18
TO START
RUNNING
14
VIN (V)
10
12
10
8
6
TO START
4
RUNNING
200
400
500
OUTPUT CURRENT (mA)
400
500
0
600
12VIN
24VIN
36VIN
14
12
10
8
6
4
2
2
300
300
Temperature Rise vs Output
Current, 2.5VOUT
16
16
15
200
8029 G24
TEMPERATURE RISE (°C)
20
100
100
OUTPUT CURRENT (mA)
Minimum VIN vs Output Current,
–18VOUT, BIAS = GND
18
0
0
8029 G23
Minimum VIN vs Output Current,
–12VOUT, BIAS = GND
5
0
600
OUTPUT CURRENT (mA)
8029 G22
VIN (V)
Minimum VIN vs Output Current,
–8VOUT, BIAS = GND
18
10
5
0
1000
8029 G21
6
25
100
OUTPUT CURRENT (mA)
8029 G20
7
0
10
1
OUTPUT CURRENT (mA)
8029 G19
8
24VIN
36VIN
1
IBIAS (mA)
IBIAS (mA)
1
IBIAS vs Output Current,
18VOUT, BIAS = 5V
0
50
100
150
200
250
300
350
OUTPUT CURRENT (mA)
8029 G25
0
0
100
200
300
400
500
600
OUTPUT CURRENT (mA)
8029 G26
8029 G27
Rev. E
6
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LTM8029
TYPICAL PERFORMANCE CHARACTERISTICS
TA = 25°C, unless otherwise noted. Configured per Table 1, where applicable.
16
14
TEMPERATURE RISE (°C)
TEMPERATURE RISE (°C)
25
12VIN
24VIN
36VIN
12
10
8
6
4
Temperature Rise vs Output
Current, 5VOUT
25
12VIN
24VIN
36VIN
20
TEMPERATURE RISE (°C)
18
Temperature Rise vs Output
Current, 3.3VOUT
15
10
5
Temperature Rise vs Output
Current, 8VOUT
12VIN
24VIN
36VIN
20
15
10
5
2
0
0
100
200
300
400
500
0
600
0
100
200
300
400
500
10
5
20
15
10
5
100
200
300
400
500
0
600
0
100
OUTPUT CURRENT (mA)
200
300
400
500
10
5
0
100
200
300
400
15
10
5
0
500
600
OUTPUT CURRENT (mA)
100
200
300
400
500
35
Temperature Rise vs Output
Current, –12VOUT
12VIN
24VIN
30
25
20
15
10
0
600
8029 G33
12VIN
24VIN
5
0
12VIN
24VIN
OUTPUT CURRENT (mA)
TEMPERATURE RISE (°C)
15
600
20
0
600
Temperature Rise vs Output
Current, –8VOUT
30
TEMPERATURE RISE (°C)
TEMPERATURE RISE (°C)
35
12VIN
24VIN
20
500
8029 G32
Temperature Rise vs Output
Current, –5VOUT
25
400
Temperature Rise vs Output
Current, –3.3VOUT
OUTPUT CURRENT (mA)
8029 G31
30
25
24VIN
36VIN
TEMPERATURE RISE (°C)
15
300
8029 G30
Temperature Rise vs Output
Current, 18VOUT
25
TEMPERATURE RISE (°C)
TEMPERATURE RISE (°C)
30
24VIN
36VIN
20
200
8029 G29
Temperature Rise vs Output
Current, 12VOUT
0
100
OUTPUT CURRENT (mA)
8029 G28
0
0
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
25
0
600
25
20
15
10
5
0
100
200
300
400
500
600
OUTPUT CURRENT (mA)
8029 G34
0
0
100
200
300
400
500
OUTPUT CURRENT (mA)
8029 G35
8029 G36
Rev. E
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7
LTM8029
PIN FUNCTIONS
VIN (Bank 1): The VIN pins supply current to the LTM8029’s
internal regulator and to the internal power switch. This
pin must be locally bypassed with an external, low ESR
capacitor; see Table 1 for recommended values.
FB (Pin A2): The LTM8029 regulates its FB pin to 1.2V.
Connect the output feedback resistor from this pin to
ground. The value of RFB is given by the equation RFB =
1200/(VOUT – 1.2), where RFB is in kΩ.
VOUT (Bank 3): Power Output Pins. Apply the output filter
capacitor and the output load between these pins and
GND pins.
RT (Pin B1): The RT pin is used to program the switching
frequency of the LTM8029 by connecting a resistor from
this pin to ground. The Applications Information section of
the data sheet includes a table to determine the resistance
value based on the desired switching frequency.
GND (Bank 2): Tie these GND pins to a local ground plane
below the LTM8029 and the circuit components. In most
applications the bulk of the heat flow out of the LTM8029
is through these pads, so the printed circuit design has a
large impact on the thermal performance of the part. See
the PCB Layout and Thermal Considerations sections for
more details. Return the feedback resistor (RFB) to this net.
RUN (Pin A1): Pull the RUN pin below 0.95V to shut down
the LTM8029. Tie to 1.3V or more for normal operation.
If the shutdown feature is not used, tie this pin to VIN.
PGOOD (Pin B2): The PGOOD pin is the open-collector
output of an internal comparator that monitors the FB pin.
PGOOD remains low until the FB pin is within 10% of the
final regulation voltage. PGOOD output is valid when VIN
is above 4.5V and RUN is high. If this function is not used,
leave this pin floating.
BIAS (Pin H3): The BIAS pin powers internal circuitry.
Connect to a power source greater than 2.25V and less
than 20V. If the output is greater than 2.25V, connect this
pin there. Also, make sure that BIAS + VIN is less than 55V.
Rev. E
8
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LTM8029
BLOCK DIAGRAM
22µH
VIN
0.1µF
VOUT
47pF
1M
1%
1µF
BIAS
RUN
CURRENT
MODE
CONTROLLER
GND
RT
PGOOD
FB
8029 BD
Rev. E
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9
LTM8029
OPERATION
The LTM8029 is a standalone non-isolated step-down
switching DC/DC power supply that can deliver up to 600mA
of output current. This device features a very low quiescent
current and provides a precisely regulated output voltage
from 1.2V to 18V. The input voltage range is 4.5V to 36V.
Given that the LTM8029 is a step-down converter, make
sure that the input voltage is high enough to support the
desired output voltage and load current.
As shown in the Block Diagram, the LTM8029 contains a
current mode controller, power switching element, power
inductor, power Schottky diode and a modest amount of
input and output capacitance. The LTM8029 is a fixed
frequency PWM regulator. The switching frequency is set
by simply connecting the appropriate resistor value from
the RT pin to GND. An internal regulator provides power
to the control circuitry.
The internal regulator normally draws power from the VIN
pin, but if the BIAS pin is connected to an external voltage higher than 2.25V, bias power will be drawn from the
external source (typically the regulated output voltage).
This improves efficiency.
The RUN pin is used to place the LTM8029 in shutdown.
To optimize efficiency, the LTM8029 automatically switches
to Burst Mode operation in light load situations. Between
bursts, all circuitry associated with controlling the output
switch is shut down reducing the input supply current to
typically 5μA at no load and 12VIN. Since the LTM8029 is
mostly shut down between bursts, the effective switching
frequency will be lower than that programmed at the RT
pin. For the same reason, the output ripple will be different than when the part is running at the full programmed
frequency.
The LTM8029 contains a power good comparator which
trips when the FB pin is at roughly 90% of its regulated
value. The PGOOD output is an open-collector transistor
that is off when the output is in regulation, allowing an
external resistor to pull the PGOOD pin high. Power good
is valid when the LTM8029 is enabled and VIN is above
4.5V. The LTM8029 features the ability to skip the off-time
in switching cycles when the input voltage approaches the
target output. This allows the LTM8029 to operate at input
voltages lower than other step-down regulators.
In an overload or short-circuit condition, the LTM8029
will protect itself by limiting its peak switching current
and decreasing the operating frequency to reduce overall
power consumption. The LTM8029 is also equipped with
a thermal shutdown that will inhibit power switching at
high junction temperatures. The activation threshold of this
function, however, is above 125°C to avoid interfering with
normal operation. Thus, prolonged or repetitive operation
under a condition in which the thermal shutdown activates
may damage or impair the reliability of the device.
Rev. E
10
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LTM8029
APPLICATIONS INFORMATION
For most applications, the design process is straight
forward, summarized as follows:
1. Look at Table 1 and find the row that has the desired
input range and output voltage.
2. Apply the recommended CIN, COUT, RFB and RT values.
3. Connect BIAS as indicated.
While these component combinations have been tested
for proper operation, it is incumbent upon the user to
verify proper operation over the intended system’s line,
load and environmental conditions. Bear in mind that the
maximum output current is limited by junction temperature, the relationship between the input and output voltage
magnitude and polarity and other factors. Please refer to
the graphs in the Typical Performance Characteristics
section for guidance.
The maximum frequency (and attendant RT value) at which
the LTM8029 should be allowed to switch is given in
Table 1 in the fMAX column, while the recommended frequency (and RT value) for optimal efficiency over the given
input condition is given in the fOPTIMAL column.
The LTM8029 is capable of operating at low input voltages
by skipping off-times to maintain regulation. This results
in a lower operating frequency than that programmed by
the RT pin, so it may be necessary to use larger input and
output capacitors, depending upon the system requirements. The recommended components and VIN range
listed in Table 1 reflect an operation where off-times are
not skipped.
Capacitor Selection Considerations
The CIN and COUT capacitor values in Table 1 are the
minimum recommended values for the associated operating conditions. Applying capacitor values below those
indicated in Table 1 is not recommended, and may result
in undesirable operation. Using larger values is generally
acceptable, and can yield improved dynamic response,
if it is necessary. It is incumbent upon the user to verify
proper operation over the intended system’s line, load and
environmental conditions.
Ceramic capacitors are small, robust and have very low
ESR. However, not all ceramic capacitors are suitable.
X5R and X7R types are stable over temperature and applied voltage and give dependable service. Other types,
including Y5V and Z5U have very large temperature and
voltage coefficients of capacitance. In an application circuit they may have only a small fraction of their nominal
capacitance resulting in much higher output voltage ripple
than expected.
Ceramic capacitors are also piezoelectric. In Burst Mode
operation, the LTM8029’s switching frequency depends
on the load current, and can excite a ceramic capacitor
at audio frequencies, generating audible noise. Since the
LTM8029 operates at a lower current limit during Burst
Mode operation, the noise is typically very quiet to a casual ear. If this audible noise is unacceptable, use a high
performance electrolytic capacitor at the output. It may
also be a parallel combination of a ceramic capacitor and
a low cost electrolytic capacitor.
A final precaution regarding ceramic capacitors concerns
the maximum input voltage rating of the LTM8029. A
ceramic input capacitor combined with trace or cable
inductance forms a high Q (under damped) tank circuit.
If the LTM8029 circuit is plugged into a live supply, the
input voltage can ring to twice its nominal value, possibly exceeding the device’s rating. This situation is easily
avoided; see the Hot-Plugging Safety section.
Rev. E
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11
LTM8029
APPLICATIONS INFORMATION
Table 1. Recommended Component Values and Configuration
VIN (V)*
VOUT (V)
CIN
COUT
BIAS
RFB
fOPT
RT(OPT)
fMAX
RT(MIN)
4.5-36
1.2
4.7µF 50V 1206 X5R
100µF 6.3V 1206 X5R
2.25V-20V
Open
270kHz
536k
510kHz
267k
4.5-36
1.5
4.7µF 50V 1206 X5R
100µF 6.3V 1206 X5R
2.25V-20V
4.02M
310kHz
475k
600kHz
220k
4.5-36
1.8
4.7µF 50V 1206 X5R
100µF 6.3V 1206 X5R
2.25V-20V
2M
350kHz
402k
750kHz
169k
4.5-36
2
4.7µF 50V 1206 X5R
100µF 6.3V 1206 X5R
2.25V-20V
1.5M
380kHz
374k
780kHz
162k
4.5-36
2.2
1µF 50V 1206 X5R
47µF 6.3V 1206 X5R
2.25V-20V
1.21M
450kHz
309k
840kHz
147k
4.5-36
2.5
1µF 50V 0805 X5R
47µF 6.3V 1206 X5R
2.25V-20V
931k
490kHz
280k
950kHz
127k
4.8-36
3.3
1µF 50V 0805 X5R
22µF 6.3V 1206 X5R
VOUT
576k
615kHz
215k
1.2MHz
93.1k
7.8-36
5
1µF 50V 0805 X5R
22µF 6.3V 1206 X5R
VOUT
309k
800kHz
158k
1.6MHz
61.9k
12-36
8
2.2µF 50V 1206 X5R
22µF 10V 1210 X5R
2.25V-20V
174k
830kHz
150k
2.2MHz
41.2k
17-36
12
2.2µF 50V 1206 X5R
10µF 50V 1210 X5R
2.25V-20V
110k
880kHz
137k
2.2MHz
41.2k
24.5-36
18
2.2µF 50V 1206 X5R
10µF 50V 1210 X5R
2.25V-20V
71.5k
880kHz
137k
2.2MHz
41.2k
10-32
–3.3
1µF 50V 0805 X5R
22µF 6.3V 1206 X5R
GND
576k
615kHz
215k
1.2MHz
93.1k
5.5-32
–3.3
4.7µF 50V 1206 X5R
100µF 6.3V 1206 X5R
GND
576k
615kHz
215k
1.2MHz
93.1k
8-31*
–5
2.2µF 50V 1206 X5R
47µF 6.3V 1206 X5R
GND
309k
800kHz
158k
1.6MHz
61.9k
7-28*
–8
2.2µF 50V 1206 X5R
22µF 10V 1210 X5R
GND
174k
830kHz
150k
2.2MHz
41.2k
7-24*
–12
2.2µF 50V 1206 X5R
22µF 16V 1210 X5R
GND
110k
880kHz
137k
2.2MHz
41.2k
4.5-24
1.2
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
Open
400kHz
348k
750kHz
169k
4.5-24
1.5
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
4.02M
430kHz
324k
930kHz
130k
4.5-24
1.8
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
2M
450kHz
309k
1MHz
124k
4.5-24
2
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
1.5M
480kHz
287k
1.2MHz
93.1k
4.5-24
2.2
1µF 50V 0805 X5R
47µF 6.3V 1206 X5R
2.25V-20V
1.21M
545kHz
249k
1.3MHz
82.5k
4.5-24
2.5
1µF 50V 0805 X5R
47µF 6.3V 1206 X5R
2.25V-20V
931k
580kHz
232k
1.4MHz
73.2k
4.8-24
3.3
1µF 25V 0603 X5R
22µF 6.3V 1206 X5R
VOUT
576k
615kHz
215k
2.2MHz
41.2k
7.8-24
5
1µF 25V 0603 X5R
22µF 6.3V 1206 X5R
VOUT
309k
800kHz
158k
2.2MHz
41.2k
12-24
8
2.2µF 50V 1206 X5R
22µF 10V 1210 X5R
2.25V-20V
174k
830kHz
150k
2.2MHz
41.2k
17-24
12
2.2µF 50V 1206 X5R
10µF 50V 1210 X5R
2.25V-20V
110k
880kHz
137k
2.2MHz
41.2k
9-15
1.2
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
Open
400kHz
348k
1.3MHz
84.5k
9-15
1.5
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
4.02M
430kHz
324k
1.5MHz
66.5k
9-15
1.8
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
2M
450kHz
309k
1.7MHz
57.6k
9-15
2
2.2µF 50V 0805 X7R
47µF 6.3V 1206 X5R
2.25V-20V
1.5M
480kHz
287k
1.9MHz
49.9k
9-15
2.2
1µF 50V 0805 X5R
47µF 6.3V 1206 X5R
2.25V-20V
1.21M
545kHz
249k
2MHz
46.4k
9-15
2.5
1µF 50V 0805 X5R
47µF 6.3V 1206 X5R
2.25V-20V
931k
580kHz
232k
2.2MHz
41.2k
9-15
3.3
1µF 25V 0603 X5R
22µF 6.3V 1206 X5R
VOUT
576k
615kHz
215k
2.2MHz
41.2k
9-15
5
1µF 25V 0603 X5R
22µF 6.3V 1206 X5R
VOUT
309k
800kHz
158k
2.2MHz
41.2k
12-15
8
2.2µF 50V 1206 X5R
22µF 10V 1210 X5R
2.25V-20V
174k
830kHz
150k
2.2MHz
41.2k
Notes: An input bulk capacitor is required. Do not allow VIN + BIAS to exceed 55V. The minimum input operating voltage may be lower than given in the table.
Refer to the Applications Information section for details.
*Maximum output current depends upon input voltage. Refer to Typical Performance Characteristics.
Rev. E
12
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LTM8029
APPLICATIONS INFORMATION
Frequency Selection
BIAS Pin Considerations
The LTM8029 uses a constant frequency PWM architecture that can be programmed to switch from 200kHz to
2.2MHz by using a resistor tied from the RT pin to ground.
Table 2 provides a list of RT resistor values and their
resultant frequencies.
The BIAS pin is used to provide drive power for the internal power switching stage and operate other internal
circuitry. For proper operation, it must be powered by at
least 2.25V. If the output voltage is programmed to 2.25V
or higher, BIAS may be simply tied to VOUT. If VOUT is less
than 2.25V, BIAS can be tied to VIN or some other voltage
source. If the BIAS pin voltage is too high, the efficiency
of the LTM8029 may suffer. The optimum BIAS voltage is
dependent upon many factors, such as load current, input
voltage, output voltage and switching frequency, but 4V to
5V works well in many applications. In all cases, ensure
that the maximum voltage at the BIAS pin is less than 25V
and that the sum of VIN and BIAS is less than 55V. If BIAS
power is applied from a remote or noisy voltage source, it
may be necessary to apply a decoupling capacitor locally
to the pin.
Table 2. Frequency vs RT Value
FREQUENCY (MHz)
RT (kΩ)
0.2
768
0.4
348
0.6
220
0.8
158
1.0
124
1.2
93.1
1.4
73.2
1.6
61.9
1.8
52.3
2.0
46.4
Burst Mode Operation
2.2
41.2
To enhance efficiency at light loads, the LTM8029 automatically switches to Burst Mode operation which keeps
the output capacitor charged to the proper voltage while
minimizing the input quiescent current. During Burst
Mode operation, the LTM8029 delivers single cycle bursts
of current to the output capacitor followed by sleep periods where the output power is delivered to the load by
the output capacitor. Since the LTM8029 is mostly shut
down between bursts, the effective switching frequency
will be lower than that programmed at the RT pin. For the
same reason, the output ripple will be different than when
the part is running at the full programmed frequency.
In addition, VIN and BIAS quiescent currents are each
greatly reduced during the sleep time. As the load current
decreases towards a no load condition, the percentage of
time that the LTM8029 operates in sleep mode increases
and the average input current is greatly reduced, resulting
in higher efficiency.
Operating Frequency Trade-offs
It is recommended that the user apply the optimal RT
resistor value given in Table 1 for the input and output
operating condition. System level or other considerations,
however, may necessitate another operating frequency.
While the LTM8029 is flexible enough to accommodate
a wide range of operating frequencies, a haphazardly
chosen one may result in undesirable operation under
certain operating or fault conditions. A frequency that is
too high can reduce efficiency, generate excessive heat
or even damage the LTM8029 if the output is overloaded
or short-circuited. A frequency that is too low can result
in a final design that has too much output ripple or too
large of an output capacitor. In addition, as shown in the
Typical Performance Characteristics section, the operating frequency affects the amount of current that may be
delivered during a short-circuit condition.
Rev. E
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13
LTM8029
APPLICATIONS INFORMATION
RUN
The LTM8029 is in shutdown when the RUN pin is low
and active when the pin is high. The rising threshold of the
RUN comparator is typically 1.15V, with a 30mV hysteresis.
This threshold is accurate when VIN is above 4.5V. Adding
a resistor divider from VIN to RUN programs the LTM8029
to operate only when VIN is above a desired voltage (see
Figure 1). This rising threshold voltage, VIN(RUN), can be
adjusted by setting the values R3 and R4 such that they
satisfy the following equation:
VIN(RUN) =
R3 + R4
R4
• 1.15V
where the LTM8029 should not start until VIN is above
VIN(RUN). Note that due to the RUN pin’s hysteresis, operation will not stop until the input falls slightly below VIN(RUN).
LTM8029
VIN
VIN
R3
RUN
R4
8029 F01
It also means that the effective frequency during this mode
of operation will be lower than the one programmed by the
resistor connected to the RT pin, so it may be necessary
to use larger input and output capacitors, depending upon
the system requirements.
Shorted Input Protection
Care needs to be taken in systems where the output will be
held high when the input to the LTM8029 is absent. This
may occur in battery charging applications or in battery
backup systems where a battery or some other supply is
diode ORed with the LTM8029’s output. If the VIN pin is
allowed to float and the RUN pin is held high (either by a
logic signal or because it is tied to VIN), then the LTM8029’s
internal circuitry will pull its quiescent current through
its internal power switch. This is fine if your system can
tolerate a few milliamps in this state. If you ground the
RUN pin, the input current will drop to essentially zero.
However, if the VIN pin is grounded while the output is
held high, then parasitic diodes inside the LTM8029 can
pull large currents from the output through the VIN pin.
Figure 2 shows a circuit that will run only when the input
voltage is present and that protects against a shorted or
reversed input.
Figure 1. R3 and R4 Set the Minimum
Operating Threshold Voltage
LTM8029
VIN
Minimum Input Voltage
The LTM8029 is a step-down converter, so a minimum
amount of headroom is required to keep the output in
regulation. Curves detailing the minimum input voltage
of the LTM8029 for various load conditions are included
in the Typical Performance Characteristics section.
The LTM8029 features the ability to skip the off-time in
switching cycle when the input voltage approaches the
target output. This allows the LTM8029 to operate an input
voltages lower than other step-down regulators. Graphs of
minimum input voltage versus output voltage and load are
given in the Typical Performance Characteristics section.
VIN
VOUT
RUN
BIAS
RT
GND
VOUT
FB
8029 F02
Figure 2. The Input Diode Prevents Shorted Input from
Discharging a Backup Battery Tied to the Output. It
Also Protects the Circuit from a Reversed Input. The
LTM8029 Runs Only When the Input is Present
Rev. E
14
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LTM8029
APPLICATIONS INFORMATION
Power Good
The PGOOD pin is the open-collector output of an internal
comparator that monitors the voltage at the FB pin. It
is used to indicate whether the output is near or within
regulation. Specifically, PGOOD is low unless the FB pin is
within 10% of the final regulation voltage. PGOOD output
is valid when VIN is above 4.5V and RUN is high. If this
function is not used, leave this pin floating.
Hot-Plugging Safely
The small size, robustness and low impedance of ceramic
capacitors make them an attractive option for the input
bypass capacitor of LTM8029. However, these capacitors
can cause problems if the LTM8029 is hot-plugged into
a live supply (see Application Note 88 for a complete discussion). The low loss ceramic capacitor combined with
stray inductance in series with the power source forms an
underdamped tank circuit, and the voltage at the VIN pin
of the LTM8029 can ring to more than twice the nominal
input voltage, possibly exceeding the LTM8029’s rating
and damaging the part. If the input supply is poorly controlled or the user will be hot-plugging the LTM8029 into
an energized supply, the input network should be designed
to prevent this overshoot. This can be accomplished by
installing a small resistor in series to VIN, but the most
popular method of controlling input voltage overshoot is
to add an electrolytic bulk capacitor to the VIN net. This
capacitor’s relatively high equivalent series resistance
usually damps the circuit and eliminates the voltage
overshoot. The extra capacitor improves low frequency
ripple filtering and can slightly improve the efficiency of
the circuit, though it is likely to be the largest component
in the circuit.
1. Place the RFB and RT resistors as close as possible to
their respective pins.
2. Place the CIN capacitor as close as possible to the VIN
and GND connection of the LTM8029.
3. Place the COUT capacitor as close as possible to the
VOUT and GND connection of the LTM8029.
4. Place the CIN and COUT capacitors such that their
ground currents flow directly adjacent or underneath
the LTM8029.
5. Connect all of the GND connections to as large a copper
pour or plane area as possible on the top layer. Avoid
breaking the ground connection between the external
components and the LTM8029.
6. For good heat sinking, use vias to connect the GND copper area to the board’s internal ground planes. Liberally
distribute these GND vias to provide both a good ground
connection and thermal path to the internal planes of the
printed circuit board. Pay attention to the location and
density of the thermal vias in Figure 3. The LTM8029
can benefit from the heat sinking afforded by vias that
connect to internal GND planes at these locations, due
to their proximity to internal power handling components. The optimum number of thermal vias depends
upon the printed circuit board design. For example, a
board might use very small via holes. It should employ
more thermal vias than a board that uses larger holes.
VIN
VOUT
CIN
GND
BIAS
PCB Layout
Most of the headaches associated with PCB layout have
been alleviated or even eliminated by the high level of
integration of the LTM8029. The LTM8029 is nevertheless a switching power supply, and care must be taken to
minimize EMI and ensure proper operation. Even with the
high level of integration, you may fail to achieve specified
operation with a haphazard or poor layout. See Figure 3
for a suggested layout. Ensure that the grounding and
heat sinking are acceptable.
PGOOD
RUN
COUT
GND
RFB
RT
THERMAL VIAS
8029 F03
Figure 3. Layout Showing Suggested External
Components, GND Plane and Thermal Vias
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Rev. E
15
LTM8029
APPLICATIONS INFORMATION
Thermal Considerations
The LTM8029 output current may need to be derated if
it is required to operate in a high ambient temperature or
deliver a large amount of continuous power. The amount
of current derating is dependent upon the input voltage,
output power and ambient temperature. The temperature
rise curves given in the Typical Performance Characteristics section can be used as a guide. These curves were
generated by a LTM8029 mounted to a 40cm2 4-layer FR4
printed circuit board. Boards of other sizes and layer count
can exhibit different thermal behavior, so it is incumbent
upon the user to verify proper operation over the intended
system’s line, load and environmental operating conditions.
The thermal resistance numbers listed in the Pin Configuration are based on modeling the µModule package
mounted on a test board specified per JESD 51-9 (“Test
Boards for Area Array Surface Mount Package Thermal
Measurements”). The thermal coefficients provided in this
page are based on JESD 51-12 (“Guidelines for Reporting
and Using Electronic Package Thermal Information”).
For increased accuracy and fidelity to the actual application,
many designers use FEA to predict thermal performance.
To that end, the Pin Configuration section typically gives
four thermal coefficients:
• θJA – Thermal resistance from junction to ambient
• θJCbottom – Thermal resistance from junction to the
bottom of the product case
• θJCtop – Thermal resistance from junction to top of the
product case
• θJB – Thermal resistance from junction to the printed
circuit board
While the meaning of each of these coefficients may seem
to be intuitive, JEDEC has defined each to avoid confusion
and inconsistency. These definitions are given in JESD
51-12, and are quoted or paraphrased below:
• θJA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to as
“still air” although natural convection causes the air to
move. This value is determined with the part mounted to
a JESD 51-9 defined test board, which does not reflect
an actual application or viable operating condition.
• θJCbottom is the thermal resistance between the junction
and bottom of the package with all of the component
power dissipation flowing through the bottom of the
package. In the typical µModule converter, the bulk of
the heat flows out the bottom of the package, but there
is always heat flow out into the ambient environment.
As a result, this thermal resistance value may be useful
for comparing packages but the test conditions don’t
generally match the user’s application.
• θJCtop is determined with nearly all of the component
power dissipation flowing through the top of the package. As the electrical connections of the typical µModule
converter are on the bottom of the package, it is rare
for an application to operate such that most of the heat
flows from the junction to the top of the part. As in the
case of θJCbottom, this value may be useful for comparing
packages but the test conditions don’t generally match
the user’s application.
• θJB is the junction-to-board thermal resistance where
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really
the sum of the θJCbottom and the thermal resistance
of the bottom of the part through the solder joints and
through a portion of the board. The board temperature is
measured a specified distance from the package, using
a two sided, two layer board. This board is described
in JESD 51-9.
Rev. E
16
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LTM8029
APPLICATIONS INFORMATION
Given these definitions, it should now be apparent that none
of these thermal coefficients reflects an actual physical
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 4.
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8029 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8029. The bulk of the heat flow out of the LTM8029
is through the bottom of the μModule converter and the
BGA pads into the printed circuit board. Consequently a
poor printed circuit board design can cause excessive
heating, resulting in impaired performance or reliability.
Please refer to the PCB Layout section for printed circuit
board design suggestions.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-CASE
CASE (BOTTOM)-TO-BOARD
(BOTTOM) RESISTANCE
RESISTANCE
AMBIENT
BOARD-TO-AMBIENT
RESISTANCE
8029 F04
µMODULE DEVICE
Figure 4. Graphical Representation of JESD 51-12 Thermal Coefficients
Rev. E
For more information www.analog.com
17
LTM8029
TYPICAL APPLICATION
1.2V Step-Down Converter
2.5V Step-Down Converter
LTM8029
VIN
4.5V TO 12V
VIN
2.2µF
LTM8029
VOUT
RUN
47µF
BIAS
VIN
4.5V TO 36V
VOUT
1.2V
600mA
VIN
VOUT
RUN
1µF
BIAS
PGOOD
RT
GND
47µF
VOUT
2.5V
600mA
PGOOD
FB
RT
8029 TA02
309k
GND
FB
280k
8029 TA03
931k
5V Step-Down Converter
LTM8029
VIN
7.8V TO 36V
VIN
VOUT
RUN
1µF
BIAS
22µF
VOUT
5V
600mA
PGOOD
RT
GND
158k
FB
8029 TA04
309k
–5V Inverting Output Converter
Minimum VIN vs Output Current
12
LTM8029
2.2µF
RUN
BIAS
PGOOD
RT
10
VOUT
VIN
GND
8
VIN (V)
VIN
4.5V TO 31V
47µF
FB
6
TO START
4
158k
309k
8029 TA05
VOUT
–5V
RUNNING
2
0
0
100
200
300
400
500
600
OUTPUT CURRENT (mA)
8029 TA06
Rev. E
18
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LTM8029
TYPICAL APPLICATION
–12V Inverting Output Converter
Minimum VIN vs Output Current,
–12VOUT, BIAS = GND
25
LTM8029
VIN
4.5V TO 24V
2.2µF
VIN
VOUT
RUN
BIAS
20
PGOOD
GND
VIN (V)
RT
22µF
FB
137k
110k
8029 TA07a
15
10
VOUT
–12V
TO START
5
RUNNING
0
0
100
200
300
400
500
OUTPUT CURRENT (mA)
8029 TA07b
PACKAGE DESCRIPTION
Table 3. Pin Assignment Table (Arranged by Pin Number)
PIN
FUNCTION
PIN
FUNCTION
PIN
FUNCTION
PIN
FUNCTION
A1
RUN
B1
RT
C1
GND
D1
GND
A2
FB
B2
PGOOD
C2
GND
D2
GND
A3
–
B3
–
C3
–
D3
GND
A4
VIN
B4
VIN
C4
–
D4
GND
A5
VIN
B5
VIN
C5
–
D5
GND
PIN
FUNCTION
PIN
FUNCTION
PIN
FUNCTION
PIN
FUNCTION
E1
GND
F1
GND
G1
GND
H1
GND
E2
GND
F2
GND
G2
GND
H2
GND
E3
GND
F3
VOUT
G3
VOUT
H3
BIAS
E4
GND
F4
VOUT
G4
VOUT
H4
VOUT
E5
GND
F5
VOUT
G5
VOUT
H5
VOUT
Rev. E
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19
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3.4925
2.8575
4
4.445
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
0.3175
1.270
2.540
SUGGESTED PCB LAYOUT
TOP VIEW
0.3175
0.000
PACKAGE TOP VIEW
1.270
PIN “A1”
CORNER
E
2.540
20
Y
D
X
aaa Z
2.45 – 2.55
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
aaa
bbb
ccc
ddd
eee
MIN
3.22
0.50
2.72
0.71
0.60
NOM
3.42
0.60
2.82
0.78
0.63
11.25
6.25
1.27
8.89
5.08
DIMENSIONS
A
A2
0.15
0.10
0.20
0.30
0.15
MAX
3.62
0.70
2.92
0.85
0.66
NOTES
DETAIL B
PACKAGE SIDE VIEW
TOTAL NUMBER OF BALLS: 35
DETAIL A
b1
0.27 – 0.37
SUBSTRATE
A1
ddd M Z X Y
eee M Z
DETAIL B
MOLD
CAP
ccc Z
Øb (35 PLACES)
// bbb Z
aaa Z
Z
F
e
4
3
2
1
DETAIL A
PACKAGE BOTTOM VIEW
5
G
H
G
F
E
D
C
B
A
PIN 1
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
4
TRAY PIN 1
BEVEL
COMPONENT
PIN “A1”
BGA 35 0510 REV Ø
PACKAGE IN TRAY LOADING ORIENTATION
LTMXXXXXX
µModule
5. PRIMARY DATUM -Z- IS SEATING PLANE
BALL DESIGNATION PER JESD MS-028 AND JEP95
3
2. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
b
3
SEE NOTES
LTM8029
PACKAGE DESCRIPTION
BGA Package
35-Lead (11.25mm × 6.25mm × 3.42mm)
(Reference LTC DWG # 05-08-1878 Rev Ø)
Rev. E
LTM8029
REVISION HISTORY
(Revision history begins at Rev B)
REV
DATE
DESCRIPTION
B
02/13
Table 1, changed Bias voltage from 2.1V to 2.25V
PAGE NUMBER
11
Table 1, changed VIN 10-33 and 5.5V-33 to 10-32 and 5.5-32, respectively
11
Updated all graphs
4
C
02/14
Added SnPb BGA package option
D
10/16
Added web link to Order Information
E
04/19
1, 2
2
Updated Temperature Rise vs Output Current graph for –5VOUT, –8VOUT and –12VOUT
7
Table 1, changed VIN 18-24 to 4.8-24
12
Typical Application for –12V Inverting Output Convertor, changed Maximum VIN 31V to 24V
22
Added Storage Temperature Range –65ºC to 150ºC
2
Changed Maximum Internal Temperature 125ºC to Internal Operating Temperature Range (Note 2)
E and I Grades –40ºC to 125ºC
MP Grade
–55ºC to 125ºC
Changed Solder Temperature 260ºC to Peak Solder Reflow Package Body Temperature
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For
is granted
implication or
otherwise under any patent or patent rights of Analog Devices.
moreby
information
www.analog.com
21
LTM8029
PACKAGE PHOTO
11.25mm
3.42mm
6.25mm
DESIGN RESOURCES
SUBJECT
DESCRIPTION
µModule Design and Manufacturing Resources
Design:
•
Selector Guides
•
Demo Boards and Gerber Files
•
Free Simulation Tools
µModule Regulator Products Search
1. Sort table of products by parameters and download the result as a spread sheet.
Manufacturing:
•
Quick Start Guide
•
PCB Design, Assembly and Manufacturing Guidelines
•
Package and Board Level Reliability
2. Search using the Quick Power Search parametric table.
Digital Power System Management
Analog Devices’ family of digital power supply management ICs are highly integrated solutions that
offer essential functions, including power supply monitoring, supervision, margining and sequencing,
and feature EEPROM for storing user configurations and fault logging.
RELATED PARTS
PART NUMBER
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COMMENTS
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3V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 5V
LTM8022
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3.6V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 10V
LTM8023
36V, 2A µModule Regulator
3.6V ≤ VIN ≤ 36V, 0.8V ≤ VOUT ≤ 10V
LTM8048
Isolated µModule Regulator
725VDC Isolation, 3.1V ≤ VIN ≤ 32V, 300mA
Rev. E
22
04/19
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