EVALUATION KIT AVAILABLE
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
General Description
Benefits and Features
S Meets Industry Standards
The MAX14591 is a dual-channel, bidirectional logiclevel translator with the level shifting necessary to allow
data transfer in a multivoltage system. Externally applied
voltages, VCC and VL, set the logic levels on either side
of the device. A logic signal present on the VL side of the
device appears as the same logic signal on the VCC side
of the device, and vice-versa.
I2C Requirements for Standard, Fast, and
High* Speeds
MDIO Open Drain Above 4MHz*
S Allows Greater Design Flexibility
Down to 0.9V Operation on VL Side
Supports Above 8MHz Push-Pull Operation
The device is optimized for the I2C bus as well as the
management data input/output (MDIO) bus where often
high-speed, open-drain operation is required. When TS
is high, the device allows the pullup to be connected to
the I/O port that has the power. This allows continuous
I2C operation on the powered side without any disruption
while the level translation function is off.
S Offers Low Power Consumption
23µA (typ) VCC Supply Current
0.5µA (typ) VL Supply Current
S Provides High Level of Integration
Pullup Resistor Enabled with One Side
Power Supply when TS Is High
12kI (max) Internal Pullup
Low Transmission Gate RON: 17I (max)
The part is specified over the extended -40NC to +85NC
temperature range, and is available in 8-bump WLP and
8-pin TDFN packages.
S Saves Space
8-Bump, 0.4mm pitch, 0.8mm x 1.6mm WLP
Package
8-Pin, 2mm x 2mm TDFN Package
Applications
Devices with I2C Communication
Devices with MDIO Communication
General Logic-Level Translation
*Requires external pullups.
Ordering Information appears at end of data sheet.
Typical Operating Circuit
VCC = +3.0V
VL = +1.2V
1µF
0.1µF
+1.2V
SYSTEM
CONTROLLER
EN
TS
VL
*
SDA
VCC
VL
*
MAX14591
IOVL1
IOVCC1
VL
SLK
SDA
VCC
*
GND
+3V
SYSTEM
VCC
*
IOVL2
GND
IOVCC2
SLK
GND
* PULLUPS ARE OPTIONAL FOR HIGH-SPEED, OPEN-DRAIN OPERATION.
For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim Integrated’s website at www.maximintegrated.com.
19-6173; Rev 1; 12/14
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
ABSOLUTE MAXIMUM RATINGS
Voltages referenced to GND.
VCC, VL, TS..............................................................-0.5V to +6V
IOVCC1, IOVCC2.................................... -0.5V to +(VCC + 0.5V)
IOVL1, IOVL2............................................. -0.5V to +(VL + 0.5V)
Short-Circuit Duration IOVCC1, IOVCC2,
IOVL1, IOVL2 to GND............................................Continuous
VCC, IOVCC_ Maximum Continuous Current at +110°C....100mA
VL, IOVL_ Maximum Continuous Current at +110°C..........40mA
TS Maximum Continuous Current at +110°C......................70mA
Continuous Power Dissipation (TA = +70NC)
TDFN (derate 6.2mW/NC above +70NC).......................496mW
WLP (derate 11.8mW/NC above +70NC)......................944mW
Operating Temperature Range........................... -40NC to +85NC
Storage Temperature Range............................. -65NC to +150NC
Lead Temperature (TDFN only, soldering, 10s)..............+300NC
Soldering Temperature (reflow).......................................+260NC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to-Ambient Thermal Resistance (BJA)............ 162NC/W
Junction-to-Case Thermal Resistance (BJC).................. 20NC/W
WLP
Junction-to-Ambient Thermal Resistance (BJA)............. 85NC/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at
VCC = +3V, VL = +1.2V, and TA = +25NC.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER SUPPLY
Power Supply Range
VCC Supply Current
VL Supply Current
VCC Shutdown Supply Current
VL
0.9
5.5
VCC
1.65
5.5
ICC
IOVCC_ = VCC, IOVL_ = VL, TS = VCC
23
IL
IOVCC_ = VCC, IOVL_ = VL, TS = VCC
ICC-SHDN
VL Shutdown Supply Current
IL-SHDN
IOVCC_, IOVL_ Three-State
Leakage Current
ILEAK
47
FA
0.5
6
FA
TS = GND
1
2.2
TS = VCC, VL = GND, IOVCC_ = unconnected
1
2.2
TS = GND
0.1
1
0.1
1
TA = +25NC, TS = GND
0.1
1
FA
1
FA
ILEAK_TS
TA = +25NC
VCC Shutdown Threshold
VTH_VCC
TS = VL, VCC falling, VL = 0.9V
VL Above VCC Shutdown
Threshold
IOVL_ Pullup Resistor
IOVCC_ Pullup Resistor
IOVL_ to IOVCC_ DC
Resistance
Maxim Integrated
VTH_VL
FA
TS = VL, VCC = GND, IOVL_ = unconnected
TS Input Leakage Current
VL Shutdown Threshold
V
TS = VCC, VL falling
VTH_VL-VCC VL rising above VCC, VCC = +1.65V
FA
0.8
1.35
V
0.15
0.3
0.8
V
0.4
0.73
1.1
V
RVL_PU
Inferred from VOHL Measurements
3
7.6
12
kI
RVCC_PU
Inferred from VOHC Measurements
3
7.6
12
kI
6
17
I
RIOVL-IOVCC Inferred from VOHx Measurements
2
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +1.65V to +5.5V, VL = +0.9V to min(VCC + 0.3V, +3.6V), TA = -40NC to +85NC, unless otherwise noted. Typical values are at
VCC = +3V, VL = +1.2V, and TA = +25NC.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
LOGIC LEVELS
IOVL_ Input-Voltage High
VIHL
IOVL_ rising, VL = +0.9V,
VCC = +1.65V (Note 4)
IOVL_ Input-Voltage Low
VILL
IOVL_ falling, VL = +0.9V,
VCC = +1.65V (Note 4)
IOVCC_ Input-Voltage High
VIHC
IOVCC_ rising, VL = +0.9V,
VCC = +1.65V (Note 4)
IOVCC_ Input-Voltage Low
VILC
IOVCC_ falling, VL = +0.9V,
VCC = +1.65V (Note 4)
TS Input-Voltage High
VIH
TS rising, VL = +0.9V or +3.6V, VCC > VL
TS Input-Voltage Low
VIL
TS falling, VL = +0.9V or +3.6V, VCC > VL
VOHL
IOVL_ source current 20FA, VIOVCC_ = VL to
VCC (VCC R VL)
IOVL_ Output-Voltage Low
VOLL
IOVL_ sink current 5mA, VIOVCC_ P 0.05V
IOVCC_ Output-Voltage High
VOHC
IOVCC_ source current 20FA, VIOVL_ = VL
IOVCC_ Output-Voltage Low
VOLC
IOVCC_ sink current 5mA, VIOVL_ P 0.05V
IOVL_ Output-Voltage High
VL - 0.2
V
0.15
VCC - 0.4
V
V
0.2
VL - 0.15
V
V
0.2
0.7 x VL
V
V
0.2
0.7 x VCC
V
V
0.25
V
48
ns
RISE/FALL TIME ACCELERATOR STAGE
Accelerator Pulse Duration
VL = +0.9V, VCC = +1.65V
IOVL_ Output Accelerator
Source Impedance
VL = +0.9V, IOVL_ = GND, VCC = +1.65V
9
22
26
VL = +3.3V, IOVL_ = GND, VCC = +5V
6.8
IOVCC_ Output Accelerator
Source Impedance
VCC = +1.65V, IOVCC_ = GND
26
VCC = +5V, IOVCC_ = GND
6.5
I
I
THERMAL PROTECTION
Thermal Shutdown
TSHDN
+150
NC
Thermal Hysteresis
THYST
10
NC
±2
kV
ESD PROTECTION
All Pins
Maxim Integrated
HBM
3
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
TIMING CHARACTERISTICS
(VCC = +1.65V to +5.5V, VL = +0.9V to +3.6V, VCC R VL, TS = VL, CVCC = 1FF, CVL = 0.1FF, CIOVL_ P 100pF, CIOVCC_ P 100pF, TA
= -40NC to +85NC, unless otherwise noted. Typical values are at VCC = +3V, VL = +1.2V and TA = +25NC. All timing is 10% to 90%
for rise time and 90% to 10% for fall time.) (Note 5)
PARAMETER
SYMBOL
Turn-On Time for Q1
tON
IOVCC_ Rise Time
tRCC
IOVCC_ Fall Time
IOVL_ Rise Time
IOVL_ Fall Time
tFCC
tRL
tFL
CONDITIONS
MIN
VTS = 0V to VL (see the Block Diagram)
Push-pull driving, VL = +1.2V, VCC = +3V
(Figure 1)
TYP
MAX
UNITS
80
200
Fs
3.7
10
ns
Open-drain driving, VL = +1.2V, VCC = +3V
(Figure 2)
7.9
Push-pull driving, VL = +1.2V, VCC = +3V
(Figure 1)
5.1
Open-drain driving, VL = +1.2V, VCC = +3V
(Figure 2)
6.1
Push-pull driving, VL = +1.2V, VCC = +3V
(Figure 3)
2.7
Open-drain driving, VL = +1.2V, VCC = +3V
(Figure 4)
13
Push-pull driving, VL = +1.2V, VCC = +3V
(Figure 3)
2.8
Open-drain driving, VL = +1.2V, VCC = +3V
(Figure 4)
3.3
15
ns
8
ns
12
ns
Propagation Delay
(Driving IOVL_)
tPD_LCC
Push-pull driving,
Rising
VL = +1.2V, VCC = +3V
Falling
(Figure 1)
3.4
7
3
8
Propagation Delay
(Driving IOVCC_)
tPD_CCL
Push-pull driving,
Rising
VL = +1.2V, VCC = +3V
Falling
(Figure 3)
1.9
3
1.5
7
Channel-to-Channel Skew
Maximum Data Rate
tSKEW
Input rise time/fall time < 6ns
1.3
Push-pull operation
8
Open-drain operation (Note 6)
4
ns
ns
ns
MHz
Note 2: All devices are 100% production tested at TA = +25NC. Limits over the operating temperature range are guaranteed by
design and not production tested.
Note 3: VL must be less than or equal to VCC during normal operation. However, VL can be greater than VCC during startup and
shutdown conditions.
Note 4: VIHL, VILL, VIHC, and VILC are intended to define the range where the accelerator triggers.
Note 5: Guaranteed by design.
Note 6: External pullup resistors are required.
Maxim Integrated
4
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
VL
VCC
VL
VCC
TS
RS
50I
MAX14591
IOVL_
VCC
VL
VCC
TS
IOVCC_
GND
10%
10%
10%
10%
tPD_CCL
tPD_LCC
Figure 1. Push-Pull Driving IOVL_
tPD_CCL
Figure 3. Push-Pull Driving IOVCC_
VL
VCC
VL
VCC
1kI
1kI
MAX14591
IOVL_
RDSON
5I
50%
50%
50%
tPD_LCC
90%
90% 50%
50%
50%
50%
TS
tFL
tRL
90%
50%
1kI
RS
50I
IOVCC_
CL
20pF
tFCC
tRCC
MAX14591
IOVL_
CL
20pF
GND
90%
VL
VL
VCC
1kI
MAX14591
IOVL_
GND
CL
20pF
tFCC
90%
VCC
TS
IOVCC_
tRCC
VL
IOVCC_
RDSON
5I
GND
CL
20pF
tRL
tFL
90%
90%
50%
90%
50%
50%
50%
10%
10%
tPD_CCL
tPD_LCC
Figure 2. Open-Drain Driving IOVL_
Maxim Integrated
tPD_LCC
10%
10%
tPD_CCL
Figure 4. Open-Drain Driving IOVCC_
5
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Typical Operating Characteristics
(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
140
120
100
80
60
180
160
140
120
100
80
60
40
40
20
20
0
800
700
2.20
2.75
3.30
3.85
4.40
4.95
5.50
600
500
400
300
200
100
0
0
1.65
MAX14591E toc03
MAX14591E toc02
160
200
1.65
2.20
2.75
3.30
3.85
4.40
4.95
0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6
5.50
VCC (V)
VCC (V)
VL (V)
VCC DYNAMIC SUPPLY CURRENT
vs. VL SUPPLY VOLTAGE
(OPEN-DRAIN DRIVING ONE IOVCC_)
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(OPEN-DRAIN DRIVING ONE IOVL_)
VL DYNAMIC SUPPLY CURRENT
vs. TEMPERATURE
(PUSH-PULL DRIVING ONE IOVCC_)
500
400
300
200
100
0
0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6
VL (V)
Maxim Integrated
160
140
120
100
80
60
200
180
160
140
120
100
80
60
40
40
20
20
0
MAX14591E toc06
600
180
VL SUPPLY CURRENT (µA)
700
200
VL SUPPLY CURRENT (µA)
MAX14591E toc04
800
MAX14591E toc05
VL SUPPLY CURRENT (µA)
180
VL SUPPLY CURRENT (µA)
MAX14591E toc01
200
VCC SUPPLY CURRENT (µA)
VCC DYNAMIC SUPPLY CURRENT
vs. VL SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE IOVL_)
VL DYNAMIC SUPPLY CURRENT
vs. VCC SUPPLY VOLTAGE
(PUSH-PULL DRIVING ONE IOVCC_)
VCC SUPPLY CURRENT (µA)
VL DYNAMIC SUPPLY CURRENT
vs. VCC SUPPLY VOLTAGE
(OPEN-DRAIN DRIVING ONE IOVL_)
0
-40
-15
10
35
TEMPERATURE (°C)
60
85
-40
-15
10
35
60
85
TEMPERATURE (°C)
6
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Typical Operating Characteristics (continued)
(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
120
100
80
60
40
1.4
1.2
1.0
0.8
0.6
40
60
80
10
tRCC
0
0
100
20
40
60
80
100
0
20
40
60
80
CAPACITIVE LOAD (pF)
PROPAGATION DELAY
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVCC_)
PROPAGATION DELAY
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVCC_)
16
tPD_LCC_FALL
8
6
14
RISE /FALL TIME (ns)
10
tPD_LCC_RISE
12
10
6
4
2
2
0
0
40
60
CAPACITIVE LOAD (pF)
Maxim Integrated
80
100
tFL
8
4
20
RS = 50I
9
tRL
RS = 50I
8
100
MAX1960 toc12
CAPACITIVE LOAD (pF)
12
0
15
CAPACITIVE LOAD (pF)
RS = 50I
14
tFCC
5
PROPAGATION DELAY (ns)
16
20
MAX1960 toc10
0
20
0.4
0
0
RS = 50I
25
0.2
20
PROPAGATION DELAY (ns)
30
RISE/FALL TIME (ns)
140
1.6
MAX1960 toc08
160
RISE/FALL TIME vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
MAX1960 toc11
VL SUPPLY CURRENT (µA)
180
VCC SUPPLY CURRENT (mA)
MAX14591E toc07
200
VCC DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(PUSH-PULL DRIVING ONE IOVL_)
MAX14591E toc09
VL DYNAMIC SUPPLY CURRENT
vs. CAPACITIVE LOAD
(OPEN-DRAIN DRIVING ONE IOVL_)
7
6
5
tPD_CCL_FALL
4
3
tPD_CCL_RISE
2
1
0
0
20
40
60
CAPACITIVE LOAD (pF)
80
100
0
20
40
60
80
100
CAPACITIVE LOAD (pF)
7
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Typical Operating Characteristics (continued)
(VCC = +3V, VL = +1.5V, RL = 1MI, CL = 15pF, push-pull driving data rate = 8Mbps, TA = +25NC, unless otherwise noted.)
RAIL-TO-RAIL DRIVING
(PUSH-PULL DRIVING ONE IOVL_)
RIOVL-IOVCC vs. VL
MAX14591E toc14
MAX14591E toc13
6
5
RIOVL-IOVCC (I)
VCC = 1.65V
IOVL_
1V/div
VL = +1.5V
VCC = +3.3V
CL = 15pF
RL = 1MI
RS = 50I
4
VCC = 3.3V
3
VCC = 5.5V
2
IOVCC_
1V/div
1
VIOVL_ = 0.05V
IIOVCC_ = 3.3mA
0
0
1
2
40ns/div
3
4
5
6
VL (V)
RAIL-TO-RAIL DRIVING
(OPEN-DRAIN DRIVING ONE IOVL_)
EXITING SHUTDOWN MODE
MAX14591E toc16
MAX14591E toc15
TS
500mV/div
IOVL_
1V/div
VL = 1.2V
VCC = 3.0V
IOVCC_ = 0V
CL = 100pF
RPU_VL = 50I
VL = +1.5V
VCC = +3.3V
CL = 100pF
RS = 50I
PULLUP ON
IOVL_ /IOVCC_ = 1kI
IOVL_
500mV/div
IOVCC_
1V/div
40ns/div
Maxim Integrated
10µs/div
8
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Pin Configurations
TOP VIEW
VCC
BUMPS ON BOTTOM
8
IOVCC2 IOVCC1
7
6
GND
5
MAX14591
3
2
4
+
1
MAX14591
A
VL
IOVL2
IOVL1
TS
B
VCC
IOVCC2 IOVCC1
GND
WLP
+
1
2
3
4
VL
IOVL2
IOVL1
TS
TDFN
Pin Description
BUMP/PIN
NAME
FUNCTION
WLP
TDFN
A1
1
VL
A2
2
IOVL2
A3
3
IOVL1
A4
4
TS
Active-Low Three-State Input. Drive TS low to place the device in shutdown mode with
high-impedance output and internal pullup resistors disconnected. Drive TS high for normal
operation.
B1
8
VCC
Power Supply Voltage, +1.65V to +5.5V. Bypass VCC to GND with a 1FF ceramic capacitor
as close to the device as possible.
B2
7
IOVCC2
B3
6
IOVCC1
B4
5
GND
Maxim Integrated
Logic Supply Voltage, +0.9V to min(VCC + 0.3V, +3.6V). Bypass VL to GND with a 0.1FF
ceramic capacitor as close as possible to the device.
Input/Output 2. Reference to VL.
Input/Output 1. Reference to VL.
Input/Output 2. Reference to VCC.
Input/Output 1. Reference to VCC.
Ground
9
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Block Diagram
VL
VCC
TS
MAX14591
ONE-SHOOT
BLOCK
ONE-SHOOT
BLOCK
EN CONTROL
BLOCK
GATE
DRIVE
IOVL_
IOVCC_
N
Detailed Description
The MAX14591 is a dual-channel, bidirectional level translator. The device translates low voltage down to +0.9V on
the VL side to high voltage on the VCC side and vice-versa. The device is optimized for open-drain and high-speed
operation, such as I2C bus and MDIO bus.
The device has low on-resistance (17I max), which
is important for high-speed, open-drain operation. The
device also features internal pullup resistors that are
active when the corresponding power is on and TS is high.
Level Translation
For proper operation, ensure that +1.65V P VCC P +5.5V,
and +0.9V P VL P VCC. When power is supplied to VL
while VCC is less than VL, the device automatically
disables logic-level translation function. Also, the device
enters shutdown mode when TS = GND.
High-Speed Operation
The device meets the requirements of high-speed I2C
and MDIO open-drain operation. The maximum data rate
is at least 4MHz for open-drain operation with the total
bus capacitance equal to or less than 100pF.
Maxim Integrated
Q1
Three-State Input TS
The device features a three-state input that can put the
device into high-impedance mode. When TS is low,
IOVCC_ and IOVL_ are all high impedance and the internal pullup resistors are disconnected. When TS is high,
the internal pullup resistors are connected when the
corresponding power is in regulation, and the resistors
are disconnected at the side that has no power on. In
many portable applications, one supply is turned off but
the other side is still operating and requires the pullup
resistors to be present. This feature eliminates the need
for external pullup resistors. The level translation function
is off until both power supplies are in range.
Thermal-Shutdown Protection
The device features thermal-shutdown protection to
protect the part from overheating. The device enters
thermal shutdown when the junction temperature exceeds
+150NC (typ), and the device is back to normal operation
again after the temperature drops by approximately 10NC
(typ). When the device is in thermal shutdown, the level
translator is disabled.
10
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Applications Information
Layout Recommendations
Use standard high-speed layout practices when
laying out a board with the MAX14591. For example, to
minimize line coupling, place all other signal lines not connected to the device at least 1x the substrate height of the
PCB away from the input and output lines of the device.
Extended ESD
ESD protection structures are incorporated on all pins to
protect against electrostatic discharges up to ±2kV (HBM)
encountered during handling and assembly. After an ESD
event, the device continues to function without latchup.
RC
1MI
CHARGE CURRENTLIMIT RESISTOR
RD
1.5kI
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
Human Body Model
Figure 5 shows the Human Body Model. Figure 6 shows
the current waveform it generates when discharged
into a low impedance. This model consists of a 100pF
capacitor charged to the ESD voltage of interest that is
then discharged into the device through a 1.5kI resistor.
IP 100%
90%
DISCHARGE
RESISTANCE
Ir
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
AMPERES
HIGHVOLTAGE
DC
SOURCE
CS
100pF
STORAGE
CAPACITOR
DEVICE
UNDER
TEST
36.8%
10%
0
0
tRL
TIME
tDL
CURRENT WAVEFORM
Figure 5. Human Body ESD Test Model
Maxim Integrated
Figure 6. Human Body Current Waveform
11
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Package Information
Ordering Information
PART
TOP MARK
PIN-PACKAGE
MAX14591ETA+T
BNS
8 TDFN
MAX14591EWA+T
AAD
8 WLP
Note: All devices are specified over -40NC to +85NC operating
temperature range.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Chip Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but the
drawing pertains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
8 TDFN
T822CN+1
21-0487
90-0349
8 WLP
W80A1+1
21-0555
Refer to
Application
Note 1891
PROCESS: BiCMOS
Maxim Integrated
12
MAX14591
High-Speed, Open-Drain Capable
Logic-Level Translator
Revision History
REVISION
NUMBER
REVISION
DATE
0
5/11
1
12/14
DESCRIPTION
PAGES
CHANGED
Initial release
—
Updated Ordering Information and Package Information
12
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent
licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and
max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000
© 2014 Maxim Integrated Products, Inc.
13
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
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