19-1603; Rev 0; 1/00
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
Minimum Component Count Analog Systems
Digital Offset/Gain Adjustment
SONET Applications
Automatic Test Equipment (ATE)
♦ 8 DACs in a Single Package
♦ Buffered Voltage Outputs
♦ Unipolar or Bipolar Voltage Swing to +9V and -4V
♦ 22µs Output Settling Time
♦ Drives up to 10,000pF Capacitive Load
♦ Low Output Glitch: 30mV
♦ Low Power Consumption: 10mA (typ)
♦ Small Package: 44-Pin MQFP
♦ Double-Buffered Digital Inputs
♦ Asynchronous Load Updates All DACs
Simultaneously
♦ Asynchronous CLR Forces All DACs to DUTGND
Potential
Ordering Information
PART
TEMP. RANGE
PINPACKAGE
INL
(LSB)
MAX5839ACMH
0°C to +70°C
44 MQFP
±2
MAX5839BCMH
0°C to +70°C
44 MQFP
±4
MAX5839AEMH
-40°C to +85°C
44 MQFP
±2
MAX5839BEMH
-40°C to +85°C
44 MQFP
±4
34
35
OUTE
DUTGNDEF
OUTF
OUTG
36
37
38
39
40
41
42
TOP VIEW
OUTB
OUTC
DUTGNDCD
OUTD
REFCDEFREFCDEF+
VDD
Pin Configuration
43
Industrial Process Controls
Arbitrary Function Generators
Avionics Equipment
♦ Full 13-Bit Performance Without Adjustments
44
Applications
Features
DUTGNDAB
OUTA
REFABREFAB+
VDD
1
33
2
32
3
31
4
30
VSS
LD
A2
A1
A0
6
CS
11
23
5
29
28
MAX5839
7
27
8
26
9
25
10
24
DUTGNDGH
OUTH
REFGHREFGH+
VSS
CLR
D12
D11
D10
D9
D8
22
21
20
19
18
17
16
15
14
13
WR
VCC
GND
D0
D1
D2
D3
D4
D5
D6
D7
12
Functional Diagram appears at end of data sheet.
MQFP
________________________________________________________________ Maxim Integrated Products
1
For free samples & the latest literature: http://www.maxim-ic.com, or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
MAX5839
General Description
The MAX5839 contains eight 13-bit, voltage-output digital-to-analog converters (DACs). On-chip precision output amplifiers provide the voltage outputs. The device
operates from +14V/-9V supplies. Its bipolar output
voltage swing ranges from +9V to -4V and is achieved
with no external components. The MAX5839 has three
pairs of differential reference inputs; two of these pairs
are connected to two DACs each, and a third pair is
connected to four DACs. The references are independently controlled, providing different full-scale output
voltages to the respective DACs. The MAX5839 operates within the following voltage ranges: VDD = +7V to
+14V, VSS = -5V to -9V, and VCC = +4.75V to +5.25V.
The MAX5839 features double-buffered interface logic
with a 13-bit parallel data bus. Each DAC has an input
latch and a DAC latch. Data in the DAC latch sets the
output voltage. The eight input latches are addressed
with three address lines. Data is loaded to the input
latch with a single write instruction. An asynchronous
load input (LD) transfers data from the input latch to the
DAC latch. The LD input controls all DACs; therefore, all
DACs can be updated simultaneously by asserting the
LD pin.
An asynchronous CLR input sets the output of all eight
DACs to the respective DUTGND input of the op amp.
Note that CLR is a CMOS input, which is powered by
VDD. All other logic inputs are TTL/CMOS compatible.
The “A” grade of the MAX5839 has a maximum INL of
±2LSBs, while the “B” grade has a maximum INL of
±4LSBs. Both grades are available in 44-pin MQFP
packages.
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
ABSOLUTE MAXIMUM RATINGS
VDD to GND ...........................................................-0.3V to +17V
VSS to GND ........................................................... -11V to +0.3V
VCC to GND ............................................................ -0.3V to +6V
A_, D_, WR, CS, LD, CLR to GND.............+0.3V to (VCC + 0.3V)
REF_ _ _ _+, REF_ _ _ _-,
DUTGND_ _ ..................................(VSS - 0.3V) to (VDD + 0.3V)
OUT_ ..........................................................................VDD to VSS
Maximum Current into REF_ _ _ _ _, DUTGND_ _ ...........±10mA
Maximum Current into Any Signal Pin ............................. ±50mA
OUT_ Short-Circuit Duration to VDD, VSS, and GND .......... 1sec
Continuous Power Dissipation (TA = +70°C)
44-Pin MQFP (derate 11.1mW/°C above +70°C)......... 870mW
Operating Temperature Ranges
MAX5839_CMH ................................................... 0°C to +70°C
MAX5839_EMH................................................. -40°C to +85°C
Junction Temperature ..................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) ................................ +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, RL = 10kΩ,
CL = 50pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
STATIC PERFORMANCE (ANALOG SECTION)
Resolution
N
Relative Accuracy
INL
Differential Nonlinearity
DNL
Zero-Scale Error
ZSE
Full-Scale Error
FSE
13
Bits
MAX5839A
±2
MAX5839B
±4
Guaranteed monotonic
±1
LSB
±2
±4
LSB
±4
±8
LSB
±2
±5
LSB
Gain Error
LSB
Gain Temperature Coefficient
(Note 1)
0.15
20
ppm
FSR/°C
DC Crosstalk
(Note 1)
14
75
µV
±1
±10
µA
REFERENCE INPUTS
Input Resistance
1
Input Current
MΩ
REF_ _ _ _+ Input Range
0.5
4.5
V
REF_ _ _ _- Input Range
-2.0
-0.5
V
2
6.5
V
(REF_ _ _ _+) - (REF_ _ _ _-)
Range
ANALOG OUTPUTS
Maximum Output Voltage
9
Minimum Output Voltage
VDD - 2
VSS + 2
Resistive Load to GND
V
-4
5
V
kΩ
Capacitive Load to GND
(Note 2)
10,000
pF
DC Output Impedance
(Note 1)
0.5
Ω
2
_______________________________________________________________________________________
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, RL = 10kΩ,
CL = 50pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
40
84
MAX
UNITS
DUTGND_ _ CHARACTERISTICS
Input Impedance per DAC
Input Current per DAC
(Note 1)
Input Range
kΩ
-165
100
µA
-2
2
V
DIGITAL INPUTS
Input Voltage High
VIH
Input Voltage Low
VIL
2.4
Input Capacitance
CIN
(Note 1)
Input Current
IIN
VIN = 0 or VCC
V
0.8
V
10
pF
-1
1
µA
POWER SUPPLIES
VDD Analog Power-Supply
Range
VDD
7
14
V
VSS Analog Power-Supply
Range
VSS
-9
-5
V
Digital Power Supply
VCC
5
5.25
V
Positive Supply Current
IDD
RL = ∞
10
13
mA
Negative Supply Current
ISS
RL = ∞
9
12
mA
Digital Supply Current
ICC
4.75
(Note 3)
0.5
(Note 4)
5
mA
PSRR, ∆VOUT / ∆VDD
VDD = 14V ±5%
94
dB
PSRR, ∆VOUT / ∆VSS
VSS = -9V ±5%
98
dB
INTERFACE TIMING CHARACTERISTICS
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, Figure 2, TA = TMIN
to TMAX, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CS Pulse Width Low
t1
50
ns
WR Pulse Width Low
t2
50
ns
LD Pulse Width Low
t3
50
ns
CS Low to WR Low
t4
0
ns
CS High to WR High
t5
0
ns
Data Valid to WR Setup
t6
50
ns
Data Valid to WR Hold
t7
0
ns
Address Valid to WR Setup
t8
15
ns
Address Valid to WR Hold
t9
0
ns
_______________________________________________________________________________________
3
MAX5839
ELECTRICAL CHARACTERISTICS (continued)
DYNAMIC CHARACTERISTICS
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, RL = 10kΩ,
CL = 50pF, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
Output Settling Time
CONDITIONS
MIN
TYP
To ±1/2LSB of full scale
Output Slew Rate
Digital Feedthrough
(Note 5)
Digital Crosstalk
(Note 6)
Digital-to-Analog Glitch Impulse
DAC-to-DAC Crosstalk
Channel-to-Channel Isolation
Output Noise Spectral Density
At ƒ = 1kHz
MAX
UNITS
22
µs
1
V/µs
3
nVs
3
nVs
120
nVs
3
nVs
100
dB
120
nV/√Hz
Guaranteed by design. Not production tested.
Guaranteed by design when 220Ω resistor is in series with CL = 10,000pF.
All digital inputs (D_, A_, WR, CS, LD, and CLR) at GND or VCC potential.
All digital inputs (D_, A_, WR, CS, LD, and CLR) at +0.8V or +2.4V.
All data inputs (D0 to D12) transition from GND to VCC, with WR = VCC.
All digital inputs (D_, A_, WR, CS, LD, and CLR) at +0.8V or +2.4V.
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Typical Operating Characteristics
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, TA = +25°C, unless
otherwise noted.)
0.3
0.1
0.1
0
0
-0.1
-0.1
-0.2
-0.2
-0.3
-0.3
-0.4
2048
4096
DIGITAL CODE
6144
8192
0.2
DNL
0.1
-0.4
0
INL
0.3
ERROR (LSB)
0.2
DNL (LSB)
0.2
INL AND DNL ERROR vs. TEMPERATURE
0.4
MAX5260-02
0.3
4
0.4
MAX5260-01
0.4
DIFFERENTIAL NONLINEARITY
vs. DIGITAL CODE
MAX5260-03
INTEGRAL NONLINEARITY
vs. DIGITAL CODE
INL (LSB)
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
0
0
2048
4096
DIGITAL CODE
6144
8192
0
10
20
30
40
50
TEMPERATURE (°C)
_______________________________________________________________________________________
60
70
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
IDD AND ISS
vs. TEMPERATURE (UNLOADED)
10.2
0.05
9.6
FULL SCALE
-0.05
ZERO SCALE
-0.10
23
SUPPLY CURRENT (µA)
9.8
IDD, ISS (mA)
0.10
0
IDD
10.0
9.4
9.2
ISS
9.0
25
MAX5260-05
0.15
8.8
8.4
8.2
0
10
20
30
40
50
60
15
0
70
25
REFERENCE INPUT FREQUENCY RESPONSE
-20
-25
30
40
50
60
LARGE-SIGNAL STEP RESPONSE
MAX5260-08
D12
5V/div
80
SETTLING TIME (µs)
-15
20
SETTLING TIME vs. CAPACITIVE LOAD
90
-5
-10
10
TEMPERATURE (°C)
100
MAX5260-07
REF_ _ _ _ _ = 200mVp-p
0
0
TEMPERATURE (°C)
TEMPERATURE (°C)
5
70
70
MAX5260-09
-0.20
70
60
50
40
OUT
1V/div
30
-30
20
-35
10
0
-40
10k
100k
1M
10
10M
100
1000
10k
CAPACITIVE LOAD (pF)
POSITIVE SETTLING TIME
NEGATIVE SETTLING TIME
LD
OUT
1mV/div
100k
LD
OUT
1mV/div
5µs/div
NOISE VOLTAGE DENSITY
vs. FREQUENCY
MAX5260-11
FREQUENCY (Hz)
MAX5260-10
1k
1000
NOISE VOLTAGE DENSITY (nV/√Hz)
AMPLITUDE (dB)
19
17
8.6
-0.15
21
MAX5260-12
ERROR (LSB)
10.4
MAX5260-04
0.20
DIGITAL SUPPLY CURRENT
vs. TEMPERATURE
MAX5260-06
ZERO-SCALE AND FULL-SCALE ERROR
vs. TEMPERATURE
100
5µs/div
5µs/div
10
100
1k
10k
FREQUENCY (Hz)
_______________________________________________________________________________________
5
MAX5839
Typical Operating Characteristics (continued)
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, TA = +25°C, unless
otherwise noted.)
Typical Operating Characteristics (continued)
(VDD = +14V, VSS = -9V, VCC = +5V, VGND = VDUTGND_ _ = 0, VREF_ _ _ _+ = +4.500V, VREF_ _ _ _- = -2.000V, TA = +25°C, unless
otherwise noted.)
MAJOR CARRY GLITCH IMPULSE
(0x1000–0xFFF)
LD
5V/div
MAX5260-15
LD
5V/div
GAIN ERROR vs. VREF (VREF+ - VREF-)
0.4
MAX5260-14
MAX5260-13
MAJOR CARRY GLITCH IMPULSE
(0xFFFF–0x10000)
0.3
OUT
GAIN ERROR (LSB)
0.2
OUT
5mV/div
5mV/div
0.1
0
-0.1
-0.2
-0.3
2µs/div
2µs/div
0
2
4
6
VREF (V)
INTEGRAL NONLINEARITY
(MAX, MIN) vs. VREF (VREF+ - VREF-)
DIFFERENTIAL NONLINEARITY
(MAX, MIN) vs. VREF (VREF+ - VREF-)
0.20
0.4
0.15
0.3
0.10
INL (MAX, MIN) (LSB)
DNL (MAX, MIN) (LSB)
MAX5260-19
0.5
MAX5260-16
0.25
0.05
0
-0.05
-0.10
0.2
0.1
0
-0.1
-0.15
-0.2
-0.20
-0.3
-0.25
2
4
6
8
0
10
2
4
6
8
VREF (V)
VREF (V)
FULL-SCALE ERROR
vs. VREF (VREF+ - VREF-)
ZERO-SCALE ERROR
vs. VREF (VREF+ - VREF-)
0
MAX5260-18
0
-0.2
10
MAX5260-17
0
-0.2
-0.4
ZSE (LSB)
-0.4
FSE (LSB)
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
-0.6
-0.6
-0.8
-1.0
-0.8
-1.2
-1.0
-1.4
-1.6
-1.2
0
2
4
6
VREF (V)
6
8
10
0
2
4
6
8
10
VREF (V)
_______________________________________________________________________________________
8
10
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
PIN
NAME
FUNCTION
1
DUTGNDAB
Device Sense Ground Input for OUTA and OUTB. In normal operation, OUTA and OUTB are referenced
to DUTGNDAB. When CLR is low, OUTA and OUTB are forced to the potential on DUTGNDAB.
2
OUTA
3
REFAB-
Negative Reference Input for DACs A and B
4
REFAB+
Positive Reference Input for DACs A and B
5, 38
VDD
Positive Analog Power Supply. Normally set to +14V. Connect both pins to the supply voltage. See
Grounding and Bypassing section for bypass requirements.
6, 29
VSS
Negative Analog Power Supply. Normally set to -9V. Connect both pins to the supply voltage. See
Grounding and Bypassing section for bypass requirements.
7
LD
Load Input. Drive this asynchronous input low to transfer the contents of the input latches to their
respective DAC latches. DAC latches are transparent when LD is low and latched when LD is high.
8
A2
Address Bit 2 (MSB)
9
A1
Address Bit 1
10
A0
Address Bit 0 (LSB)
11
CS
Chip Select. Active-low input.
12
WR
Write Input. Active-low strobe for conventional memory write sequence. Input data latches are transparent when WR and CS are both low. WR latches data into the DAC input latch selected by A2–A0 on the
rising edge of CS.
13
VCC
Digital Power Supply. Normally set to +5V. See Grounding and Bypassing section for bypass requirements.
14
GND
Ground
15–27
D0–D12
28
CLR
30
REFGH+
Positive Reference Input for DACs G and H
31
REFGH-
Negative Reference Input for DACs G and H
DAC A Buffered Output Voltage
Data Bits 0–12. Offset binary coding.
Clear Input. Drive CLR low to force all DAC outputs to the voltage on their respective DUTGND _ _.
Does not affect the status of internal registers. All DACs return to their previous levels when CLR goes
high.
_______________________________________________________________________________________
7
MAX5839
Pin Description
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
MAX5839
Pin Description (continued)
8
PIN
NAME
FUNCTION
32
OUTH
33
DUTGNDGH
34
OUTG
DAC G Buffered Output Voltage
35
OUTF
DAC F Buffered Output Voltage
36
DUTGNDEF
37
OUTE
39
REFCDEF+
Positive Reference Input for DACs C, D, E, and F
40
REFCDEF-
Negative Reference Input for DACs C, D, E, and F
41
OUTD
42
DUTGNDCD
43
OUTC
DAC C Buffered Output Voltage
44
OUTB
DAC B Buffered Output Voltage
DAC H Buffered Output Voltage
Device Sense Ground Input for OUTG and OUTH. In normal operation, OUTG and OUTH are referenced
to DUTGNDGH. When CLR is low, OUTG and OUTH are forced to the potential on DUTGNDGH.
Device Sense Ground Input for OUTE and OUTF. In normal operation, OUTE and OUTF are referenced
to DUTGNDEF. When CLR is low, OUTE and OUTF are forced to the potential on DUTGNDEF.
DAC E Buffered Output Voltage
DAC D Buffered Output Voltage
Device Sense Ground Input for OUTC and OUTD. In normal operation, OUTC and OUTD are referenced
to DUTGNDCD. When CLR is low, OUTC and OUTD are forced to the potential on DUTGNDCD.
_______________________________________________________________________________________
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
CLR
R
Analog Section
R
OUT
2R
2R
2R
2R
D11
D12
D0
2R
2R
DUTGND
REF-
The MAX5839 contains eight 13-bit voltage-output
DACs. These DACs are “inverted” R-2R ladder networks that convert 13-bit digital inputs into equivalent
analog output voltages, in proportion to the applied reference voltages (Figure 1). The MAX5839 has three
positive reference inputs (REF_ _ _ _+) and three negative reference inputs (REF_ _ _ _-). The difference from
REF_ _ _ _+ to REF_ _ _ _- , multiplied by two, sets the
DAC output span.
In addition to the differential reference inputs, the
MAX5839 has four analog-ground input pins (DUTGND_ _). When CLR is high (unasserted), the voltage
on DUTGND_ _ offsets the DAC output voltage range. If
CLR is asserted, the output amplifier is forced to the
voltage present on DUTGND_ _.
REF+
Figure 1. DAC Simplified Circuit
Reference and DUTGND Inputs
All of the MAX5839’s reference inputs are buffered with
precision amplifiers. This allows the flexibility of using
resistive dividers to set the reference voltages. Because
of the relatively high multiplying bandwidth of the reference input (188kHz), any signal present on the reference pin within this bandwidth is replicated on the DAC
output.
t1
CS
t4
t5
t2
WR
The DUTGND pins of the MAX5839 are connected to
the negative source resistor (nominally 84kΩ) of the
output amplifier. The DUTGND pins are typically connected directly to analog ground. Each of these pins
has an input current that varies with the DAC digital
code. If the DUTGND pins are driven by external circuitry, budget ±200µA per DAC for load current.
t8
t9
A0–A2
t6
Output Buffer Amplifiers
t7
D0–D12
t3
t3
(NOTE 3)
LD
The MAX5839’s voltage outputs are internally buffered
by precision gain-of-two amplifiers with a typical slew
rate of 1V/µs. With a full-scale transition at its output,
the typical settling time to ±1/2LSB is 22µs. This settling
time does not significantly vary with capacitive loads
less than 10,000pF.
Output Deglitching Circuit
NOTES:
1. ALL INPUT RISE AND FALL TIMES MEASURED FROM 10% TO 90% OF
+5V. tr = tf = 5ns.
2. MEASUREMENT REFERENCE LEVEL IS (VINH + VINL) / 2.
3. IF LD– IS ACTIVATED WHILE WR IS LOW, THEN LD– MUST STAY LOW
FOR t3 OR LONGER AFTER WR GOES HIGH.
The MAX5839’s internal connection from the DAC ladder to the output amplifier contains special deglitch circuitry. This glitch/deglitch circuitry is enabled on the
falling edge of LD to remove the glitch from the R-2R
DAC. This enables the MAX5839 to exhibit a fraction of
the glitch impulse energy of parts without the deglitching circuit.
Figure 2. Digital Timing Diagram
_______________________________________________________________________________________
9
MAX5839
_______________Detailed Description
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
Digital Inputs and Interface Logic
All digital inputs are compatible with both TTL and
CMOS logic. The MAX5839 interfaces with microprocessors using a data bus at least 13 bits wide. The
interface is double buffered, allowing simultaneous
updating of all DACs. There are two latches for each
DAC (see Functional Diagram): an input latch that
receives data from the data bus, and a DAC latch that
receives data from the input latch. Address lines A0,
A1, and A2 select which DAC’s input latch receives
data from the data bus, as shown in Table 1. Both the
input latches and the DAC latches are transparent
when CS, WR, and LD are all low. Any change of
D0–D12 during this condition appears at the output
instantly. Transfer data from the input latches to the
DAC latches by asserting the asynchronous LD signal.
Each DAC’s analog output reflects the data held in its
DAC latch. All control inputs are level triggered. Table 2
is an interface truth table.
Table 1. MAX5839 DAC Addressing
FUNCTION
Loading the DACs
Taking LD high latches data into the DAC latches. If LD
is brought low when WR and CS are low, the DAC
addressed by A0, A1, and A2 is directly controlled by
the data on D0–D12. This allows the maximum digital
update rate; however, it is sensitive to any glitches or
skew in the input data stream.
Asynchronous Clear
The MAX5839 has an asynchronous clear pin (CLR)
that, when asserted, sets all DAC outputs to the voltage
present on their respective DUTGND pins. Deassert
CLR to return the DAC output to its previous voltage.
Note that CLR does not clear any of the internal digital
registers.
A2
A1
A0
0
0
0
DAC A input latch
0
0
1
DAC B input latch
0
1
0
DAC C input latch
0
1
1
DAC D input latch
1
0
0
DAC E input latch
Multiplying Operation
The MAX5839 can be used for multiplying applications.
Its reference accepts both DC and AC signals. Since
the reference inputs are unipolar, multiplying operation
is limited to two quadrants. See the graphs in the
Typical Operating Characteristics for dynamic performance of the DACs and output buffers.
1
0
1
DAC F input latch
1
1
0
DAC G input latch
1
1
1
DAC H input latch
Table 2. Interface Truth Table
CLR
LD
WR
CS
X
X
0
0
Input register transparent
X
X
X
1
Input register latched
X
X
1
X
Input register latched
X
0
X
X
DAC register transparent
X
1
X
X
DAC register latched
0
X
X
X
Outputs of DACs at
DUTGND_ _
X
Outputs of DACs set to voltage defined by the DAC
register, the references,
and the corresponding
DUTGND_ _
1
1
X = Don’t care
10
Input Write Cycle
Data can be latched or transferred directly to the DAC.
CS and WR control the input latch, and LD transfers
information from the input latch to the DAC latch. The
input latch is transparent when CS and WR are low,
and the DAC latch is transparent when LD is low. The
address lines (A0, A1, A2) must be valid for the duration that CS and WR are low (Figure 1), to prevent data
from being inadvertently written to the wrong DAC.
Data is latched within the input latch when either CS or
WR is high.
X
FUNCTION
Applications Information
Digital Code and
Analog Output Voltage
The MAX5839 uses offset binary coding. A 13-bit two’s
complement code is converted to a 13-bit offset binary
code by adding 212 = 4096.
Output Voltage Range
For typical operation, connect DUTGND to signal
ground, VREF+ to +4.5V, and VREF- to -2.0V. Table 3
shows the relationship between digital code and output
voltage.
The DAC digital code controls each leg of the 13-bit
R-2R ladder. A code of 0x0 connects all legs of the ladder to REF-, corresponding to a DAC output voltage
(VDAC) equal to REF-. A code of 0x1FFF connects all
legs of the ladder to REF+, corresponding to a VDAC
approximately equal to REF+.
______________________________________________________________________________________
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
INPUT CODE
OUTPUT
VOLTAGE (V)
1 1111 1111 1111
+8.998413
1 0000 0000 0000
+4.500
0 1001 1101 1001
+600µ
0 0000 0000 0001
-3.998586
0 0000 0000 0000
-4.000
Note: Output voltage is based on REF+ = +4.5V, REF- = -2.0V,
and DUTGND = 0.
The output amplifier multiplies VDAC by 2, yielding an
output voltage range of 2 · REF- to 2 · REF+ (Figure 1).
Further manipulation of the output voltage span is
accomplished by offsetting DUTGND. The output voltage of the MAX5839 is described by the following
equation:
DATA
VOUT = 2 VREF+ − VREF−
+ VREF−
13
2
− VOUTGND
(
)
where DATA is the numeric value of the DAC’s binary
input code, and DATA ranges from 0 (2 0 ) to 8191
(213 - 1). The resolution of the MAX5839, defined as
1LSB, is described by the following equation:
LSB =
(
2 REF+ − REF −
)
For optimum performance, use a multilayer PC board
with an unbroken analog ground. For normal operation,
connect the four DUTGND pins directly to the ground
plane. Avoid sharing the connections of these sensitive
pins with other ground traces.
As with any sensitive data acquisition system, connect
the digital and analog ground planes together at a single point, preferably directly underneath the MAX5839.
Avoid routing digital signals underneath the MAX5839
to minimize their coupling into the IC.
For normal operation, bypass VDD and VSS with 0.1µF
ceramic chip capacitors to the analog ground plane. To
enhance transient response and capacitive drive capability, add 10µF tantalum capacitors in parallel with the
ceramic capacitors. Note, however, that the MAX5839
does not require the additional capacitance for stability.
Bypass VCC with a 0.1µF ceramic chip capacitor to the
digital ground plane.
Power-Supply Sequencing
To guarantee proper operation of the MAX5839, ensure
that power is applied to VDD before VSS and VCC. Also
ensure that V SS is never more than 300mV above
ground. To prevent this situation, connect a Schottky
diode between VSS and the analog ground plane, as
shown in Figure 3. Do not power up the logic input pins
before establishing the supply voltages. If this is not
possible and the digital lines can drive more than
10mA, place current-limiting resistors (e.g., 470Ω) in
series with the logic pins.
13
2
Reference Selection
Because the MAX5839 has precision buffers on its reference inputs, the requirements for interfacing to these
inputs are minimal. Select a low-drift, low-noise reference within the recommended REF+ and REF- voltage
ranges. The MAX5839 does not require bypass capacitors on its reference inputs. Add capacitors only if the
reference voltage source requires them to meet system
specifications.
VSS
VSS
VSS
MAX5839
1N5817
Minimizing Output Glitch
The MAX5839’s internal deglitch circuitry is enabled on
the falling edge of LD. Therefore, to achieve optimum
performance, drive LD low after the inputs are either
latched or steady state. This is best accomplished by
having the falling edge of LD occur at least 50ns after
the rising edge of CS.
GND
SYSTEM GND
Figure 3. Schottky Diode Between VSS and GND
______________________________________________________________________________________
11
MAX5839
Power Supplies, Grounding,
and Bypassing
Table 3. Analog Voltage vs. Digital Code
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
Driving Capacitive Loads
The MAX5839 typically drives capacitive loads up to
0.01µF without a series output resistor. However, whenever driving high capacitive loads, it is prudent to use a
220Ω series resistor between the MAX5839 output and
the capacitive load.
12
Chip Information
TRANSISTOR COUNT: 10,973
______________________________________________________________________________________
LD
WR
CS
A0
A1
A2
GND
VCC
D0–
D12
ADDRESS
DECODE
LOGIC
DIGITAL
POWER
SUPPLY
DATA
REG
H
13
DATA
REG
F
13
DATA
REG
G
13
DATA
REG
E
13
13
13
DATA
REG
D
13
13
13
13
13
DATA
REG
C
13
13
13
DATA
REG
B
DATA
R
REG
A
13
13
13
13
MAX5839
DAC
REG
H
DAC
REG
G
13
DAC H
DAC G
DAC F
DAC E
13
DAC
REG
E
DAC
REG
F
DAC D
DAC C
DAC B
DAC A
13
13
13
13
DAC
REG
D
DAC
REG
C
DAC
REG
B
DAC
REG
A
ANALOG
POWER
SUPPLY
VDD
DUTGNDGH
OUTH
OUTG
DUTGNDEF
OUTF
OUTE
DUTGNDCD
OUTD
OUTC
DUTGNDAB
OUTB
OUTA
VSS
Functional Diagram
REFAB-
REFAB+
REFCDEF-
REFCDEF+
REFGH-
REFGH+
______________________________________________________________________________________
13
MAX5839
CLR
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
MQFP44.EPS
MAX5839
Package Information
14
______________________________________________________________________________________
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
MAX5839
NOTES
______________________________________________________________________________________
15
MAX5839
Octal, 13-Bit Voltage-Output DAC
with Parallel Interface
NOTES
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
16 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 1999 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
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