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MAX8731AETI+TG24

MAX8731AETI+TG24

  • 厂商:

    AD(亚德诺)

  • 封装:

  • 描述:

    INTEGRATED CIRCUIT

  • 数据手册
  • 价格&库存
MAX8731AETI+TG24 数据手册
19-0756; Rev 0; 1/07 KIT ATION EVALU E L B A IL AVA SMBus Level 2 Battery Charger with Remote Sense The MAX8731A is an SMBus™ programmable multichemistry battery charger. The MAX8731A uses a minimal command set to easily program the charge voltage, charge current, and adapter current limit. The MAX8731A charges one to four Li+ series cells and delivers up to 8A charge current. The MAX8731A drives n-channel MOSFETs for improved efficiency and reduced cost. Low-offset current-sense amplifiers provide high accuracy with 10mΩ sense resistors. The MAX8731A current-sense amplifiers provide high accuracy (3% at 3.5A) and also provide fast cycle-bycycle current-mode control to protect against battery short circuit and system load transients. The charger employs dual remote sense, which reduces charge time by measuring the feedback voltage directly at the battery, improving accuracy of initial transition into constant-voltage mode. The MAX8731A provides 0.5% battery voltage accuracy directly at the battery terminal. The MAX8731A provides a digital output that indicates the presence of the AC adapter, as well as an analog output that indicates the adapter current within 4% accuracy. The MAX8731A is available in a small 5mm x 5mm, 28-pin, thin (0.8mm) QFN package. An evaluation kit is available to reduce design time. The MAX8731A is available in a lead-free package. Features ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ 0.5% Battery Voltage Accuracy 3% Input Current-Limit Accuracy 3% Charge-Current Accuracy SMBus 2-Wire Serial Interface Cycle-by-Cycle Current Limit Battery Short-Circuit Protection Fast Response for Pulse Charging Fast System-Load-Transient Response Dual-Remote-Sense Inputs Monitor Outputs for Adapter Current (4% Accuracy) AC Adapter Detection 11-Bit Battery Voltage Setting 6-Bit Charge-Current/Input-Current Setting 8A (max) Battery Charger Current 11A (max) Input Current +8V to +26V Input Voltage Range Charges Li+, NiMH, and NiCd Battery Chemistries Ordering Information PART TEMP RANGE PINPACKAGE PKG CODE MAX8731AETI+ -40°C to +85°C 28 Thin QFN (5mm x 5mm) T2855-6 SMBus is a trademark of Intel Corp. Applications Notebook Computers Tablet PCs Medical Devices Portable Equipment with Rechargeable Batteries +Indicates a lead-free package. Typical Operating Circuit EXTERNAL LOAD OPTIONAL DLO CSIP CSIN FBSB FBSA 21 PGND TOP VIEW LDO Pin Configuration 20 19 18 17 16 15 CSSP ACIN DCIN ACOK 14 BATSEL LX 23 13 ACOK DHI 24 12 GND BST 25 11 VDD GND VCC 26 10 SCL CSSN 27 9 SDA 8 IINP *EXPOSED PADDLE 4 5 6 7 CCI CCV DAC GND 3 CCS 2 REF 1 ACIN CSSP 28 N LX MAX8731A DLO REF DCIN 22 MAX8731A CSSN DHI N PGND BST CSIP CSIN SELECTOR HOST SCL SDA VDD BATSEL FBSA BATTERY A FBSB BATTERY B SCL SDA VDD GND IINP DAC CCS BATSEL LDO VCC CCV CCI THIN QFN 5mm x 5mm ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. 1 MAX8731A General Description MAX8731A SMBus Level 2 Battery Charger with Remote Sense ABSOLUTE MAXIMUM RATINGS DCIN, CSSN, CSIN, FBSA, FBSB to GND..............-0.3V to +28V CSSP to CSSN, CSIP to CSIN, PGND to GND ......-0.3V to +0.3V BST to GND ............................................................-0.3V to +32V BST to LX..................................................................-0.3V to +6V DHI to LX.................................................-0.3V to +(VBST + 0.3)V DLO to PGND..........................................-0.3V to +(LDO + 0.3)V LX to GND .................................................................-6V to +28V CCI, CCS, CCV, DAC, REF, IINP to GND...........................................-0.3V to (VVCC + 0.3)V VDD, SCL, SDA, BATSEL, ACIN, ACOK, VCC to GND, LDO to PGND ......................................................-0.3V to +6V Continuous Power Dissipation (TA = +70°C) 28-Pin Thin QFN (derate 20.8mW/°C above +70°C) ........................1666.7 mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-60°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF, VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER CONDITIONS MIN TYP MAX UNITS 16.716 16.8 16.884 V +0.5 % CHARGE-VOLTAGE REGULATION ChargingVoltage() = 0x41A0 ChargingVoltage() = 0x3130 Battery Full-Charge Voltage and Accuracy ChargingVoltage() = 0x20D0 ChargingVoltage() = 0x1060 -0.5 12.491 12.592 12.693 V +0.8 % 8.4 8.467 V +0.8 % 4.192 4.234 V +1.0 % -0.8 8.333 -0.8 4.150 -1.0 Battery Undervoltage-Lockout Trip Point for Trickle Charge 2.5 V CHARGE-CURRENT REGULATION CSIP-to-CSIN Full-Scale CurrentSense Voltage Charge Current and Accuracy Charge-Current Gain Error FBSA/FBSB/CSIP/CSIN Input Voltage Range 2 78.22 80.64 83.06 mV RS2, Figure 1 = 10mΩ; ChargingCurrent() = 0x1f80 7.822 8.064 8.306 A +3 % RS2, Figure 1 = 10mΩ; ChargingCurrent() = 0x0f80 3.809 3.968 4.126 A -4 +4 % RS2, Figure 1 = 10mΩ; ChargingCurrent() = 0x0080 (128mA) 64 400 mA Based on ChargeCurrent() = 128mA and 8.064A -2 +2 % 0 19 V -3 _______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF, VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER Battery Quiescent Current CONDITIONS MIN Adapter present, not charging, ICSIP + ICSIN + ILX + IFBS, VFBS_ = VLX = VCSIN = VCSIP = 19V TYP MAX 2 5 µA Adapter absent, ICSIP + ICSIN + ILX + IFBSA + IFBSB + ICSSP + ICSSN, VFBS_ = VLX = VCSIN = VCSIP = 19V, VDCIN = 0V +1 VAdapter = 26V, VBattery = 16.8V, not charging Adapter Quiescent Current IDCIN + ICSSP + ICSSN UNITS 200 500 µA mA VAdapter = 19V, VBattery = 16.8V Charging 0.4 1 Not charging 200 500 µA VAdapter = 8V, VBattery = 4V Charging 0.4 1 mA Not charging 200 500 µA 110 113.3 mV INPUT-CURRENT REGULATION CSSP-to-CSSN Full-Scale Current-Sense Voltage Input Current Accuracy POR Input Current VFBS_ = 19V 106.7 RS1, Figure 1 = 10mΩ, InputCurrent() = 11004mA or 3584mA -3 +3 RS1, Figure 1 = 10mΩ, InputCurrent() = 2048mA -5 +5 RS1, Figure 1 = 10mΩ Input Current-Limit Gain Error Input Current-Limit Offset Based on InputCurrent() = 1024mA and 11004mA CSSP/CSSN Input Voltage Range 256 mA -2 +2 % -1 +1 mV 8 26 V 3.15 mA/V -1.5 +1.5 mV VCSSP - CSSN = 110mV -5 +5 VCSSP - CSSN = 55mV or 35mV -4 +4 VCSSP - CSSN = 20mV -10 +10 0 3.5 V 8.0 26.0 V IINP Transconductance VCSSP - CSSN = 110mV 2.85 IINP Offset Based on VCSSP - CSSN = 110mV and 20mV IINP Accuracy % IINP Output Voltage Range 3.0 % SUPPLY AND LINEAR REGULATOR DCIN, Input Voltage Range DCIN Undervoltage-Lockout Trip Point Power-Fail Threshold DCIN falling 7 DCIN rising 7.4 7.5 7.85 VCSSP - VCSIN falling 9 15 21 VCSSP - VCSIN rising 160 210 271 V mV _______________________________________________________________________________________ 3 MAX8731A ELECTRICAL CHARACTERISTICS (continued) MAX8731A SMBus Level 2 Battery Charger with Remote Sense ELECTRICAL CHARACTERISTICS (continued) (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF, VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER CONDITIONS LDO Output Voltage 8.0V < VDCIN < 28V, no load LDO Load Regulation 0 < ILDO < 30mA LDO Undervoltage-Lockout Threshold VDCIN = 8.0V, VLDO falling VDD Range MIN TYP MAX 5.25 5.4 5.55 V 34 100 mV 4.00 5.15 V 5.5 V 2.7 V 3.20 2.7 VDD UVLO Rising 2.5 VDD UVLO Hysteresis VDD Quiescent Current 100 DCIN < 6V, VDD = 5.5V, SCL = SDA = 5.5V UNITS mV 16 27 µA 4.096 4.120 V 3.1 3.9 V REFERENCE REF Output Voltage 0 < IREF < 500µA REF Undervoltage-Lockout Trip Point REF falling 4.071 ACOK ACOK Sink Current VACOK = 0.4V, ACIN = 1.5V ACOK Leakage Current VACOK = 5.5V, ACIN = 2.5V 1 mA 1 µA ACIN ACIN Threshold 2.007 2.048 2.089 V ACIN Threshold Hysteresis 10 20 30 mV ACIN Input Bias Current -1 +1 µA REMOTE-SENSE INPUTS FBS_ Range VCSIN - VFBS FBS_ Gain ΔVCSIN / Δ(VCSIN - VFBS_) CSIN-FBS_ Clamp Voltage FBS_ Bias Current Charger switching, FBS_ selected FBS_ Bias Current Charger not switching or FBS_ not selected 200 mV 0.95 0 1.00 1.05 V/V 225 250 275 mV 14 µA +2 µA -2 SWITCHING REGULATOR Off-Time VCSIN = 16.0V, VCSSP = 19V 360 400 440 VCSIN = 16.0V, VCSSP = 17V 260 300 360 500 800 µA 2 µA BST Supply Current DHI high LX Input Bias Current VDCIN = 28V, VCSIN = VLX = 20V, DHI low Maximum Discontinuous-Mode Peak Current (IMIN) 0.5 ns A DHI On-Resistance Low IDHI = -10mA 1 3 Ω DHI On-Resistance High IDHI = 10mA 3 5 Ω DLO On-Resistance High IDLO = 10mA 3 5 Ω DLO On-Resistance Low IDLO = -10mA 1 3 Ω 4 _______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF, VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) PARAMETER CONDITIONS MIN TYP MAX UNITS 0.0625 0.125 0.2500 mA/V ERROR AMPLIFIERS GMV Amplifier Transconductance ChargingVoltage() = 16.8V, VFBS_ = 16.8V GMI Amplifier Transconductance 0.5 1.0 2.0 mA/V GMS Amplifier Transconductance InputCurrent() = 3968mA, VCSSP - VCSSN = 79.36mV ChargingCurrent() = 3968mA, VCSIP - VCSIN = 39.68mV 0.5 1.0 2.0 mA/V CCI/CCS/CCV Clamp Voltage 120 250 600 mV 0.8 V 0.25V < VCCI/S/V < 2.0V LOGIC LEVELS SDA/SCL Input-Low_Voltage VDD = 2.7V to 5.5V SDA/SCL Input-High_Voltage VDD = 2.7V to 5.5V 2.1 SDA/SCL Input Bias Current VDD = 2.7V to 5.5V -1 V BATSEL Input-Low_Voltage BATSEL Input-High_Voltage µA V 2.1 BATSEL Input Bias Current SDA, Output Sink Current +1 0.8 V -1 V(SDA) = 0.4V +1 6 µA mA SMBus TIMING SPECIFICATIONS (VDD = 2.7V to 5.5V) (see Figures 4 and 5) PARAMETERS SYMBOL CONDITIONS MIN SMBus Frequency fSMB 10 Bus Free Time TYP MAX UNITS 100 kHz tBUF 4.7 µs Start Condition Hold Time from SCL tHD:STA 4 µs Start Condition Setup Time from SCL tSU:STA 4.7 µs Stop Condition Setup Time from SCL tSU:STO 4 µs SDA Hold Time from SCL tHD:DAT 300 ns SDA Setup Time from SCL tSU:DAT 250 ns SCL Low Timeout tTIMEOUT (Note 1) 25 35 ms SCL Low Period TLOW 4.7 µs SCL High Period THIGH 4 µs Maximum Charging Period Without a ChargeVoltage() or ChargeCurrent() Command 140 175 210 s _______________________________________________________________________________________ 5 MAX8731A ELECTRICAL CHARACTERISTICS (continued) MAX8731A SMBus Level 2 Battery Charger with Remote Sense ELECTRICAL CHARACTERISTICS (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF , VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = -40°C to +85°C, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS MIN TYP MAX UNITS 16.968 V % CHARGE-VOLTAGE REGULATION 16.632 ChargingVoltage() = 0x41A0 -1 +1 12.466 12.717 V -1 +1 % 8.316 8.484 V -1 +1 % 4.129 4.255 V -1.5 +1.5 % 78.22 83.05 mV RS2, Figure 1 = 10mΩ; ChargingCurrent()= 0x1f80 7.822 8.305 A -3 +3 % RS2, Figure 1 = 10mΩ; ChargingCurrent() = 0x0f80 3.809 4.126 A -4 +4 % RS2, Figure 1 =10mΩ; ChargingCurrent() = 0x0080 30 400 mA Based on ChargeCurrent() = 128mA and 8.064A -2 +2 % 0 19 V ChargingVoltage() = 0x3130 Battery Full-Charge Voltage and Accuracy ChargingVoltage() = 0x20D0 ChargingVoltage() = 0x1060 CHARGE-CURRENT REGULATION CSIP-to-CSIN Full-Scale CurrentSense Voltage Charge Current and Accuracy Charge-Current Gain Error FBSA/FBSB/CSIP/CSIN InputVoltage Range Battery Quiescent Current Adapter present, not charging, ICSIP + ICSIN + ILX + IFBS, VFBS_ = VLX = VCSIN = VCSIP = 19V 5 Adapter absent, ICSIP + ICSIN + ILX + IFBSA + IFBSB + ICSSP + ICSSN, VFBS_= VLX = VCSIN = VCSIP = 19V, VDCIN = 0V 1 VAdapter = 26V, VBattery = 16.8V, not charging Adapter Quiescent Current 6 IDCIN + ICSSP + ICSSN VAdapter = 19V, VBattery = 16.8V Charging VAdapter = 8V, VBattery = 4V Charging Not charging Not charging _______________________________________________________________________________________ µA 500 µA 1 mA 500 µA 1 mA 500 µA SMBus Level 2 Battery Charger with Remote Sense (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF , VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = -40°C to +85°C, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS MIN TYP MAX UNITS 103.3 116.6 mV RS1, Figure 1 = 10mΩ; InputCurrent() = 11004mA or 3584mA -6 +6 RS1, Figure 1 = 10mΩ; InputCurrent() = 2048mA -5 +5 Input Current-Limit Gain Error Based on InputCurrent() = 1024mA and 11004mA -5 +5 % Input Current-Limit Offset Based on InputCurrent() = 1024mA and 11004mA -1 +1 mV 8 26 V INPUT-CURRENT REGULATION CSSP-to-CSSN Full-Scale Current-Sense Voltage VFBS_ = 19V Input Current Accuracy % CSSP/CSSN Input Voltage Range IINP Transconductance VCSSP - CSSN = 110mV 2.7 3.3 mA/V IINP Offset Based on VCSSP - CSSN = 110mV and 20mV mV IINP Accuracy -1.5 +1.5 VCSSP - CSSN = 110mV -5 +5 VCSSP - CSSN = 55mV or 35mV -4 +4 VCSSP - CSSN = 20mV -10 +10 0 3.5 V 8.0 26.0 V IINP Output Voltage Range % SUPPLY AND LINEAR REGULATOR DCIN, Input Voltage Range DCIN Undervoltage-Lockout Trip Point DCIN falling 7 DCIN rising 7.85 — VCSSP - VCSIN falling 9 21 VCSSP - VCSIN rising 160 271 LDO Output Voltage 8.0V < VDCIN < 28V, no load 5.25 5.55 V LDO Load Regulation 0 < ILDO < 30mA 100 mV LDO Undervoltage-Lockout Threshold VDCIN = 8.0V, VLDO falling 3.20 5.15 V 2.7 5.5 V POWER_FAIL Threshold VDD Range VDD UVLO Rising VDD Quiescent Current DCIN < 6V, VDD = 5.5V, SCL = SDA = 5.5V mV 2.7 V 27 µA 4.139 V 3.9 V REFERENCE REF Output Voltage 0 < IREF < 500µA REF Undervoltage-Lockout Trip Point REF falling 4.053 ACOK ACOK Sink Current VACOK = 0.4V, ACIN = 1.5V 1 mA _______________________________________________________________________________________ 7 MAX8731A ELECTRICAL CHARACTERISTICS (continued) MAX8731A SMBus Level 2 Battery Charger with Remote Sense ELECTRICAL CHARACTERISTICS (continued) (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF , VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = -40°C to +85°C, unless otherwise noted.) (Note 2) PARAMETER CONDITIONS MIN TYP MAX UNITS 2.007 2.089 V 10 30 mV 0 200 mV 0.9 1.1 V/V 220 280 mV 14 µA ACIN ACIN Threshold ACIN Threshold Hysteresis REMOTE-SENSE INPUTS FBS_ Range VCSIN - VFBS FBS_ Gain ΔVCSIN / Δ(VCSIN - VFBS_) CSIN-FBS_ Clamp Voltage FBS_ Bias Current Charger switching, FBS_ selected SWITCHING REGULATOR Off-Time VCSIN = 16.0V, VCSSP = 19V 360 440 VCSIN = 16.0V, VCSSP = 17V 260 350 ns BST Supply Current DHI high 800 µA DHI On-Resistance Low IDHI = -10mA 3 Ω DHI On-Resistance High IDHI = 10mA 5 Ω DLO On-Resistance High IDLO = 10mA 5 Ω DLO On-Resistance Low IDLO = -10mA 3 Ω 0.0625 0.2500 mA/V 0.5 2.0 mA/V ERROR AMPLIFIERS GMV Amplifier Transconductance ChargingVoltage() = 16.8V, VFBS_ = 16.8V GMI Amplifier Transconductance ChargingCurrent() = 3968mA, VCSIP - VCSIN = 39.68mV GMS Amplifier Transconductance InputCurrent() = 3968mA, VCSSP - VCSSN = 79.36mV 0.5 2.0 mA/V CCI/CCS/CCV Clamp Voltage 150 600 mV 0.8 V 0.25V < VCCI/S/V < 2.0V LOGIC LEVELS SDA/SCL Input Low Voltage VDD = 2.7V to 5.5V SDA/SCL Input High Voltage VDD = 2.7V to 5.5V 2.3 BATSEL Input Low Voltage BATSEL Input High Voltage SDA, Output Sink Current 8 V 0.8 V(SDA) = 0.4V V 2.3 V 6 mA _______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense (VDCIN = VLX = VCSSP = VCSSN = 19V, VBST - VLX = 4.5V, VFBSA = VFBSB = VCSIP = VCSIN = 16.8V, BATSEL = GND = PGND = 0, CLDO = 1µF, VCC = LDO, CREF = 1µF, CDAC = 0.1µF , VDD = 3.3V, ACIN = 2.5V; pins CCI, CCV, and CCS are compensated per Figure 1; TA = -40°C to +85°C, unless otherwise noted.) (Note 2) SMB TIMING SPECIFICATION (VDD = 2.7V to 5.5V) (see Figures 4 and 5) PARAMETERS SYMBOL CONDITIONS MIN TYP MAX UNITS 100 kHz SMBus Frequency fSMB 10 Bus Free Time tBUF 4.7 µs START Condition Hold Time from SCL tHD:STA 4 µs START Condition Setup Time from SCL tSU:STA 4.7 µs STOP Condition Setup Time from SCL tSU:STO 4 µs SDA Hold Time from SCL tHD:DAT 300 ns SDA Setup Time from SCL SCL Low Timeout tSU:DAT tTIMEOUT 250 (Note 1) 25 ns 35 ms SCL Low Period TLOW 4.7 µs SCL High Period THIGH 4 µs Maximum Charging Period Without a ChargeVoltage() or ChargeCurrent() Command 140 210 s Note 1: Devices participating in a transfer time out when any clock low exceeds the 25ms minimum timeout period. Devices that have detected a timeout condition must reset the communication no later than the 35ms maximum timeout period. Both a master and a slave must adhere to the maximum value specified as it incorporates the cumulative stretch limit for both a master (10ms) and a slave (25ms). Note 2: Specifications to -40°C are guaranteed by design, not production tested. _______________________________________________________________________________________ 9 MAX8731A ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (Circuit of Figure 1, adapter = 19.5V, ChargeVoltage() = 16.8V, ChargeCurrent() = 3.854A, InputCurrent() = 3.584A, TA = +25°C, unless otherwise noted.) TYPICAL 0 -2 MINIMUM INPUT CURRENT LIMIT = 3.584A 0.2 0 INPUT CURRENT LIMIT = 4.096A -0.2 1.0 2 4 6 8 10 INPUT CURRENT-LIMIT SETTING (A) 0 1 2 3 SYSTEM CURRENT (A) -0.6 VBATT = 8.4V -0.2 8 6 NOT SWITCHING 4 1.5 VBATT = 16.8V VBATT = 8.4V 1.0 -0.4 0 -2 TYPICAL -8 INPUT CURRENT LIMIT = 3.584A OPERATING AT INPUT CURRENT LIMIT 0 -1.0 0.5 1.0 1.5 2.0 2.5 3.0 SYSTEM CURRENT (A) 3.5 -10 0 4.0 MAXIMUM 4 2 0 -2 TYPICAL MINIMUM -6 4 2 3.072A 3.968A 0 8.064A -2 -8 -4 -10 0 2 4 6 CHARGE-CURRENT SETTING (A) 0 8 1 2 3 4 INPUT CURRENT (A) 5 6 TRICKLE-CHARGE CURRENT ERROR vs. BATTERY VOLTAGE MAX8731A toc08 8 4 CHARGE-CURRENT ERROR (%) MAX8731A toc07 10 -4 2 3 SYSTEM CURRENT (A) CHARGE-CURRENT ERROR vs. BATTERY VOLTAGE CHARGE-CURRENT ERROR vs. CHARGE CURRENT-LIMIT SETTING 6 1 5 TRICKLE-CHARGE CURRENT ERROR (%) 0 MINIMUM -6 MAX8731A toc09 -0.8 0.5 MAXIMUM 2 -4 INPUT CURRENT LIMIT = 4.096A -0.6 4 MAX8731A toc06 VBATT = 12.6V IINP ERROR (%) 0 2 3 SYSTEM CURRENT (A) IINP ERROR vs. INPUT CURRENT 2.0 IINP ERROR (%) INPUT CURRENT LIMIT = 3.584A 1 10 0.4 IINP ERROR (%) -0.4 0 MAX8731A toc05 0.6 10 0 -0.2 4 2.5 MAX8731A toc04 INPUT CURRENT LIMIT = 2.048A 0.2 VBATT = 16.8V VBATT = 12.6V 0.2 IINP ERROR vs. SYSTEM CURRENT IINP ERROR vs. SYSTEM CURRENT 1.0 0.8 0.4 -1.0 -0.4 0 0.6 -0.8 INPUT CURRENT LIMIT = 2.048A -6 INPUT CURRENT LIMIT = 3.584A 0.8 INPUT CURRENT-LIMIT ERROR (%) MAXIMUM 2 MAX8731A toc02 4 0.4 INPUT CURRENT-LIMIT ERROR (%) MAX8731A toc01 INPUT CURRENT-LIMIT ERROR (%) 6 -4 INPUT CURRENT-LIMIT ERROR vs. SYSTEM CURRENT INPUT CURRENT-LIMIT ERROR vs. SYSTEM CURRENT MAX8731A toc03 INPUT CURRENT-LIMIT ERROR vs. INPUT CURRENT-LIMIT SETTING CHARGE-CURRENT LIMIT ERROR (%) MAX8731A SMBus Level 2 Battery Charger with Remote Sense 0 -5 -10 -15 -20 -25 ChargeCurrent( ) = 128mA -30 3 6 9 12 15 BATTERY VOLTAGE (V) 18 0 3 6 9 12 BATTERY VOLTAGE (V) ______________________________________________________________________________________ 15 18 SMBus Level 2 Battery Charger with Remote Sense (Circuit of Figure 1, adapter = 19.5V, ChargeVoltage() = 16.8V, ChargeCurrent() = 3.854A, InputCurrent() = 3.584A, TA = +25°C, unless otherwise noted.) CHARGE-VOLTAGE ERROR vs. CHARGE-VOLTAGE SETTING BATTERY-VOLTAGE ERROR vs. CHARGE CURRENT 0.2 0.0 -0.2 -0.4 MAX8731A toc11 0.4 0.3 BATTERY-VOLTAGE ERROR (%) MAX8731A toc10 CHARGE-VOLTAGE ERROR (%) 0.6 0.2 0.1 2 CELLS 0 4 CELLS -0.1 -0.2 3 CELLS -0.6 -0.3 8 12 16 CHARGE-VOLTAGE SETTING (V) 20 0 BATTERY REMOVAL 2 3 4 CHARGE CURRENT (A) 13.5V 12.5V VOUT OUTPUT CAPACITOR = 22μF 5A LOAD CURRENT 0A ADAPTER CURRENT 5A 0A 5A INDUCTOR CURRENT ChargeVoltage( ) = 12.6V CCS CCS VOLTAGE 500mV/div CCI VOLTAGE 500mV/div 500mV/div LDO LOAD REGULATION EFFICIENCY vs. CHARGE CURRENT 0 MAX8731A toc14 95 4 CELLS -5 CHARGER OFF -10 LDO ERROR (mV) EFFICIENCY (%) CCI CCS 200μs/div 100 2 CELLS 85 0A 500mV/div CCI 20μs/div 3 CELLS 6 MAX8731A toc13 13.0V 90 5 SYSTEM LOAD TRANSIENT MAX8731A toc12 VOUT OUTPUT CAPACITOR = 10μF 1 MAX8731A toc15 4 80 75 -15 -20 -25 70 -30 65 -35 60 -40 0 2 4 6 CHARGE CURRENT (A) 8 0 20 40 60 ILDO (mA) 80 100 ______________________________________________________________________________________ 11 MAX8731A Typical Operating Characteristics (continued) Typical Operating Characteristics (continued) (Circuit of Figure 1, adapter = 19.5V, ChargeVoltage() = 16.8V, ChargeCurrent() = 3.854A, InputCurrent() = 3.584A, TA = +25°C, unless otherwise noted.) REF LOAD REGULATION NOT SWITCHING 0.15 0.3 MAX8731A toc18 MAX8731A toc16 -1 REF ERROR vs. TEMPERATURE 0.20 MAX8731A toc17 LDO LINE REGULATION 0 0.2 REF ERROR (%) -2 -3 -4 REF ERROR (%) 0.10 LDO ERROR (mV) 0.05 0 -0.05 0.1 0 -0.1 -0.10 -0.2 -0.15 -6 -0.20 13 18 VDCIN (V) 23 -0.3 0 0.2 0.4 0.6 IREF (mA) 0.8 0 20 40 TEMPERATURE (°C) MAX8731A toc19 350 300 250 MAX8731A toc20 13.0 2.8Ah x 3S3P BATTERY 4 12.5 BATTERY VOLTAGE 12.0 3 11.5 2 11.0 1 200 10.5 CHARGE CURRENT 0 150 0 5 10 15 VADAPTER - VBATTERY (V) 10.0 0 20 ADAPTER CURRENT vs. ADAPTER VOLTAGE 2 3 TIME (h) 4 2.5 MAX8731A toc21 2.5 ADAPTER PRESENT OR ABSENT 2.0 BATTERY CURRENT (μA) SWITCHING, NO LOAD 2.0 ChargeVoltage( ) = 4.192V 1.5 NOT SWITCHING 1.0 1 5 6 BATTERY-LEAKAGE CURRENT vs. BATTERY VOLTAGE 3.0 1.5 1.0 0.5 0.5 0 0 0 12 -20 5 CHARGE CURRENT (A) FREQUENCY (kHz) 400 -40 BATTERY-CHARGE CURVE SWITCHING FREQUENCY 450 1.0 MAX8731A toc22 8 5 10 15 20 ADAPTER VOLTAGE (V) 25 30 0 5 10 15 BATTERY VOLTAGE (V) 20 ______________________________________________________________________________________ BATTERY VOLTAGE (V) NOT SWITCHING -5 ADAPTER CURRENT (mA) MAX8731A SMBus Level 2 Battery Charger with Remote Sense 60 80 SMBus Level 2 Battery Charger with Remote Sense PIN NAME FUNCTION 1, 12 GND Analog Ground. Connect directly to the paddle. 2 ACIN AC Adapter Detect Input. ACIN is the input to an uncommitted comparator. 3 REF 4.096V Voltage Reference. Bypass REF with a 1µF capacitor to GND. 4 CCS Input Current Regulation Loop-Compensation Point. Connect 0.01µF from CCS to GND. 5 CCI Output Current Regulation Loop-Compensation Point. Connect 0.01µF from CCI to GND. 6 CCV Voltage Regulation Loop-Compensation Point. Connect 10kΩ in series with 0.01µF to GND. 7 DAC DAC Voltage Output. Bypass with 0.1µF from DAC to GND. 8 IINP Input Current Monitor Output. IINP sources the current proportional to the current sensed across CSSP and CSSN. The transconductance from (CSSP - CSSN) to IINP is 3mA/V. 9 SDA SMBus Data I/O. Open-drain output. Connect an external pullup resistor according to SMBus specifications. 10 SCL SMBus Clock Input. Connect an external pullup resistor according to SMBus specifications. 11 VDD Logic Circuitry Supply-Voltage Input. Bypass with a 0.1µF capacitor to GND. 13 ACOK AC Detect Output. This open-drain output is high impedance when ACIN is greater than REF/2. The ACOK output remains low when the MAX8731A is powered down. Connect a 10kΩ pullup resistor from VCC to ACOK. 14 BATSEL Battery Voltage Select Input. Drive BATSEL high to select battery B, or drive BATSEL low to select battery A. Any change of BATSEL immediately stops charging. Charging begins again in approximately 10ms. 15 FBSA Remote-Sense Input for the Output Voltage of Battery A. Connect a 100Ω resistor from FBSA to the battery connector, and a 10nF capacitor from FBSA to PGND. 16 FBSB Remote-Sense Input for the Output Voltage of Battery B. Connect a 100Ω resistor from FBSB to the battery connector, and a 10nF capacitor from FBSB to PGND. 17 CSIN Charge Current-Sense Negative Input 18 CSIP Charge Current-Sense Positive Input. Connect a 10mΩ current-sense resistor between CSIP and CSIN. 19 PGND 20 DLO Low-Side Power MOSFET Driver Output. Connect to low-side n-channel MOSFET. DLO drives between LDO and PGND. 21 LDO Linear-Regulator Output. LDO is the output of the 5.4V linear regulator supplied from DCIN. LDO also directly supplies the DLO driver and the BST charge pump. Bypass with a 1µF ceramic capacitor from LDO to PGND. 22 DCIN Charger Bias Supply Input. Bypass DCIN with a 0.1µF capacitor to PGND. 23 LX High-Side Power MOSFET Driver Source Connection. Connect to the source of the high-side n-channel MOSFET. 24 DHI High-Side Power MOSFET Driver Output. Connect to the high-side n-channel MOSFET gate. 25 BST High-Side Power MOSFET Driver Power-Supply Connection. Connect a 0.1µF capacitor from BST to LX. 26 VCC Device Power-Supply Input. Connect to LDO through an RC filter as shown in Figure 1. 27 CSSN Input Current-Sense Negative Input 28 CSSP Input Current-Sense Positive Input. Connect a 10mΩ current-sense resistor between CSSP and CSSN. — BP Power Ground Backside Paddle. Connect the backside paddle to analog ground. ______________________________________________________________________________________ 13 MAX8731A Pin Description MAX8731A SMBus Level 2 Battery Charger with Remote Sense ADAPTER INPUT R2 100kΩ R1 150kΩ R13 100kΩ D1 CSSP RS1 10mΩ DCIN C1 1μF ACIN CSSN VCC R3 49.9kΩ N R12 33Ω D2 ACOK INPUT BST VDD VDD KBC LDO C11 1μF LDO R4 10kΩ N1 DHI R6 10kΩ C2 0.1μF DHI SCL LX SDA C9 220pF N3 PGND RS2 10mΩ CSIP C3 0.1μF L1 4.3μH L1: SUMIDA CEP125-4R3MC-U IINP R7 10kΩ N2 R11 1Ω DLO SDA N1, N2,: SI4800BDY N3: SI4810BDY C10 0.1μF R5 10kΩ SCL CIN2 10μF CIN1 10μF C12 1μF MAX8731A LDO SYSTEM LOAD CSIN VOUT CCV R8 10kΩ C5 0.01μF C4 0.01μF COUT1 10μF CCI BATSEL SELECTOR R10 100Ω FBSB CCS C6 0.01μF COUT2 10μF REF DAC C7 1μF BP C8 0.1μF FBSA GND R9 100Ω BATTERY A BATTERY B Figure 1. Typical Dual-Battery Application Circuit Detailed Description The typical application circuit is shown in Figure 1. The MAX8731A includes all the functions necessary to charge Li+, NiMH, and NiCd smart batteries. A highefficiency, synchronous-rectified, step-down DC-DC converter is used to implement a precision constantcurrent, constant-voltage charger. The DC-DC converter drives a high-side n-channel MOSFET and provides synchronous rectification with a low-side n-channel MOSFET. The charge current and input current-sense 14 amplifiers have low input-offset error (±64µV typ), allowing the use of small-valued sense resistors. The MAX8731A features a voltage-regulation loop (CCV) and two current-regulation loops (CCI and CCS). The loops operate independently of each other. The CCV voltage-regulation loop monitors either FBSA or FBSB to ensure that its voltage never exceeds the voltage set by the ChargeVoltage() command. The CCI battery current-regulation loop monitors the current delivered to the selected battery to ensure that it never exceeds the current limit set by the ChargeCurrent() ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense the set point. A third loop (CCS) takes control and reduces the charge current when the adapter current exceeds the input current limit set by the InputCurrent() command. A functional diagram is shown in Figure 2. 2V (10A FOR RS2 = 10mΩ) 150mV (750mA FOR RS2 = 10mΩ) MAX8731A BST CSSP POWER-FAIL IMAX ZCMP CSIN HIGHSIDE DRIVER ENABLE 100mV ACIN IMIN VCC LX LEVEL SHIFT DC-DC ACOK DHI CONVERTER LDO LVC LOWSIDE DRIVER CCMP REF/2 GND DLO OVP PGND LOWEST VOLTAGE CLAMP CCV CCI 5.4V LINEAR REGULATOR GMV DCIN VCC GMI + 200mV - CCS 4.096V REFERENCE REF CSI CSA: CURRENT-SENSE AMPLIFIER SMBus LOGIC GMS 11-BIT DAC CHARGE VOLTAGE ( ) 6-BIT DAC CHARGE CURRENT ( ) 6-BIT DAC INPUT CURRENT ( ) SCL A = 1V/V CSA CSS SDA A = 20V/V GM VDD CSA DAC FBSA FBSB BATSEL CSIN CSIP CSSP CSSN IINP A = 20V/V Figure 2. Functional Diagram ______________________________________________________________________________________ 15 MAX8731A command. The charge current-regulation loop is in control as long as the selected battery voltage is below the charge voltage set point. When the selected battery voltage reaches its set point, the voltage-regulation loop takes control and maintains the battery voltage at MAX8731A SMBus Level 2 Battery Charger with Remote Sense Setting Charge Voltage To set the output voltage, use the SMBus to write a 16-bit ChargeVoltage() command using the data format listed in Table 1. The ChargeVoltage() command uses the WriteWord protocol (see Figure 3). The command code for ChargeVoltage() is 0x15 (0b00010101). The MAX8731A provides a 1.024V to 19.200V charge voltage range, with 16mV resolution. Set ChargeVoltage() below 1.024V to terminate charging. Upon reset, the ChargeVoltage() and ChargeCurrent() values are cleared and the charger remains off until both the ChargeVoltage() and the ChargeCurrent() command are sent. Both DHI and DLO remain low until the charger is restarted. Table 1. ChargeVoltage () (0x15) BIT BIT NAME 0 — Not used. Normally a 1mV weight. 1 — Not used. Normally a 2mV weight. 2 — Not used. Normally a 4mV weight. 3 — Not used. Normally a 8mV weight. 4 Charge voltage, DACV 0 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 16mV of charger voltage compliance. 5 Charge voltage, DACV 1 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 32mV of charger voltage compliance. 6 Charge voltage, DACV 2 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 64mV of charger voltage compliance. 7 Charge voltage, DACV 3 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 128mV of charger voltage compliance. 8 Charge voltage, DACV 4 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 256mV of charger voltage compliance. 9 Charge voltage, DACV 5 0 = Adds 0mV of charger voltage compliance, 1024mV min. 1 = Adds 512mV of charger voltage compliance. 10 Charge voltage, DACV 6 0 = Adds 0mA of charger voltage compliance. 1 = Adds 1024mV of charger voltage compliance. 11 Charge voltage, DACV 7 0 = Adds 0mV of charger voltage compliance. 1 = Adds 2048mV of charger voltage compliance. 12 Charge voltage, DACV 8 0 = Adds 0mV of charger voltage compliance. 1 = Adds 4096mV of charger voltage compliance. 13 Charge voltage, DACV 9 0 = Adds 0mV of charger voltage compliance. 1 = Adds 8192mV of charger voltage compliance. 14 Charge voltage, DACV 10 0 = Adds 0mV of charger voltage compliance. 1 = Adds 16,384mV of charger voltage compliance, 19,200mV max. 15 16 DESCRIPTION — Not used. Normally a 32,768mV weight. ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense Setting Input-Current Limit System current normally fluctuates as portions of the system are powered up or put to sleep. By using the input-current-limit circuit, the output-current requirement of the AC wall adapter can be lowered, reducing system cost. The total input current, from a wall cube or other DC source, is the sum of the system supply current and the current required by the charger. When the input current exceeds the set input current limit, the MAX8731A decreases the charge current to provide priority to system load current. As the system supply rises, the available charge current drops linearly to zero. Thereafter, the total input current can increase without limit. The internal amplifier compares the differential voltage between CSSP and CSSN to a scaled voltage set by the InputCurrent() command (see Table 3). The total input current is the sum of the device supply current, the charger input current, and the system load current. The total input current can be estimated as follows: Table 2. ChargeCurrent() (0x14) (10mΩ Sense Resistor, RS2) BIT BIT NAME 0 — Not used. Normally a 1mA weight. DESCRIPTION 1 — Not used. Normally a 2mA weight. 2 — Not used. Normally a 4mA weight. 3 — Not used. Normally an 8mA weight. 4 — Not used. Normally a 16mA weight. 5 — Not used. Normally a 32mA weight. 6 — Not used. Normally a 64mA weight. 7 Charge Current, DACI 0 0 = Adds 0mA of charger current compliance. 1 = Adds 128mA of charger current compliance. 8 Charge Current, DACI 1 0 = Adds 0mA of charger current compliance. 1 = Adds 256mA of charger current compliance. 9 Charge Current, DACI 2 0 = Adds 0mA of charger current compliance. 1 = Adds 512mA of charger current compliance. 10 Charge Current, DACI 3 0 = Adds 0mA of charger current compliance. 1 = Adds 1024mA of charger current compliance. 11 Charge Current, DACI 4 0 = Adds 0mA of charger current compliance. 1 = Adds 2048mA of charger current compliance. 12 Charge Current, DACI 5 0 = Adds 0mA of charger current compliance. 1 = Adds 4096mA of charger current compliance, 8064mA max. 13 — Not used. Normally a 8192mA weight. 14 — Not used. Normally a 16,386mA weight. 15 — Not used. Normally a 32,772mA weight. ______________________________________________________________________________________ 17 MAX8731A Setting Charge Current To set the charge current, use the SMBus to write a 16bit ChargeCurrent() command using the data format listed in Table 2. The ChargeCurrent() command uses the Write-Word protocol (see Figure 3). The command code for ChargeCurrent() is 0x14 (0b00010100). When RS2 =10mΩ, the MAX8731A provides a charge current range of 128mA to 8.064A, with 128mA resolution. Set ChargeCurrent() to 0 to terminate charging. Upon reset, the ChargeVoltage() and ChargeCurrent() values are cleared and the charger remains off until both the ChargeVoltage() and the ChargeCurrent() commands are sent. Both DHI and DLO remain low until the charger is restarted. The MAX8731A includes a foldback current limit when the battery voltage is low. If the battery voltage is less than 2.5V, the charge current is temporarily set to 128mA. The ChargeCurrent() register is preserved and becomes active again when the battery voltage is higher than 2.5V. This function effectively provides a foldback current limit, which protects the charger during short circuit and overload. MAX8731A SMBus Level 2 Battery Charger with Remote Sense ⎡ (ICHARGE × VBATTERY ) ⎤ IINPUT = ILOAD + ⎢ ⎥ + IBIAS (VIN × η) ⎢⎣ ⎥⎦ where η is the efficiency of the DC-DC converter (typically 85% to 95%). To set the input current limit, use the SMBus to write a 16-bit InputCurrent() command using the data format listed in Table 3. The InputCurrent() command uses the Write-Word protocol (see Figure 3). The command code for InputCurrent() is 0x3F (0b00111111). When RS1 = 10mΩ, the MAX8731A provides an input-currentlimit range of 256mA to 11.004A, with 256mA resolution. InputCurrent() settings from 1mA to 256mA result in a current limit of 256mA. Upon reset the input current limit is 256mA. Charger Timeout The MAX8731A includes a timer to terminate charging if the charger does not receive a ChargeVoltage() or ChargeCurrent() command within 175s. If a timeout occurs, both ChargeVoltage() and ChargeCurrent() commands must be resent to reenable charging. Remote Sense The MAX8731A features dual remote sense, which allows the rejection of board resistance and selector resistance when used in either single- or dual-battery systems. To fully utilize remote sensing, connect FBS_ directly to the battery interface through an unshared battery sense trace in series with a 100Ω resistor, and 10nF capacitor (see Figure 1). In single-battery systems, connect BATSEL directly to GND and use only FBSA. Remote sensing cancels the effect of impedance in series with the battery. This impedance normally causes the battery charger to prematurely enter constantvoltage mode with reducing charge current. The result is that the last 20% of charging takes longer than necessary. When in constant-voltage mode, the remaining charge time is proportional to the total resistance in series with the battery. Remote sensing reduces charge time according to the following equation: t CVRS = t CV 0 × RPack RPack + RBoard Table 3. InputCurrent() (0x3F) (10mΩ Sense Resistor, RS1) 18 BIT BIT NAME DESCRIPTION 0 — Not used. Normally a 2mA weight. 1 — Not used. Normally a 4mA weight. 2 — Not used. Normally an 8mA weight. 3 — Not used. Normally a 16mA weight. 4 — Not used. Normally a 32mA weight. 5 — Not used. Normally a 64mA weight. 6 — Not used. Normally a 128mA weight. 7 Input Current, DACS 0 0 = Adds 0mA of input current compliance. 1 = Adds 256mA of input current compliance. 8 Input Current, DACS 1 0 = Adds 0mA of input current compliance. 1 = Adds 512mA of input current compliance. 9 Input Current, DACS 2 0 = Adds 0mA of input current compliance. 1 = Adds 1024mA of input current compliance. 10 Input Current, DACS 3 0 = Adds 0mA of input current compliance. 1 = Adds 2048mA of input current compliance. 11 Input Current, DACS 4 0 = Adds 0mA of input current compliance. 1 = Adds 4096mA of input current compliance. 12 Input Current, DACS 5 0 = Adds 0mA of input current compliance. 1 = Adds 8192mA of input current compliance, 11,004mA max. 13 — Not used. Normally a 16,384mA weight. 14 — Not used. Normally a 32,768mA weight. 15 — Not used. Normally a 65,536mA weight. ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense The MAX8731A includes a safety feature, which limits the charge voltage when FBS_ or the selector is disconnected. The MAX8731A guarantees that CSIN does not regulate more than 250mV above the selected charging voltage. This also limits the extent to which remote sense can cancel charge-path impedance. Input Current Measurement Use IINP to monitor the system-input current sensed across CSSP and CSSN. The voltage at IINP is proportional to the input current by the equation: VIINP = IINPUT x RS1 x GIINP x R8 where I INPUT is the DC current supplied by the AC adapter, GIINP is the transconductance of IINP (3mA/V typ), and R8 is the resistor connected between IINP and ground. Typically, IINP has a 0 to 3.5V output voltage range. Leave IINP open if not used. LDO Regulator An integrated low-dropout (LDO) linear regulator provides a 5.4V supply derived from DCIN, and delivers over 30mA of load current. The LDO powers the gate drivers of the n-channel MOSFETs. See the MOSFET Drivers section. LDO has a minimum current limit of 35mA. This allows the MAX8731A to work with 87nC of total gate charge (both high-side and low-side MOSFETs). Bypass LDO to PGND with a 1µF or greater ceramic capacitor. AC Adapter Detection The MAX8731A includes a hysteretic comparator that detects the presence of an AC power adapter. When ACIN is greater than 2.048V, the open-drain ACOK output becomes high impedance. Connect 10kΩ pullup resistance between LDO and ACOK. Use a resistive voltage-divider from the adapter’s output to the ACIN pin to set the appropriate detection threshold. Select the resistive voltage-divider not to exceed the 6V absolute maximum rating of ACIN. VDD Supply The VDD input provides power to the SMBus interface. Connect VDD to LDO, or apply an external supply to VDD to keep the SMBus interface active while the supply to DCIN is removed. When VDD is biased the internal registers are maintained. Bypass VDD to GND with a 0.1µF or greater ceramic capacitor. Operating Conditions The MAX8731A has the following operating states: • Adapter Present: When DCIN is greater than 7.5V, the adapter is considered to be present. In this condition, both the LDO and REF function properly and battery charging is allowed: a) Charging: The total MAX8731A quiescent current when charging is 1mA (max) plus the current required to drive the MOSFETs. b) Not Charging: To disable charging, set either ChargeCurrent() or ChargeVoltage() to zero. When the adapter is present and charging is disabled, the total adapter quiescent current is less than 1mA and the total battery quiescent current is less than 5µA. • Adapter Absent (Power Fail): When VCSSP is less than VCSIN + 10mV, the MAX8731A is in the powerfail state, since the DC-DC converter is in dropout. The charger does not attempt to charge in the power-fail state. Typically, this occurs when the adapter is absent. When the adapter is absent, the total MAX8731A quiescent battery current is less than 1µA (max). • VDD Undervoltage (POR): When VDD is less than 2.5V, the VDD supply is in an undervoltage state and the internal registers are in their POR state. The SMBus interface does not respond to commands. When VDD rises above 2.5V, the MAX8731A is in a power-on reset state. Charging does not occur until the ChargeVoltage() and ChargeCurrent() commands are sent. When V DD is greater than 2.5V, SMBus registers are preserved. The MAX8731A allows charging under the following conditions: 1) DCIN > 7.5V, LDO > 4V, REF > 3.1V 2) VCSSP > VCSIN + 210mV (15mV falling threshold) 3) VDD > 2.5V ______________________________________________________________________________________ 19 MAX8731A where RPack is the total resistance in the battery pack, RBoard is the board resistance in series with the battery charge path, tCV0 is the constant-voltage charge time without remote sense, and tCVRS is the constant-voltage charge time with remote sense. MAX8731A SMBus Level 2 Battery Charger with Remote Sense SMBus Interface The MAX8731A receives control inputs from the SMBus interface. The MAX8731A uses a simplified subset of the commands documented in System Management Bus Specification V1.1, which can be downloaded from www.smbus.org. The MAX8731A uses the SMBus Read-Word and Write-Word protocols (Figure 3) to communicate with the smart battery. The MAX8731A performs only as an SMBus slave device with address 0b0001001_ (0x12) and does not initiate communication on the bus. In addition, the MAX8731A has two identification (ID) registers (0xFE): a 16-bit device ID register and a 16-bit manufacturer ID register (0xFF). The data (SDA) and clock (SCL) pins have Schmitt-trigger inputs that can accommodate slow edges. Choose pullup resistors (10kΩ) for SDA and SCL to achieve rise times according to the SMBus specifications. Communication starts when the master signals a START condition, which is a high-to-low transition on SDA, while SCL is high. When the master has finished communicating, the master issues a STOP condition, which is a low-to-high transition on SDA, while SCL is high. The bus is then free for another transmission. Figures 4 and 5 show the timing diagram for signals on the SMBus interface. The address byte, command byte, and data bytes are transmitted between the START and STOP conditions. The SDA state changes only while SCL is low, except for the START and STOP conditions. Data is transmitted in 8-bit bytes and is sampled on the rising edge of SCL. Nine clock cycles are required to transfer each byte in or out of the MAX8731A because either the master or the slave acknowledges the receipt of the correct byte during the ninth clock cycle. The MAX8731A supports the charger commands as described in Table 4. a) WRITE-WORD FORMAT S SLAVE W ADDRESS 7 BITS 1b MSB LSB 0 PRESET TO 0b0001001 ACK 1b 0 b) READ-WORD FORMAT S SLAVE W ADDRESS 7 BITS 1b MSB LSB 0 Preset to 0b0001001 ACK 1b 0 COMMAND BYTE 8 BITS MSB LSB ChargerMode() = 0x12 ChargeCurrent() = 0x14 ChargeVoltage() = 0x15 AlarmWarning() = 0x16 InputCurrent() = 0x3F ACK 1b 0 COMMAND ACK BYTE 8 BITS 1b MSB LSB 0 ChargerSpecInfo() = 0x11 ChargerStatus() = 0x13 LEGEND: S = START CONDITION OR REPEATED START CONDITION ACK = ACKNOWLEDGE (LOGIC-LOW) W = WRITE BIT (LOGIC-LOW) LOW DATA ACK BYTE 8 BITS 1b MSB LSB 0 D7 D0 S SLAVE ADDRESS 7 BITS MSB LSB PRESET TO 0b0001001 HIGH DATA ACK P BYTE 8 BITS 1b MSB LSB 0 D15 D8 R ACK 1b 1 1b 0 LOW DATA ACK BYTE 8 BITS 1b MSB LSB 0 D7 D0 HIGH DATA NACK P BYTE 8 BITS 1b MSB LSB 1 D15 D8 P = STOP CONDITION NACK = NOT ACKNOWLEDGE (LOGIC-HIGH) R = READ BIT (LOGIC-HIGH) MASTER TO SLAVE SLAVE TO MASTER Figure 3. SMBus Write-Word and Read-Word Protocols 20 ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense tLOW B tHIGH C E D F G I H J K L MAX8731A A M SMBCLK SMBDATA tSU:STA tHD:STA tSU:DAT A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE E = SLAVE PULLS SMBDATA LINE LOW tHD:DAT tHD:DAT tSU:STO tBUF J = ACKNOWLEDGE CLOCKED INTO MASTER K = ACKNOWLEDGE CLOCK PULSE L = STOP CONDITION, DATA EXECUTED BY SLAVE M = NEW START CONDITION F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO SLAVE H = LSB OF DATA CLOCKED INTO SLAVE I = SLAVE PULLS SMBDATA LINE LOW Figure 4. SMBus Write Timing A B tLOW C D E F G H tHIGH J I K SMBCLK SMBDATA tSU:STA tHD:STA A = START CONDITION B = MSB OF ADDRESS CLOCKED INTO SLAVE C = LSB OF ADDRESS CLOCKED INTO SLAVE D = R/W BIT CLOCKED INTO SLAVE tSU:DAT tHD:DAT E = SLAVE PULLS SMBDATA LINE LOW F = ACKNOWLEDGE BIT CLOCKED INTO MASTER G = MSB OF DATA CLOCKED INTO MASTER H = LSB OF DATA CLOCKED INTO MASTER tSU:DAT tSU:STO tBUF I = ACKNOWLEDGE CLOCK PULSE J = STOP CONDITION K = NEW START CONDITION Figure 5. SMBus Read Timing ______________________________________________________________________________________ 21 MAX8731A SMBus Level 2 Battery Charger with Remote Sense Table 4. Battery-Charger Command Summary COMMAND COMMAND NAME READ/WRITE POR STATE 0x14 ChargeCurrent() Write Only 6-Bit Charge-Current Setting 0x15 ChargeVoltage() Write Only 11-Bit Charge-Voltage Setting 0x0000 0x3F InputCurrent() Write Only 6-Bit Charge-Current Setting 0x0080 0xFE ManufacturerID() Read Only Manufacturer ID 0x004D 0xFF DeviceID() Read Only Device ID 0x0008 Battery-Charger Commands The MAX8731A supports four battery-charger commands that use either Write-Word or Read-Word protocols, as summarized in Table 4. ManufacturerID() and DeviceID() can be used to identify the MAX8731A. On the MAX8731A, the ManufacturerID() command always returns 0x004D and the DeviceID() command always returns 0x0008. DC-DC Converter The MAX8731A employs a synchronous step-down DCDC converter with an n-channel high-side MOSFET switch and an n-channel low-side synchronous rectifier. The MAX8731A features a pseudo-fixed-frequency, current-mode control scheme with cycle-by-cycle current limit. The controller’s constant off-time (tOFF) is calculated based on VCSSP, VCSIN, and a time constant with a minimum value of 300ns. The MAX8731A can also operate in discontinuous-conduction mode for improved light-load efficiency. The operation of the DC-DC controller is determined by the following four comparators as shown in the functional diagrams in Figures 2 and 6: FBS_ ChargeVoltage ( ) +200mV IMAX 2V CCMP R Q DH DRIVER IMIN S Q ZCMP 150mV DCIN CSIN OFF-TIME COMPUTE The IMIN comparator triggers a pulse in discontinuous mode when the accumulated error is too high. IMIN compares the control signal (LVC) against 100mV (typ). When LVC is less than 100mV, DHI and DLO are both forced low. Indirectly, IMIN sets the peak inductor current in discontinuous mode. The CCMP comparator is used for current-mode regulation in continuous-conduction mode. CCMP compares LVC against the inductor current. The high-side MOSFET on-time is terminated when the CSI voltage is higher than LVC. The IMAX comparator provides a secondary cycle-bycycle current limit. IMAX compares CSI to 2V (corresponding to 10A when RS2 = 10mΩ). The high-side MOSFET on-time is terminated when the current-sense signal exceeds 10A. A new cycle cannot start until the IMAX comparator’s output goes low. The ZCMP comparator provides zero-crossing detection during discontinuous conduction. ZCMP compares the current-sense feedback signal to 750mA (RS2 = 10mΩ). When the inductor current is lower than the 750mA threshold, the comparator output is high and DLO is turned off. CCV, CCI, CCS, and LVC Control Blocks LVC 100mV 0x0000 The OVP comparator is used to prevent overvoltage at the output due to battery removal. OVP compares FBS_ against the set voltage (ChargeVoltage()). When FBS_ is 200mV above the set value, the OVP comparator output goes high and the high-side MOSFET on-time is terminated. DHI and DLO remain off until the OVP condition is removed. OVP CSI OFF-TIME ONE-SHOT Figure 6. DC-DC Converter Functional Diagram 22 DESCRIPTION DL DRIVER The MAX8731A controls input current (CCS control loop), charge current (CCI control loop), or charge voltage (CCV control loop), depending on the operating condition. The three control loops—CCV, CCI, and CCS—are brought together internally at the lowest voltage-clamp (LVC) amplifier. The output of the LVC amplifier is the feedback control signal for the DC-DC controller. The minimum voltage at the CCV, CCI, or CCS appears at the output of the LVC amplifier and clamps the other control loops to within 0.3V above the ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense Continuous-Conduction Mode With sufficient charge current, the MAX8731A’s inductor current never crosses zero, which is defined as continuous-conduction mode. The regulator switches at 400kHz (nominal) if VCSIN < 0.88 x VCSSP. The controller starts a new cycle by turning on the high-side MOSFET and turning off the low-side MOSFET. When the charge-current feedback signal (CSI) is greater than the control point (LVC), the CCMP comparator output goes high and the controller initiates the off-time by turning off the high-side MOSFET and turning on the low-side MOSFET. The operating frequency is governed by the off-time and is dependent upon VCSIN and VCSSP. The off-time is set by the following equation: −V V t OFF = 2.5μs × CSSP CSIN VCSSP The on-time can be determined using the following equation: t ON = L × IRIPPLE VCSSN − VBATT where: V ×t IRIPPLE = BATT OFF L The switching frequency can then be calculated: fSW = 1 t ON + t OFF These equations describe the controller’s pseudofixed-frequency performance over the most common operating conditions. At the end of the fixed off-time, the controller initiates a new cycle if the control point (LVC) is greater than 100mV and the peak charge current is less than the cycle-by-cycle current limit. Restated another way, IMIN must be high, IMAX must be low, and OVP must be low for the controller to initiate a new cycle. If the peak inductor current exceeds the IMAX comparator threshold or the output voltage exceeds the OVP threshold, then the on-time is terminated. The cycle-bycycle current limit effectively protects against overcurrent and short-circuit faults. If during the off-time the inductor current goes to zero, the ZCMP comparator output pulls high, turning off the low-side MOSFET. Both the high- and low-side MOSFETs are turned off until another cycle is ready to begin. ZCOMP causes the MAX8731A to enter into discontinuous-conduction mode (see the Discontinuous Conduction section). There is a 0.3µs minimum off-time when the (VCSSP VCSIN) differential becomes too small. If VCSIN ≥ 0.88 x VCSSP, the threshold for the 0.3µs minimum off-time is reached. The switching frequency in this mode varies according to the equation: f= 1 L × IRIPPLE + 0.3μs VCSSN − VBATT Discontinuous Conduction The MAX8731A can also operate in discontinuous-conduction mode to ensure that the inductor current is always positive. The MAX8731A enters discontinuousconduction mode when the output of the LVC control point falls below 100mV. This corresponds to peak inductor current = 500mA: 100mV ICHG = 1 × = 250mA 2 20 × RS2 charge current for RS2 = 10mΩ. In discontinuous mode, a new cycle is not started until the LVC voltage rises above 100mV. Discontinuousmode operation can occur during conditioning charge of overdischarged battery packs, when the charge current has been reduced sufficiently by the CCS control loop, or when the charger is in constant-voltage mode with a nearly full battery pack. ______________________________________________________________________________________ 23 MAX8731A control point. Clamping the other two control loops close to the lowest control loop ensures fast transition with minimal overshoot when switching between different control loops (see the Compensation section). MAX8731A SMBus Level 2 Battery Charger with Remote Sense Compensation The charge-voltage and charge-current regulation loops are independent and compensated separately at the CCV, CCI, and CCS. CCV Loop Compensation The simplified schematic in Figure 7 is sufficient to describe the operation of the MAX8731A when the voltage loop (CCV) is in control. The required compensation network is a pole-zero pair formed with CCV and RCV. The zero is necessary to compensate the pole formed by the output capacitor and the load. RESR is the equivalent series resistance (ESR) of the charger output capacitor (COUT). RL is the equivalent charger output load, where RL = ΔVBATT / ΔICHG. The equivalent output impedance of the GMV amplifier, ROGMV, is FBS_ RESR COUT GMV RCV ROGMV ChargeVoltage( ) CCV GMOUT = 1 A CSI × RS2 where ACSI = 20V/V, and RS2 = 10mΩ in the typical application circuits, so GMOUT = 5A/V. The loop-transfer function is given by: LTF = GMOUT × RL × GMV × ROGMV (1 + sCOUT × RESR )(1 + sCCV × RCV ) × (1 + sCCV × ROGMV )(1 + sCOUT × RL ) The poles and zeros of the voltage loop-transfer function are listed from lowest frequency to highest frequency in Table 5. GMOUT CCV greater than 10MΩ. The voltage amplifier transconductance, GMV = 0.125µA/mV. The DC-DC converter transconductance is dependent upon the charge-current sense resistor RS2: RL Near crossover CCV is much lower impedance than ROGMV. Since CCV is in parallel with ROGMV, CCV dominates the parallel impedance near crossover. Additionally, RCV is much higher impedance than CCV and dominates the series combination of RCV and CCV, so near crossover: ROGMV × (1+ sCCV × RCV ) ≅ RCV (1+ sCCV × ROGMV ) Figure 7. CCV Loop Diagram Table 5. CCV Loop Poles and Zeros NAME CCV Pole EQUATION f P _ CV = 1 2πROGMV × CCV DESCRIPTION Lowest frequency pole created by CCV and GMV’s finite output resistance. Voltage-loop compensation zero. If this zero is at the same frequency or lower than the output pole fP_OUT, then the loop-transfer function approximates a single-pole response near the crossover frequency. Choose CCV to place this zero at least 1 decade below crossover to ensure adequate phase margin. CCV Zero f Z _ CV = 1 2πRCV × CCV Output Pole f P _ OUT = 1 2πRL × COUT Output pole formed with the effective load resistance RL and the output capacitance COUT. RL influences the DC gain but does not affect the stability of the system or the crossover frequency. Output Zero f P _ OUT = 1 2πRL × COUT Output ESR Zero. This zero can keep the loop from crossing unity gain if fZ_OUT is less than the desired crossover frequency; therefore, choose a capacitor with an ESR zero greater than the crossover frequency. 24 ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense 1 RL ⋅ ≅ (1+ sCOUT × RL ) sCOUT If RESR is small enough, its associated output zero has a negligible effect near crossover and the loop-transfer function can be simplified as follows: RCV LTF = GMOUT × GMV sCOUT Setting LTF = 1 to solve for the unity-gain frequency yields: fCO _ CV = GMOUT × GMV × RCV 2π × COUT For stability, choose a crossover frequency lower than 1/10 the switching frequency. For example, choose a crossover frequency of 50kHz and solve for RVC using the component values listed in Figure 1 to yield RCV = 10kΩ: RCV = 2π × COUT × fCO _ CV GMV × GMOUT ≅ 10kΩ GMV = 0.125µA/mV 80 GMOUT = 5A/V COUT = 2 x 10µF FOSC = 400kHz RL = 0.2Ω FCO_CV = 50kHz To ensure that the compensation zero adequately cancels the output pole, select fZ_CV ≤ fP_OUT: CCV ≥ (RL / RCV) COUT C CV ≥ 400pF (assuming 2 cells and 2A maximum charge current.) Figure 8 shows the Bode plot of the voltage-loop frequency response using the values calculated above. CCI Loop Compensation The simplified schematic in Figure 9 is sufficient to describe the operation of the MAX8731A when the battery current loop (CCI) is in control. Since the output capacitor’s impedance has little effect on the response of the current loop, only a simple single pole is required to compensate this loop. ACSI is the internal gain of the current-sense amplifier. RS2 is the charge currentsense resistor (10mΩ). ROGMI is the equivalent output impedance of the GMI amplifier, which is greater than 10MΩ. GMI is the charge-current amplifier transconductance = 1µA/mV. GMOUT is the DC-DC converter transconductance = 5A/V. 0 CSIP 60 CSIN GMOUT -45 20 0 -90 PHASE (DEGREES) MAGNITUDE (dB) RS2 40 CSI CCI -20 GMI MAG PHASE -40 0.1 1 10 100 1k 10k 100k -135 1M CCI ROGMI ChargeCurrent( ) FREQUENCY (Hz) Figure 8. CCV Loop Response Figure 9. CCI Loop Diagram ______________________________________________________________________________________ 25 MAX8731A C OUT is also much lower impedance than RL near crossover so the parallel impedance is mostly capacitive and: The loop-transfer function is given by: LTF = GMOUT × A CSI × RS2 × GMI ROGMI 1+ sROGMI × CCI This describes a single-pole system. Since: 1 GMOUT = A CSI × RS2 the loop-transfer function simplifies to: LTF = GMI ROGMI 1+ sROGMI × CCI The crossover frequency is given by: GMI fCO _ CI = 2πCCI CCS Loop Compensation The simplified schematic in Figure 11 is sufficient to describe the operation of the MAX8731A when the input current-limit loop (CCS) is in control. Since the output capacitor’s impedance has little effect on the response of the input current-limit loop, only a single pole is required to compensate this loop. ACSS is the internal gain of the current-sense resistor; RS1 = 10mΩ in the typical application circuits. ROGMS is the equivalent output impedance of the GMS amplifier, which is greater than 10MΩ. GMS is the charge-current amplifier transconductance = 1µA/mV. GMIN is the DC-DC converter’s input-referred transconductance = (1/D) x GMOUT = (1 / D) x 5A/V. The loop-transfer function is given by: LTF = GMIN × ACSS × RSI × GMS ROGMS 1 + SROGMS × CCS For stability, choose a crossover frequency lower than 1/10 the switching frequency: Since: CCI > 10 × GMI / (2π fOSC) = 4nF, for a 400kHz switching frequency. the loop-transfer function simplifies to: Values for CCI greater than 10 times the minimum value can slow down the current-loop response. Choosing CCI = 10nF yields a crossover frequency of 15.9kHz. Figure 10 shows the Bode plot of the current-loop frequency response using the values calculated above. 100 GMIN = LTF = GMS 1 A CSS × RS2 ROGMS 1 + SROGMS × CCS ADAPTER INPUT 0 MAG PHASE 80 MAGNITUDE (dB) MAX8731A SMBus Level 2 Battery Charger with Remote Sense CSSP 60 InputCurrent( ) CSS 40 RS1 CSSI -45 GMS 20 0 CCS -20 -40 -90 0.1 10 1k GMIN CCS ROGMS 100k FREQUENCY (Hz) Figure 10. CCI Loop Response 26 Figure 11. CCS Loop Diagram ______________________________________________________________________________________ SYSTEM LOAD SMBus Level 2 Battery Charger with Remote Sense fCO _ CS = the device). Unlike the DLO output, the DHI output uses a 50ns (typ) delay time to prevent the low-side MOSFET from turning on until DHI is fully off. The same considerations should be used for routing the DHI signal to the high-side MOSFET. GMS 2πCCS For stability, choose a crossover frequency lower than 1/10 the switching frequency: CCS = 5 × GMS /(2πfOSC ) Choosing a crossover frequency of 30kHz and using the component values listed in Figure 1 yields CCS > 5.4nF. Values for CCS greater than 10 times the minimum value may slow down the current-loop response excessively. Figure 12 shows the Bode plot of the input current-limit-loop frequency response using the values calculated above. MOSFET Drivers The DHI and DLO outputs are optimized for driving moderate-sized power MOSFETs. The MOSFET drive capability is the same for both the low-side and highsides switches. This is consistent with the variable duty factor that occurs in the notebook computer environment where the battery voltage changes over a wide range. There must be a low-resistance, low-inductance path from the DLO driver to the MOSFET gate to prevent shoot-through. Otherwise, the sense circuitry in the MAX8731A interprets the MOSFET gate as “off” while there is still charge left on the gate. Use very short, wide traces measuring 10 to 20 squares or less (1.25mm to 2.5mm wide if the MOSFET is 25mm from 100 0 MAGNITUDE (dB) 80 60 40 -45 20 0 -20 -40 0.1 10 1k FREQUENCY (Hz) 100k -90 10M PHASE (DEGREES) MAG PHASE The high-side driver (DHI) swings from LX to 5V above LX (BST) and has a typical impedance of 3Ω sourcing and 1Ω sinking. The low-side driver (DLO) swings from DLOV to ground and has a typical impedance of 1Ω sinking and 3Ω sourcing. This helps prevent DLO from being pulled up when the high-side switch turns on, due to capacitive coupling from the drain to the gate of the low-side MOSFET. This places some restrictions on the MOSFETs that can be used. Using a low-side MOSFET with smaller gate-to-drain capacitance can prevent these problems. Design Procedure MOSFET Selection Choose the n-channel MOSFETs according to the maximum required charge current. The MOSFETs must be able to dissipate the resistive losses plus the switching losses at both VDCIN(MIN) and VDCIN(MAX). For the high-side MOSFET, the worst-case resistive power losses occur at the maximum battery voltage and minimum supply voltage: PDCONDUCTION(HighSide) = VFBS _ VCSSP × ICHG2 × RDS(ON) Generally a low-gate charge high-side MOSFET is preferred to minimize switching losses. However, the RDS(ON) required to stay within package power-dissipation limits often limits how small the MOSFET can be. The optimum occurs when the switching (AC) losses equal the conduction (RDS(ON)) losses. Calculating the power dissipation in N1 due to switching losses is difficult since it must allow for difficult quantifying factors that influence the turn-on and turn-off times. These factors include the internal gate resistance, gate charge, threshold voltage, source inductance, and PCB layout characteristics. The following switching-loss calculation provides a rough estimate and is no substitute for breadboard evaluation, preferably including a verification using a thermocouple mounted on N1: PDSWITCHING (High Side) = 1 × t Trans × VDCIN × ICHG × fSW 2 Figure 12. CCS Loop Response ______________________________________________________________________________________ 27 MAX8731A The crossover frequency is given by: MAX8731A SMBus Level 2 Battery Charger with Remote Sense where tTRANS is the driver’s transition time and can be calculated as follows: ⎛ 1 1 ⎞ 2QG t TRANS = ⎜ + , and fSW ≈ 400kHz ⎟× ⎝ IGsrc IGsnk ⎠ IGATE IGATE is the peak gate-drive current. The following is the power dissipated due to the highside n-channel MOSFET’s output capacitance (CRSS): V2 × CRSS × fSW PDCOSS (HighSide) ≈ DCIN 2 The total power low-side MOSFET dissipation is: PDTOTAL (Low Side) ≈ PDCONDUCTION(Low Side) + PDBDY (Low Side) These calculations provide an estimate and are not a substitute for breadboard evaluation, preferably including a verification using a thermocouple mounted on the MOSFET. Inductor Selection The charge current, ripple, and operating frequency (off-time) determine the inductor characteristics. For optimum efficiency, choose the inductance according to the following equation: The following high-side MOSFET’s loss is due to the reverse-recovery charge of the low-side MOSFET’s body diode: PDQRR(HighSide) = QRR2 x VDCIN x fSW x 0.5 Ignore PDQRR (HighSide) if a Schottky diode is used parallel to the low-side MOSFET. The total high-side MOSFET power dissipation is: PDTOTAL (HighSide) ≈ PDCONDUCTION(HighSide) + PDSWITCHING (HighSide) + PDCOSS (HighSide) +PDQRR (HighSide) Switching losses in the high-side MOSFET can become an insidious heat problem when maximum AC adapter voltages are applied. If the high-side MOSFET chosen for adequate RDS(ON) at low-battery voltages becomes hot when biased from V IN(MAX), consider choosing another MOSFET with lower parasitic capacitance. For the low-side MOSFET (N2), the worst-case power dissipation always occurs at maximum input voltage: ⎛ VFBS _ ⎞ PDCONDUCTION(Low Side) = ⎜1− ⎟ ⎝ VCSSP ⎠ × ICHG2 × RDS(ON) The following additional loss occurs in the low-side MOSFET due to the body diode conduction losses: V ×t L = BATT OFF 0.3 × ICHG This sets the ripple current to 1/3 the charge current and results in a good balance between inductor size and efficiency. Higher inductor values decrease the ripple current. Smaller inductor values save cost but require higher saturation current capabilities and degrade efficiency. Inductor L1 must have a saturation current rating of at least the maximum charge current plus 1/2 the ripple current (ΔIL): ISAT = ICHG + (1/2) ΔIL The ripple current is determined by: ΔIL = VBATT × tOFF / L where: tOFF = 2.5µs (VDCIN - VBATT) / VDCIN for VBATT < 0.88 VDCIN or during dropout: PDBDY (Low Side) = 0.05 × IPEAK × 0.4V tOFF = 0.3µs for VBATT > 0.88 VDCIN 28 ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense ⎛ V ⎞ BATT ( VDCIN − VBATT ) ⎟ IRMS = ICHG ⎜ ⎜ ⎟ VDCIN ⎝ ⎠ The input capacitors should be sized so that the temperature rise due to ripple current in continuous conduction does not exceed approximately +10°C. The maximum ripple current occurs at 50% duty factor or VDCIN = 2 x VBATT, which equates to 0.5 x ICHG. If the application of interest does not achieve the maximum value, size the input capacitors according to the worst-case conditions. SYSTEM POWER SUPPLIES AC-TO-DC CONVERTER (ADAPTER) MAX8731A SMART-BATTERY CHARGER/ POWER-SOURCE SELECTOR MAX8731A Input-Capacitor Selection The input capacitor must meet the ripple current requirement (IRMS) imposed by the switching currents. Nontantalum chemistries (ceramic, aluminum, or OS-CON) are preferred due to their resilience to powerup surge currents: BATT+ BATT- SMART BATTERY SMBus CONTROL SIGNALS FOR BATTERY SMBus CONTROL SIGNALS FOR BATTERY SYSTEM HOST (KEYBOARD CONTROLLER) Output-Capacitor Selection The output capacitor absorbs the inductor ripple current and must tolerate the surge current delivered from the battery when it is initially plugged into the charger. As such, both capacitance and ESR are important parameters in specifying the output capacitor as a filter and to ensure stability of the DC-DC converter (see the Compensation section). Beyond the stability requirements, it is often sufficient to make sure that the output capacitor’s ESR is much lower than the battery’s ESR. Either tantalum or ceramic capacitors can be used on the output. Ceramic devices are preferable because of their good voltage ratings and resilience to surge currents. Applications Information Smart-Battery System Background Information Smart-battery systems have evolved since the conception of the smart-battery system (SBS) specifications. Originally, such systems consisted of a smart battery and smart-battery charger that were compatible with the SBS specifications and communicated directly with one another using SMBus protocols. Modern systems still employ the original commands and protocols, but often use a keyboard controller or similar digital intelligence to mediate the communication between the battery and the charger (Figure 13). This arrangement permits considerable freedom in the implementation of charging algorithms at the expense of standardization. Algorithms can vary from the simple detection of the battery with a fixed set of instructions for charging the battery to highly complex programs that can accommodate multiple battery Figure 13. Typical Smart-Battery System configurations and chemistries. Microcontroller programs can perform frequent tests on the battery’s state of charge and dynamically change the voltage and current applied to enhance safety. Multiple batteries can also be utilized with a selector that is programmable over the SMBus. Setting Input-Current Limit The input-current limit should be set based on the current capability of the AC adapter and the tolerance of the input-current limit. The upper limit of the input current threshold should never exceed the adapter’s minimum available output current. For example, if the adapter’s output current rating is 5A ±10%, the input current limit should be selected so that its upper limit is less than 5A × 0.9 = 4.5A. Since the input current-limit accuracy of the MAX8731A is ±3%, the typical value of the input-current limit should be set at 4.5A / 1.03 ≈ 4.36A. The lower limit for input current must also be considered. For chargers at the low end of the spec, the input-current limit for this example could be 4.36A × 0.95, or approximately 4.14A. Layout and Bypassing Bypass DCIN with a 1µF ceramic to ground (Figure 1). D1 protects the MAX8731A when the DC power source input is reversed. Bypass VDD, DCIN, LDO, VCC, DAC, and REF as shown in Figure 1. ______________________________________________________________________________________ 29 MAX8731A SMBus Level 2 Battery Charger with Remote Sense Good PCB layout is required to achieve specified noise immunity, efficiency, and stable performance. The PCB layout artist must be given explicit instructions—preferably, a sketch showing the placement of the powerswitching components and high-current routing. Refer to the PCB layout in the MAX8731A evaluation kit for examples. A ground plane is essential for optimum performance. In most applications, the circuit will be located on a multilayer board, and full use of the four or more copper layers is recommended. Use the top layer for high-current connections, the bottom layer for quiet connections, and the inner layers for uninterrupted ground planes. Use the following step-by-step guide: 1) Place the high-power connections first, with their grounds adjacent: a) Minimize the current-sense resistor trace lengths, and ensure accurate current sensing with Kelvin connections. b) Minimize ground trace lengths in the high-current paths. c) Minimize other trace lengths in the high-current paths. Use > 5mm wide traces in the high-current paths. d) Connect C1 and C2 to high-side MOSFET (10mm max length). Place the input capacitor between the input current-sense resistor and drain of the high-side MOSFET. e) Minimize the LX node (MOSFETs, rectifier cathode, inductor (15mm max length)). Keep LX on one side of the PCB to reduce EMI radiation. f) Since the return path of DHI is LX, route DHI near LX. Optimally, LX and DHI should overlap. The same principle is applied to DLO and PGND. g) Ideally, surface-mount power components are flush against one another with their ground terminals almost touching. These high-current grounds are then connected to each other with a wide, filled zone of top-layer copper, so they do 30 not go through vias. The resulting top-layer subground plane is connected to the normal innerlayer ground plane at the paddle. Other high-current paths should also be minimized, but focusing primarily on short ground and currentsense connections eliminates approximately 90% of all PCB layout problems. 2) Place the IC and signal components. Keep the main switching node (LX node) away from sensitive analog components (current-sense traces and REF capacitor). Important: The IC must be no further than 10mm from the current-sense resistors. Quiet connections to REF, CCS, DAC, CCV, CCI, ACIN, and VCC should be returned to a separate ground (GND) island. The analog ground is separately worked from power ground in Figure 1. There is very little current flowing in these traces, so the ground island need not be very large. When placed on an inner layer, a sizable ground island can help simplify the layout because the low-current connections can be made through vias. The ground pad on the backside of the package should also be connected to this quiet ground island. 3) Keep the gate-drive traces (DHI and DLO) as short as possible (L < 20mm), and route them away from the current-sense lines and REF. These traces should also be relatively wide (W > 1.25mm). 4) Place ceramic bypass capacitors close to the IC. The bulk capacitors can be placed further away. Place the current-sense input filter capacitors under the part, connected directly to the GND pin. 5) Use a single-point star ground placed directly below the part at the PGND pin. Connect the power ground (ground plane) and the quiet ground island at this location. Chip Information TRANSISTOR COUNT: 10,234 PROCESS: BiCMOS ______________________________________________________________________________________ SMBus Level 2 Battery Charger with Remote Sense QFN THIN.EPS PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm 21-0140 K 1 2 ______________________________________________________________________________________ 31 MAX8731A Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) MAX8731A SMBus Level 2 Battery Charger with Remote Sense Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm 21-0140 K 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 32 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 © 2007 Maxim Integrated Products is a registered trademark of Maxim Integrated Products. Inc.
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