SSM2211CPZ-R2

Low Distortion, 1.5 W Audio Power Amplifier SSM2211 Data Sheet FEATURES FUNCTIONAL BLOCK DIAGRAM 1.5 W output with THD + N < 1% Differential bridge-tied load output Single-supply operation: 2.7 V to 5.5 V Functions down to 1.75 V Wide bandwidth: 4 MHz Highly stable phase margin: >80° Low distortion: 0.2% THD + N at 1 W output Excellent power supply rejection IN– VOUTA IN+ VOUTB BYPASS SHUTDOWN Portable computers Personal wireless communicators Hands-free telephones Speaker phones Intercoms Musical toys and talking games BIAS SSM2211 V– (GND) 00358-001 APPLICATIONS Figure 1. GENERAL DESCRIPTION The SSM22111 is a high performance audio amplifier that delivers 1 W rms of low distortion audio power into a bridgeconnected 8 Ω speaker load (or 1.5 W rms into a 4 Ω load). The SSM2211 operates over a wide temperature range and is specified for single-supply voltages between 2.7 V and 5.5 V. When operating from batteries, it continues to operate down to 1.75 V. This makes the SSM2211 the best choice for unregulated applications, such as toys and games. Featuring a 4 MHz bandwidth and distortion below 0.2% total harmonic distortion plus noise (THD + N) at 1 W, superior performance is delivered at higher power or lower speaker load impedance than competitive units. Furthermore, when the ambient temperature is at 25°C, THD + N < 1%, and VS = 5 V on a 4-layer printed circuit board (PCB), the SSM2211 delivers a 1.5 W output. 1 The low differential dc output voltage results in negligible losses in the speaker winding and makes high value dc blocking capacitors unnecessary. The battery life is extended by using shutdown mode, which typically reduces quiescent current drain to 100 nA. The SSM2211 is designed to operate over the −40°C to +85°C temperature range. The SSM2211 is available in 8-lead SOIC (narrow body) and LFCSP (lead frame chip scale) surfacemount packages. The advanced mechanical packaging of the LFCSP models ensures lower chip temperature and enhanced performance relative to standard packaging options. Applications include personal portable computers, hands-free telephones and transceivers, talking toys, intercom systems, and other low voltage audio systems requiring 1 W output power. Protected by U.S. Patent No. 5,519,576. Rev. G Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2002–2016 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com SSM2211 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Bridged Output vs. Single-Ended Output Configurations ... 16 Applications ....................................................................................... 1 Speaker Efficiency and Loudness ............................................. 16 Functional Block Diagram .............................................................. 1 Power Dissipation....................................................................... 16 General Description ......................................................................... 1 Output Voltage Headroom........................................................ 18 Revision History ............................................................................... 2 Automatic Shutdown-Sensing Circuit ..................................... 18 Specifications..................................................................................... 4 Shutdown-Circuit Design Example ......................................... 19 Absolute Maximum Ratings ............................................................ 6 Start-Up Popping Noise............................................................. 19 Thermal Resistance ...................................................................... 6 SSM2211 Amplifier Design Example .................................. 19 ESD Caution .................................................................................. 6 Single-Ended Applications ........................................................ 20 Pin Configurations and Function Descriptions ........................... 7 Driving Two Speakers Single-Endedly .................................... 20 Typical Performance Characteristics ............................................. 8 LFCSP PCB Considerations ...................................................... 21 Theory of Operation ...................................................................... 15 Outline Dimensions ....................................................................... 22 Thermal Performance—LFCSP ................................................ 15 Ordering Guide .......................................................................... 22 Applications Information .............................................................. 16 REVISION HISTORY 5/16—Rev. F to Rev. G Changed Electrical Characteristics Section Heading to Specifications Section Heading....................................................... 4 Changes to Table 5 ............................................................................ 6 Changes to Figure 3 .......................................................................... 7 Changed Product Overview Section Heading to Theory of Operation Section Heading ........................................................... 15 Changed Typical Applications Section Heading to Applications Information Section Heading ....................................................... 16 Updated Outline Dimensions ....................................................... 22 Changes to Ordering Guide .......................................................... 22 Changes to Driving Two Speakers Single Endedly Section ...... 20 Changes to Figure 50...................................................................... 20 Changes to Evaluation Board Section.......................................... 20 Changes to Figure 51...................................................................... 20 Changes to Ordering Guide .......................................................... 22 12/13—Rev. E to Rev. F Changes to Table 5 ............................................................................ 5 Added Exposed Pad Notation, Pin Configurations and Function Descriptions Section ........................................................................ 6 Deleted Evaluation Board Section ................................................ 20 Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 22 11/06—Rev. C to Rev. D Updated Format .................................................................. Universal Changes to General Description .....................................................1 Changes to Electrical Characteristics .............................................3 Changes to Absolute Maximum Ratings ........................................5 Added Table 6 ....................................................................................6 Changes to Figure 32...................................................................... 11 Changes to the Product Overview Section ................................. 14 Changes to the Output Voltage Headroom Section................... 17 Changes to the Start-Up Popping Noise Section........................ 18 Changes to the Evaluation Board Section ................................... 20 Updated Outline Dimensions ....................................................... 21 Changes to Ordering Guide .......................................................... 21 4/08—Rev. D to Rev. E Changes to Features.......................................................................... 1 Changes to General Description .................................................... 1 Changes to Supply Current in Table 1 and Table 2 ...................... 3 Changes to Supply Current in Table 3 ........................................... 4 Changes to Absolute Maximum Ratings ....................................... 5 Changes to Figure 41 ...................................................................... 14 Changes to Equation 7, Equation 8, and Equation 10 ............... 16 Changes to Figure 47 ...................................................................... 17 Changes to Automatic Shutdown-Sensing Circuit Section ...... 18 Changes to SSM2211Amplifier Design Example Section ......... 19 10/04—Rev. B to Rev. C Updated Format .................................................................. Universal Changes to General Description .....................................................1 Changes to Table 5.............................................................................4 Deleted Thermal Performance—SOIC Section ...........................8 Changes to Figure 31...................................................................... 10 Changes to Figure 40...................................................................... 12 Changes to Thermal Performance—LFCSP Section ................. 13 Deleted Figure 52, Renumbered Successive Figures .................. 14 Deleted Printed Circuit Board Layout—SOIC Section ............. 14 Changes to Output Voltage Headroom Section ......................... 16 Rev. G | Page 2 of 24 Data Sheet SSM2211 Changes to Start-Up Popping Noise Section ...............................17 Changes to Ordering Guide ...........................................................20 10/02—Rev. A to Rev. B Deleted 8-Lead PDIP ......................................................... Universal Updated Outline Dimensions ........................................................15 5/02—Rev. 0 to Rev. A Edits to General Description ........................................................... 1 Edits to Package Type ....................................................................... 3 Edits to Ordering Guide ................................................................... 3 Edits to Product Overview............................................................... 8 Edits to Printed Circuit Board Layout Considerations .............. 13 Added section Printed Circuit Board Layout Considerations—LFCSP ................................................................ 14 Rev. G | Page 3 of 24 SSM2211 Data Sheet SPECIFICATIONS VDD = 5.0 V, TA = 25°C, RL = 8 Ω, CB = 0.1 µF, VCM = VDD/2, unless otherwise noted. Table 1. Parameter GENERAL CHARACTERISTICS Differential Output Offset Voltage Output Impedance SHUTDOWN CONTROL Input Voltage High Input Voltage Low POWER SUPPLY Power Supply Rejection Ratio Supply Current Supply Current, Shutdown Mode DYNAMIC PERFORMANCE Gain Bandwidth Product Phase Margin AUDIO PERFORMANCE Total Harmonic Distortion Total Harmonic Distortion Voltage Noise Density Symbol Conditions VOOS ZOUT AVD = 2, −40°C ≤ TA ≤ +85°C VIH VIL ISY = (2.2 μF)(20 kΩ) 25 kΩ = 1.76 μF 20kΩ AUDIO INPUT 4 1µF + – LEFT SPEAKER (8Ω) 5 SSM2211 3 1 + 7 2 0.1µF (19) 8 470µF + RIGHT SPEAKER (8Ω) – Figure 49. SSM2211 Used as a Dual-Speaker Amplifier Each speaker is driven by a single-ended output. The trade-off is that only 250 mW of sustained power can be put into each speaker. In addition, a coupling capacitor must be connected in series with each of the speakers to prevent large dc currents from flowing through the 8 Ω speakers. These coupling capacitors produce a high-pass filter with a corner frequency given by Equation 4. For a speaker load of 8 Ω and a coupling capacitor of 470 µF, this results in a −3 dB frequency of 42 Hz. Selecting CB to be 2.2 µF for a practical value of capacitor minimizes start-up popping noise. To summarize the final design, • • • • • • 6 – 00358-049 CC > It is not necessary to connect a dummy load to the unused output to help stabilize the output. The 470 µF coupling capacitor creates a high-pass frequency cutoff of 42 Hz, as given in Equation 4, which is acceptable for most computer speaker applications. The overall gain for a single-ended output configuration is AV = RF/R1, which for this example is equal to 1. VDD = 5 V R1 = 20 kΩ RF = 28 kΩ CC = 2.2 µF CB = 2.2 µF TA, MAX = 85°C SINGLE-ENDED APPLICATIONS Because the power of a single-ended output is one-quarter that of a BTL, both speakers together are still half as loud (−6 dB SPL) as a single speaker driven with a BTL. There are applications in which driving a speaker differentially is not practical, for example, a pair of stereo speakers where the negative terminal of both speakers is connected to ground. Figure 48 shows how this application can be accomplished. The polarity of the speakers is important because each output is 180° out of phase with the other. By connecting the negative terminal of Speaker 1 to Pin 5 and the positive terminal of Speaker 2 to Pin 8, proper speaker phase can be established. 10kΩ 5V 6 10kΩ 4 0.47µF – 5 SSM2211 3 1 + 7 2 0.1µF 8 470µF + 250mW SPEAKER (8Ω) – 00358-048 AUDIO INPUT The maximum power dissipation of the device, assuming both loads are equal, can be found by doubling Equation 11. If the loads are different, use Equation 11 to find the power dissipation caused by each load, and then take the sum to find the total power dissipated by the SSM2211. Figure 48. Single-Ended Output Application Rev. G | Page 20 of 24 Data Sheet SSM2211 LFCSP PCB CONSIDERATIONS The LFCSP is a plastic encapsulated package with a copper lead frame substrate. The LFCSP is a leadless package with solder lands on the bottom surface of the package, instead of conventional formed perimeter leads. A key feature that allows the user to reach the quoted θJA performance is the exposed die attach paddle (DAP) on the bottom surface of the package. When soldered to the PCB, the DAP can provide efficient conduction of heat from the die to the PCB. To achieve optimum package performance, consideration must be given to the PCB pad design for both the solder lands and the DAP. For further information, see the AN-772 Application Note. Rev. G | Page 21 of 24 SSM2211 Data Sheet OUTLINE DIMENSIONS 5.00 (0.1968) 4.80 (0.1890) 8 4.00 (0.1574) 3.80 (0.1497) 1 5 6.20 (0.2441) 5.80 (0.2284) 4 1.27 (0.0500) BSC 0.25 (0.0098) 0.10 (0.0040) COPLANARITY 0.10 SEATING PLANE 1.75 (0.0688) 1.35 (0.0532) 0.51 (0.0201) 0.31 (0.0122) 0.50 (0.0196) 0.25 (0.0099) 45° 8° 0° 0.25 (0.0098) 0.17 (0.0067) 1.27 (0.0500) 0.40 (0.0157) 012407-A COMPLIANT TO JEDEC STANDARDS MS-012-AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 50. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body, S-Suffix (R-8) Dimensions shown in millimeters and (inches) 1.84 1.74 1.64 3.10 3.00 SQ 2.90 1.55 1.45 1.35 EXPOSED PAD 0.50 0.40 0.30 0.80 0.75 0.70 0.30 0.25 0.20 1 4 BOTTOM VIEW TOP VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-229-WEED 12-07-2010-A PIN 1 INDEX AREA SEATING PLANE 0.50 BSC 8 5 Figure 51. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-13) Dimensions shown in millimeters ORDERING GUIDE Model 1 SSM2211CPZ-REEL SSM2211CPZ-REEL7 SSM2211SZ SSM2211SZ-REEL SSM2211SZ-REEL7 1 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 8-Lead LFCSP 8-Lead LFCSP 8-Lead SOIC_N 8-Lead SOIC_N 8-Lead SOIC_N Z = RoHS Compliant Part; # denotes RoHS compliant product may be top or bottom marked. Rev. G | Page 22 of 24 Package Option CP-8-13 CP-8-13 R-8 (S-Suffix) R-8 (S-Suffix) R-8 (S-Suffix) Branding B5A# B5A# Data Sheet SSM2211 NOTES Rev. G | Page 23 of 24 SSM2211 Data Sheet NOTES ©2002–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00358-0-5/16(G) Rev. G | Page 24 of 24