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AMC7135SJFA

AMC7135SJFA

  • 厂商:

    ADDTEK

  • 封装:

  • 描述:

    AMC7135SJFA - 350mA ADVANCED CURRENT REGULATOR - ADDtek Corp

  • 数据手册
  • 价格&库存
AMC7135SJFA 数据手册
AMC7135 www.addmtek.com DESCRIPTION The AMC7135 is a low dropout current regulator rated for 350mA constant sink current. The low quiescent current and low dropout voltage is achieved by advanced Bi-CMOS process. 350mA ADVANCED CURRENT REGULATOR FEATURES 350mA constant sink current. Output short / open circuit protection. Low dropout voltage. Low quiescent current Supply voltage range 2.7V ~ 6V 2KV HBM ESD protection Advanced Bi-CMOS process. SOT-89 and TO-252 package TYPICAL APPLICATION CIRCUIT APPLICATIONS Power LED driver Supply Voltage 2.7V ~ 6V PACKAGE PIN OUT C BP OUT V DD VDD VDD GND OUT OUT SOT-89 (Top View) TO-252 GND AMC7135 G ND ORDER INFORMATION IOUT 340-380mA 300-340mA Note: PK SOT-89 3-pin AMC7135PKF AMC7135PKFA SJ TO-252 3-pin AMC7135SJF AMC7135SJFA 1. All surface-mount packages are available in Tape & Reel. Append the letter “T” to part number (i.e. AMC7135PKFAT). 2. The letter ”F” is marked for Lead Free process. 3. The letter ”A” is marked for current ranking. Copyright © 2007 ADDtek Corp. 1 DD031_C -- APRIL 2007 AMC7135 ABSOLUTE MAXIMUM RATINGS (Note) Input Voltage, VDD Output Voltage, VOUT Maximum Junction Temperature, TJ Storage Temperature Range Lead Temperature (Soldering, 10 seconds) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. -0.3V to 7V -0.3V to 7V 150OC -40OC to 150OC 260OC BLOCK DIAGRAM VDD Band-gap Reference AMC7135 OUT Control Circuit GND PIN DESCRIPTION Pin Name VDD OUT GND Pin Function Power supply. Output pins. Connected to load. Ground. Copyright © 2007 ADDtek Corp. 2 DD031_C -- APRIL 2007 AMC7135 RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Output Sink Current Operating Free-air Temperature Range Symbol VDD IOUT TA Min 2.7 -40 Typ Max 6 400 +85 Unit V mA ℃ DC ELECTRICAL CHARACTERISTICS VDD=3.7V, TA=25°C, No Load, ( Unless otherwise noted) Parameter Output Sink Current Load Regulation Line Regulation Output Dropout Voltage Supply Current Consumption VOUTL IDD Symbol ISINK Condition VOUT=0.2V VOUT=0.2V, Rank A VOUT=0.2V to 3V VDD= 3V to 6V, VOUT=0.2V 120 200 Min 340 300 Typ 360 320 Max 380 340 3 3 Unit mA mA mA/V mA/V mV uA VDD OUT Apply Pin Note 1: Output dropout voltage: 90% x IOUT @ VOUT=200mV TYPICAL OPERATION CHRACTERISTICS QUIESCENT CURRENT vs. SUPPLY VOLTAGE 0.17 0.16 0.15 IQ (mA) QUIESCENT CURRENT vs. TEMP 0.22 0.2 0.18 IQ (mA) 0.16 0.14 0.12 0.1 0.14 0.13 0.12 0.11 0.10 2 2.5 3 VIN (V) 3.5 4 20 40 60 TEMP (ºC) 80 100 OUT CURRENT vs.OUT_DROPOUT VOLTAGE 400 350 300 OUT (mA) 250 200 150 100 50 0 0.01 0.1 OUT_DROPOUT (V) 1 10 Copyright © 2007 ADDtek Corp. 3 DD031_C -- APRIL 2007 AMC7135 APPLICATION INFORMATION The Maximum Power Dissipation on Regulator: PD(MAX) = VOUT(MAX) × IOUT(NOM) + VIN(MAX) × IQ VOUT(MAX) = the maximum voltage on output pin; IOUT(NOM) = the nominal output current; IQ = the quiescent current the regulator consumes at IOUT(MAX); VIN(MAX) = the maximum input voltage. Thermal Consideration: The maximum junction temperature ratings of AMC7135 should not be exceeded under continuous normal load conditions. When power consumption is over about 700mW (SOT-89 package, at TA=70°C) or 1000mW (TO-252 package, at TA=70°C), additional heat sink is required to control the junction temperature below 120°C. The junction temperature is: TJ = PD (θJT +θCS +θSA ) + TA PD : Dissipated power. θJT: Thermal resistance from the junction to the mounting tab of the package. θCS: Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, θCS < 1.0°C /W) θSA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through-hole vias. PCB θSA (°C /W) PCB heat sink size (mm2) 59 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000 Copyright © 2007 ADDtek Corp. 4 DD031_C -- APRIL 2007 AMC7135 PACKAGE Copyright © 2007 ADDtek Corp. 5 DD031_C -- APRIL 2007 AMC7135 IMPORTANT NOTICE ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale. ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196 Copyright © 2007 ADDtek Corp. 6 DD031_C -APRIL 2007
AMC7135SJFA 价格&库存

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