MAMG-0T0912-090PSM

MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 Features            Compact Size (14x24 mm 2) GaN on SiC D-Mode Transistor Technology Fully Matched, de-coupled DC and RF Typical Bias: 50 V, Class AB Intended for Pulsed RADAR Applications Output Power > 90 W, with 30 dB Gain and 60% Power Added Efficiency Pulse width up to 600 μs. MTTF = 600 years (TJ < 200°C) Thermally Enhanced Laminate LGA Package RoHS* Compliant. Lead Free Reflow Compatible MSL-3 Functional Schematic Description The MAMG-000912-090PSM is a 2-stage GaN power module in a “True SMT” laminate package. The module is fully matched. Under pulsed conditions, it can deliver output power greater than 90 W, with 30 dB typical associated gain and 60% typical power added efficiency. Flexible design allows for gate and/or drain pulsing. Additional features include a gate voltage sense port for use in temperature compensation or pulse droop compensation. The overall package size is very small, only 14x24 mm 2. The module’s compact size, combined with excellent RF performance makes this product an ideal solution for pulsed RADAR applications where small size, light weight and performance (SWaP) are the key. Ordering Information1 Pin Configuration Pin No. Function 1 RF IN 2 VG 3 Part Number Package 3 VD1 MAMG-000912-090PSM Bulk Packaging 4 NC 4 MAMG-0T0912-090PSM 100 Piece Reel 5 VG sense 5 MAMG-A00912-090PSM Evaluation Board2 6 Ground 7 VD2 8 RF OUT 9 NC 4 1. Reference Application Note M513 for reel size information. 2. Includes one module surface mounted onto board. * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. 3. One common gate voltage for both stages in the module. 4. Do not connect. 5. Do not connect to ground if not used. 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 Electrical Specifications 6 Parameter Symbol Min. Typ. Max. Typ. Typ. Units RF FUNCTIONAL TESTS: Freq. = 960-1215 MHz, VDD = 50 V, IDQ = 300 mA, TA = 25°C, ZL = 50 Ω, Pulse Width = 300 us, Duty Cycle = 10%, PIN = 19 dBm Frequency f Peak Output Power 7 960 1090 1215 MHz POUT 90 95 - 105 105 W GP - 30 - 31 31 dB PAE 55 58 - 63 63 % Droop - 0.2 0.3 0.2 0.2 dB 2F0 - -30 - -30 -30 dBc 3 Harmonic 3F0 - -40 - -40 -40 dBc Load Mismatch Stability VSWR-S - 5:1 - 5:1 5:1 - Load Mismatch Tolerance VSWR-T - 6:1 - 6:1 6:1 - Power Gain Power Added Efficiency Pulse Droop 8 2nd Harmonic rd 6. Typical RF performance measured in RF evaluation board (see layout on page 3). 7. Peak output power measured at center of pulse. 8. Pulse droop measured between 10% and 90% of pulse. Absolute Maximum Ratings 9,10,11,12,13 Parameter Absolute Maximum Input Power 24 dBm Drain Supply Voltage (pulsed), VDD +55 V Gate Supply Voltage Range, VGG -9 V to -2.5 V Supply Current, IDD 4.0 A Power Dissipation, Pulsed Mode @ 85ºC Junction Temperature 14 80 W 200 °C Operating Temperature -40°C to +85°C Storage Temperature -65°C to +150°C ESD Maximum - Human Body Model (HBM) 600 V ESD Maximum - Charged Device Model (CDM) 300 V 9. 10. 11. 12. 13. Exceeding any one or combination of these limits may cause permanent damage to this device. MACOM does not recommend sustained operation near these survivability limits. For saturated performance it is recommended that the sum of (3 * VDD + abs (VGG)) < 175 V. CW operation is not recommended. Operating at nominal conditions with TJ ≤ 200°C will ensure MTTF > 1 x 106 hours. Junction temperature directly affects device MTTF and should be kept as low as possible to maximize lifetime. 14. Junction Temperature (TJ) = TC + ӨJC * ((V * I) - (POUT - PIN)). Typical Transient Thermal Resistance ӨJC = 1.6 °C/W (50V, 600 μs pulses, 10% duty cycle) 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Evaluation Board Outline Rev. V2 Parts List Part Value Case Style C1 100 F Radial C2 10 nF 0603 Parts are measured and sampled in the evaluation board shown on the left. The board is made of 8-mil thick RO4003C and is bolted onto a Ni-plated Aluminum plate. Electrical and thermal ground is provided using a Cu-filled via-hole array (pictured below). Very few external components are used, as DC blocks are not required. Bias Sequencing Turning the device ON 1. Set VG to the pinch-off value (VP), typically -6 V. 2. Turn on VD to nominal voltage (50 V). 3. Increase VG to desired quiescent current. 4. Apply RF power to desired level. Turning the device OFF 1. Turn off RF power. 2. Decrease VG down to VP. 3. Turn off VD. 4. Turn off VG. 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 Applications Section Typical Large-Signal Performance Curves Over Temperature: Pulsed RF, 300 μs Pulses, 10% Duty Cycle, VDD = 45 V, IDQ = 300 mA, PIN = 19 dBm Output Power vs. Frequency Power Added Efficiency vs. Frequency 125 70 -40 0 +25 +50 +85 68 115 66 110 64 Power Added Eff (%) Peak Output Power (W) 120 105 100 95 90 85 62 60 58 56 54 80 52 75 50 Freq (MHz) -40 0 +25 +50 +85 Freq (MHz) Pulse Droop vs. Frequency 0.50 -40 0 +25 +50 +85 Pulse Droop (dB) 0.40 0.30 0.20 0.10 0.00 Freq (MHz) 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 Applications Section Maximum Transient Channel Temperature (Based on IR-Scan Measurements) Pulsed RF, IDQ = 300 mA, PIN = 19 dBm, TC = 80°C 130 125 120 115 110 105 100 95 90 85 80 5% duty 10% duty 20% duty Pulse Duration (s) Max. Transient Channel Temp. vs. Pulse Width (VDD = 45 V) Channel Temperature (°C) Channel Temperature (°C) Max. Transient Channel Temp. vs. Pulse Width (VDD = 35 V) 170 165 160 155 150 145 140 135 130 125 120 115 110 105 100 5% duty 10% duty 20% duty Pulse Duration (s) Channel Temperature (°C) Max. Transient Channel Temp. vs. Pulse Width (VDD = 50 V) 200 195 190 185 180 175 170 165 160 155 150 145 140 135 130 125 120 115 5% duty 10% duty Pulse Duration (s) 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport MAMG-000912-090PSM 960-1215 MHz 90 W 2-Stage GaN Module Surface Mount Laminate Package Rev. V2 Package Outline 15,16,18 Recommended Landing Pattern 15,16,17,18 15. All dimensions are in inches. 16. Reference Application Note S2083 for lead-free solder reflow recommendations. Plating is Ni/Pd/Au. 17. Landing pattern indicates solder mask opening. Cu-filled via-holes under the ground are used for optimal thermal performance. Recommended pattern: 8-mil diameter, 8-mil spacing. 18. Layout drawing available upon request. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity Gallium Nitride Devices and Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport