Hardware Design Guide, Revision 1 November 2, 2005
TSI-8 8K x 8K Time-Slot Interchanger
1 Introduction
The last issue of this data sheet was May, 2002 (This document was previously labeled Advance Information.) A change history is included in 9 Change History on page 25. Red change bars have been installed on all text, figures, and tables that were added or changed. All changes to the text are highlighted in red. Changes within figures, and the figure title itself, are highlighted in red, if feasible. Formatting or grammatical changes have not been highlighted. Deleted sections, paragraphs, figures, or tables will be specifically mentioned. If the reader displays this document in Acrobat Reader®, clicking on any blue entry in the text will bring the reader to that reference point. This document describes the hardware interfaces to the Agere Systems Inc. TSI-8 device. Information relevant to the use of the device in a board design is covered. Ball descriptions, dc electrical characteristics, timing diagrams, ac timing parameters, packaging, and operating conditions are included.
1.1 Related Documents
More information on the TSI-8 is contained in the following documents: TSI-8 Product Description TSI-8 Register Description TSI-8 Systems Design Guide
2 Description
2.1 Block Diagram and High-Level Interface Definition
TEST PATTERN GENERATOR TEST PATTERN MONITOR TRANSLATION TABLE LOOKUP
TEST ACCESS PORT
8K X 8K SWITCH FABRIC
32 RECEIVE CHI TRANSMIT CHI 32
DATA STORE
WRITE ADDRESS COUNTER
CONNECTION STORE
READ ADDRESS COUNTER
MICROPROCESSOR INTERFACE
CLOCK GENERATOR
Figure 2-1. Block Diagram and High-Level Interface Definition
TSI-8 8K x 8K Time-Slot Interchanger
Hardware Design Guide, Revision 1 November 2, 2005
Table of Contents
Contents Page Contents Page
1 Introduction .............................................................. 1 1.1 Related Documents .......................................... 1 2 Description ............................................................... 1 2.1 Block Diagram and High-Level Interface Definition .......................................................... 1 3 Ball Information ........................................................ 3 3.1 Ball Diagram ..................................................... 3 3.2 Package Ball Assignments ............................... 4 3.3 Ball Types ......................................................... 8 3.4 Ball Definitions .................................................. 8 4 Absolute Maximum Ratings ................................... 11 4.1 Handling Precautions ..................................... 11 4.2 ESD Tolerance ............................................... 11 4.3 Package Thermal Characteristics ................... 11 4.4 Recommended Operating Conditions ............ 12 5 dc Electrical Characteristics .................................. 13 6 Timing Diagrams and ac Characteristics ............... 14 7 Outline Diagrams ................................................... 24 8 Ordering Information .............................................. 25 9 Change History ...................................................... 25
Figure 6-13. Typical Receive CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK ..... 20 Figure 6-14. Transmit CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK ................. 20 Figure 6-15. CHI 3-State Output Control ................... 21 Figure 6-16. Microprocessor Port Timing— Read Cycle............................................. 22 Figure 6-17. Microprocessor Port Timing— Write Cycle............................................. 23
Tables
Page
Figures
Page
Figure 2-1. Block Diagram and High-Level Interface Definition ................................................... 1 Figure 3-1. Package Diagram (Top View) ................... 3 Figure 6-1. CHICLK Timing Specifications ................ 14 Figure 6-2. MPUCLK Timing Specifications .............. 14 Figure 6-3. ac Timing Specification ........................... 15 Figure 6-4. CHI Interface Timing ............................... 15 Figure 6-5. Typical Receive CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK... 16 Figure 6-6. Transmit CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK ............... 16 Figure 6-7. Typical Receive CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK... 17 Figure 6-8. Transmit CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK ............... 17 Figure 6-9. Typical Receive CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK... 18 Figure 6-10. Transmit CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK ............... 18 Figure 6-11. Typical Receive CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK... 19 Figure 6-12. Transmit CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK ............... 19
Table 3-1. Package Ball Assignments in Signal Name Order ........................................................... 4 Table 3-2. Package Ball Assignments in Ball Number Order (Top View) ......................................... 6 Table 3-3. Package Ball Assignments in Ball Number Order (Bottom View) (continued)................. 7 Table 3-4. Ball Types ................................................... 8 Table 3-5. Timing Port.................................................. 8 Table 3-6. Transmit and Receive Concentration Highways..................................................... 8 Table 3-7. Control Port................................................. 9 Table 3-8. Initialization and Test Access...................... 9 Table 3-9. Power Balls............................................... 10 Table 4-1. Absolute Maximum Ratings ...................... 11 Table 4-2. ESD Tolerance.......................................... 11 Table 4-3. Power Consumption ................................. 11 Table 4-4. Operating Conditions ................................ 12 Table 5-1. CMOS Inputs ............................................ 13 Table 5-2. CMOS Outputs ......................................... 13 Table 5-3. CMOS Bidirectionals (Excluding TXD[31:00]) ............................................... 13 Table 5-4. CMOS Bidirectionals (TXD[31:00]) ........... 13 Table 6-1. CHICLK Timing Specifications .................. 14 Table 6-2. MPUCLK Timing Specifications ................ 14 Table 6-3. CMOS Output ac Timing Specification * ... 15 Table 6-4. CHI Interface Timing ................................. 15 Table 6-5. CHI 3-State Output Control .......................21 Table 6-6. Microprocessor Port Timing— Read Cycle................................................ 22 Table 6-7. Microprocessor Port Timing— Write Cycle23 Table 8-1. Ordering Information................................. 25
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TSI-8 8K x 8K Time-Slot Interchanger
3 Ball Information
3.1 Ball Diagram
The TSI-8 is housed in a 240-ball plastic ball grid array. Figure 3-1 shows the ball arrangement viewed from the top of the package. The balls are spaced on a 1.0 mm pitch.
1 A B 2
34
56
7
8
9 10 11 12 13 14 15 16 17 18
C
D E
F
G H
J
K L
M
N P
R
T U
V
Figure 3-1. Package Diagram (Top View)
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TSI-8 8K x 8K Time-Slot Interchanger
3.2 Package Ball Assignments
Table 3-1. Package Ball Assignments in Signal Name Order Symbol ADDR00 ADDR01 ADDR02 ADDR03 ADDR04 ADDR05 ADDR06 ADDR07 ADDR08 ADDR09 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15 AS CHICLK CKSPD0 CKSPD1 CS DATA00 DATA01 DATA02 DATA03 DATA04 DATA05 DATA06 DATA07 DATA08 DATA09 DATA10 DATA11 DATA12 Ball A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 J16 R16 E18 D16 J18 K18 K17 L18 L17 L16 M18 M17 M16 M15 N18 N17 N16 N15 Symbol DATA13 DATA14 DATA15 DT FSYNC HIZ INT MPUCLK PAR0 PAR1 R/W RESET RSV1 RSV2 RSV3 RSV4 RSV5 RSV6 RSV7 RSV8 RSV9 RSV10 RSV11 RXD00 RXD01 RXD02 RXD03 RXD04 RXD05 RXD06 RXD07 RXD08 RXD09 RXD10 Ball P18 P17 P16 H17 T11 R17 H16 K15 R18 P15 J17 H15 F17 F18 E15 E16 E17 D17 B18 C18 D18 T18 V17 V2 U3 V3 U4 V4 U5 V5 U6 V6 T7 U7 Symbol RXD11 RXD12 RXD13 RXD14 RXD15 RXD16 RXD17 RXD18 RXD19 RXD20 RXD21 RXD22 RXD23 RXD24 RXD25 RXD26 RXD27 RXD28 RXD29 RXD30 RXD31 TCK TDI TDO TMS TRSTN TXD00 TXD01 TXD02 TXD03 TXD04 TXD05 TXD06 TXD07 Ball V7 T8 U8 V8 U9 V9 V10 U10 V11 U11 V12 U12 V13 U13 V14 U14 V15 U15 T15 V16 U16 G17 G16 G18 G15 H18 B1 C2 C1 D2 D1 E2 E1 F2
Hardware Design Guide, Revision 1 November 2, 2005
Symbol TXD08 TXD09 TXD10 TXD11 TXD12 TXD13 TXD14 TXD15 TXD16 TXD17 TXD18 TXD19 TXD20 TXD21 TXD22 TXD23 TXD24 TXD25 TXD26 TXD27 TXD28 TXD29 TXD30 TXD31 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15
Ball F1 G3 G2 G1 H2 H1 J2 J1 K1 K2 L1 L2 M1 M2 N1 N2 N3 P1 P2 R1 R2 T1 T2 U1 C5 C6 C7 C12 C13 C14 D5 D6 D7 D12
Symbol VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDD33 VDDPLL VIO VPRE VSS VSS
Ball D13 D14 G4 H4 L4 M4 R7 R8 R11 R12 C9 C10 C17 D9 D10 E3 F3 F15 H3 J3 K16 P3 R3 T5 T6 T9 T10 T14 T17 R14 K3 T4 A1 A18
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Table 3-1. Package Ball Assignments in Signal Name Order (continued) Symbol VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 C3 C4 Symbol VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball C8 C11 C15 C16 D3 D4 D8 D11 D15 E4 F4 F16 H8 H9 H10 H11 J4 J8 Symbol VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
TSI-8 8K x 8K Time-Slot Interchanger
Ball J9 J10 J11 J15 K4 K8 K9 K10 K11 L3 L8 L9 L10 L11 L15 M3 N4 P4
Symbol VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSSPLL
Ball R4 R5 R6 R9 R10 R15 T3 T12 T13 T16 U2 U17 U18 V1 V18 R13
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Hardware Design Guide, Revision 1 November 2, 2005
Table 3-2. Package Ball Assignments in Ball Number Order (Top View) (continued)
1 A 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 VSS RSV7 RSV8 RSV9 CKSPD0 RSV2 TDO TRSTN CS DATA00 DATA02 DATA05 DATA09 DATA13 PAR0 RSV10 VSS VSS
VSS ADDR15 ADDR14 ADDR13 ADDR12 ADDR11 ADDR10 ADDR09 ADDR08 ADDR07 ADDR06 ADDR05 ADDR04 ADDR03 ADDR02 ADDR01 ADDR00 VSS VSS VSS VSS VDD33 VDD33 TXD09 VDD33 VDD33 VIO VSS VSS TXD24 VDD33 VDD33 VSS RXD01 RXD02 VSS VSS VSS VSS VSS VDD15 VDD15 VSS VSS VDD15 VDD15 VSS VSS VSS VPRE RXD03 RXD04 VSS VDD15 VDD15 — — — — — — — — — — VSS VDD33 RXD05 RXD06 VSS VDD15 VDD15 — — — — — — — — — — VSS VDD33 RXD07 RXD08 VSS VDD15 VDD15 — — — — — — — — — — VDD15 RXD09 RXD10 RXD11 VSS VSS VSS — — — VSS VSS VSS VSS — — — VDD15 RXD12 RXD13 RXD14 VSS VDD33 VDD33 — — — VSS VSS VSS VSS — — — VSS VDD33 RXD15 RXD16 VSS VDD33 VDD33 — — — VSS VSS VSS VSS — — — VSS VDD33 RXD18 RXD17 VSS VSS VSS — — — VSS VSS VSS VSS — — — VDD15 FSYNC RXD20 RXD19 VSS VDD15 VDD15 — — — — — — — — — — VSS VDD15 VDD15 — — — — — — — — — — VSS VDD15 VDD15 — — — — — — — — — — VSS VSS VSS RSV3 VDD33 TMS RESET VSS MPUCLK VSS DATA08 DATA12 PAR1 VSS RXD29 RXD28 RXD27 VSS VSS CKSPD1 RSV4 VSS TDI INT AS VDD33 DATA04 DATA07 DATA11 DATA15 CHICLK VSS RXD31 RXD30 VSS VDD33 RSV6 RSV5 RSV1 TCK DT R/W DATA01 DATA03 DATA06 DATA10 DATA14 HIZ VDD33 VSS RSV11
B TXD00
C TXD02 TXD01 D TXD04 TXD03 E TXD06 TXD05 F TXD08 TXD07 G TXD11 TXD10 H TXD13 TXD12 J TXD15 TXD14 K TXD16 TXD17 L TXD18 TXD19 M TXD20 TXD21 N TXD22 TXD23 P TXD25 TXD26 R TXD27 TXD28 T TXD29 TXD30 U TXD31 V VSS VSS RXD00
VDD15 VSSPLL VDDPLL VSS RXD22 RXD21 VSS RXD24 RXD23 VDD33 RXD26 RXD25
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TSI-8 8K x 8K Time-Slot Interchanger
Table 3-3. Package Ball Assignments in Ball Number Order (Bottom View)
18 A B C D VSS RSV7 RSV8 RSV9 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VSS TXD00
ADDR00 ADDR01 ADDR02 ADDR03 ADDR04 ADDR05 ADDR06 ADDR07 ADDR08 ADDR09 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15 VSS VDD33 RSV6 RSV5 RSV1 TCK DT R/W DATA01 DATA03 DATA06 DATA10 DATA14 HIZ VDD33 VSS RSV11 VSS VSS CKSPD1 RSV4 VSS TDI INT AS VDD33 DATA04 DATA07 DATA11 DATA15 CHICLK VSS RXD31 RXD30 VSS VSS VSS RSV3 VDD33 TMS RESET VSS MPUCLK VSS DATA08 DATA12 PAR1 VSS RXD29 RXD28 RXD27 VSS VDD15 VDD15 — — — — — — — — — — VSS VDD15 VDD15 — — — — — — — — — — VSS VDD15 VDD15 — — — — — — — — — — VSS VSS VSS — — — VSS VSS VSS VSS — — — VSS VSS VSS VSS VSS — — — VSS VSS VSS VSS — — — VSS VSS VSS VSS VSS VSS VSS VSS VDD15 VSS VSS VSS VDD33 VDD33 TXD09 VSS
VDD33 VDD33 VDD33 VDD33 — — — VSS VSS VSS VSS — — — VSS — — — VSS VSS VSS VSS — — — VSS
VDD15 VDD15 VDD15 VDD15 VDD15 VDD15 — — — — — — — — — — — — — — — — — — — — VSS — — — — — — — — — — VSS
TXD01 TXD02 TXD03 TXD04 TXD05 TXD06 TXD07 TXD08 TXD10 TXD11 TXD12 TXD13 TXD14 TXD15 TXD17 TXD16 TXD19 TXD18 TXD21 TXD20 TXD23 TXD22 TXD26 TXD25 TXD28 TXD27 TXD30 TXD29 VSS TXD31 VSS
E CKSPD0 F G H J K L M N P R T U V RSV2 TDO TRSTN CS DATA00 DATA02 DATA05 DATA09 DATA13 PAR0 RSV10 VSS VSS
VDD15 VDD33 VSS VSS VDD15 VDD15 VSS VSS VSS VPRE VDD33 VIO VSS VSS TXD24 VDD33 VDD33 VSS
VDDPLL VSSPLL VDD15 VDD15 VDD33 RXD26 RXD25 VSS RXD24 RXD23 VSS
VDD15 VDD15
FSYNC VDD33 VDD33 RXD12 RXD09 VDD33 VDD33
RXD22 RXD20 RXD18 RXD15 RXD13 RXD10 RXD07 RXD05 RXD03 RXD01 RXD21 RXD19 RXD17 RXD16 RXD14 RXD11
RXD08 RXD06 RXD04 RXD02 RXD00
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TSI-8 8K x 8K Time-Slot Interchanger
3.3 Ball Types
Hardware Design Guide, Revision 1 November 2, 2005
This table describes each type of input, output, and I/O ball used on the TSI-8. Table 3-4. Ball Types Type Label I I pd I pu O O od I/O None P CMOS input, TTL switching thresholds. CMOS input, TTL switching thresholds with internal pull-down resistor. CMOS input, TTL switching thresholds with internal pull-up resistor. CMOS output. Open drain output. Bidirectional ball; CMOS input with TTL switching thresholds and CMOS output. Analog inputs for external resistors, capacitors, voltage references, etc. Power and ground. Description
The dc switching and other electrical characteristics are specified later in this document.
3.4 Ball Definitions
This section describes the function of each of the device balls. The balls are listed by ball name. Package ball numbers are listed in Table 3-1 of this document. The static parameters (drive currents, switching thresholds, etc.) for each ball type (input, output, etc.) are described in Table 5-1 through Table 5-4. Table 3-5. Timing Port Ball Name Type Name/Description FSYNC I Frame Synchronization. This signal indicates the beginning of a 125 µs frame event (8 kHz). The FSYNC ball can be programmed as active-low or active-high, but its polarity is the same for all concentration highway interfaces (CHI). FSYNC can be sampled on either the positive or negative edge of CHICLK. Time-slot numbers and bit offsets for each CHI are assigned relative to the detection of FSYNC. CHICLK I Clock. This is the master synchronous clock for the transmit and receive concentration highways. The frequency can be 8.192 MHz or 16.384 MHz. It must be at least as fast as the highest CHI data rate. CKSPD0 I Clock Speed. Static control input that should be tied according to the frequency of CHICLK. If CHICLK is connected to an 8.192 MHz source, CKSPD0 should be tied to VSS. If CHICLK is connected to a 16.384 MHz source, CKSPD0 should be tied to VDD33. CKSPD1 I pd Clock Speed. Reserved, leave disconnected. 20 kΩ pull-down resistor. Table 3-6. Transmit and Receive Concentration Highways Ball Name Type Name/Description RXD[31:00] I pd Receive Data [31:00]. Receive concentration highways. These are serial, synchronous data streams which may be individually programmed to operate at 2.048 Mbits/s, 4.096 Mbits/s, 8.192 Mbits/s, or 16.384 Mbits/s. They carry 32, 64, 128, or 256 time slots (respectively) each occupying eight contiguous bits. 20 kΩ pull-down resistor. TXD[31:00] I/O Transmit Data [31:00]. Normally these are output concentration highway data streams with data rate options identical to the RXD inputs. These balls can be configured to operate as bidirectional multiplex ports such as H.110. Further information can be found in the system design guide. 20 kΩ resistor connected to VPRE.
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Table 3-7. Control Port Ball Name MPUCLK CS AS Type I I I Name/Description
TSI-8 8K x 8K Time-Slot Interchanger
Processor Clock. This clock is used to sample address, data, and control signals from the microprocessor. This clock must be within the range of 0 MHz—66 MHz. Required for operation. Chip Select. Active-low chip select. This input is held low for the duration of any read or write access to the TSI-8. Required for operation. Address Strobe. Active-low address strobe that is one MPUCLK cycle wide at the start of a microprocessor access cycle to the TSI-8. This is used to initiate a microprocessor access. Required for operation.
Read/Write. Cycle selection. R/W is set high during a read cycle, or set low for a write cycle. Required for operation. ADDR[15:00] I pu Address [15:00]. ADDR[15] is the most significant bit and ADDR[00] is the least significant bit for addressing all the internal registers during microprocessor access cycles. All addresses are 16-bit word addresses; hence, in a typical application ADDR[00] of the TSI-8 device would be connected to address bit 1 of a byte addressable system address bus. Required for operation. 200 kΩ pull-up resistor. Note: The TSI-8 is little-endian; the least significant byte is stored in the lowest address and the most significant byte is stored in the highest address. Care must be exercised in connection to microprocessors that use big-endian byte ordering. I/O Data [15:00]. Data bus for all transfers between the microprocessor and the internal registers. The balls are inputs during write cycles and outputs during read cycles. DATA[15] is the most significant bit, and DATA[00] is the least significant bit. Required for operation. I/O Control Port Parity [1:0]. Byte-wide parity bits for data. PAR[1] is the parity for DATA[15:8], and PAR[0] is the parity for DATA[7:0]. The parity sense (even or odd) is application programmable via a register bit in the TSI-8. Not required for operation. O Data Transfer Acknowledge. Active-low for one MPUCLK cycle. Indicates that data has been written during write cycles or that data is valid during read cycles. High impedance when CS is a 1 and driven when CS is 0. Required for operation.
R/W
I
DATA[15:00]
PAR[1:0]
DT
INT
O od Interrupt. This output is asserted low to indicate that an interrupt condition has occurred. This signal remains active-low until the interrupt status register has been cleared or masked.
Table 3-8. Initialization and Test Access Ball Name Type Name/Description I pu Reset. Global reset, active-low. Initializes all internal registers to their default state. The reset occurs RESET asynchronously, but RESET should be held low for at least two CHICLK periods. 20 kΩ pull-up resistor. TCK I pu Test Clock. This signal provides timing for the boundary scan and test access port (TAP) controller. Should be static except during boundary-scan testing. 20 kΩ pull-up resistor. TDI I pu Test Data In. Data input for the boundary scan. Sampled on the rising edge of TCK. 20 kΩ pull-up resistor. TMS I pu Test Mode Select (Active-Low). Controls boundary-scan test operations. TMS is sampled on the rising edge of TCK. 20 kΩ pull-up resistor. TRSTN I pd Test Reset (Active-Low). This signal is an asynchronous reset for the TAP controller. 20 kΩ pull-down resistor. TDO O Test Data Out. Updated on the falling edge of TCK. The TDO output is high impedance except when scanning out test data. I pu Output Enable. All output and bidrectional buffers will be high impedance when this input is low unless HIZ boundary scan is enabled (TRSTN = 1). 20 kΩ pull-up resistor. RSV[11:1] — Reserved [11:1]. These balls are used by Agere Systems during the manufacturing process. They must be left unconnected. Agere Systems Inc. 9
TSI-8 8K x 8K Time-Slot Interchanger
Table 3-9. Power Balls Symbol Type VDD33 VDD15 VSS VPRE P P P P
Hardware Design Guide, Revision 1 November 2, 2005
Name/Description I/O Power. Power supply balls for the I/O pads (3.3 V ± 5%). Core Power. Power supply balls for the core (1.5 V ± 5%). Ground. Common ground balls for 3.3 V and 1.5 V supplies. Precharge. Precharge voltage to support H.110 hot insertion on TXD[31:00]. If the device is used in an H.110 hot insertion applications, the signal should be connected to backplane early voltage; otherwise connect this signal to ground. PCI Buffer Voltage Select. For an H.110 application using TXD[31:00] in a 5 V signaling environment, connect this signal to 5 V. For an H.110 application using TXD[31:00] in a 3 V signaling environment, connect this signal to VDD33. For all other applications, connect this signal to VDD33. PLL Power. 1.5 V power supply for the internal phase-locked loop. Must include local 0.01 µF capacitor to VSSPLL. PLL Ground. Isolated ground for the internal phase-locked loop.
VIO
P
VDDPLL VSSPLL
P P
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TSI-8 8K x 8K Time-Slot Interchanger
4 Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect device reliability. Table 4-1. Absolute Maximum Ratings Parameter Supply Voltage (VDD33) Supply Voltage (VDD15) Input Voltage: TXD[31:00] All Other Inputs Storage Temperature Junction Temperature Min –0.5 –0.5 –0.5 –0.3 –40 — Max 4.2 1.8 5.5 VDD33 + 0.3 125 125 Unit V V V °C °C
4.1 Handling Precautions
Although electrostatic discharge (ESD) protection circuitry has been designed into this device, proper precautions must be taken to avoid exposure to ESD and electrical overstress (EOS) during all handling, assembly, and test operations. Agere employs both a human-body model (HBM) and a charged-device model (CDM) qualification requirement in order to determine ESD-susceptibility limits and protection design evaluation. ESD voltage thresholds are dependent on the circuit parameters used in each of the models, as defined by JEDEC’s JESD22-A114 (HBM) and JESD22-C101 (CDM) standards.
4.2 ESD Tolerance
Table 4-2. ESD Tolerance Device TSI-8 Voltage 2,000 V 500 V Type HBM (human-body model) CDM (charged-device model)
4.3 Package Thermal Characteristics
ΘJA = 24.0 °C/W. Table 4-3. Power Consumption Supply Voltage VDD33 VDD15 Typ* 100 mW at 3.3 V 275 mW at 1.5 V Max 150 mW at 3.47 V 325 mW at 1.6 V
*MPUCLK = 66 MHz, CHICLK = 16.384 MHz, TA = 25 °C, all CHIs active, all outputs loaded with 50 pF.
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TSI-8 8K x 8K Time-Slot Interchanger
4.4 Recommended Operating Conditions
Recommended conditions apply unless otherwise specified. Table 4-4. Operating Conditions Parameter Supply Voltage (VDD33) Supply Voltage (VDD15) Ambient Temperature Min 3.14 1.4 –40
Hardware Design Guide, Revision 1 November 2, 2005
Typ 3.3 1.5 —
Max 3.47 1.6 85
Unit V V °C
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5 dc Electrical Characteristics
This section describes the static parameters associated with all the ball types used in the TSI-8 device. Table 5-1. CMOS Inputs Parameter Input Leakage Current High-Input Voltage Low-Input Voltage Input Capacitance Table 5-2. CMOS Outputs Parameter Output Voltage Low Output Voltage High Output Current Low Output Current High Output Capacitance HIZ Output Leakage Current Symbol VOL VOH IOL IOH CO IOZ Conditions IOL = –10 mA IOL = 10 mA — — — — Min — 2.4 — — — — Typ — — — — 3 — Max 0.4 — 10 10 — 10 Unit V V mA mA pF µA Symbol IIL VIH VIL CI Conditions VSS < VIN < VDD33 — — — Min — 2.0 –0.3 — Typ — — — 2.5 Max 1* VDD33 + 0.3 0.8 — Unit µA V V pF
* Excludes current due to pull-up or pull-down resistors.
Table 5-3. CMOS Bidirectionals (Excluding TXD[31:00]) Parameter Leakage Current High-Input Voltage Low-Input Voltage Biput Capacitance Output Voltage Low Output Voltage High Symbol IL VIH VIL CIB VOL VOH Conditions VSS < VIN < VDD33 — — — IOL = –10 mA IOL = 10 mA Min — 2.0 –0.3 — — 2.4 Typ — — — 5.0 — — Max 11 VDD33 + 0.3 0.8 — 0.4 — Unit µA V V pF V V
Table 5-4. CMOS Bidirectionals (TXD[31:00]) Parameter Leakage Current High-Input Voltage Low-Input Voltage Biput Capacitance Output Voltage Low Output Voltage High Positive-Going Threshold Negative-Going Threshold Hysteresis (Vt+ – Vt–) Symbol IL VIH VIL CIB VOL VOH Vt+ Vt– VHYS Conditions VSS < VIN < VDD33 VIO = 5.0 V VIO = 3.3 V VIO = 5.0 V VIO = 3.3 V — IOL = 1.5 mA, VIO = 3.3 V IOL = 6.0 mA, VIO = 5.0 V IOL = –0.5 mA, VIO = 3.3 V IOL = –2.0 mA, VIO = 5.0 V — — — Min — 2.0 0.5 VDD33 –0.5 –0.5 — — — 0.9 VDD33 2.4 1.2 0.6 0.4 Max 10 5.5 VDD33 + 0.5 0.8 0.3 VDD33 10 0.1 VDD33 0.55 — — 2.0 1.6 — Unit µA V V pF V V V V V
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Hardware Design Guide, Revision 1 November 2, 2005
6 Timing Diagrams and ac Characteristics
Figure 6-1 and Figure 6-2 describe the timing specifications for the input clocks on the TSI-8.
t2 t1 VIH VIL t4 VIH VIL t3 VDD33 50%
Figure 6-1. CHICLK Timing Specifications
Table 6-1. CHICLK Timing Specifications Parameter t1 t2 t2 t3 t4 t4 Description CHICLK Rise Time CHICLK Width (8.192 MHz)* CHICLK Width (16.384 MHz)* CHICLK Fall Time CHICLK Period (8.192 MHz) CHICLK Period (16.384 MHz) Min — 48.84 24.42 — — — Typ 2 — — 2 122.07 61.03 Max 7 73.24 36.62 7 — — Unit ns ns ns ns ns ns
* VIH to VIH or VIL to VIL.
t6 t5 VIH VIL t8 VIH 50% VIL t7 VDD33
Figure 6-2. MPUCLK Timing Specifications
Table 6-2. MPUCLK Timing Specifications Parameter t5 t6 t7 t8 Description MPUCLK Rise Time MPUCLK Width* MPUCLK Fall Time MPUCLK Period Min — 6.06 — 15.2 Typ 2 — 2 — Max 7 — 7 — Unit ns ns ns ns
* VIH to VIH or VIL to VIL.
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TSI-8 8K x 8K Time-Slot Interchanger
Figure 6-3 shows the ac timing specifications for the CMOS outputs on the device.
80 %
80 %
20%
20 %
t9
t10
Figure 6-3. ac Timing Specification
Table 6-3. CMOS Output ac Timing Specification * Parameter t9 t10 Description Rise Time (20%—80%) Fall Time (80%—20%) Min — — Typ 1.5 1.5 Max 7 7 Unit ns ns
* Test load = 50 pF (total).
FSYNC
t13
t14
CHICLK
t15
RXD
t16
t17
TXD
t18
t19
Note: This figure assumes TSI-8 is programmed to sample FSYNC on rising edge of CHICLK.
Figure 6-4. CHI Interface Timing
Table 6-4. CHI Interface Timing Parameter t13 t14 t15 t16 t17 t18 t19 Description FSYNC Setup Time to Active CHICLK Edge FSYNC Hold Time from Active CHICLK Edge RXD Setup to Active CHICLK Edge RXD Hold Time from Active CHICLK Edge TXD High Z to Data Valid TXD Propagation Delay from Active CHICLK Edge Transmit Data High Impedance* Min 10 5 10 5 — 2 — Max — — — — 15 12 15 Unit ns ns ns ns ns ns ns
* Applies if Driver_Enable_Control = 01. For Driver_Enable_Control = 11 refer to Figure 6-15 CHI 3-State Output Control on page 21.
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TSI-8 8K x 8K Time-Slot Interchanger
All timing specifications also apply under the following conditions: If FS is active-low. If the falling edge of CHICLK is specified as the active edge.
Hardware Design Guide, Revision 1 November 2, 2005
At all RXD and TXD rates (16.384 Mbits/s, 8.192 Mbits/s, 4.096 Mbits/s, or 2.048 Mbits/s) with a CHICLK frequency of 16.384 MHz or 8.192 MHz.
FSYNC CHICLK
w/ 0 offset
TS255 B6
TS255 B7
TS0 B0 TS0 B1 data sampled TS0 B0 TS0 B1 data sampled
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ ¼ bit offset
TS255 B6
TS255 B7
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ ½ bit offset
TS255 B6
TS255 B7
TS0 B0 TS0 B1 data sampled TS0 B0 TS0 B1 data sampled
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ ¾ bit offset
TS255 B5
TS255 B6
TS255 B7
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ bit offset = 1
TS255 B5
TS255 B6
TS255 B7 TS0 B0 data sampled
TS0 B1
TS0 B2
TS0 B3
TS0 B4
w/ 2¾ bit offset
TS255 B3
TS255 B4
TS255 B5
TS255 B6 TS255 B7 data sampled TS255 B3
TS0 B0
TS0 B1
TS0 B2
TS0 B3
w/ bit offset = 7
TS254 B7
TS255 B0
TS255 B1 TS255 B2 data sampled TS255 B0 TS255 B1 data sampled
TS255 B4
TS255 B5
TS255 B6
TS255 B7
TS0 B 0
TS0 B1
w/ TS offset = 1, bit offset = 0 w/ TS offset = 13, bit offset = 3¼ w/ TS offset = 255, bit offset = 7¾
TS254 B6
TS254 B7
TS255 B2
TS255 B3
TS255 B4
TS255 B5
TS255 B6
TS255 B7
TS0 B0
TS242 B3
TS242 B4
TS242 B5 TS242 B6 data sampled
TS242 B7
TS243 B0
TS243 B1
TS243 B2
TS243 B3
TS243 B4
TS243 B5
TS255 B6
TS255 B7
TS0 B0
TS0 B1 TS0 B2 data sampled
TS0 B3
TS0 B4
TS0 B5
TS0 B6
TS0 B7
TS1 B0
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-5. Typical Receive CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK
FSYNC CHICLK
w/ 0 offset w/ ½ bit offset w/ bit offset = 1 w/ TS offset = 1, bit offset = 0 w/ TS offset = 255, bit offset = 7½
TS255 B5
TS255 B6
TS255 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4
TS0 B5
TS255 B5 TS255 B4 TS254 B5
TS255 B6
TS255 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4 TS0 B4 TS255 B5
TS255 B5 TS254 B6
TS255 B6 TS254 B7
TS255 B7 TS255 B0
TS0 B0 TS255 B1
TS0 B1 TS255 B2
TS0 B2 TS255 B3
TS0 B3 TS255 B4
TS255 B6
TS255 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4
TS0 B5
Notes: 1/4 bit offset not valid with 16 Mbits/s data. For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and sampled by the rising edge of the CHICLK.
Figure 6-6. Transmit CHI Timing with 16.384 Mbits/s Data and 16.384 MHz CHICLK 16 Agere Systems Inc.
Hardware Design Guide, Revision 1 November 2, 2005
FSYNC CHICLK
TSI-8 8K x 8K Time-Slot Interchanger
w/ 0 offset
TS127 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
TS0 B3
TS0 B4
w/ ¼ bit offset
TS127 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
TS0 B3
TS0 B4
w/ ½ bit offset
TS127 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
TS0 B3
w/ ¾ bit offset
TS 127 B6
TS127 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
TS0 B3
w/ bit offset = 1
TS127 B6
TS127 B7 data sampled
TS0 B0
TS0 B1
TS0 B2
TS0 B3
w/ 2¾ bit offset
TS 127 B4
TS127 B5
TS127 B6 data sampled
TS127 B7
TS0 B0
TS0 B1
w/ bit offset = 7
TS127 B0
TS127 B1 data sampled
TS127 B2
TS127 B3
TS127 B4
TS127 B5
w/ TS offset = 1, bit offset = 0 w/ TS offset = 13, bit offset = 3¼ w/ TS offset = 127, bit offset = 7¾
TS126 B7
TS127 B0 data sampled
TS127 B1
TS127 B2
TS127 B3
TS127 B4
TS114 B4
TS114 B5 data sampled
TS114 B6
TS114 B7
TS115 B0
TS115 B1
TS 127 B7
TS0 B0
TS0 B1 data sampled
TS0 B2
TS0 B3
TS0 B4
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-7. Typical Receive CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK
FSYNC CHICLK
w/ 0 offset w/ ¼ bit offset w/ ½ bit offset w/ bit offset = 1 w/ TS offset = 1, bit offset = 0 w/ TS offset = 127, bit offset = 7¾
TS 127 B6 TS127 B6 TS127 B6 TS 127 B5 TS 126 B6
TS127 B7 TS127 B7 TS127 B7 TS127 B6 TS126 B7
TS0 B0 TS0 B0 TS0 B0 TS127 B7 TS127 B0
TS0 B1 TS0 B1 TS0 B1 TS0 B0 TS127 B1
TS0 B2 TS0 B2 TS0 B2 TS0 B1 TS127 B2
TS0 B3 TS0 B3 TS0 B3 TS0 B2 TS127 B3
TS127 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-8. Transmit CHI Timing with 8.192 Mbits/s Data and 16.384 MHz CHICLK
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TSI-8 8K x 8K Time-Slot Interchanger
FSYNC CHICLK
Hardware Design Guide, Revision 1 November 2, 2005
w/ 0 offset
TS0 B0 data sampled
TS0 B1
TS0 B2
w/ ¼ bit offset
TS63 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
w/ ½ bit offset
TS63 B7
TS0 B0 data sampled
TS0 B1
TS0 B2
w/ ¾ bit offset
TS63 B7
TS0 B0 data sampled
TS0 B1
w/ bit offset = 1
TS63 B7 data sampled
TS0 B0
TS0 B1
w/ 2¾ bit offset
TS63 B5
TS63 B6 data sampled
TS63 B7
w/ bit offset = 7
TS63 B1 data sampled
TS63 B2
TS63 B3
w/ TS offset = 1, bit offset = 0 w/ TS offset = 13, bit offset = 3¼ w/ TS offset = 63, bit offset = 7¾ TS50 B4
TS63 B0 data sampled TS50 B5 data sampled TS0 B0 TS0 B1
TS63 B1
TS63 B2
TS50 B6
TS50 B7
TS0 B2 data sampled
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-9. Typical Receive CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK
FSYNC CHICLK
w/ 0 offset w/ ¼ bit offset w/ ½ bit offset w/ bit offset = 1 w/ TS offset = 1, bit offset = 0 w/ TS offset = 63, bit offset = 7¾ TS63 B6
TS63 B7 TS63 B7 TS63 B7 TS63 B6 TS62 B7
TS0 B0 TS0 B0 TS0 B0 TS63 B7 TS63 B0
TS0 B1 TS0 B1 TS0 B1 TS0 B0 TS63 B1
TS63 B7
TS0 B0
TS0 B1
TS0 B2
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-10. Transmit CHI Timing with 4.096 Mbits/s Data and 16.384 MHz CHICLK
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FSYNC CHICLK
TSI-8 8K x 8K Time-Slot Interchanger
w/ 0 offset
TS0 B0 data sampled
TS0 B1
w/ ¼ bit offset
TS0 B0 data sampled
TS0 B1
w/ ½ bit offset
TS31 B7
TS0 B0 data sampled
TS0 B1
w/ ¾ bit offset
TS31 B7
TS0 B0 data sampled
TS0
w/ bit offset = 1
TS31 B7 data sampled
TS0 B0
w/ 2¾ bit offset
TS31 B5
TS31 B6 data sampled
TS31
w/ bit offset = 7
TS31 B1 data sampled
TS31 B2
w/ TS offset = 1, bit offset = 0 w/ TS offset = 13, bit offset = 3¼ w/ TS offset = 31, bit offset = 7¾ TS0 B0
TS31 B0 data sampled TS18 B5 data sampled TS0 B1
TS31 B1
TS18 B6
TS0 data sampled
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-11. Typical Receive CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK
FSYNC CHICLK
w/ 0 offset w/ ¼ bit offset w/ ½ bit offset w/ bit offset = 1 w/ TS offset = 1, bit offset = 0 w/ TS offset = 31, bit offset = 7¾ TS31 B7
TS31 B7 TS31 B7 TS31 B7 TS31 B6 TS30 B7
TS0 B0 TS0 B0 TS0 B0 TS31 B7 TS31 B0
TS0 B1
TS0 B0 TS31 B01
TS0 B0
TS0 B1
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-12. Transmit CHI Timing with 2.048 Mbits/s Data and 16.384 MHz CHICLK
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TSI-8 8K x 8K Time-Slot Interchanger
FSYNC CHICLK w/ 0 offset TS127 B6 TS127 B7 TS0 B0 TS0 B1 data sampled TS0 B0 TS0 B1 data sampled TS0 B0 TS0 B1 data sampled TS0 B0 TS0 B1 data sampled TS0 B1 TS0 B2 TS0 B3
Hardware Design Guide, Revision 1 November 2, 2005
TS0 B4
TS0 B5
w/ ¼ bit offset
TS127 B6
TS127 B7
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ ½ bit offset
TS127 B6
TS127 B7
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ ¾ bit offset
TS127 B5
TS127 B6
TS127 B7
TS0 B2
TS0 B3
TS0 B4
TS0 B5
w/ bit offset = 1
TS127 B5
TS127 B6
TS127 B7 TS0 B0 data sampled TS127 B5
TS0 B2
TS0 B3
TS0 B4
w/ 2¾ bit offset
TS127 B3
TS127 B4
TS127 B6 TS127 B7 data sampled TS127 B3
TS0 B0
TS0 B1
TS0 B2
TS0 B3
w/ bit offset = 7
TS126 B7
TS127 B0
TS127 B1 TS127 B2 data sampled TS127 B0 TS127 B1 data sampled TS114 B5 TS114 B6 data sampled
TS127 B4
TS127 B5
TS127 B6
TS127 B7
TS0 B 0
TS0 B1
w/ TS offset = 1, bit offset = 0 w/ TS offset = 13, bit offset = 3¼ w/ TS offset = 127, bit offset = 7¾
TS126 B6
TS126 B7
TS127 B2
TS127 B3
TS127 B4
TS127 B5
TS127 B6
TS127 B7
TS0 B0
TS114 B3
TS114 B4
TS114 B7
TS115 B0
TS115 B1
TS115 B2
TS115 B3
TS115 B4
TS115 B5
TS127 B6
TS127 B7
TS0 B0
TS0 B1 TS0 B2 data sampled
TS0 B3
TS0 B4
TS0 B5
TS0 B6
TS0 B7
TS1 B0
Note: For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-13. Typical Receive CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK
FSYNC CHICLK
w/ 0 offset w/ ½ bit offset w/ bit offset = 1 w/ TS offset = 1, bit offset = 0 w/ TS offset = 127, bit offset = 7½
TS127 B5
TS127 B6
TS127 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4
TS0 B5
TS127 B5 TS127 B4 TS126 B5
TS127 B6
TS127 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4 TS0 B4 TS127 B5
TS127 B5 TS126 B6
TS127 B6 TS126 B7
TS127 B7 TS127 B0
TS0 B0 TS127 B1
TS0 B1 TS127 B2
TS0 B2 TS127 B3
TS0 B3 TS127 B4
TS127 B6
TS127 B7
TS0 B0
TS0 B1
TS0 B2
TS0 B3
TS0 B4
TS0 B5
Notes: 1/4 bit offset not valid with 8 MHz data and 8 MHz clock. For this timing diagram, it is assumed that FSYNC has been programmed to be active-high, and to be sampled by the rising edge of the CHICLK.
Figure 6-14. Transmit CHI Timing with 8.192 Mbits/s Data and 8.192 MHz CHICLK
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CHICLK 16.384 MHz
TSI-8 8K x 8K Time-Slot Interchanger
t20
TXD 16.384 Mbits/s
CHICLK 8.192 MHz
t21
TXD 8.192 Mbits/s
CHICLK 8.192 MHz
t22
TXD 8.192 Mbits/s
Figure 6-15. CHI 3-State Output Control Table 6-5. CHI 3-State Output Control Control in the table below refers to bits [6:4] in the Transmit_CHI_Global_Configuration register (0x0C84). This only applies if bits 13 and 12 of the corresponding Transmit_CHI_Control register (0x0C00—0x0C3E) are set to 11. See the TSI-8 Register Description document. Parameter Control t20 000 001 010 011 t21 000 001 010 011 t22 100 101 110 111 Reference Point* After Previous Like Edge in 16 MHz After Previous Like Edge in 16 MHz After Previous Like Edge in 16 MHz After Previous Like Edge in 16 MHz After Previous Opposite Edge in 8 MHz After Previous Opposite Edge in 8 MHz After Previous Opposite Edge in 8 MHz After Previous Opposite Edge in 8 MHz After Previous Like Edge (8 MHz mode only) After Previous Like Edge (8 MHz mode only) After Previous Like Edge (8 MHz mode only) After Previous Like Edge (8 MHz mode only) Min 50 44 38 32 50 44 38 32 111 105 99 93 Max* 59 53 47 41 59 53 47 41 120 114 108 102 Unit ns ns ns ns ns ns ns ns ns ns ns ns
* Like edge is the reference edge (rising or falling) as defined by the Transmit_Clock_Edge bit in the Transmit_CHI_Global_Configuration (0x0C84) register. See the TSI-8 Register Description document for further details.
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Hardware Design Guide, Revision 1 November 2, 2005
MPUCLK
t23 t24
ADDR[15:00] t26
t25
CS
t27
AS
t28 t29 t30
R/W
t31
DATA[15:00] PAR[1:0]
t32
t33
t35
DT
t35 t36
t34
Figure 6-16. Microprocessor Port Timing—Read Cycle
Table 6-6. Microprocessor Port Timing—Read Cycle Parameter t23 t24 t25 t26 t27 t28 t29 t30 t31 t32 t33 t34 t35 t36 Address Setup Address Hold Chip Select Setup Chip Select Hold Address Strobe Setup Address Strobe Hold R/W Setup R/W Hold Data Output Enable Data Clock to Valid Data High-Impedance DT High-Impedance to Valid DT Clock to Out DT Valid to High-Impedance Description Min 5 1 5 1 5 1 5 1 — 1 — 1 1 1 Max — — — — — — — — 15 7 8 15 7 8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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TSI-8 8K x 8K Time-Slot Interchanger
MPUCLK
t37
t38 ADDR[15:00]
t40
t39 CS t41 AS t42
t43
R/W
t44
t45
DATA[15:00] PAR[1:0]
t46
DT
t47
t48
t48 t49
Figure 6-17. Microprocessor Port Timing—Write Cycle
Table 6-7. Microprocessor Port Timing—Write Cycle Parameter t37 t38 t39 t40 t41 t42 t43 t44 t45 t46 t47 t48 t49 Address Setup Address Hold Chip Select Setup Chip Select Hold Address Strobe Setup Address Strobe Hold R/W Setup R/W Hold Data Setup Data Hold DT High-Impedance to Valid DT Clock to Out DT Valid to High-Impedance Description Min 5 1 5 1 5 1 5 1 5 1 1 1 1 Max — — — — — — — — — — 15 7 8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
Note: Posted writes follow the same timing shown in Figure 6-17 and Table 6-7. A posted write may return a DT prior to the device completing the write cycle. This allows the microprocessor to continue operation while the TSI-8 completes the write.
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TSI-8 8K x 8K Time-Slot Interchanger
Hardware Design Guide, Revision 1 November 2, 2005
7 Outline Diagrams
Dimensions are in millimeters.
TOP VIEW 19.00 SQUARE +0.70 17.70–0.05 SQUARE
A1 INDICATOR (PLATED)
1.75 TYP.
USE OF EJECTOR PINS IS OPTIONAL
4.00 x 45° APPROX TYP 4 CORNERS 1.20 x 45° APPROX TYP 3 PLACES 0.80 ± 0.050 0.50 R MAX ALL EDGES 30° APPROX ALL SIDES 0.35 Z 0.20 Z 0.10 1.86 ± 0.21 0.50 ± 0.10 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V +0.07 0.63 –0.13 DIA BOTTOM VIEW A1 INDICATOR (UNDER SOLDER MASK) Z SEATING PLANE
0.56 ± 0.06
1.00 TYP
0.50
CENTER ARRAY FOR THERMAL ENHANCEMENT
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TSI-8 8K x 8K Time-Slot Interchanger
8 Ordering Information
Table 8-1. Ordering Information Device TSI-8
* Pb-free/RoHS.
Part Number TTSI008321BL-2-DB L-TTSI008321BL-2-DB
Ball Count 240
Package PBGAM1
Comcode 700046829 700078759*
9 Change History
On page 1, updated Figure 2-1. On page 15, deleted 2 sentences at the beginning of the page. (All timing parameters are referenced to VIHmin and VILmax. The reference signal polarity may be inverted for some timing parameters.) On page 15, updated Figure 6-3, ac Timing Specification. On page 15, updated Table 6-3. CMOS Output ac Timing Specification * . On page 15, under Table 6-4 eliminated the following sentence: All timing specifications are with respect to VIHmin and VILmax as shown in Figure 5. On page 21, deleted footnote † under Table 6-5 and clarified the remaining footnote. On page 22, deleted the footnote under Table 6-6. On page 23, deleted the footnote under Table 6-7. On page 26, changed the part numbers.
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November 2, 2005 DS02-122SWCH-1 (Replaces DS02-122SWCH)
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