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AIC1734-30GXTTR

AIC1734-30GXTTR

  • 厂商:

    AIC(沛亨半导体)

  • 封装:

    SOT89-3

  • 描述:

    输出类型:固定;输出极性:正;最大输入电压:12V;输出电压:3V;输出电流:300mA;电源纹波抑制比(PSRR):-;

  • 数据手册
  • 价格&库存
AIC1734-30GXTTR 数据手册
AIC1734 300mA Low Dropout Linear Regulator   FEATURES DESCRIPTION  Low Dropout Voltage of 470mV at 300mA Output Current (3.0V Output Version). The AIC1734 is a 3-pin low dropout linear  Guaranteed 300mA Output Current. AIC1734 include zero base current loss, very  Low Ground Current at 55A. low dropout voltage, and 2% accuracy output  2% Accuracy Output Voltage of 1.8V/ 2.0V /2.5V /2.7V/ 3.0V/ 3.3V/ 3.5V/ 3.7V/ 3.8V/ 5.0V/ 5.2V. voltage.  Only needs 1F Output Capacitor for Stability. output current is exceptionally low. Built-in  Current and Thermal Limiting. output current limiting and thermal limiting  regulator. The superior characteristics of the Typical ground current remains approximately 55A, for loading ranging from zero to maximum. Dropout voltage at 300mA provide maximal protection to the AIC1734 APPLICATIONS against fault conditions.  CD-ROM Drivers. The AIC1734 is available in popular SOT-23,  LAN Cards. SOT-89 and TO-92 packages.  Microprocessor.  RAM Module.  Wireless Communication Systems. Battery Powered Systems.   TYPICAL APPLICATION CIRCUIT VOUT VIN AIC1734 VIN + CIN 1F GND VOUT + COUT 1F (Note1) Low Dropout Linear Regulator Analog Integrations Corporation Si-Soft Research Center DS-1734G-05 20120615 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1734  ORDERING INFORMATION AIC1734-XXXXX XX PIN CONFIGURATION PACKING TYPE TR: REEL BG: BAG PACKAGE TYPE U: SOT-23 XA: SOT-89 XT: SOT-89 ZT: TO-92 ZL: TO-92 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V 50: 5.0V 52: 5.2V Example: AIC1734-18PXATR  1.8V Version, in Lead Free SOT-89 Package & Reel Packing Type 3 SOT-23(U) TOP VIEW 1: GND 2: VOUT 3: VIN 1 SOT-89(XA) TOP VIEW 1: GND 2. VIN 3. VOUT SOT-89(XT) TOP VIEW 1: VOUT 2. GND 3. VIN TO-92(ZTBG) TOP VIEW 1: GND 2. VIN 3. VOUT Package & Reel Packing Type 1 2 3 1 2 3 1 2 3 1 23 * Straight lead option available in bag packing type only. * Refer to physical dimensions for lead pitch. TO-92(ZTTR) TOP VIEW 1: GND 2. VIN 3. VOUT 1 2 3 AIC1734-18GUTR  1.8V Version, in Green SOT-23 2 1 2 3 * Formed lead option available in reel packing type. * Refer to physical dimensions for lead pitch. TO-92(ZLBG) TOP VIEW 1: VIN 2. GND 3. VOUT 1 2 3 1 23 * Straight lead option available in bag packing type only. * Refer to physical dimensions for lead pitch. TO-92(ZLTR) TOP VIEW 1: VIN 2. GND 3. VOUT 1 2 3 1 2 3 * Formed lead option available in reel packing type. * Refer to physical dimensions for lead pitch. 2 AIC1734    SOT-23 MARKING Part No. PU AIC1734-18XU GU Part No. PU GU CD18P CD18G AIC1734-35XU CD35P CD35G AIC1734-20XU CD20P CD20G AIC1734-37XU CD37P CD37G AIC1734-25XU CD25P CD25G AIC1734-38XU CD38P CD38G AIC1734-27XU CD27P CD27G AIC1734-50XU CD50P CD50G AIC1734-30XU CD30P CD30G AIC1734-52XU CD52P CD52G AIC1734-33XU CD33P CD33G SOT-89 MARKING Part No. PXA GXA Part No. PXT GXT AIC1734-18XXA CA18P CA18G AIC1734-18XXT CB18P CB18G AIC1734-20XXA CA20P CA20G AIC1734-20XXT CB20P CB20G AIC1734-25XXA CA25P CA25G AIC1734-25XXT CB25P CB25G AIC1734-27XXA CA27P CA27G AIC1734-27XXT CB27P CB27G AIC1734-30XXA CA30P CA30G AIC1734-30XXT CB30P CB30G AIC1734-33XXA CA33P CA33G AIC1734-33XXT CB33P CB33G AIC1734-35XXA CA35P CA35G AIC1734-35XXT CB35P CB35G AIC1734-37XXA CA37P CA37G AIC1734-37XXT CB37P CB37G AIC1734-38XXA CA38P CA38G AIC1734-38XXT CB38P CB38G AIC1734-50XXA CA50P CA50G AIC1734-50XXT CB50P CB50G AIC1734-52XXA CA52P CA52G AIC1734-52XXT CB52P CB52G ABSOLUTE MAXIMUM RATINGS Input Supply Voltage -0.3 ~12V Operating Temperature Range -40C~ 85C Storage Temperature Range Maximum Junction Temperature -65C~150C 150C 260C Lead Temperature (Soldering 10 sec.) Thermal Resistance Junction to Case SOT-89 Package 100C/W TO-92 Package 120C/W SOT-23 Package 130C/W Thermal Resistance Junction to Ambient SOT-89 Package 160C/W (Assume no Ambient Airflow, no Heatsink) TO-92 Package 150C/W SOT-23 Package 180C/W Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.  TEST CIRCUIT Refer to the TYPICAL APPLICATION CIRCUIT 3 AIC1734  ELECTRICAL CHARACTERISTICS (TA=25C, CIN=1F, COUT=1F, unless otherwise specified.) (Note2) PARAMETER TEST CONDITIONS Output Voltage No Load AIC1734-52 AIC1734-50 AIC1734-38 AIC1734-37 AIC1734-35 AIC1734-33 AIC1734-30 AIC1734-27 AIC1734-25 AIC1734-20 AIC1734-18 Output Voltage Temperature Coefficiency (Note 3) Line Regulation Load Regulation (Note 4) Current Limit (Note 5) Dropout Voltage (Note 6) VIN=5.5~12V VIN=5.5~12V VIN=4.1~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V VIN=4.0~12V TYP. MAX. UNIT 5.100 4.900 3.725 3.625 3.430 3.235 2.940 2.646 2.450 1.960 1.764 5.200 5.000 3.800 3.700 3.500 3.300 3.000 2.700 2.500 2.000 1.800 5.300 5.100 3.875 3.775 3.570 3.365 3.060 2.754 2.550 2.040 1.836 V 50 IL=1mA, 1.4VVOUT3.2V 3.3VVOUT5.2V IL=0.1~300mA 1.4VVOUT3.9V 4.0VVOUT5.2V PPM/C VIN=4V~12V VIN=5.5V~12V 3 3 10 10 mV VIN=5V VIN=7V 7 15 20 40 mV VIN=7V, VOUT=0V IL=300mA MIN. 4.0VVOUT5.2V 3.0VVOUT3.9V 2.5VVOUT2.9V 2.0VVOUT2.4V 1.4VVOUT1.9V 300 mA 400 470 570 800 1260 500 570 670 900 1360 mV IO=0.1mA~IMAX Ground Current 1.4VVOUT3.9V VIN=5~12V 55 80 A 4.0VVOUT5.2V VIN=7~12V 55 80 Note 1: To avoid output oscillation, aluminum electrolytic output capacitor is recommended and ceramic capacitor is not suggested. Note 2: Specifications are production tested at TA=25C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 3: Guaranteed by design. Note 4: Regulation is measured at constant junction temperature, using pulse testing with a low ON time. Note 5: Current limit is measured by pulsing a short time. Note 6: Dropout voltage is defined as the input to output differential at which the output voltage drops 100mV. 4 AIC1734  TYPICAL PERFORMANCE CHARACTERISTICS 5.40 3.50 AIC1734-52 5.30 3.40 5.25 3.35 5.20 5.15 3.30 3.25 5.10 3.20 5.05 3.15 5.00 -50 -30 AIC1734-33 3.45 V OUT (V) V OUT (V) 5.35 -10 10 30 50 70 3.10 -50 90 -30 -10 Temperature (C) Fig. 1 Fig. 2 VOUT vs. Temperature AIC1734-18 50 70 90 VOUT vs. Temperature AIC1734-52 Ground Current (A) 1.95 VOUT (V) 30 50 2.00 1.90 1.85 1.80 1.75 1.70 48 ILOAD=300mA 46 44 42 ILOAD=100mA 40 1.65 1.60 -40 -20 20 0 40 60 80 Fig. 4 44 44 42 ILOAD=100mA 40 Ground Current (A) AIC1734-33 ILOAD=300mA 42 38 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (C) Fig. 5 Ground Current vs. Temperature 10 20 30 40 50 60 70 80 90 Ground Current vs. Temperature AIC1734-18 ILOAD = 300mA 40 38 36 ILOAD= 0mA 0 Temperature (C) 48 46 ILOAD= 0mA 38 -40 -30 -20 -10 100 Temperature (C) Fig 3 VOUT vs. Temperature Ground Current (A) 10 Temperature (C) ILOAD =100mA ILOAD =0mA 34 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 Temperature (C) Fig. 6 Ground Current vs. Temperature 5 AIC1734 TYPICAL PERFORMANCE CHARACTERISTIC AIC1734-33 50 50 Ground Current (A) Ground Current (A) AIC1734-52 40 30 20 40 30 20 10 10 0 (Continued) 60 60 0 1 2 3 4 5 6 7 8 9 10 11 0 12 0 1 2 3 4 VIN (V) Fig. 7 Ground Current vs. VIN Fig. 8 AIC1734-18 6 7 8 9 10 11 12 Ground Current vs. VIN AIC1734-52 450 50 T= 80C 400 VDROP (mV) Ground Current (A) 5 VIN (V) 500 60 40 30 20 350 T= 50C 300 250 T= 20C 200 T=-40C 150 100 10 50 0 0 1 2 3 4 5 6 7 8 9 10 11 00 12 1000 T= 80C VDROP (V) T= 20C 200 200 250 300 350 400 VDROP vs. ILOAD T=20C T=-40C 900 T= 50C 300 150 AIC1734-18 AIC1734-33 400 100 Fig. 10 600 500 50 ILOAD (mA) VIN (V) Fig. 9 Ground Current vs. VIN VDROP (mV)  T=50C 800 T=80C 700 600 T=-40C 100 500 0 0 50 100 150 200 250 300 ILOAD (mA) Fig. 11 VDROP vs. ILOAD 350 400 400 0 50 100 150 200 250 300 350 400 ILOAD (mA) Fig. 12 VDROP vs. ILOAD 6 AIC1734  TYPICAL PERFORMANCE CHARACTERISTIC 100 500 490 AIC1734 -18 VIN=5V ; COUT=1uF AIC1734 VIN = 8V 10 470 VIN = 7V 460 ESR(O) Crrent Limit (mA) 480 450 440 1 Stable Region 430 410 400 -40 0.1 VIN = 6V 420 VIN = 5V -20 0 20 40 60 0.01 80 100 Temperature (C) Fig. 13 200 300 IOUT(mA) Current Limit vs. Temperature Fig. 14 Region of Stable COUT ESR vs. Load Current 100 100 AIC1734 -18 VIN=5V ; COUT=10uF AIC1734 -18 VIN=5V ; COUT= 4.7uF 10 10 ESR(O) ESR(O) (Continued) 1 Stable Region 0.1 1 Stable Region 0.1 0.01 0.01 100 200 300 IOUT(mA) Fig. 15 Region of Stable COUT ESR vs. Load Current 100 200 300 IOUT(mA) Fig. 16 Region of Stable COUT ESR vs. Load Current 7 AIC1734  BLOCK DIAGRAM VIN VOUT CURRENT LIMITING ERROR AMP + - + THERMAL SHUTDOWN 1.235V Reference GND  PIN DESCRIPTIONS VOUT PIN - Output pin. GND PIN - Power GND. VIN PIN - Power Supply Input. 8 AIC1734  APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. A 1uF aluminum electrolytic input capacitor with a 1uF aluminum electrolytic output capacitor is recommended. To avoid oscillation, it is recommended to follow the figures of “Region of Stable COUT ESR vs. Load to choose proper capacitor Current” specifications. POWER DISSIPATION The AIC1734 obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. For continuous load condition, maximum rating of junction temperature must not be exceeded. It is important to pay more attention in thermal resistance. It includes junction to case, junction to ambient. The maximum power dissipation of AIC1734 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: (T - TA ) PMAX  J-max Rθ JA Where TJ-max is the maximum allowable junction temperature (125C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function for providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature. 9 AIC1734  PHYSICAL DIMENSIONS (unit: mm)  SOT-23 D A A E E1 e e1 SEE VIEW B WITH PLATING c A A2 b BASE METAL 0.25 A1 SECTION A-A GAUGE PLANE SEATING PLANE L1 VIEW B S Y M B O L θ L Note: 1. Refer to JEDEC MO-178. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. SOT-23 MILLIMETERS MIN. MAX. A 0.95 1.45 A1 0.00 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 e e1 L 1.90 BSC 0.60 0.30 0.60 REF L1 θ 1.70 0.95 BSC 0° 8° 10 AIC1734  SOT-89 D A C L H E D1 e S Y M B O L e1 B1 B SOT-89 MILLIMETERS MIN. MAX. A 1.40 1.60 B 0.44 0.56 B1 0.36 0.48 C 0.35 0.44 D 4.40 4.60 D1 1.50 1.83 E 2.29 2.60 e 1.50 BSC e1 3.00 BSC H 3.94 4.25 L 0.89 1.20 Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 11 AIC1734  TO-92 (Straight lead option available in Bag packing type only) E b S D S Y M B O L TO-92 MILLIMETERS MIN. MAX. A 4.32 5.33 b 0.36 0.47 D 4.45 5.20 E 3.18 4.19 e 2.42 2.66 e1 1.15 1.39 j 3.43 L 12.70 S 2.03 2.66 L A j Note: 1. Refer to JEDEC TO-226. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "A" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. e1 e 12 AIC1734  TO-92 (Formed lead option available in Reel packing) A W B E F P1 P φD e T SYMBOL W A B E F SPEC. 1 8 .0 ± 0 .2 9 .0 ± 0 .2 6 .0 ± 0 .2 0 1 6 .0 ± 0 .5 1 9 .0 ± 0 .5 SYMBOL P P1 D e T SPEC. 1 2 .7 B S C 1 2 .7 B S C 4 .0 ± 0 .2 2 .5 B S C 0 .6 ± 0 .1 Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 13
AIC1734-30GXTTR 价格&库存

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