SCDB

Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™) SCDB Series Push-push type featuring contact protection function with less impact to media cards. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance （Initial） Contact resistance （Initial） Connector contacts Detection switch Standard mount/Reverse mount Push-push type −25℃ to ＋60℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 500mΩ max. 10,000cycles SD Memory Card） （ 12,000cycles Memory StickTM） （ Features ● Applications ● ● ● ● Applicable to three memory card standards - SD Memory Card, Multi Media CardTM and Memory StickTM. Push-push ejection mechanism applied in both card types. Contact point protection to minimize card damage during insertion and ejection. Same insertion and ejection position applied for both cards. ● ● ● ● ● For desktop PCs, notebook PCs and personal digital assistants For home audio equipment (TVs and set top boxes) For audio systems For digital camcorders For digital still cameras For headphone players Typical Specifications Items Applicable media Mounting type Specifications SD Memory Card, MultiMediaCard™, Memory StickTM Surface mounting type Performance Insertion and removal cycle Product Line Media ejection structure Push-push type Reverse mount Mounting system Standard mount Feature Standoff mm） （ 0 Packing system Product No. SCDB1C0105 Drawing No. 1 2 With boss Tray SCDB2A0200 38 Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™) SCDB Series Dimensions No. Standard mount 32.2 31 4.5 No.!0 No.@1 No.!9 0.65 No.!4 No.!3 No.!2 No.!1 No.!0 ø1.5 32.3 27 13.5 1.5×9） （ 16.6 14.15 5.525 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） 10-1 No.!5 No.!6 No.!7 No.!8 No.!9 For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM 46.15 No.@1: Card detect switch 18.7 C （35） ard lock position 8.05 6.25 No.@2 O （1.2） ver travel 28 11 13.45 11.65 10.65 1.55 （Hole） 23.05 23.55 24.55 25.35 2.9 No.@0 ø2 17 19.2 ø1.55 Positioning boss hole 28.5 20.8 18.5 1 （7） No.@2:Common For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ （5） 6.95 No.@3:Ground No.@0:Write protect detect switch No.i No.u No.y No.t No.o No.q No.w No.e No.r No.8 Connector center Card eject travel No.9 Card center 9-1 16 2×8） （ 29.6 33.2 No part mounting Land area No pattern area 21.5 22.5 24.1 27 Reverse mount No.!9 31 No.!0 No.@1 No.@2 2-ø1.5 No.!5 No.!6 No.!7 No.!8 No.!9 32.3 13.5(1.5G9) 10-1 16.6 14.15 5.525 No.!4 No.!3 No.!2 No.!1 No.!0 For CMOS Camera Module 16.4 4.1 46.15 （35） Card inserting 19.7 18.85 17.3 Ground No.5 12.6 12.3 No.@0 0.55 Over travel (1.2) (5) 4.5 Card center Connector center 24.1 22.5 21.5 Card eject travel 2.85 2.25 1.55 (0.35) No.4 6-0.9 Ground No.9 No.1 No.2 No.3 1 4-0.9 No.4 28.6 25.5 24.2 22.9 21.6 20.3 19 （7） (hole) 27 30.8 33.9 Land area 27 PC board surface No part mounting 1.6 3.2 19.65 20.95 22.25 23.55 25.15 No.8 No.7 No.6 No.5 No.@0 2 6.4 8.2 ø1 (h .55 ol e) 28 2 1.55 39 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50