ASM3P2779A

September 2005 rev 3.0 Low Power Peak EMI Reducing Solution Features Generates an EMI optimized clock signal at the output. Integrated loop filter components. Operates with a 3.3 / 2.5V Supply. Operating current less than 4mA. Low power CMOS design. Input frequency range : 13MHz to 30MHz for 2.5V. : 13MHz to 30MHz for 3.3V. Generates a 1X low EMI spread spectrum clock of the input frequency. Frequency deviation: ±1% (Typ) @16MHz Input Frequency. Available in 6-pin TSOT-23, 8-pin SOIC and 8-pin TSSOP packages. ASM3P2779A The ASM3P2779A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. The ASM3P2779A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. Applications The ASM3P2779A is targeted towards all portable devices with very low power requirements like MP3 players and digital still cameras. Product Description The ASM3P2779A is a versatile spread spectrum frequency modulator designed specifically for a wide range of clock frequencies. The ASM3P2779A reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of all clock dependent signals. The ASM3P2779A allows significant system cost savings by reducing the number of circuit board layers ferrite beads, shielding that are traditionally required to pass EMI regulations. Key Specifications Description Supply voltages Cycle-to-Cycle Jitter Output Duty Cycle Modulation Rate Equation Frequency Deviation Specification VDD = 3.3V / 2.5V 200pS (Max) 45/55% FIN/640 ±1% (Typ) @ 16MHz Block Diagram VDD PD Modulation XIN/CLKIN XOUT Crystal Oscillator Frequency Divider Feedback Divider Phase Detector Loop Filter PLL VCO Output Divider ModOUT VSS Alliance Semiconductor 2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. September 2005 rev 3.0 Pin Configuration (6-pin TSOT- 23 Package) ASM3P2779A PD 1 XOUT 2 XIN / CLKIN 3 6 VSS ModOUT VDD ASM3P2779A 5 4 Pin Description Pin# 1 2 3 4 5 6 Pin Name PD XOUT XIN / CLKIN VDD ModOUT VSS Type I O I P O P Description Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. Crystal connection. If using an external reference, this pin must be left unconnected. Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Power supply for the entire chip. Spread spectrum clock output. Ground connection. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 2 of 12 September 2005 rev 3.0 Pin Configuration (8-pin SOIC and TSSOP Packages) ASM3P2779A XIN / CLKIN 1 XOUT 2 PD 3 NC 4 8 7 6 5 VDD NC ModOUT VSS ASM3P2779A Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN/CLKIN XOUT PD NC VSS ModOUT NC VDD Type I O I P O P Description Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Power-down control pin. Pull low to enable power-down mode. Connect to VDD if not used. No connect. Ground connection. Spread spectrum clock output. No connect. Power supply for the entire chip. Modulation Profile Specifications Description Frequency Range For 2.5V Supply For 3.3V Supply Specification 13MHz < CLKIN < 30MHz 13MHz < CLKIN < 30MHz FIN/640 ±1% (Typ) @ 16MHz Modulation Equation Frequency Deviation Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 3 of 12 September 2005 rev 3.0 Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) ASM3P2779A Parameter Rating -0.5 to +7.0 -65 to +125 0 to 70 260 150 2 Unit V °C °C °C °C KV Voltage on any pin with respect to Ground Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics for 2.5V Supply (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input low voltage Input high voltage Input low current Input high current Parameter Min VSS - 0.3 2.0 1.8 2.375 - Typ 3 3 3.0 2.5 50 Max 0.8 VDD + 0.3 -35 35 0.6 10 2.625 5 - Unit V V µA µA mA mA V V uA mA V mS Ω XOUT output low current (@0.5V, VDD=2.5V) XOUT output high current (@1.8V, VDD=2.5V) Output low voltage (VDD = 2.5 V, IOL = 8mA) Output high voltage (VDD = 2.5 V, IOH = 8mA) Static supply current* Dynamic supply current (2.5V, 16MHz and no load) Operating Voltage Power-up time (first locked cycle after power-up)** Output impedance * XIN /CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 2.5V Supply Symbol CLKIN ModOUT fd tLH* tHL* tJC tD Input frequency Output frequency Frequency Deviation Input Frequency = 13MHz Input Frequency = 30MHz Parameter Min 13 13 0.7 0.4 45 Typ ± 1.15 ± 0.6 1.4 0.9 50 Max 30 30 1.8 1.1 200 55 Unit MHz MHz % nS nS pS % Output rise time (measured from 0.7V to 1.7V) Output fall time (measured from 1.7V to 0.7V) Jitter (cycle to cycle) Output duty cycle * tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 4 of 12 September 2005 rev 3.0 DC Electrical Characteristics for 3.3V Supply (Test condition: All parameters are measured at room temperature (+ 25°C) unless otherwise stated) ASM3P2779A Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH IDD ICC VDD tON ZOUT Input low voltage Input high voltage Input low current Input high current Parameter Min VSS - 0.3 2.0 2.5 2.7 - Typ 3 3 3.5 3.3 45 Max 0.8 VDD + 0.3 -35 35 0.4 10 3.6 5 - Unit V V µA µA mA mA V V uA mA V mS Ω XOUT output low current (@0.4V, VDD=3.3V) XOUT output high current (@2.5V, VDD=3.3V) Output low voltage (VDD = 3.3 V, IOL = 8mA) Output high voltage (VDD = 3.3 V, IOH = 8mA) Static supply current* Dynamic supply current (3.3V, 16MHz and no load) Operating Voltage Power-up time (first locked cycle after power-up)** Output impedance * XIN /CLKIN pin and PD pin are pulled low ** VDD and XIN/CLKIN input are stable, PD pin is made high from low. AC Electrical Characteristics for 3.3V Supply Symbol CLKIN ModOUT fd tLH* tHL * tJC tD Input frequency Output frequency Frequency Deviation Input Frequency = 13MHz Input Frequency = 30MHz Parameter Min 13 13 0.5 0.3 45 Typ v ±1.15 ± 0.6 1.1 0.8 50 Max 30 30 1.3 0.9 200 55 Unit MHz MHz % nS nS pS % Output rise time (measured from 0.8 to 2.0V) Output fall time (measured at 2.0V to 0.8V) Jitter (cycle to cycle) Output duty cycle *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 5 of 12 September 2005 rev 3.0 Typical Crystal Oscillator Circuit ASM3P2779A Crystal R1 = 510Ω C1 = 27 pF C2 = 27 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency Frequency tolerance Operating temperature range Storage temperature Load capacitance Shunt capacitance ESR 14.31818MHz ± 50 ppm or better at 25°C -25°C to +85°C -40°C to +85°C 18pF 7pF maximum 25Ω Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 6 of 12 September 2005 rev 3.0 Package Information 6-pin TSOT-23 Package ASM3P2779A Dimensions Symbol Min A A1 A2 b H D B e C L θ 0.00 0.033 0.012 Inches Max 0.04 0.004 0.036 0.02 Millimeters Min Max 1.00 0.00 0.84 0.30 0.127 BSC 2.90 BSC 1.60 BSC 0.950 BSC 2.80 BSC 0.30 0° 0.50 4° 0.10 0.90 0.50 0.005 BSC 0.114 BSC 0.06 BSC 0.0374 BSC 0.11 BSC 0.0118 0° 0.02 4° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 7 of 12 September 2005 rev 3.0 8-Pin SOIC Package ASM3P2779A E H D A2 A θ e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L θ Inches Max 0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 8 of 12 September 2005 rev 3.0 8-Pin TSSOP Package ASM3P2779A H E D A2 A θ e B A1 L C Dimensions Symbol Min A A1 A2 B c D E e H L θ 0.020 0° 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8° 0.50 0° Inches Max 0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30 Millimeters Min Max 1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8° Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 9 of 12 September 2005 rev 3.0 Ordering Information Part Number ASM3P2779AF-06OR ASM3P2779AF-08TT ASM3P2779AF-08TR ASM3P2779AF-08ST ASM3P2779AF-08SR ASM3P2779AG-06OR ASM3P2779AG-08TT ASM3P2779AG-08TR ASM3P2779AG-08ST ASM3P2779AG-08SR ASM3P2779A-06OR ASM3P2779A-08TT ASM3P2779A-08TR ASM3P2779A-08ST ASM3P2779A-08SR ASM3I2779AF-06OR ASM3I2779AF-08TT ASM3I2779AF-08TR ASM3I2779AF-08ST ASM3I2779AF-08SR ASM3I2779AG-06OR ASM3I2779AG-08TT ASM3I2779AG-08TR ASM3I2779AG-08ST ASM3I2779AG-08SR ASM3I2779A-06OR ASM3I2779A-08TT ASM3I2779A-08TR ASM3I2779A-08ST ASM3I2779A-08SR ASM3P2779A Marking A4LL 3P2779AF 3P2779AF 3P2779AF 3P2779AF A3LL 3P2779AG 3P2779AG 3P2779AG 3P2779AG A1LL 3P2779A 3P2779A 3P2779A 3P2779A A5LL 3I2779AF 3I2779AF 3I2779AF 3I2779AF A6LL 3I2779AG 3I2779AG 3I2779AG 3I2779AG A2LL 3I2779A 3I2779A 3I2779A 3I2779A Package Type 6-Pin TSOT-23, TAPE & REEL, Pb Free 8-Pin TSSOP, TUBE, Pb Free 8-Pin TSSOP, TAPE & REEL, Pb Free 8-Pin SOIC, TUBE, Pb Free 8-Pin SOIC, TAPE & REEL, Pb Free 6-Pin TSOT-23, TAPE & REEL, Green 8-Pin TSSOP, TUBE, Green 8-Pin TSSOP, TAPE & REEL, Green 8-Pin SOIC, TUBE, Green 8-Pin SOIC, TAPE & REEL, Green 6-Pin TSOT-23, TAPE & REEL 8-Pin TSSOP, TUBE 8-Pin TSSOP, TAPE & REEL 8-Pin SOIC, TUBE 8-Pin SOIC, TAPE & REEL 6-Pin TSOT-23, TAPE & REEL, Pb Free 8-Pin TSSOP, TUBE, Pb Free 8-Pin TSSOP, TAPE & REEL, Pb Free 8-Pin SOIC, TUBE, Pb Free 8-Pin SOIC, TAPE & REEL, Pb Free 6-Pin TSOT-23, TAPE & REEL, Green 8-Pin TSSOP, TUBE, Green 8-Pin TSSOP, TAPE & REEL, Green 8-Pin SOIC, TUBE, Green 8-Pin SOIC, TAPE & REEL, Green 6-Pin TSOT-23, TAPE & REEL 8-Pin TSSOP, TUBE 8-Pin TSSOP, TAPE & REEL 8-Pin SOIC, TUBE 8-Pin SOIC, TAPE & REEL Temperature Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 10 of 12 September 2005 rev 3.0 Device Ordering Information ASM3P2779A ASM3P2779AF-08TR R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under U.S Patent Nos 5,488,627 and 5,631,921 Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 11 of 12 September 2005 rev 3.0 ASM3P2779A Alliance Semiconductor Corporation 2575 Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P2779A Document Version: v3.0 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. 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Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Low Power Peak EMI Reducing Solution Notice: The information in this document is subject to change without notice. 12 of 12