A29001UV-90

A29001/290011 Series 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory Document Title 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory Revision History Rev. No. 0.0 0.1 0.2 0.3 0.4 1.0 1.1 1.2 1.3 History Initial issue Change ILIT from 50µA to 100µA Change typical byte programming time from 7µs to 35µs Erase VCC supply voltage for ± 5% devices in Operation Ranges Add the time limit tWPH max. = 50µs of command cycle sequence Correct the Continuation ID command to hexadecimal Error Correction: P.8: Autoselect Command Sequence (line 15), XX11h → XX03h Final version release Add 32Pin Pb-Free TSOP package type for A290011UV-70(U)F & A290011TV-70(U)F Add Pb-Free package type for all parts Add sTSOP package type. Issue Date October 19, 2000 January 3, 2001 February 6, 2001 August 21, 2001 December 24, 2002 October 7, 2003 February 16, 2004 August 5, 2004 December 1, 2004 Remark Preliminary Final (December, 2004, Version 1.3) AMIC Technology, Corp. A29001/290011 Series 128K X 8 Bit CMOS 5.0 Volt-only, Boot Sector Flash Memory Features 5.0V ± 10% for read and write operations Access times: - 55/70/90 (max.) Current: - 20 mA typical active read current - 30 mA typical program/erase current - 1 µA typical CMOS standby Flexible sector architecture - 8 Kbyte/ 4 KbyteX2/ 16 Kbyte/ 32 KbyteX3 sectors - Any combination of sectors can be erased - Supports full chip erase - Sector protection: A hardware method of protecting sectors to prevent any inadvertent program or erase operations within that sector Top or bottom boot block configurations available Embedded Erase Algorithms - Embedded Erase algorithm will automatically erase the entire chip or any combination of designated sectors and verify the erased sectors - Embedded Program algorithm automatically writes and verifies bytes at specified addresses Typical 100,000 program/erase cycles per sector 20-year data retention at 125°C - Reliable operation for the life of the system Compatible with JEDEC-standards - Pinout and software compatible with single-powersupply Flash memory standard - Superior inadvertent write protection Data Polling and toggle bits - Provides a software method of detecting completion of program or erase operations Erase Suspend/Erase Resume - Suspends a sector erase operation to read data from, or program data to, a non-erasing sector, then resumes the erase operation Hardware reset pin ( RESET ) - Hardware method to reset the device to reading array data (not available on A290011) Industrial operating temperature range: -40°C to +85°C for – U Package options: 32-pin P-DIP, PLCC, TSOP or sTSOP (Forward type) General Description The A29001 is a 5.0 volt-only Flash memory organized as 131,072 bytes of 8 bits each. The A29001 offers the RESET function, but it is not available on A290011. The 128 Kbytes of data are further divided into seven sectors for flexible sector erase capability. The 8 bits of data appear on I/O0 - I/O7 while the addresses are input on A0 to A16. The A29001 is offered in 32-pin PLCC, TSOP, sTSOP and PDIP packages. This device is designed to be programmed insystem with the standard system 5.0 volt VCC supply. Additional 12.0 volt VPP is not required for in-system write or erase operations. However, the A29001 can also be programmed in standard EPROM programmers. The A29001 has the first toggle bit, I/O6, which indicates whether an Embedded Program or Erase is in progress, or it is in the Erase Suspend. Besides the I/O6 toggle bit, the A29001 has a second toggle bit, I/O2, to indicate whether the addressed sector is being selected for erase. The A29001 also offers the ability to program in the Erase Suspend mode. The standard A29001 offers access times of 55, 70 and 90 ns allowing high-speed microprocessors to operate without wait states. To eliminate bus contention the device has separate chip enable ( CE ), write enable ( WE ) and output enable ( OE ) controls. The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. The A29001 is entirely software command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by writing the proper program command sequence. This initiates the Embedded Program algorithm - an internal algorithm that automatically times the program pulse widths and verifies proper program margin. Device erasure occurs by executing the proper erase command sequence. This initiates the Embedded Erase algorithm - an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper erase margin. The host system can detect whether a program or erase operation is complete by reading the I/O7 ( Data Polling) and I/O6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. (December, 2004, Version 1.3) 1 AMIC Technology, Corp. A29001/A290011 Series The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The A29001 is fully erased when shipped from the factory. The hardware sector protection feature disables operations f o r b o t h p r o g r a m a nd erase in any c ombination of the sectors of memory. This can be achieved via programming equipment. The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any other sector that is not selected for erasure. True background erase can thus be achieved. Power consumption is greatly reduced when the device is placed in the standby mode. The hardware RESET pin terminates any operation in progress and resets the internal state machine to reading array data (This feature is not available on the A290011). Pin Configurations DIP PLCC NC on A290011 1 2 3 4 VCC WE NC 4 3 2 1 32 RESET NC on A290011 A15 VCC A12 A16 WE 31 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 VSS 31 30 29 A14 A13 A8 A9 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 5 6 7 8 9 10 11 12 13 30 NC RESET 32 A29001/A290011 5 6 7 8 9 10 11 12 13 14 15 16 28 27 26 25 24 23 22 21 20 19 18 17 29 28 27 A14 A13 A8 A9 A11 OE A10 CE I/O7 A29001L/ A290011L 26 25 24 23 22 21 14 15 16 17 18 19 I/O5 VSS I/O1 I/O2 I/O3 I/O4 I/O3 TSOP/sTSOP (Forw ard type) A11 A9 A8 A13 A14 NC WE VCC RESET A16 A15 NC on A290011 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 VSS I/O2 I/O1 I/O0 A0 A1 A2 A3 A29001V/A290011V A29001X/A290011X (December, 2004, Version 1.3) 2 AMIC Technology, Corp. I/O6 20 A29001/A290011 Series Block Diagram I/O0 - I/O7 VCC VSS Erase Voltage Generator Input/Output Buffers WE RESET (N/A A290011) State Control PGM Voltage Generator Chip Enable Output Enable Logic STB Data Latch Command Register CE OE Y-Decoder Address Latch STB VCC Detector Timer Y-Gating X-decoder Cell Matrix A0-A16 Pin Descriptions Pin No. A0 - A16 I/O0 - I/O7 Description Address Inputs Data Inputs/Outputs Chip Enable Write Enable Output Enable Hardware Reset (N/A A290011) Ground Power Supply CE WE OE RESET VSS VCC (December, 2004, Version 1.3) 3 AMIC Technology, Corp. A29001/A290011 Series Absolute Maximum Ratings* Ambient Operating Temperature . . . . .-55°C to + 125°C Storage Temperature . . . . . . . . . . . . . . .-65°C to + 150°C Ground to VCC . . . . . . . . . . . . . . . . . . . .. . . -2.0V to 7.0V Output Voltage (Note 1) . . . . . . . . . . . . ……-2.0V to 7.0V A9, OE & RESET (Note 2) . . . . . . . . . . . -2.0V to 12.5V All other pins (Note 1) . . . . . . . . . . . . . . . . ..-2.0V to 7.0V Output Short Circuit Current (Note 3) . .. . . . . . . . 200mA *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of these specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. Notes: 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot VSS to -2.0V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is VCC +0.5V. During voltage transitions, outputs may overshoot to VCC +2.0V for periods up to 20ns. 2. Minimum DC input voltage on A9 pins is -0.5V. During voltage transitions, A9, OE and RESET may overshoot VSS to -2.0V for periods of up to 20ns. Maximum DC input voltage on A9 and OE is +12.5V which may overshoot to 13.5V for periods up to 20ns. ( RESET is N/A on A290011) 3. No more than one output is shorted at a time. Duration of the short circuit should not be greater than one second. Operating Ranges Commercial (C) Devices Ambient Temperature (TA) . . . . . . . . . . . . . .0°C to +70°C Extended Range Devices Ambient Temperature (TA) . . . . . . . . . . . . -40°C to +85°C VCC Supply Voltages VCC for ± 10% devices . . . . . . . . . . . . . . +4.5V to +5.5V Operating ranges define those limits between which the functionally of the device is guaranteed. Device Bus Operations This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the commands, along with the address and data information needed to execute the command. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The appropriate device bus operations table lists the inputs and control levels required, and the resulting output. The following subsections describe each of these operations in further detail. Table 1. A29001/A290011 Device Bus Operations Operation CE L L VCC ± 0.5 V H L X X OE L H X X H X X WE H L X X H X X RESET (N/A A290011) H H VCC ± 0.5 V VCC ± 0.5 V H L VID A0 – A16 I/O0 - I/O7 Read Write CMOS Standby TTL Standby Output Disable Reset Temporary Sector Unprotect (Note) AIN AIN X X X X X DOUT DIN High-Z High-Z High-Z High-Z X Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In Note: 1. See the "Sector Protection/Unprotection" section and Temporary Sector Unprotect for more information. 2. This function is not available on A290011. (December, 2004, Version 1.3) 4 AMIC Technology, Corp. A29001/A290011 Series Requirements for Reading Array Data To read array data from the outputs, the system must drive the CE and OE pins to VIL. CE is the power control and selects the device. OE is the output control and gates array data to the output pins. WE should remain at VIH all the time during read operation. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered. See "Reading Array Data" for more information. Refer to the AC Read Operations table for timing specifications and to the Read Operations Timings diagram for the timing waveforms, lCC1 in the DC Characteristics table represents the active current specification for reading array data. Standby Mode When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE input. The device enters the CMOS standby mode when the CE & RESET pins ( CE only on A290011) are both held at VCC ± 0.5V. (Note that this is a more restricted voltage range than VIH.) The device enters the TTL standby mode when CE is held at VIH, while RESET (Not available on A290011) is held at VCC±0.5V. The device requires the standard access time (tCE) before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3 in the DC Characteristics tables represents the standby current specification. Output Disable Mode When the OE input is at VIH, output from the device is disabled. The output pins are placed in the high impedance state. Writing Commands/Command Sequences To write a command or command sequence (which includes programming data to the device and erasing sectors of memory), the system must drive WE and CE to VIL, and OE to VIH. An erase operation can erase one sector, multiple sectors, or the entire device. The Sector Address Tables indicate the address range that each sector occupies. A "sector address" consists of the address inputs required to uniquely select a sector. See the "Command Definitions" section for details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on I/O7 - I/O0. Standard read cycle timings apply in this mode. Refer to the "Autoselect Mode" and "Autoselect Command Sequence" sections for more information. ICC2 in the Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification tables and timing diagrams for write operations. RESET : Hardware Reset Pin (N/A on A290011) The RESET pin provides a hardware method of resetting the device to reading array data. When the system drives the RESET pin low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity. The RESET pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. Refer to the AC Characteristics tables for RESET parameters and diagram. Program and Erase Operation Status During an erase or program operation, the system may check the status of the operation by reading the status bits on I/O7 - I/O0. Standard read cycle timings and ICC read specifications apply. Refer to "Write Operation Status" for more information, and to each AC Characteristics section for timing diagrams. (December, 2004, Version 1.3) 5 AMIC Technology, Corp. A29001/A290011 Series Table 2. A29001/A290011 Top Boot Block Sector Address Table Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 A16 0 0 1 1 1 1 1 A15 0 1 0 1 1 1 1 A14 X X X 0 1 1 1 A13 X X X X 0 0 1 A12 X X X X 0 1 X Sector Size (Kbytes) 32 32 32 16 4 4 8 Address Range 00000h - 07FFFh 08000h - 0FFFFh 10000h - 17FFFh 18000h - 1BFFFh 1C000h - 1CFFFh 1D000h - 1DFFFh 1E000h - 1FFFFh Table 3. A29001/A290011 Bottom Boot Block Sector Address Table Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 A16 0 0 0 0 0 1 1 A15 0 0 0 0 1 0 1 A14 0 0 0 1 X X X A13 0 1 1 X X X X A12 X 0 1 X X X X Sector Size (Kbytes) 8 4 4 16 32 32 32 Address Range 00000h - 01FFFh 02000h - 02FFFh 03000h - 03FFFh 04000h - 07FFFh 08000h - 0FFFFh 10000h - 17FFFh 18000h - 1FFFFh Autoselect Mode The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on I/O7 - I/O0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register. When using programming equipment, the autoselect mode requires VID (11.5V to 12.5 V) on address pinA9. Address pins A6, A1, and AO must be as shown in Autoselect Codes (High Voltage Method) table. In addition, when verifying sector protection, the sector address must appear on the appropriate highest order address bits. Refer to the corresponding Sector Address Tables. The Command Definitions table shows the remaining address bits that are don't care. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on I/O7 - I/O0.To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the Command Definitions table. This method does not require VID. See "Command Definitions" for details on using the autoselect mode. Table 4. A29001/A290011 Autoselect Codes (High Voltage Method) Description Manufacturer ID: AMIC Device ID: A29001/ A290011 Sector Protection Verification Continuation ID A16 - A12 A11 - A10 X X Sector Address X X VID X VIL X VIH VIH X X X A9 VID VID VID A8 - A7 X X X A6 VIL VIL VIL A5 - A2 X X X A1 VIL VIL VIH A0 VIL VIH VIL Identifier Code on I/O7 - I/O0 37h Top Boot Block: A1h Bottom Boot Block: 4Ch 01h (protected) 00h (unprotected) 7Fh Note: CE =VIL, OE =VIL and WE =VIH when Autoselect Mode (December, 2004, Version 1.3) 6 AMIC Technology, Corp. A29001/A290011 Series Sector Protection/Unprotection The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors. Sector protection/unprotection must be implemented using programming equipment. The procedure requires a high voltage (VID) on address pin A9 and the control pins. The device is shipped with all sectors unprotected. It is possible to determine whether a sector is protected or unprotected. See "Autoselect Mode" for details. START RESET = VID (Note 1) Hardw are Data Protection The requirement of command unlocking sequence for programming or erasing provides data protection against inadvertent writes (refer to the Command Definitions table). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up transitions, or from system noise. The device is powered up to read array data to avoid accidentally writing data to the array. Perform Erase or Program Operations RESET = VIH Write Pulse "Glitch" Protection Noise pulses of less than 5ns (typical) on OE , CE or WE do not initiate a write cycle. Temporary Sector Unprotect Completed (Note 2) Logical Inhibit Write cycles are inhibited by holding any one of OE =VIL, CE = VIH or WE = VIH. To initiate a write cycle, CE and WE must be a logical zero while OE is a logical one. Pow er-Up Write Inhibit If WE = CE = VIL and OE = VIH during power up, the device does not accept commands on the rising edge of WE . The internal state machine is automatically reset to reading array data on the initial power-up. Notes: 1. All protected sectors unprotected. 2. All previously protected sectors are protected once again. Figure 1. Temporary Sector Unprotect Operation Temporary Sector Unprotect (N/A A290011) This feature allows temporary unprotection of previous protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET pin to VID. During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once VID is removed from the RESET pin, all the previously protected sectors are protected again. Figure 1 shows the algorithm, and the Temporary Sector Unprotect diagram shows the timing waveforms, for this feature. (December, 2004, Version 1.3) 7 AMIC Technology, Corp. A29001/A290011 Series Command Definitions Writing specific address and data commands or sequences into the command register initiates device operations. The Command Definitions table defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. All addresses are latched on the falling edge of WE or CE , whichever happens later. All data is latched on the rising edge of WE or CE , whichever happens first. Refer to the appropriate timing diagrams in the "AC Characteristics" section. Autoselect Command Sequence The autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. The Command Definitions table shows the address and data requirements. This method is an alternative to that shown in the Autoselect Codes (High Voltage Method) table, which is intended for PROM programmers and requires VID on address bit A9. The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. A read cycle at address XX00h retrieves the manufacturer code and another read cycle at XX03h retrieves the continuation code. A read cycle at address XX01h returns the device code. A read cycle containing a sector address (SA) and the address 02h in returns 01h if that sector is protected, or 00h if it is unprotected. Refer to the Sector Address tables for valid sector addresses. The system must write the reset command to exit the autoselect mode and return to reading array data. Reading Array Data The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erasesuspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See "Erase Suspend/Erase Resume Commands" for more information on this mode. The system must issue the reset command to re-enable the device for reading array data if I/O5 goes high, or while in the autoselect mode. See the "Reset Command" section, next. See also "Requirements for Reading Array Data" in the "Device Bus Operations" section for more information. The Read Operations table provides the read parameters, and Read Operation Timings diagram shows the timing diagram. Byte Program Command Sequence Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verify the programmed cell margin. The Command Definitions table shows the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using I/O7 or I/O6. See "Write Operation Status" for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a "0" back to a "1 ". Attempting to do so may halt the operation and set I/O5 to "1", or cause the Data Polling algorithm to indicate the operation was successful. However, a succeeding read will show that the data is still "0". Only erase operations can convert a "0" to a "1". Reset Command Writing the reset command to the device resets the device to reading array data. Address bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during Erase Suspend). If I/O5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend). (December, 2004, Version 1.3) 8 AMIC Technology, Corp. A29001/A290011 Series Figure 3 illustrates the algorithm for the erase operation. See the Erase/Program Operations tables in "AC Characteristics" for parameters, and to the Chip/Sector Erase Operation Timings for timing waveforms. START Sector Erase Command Sequence Write Program Command Sequence Embedded Program algorithm in progress Data Poll from System Verify Data ? No Yes Increment Address Last Address ? Yes Programming Completed Note : See the appropriate Command Definitions table for program command sequence. Figure 2. Program Operation Chip Erase Command Sequence Chip erase is a six-bus-cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. The Command Definitions table shows the address and data requirements for the chip erase command sequence. Any commands written to the chip during the Embedded Erase algorithm are ignored. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. See "Write Operation Status" for information on these status bits. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. (December, 2004, Version 1.3) 9 Sector erase is a six-bus-cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the address of the sector to be erased, and the sector erase command. The Command Definitions table shows the address and data requirements for the sector erase command sequence. The device does not require the system to preprogram the memory prior to erase. The Embedded Erase algorithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. After the command sequence is written, a sector erase time-out of 50µs begins. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50µs, otherwise the last address and command might not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be reenabled after the last Sector Erase command is written. If the time between additional sector erase commands can be assumed to be less than 50µs, the system need not monitor I/O3. Any command other than Sector Erase or Erase Suspend during the time-out period resets the device to reading array data. The system must rewrite the command sequence and any additional sector addresses and commands. The system can monitor I/O3 to determine if the sector erase timer has timed out. (See the " I/O3: Sector Erase Timer" section.) The time-out begins from the rising edge of the final WE pulse in the command sequence. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. Refer to "Write Operation Status" for information on these status bits. Figure 3 illustrates the algorithm for the erase operation. Refer to the Erase/Program Operations tables in the "AC Characteristics" section for parameters, and to the Sector Erase Operations Timing diagram for timing waveforms. Erase Suspend/Erase Resume Commands The Erase Suspend command allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation, including the 50µs time-out period during the sector erase command sequence. The Erase Suspend AMIC Technology, Corp. A29001/A290011 Series command is ignored if written during the chip erase operation or Embedded Program algorithm. Writing the Erase Suspend command during the Sector Erase timeout immediately terminates the time-out period and suspends the erase operation. Addresses are "don't cares" when writing the Erase Suspend command. When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (The device "erase suspends" all sectors selected for erasure.) Normal read and write timings and command definitions apply. Reading at any address within erase-suspended sectors produces status data on I/O7 - I/O0. The system can use I/O7, or I/O6 and I/O2 together, to determine if a sector is actively erasing or is erase-suspended. See "Write Operation Status" for information on these status bits. After an erase-suspended program operation is complete, the system can once again read array data within nonsuspended sectors. The system can determine the status of the program operation using the I/O7 or I/O6 status bits, just as in the standard program operation. See "Write Operation Status" for more information. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. The device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation. See "Autoselect Command Sequence" for more information. The system must write the Erase Resume command (address bits are "don't care") to exit the erase suspend mode and continue the sector erase operation. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the device has resumed erasing. START Write Erase Command Sequence Data Poll from System Embedded Erase algorithm in progress No Data = FFh ? Yes Erasure Completed Note : 1. See the appropriate Command Definitions table for erase command sequences. 2. See "I/O3 : Sector Erase Timer" for more information. Figure 3. Erase Operation (December, 2004, Version 1.3) 10 AMIC Technology, Corp. A29001/A290011 Series Table 5. A29001/A290011 Command Definitions Command Cycles Sequence (Note 1) Read (Note 5) Reset (Note 6) Autoselect Manufacturer ID (Note 7) Device ID Top Bottom Continuation ID 4 555 555 AA AA 2AA 2AA 55 55 555 555 90 90 X03 SA X02 4 6 6 1 1 555 555 555 XXX XXX AA AA AA B0 30 2AA 2AA 2AA 55 55 55 555 555 555 A0 80 80 PA 555 555 First Addr Data RA XXX 555 555 RD F0 AA AA 2AA 2AA 55 55 555 555 90 90 X00 X01 37 A1 4C 7F 00 01 PD AA AA 2AA 2AA 55 55 555 SA 10 30 Second Addr Data Bus Cycles (Notes 2 - 4) Third Fourth Fifth Sixth Addr Data Addr Data Addr Data Addr Data 1 1 4 4 Sector Protect Verify 4 (Note 8) Program Chip Erase Sector Erase Erase Suspend (Note 9) Erase Resume (Note 10) Legend: X = Don't care RA = Address of the memory location to be read. RD = Data read from location RA during read operation. PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the WE or CE pulse, whichever happens later. PD = Data to be programmed at location PA. Data latches on the rising edge of WE or CE pulse, whichever happens first. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A16 - A12 select a unique sector. Note: 1. See Table 1 for description of bus operations. 2. All values are in hexadecimal. 3. Except when reading array or autoselect data, all bus cycles are write operation. 4. Address bits A16 - A12 are don't cares for unlock and command cycles, unless SA or PA required. 5. No unlock or command cycles required when reading array data. 6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high (while the device is providing status data). 7. The fourth cycle of the autoselect command sequence is a read cycle. 8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more information. 9. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode. 10. The Erase Resume command is valid only during the Erase Suspend mode. 11. The time between each command cycle has to be less than 50µs. (December, 2004, Version 1.3) 11 AMIC Technology, Corp. A29001/A290011 Series Write Operation Status Several bits, I/O2, I/O3, I/O5, I/O6, and I/O7, are provided in the A29001/A290011 to determine the status of a write operation. Table 6 and the following subsections describe the functions of these status bits. I/O7, I/O6 and I/O2 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first. START Read I/O7-I/O0 Address = VA I/O7: Data Polling The Data Polling bit, I/O7, indicates to the host system whether an Embedded Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data Polling is valid after the rising edge of the final WE pulse in the program or erase command sequence. During the Embedded Program algorithm, the device outputs on I/O7 the complement of the datum programmed to I/O7. This I/O7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to I/O7. The system must provide the program address to read valid status information on I/O7. If a program address falls within a protected sector, Data Polling on I/O7 is active for approximately 2µs, then the device returns to reading array data. During the Embedded Erase algorithm, Data Polling produces a "0" on I/O7. When the Embedded Erase algorithm is complete, or if the device enters the Erase Suspend mode, Data Polling produces a "1" on I/O7.This is analogous to the complement/true datum output described for the Embedded Program algorithm: the erase function changes all the bits in a sector to "1"; prior to this, the device outputs the "complement," or "0." The system must provide an address within any of the sectors selected for erasure to read valid status information on I/O7. After an erase command sequence is written, if all sectors selected for erasing are protected, Data Polling on I/O7 is active for approximately 100µs, then the device returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. When the system detects I/O7 has changed from the complement to true data, it can read valid data at I/O7 I/O0 on the following read cycles. This is because I/O7 may change asynchronously with I/O0 - I/O6 while Output Enable ( OE ) is asserted low. The Data Polling Timings (During Embedded Algorithms) figure in the "AC Characteristics" section illustrates this. Table 6 shows the outputs for Data Polling on I/O7. Figure 4 shows the Data Polling algorithm. Yes I/O7 = Data ? No No I/O5 = 1? Yes Read I/O7 - I/O0 Address = VA Yes I/O7 = Data ? No FAIL PASS Note : 1. VA = Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for erasure. During chip erase, a valid address is any non-protected sector address. 2. I/O7 should be rechecked even if I/O5 = "1" because I/O7 may change simultaneously with I/O . 5 Figure 4. Data Polling Algorithm (December, 2004, Version 1.3) 12 AMIC Technology, Corp. A29001/A290011 Series I/O6: Toggle Bit I Toggle Bit I on I/O6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause I/O6 to toggle. (The system may use either OE or CE to control the read cycles.) When the operation is complete, I/O6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, I/O6 toggles for approximately 100µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use I/O6 and I/O2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), I/O6 toggles. When the device enters the Erase Suspend mode, I/O6 stops toggling. However, the system must also use I/O2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use I/O7 (see the subsection on " I/O7 : Data Polling"). If a program address falls within a protected sector, I/O6 toggles for approximately 2µs after the program command sequence is written, then returns to reading array data. I/O6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. The Write Operation Status table shows the outputs for Toggle Bit I on I/O6. Refer to Figure 5 for the toggle bit algorithm, and to the Toggle Bit Timings figure in the "AC Characteristics" section for the timing diagram. The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form. See also the subsection on " I/O2: Toggle Bit II". The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form. Reading Toggle Bits I/O6, I/O2 Refer to Figure 5 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read I/O7 - I/O0 at least twice in a row to determine whether a toggle bit is toggling. Typically, a system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on I/O7 - I/O0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of I/O5 is high (see the section on I/O5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as I/O5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and I/O5 has not gone high. The system may continue to monitor the toggle bit and I/O5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure 5). I/O5: Exceeded Timing Limits I/O5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions I/O5 produces a "1." This is a failure condition that indicates the program or erase cycle was not successfully completed. The I/O5 failure condition may appear if the system tries to program a "1 "to a location that is previously programmed to "0." Only an erase operation can change a "0" back to a "1." Under this condition, the device halts the operation, and when the operation has exceeded the timing limits, I/O5 produces a "1." Under both these conditions, the system must issue the reset command to return the device to reading array data. I/O2: Toggle Bit II The "Toggle Bit II" on I/O2, when used with I/O6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE pulse in the command sequence. I/O2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE or CE to control the read cycles.) But I/O2 cannot distinguish whether the sector is actively erasing or is erase-suspended. I/O6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer to Table 6 to compare outputs for I/O2 and I/O6. Figure 5 shows the toggle bit algorithm in flowchart form, and the section " I/O2: Toggle Bit II" explains the algorithm. See also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle Bit Timings figure for the toggle bit timing diagram. I/O3: Sector Erase Timer After writing a sector erase command sequence, the system may read I/O3 to determine whether or not an erase operation has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out is complete, I/O3 switches from "0" to "1." The system may ignore I/O3 if the system can guarantee that the time between additional sector erase commands will always be less than 50µs. See also the "Sector Erase Command Sequence" section. After the sector erase command sequence is written, the system should read the status on I/O7 ( Data Polling) or I/O6 (Toggle Bit 1) to ensure the device has accepted the command sequence, 13 (December, 2004, Version 1.3) AMIC Technology, Corp. A29001/A290011 Series and then read I/O3. If I/O3 is "1", the internally controlled erase cycle has begun; all further commands (other than Erase Suspend) are ignored until the erase operation is complete. If I/O3 is "0", the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of I/O3 prior to and following each subsequent sector erase command. If I/O3 is high on the second status check, the last command might not have been accepted. Table 6 shows the outputs for I/O3. START Read I/O7-I/O0 Read I/O7-I/O0 (Note 1) Toggle Bit = Toggle ? Yes No No I/O5 = 1? Yes Read I/O7 - I/O0 Twice (Notes 1,2) Toggle Bit = Toggle ? No Yes Program/Erase Operation Not Commplete, Write Reset Command Program/Erase Operation Complete Notes : 1. Read toggle bit twice to determine whether or not it is toggling. See text. 2. Recheck toggle bit because it may stop toggling as I/O5 changes to "1". See text. Figure 5. Toggle Bit Algorithm (December, 2004, Version 1.3) 14 AMIC Technology, Corp. A29001/A290011 Series Table 6. Write Operation Status Operation Standard Mode Erase Suspend Mode Embedded Program Algorithm Embedded Erase Algorithm Reading within Erase Suspended Sector Reading within Non-Erase Suspend Sector Erase-Suspend-Program Notes: 1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See “I/O5: Exceeded Timing Limits” for more information. I/O7 (Note 1) I / O6 Toggle Toggle No toggle Data Toggle I / O5 (Note 2) 0 0 0 Data 0 N/A 1 N/A Data N/A I / O3 I / O2 (Note 1) No toggle Toggle Toggle Data N/A I/O7 0 1 Data I/O7 Maximum Negative Input Overshoot 20ns +0.8V 20ns -0.5V -2.0V 20ns Maximum Positive Input Overshoot 20ns VCC+2.0V VCC+0.5V 2.0V 20ns 20ns (December, 2004, Version 1.3) 15 AMIC Technology, Corp. A29001/A290011 Series DC Characteristics TTL/NMOS Compatible Parameter Symbol ILI ILIT Input Load Current VIN = VSS to VCC. VCC = VCC Max ±1.0 100 µA µA µA mA mA mA V V V V V Parameter Description Test Description Min. Typ. Max. Unit A9, OE & RESET Input Load Current VCC = VCC Max, A9, OE & RESET =12.5V Output Leakage Current VCC Active Read Current (Notes 1, 2) VCC Active Write (Program/Erase) Current (Notes 2, 3, 4) VCC Standby Current (Note 2) Input Low Level Input High Level Voltage for Autoselect and Temporary Unprotect Sector Output Low Voltage Output High Voltage VCC = 5.25 V IOL = 12mA, VCC = VCC Min IOH = -2.5 mA, VCC = VCC Min 2.4 VOUT = VSS to VCC. VCC = VCC Max ILO ICC1 ICC2 ICC3 VIL VIH VID VOL VOH ±1.0 20 30 0.4 -0.5 2.0 10.5 30 40 1.0 0.8 VCC+0.5 12.5 0.45 CE = VIL, OE = VIH CE = VIL, OE =VIH CE = VIH, RESET = VCC ± 0.5V CMOS Compatible Parameter Symbol ILI ILIT Input Load Current VIN = VSS to VCC, VCC = VCC Max ±1.0 100 µA µA µA mA mA µA V V V V V V Parameter Description Test Description Min. Typ. Max. Unit A9, OE & RESET Input Load Current VCC = VCC Max, A9, OE & RESET = 12.5V Output Leakage Current VCC Active Read Current (Notes 1,2) VCC Active Program/Erase Current (Notes 2,3,4) VCC Standby Current (Notes 2, 5) Input Low Level Input High Level Voltage for Autoselect and Temporary Sector Unprotect Output Low Voltage Output High Voltage VCC = 5.25 V IOL = 12.0 mA, VCC = VCC Min IOH = -2.5 mA, VCC = VCC Min IOH = -100 µA. VCC = VCC Min 0.85 x VCC VCC-0.4 VOUT = VSS to VCC, VCC = VCC Max ILO ICC1 ICC2 ICC3 VIL VIH VID VOL VOH1 VOH2 ±1.0 20 30 1 -0.5 0.7 x VCC 10.5 30 40 5 0.8 VCC+0.3 12.5 0.45 CE = VIL, OE = VIH CE = VIL, OE = VIH CE = RESET = VCC ± 0.5 V Notes for DC characteristics (both tables): 1. The ICC current listed includes both the DC operation current and the frequency dependent component (at 6 MHz). The frequency component typically is less than 2 mA/MHz, with OE at VIH. 2. Maximum ICC specifications are tested with VCC = VCC max. 3. ICC active while Embedded Algorithm (program or erase) is in progress. 4. Not 100% tested. 5. For CMOS mode only, ICC3 = 20µA max at extended temperatures (> +85°C). 6. RESET is not available on A290011. (December, 2004, Version 1.3) 16 AMIC Technology, Corp. A29001/A290011 Series AC Characteristics Read Only Operations Parameter Symbols JEDEC tAVAV tAVQV Std tRC tACC Read Cycle Time (Note 2) Address to Output Delay Min. Description Test Setup -55 55 55 Speed -70 70 70 -90 90 90 ns ns Unit CE = VIL OE = VIL Max. tELQV tGLQV tCE tOE tOEH Chip Enable to Output Delay Output Enable to Output Delay Output Enable Hold Time (Note 2) Read Toggle and OE = VIL Max. Max. Min. Min. 55 30 0 10 70 30 0 10 90 35 0 10 ns ns ns ns Data Polling tEHQZ tGHQZ tAXQX tDF tDF tOH Chip Enable to Output High Z Output Enable to Output High Z Output Hold Time from Addresses, CE or OE , Whichever Occurs First Min. Max. 18 18 0 20 20 0 20 20 0 ns ns ns Notes: 1. Output driver disable time. 2. Not 100% tested. Timing Waveforms for Read Only Operation ( RESET =VIH on A29001) tRC Addresses tACC CE tDF OE tOEH WE tCE tOE Addresses Stable tOH High-Z Output High-Z Output Valid 0V (December, 2004, Version 1.3) 17 AMIC Technology, Corp. A29001/A290011 Series Hardw are Reset ( RESET )(N/A on A290011) Parameter JEDEC Std tREADY tREADY tRP tRH Note: Not 100% tested. Description Test Setup Max Max Min Min All Speed Options 20 500 500 50 Unit µs ns ns ns RESET Pin Low (During Embedded Algorithms) to Read or Write (See Note) RESET Pin Low (Not During Embedded Algorithms) to Read or Write (See Note) RESET Pulse Width RESET High Time Before Read (See Note) RESET Timings CE, OE tRH RESET tRP tReady Reset Timings NOT during Embedded Algorithms Reset Timings during Embedded Algorithms ~ ~ RESET tRP Temporary Sector Unprotect (N/A on A290011) Parameter JEDEC Std tVIDR tRSP Description VID Rise and Fall Time (See Note) Min Min All Speed Options 500 4 Unit ns µs RESET Setup Time for Temporary Sector Unprotect Note: Not 100% tested. Temporary Sector Unprotect Timing Diagram 12V 0 or 5V RESET CE tVIDR Program or Erase Command Sequence ~ ~ 0 or 5V tVIDR ~ ~ WE ~ ~ tRSP (December, 2004, Version 1.3) 18 AMIC Technology, Corp. A29001/A290011 Series AC Characteristics Erase and Program Operations Parameter Symbols JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX Std tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 tVCS Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write ( OE high to WE low) Min. Min. Min. Min. Min. Write Pulse Width High Max. Byte Programming Operation (Note 2) Sector Erase Operation (Note 2) VCC Set Up Time (Note 1) Typ. Typ. Min. 50 7 1 50 30 0 0 0 35 20 45 ns ns ns ns ns µs µs sec µs Min. Min. Min. Min. Min. Min. 40 25 Speed -55 55 -70 70 0 45 30 0 0 45 45 -90 90 ns ns ns ns ns ns Description Unit CE Setup Time CE Hold Time Write Pulse Width Notes: 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. (December, 2004, Version 1.3) 19 AMIC Technology, Corp. A29001/A290011 Series Timing Waveforms for Program Operation Program Command Sequence (last two cycles) Read Status Data (last two cycles) Addresses 555h PA ~ ~ tWC tAS PA PA tAH CE tCH OE tWP WE tCS tDS Data A0h tWPH tDH PD Status DOUT tWHWH1 tVCS VCC Note : PA = program addrss, PD = program data, Dout is the true data at the program address. ~ ~ ~ ~ ~ ~ ~ ~ tGHWL ~~ ~~ (December, 2004, Version 1.3) 20 AMIC Technology, Corp. A29001/A290011 Series Timing Waveforms for Chip/Sector Erase Operation Erase Command Sequence (last two cycles) Read Status Data Addresses 2AAh SA 555h for chip erase ~ ~ VA tWC tAS VA tAH CE OE tCH tWP WE tCS tDS Data 55h tWPH tDH 30h 10h for chip erase ~ ~ tWHWH2 ~ ~ tGHWL ~~ ~~ In Progress ~ ~ Complete tVCS VCC Note : SA = Sector Address. VA = Valid Address for reading status data. ~ ~ (December, 2004, Version 1.3) 21 AMIC Technology, Corp. A29001/A290011 Series Timing Waveforms for Data Polling (During Embedded Algorithms) tRC Addresses VA tACC CE tCH OE tOEH WE tOH High-Z I/O7 Complement Complement True Valid Data tDF tCE ~ ~ VA VA ~ ~ ~ ~ ~ ~ tOE ~~ ~~ High-Z Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data read cycle. ~ ~ I/O0 - I/O6 Status Data Status Data True Valid Data (December, 2004, Version 1.3) 22 AMIC Technology, Corp. A29001/A290011 Series Timing Waveforms for Toggle Bit (During Embedded Algorithms) tRC Addresses ~ ~ VA VA VA VA tACC CE tCE tCH tOE tOEH WE tDF tOH I/O6 , I/O2 ~ ~ ~ ~ ~ ~ OE ~~ ~~ Valid Status Valid Status Valid Status Valid Status (first read) (second read) (stop togging) Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle. (December, 2004, Version 1.3) 23 AMIC Technology, Corp. A29001/A290011 Series Timing Waveforms for I/O2 vs. I/O6 ~ ~ ~ ~ ~ ~ ~ ~ WE Erase Erase Suspend Read Erase Suspend Program Erase Suspend Read Erase ~ ~ Erase Complete Enter Embedded Erasing Erase Suspend Enter Erase Suspend Program Erase Resume ~ ~ ~ ~ ~ ~ ~ ~ I/O6 I/O2 I/O2 and I/O6 toggle with OE and CE Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O and I/O2 in the section "Write Operation Statue" for 6 more information. AC Characteristics Erase and Program Operations Alternate CE Controlled Writes Parameter Symbols JEDEC tAVAV tAVEL tELAX tDVEH tEHDX tGHEL tWLEL tEHWH tELEH tEHEL tWHWH1 tWHWH2 Std tWC tAS tAH tDS tDH tGHEL tWS tWH tCP tCPH tWHWH1 tWHWH2 Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Read Recover Time Before Write Min. Min. Min. Min. Min. Min. Min. Min. Min. Min. Typ. Typ. 30 20 40 25 Description -55 55 Speed -70 70 0 45 30 0 0 0 0 35 20 7 1 45 20 45 45 -90 90 ns ns ns ns ns ns ns ns ns ns µs sec Unit Notes: 3. Not 100% tested. 4. See the "Erase and Programming Performance" section for more information. ~ ~ WE Setup Time WE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation (Note 2) Sector Erase Operation (Note 2) ~ ~ ~ ~ ~ ~ (December, 2004, Version 1.3) 24 AMIC Technology, Corp. ~ ~ ~ ~ A29001/A290011 Series Timing Waveforms for Alternate CE Controlled Write Operation PA for program SA for sector erase 555 for chip erase Data Polling 555 for program 2AA for erase ~ ~ Addresses tWC tWH WE tAS tAH PA OE tCP tCPH tWS tDS tDH tBUSY tWHWH1 or 2 CE ~ ~ ~ ~ ~ ~ tGHEL ~ ~ ~ ~ Data tRH A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase I/O7 DOUT Note : 1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O = Complement of Data Input, DOUT = Array Data. 7 2. Figure indicates the last two bus cycles of the command sequence. Erase and Programming Performance Parameter Sector Erase Time Chip Erase Time Byte Programming Time Chip Programming Time (Note 3) Typ. (Note 1) 1 8 35 3.6 Max. (Note 2) 8 64 300 10.8 Unit sec sec µs sec Comments Excludes 00h programming prior to erasure (Note 4) Excludes system-level overhead (Note 5) Notes: 1. Typical program and erase times assume the following conditions: 25°C, 5.0V VCC, 100,000 cycles. Additionally, programming typically assumes checkerboard pattern. 2. Under worst case conditions of 90°C, VCC = 4.5V (4.75V for -55), 100,000 cycles. 3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only then does the device set I/O5 = 1. See the section on I/O5 for further information. 4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. 5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 4 for further information on command definitions. 6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles. (December, 2004, Version 1.3) 25 AMIC Technology, Corp. A29001/A290011 Series Latch-up Characteristics Description Input Voltage with respect to VSS on all I/O pins VCC Current Input voltage with respect to VSS on all pins except I/O pins (including A9, OE and RESET ) -1.0V 12.5V Min. -1.0V -100 mA Max. VCC+1.0V +100 mA Includes all pins except VCC. Test conditions: VCC = 5.0V, one pin at time. RESET N/A on A290011. TSOP/sTSOP Pin Capacitance Parameter Symbol CIN COUT CIN2 Parameter Description Input Capacitance Output Capacitance Control Pin Capacitance Test Setup VIN=0 VOUT=0 VIN=0 Typ. 6 8.5 7.5 Max. 7.5 12 9 Unit pF pF pF Notes: 1. Sampled, not 100% tested. 2. Test conditions TA = 25°C, f = 1.0MHz PLCC and P-DIP Pin Capacitance Parameter Symbol CIN COUT CIN2 Parameter Description Input Capacitance Output Capacitance Control Pin Capacitance Test Setup VIN=0 VOUT=0 VPP=0 Typ. 4 8 8 Max. 6 12 12 Unit pF pF pF Notes: 3. Sampled, not 100% tested. 4. Test conditions TA = 25°C, f = 1.0MHz Data Retention Parameter Minimum Pattern Data Retention Time Test Conditions 150°C 125°C Min 10 20 Unit Years Years (December, 2004, Version 1.3) 26 AMIC Technology, Corp. A29001/A290011 Series Test Conditions Test Specifications Test Condition Output Load Output Load Capacitance, CL(including jig capacitance) Input Rise and Fall Times Input Pulse Levels Input timing measurement reference levels Output timing measurement reference levels 30 5 0.0 - 3.0 1.5 1.5 -55 All others 1 TTL gate 100 20 0.45 - 2.4 0.8, 2.0 0.8, 2.0 pF ns V V V Unit Test Setup 5.0 V 2.7 KΩ Device Under Test CL 6.2 KΩ Diodes = IN3064 or Equivalent (December, 2004, Version 1.3) 27 AMIC Technology, Corp. A29001/A290011 Series Ordering Information Top Boot Sector Flash Part No. Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) Package A29001T-55 A29001T-55F A290011T-55 A290011T-55F A29001TL-55 A29001TL-55F A290011TL-55 A290011TL-55F 55 A29001TV-55 A29001TV-55F A290011TV-55 A290011TV-55F A29001TX-55 A29001TX-55F A290011TX-55 A290011TX-55F A29001T-70 A29001T-70F A290011T-70 A290011T-70F A29001TL-70 A29001TL-70F A290011TL-70 A290011TL-70F A29001TV-70 70 A29001TV-70F A290011TV-70 A290011TV-70F A290011TV-70UF A29001TX-70 A29001TX-70F A290011TX-70 A290011TX-70F A290011TX-70UF 20 30 1 20 30 1 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC 32Pin TSOP 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free TSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC 32Pin TSOP 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free TSOP 32Pin Pb-Free TSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin Pb-Free sTSOP (December, 2004, Version 1.3) 28 AMIC Technology, Corp. A29001/A290011 Series Ordering Information (continued) Top Boot Sector Flash Part No. Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) Package A29001T-90 A29001T-90F A290011T-90 A290011T-90F A29001TL-90 A29001TL-90F A290011TL-90 A290011TL-90F 90 A29001TV-90 A29001TV-90F A290011TV-90 A290011TV-90F A29001TX-90 A29001TX-90F A290011TX-90 A290011TX-90F Note: -U is for industrial operating temperature range 20 30 1 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC 32Pin TSOP 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free sSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP (December, 2004, Version 1.3) 29 AMIC Technology, Corp. A29001/A290011 Series Ordering Information (continued) Bottom Boot Sector Flash Part No. A29001U-55 A29001U-55F A290011U-55 A290011U-55F A29001UL-55 A29001UL-55F A290011UL-55 A290011UL-55F 55 A29001UV-55 A29001UV-55F A290011UV-55 A290011UV-55F A29001UX-55 A29001UX-55F A290011UX-55 A290011UX-55F A29001U-70 A29001U-70F A290011U-70 A290011U-70F A29001UL-70 A29001UL-70F A290011UL-70 A290011UL-70F A29001UV-70 70 A29001UV-70F A290011UV-70 A290011UV-70F A290011UV-70UF A29001UX-70 A29001UX-70F A290011UX-70 A290011UX-70F A290011UX-70UF (December, 2004, Version 1.3) 30 20 30 1 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free TSOP 32Pin Pb-Free TSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin Pb-Free sTSOP 20 30 1 32Pin TSOP 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free TSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC 32Pin TSOP Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) Package 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC AMIC Technology, Corp. A29001/A290011 Series Ordering Information (continued) Bottom Boot Sector Flash Part No. Access Time (ns) Active Read Current Typ. (mA) Program/Erase Current Typ. (mA) Standby Current Typ. (µA) Package A29001U-90 A29001U-90F A290011U-90 A290011U-90F A29001UL-90 A29001UL-90F A290011UL-90 A290011UL-90F 90 A29001UV-90 A29001UV-90F A290011UV-90 A290011UV-90F A29001UX-90 A29001UX-90F A290011UX-90 A290011UX-90F Note: -U is for industrial operating temperature range 20 30 1 32Pin DIP 32Pin Pb-Free DIP 32Pin DIP 32Pin Pb-Free DIP 32Pin PLCC 32Pin Pb-Free PLCC 32Pin PLCC 32Pin Pb-Free PLCC 32Pin TSOP 32Pin Pb-Free TSOP 32Pin TSOP 32Pin Pb-Free TSOP 32Pin sTSOP 32Pin Pb-Free sTSOP 32Pin sTSOP 32Pin Pb-Free sTSOP (December, 2004, Version 1.3) 31 AMIC Technology, Corp. A29001/A290011 Series Package Information P-DIP 32L Outline Dimensions unit: inches/mm D 32 17 E 1 16 E1 C A2 A A1 Base Plane Seating Plane L B B1 e θ EA Symbol A A1 A2 B B1 C D E E1 EA e L θ Dimensions in inches Min 0.015 0.149 1.645 0.537 0.590 0.630 0.120 0° Nom 0.154 0.018 0.050 0.010 1.650 0.542 0.600 0.650 0.100 0.130 M ax 0.210 0.159 1.655 0.547 0.610 0.670 0.140 15 ° Dimensions in mm Min 0.381 3.785 41.783 13.64 14.986 16.002 3.048 0° Nom 3.912 0.457 1.270 0.254 41.91 13.767 15.240 16.510 2.540 3.302 M ax 5.334 4.039 42.037 13.894 15.494 17.018 3.556 15 ° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. (December, 2004, Version 1.3) 32 AMIC Technology, Corp. A29001/A290011 Series Package Information PLCC 32L Outline Dimension HD D 13 5 unit: inches/mm 14 4 32 20 30 21 29 A2 A HE 1 E b1 GD y D A1 e b GE θ Dimensions in inches Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0° Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 M ax 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10° Symbol A A1 A2 b1 b C D E e GD GE HD HE L y θ Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0° Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 - M ax 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. (December, 2004, Version 1.3) 33 AMIC Technology, Corp. L c A29001/A290011 Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions D unit: inches/mm e A2 E A1 c θ L LE HD Detail "A" Detail "A" y D S b Dimensions in inches Symbol A A1 A2 b c D E e HD L LE S y θ 0.779 0.016 0° Min 0.002 0.037 0.007 0.004 0.720 Nom 0.039 0.009 0.724 0.315 0.020 BSC 0.787 0.020 0.032 0.795 0.024 0.020 0.003 5° M ax 0.047 0.006 0.041 0.011 0.008 0.728 0.319 Dimensions in mm Min 0.05 0.95 0.18 0.11 18.30 Nom 1.00 0.22 18.40 8.00 0.50 BSC 19.80 0.40 0° 20.00 0.50 0.80 20.20 0.60 0.50 0.08 5° M ax 1.20 0.15 1.05 0.27 0.20 18.50 8.10 Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (December, 2004, Version 1.3) 34 AMIC Technology, Corp. A A29001/A290011 Series Package Information sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm e A2 E A1 c θ L LE Detail "A" D1 D Detail "A" D 0.076MM S SEATING PLANE b Dimensions in inches Symbol A A1 A2 b c E e D D1 L LE S θ 0° 0.520 0.461 0.012 0.0275 Min 0.002 0.037 0.007 0.0056 0.311 Nom 0.039 0.008 0.0059 0.315 0.020 TYP 0.528 0.465 0.020 0.0315 0.0109 TYP 3° 5° 0.535 0.469 0.028 0.0355 M ax 0.049 0.041 0.009 0.0062 0.319 Dimensions in mm Min 0.05 0.95 0.17 0.142 7.90 Nom 1.00 0.20 0.150 8.00 0.50 TYP 13.20 11.70 0.30 0.700 0° 13.40 11.80 0.50 0.800 0.278 TYP 3° 5° 13.60 11.90 0.70 0.900 M ax 1.25 1.05 0.23 0.158 8.10 Notes: 1. The maximum value of dimension D1 includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (December, 2004, Version 1.3) 35 AMIC Technology, Corp. A