PLCC

data sheet PLCC Features: LEADFRAME Amkor’s PLCC IC package portfolio provides: • .352” x .352” to 1.152” x 1.152” body size • 20 to 84 lead counts • JEDEC standard compliant • Available with heatspreader option • Fine pitch wire bond capability Multi-Layer PCB Theta JA (°C/W) by Velocity Plastic Leaded Chip Carrier (PLCC) Packages: Amkor’s PLCC offerings cover the total range offered by the industry. It includes all square body packages from 20 lead through 84 lead. Also included is the rectangular body format of the 32 lead. All PLCC products are offered with and without heatspreaders. The heatspreader versions are identical in form factor to the standard non-heatspreader versions. Both versions are JEDEC compliant in all respects. The heatspreader versions give the system designer greater latitude in thermally enhanced board level and/or system design. All products utilize the most advanced manufacturing equipment offered today. Lead free and green material set are qualified. Applications: Amkor’s PLCC product family was engineered to meet JEDEC requirements for “J” leaded surface mount packages. As such, they take up less board space than equivalent “gull” formed product in the same body size. Due to the flexibility and performance offered, most industry circuit types can be designed into this product. This would include memory, processors and controllers, ASIC, DSP, PC chipset, to name a few. Applications range from consumer through automotive and aerospace. Thermal Resistance: Pkg Body Size (mm) Pad Size (mm) 0 200 500 44 ld 44 ld* 16.6 x 16.6 16.6 x 16.6 7.8 x 7.8 7.8 x 7.8 30.0 24.4 24.5 19.0 22.0 16.6 *With Drop-in heatspreader option Electrical: Body Size Pad Size (mm) (mm) Tested @ 1W Pkg Self Bulk Self Inductance Capacitance Resistance (pF) (mΩ) Lead (nH) 20 ld 8.9 x 8.9 220 x 220 Longest 2.110 Shortest 1.780 Simulated Results @ 100 MHz Reliability: 0.596 0.583 13.5 11.1 Amkor’s PLCCs are reliability assured through optimized design, material and process enabling high performance operation of your IC chip. • Moisture sensitivity characterization • • • • PCT Temp cycle Temp/Humidity High temp storage JEDEC Level 3 30 °C/60% - 192 hrs, SAT-192 hrs 121 °C, 2 atm, 100%RH, 504 hours -65/150 °C, 1000 cycles 85 °C/85% RH, 1000 hours 150 °C, 1000 hours VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS293D Rev Date: 07’03 data sheet Cross-section PLCC LEADFRAME PLCC Process Highlights Die thickness (max) 25 mils Strip solder plating 85/15 Sn/Pb or 100% Sn Strip marking Laser/pad/offset Lead inspection Optical Pack/ship options Bar code Test Services • Program/generation/conversion • Product engineering • Wafer sort • 256 pin x 20 MHz test system available • -55 °C to +165 °C test available • Burn-in Shipping Clear antistatic tube 20 inches Configuration Options: PLCC NOMINAL PACKAGE DIMENSIONS Lead Count Square 20 28 44 52 68 84 Rectangular 32 Body Size .352 x .352 .452 x .452 .652 x .652 .752 x .752 .952 x .952 1.152 x 1.152 .452 x .552 Body Thickness 0.152 0.152 0.152 0.152 0.150 0.150 0.109 Lead Pitch 0.05 0.05 0.05 0.05 0.05 0.05 0.05 Lead Form N/A N/A N/A N/A N/A N/A N/A Amkor Dwg No. 00060 00060 00060 00060 00060 00060 00061 JEDEC Dwg No. MS-018 MS-018 MS-018 MS-018 MS-018 MS-018 MS-016 Qty Per Tube 46 37 26 23 18 15 30 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.