POWERSOP2

data sheet Features: LEADFRAME PowerSOP® 2&3 Exceptional performance through the innovative design of PSOPs offer: • Up to 50% improvement in Theta JA when slug soldered to board • Highly conductive copper heatslug and leadframes • Optional PSOP assembly materials for enhanced power capability include soft solder die attach • Available in: PSOP 2 (.150" body) - 8, 16 lead (.300" body) - 16, 20, 24, 28 lead PSOP 3 (11 x 15.9 mm body) - 20, 24, 30, 36, 44 lead PSSOP (.150" body) - 16, 28 lead Single Layer PCB Pkg PSOP 2 8 16 PSOP 3 20 Multi-Layer PCB Pkg PSOP 2 8 16 PSOP 3 20 Body Size 3.8 x 4.9 3.8 x 9.9 11 x 15.9 Body Size 3.8 x 4.9 3.8 x 9.9 11 x 15.9 Pad Size 2.3 x 3.1 2.3 x 4.9 7.5 x 7.9 Pad Size 2.3 x 3.1 2.3 x 4.9 7.5 x 7.9 Theta JA (°C/W) by Velocity (LFPM) 0 200 500 S/NS S/NS S/NS 144.1/157.6 91.2/95.9 50.8/52.4 120.2/131.1 104.2/112.8 72.2/75.2 61.8/64.4 35.7/37.6 27.8/28.8 PowerSOP® Packages: (PSOP / PSSOP) This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP© (PSOP) improves Theta JA up to 50% over a standard SOIC thereby expanding the margin of operating parameters. The large integrated exposed copper heatslug to which the IC chip is directly attached results in an increased ability to dissipate heat. The leadframe and heatslug are mechanically attached, leaving the leads electrically isolated. The package is offered in a low stand-off (.002) heatslug down version, which is MS-012, MS-013, or MO-166 JEDEC compliant depending on the package you choose. These flexibilities still allow maximum thermal management by directly soldering the slug to the PCB. Furthermore, there are two types of PSOPs (2 and 3) available with various features and benefits to address different market application needs. Applications: Increased end-application densities and shrinking product sizes demand more from IC packages. PSOPs give designers the needed margin for designing and producing high performing products such as telecom, disk drives, pagers, wireless, CATV/RF modules, radio, automotive/industrial and other similar applications. GaAs, SiGe and hi-speed silicon technologies work especially well in PSOP packages due to added shielding and grounding capabilities. Thermal Resistance: g Theta JA (°C/W) by Velocity (LFPM) 0 200 500 S/NS S/NS S/NS 51.8/95.3 30.2/51.6 19.2/25.7 45.5/86.5 25.0/45.3 14.2/20.4 42.6/80.6 23.0/42.3 12.2/17.8 JEDEC Standard Test Boards Body Size 4.9 x 3.9 11 x 15.9 4.9 x 3.9 Pad Size 3.2 x 2.3 7.5 x 7.9 1.3 x 3.2 S - Slug Soldered to Test Board N/S - Slug Not Soldered to Test Board Lead Longest Shortest Longest Shortest Longest Shortest Inductance Capacitance Resistance Electrical: Pkg PSOP 2 8 ld PSOP 3 20 ld PSSOP 16 ld (nH) (pF) (mΩ) 9.9 5.7 30.6 9.42 12.8 8.36 1.120 0.684 3.130 1.540 1.510 0.885 0.456 0.344 1.990 0.604 0.367 0.243 Reliability: IC chips are assembled in optimized package designs with proven reliable semiconductor materials. • High temp storage: 150 °C, 1000 hrs. • HAST: 130 °C/85% RH, no bias, 96 hours • Temp cycle: -65/150 °C, 500 cycles VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS320G Rev Date: 01’07 data sheet Cross-sections PSOP 2&3 PSOP2 Mounted Height: 0.150” body - 0.062” 0.300” body = 0.094” PSSOP Mounted Height: 0.150” body = 0.060” LEADFRAME PowerSOP® 2&3 Process Highlights GaAs Thin Die Option Leadframes Tapeless design available Die thickness (max) .150" PSOP 2 - 15 mil .300" PSOP 2 - 18 mil 11 mm PSOP 3 - 26 mil Solder plating 85/15 Sn/Pb Marking Laser/pad Lead inspection Optical Pack/ship options Bar code, dry pack Coplanarity (max) 3 mils Test Services Contact Amkor Test Services for more details. • Program generation/conversion • Product engineering support • Wafer sort • Burn-in • Tape and reel services • Ambient to +165 °C test available • 256 pin x 20 MHz test system available Shipping Clear anti-static tube PSOP 2 PSOP3 Mounted Height: 3.35 mm PSOP 3 20 inch PowerSOP® 2 and 3/PSSOP Nominal Package Dimensions Package Body Size Lead Pitch Lead Body Count Length Lead Length Tip to Tip Body Thck Stand-off Mounted Height JEDEC Units per tube PSOP 2 (units in inches unless otherwise stated) PSOP 2 PSOP 2 PSOP 2 PSOP 2 PSOP 2 PSOP 2 PSOP 3 PSOP 3 PSOP 3 PSOP 3 PSSOP PSSOP .150” (3.8 mm) 0.050 .150” (3.8 mm) 0.050 .300” (7.6 mm) 0.050 .300” (7.6 mm) 0.050 .300” (7.6 mm) 0.050 .300” (7.6 mm) 0.050 11.0 mm (.422”) 1.270 11.0 mm (.422”) 1.000 11.0 mm (.422”) 0.800 11.0 mm (.422”) 0.650 .150” (3.8 mm) 0.025 .150” (3.8 mm) 0.025 8 16 16 20 24 28 20 24 30 36 16 28 0.194 0.391 0.407 0.505 0.607 0.706 15.9 15.9 15.9 15.9 0.194 0.391 0.041 0.041 0.055 0.055 0.055 0.055 1.60 1.60 1.60 1.60 0.042 0.042 0.236 0.236 0.406 0.406 0.406 0.406 14.2 14.2 14.2 14.2 0.237 0.237 0.060 0.060 0.092 0.092 0.092 0.092 3.15 3.15 3.15 3.15 0.058 0.058 .002 .002 .002 .002 .002 .002 0.20 0.20 0.20 0.20 0.002 0.002 .062 .062 .094 .094 .094 .094 3.35 3.35 3.35 3.35 .060 .060 MS-012* MS-012* MS-013* MS-013* MS-013* MS-013* MO-166 MO-166 MO-166 MO-166 N/A N/A 97 48 46 37 31 27 30 30 30 30 97 48 PSOP 3 (units in mm unless otherwise stated) PSSOP (units in inches unless otherwise stated) *JEDEC does not include heat slug www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.