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BLP8G05S-200GY

BLP8G05S-200GY

  • 厂商:

    AMPHENOL(安费诺)

  • 封装:

    SOT-1204-2

  • 描述:

    RF FET LDMOS 65V 21DB SOT12042

  • 数据手册
  • 价格&库存
BLP8G05S-200GY 数据手册
BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor Rev. 2 — 1 October 2015 Product data sheet 1. Product profile 1.1 General description 200 W LDMOS power transistor for base stations applications at frequencies from 400 MHz to 500 MHz. Table 1. Typical performance RF performance at Tcase = 25 C, IDq = 2 mA in an application circuit. Test signal CW f VDS PL(AV) Gp D (MHz) (V) (W) (dB) (%) 440 28 210 21 81 1.2 Features and benefits         High efficiency Excellent ruggedness Excellent thermal stability Integrated ESD protection Easy power control Designed for ISM operation (400 MHz to 500 MHz) Input integration for simple board design Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications  RF power amplifiers for W-CDMA base stations and multi carrier applications in the 400 MHz to 500 MHz frequency range BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 2. Pinning information Table 2. Pinning All pins must be connected for correct operation and to prevent damage to the device. Pin Description Simplified outline Graphic symbol BLP8G05S-200 (SOT1138-2) 1, 2 gate 3, 4 drain 5 source 4 3 4 [1] 1 5 2 1 2 3 aaa-019794 BLP8G05S-200G (SOT1204-2) 1, 2 gate 3, 4 drain 5 source 4 3 4 [1] 1 5 1 2 2 3 aaa-019794 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name BLP8G05S-200 Product data sheet Version HSOP4F plastic, heatsink small outline package; 4 leads (flat) BLP8G05S-200G HSOP4 BLP8G05S-200_8G05S-200G Description plastic, heatsink small outline package; 4 leads All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 SOT1138-2 SOT1204-2 © Ampleon Netherlands B.V. 2016. All rights reserved. 2 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage - 65 V VGS gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C Tcase case temperature - 150 C - 225 C junction temperature Tj [1] [1] Continuous use at maximum temperature will affect the reliability. 5. Thermal characteristics Table 5. Symbol Thermal characteristics Parameter Rth(j-case) thermal resistance from junction to case Conditions Typ Unit Tcase = 80 C; PL = 200 W 0.5 K/W 6. Characteristics Table 6. DC characteristics Tj = 25 C per section; unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 3.2 mA Min Typ Max Unit 65 - - V 2.3 V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 320 mA 1.5 1.9 IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 2.8 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 52 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 280 nA gfs forward transconductance VDS = 10 V; ID = 11.2 A - 20 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 11.2 A - 0.08 -  Table 7. RF characteristics Test signal: CW at 440 MHz; RF performance at VDS = 28 V; IDq = 2 mA; Tcase = 25 C; unless otherwise specified; in a class-AB production test circuit. BLP8G05S-200_8G05S-200G Product data sheet Symbol Parameter Conditions Min Typ Max Unit Gp power gain PL = 210 W 19.5 21 - dB RLin input return loss PL = 210 W - 15 11 dB D drain efficiency PL = 210 W 73 77 - % All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 3 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 7. Test information 7.1 Ruggedness in class-AB operation The BLP8G05S-200 and BLP8G05S-200G are capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; IDq = 20 mA; PL = 200 W (CW); f = 440 MHz. 7.2 Impedance information Table 8. Typical impedance Measured load-pull data. Typical values unless otherwise specified. IDq = 20 mA; VDS = 28 V. ZS and ZL defined in Figure 1. f ZS ZL (MHz) () () 440 1.5 + j0.7 1.1 + j0.14 drain ZL gate ZS 001aaf059 Fig 1. BLP8G05S-200_8G05S-200G Product data sheet Definition of transistor impedance All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 4 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 7.3 Test circuit 150.4 mm C11 C10 130 mm C3 C4 R1 L1 L2 C9 C6 C1 C12 C7 C2 C8 C5 aaa-008975 Printed-Circuit Board (PCB): Rogers RO4350B; r = 3.5; thickness = 0.762 mm. See Table 9 for list of components. Fig 2. Component layout for test circuit Table 9. List of components For test circuit, see Figure 2. BLP8G05S-200_8G05S-200G Product data sheet Component Description Value Remarks C1, C3 multilayer ceramic chip capacitor 160 pF ATC800A C2 multilayer ceramic chip capacitor 39 pF ATC800A C4, C9 multilayer ceramic chip capacitor 910 pF ATC800B C5, C6 multilayer ceramic chip capacitor 33 pF ATC800B C7 multilayer ceramic chip capacitor 15 pF ATC800B C8, C10 multilayer ceramic chip capacitor 130 pF ATC800B C11 electrolytic capacitor 220 F, 63 V C12 multilayer ceramic chip capacitor 4.3 pF ATC800A R1 chip resistor 10  Philips: SMD 1206 L1 copper wire 6 turns L2 copper foil - All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 5 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 7.4 Graphical data 7.4.1 CW aaa-009161 25 80 Gp Gp (dB) 20 ηD (%) 60 ηD 15 40 10 20 5 0 50 100 150 200 PL (W) 0 250 VDS = 28 V; IDq = 2 mA; f = 440 MHz. Fig 3. BLP8G05S-200_8G05S-200G Product data sheet Power gain and drain efficiency as function of output power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 6 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 8. Package outline HSOP4F: plastic, heatsink small outline package; 4 leads(flat) SOT1138-2 D E X c B D3 A E3 y v HE A D1 D2 e 4 3 (8x) METAL PROTRUSIONS (SOURCE) e4 (2x) F (4x) e3 (2x) E1 E2 A A2 A1 pin 1 index Q1 detail X 1 e1 (2x) 2 b w B e2 (2x) Q1 0 v w 1.62 1.57 0.25 0.25 1.52 10 mm scale y 0.1 Dimensions (mm are the original dimensions) Unit mm max nom min A A1 3.9 0.2 0.1 0 A2 b c D(1) D1 D2 D3 E(1) E1 E2 E3 e e1 e2 e3 3.65 5.90 0.27 20.62 19.00 16.05 20.44 10.01 8.18 5.89 9.83 3.60 5.85 0.22 20.57 18.95 16.00 20.39 9.96 8.13 5.84 9.78 6.85 8.45 9.55 2.97 4.07 3.55 5.80 0.17 20.52 18.90 15.95 20.34 9.91 8.08 5.79 9.73 Note 1. Package body dimensions “D and “E do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side. 2. Lead width dimension “b do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead. Outline version References IEC JEDEC JEITA European projection F HE 16.16 0.4 15.96 15.76 sot1138-2_po Issue date 15-01-13 15-06-04 SOT1138-2 Fig 4. e4 Package outline SOT1138-2 (HSOP4F) BLP8G05S-200_8G05S-200G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 7 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor HSOP4: plastic, heatsink small outline package; 4 leads SOT1204-2 D E X c D3 B E3 y A v HE A D1 D2 e 4 Q e4 (2x) (8x) METAL PROTRUSIONS (SOURCE) 3 e3 A2 (2x) E2 A E1 (A3) pin 1 index A1 1 A4 2 e1 (2x) θ Lp H detail X b w B e2 (2x) Lp 0 Q v w y 1.10 2.07 0.1 0.95 2.02 0.25 0.25 0.80 1.97 10 mm scale θ 7° 3° 0° Dimensions (mm are the original dimensions) A A1 3.9 0.2 0.1 0 Unit mm max nom min A2 A3 A4 b D(1) c D1 D2 D3 E(1) E1 E2 E3 e1 e 3.65 0.06 5.90 0.27 20.62 19.00 16.05 20.44 10.01 8.18 5.89 9.83 3.60 0.35 0 5.85 0.22 20.57 18.95 16.00 20.39 9.96 8.13 5.84 9.78 6.85 3.55 -0.02 5.80 0.17 20.52 18.90 15.95 20.34 9.91 8.08 5.79 9.73 e2 References IEC JEDEC JEITA HE European projection sot1204-2_po Issue date 15-01-14 15-06-04 SOT1204-2 Fig 5. e4 13.5 8.45 9.55 2.97 4.07 13.2 12.9 Note 1. Package body dimensions “D and “E do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side. 2. Lead width dimension “b does not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead. 3. Dimension A4 is measured with respect to bottom of the heatsink DATUM H. Positive value means that the bottom of the heatsink is higher than the bottom of the lead. Outline version e3 Package outline SOT1204-2 (HSOP4) BLP8G05S-200_8G05S-200G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 8 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 9. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 10. Abbreviations Table 10. Abbreviations Acronym Description CW Continuous Wave ESD ElectroStatic Discharge ISM Industrial, Scientific and Medical LDMOS Laterally Diffused Metal-Oxide Semiconductor SMD Surface Mounted Device VSWR Voltage Standing-Wave Ratio W-CDMA Wideband Code Division Multiple Access 11. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes BLP8G05S-200_8G05S-200G v.2 20151001 Product data sheet - BLP8G05S-200_ 8G05S-200G v.1 Modifications: BLP8G05S-200_8G05S-200G v.1 BLP8G05S-200_8G05S-200G Product data sheet • The format of this document has been redesigned to comply with the new identity guidelines of Ampleon • Legal texts have been adapted to the new company name where appropriate 20150917 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 - - © Ampleon Netherlands B.V. 2016. All rights reserved. 9 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an BLP8G05S-200_8G05S-200G Product data sheet Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 10 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’ standard warranty and Ampleon’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 13. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLP8G05S-200_8G05S-200G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 11 of 12 BLP8G05S-200; BLP8G05S-200G Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.4.1 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 4 Ruggedness in class-AB operation . . . . . . . . . 4 Impedance information . . . . . . . . . . . . . . . . . . . 4 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 6 CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Handling information. . . . . . . . . . . . . . . . . . . . . 9 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2016. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 1 October 2015 Document identifier: BLP8G05S-200_8G05S-200G
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